Circuit board of direct-current converter, manufacturing method of circuit board and direct-current converter

Abstract

The invention discloses a circuit board of a direct-current converter, a manufacturing method of the circuit board and the direct-current converter, and belongs to the technical field of power electronic devices. The method comprises the following steps: providing a circuit board bare board of the DC converter, wherein component layout and wiring design on the circuit board bare board are formed based on a preset boost-buck circuit topology; according to a preset target working mode of the direct-current converter, determining a target element which needs to be subjected to empty bonding and a target bonding pad which needs to be subjected to short circuit on the bare board of the circuit board; and according to the component layout and wiring design on the circuit board bare board, carrying out surface mounting and welding treatment on other components except the target component on the circuit board bare board, and meanwhile, carrying out short circuit on the target bonding pad so as to obtain the required circuit board. According to the method, the components on the PCB can be flexibly configured according to the preset target working mode of the direct-current converter, and the purpose of effectively reducing the manufacturing cost on the premise that the universality of the direct-current converter is not sacrificed is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronic devices, and in particular to a circuit board of a direct current converter and a manufacturing method thereof, and a direct current converter. Background Art

[0002] In the field of power electronics, DC-DC Converter is a key device for realizing DC voltage conversion and is widely used in various electronic devices to meet the voltage requirements in different application scenarios. At present, there are three typical working modes of DC converters: boost mode, buck mode and more flexible buck-boost mode (Buck-Boost Mode or Flyback Mode). Each working mode is based on a specific circuit topology, which exhibits different characteristics in terms of component configuration, energy conversion efficiency, dynamic response and stability.

[0003] In the design and manufacturing process of DC converters, the choice of circuit topology is crucial. It not only determines the working mode of the converter, but also directly affects its performance, cost-effectiveness and production flexibility. Traditionally, manufacturers will customize or design circuit topology according to the specific requirements of customer orders, such as the required working mode, input and output voltage range, power level, etc., and make printed circuit boards (PCBs) accordingly. However, this customized development model faces challenges such as scattered orders, small single purchase quantities, and high mold opening costs. In particular, considering the diversity and inconsistency of the internal architecture of DCDC converters, it is often difficult to share molds between different circuit topologies, resulting in further increases in production costs.

[0004] In order to meet this challenge, the industry has adopted a strategy of adopting universal molds. This strategy is based on the buck-boost circuit topology to design PCB boards, aiming to achieve compatibility with multiple working modes through a universal hardware platform, thereby improving production efficiency and reducing costs. The buck-boost circuit topology is considered an ideal choice for achieving universalization because it can support both boost and buck functions. However, although this method reduces the mold opening cost to a certain extent, the buck-boost circuit usually requires more components to realize its function compared to a single boost or buck circuit, which directly leads to an increase in manufacturing costs.

[0005] Therefore, how to effectively reduce the manufacturing cost of the DC converter while maintaining its versatility has become a technical problem that needs to be solved urgently. Summary of the invention

[0006] In view of the above problems, the present invention is proposed to provide a circuit board of a DC converter and a manufacturing method thereof, and a DC converter that overcome the above problems or at least partially solve the above problems. The method utilizes the versatility of the buck-boost circuit topology to form a bare circuit board, and then adopts a blank-sticking method to flexibly configure the components on the PCB board to achieve conversion of different working modes according to the target working mode of the predetermined DC converter, thereby achieving the goal of effectively reducing the manufacturing cost without sacrificing the versatility of the DC converter.

[0007] In a first aspect, a method for manufacturing a circuit board of a DC converter is provided, comprising:

[0008] A bare circuit board of a DC converter is provided, wherein the layout and routing design of components on the bare circuit board are formed based on a predetermined buck-boost circuit topology;

[0009] According to a predetermined target operating mode of the DC converter, determining target components to be blanked on the bare board of the circuit board and target pads to be short-circuited, wherein the target operating mode includes a boost mode, a buck mode or a buck-boost mode;

[0010] According to the layout of components and the routing design on the bare circuit board, other components on the bare circuit board except the target component are subjected to patch and welding processing, and the target pads are short-circuited at the same time to obtain the required circuit board.

