Surface packaging semiconductor bridge transduction element for electric initiating explosive device

Abstract

The invention provides a surface-packaged semiconductor bridge transduction element for an electric initiating explosive device, and belongs to the field of transduction elements. The internal thread groove is formed in the upper end of the electrode plug; the positioning mechanism is arranged on the electrode plug; the semiconductor bridge chip is arranged on the positioning mechanism, and the semiconductor bridge chip is movably inserted into the internal thread groove; the fixing mechanism is arranged on the internal thread groove, and the fixing mechanism is connected with the semiconductor bridge chip; the number of the electrode columns is two, the two electrode columns are fixedly connected to the upper end of the semiconductor bridge chip, and the two electrode columns penetrate through the semiconductor bridge chip and extend to the lower side of the electrode plug; according to the utility model, the semiconductor bridge chip is in threaded connection with the interior of the internal thread groove, so that the semiconductor bridge chip is convenient to mount and dismount, and the problems that in the prior art, parts are damaged in the welding and assembling process, so that the use of elements is influenced, and the welded parts cannot be dismounted can be solved.

Description

Technical Field

[0001] The invention belongs to the field of transducer elements, and in particular relates to a surface-encapsulated semiconductor bridge transducer element for electric ignition devices. Background Art

[0002] Electric pyrotechnics are widely used in military weapons ignition transmission systems and civilian blasting equipment. Electric pyrotechnics often use glowing bridge wires as transducer elements. Bridge wire is a metal resistance wire with a positive temperature coefficient. When current passes through, the bridge wire heats up and ignites the pyrotechnic agent wrapped around the bridge wire, so that the pyrotechnic can achieve functions such as ignition, detonation, and work. Bridge wire electric pyrotechnics have obvious disadvantages, mainly requiring a large input of energy; and the action time is long and scattered; it is also easily affected by electromagnetic radiation, static electricity, and stray currents, causing performance changes or accidental ignition. At this stage, the electromagnetic environment is becoming more and more complex and the output intensity is increasing. In the environment where electric pyrotechnics are used, there are electromagnetic waves of various frequencies and powers. Electromagnetic waves will directly or indirectly generate induced currents on the bridge wire, causing damage to the electric pyrotechnics, making their performance insensitive or accidentally igniting, causing safety accidents; static electricity has the characteristics of high voltage and low energy, and the energy of static electricity often causes electric pyrotechnics to accidentally ignite. In order to solve these problems, some protective measures are usually taken on bridgewire EEDs, such as designing low-pass filters to protect against electromagnetic waves, and designing electrostatic discharge air gaps or electrostatic discharge elements to protect against static electricity, but these will increase the complexity of the structure.

[0003] The authorization publication number "CN202836367U" records "a surface-mounted semiconductor bridge transducer element for electric ignition products, including an electrode plug, a foot electrode of the electrode plug, and a printed circuit board. Two pad electrodes are symmetrically arranged on the two surfaces of the printed circuit board, and a number of marking cups for connecting the conductive glue of the chip are reserved on the pad electrode on the surface in contact with the electrode plug. Two electrode holes for passing through the foot electrodes of the electrode plug are arranged on the printed circuit board. The electrode holes simultaneously pass through the pad electrodes on the two surfaces of the printed circuit board and are connected thereto. An opening is reserved in the center of the printed circuit board, and a semiconductor bridge chip is installed on the surface of the printed circuit board in contact with the electrode plug, and the opening is aligned with the bridge area of ​​the semiconductor bridge chip. The present invention opens a hole in the center of the printed circuit board and adopts the surface assembly technology of chip inversion. The chip and the printed circuit board electrode can be reliably connected in one process. The structure is simple, the welding strength is high, the function is reliable, the product qualification rate is high, and the manufacturing cost is low."