[0011] Optionally, the step of determining target components to be blank-mounted and target pads to be short-circuited on the bare board of the circuit board according to a predetermined target operating mode of the DC converter includes:

[0012] Determine a corresponding target circuit topology according to a predetermined target operating mode of the DC converter, wherein the target circuit topology includes at least a boost circuit topology, a buck circuit topology, and a buck-boost circuit topology;

[0013] The target circuit topology is compared with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited.

[0014] Optionally, the target circuit topology is determined according to a predetermined target operating mode of the DC converter:

[0015] When the target operating mode is the boost mode, determining that the corresponding target circuit topology is the boost circuit topology;

[0016] When the target operating mode is the buck mode, determining that the corresponding target circuit topology is the buck circuit topology;

[0017] When the target operating mode is the buck-boost mode, the corresponding target circuit topology is determined to be the buck-boost circuit topology.

[0018] Optionally, the predetermined buck-boost circuit topology includes a first switch tube, a second switch tube, a first diode, a second diode, a first capacitor, a second capacitor and an inductor;

[0019] One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, and one end of the series circuit formed by the first switch tube, the inductor and the second diode connected in series in sequence is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor;

[0020] The drain of the first switch tube is connected to one end of the first capacitor, the source of the first switch tube is connected to one end of the inductor, the other end of the inductor is connected to the anode of the second diode, and the cathode of the second diode is connected to one end of the second capacitor;

[0021] The cathode of the first diode is connected to the source of the first switch tube, and the anode of the first diode is connected to the other end of the first capacitor; the drain of the second switch tube is connected to the other end of the inductor, and the source of the second switch tube is connected to the other end of the second capacitor;

[0022] The gates of the first switch tube and the second switch tube are both grounded.

[0023] Optionally, the buck circuit topology includes the first switch tube, the first diode, the first capacitor, the second capacitor and the inductor;

[0024] One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, one end of the series circuit formed by the first switch tube and the inductor being connected in series in sequence is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor;

[0025] Among them, the drain of the first switching tube is connected to one end of the first capacitor, the source of the first switching tube is connected to one end of the inductor, the other end of the inductor is connected to one end of the second capacitor, and the gate of the first switching tube is grounded; the cathode of the first diode is connected to the source of the first switching tube, and the anode of the first diode is connected to the other end of the first capacitor.

[0026] Optionally, when the target circuit topology is a buck circuit topology, comparing the target circuit topology with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited includes:

[0027] The buck circuit topology is compared with the predetermined buck-boost circuit topology to determine that the target components that need to be blank-pasted on the bare board of the circuit board are the second switch tube and the second diode, and the target pads that need to be short-circuited are the pads corresponding to the second diode.

[0028] Optionally, the boost circuit topology includes the second switch tube, the second diode, the first capacitor, the second capacitor and the inductor;

[0029] One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, and one end of the series circuit formed by the inductor and the second diode connected in series is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor;

[0030] Among them, one end of the inductor is connected to one end of the first capacitor, the other end of the inductor is connected to the positive electrode of the second diode, and the negative electrode of the second diode is connected to one end of the second capacitor; the drain of the second switch tube is connected to the other end of the inductor, the source of the second switch tube is connected to the other end of the second capacitor, and the gate of the second switch tube is grounded.

[0031] Optionally, when the target circuit topology is a buck circuit topology, comparing the target circuit topology with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited includes:

[0032] The boost circuit topology is compared with the predetermined boost-boost circuit topology to determine that the target components that need to be blank-pasted on the bare board of the circuit board are the first switch tube and the first diode, and the target pads that need to be short-circuited are the pads corresponding to the first switch tube.

[0033] In a second aspect, a circuit board of a DC converter is provided, which is manufactured using the circuit board manufacturing method as described in the first aspect.

[0034] In a third aspect, a DC converter is provided, comprising the circuit board as described in the second aspect.

[0035] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0036] A circuit board of a DC converter and a manufacturing method thereof, and a DC converter provided by an embodiment of the present invention provide a bare circuit board formed by a pre-defined buck-boost circuit topology by providing a component layout and routing design, wherein the pre-defined buck-boost circuit topology can be used as a general topology to meet the requirements of the boost, buck and buck-boost working modes of the DC converter. Then, according to the predetermined target working mode of the DC converter, the target components that need to be vacantly pasted on the bare circuit board and the target pads that need to be short-circuited are determined, and finally, other components on the bare circuit board except the target components are patched and welded, and the target pads are short-circuited at the same time to obtain the required circuit board. Since the component layout and routing design on the bare circuit board are based on a unified universal circuit, that is, formed by a pre-defined buck-boost circuit topology, the manufacturing method can use a universal mold to manufacture the bare circuit board, and allows the manufacturer to vacantly paste the unnecessary components on the bare circuit board according to the customer's predetermined target working mode requirements for the DC converter, and short-circuit some pads, so as to flexibly and selectively mount the required components to meet the different working mode requirements of the DC converter, without having to design a mold separately for each working mode to make different circuit boards. This not only reduces the cost of mold making and mold opening, but also reduces the setting of components, improves production efficiency and flexibility, and achieves the goal of effectively reducing manufacturing costs without sacrificing the versatility of DC converters, making small batch and multi-variety production more economically feasible. In addition, since the diversity of molds is reduced, it is also convenient for inventory management and simplification of production processes.

[0037] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0039] Figure 1 It is a flow chart of a method for manufacturing a circuit board of a DC converter provided by an embodiment of the present invention;

[0040] Figure 2 It is a structural schematic diagram of a pre-customized buck-boost circuit topology provided by an embodiment of the present invention;

[0041] Figure 3 is a schematic diagram of the use of a DC converter provided by an embodiment of the present invention;

[0042] Figure 4 is a schematic diagram of a buck circuit topology provided by an embodiment of the present invention;

[0043] Figure 5 The diagram is a topology diagram of a boost circuit provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0044] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in combination with the accompanying drawings and specific implementation methods of the specification. It should be understood that the embodiments of the present disclosure and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present application and the technical features in the embodiments can be combined with each other.

[0045] Since most DCDC converters are customized and have scattered orders, the single purchase quantity is less than 100 units, the mold opening cost is high, the gravity casting mold cost is less than 100W, and the high-pressure casting mold cost is as high as 200W or more. However, DCDC has a variety of circuit topologies, and the internal architecture is inconsistent. It is often difficult to share molds between different circuit topologies. The mold opening balance point needs to be evaluated based on the order volume. Therefore, the strategy of universal molds is often adopted in related technologies. This strategy designs the PCB board of the DC converter based on the buck-boost circuit topology, aiming to achieve compatibility with multiple working modes through a universal hardware platform, thereby improving production efficiency and reducing costs. The buck-boost circuit topology is considered an ideal choice for achieving universalization because it can support both boost and buck functions. However, although this method reduces the mold opening cost to a certain extent, the buck-boost circuit usually requires more components to realize its function compared to a single boost or buck circuit, which directly leads to an increase in manufacturing costs.

[0046] Therefore, in order to solve the above-mentioned technical problems, the embodiment of the present invention provides a manufacturing method of a circuit board of a DC converter, the core of which is that after forming a bare circuit board based on a predetermined buck-boost circuit topology, before the bare circuit board is subjected to processes such as patching and welding, first determine the target components that need to be vacantly pasted on the bare circuit board and the target pads that need to be short-circuited according to the predetermined target operating mode of the DC converter, and then perform patching and welding on other components on the bare circuit board except the target components, and short-circuit the target pads at the same time to obtain the required circuit board. At this time, the target component is vacantly pasted, and the position of the target component is empty so that it can be installed according to specific needs later. In this way, the same PCB circuit board can be configured with different components to achieve boost, buck or buck-boost operating modes, meet customer needs, and achieve the goal of effectively reducing manufacturing costs without sacrificing the versatility of the DC converter.