[0004] The above patent has a simple structure, high welding strength, reliable function, high product qualification rate and low manufacturing cost. However, the above patent is assembled by welding, and the welding assembly process may cause damage to the parts, thereby affecting the use of the components, and the parts cannot be disassembled after welding. Summary of the invention

[0005] The purpose of the present invention is to provide a surface-mounted semiconductor bridge transducer element for electric ignition products, aiming to solve the problem in the prior art that the welding assembly process may cause damage to parts, thereby affecting the use of the components, and the parts cannot be disassembled after welding.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A surface-mounted semiconductor bridge transducer element for electric ignition products, comprising:

[0008] Electrode plug;

[0009] An internal thread groove is provided at the upper end of the electrode plug;

[0010] A positioning mechanism, arranged on the electrode plug;

[0011] A semiconductor bridge chip is arranged on the positioning mechanism, and the semiconductor bridge chip is movably inserted into the internal thread groove;

[0012] A fixing mechanism is provided on the internal thread groove, and the fixing mechanism is connected to the semiconductor bridge chip;

[0013] There are two electrode columns, both of which are fixedly connected to the upper end of the semiconductor bridge chip, and both electrode columns penetrate the semiconductor bridge chip and extend to the lower side of the electrode plug; and a heat dissipation mechanism is arranged on the electrode plug.

[0014] As a preferred solution of the present invention, the positioning mechanism includes a plug-in hole and a positioning column, wherein three plug-in holes are provided, and the three plug-in holes are all opened on the lower inner wall of the internal thread groove, and the three plug-in holes are evenly distributed, and three positioning columns are provided, and the three positioning columns are all fixedly connected to the lower end of the semiconductor bridge chip, and each positioning column is movably plugged into each plug-in hole.

[0015] As a preferred solution of the present invention, the fixing mechanism includes an external thread fixing ring and a limiting ring, the limiting ring is fixedly connected to the circumferential surface of the semiconductor bridge chip, and the limiting ring is located in the internal thread groove, the external thread fixing ring is threadedly connected to the internal thread groove, and the external thread fixing ring is sleeved on the semiconductor bridge chip, and the semiconductor bridge chip is located on the upper side of the limiting ring.

[0016] As a preferred solution of the present invention, the heat dissipation mechanism includes a heat dissipation block and a mounting hole. The mounting hole is opened at the lower end of the electrode plug, and the heat dissipation block is fixedly connected in the mounting hole.

[0017] As a preferred solution of the present invention, a through hole is opened at the upper end of the semiconductor bridge chip.

[0018] As a preferred solution of the present invention, the upper end of the external threaded fixing ring is fixedly connected with a second antistatic patch, the lower end of the electrode plug is fixedly connected with a first antistatic patch, and the first antistatic patch is sleeved on the two electrode columns.

[0019] As a preferred solution of the present invention, two positioning grooves are provided on the lower inner wall of the internal thread groove.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. In this scheme, the positioning groove is provided to facilitate the connection of the electrode column, and the plug-in hole is provided to facilitate the plug-in of the positioning column. The positioning column is movably plugged into the plug-in hole to achieve the positioning of the semiconductor bridge chip. The external thread fixing ring is threadedly connected to the internal thread groove to fix the semiconductor bridge chip. Since the semiconductor bridge chip is threadedly connected to the internal thread groove, the semiconductor bridge chip is easy to install and disassemble.

[0022] 2. In this solution, the heat dissipation effect can be improved by setting up the heat dissipation block, the use of materials can be reduced by opening the through hole, thereby saving costs, and the generation of static electricity can be prevented by setting up the first anti-static patch and the second anti-static patch, thereby improving the stability of the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 is a cross-sectional view of the electrode plug of the present invention;

[0026] Figure 3 An exploded view of the semiconductor bridge chip and the external thread fixing ring of the present invention;

[0027] Figure 4 It is an exploded view of the semiconductor bridge chip and the external thread fixing ring of the present invention from another perspective;

[0028] Figure 5 It is an exploded view of the heat dissipation block of the present invention.

[0029] In the figure: 1. electrode plug; 2. first antistatic patch; 3. electrode column; 4. external thread fixing ring; 5. second antistatic patch; 6. through hole; 7. semiconductor bridge chip; 8. heat sink; 10. limiting ring; 11. internal thread groove; 12. positioning groove; 13. plug-in hole; 14. positioning column; 15. mounting hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Example 1

[0032] See also Figure 1-5 , the technical solution provided by this embodiment is as follows:

[0033] A surface-mounted semiconductor bridge transducer element for electric ignition products, comprising:

[0034] Electrode plug 1;

[0035] An internal thread groove 11, which is opened at the upper end of the electrode plug 1;

[0036] A positioning mechanism is provided on the electrode plug 1;

[0037] The semiconductor bridge chip 7 is arranged on the positioning mechanism, and the semiconductor bridge chip 7 is movably inserted into the internal thread groove 11;

[0038] A fixing mechanism is provided on the internal thread groove 11, and the fixing mechanism is connected to the semiconductor bridge chip 7;

[0039] Two electrode columns 3 are provided, and both electrode columns 3 are fixedly connected to the upper end of the semiconductor bridge chip 7, and both electrode columns 3 penetrate the semiconductor bridge chip 7 and extend to the lower side of the electrode plug 1; and

[0040] The heat dissipation mechanism is arranged on the electrode plug 1 .

[0041] In a specific embodiment of the present invention, the internal thread groove 11 is used to connect the semiconductor bridge chip 7, and the semiconductor bridge chip 7 is fixedly connected to the upper ends of three positioning columns 14. Each electrode column 3 is movably inserted into each positioning groove 12, and each electrode column 3 extends to the outside of each positioning groove 12.

[0042] Specifically, the positioning mechanism includes a plug-in hole 13 and a positioning column 14. There are three plug-in holes 13, which are all opened on the lower inner wall of the internal thread groove 11, and the three plug-in holes 13 are evenly distributed. There are three positioning columns 14, which are all fixedly connected to the lower end of the semiconductor bridge chip 7, and each positioning column 14 is movably plugged into each plug-in hole 13.

[0043] In a specific embodiment of the present invention, the positioning groove 12 is used to connect the positioning column 14, and positioning can be achieved through the arrangement of the positioning column 14.

[0044] Specifically, the fixing mechanism includes an externally threaded fixing ring 4 and a limiting ring 10. The limiting ring 10 is fixedly connected to the circumferential surface of the semiconductor bridge chip 7, and the limiting ring 10 is located in the internal thread groove 11. The externally threaded fixing ring 4 is threadedly connected to the internal thread groove 11, and the externally threaded fixing ring 4 is sleeved on the semiconductor bridge chip 7, and the semiconductor bridge chip 7 is located on the upper side of the limiting ring 10.

[0045] In a specific embodiment of the present invention, the second antistatic patch 5 is threadedly connected to the internal thread groove 11 to limit the position of the limit ring 10, and the position of the semiconductor bridge chip 7 can be fixed by the fixed connection between the limit ring 10 and the semiconductor bridge chip 7.

[0046] Specifically, the heat dissipation mechanism includes a heat dissipation block 8 and a mounting hole 15 . The mounting hole 15 is opened at the lower end of the electrode plug 1 , and the heat dissipation block 8 is fixedly connected in the mounting hole 15 .

[0047] In a specific embodiment of the present invention, the mounting hole 15 is used to connect the heat sink 8, and the heat sink 8 can improve the heat dissipation effect.

[0048] Specifically, a through hole 6 is formed at the upper end of the semiconductor bridge chip 7 .

[0049] In a specific embodiment of the present invention, the use of materials can be reduced by opening the through hole 6, thereby saving costs.

[0050] Specifically, the upper end of the external threaded fixing ring 4 is fixedly connected with the second antistatic patch 5 , the lower end of the electrode plug 1 is fixedly connected with the first antistatic patch 2 , and the first antistatic patch 2 is sleeved on the two electrode columns 3 .

[0051] In a specific embodiment of the present invention, the provision of the first antistatic patch 2 and the second antistatic patch 5 can prevent static electricity from being generated, thereby improving the stability of the component.