[0047] Figure 1 is a flow chart of a method for manufacturing a circuit board of a DC converter provided by an embodiment of the present invention, such as Figure 1 As shown, the manufacturing method includes:

[0048] Step S110: providing a bare circuit board of a DC converter, wherein the layout of components and the design of wiring on the bare circuit board are formed based on a predetermined buck-boost circuit topology.

[0049] Among them, bare circuit board, also known as bare PCB, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Specifically, bare circuit board refers to a printed circuit board without any through-holes or electronic components added. They usually only have basic channels, patterns, metal coatings and PCB substrates, without any electronic components or devices installed. By mounting electronic components on it, various functions of the equipment are realized.

[0050] Figure 2 is a schematic diagram of a structure of a pre-customized buck-boost circuit topology provided by an embodiment of the present invention, such as Figure 2 As shown, the pre-customized buck-boost circuit topology includes a first switch tube Q1, a second switch tube Q2, a first diode D1, a second diode D2, a first capacitor C1, a second capacitor C2 and an inductor L.

[0051] One end of the first capacitor C1 is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor C1 is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor C2 is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor C2 is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor C1 is connected to the other end of the second capacitor C2. One end of the series circuit formed by the first switch tube Q1, the inductor L and the second diode D2 connected in series in sequence is connected to one end of the first capacitor C1, and the other end is connected to one end of the second capacitor C2.

[0052] The drain of the first switch tube Q1 is connected to one end of the first capacitor C1, the source of the first switch tube Q1 is connected to one end of the inductor L, the other end of the inductor L is connected to the positive electrode of the second diode D2, and the negative electrode of the second diode D2 is connected to one end of the second capacitor C2. The negative electrode of the first diode D1 is connected to the source of the first switch tube Q1, and the positive electrode of the first diode D1 is connected to the other end of the first capacitor C1; the drain of the second switch tube Q2 is connected to the other end of the inductor L, and the source of the second switch tube Q2 is connected to the other end of the second capacitor C2. The gates of the first switch tube Q1 and the second switch tube Q2 are both grounded.

[0053] In the above embodiment, the first switch tube D1 and the second switch tube D2 are both MOS with a voltage regulator diode connected in parallel between the drain and the source, that is, a metal-oxide semiconductor field effect transistor, which is a commonly used electronic component and is widely used in various circuits. MOS tubes control current through voltage and have the advantages of fast switching speed, high input impedance, low noise, etc. The voltage regulator diode can protect the MOS tube from adverse factors such as reverse voltage, transient high voltage and induced voltage generated by inductive loads, and also provide a current path when the MOSFET is in the inversion zone to ensure the stability and reliability of the circuit.

[0054] like Figure 2 As shown, the pre-customized buck-boost circuit topology is a unidirectional buck-boost topology circuit. When the working mode is buck mode, the first switch tube Q1 is driven to work, and the second switch tube Q2 is not working and is in the off state; when the working mode is buck mode, the first switch tube Q1 is fully turned on and the second switch tube Q2 is driven to work at the same time. When the working mode is buck-boost mode, the input and output voltages can be intelligently judged through DCDC voltage sampling to achieve intelligent switching between boost and buck.

[0055] Since the layout and routing design of components on the bare circuit board are based on the pre-customized buck-boost circuit topology, the bare circuit board is universal and can be manufactured using a universal mold, thereby reducing the mold opening cost during the PCB manufacturing process. In addition, manufacturers can flexibly and selectively install components on the bare circuit board according to customer needs to form the circuit board structure required for DC converters in different working modes.

[0056] Optionally, before performing step S120, the manufacturing method further includes:

[0057] A predetermined target operating mode of the DC converter is determined according to a predetermined target input voltage and a target output voltage of the DC converter.

[0058] Specifically, when the maximum value of the input voltage is less than the minimum value of the output voltage, the target circuit topology of the DC converter is determined to be a boost circuit topology; when the minimum value of the input voltage is greater than the maximum value of the output voltage, the target circuit topology of the DC converter is determined to be a buck circuit topology; when there is overlap between the voltage values ​​of the input voltage and the output voltage, the target circuit topology of the DC converter is determined to be a buck-boost circuit topology.

[0059] Figure 3 is a schematic diagram of the use of a DC converter provided by an embodiment of the present invention, such as Figure 3 As shown, when the DC converter 300 is used in a fuel cell system, the input end of the DC converter 300 is connected to the output voltage of the battery stack 310, and the output end is connected to the vehicle bus voltage platform 320 and the power battery 330. The target operating mode of the predetermined DC converter can be determined according to the following method:

[0060] (1) When the stack open circuit voltage 1.0*n (i.e., the maximum value of the input voltage) is less than the power battery minimum voltage Umin (i.e., the minimum value of the output voltage), the target circuit topology of the DC converter is determined to be a boost circuit topology;

[0061] (2) When the full-load voltage of the battery stack 0.6*n (i.e., the minimum value of the input voltage) is greater than the maximum voltage of the power battery Umax (i.e., the maximum value of the output voltage), the target circuit topology of the DC converter is determined to be a buck circuit topology;

[0062] (3) When the voltage values ​​of the input voltage and the output voltage overlap, that is, when the value range of the stack voltage 0.6*n~1.0*n overlaps with the value range of the power battery voltage Umin~Umax, the target circuit topology of the DC converter is determined to be a buck-boost circuit topology.

[0063] Step S120, according to a predetermined target operating mode of the DC converter, determining target components to be blanked on the bare circuit board and target pads to be short-circuited, wherein the target operating mode includes a boost mode, a buck mode or a buck-boost mode.

[0064] Optionally, step S120 includes:

[0065] The first step is to determine a corresponding target circuit topology according to a predetermined target operating mode of the DC converter, wherein the target circuit topology includes at least a boost circuit topology, a buck circuit topology and a buck-boost circuit topology;

[0066] In this embodiment, when the target operating mode is a boost mode, the corresponding target circuit topology is determined to be a boost circuit topology; when the target operating mode is a buck mode, the corresponding target circuit topology is determined to be a buck circuit topology; when the target operating mode is a buck-boost mode, the corresponding target circuit topology is determined to be a buck-boost circuit topology.

[0067] The second step is to compare the target circuit topology with the pre-customized buck-boost circuit topology to determine the target components that need to be placed on the bare board of the circuit board and the target pads that need to be short-circuited.

[0068] Figure 4 is a schematic diagram of a buck circuit topology provided by an embodiment of the present invention, such as Figure 4 As shown, the buck circuit topology includes a first switch tube Q1, a first diode D1, a first capacitor C1, a second capacitor C2 and an inductor L.

[0069] One end of the first capacitor C1 is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor C1 is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor C2 is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor C2 is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor C1 is connected to the other end of the second capacitor C2. One end of the series circuit formed by the first switch tube Q1 and the inductor L connected in series in sequence is connected to one end of the first capacitor C1, and the other end is connected to one end of the second capacitor C2.

[0070] Among them, the drain of the first switch tube Q1 is connected to one end of the first capacitor C1, the source of the first switch tube Q1 is connected to one end of the inductor L, the other end of the inductor L is connected to one end of the second capacitor C2, and the gate of the first switch tube Q1 is grounded; the cathode of the first diode D1 is connected to the source of the first switch tube Q1, and the anode of the first diode D1 is connected to the other end of the first capacitor C1.