[0052] Specifically, two positioning grooves 12 are formed on the lower inner wall of the internal thread groove 11 .

[0053] In a specific embodiment of the present invention, the positioning groove 12 is provided for connecting the electrode column 3 .

[0054] The working principle of the surface-encapsulated semiconductor bridge transducer element for electric ignition products provided by the present invention is as follows: the arrangement of the positioning groove 12 facilitates the connection of the electrode column 3, the arrangement of the plug-in hole 13 facilitates the plug-in of the positioning column 14, and the positioning column 14 is movably plugged into the plug-in hole 13 to achieve the positioning of the semiconductor bridge chip 7, and the external thread fixing ring 4 is threadedly connected to the internal thread groove 11 to fix the semiconductor bridge chip 7. Since the semiconductor bridge chip 7 is threadedly connected to the internal thread groove 11, the semiconductor bridge chip 7 is easy to install and disassemble, and the arrangement of the heat dissipation block 8 can improve the heat dissipation effect, and the opening of the through hole 6 can reduce the use of materials, thereby saving costs, and the arrangement of the first anti-static patch 2 and the second anti-static patch 5 can prevent the generation of static electricity, thereby improving the stability of the component.

[0055] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A surface-mounted semiconductor bridge transducer element for electric ignition products, characterized in that: include: Electrode plug (1); An internal thread groove (11) is provided at the upper end of the electrode plug (1); A positioning mechanism is arranged on the electrode plug (1); A semiconductor bridge chip (7) is arranged on the positioning mechanism, and the semiconductor bridge chip (7) is movably inserted into the internal thread groove (11); A fixing mechanism is arranged on the internal thread groove (11), and the fixing mechanism is connected to the semiconductor bridge chip (7); Two electrode columns (3) are provided, and both of the two electrode columns (3) are fixedly connected to the upper end of the semiconductor bridge chip (7), and both of the two electrode columns (3) penetrate the semiconductor bridge chip (7) and extend to the lower side of the electrode plug (1); and The heat dissipation mechanism is arranged on the electrode plug (1).

2. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 1, characterized in that: The positioning mechanism comprises a plug-in hole (13) and a positioning column (14); three plug-in holes (13) are provided, and the three plug-in holes (13) are all opened on the lower inner wall of the internal thread groove (11), and the three plug-in holes (13) are evenly distributed; three positioning columns (14) are provided, and the three positioning columns (14) are all fixedly connected to the lower end of the semiconductor bridge chip (7), and each positioning column (14) is movably plugged into each plug-in hole (13).

3. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 2, characterized in that: The fixing mechanism comprises an externally threaded fixing ring (4) and a limiting ring (10); the limiting ring (10) is fixedly connected to the circumferential surface of the semiconductor bridge chip (7), and the limiting ring (10) is located in the internal thread groove (11); the externally threaded fixing ring (4) is threadedly connected in the internal thread groove (11), and the externally threaded fixing ring (4) is sleeved on the semiconductor bridge chip (7); and the semiconductor bridge chip (7) is located on the upper side of the limiting ring (10).

4. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 3, characterized in that: The heat dissipation mechanism comprises a heat dissipation block (8) and a mounting hole (15); the mounting hole (15) is opened at the lower end of the electrode plug (1); and the heat dissipation block (8) is fixedly connected in the mounting hole (15).

5. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 4, characterized in that: A through hole (6) is provided at the upper end of the semiconductor bridge chip (7).

6. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 5, characterized in that: The upper end of the external thread fixing ring (4) is fixedly connected to a second antistatic patch (5), the lower end of the electrode plug (1) is fixedly connected to a first antistatic patch (2), and the first antistatic patch (2) is sleeved on the two electrode columns (3).

7. The surface mounted semiconductor bridge transducer element for electric ignition products according to claim 6, characterized in that: The lower inner wall of the internal thread groove (11) is provided with two positioning grooves (12).

Images