[0071] Optionally, when the target circuit topology is a buck circuit topology, the target circuit topology is compared with a pre-customized buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited, including:

[0072] The buck circuit topology is compared with the pre-customized buck-boost circuit topology to determine that the target components that need to be blank-pasted on the bare board of the circuit board are the second switch tube Q2 and the second diode D2, and the target pads that need to be short-circuited are the pads corresponding to the second diode D2.

[0073] In this embodiment, the comparison Figure 2 and Figure 4 It can be seen that the difference between the buck circuit topology and the predetermined buck-boost circuit topology lies only in the second switch tube Q2 and the second diode D2. Therefore, by leaving the second switch tube Q2 and the second diode D2 blank, and short-circuiting the pads corresponding to the second diode D2 through metal sheets, and then mounting and welding the other components on the circuit board except the second switch tube Q2 and the second diode D2, a circuit board with a buck circuit topology can be obtained, and a DC converter formed based on the circuit board can operate in a buck mode.

[0074] Figure 5 is a schematic diagram of a boost circuit topology provided by an embodiment of the present invention, such as Figure 5 As shown, the boost circuit topology includes a second switch tube Q2, a second diode D2, a first capacitor C1, a second capacitor C2 and an inductor L.

[0075] One end of the first capacitor C1 is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor C1 is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor C2 is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor C2 is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor C1 is connected to the other end of the second capacitor C2. One end of the series circuit formed by the inductor L and the second diode D2 connected in series in sequence is connected to one end of the first capacitor C1, and the other end is connected to one end of the second capacitor C2.

[0076] Among them, one end of the inductor L is connected to one end of the first capacitor C1, the other end of the inductor L is connected to the positive electrode of the second diode D2, and the negative electrode of the second diode D2 is connected to one end of the second capacitor C2; the drain of the second switch tube Q2 is connected to the other end of the inductor L, the source of the second switch tube Q2 is connected to the other end of the second capacitor C2, and the gate of the second switch tube Q2 is grounded.

[0077] Optionally, when the target circuit topology is a buck circuit topology, the target circuit topology is compared with a pre-customized buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited, including:

[0078] The boost circuit topology is compared with the pre-customized boost-boost circuit topology to determine that the target components that need to be blank-pasted on the bare circuit board are the first switch tube Q1 and the first diode D1, and the target pads that need to be short-circuited are the pads corresponding to the first switch tube Q1.

[0079] In this embodiment, the comparison Figure 2 and Figure 5 It can be seen that the difference between the boost circuit topology and the predetermined buck-boost circuit topology lies only in the first switch tube Q1 and the first diode D1. Therefore, by mounting the first switch tube Q1 and the first diode D1 in vain, and short-circuiting the pads corresponding to the first switch tube Q1 through metal sheets, and then mounting and welding the other components on the circuit board except the first switch tube Q1 and the first diode D1, a circuit board with a boost circuit topology can be obtained, and a DC converter formed based on the circuit board can operate in a boost mode.

[0080] It should be noted that when the target circuit topology is a buck-boost circuit topology, the target circuit topology is the same as the pre-customized buck-boost circuit topology. At this time, there are no target components that need to be blanked and no target pads that need to be short-circuited on the bare board of the circuit board.

[0081] Step S130: According to the component layout and routing design on the bare circuit board, other components on the bare circuit board except the target component are subjected to SMT and welding processing, and the target pads are short-circuited to obtain the desired circuit board.

[0082] In this embodiment, the target pad may be short-circuited with a metal sheet.

[0083] It should be noted that the above-mentioned manufacturing method provided by the embodiment of the present invention can be executed by a controller. Specifically, the controller can control the machine to manipulate the mechanical equipment to clamp the required bare circuit board to complete step S110; then the controller can determine the corresponding target circuit topology by obtaining the target operating mode of the predetermined DC converter input by the user at the input end, and by comparing the target circuit topology with the predetermined buck-boost circuit topology, determine the target components that need to be blank-pasted on the bare circuit board and the target pads that need to be short-circuited to complete step S120; finally, the controller can control related equipment (such as patch, welding equipment, etc.), according to the component layout and routing design on the bare circuit board, perform patch and welding processing on other components on the bare circuit board except the target components, and short-circuit the target pads at the same time to obtain the required circuit board to complete step S130.

[0084] Based on the same inventive concept, an embodiment of the present invention further provides a circuit board for a DC converter, which is manufactured using the circuit board manufacturing method described in the above embodiment.

[0085] An embodiment of the present invention further provides a DC converter, comprising a circuit board manufactured by the circuit board manufacturing method described in the above embodiment.

[0086] Compared with the prior art, the beneficial effects of the circuit board of the DC converter and the DC converter provided in the present application are the same as the beneficial effects of the circuit board manufacturing method provided in the above embodiment, and will not be elaborated here.

[0087] The technical solutions provided in the above embodiments of the present application have at least the following technical effects or advantages:

[0088] A circuit board of a DC converter and a manufacturing method thereof, and a DC converter provided by an embodiment of the present invention provide a bare circuit board formed by a pre-defined buck-boost circuit topology by providing a component layout and routing design, wherein the pre-defined buck-boost circuit topology can be used as a general topology to meet the requirements of the boost, buck and buck-boost working modes of the DC converter. Then, according to the predetermined target working mode of the DC converter, the target components that need to be vacantly pasted on the bare circuit board and the target pads that need to be short-circuited are determined, and finally, other components on the bare circuit board except the target components are patched and welded, and the target pads are short-circuited at the same time to obtain the required circuit board. Since the component layout and routing design on the bare circuit board are based on a unified universal circuit, that is, formed by a pre-defined buck-boost circuit topology, the manufacturing method can use a universal mold to manufacture the bare circuit board, and allows the manufacturer to vacantly paste the unnecessary components on the bare circuit board according to the customer's predetermined target working mode requirements for the DC converter, and short-circuit some pads, so as to flexibly and selectively mount the required components to meet the different working mode requirements of the DC converter, without having to design a mold separately for each working mode to make different circuit boards. This not only reduces the cost of mold making and mold opening, but also reduces the setting of components, improves production efficiency and flexibility, and achieves the goal of effectively reducing manufacturing costs without sacrificing the versatility of DC converters, making small batch and multi-variety production more economically feasible. In addition, since the diversity of molds is reduced, it is also convenient for inventory management and simplification of production processes.

[0089] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0090] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0091] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A method for manufacturing a circuit board of a DC converter, characterized in that: include: A bare circuit board of a DC converter is provided, wherein the layout and routing design of components on the bare circuit board are formed based on a predetermined buck-boost circuit topology; Determine the target components to be blanked and the target pads to be short-circuited on the bare board of the circuit board according to the predetermined target operating mode of the DC converter, wherein the target operating mode includes a boost mode, a buck mode or a buck-boost mode; According to the layout of components and the routing design on the bare circuit board, other components on the bare circuit board except the target component are subjected to SMT and welding processing, and the target pads are short-circuited at the same time to obtain the required circuit board.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The step of determining target components to be blank-mounted and target pads to be short-circuited on the bare board of the circuit board according to the predetermined target operating mode of the DC converter includes: Determine a corresponding target circuit topology according to a predetermined target operating mode of the DC converter, wherein the target circuit topology includes at least a boost circuit topology, a buck circuit topology, and a buck-boost circuit topology; The target circuit topology is compared with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited.

3. The method for manufacturing a circuit board according to claim 2, characterized in that: The step of determining a corresponding target circuit topology according to a predetermined target operating mode of the DC converter includes: When the target operating mode is the boost mode, determining that the corresponding target circuit topology is the boost circuit topology; When the target operating mode is the buck mode, determining that the corresponding target circuit topology is the buck circuit topology; When the target operating mode is the buck-boost mode, the corresponding target circuit topology is determined to be the buck-boost circuit topology.

4. The method for manufacturing a circuit board according to claim 2, characterized in that: The predetermined buck-boost circuit topology includes a first switch tube, a second switch tube, a first diode, a second diode, a first capacitor, a second capacitor and an inductor; One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, and one end of the series circuit formed by the first switch tube, the inductor and the second diode connected in series in sequence is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor; The drain of the first switch tube is connected to one end of the first capacitor, the source of the first switch tube is connected to one end of the inductor, the other end of the inductor is connected to the anode of the second diode, and the cathode of the second diode is connected to one end of the second capacitor; The cathode of the first diode is connected to the source of the first switch tube, and the anode of the first diode is connected to the other end of the first capacitor; the drain of the second switch tube is connected to the other end of the inductor, and the source of the second switch tube is connected to the other end of the second capacitor; The gates of the first switch tube and the second switch tube are both grounded.

5. The method for manufacturing a circuit board according to claim 4, characterized in that: The buck circuit topology includes the first switch tube, the first diode, the first capacitor, the second capacitor and the inductor; One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, one end of the series circuit formed by the first switch tube and the inductor being connected in series in sequence is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor; Among them, the drain of the first switching tube is connected to one end of the first capacitor, the source of the first switching tube is connected to one end of the inductor, the other end of the inductor is connected to one end of the second capacitor, and the gate of the first switching tube is grounded; the cathode of the first diode is connected to the source of the first switching tube, and the anode of the first diode is connected to the other end of the first capacitor.

6. The method for manufacturing a circuit board according to claim 5, characterized in that: When the target circuit topology is a buck circuit topology, comparing the target circuit topology with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited includes: The buck circuit topology is compared with the predetermined buck-boost circuit topology to determine that the target components that need to be blank-pasted on the bare board of the circuit board are the second switch tube and the second diode, and the target pads that need to be short-circuited are the pads corresponding to the second diode.

7. The method for manufacturing a circuit board according to claim 4, characterized in that: The boost circuit topology includes the second switch tube, the second diode, the first capacitor, the second capacitor and the inductor; One end of the first capacitor is connected to the positive electrode of the input end of the DC converter, the other end of the first capacitor is connected to the negative electrode of the input end of the DC converter, one end of the second capacitor is connected to the positive electrode of the output end of the DC converter, the other end of the second capacitor is connected to the negative electrode of the output end of the DC converter, and the other end of the first capacitor is connected to the other end of the second capacitor, and one end of the series circuit formed by the inductor and the second diode connected in series is connected to one end of the first capacitor, and the other end is connected to one end of the second capacitor; Among them, one end of the inductor is connected to one end of the first capacitor, the other end of the inductor is connected to the positive electrode of the second diode, and the negative electrode of the second diode is connected to one end of the second capacitor; the drain of the second switch tube is connected to the other end of the inductor, the source of the second switch tube is connected to the other end of the second capacitor, and the gate of the second switch tube is grounded.

8. The method for manufacturing a circuit board according to claim 7, characterized in that: When the target circuit topology is a buck circuit topology, comparing the target circuit topology with the predetermined buck-boost circuit topology to determine target components that need to be blanked on the bare board of the circuit board and target pads that need to be short-circuited includes: The boost circuit topology is compared with the predetermined boost-boost circuit topology to determine that the target components that need to be blank-pasted on the bare board of the circuit board are the first switch tube and the first diode, and the target pads that need to be short-circuited are the pads corresponding to the first switch tube.

9. A circuit board for a DC converter, characterized in that: The circuit board is manufactured by the circuit board manufacturing method according to any one of claims 1 to 8.

10. A DC converter, characterized in that: Comprising the circuit board as claimed in claim 9.

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