Heat dissipation structure, container and data center

Abstract

The embodiment of the invention provides a heat dissipation structure, a container and a data center, the heat dissipation structure comprises at least one rack, a cooling device, a top frame and a supporting platform, the rack comprises a cabinet for integrated installation of a plurality of computing devices and a medium flow path for a cooling medium to flow through the plurality of computing devices; the cooling equipment comprises a heat exchange module and a first pipeline group connected between the heat exchange module and the medium flow path; the top frame is fixed to the top of the rack, and at least part of the first pipeline set is supported on the top frame. The rack and the cooling equipment are integrated on the supporting platform, the heat exchange module is arranged on one side of the rack in the first direction, and the first pipeline set is located on one side of the heat exchange module in the second direction, so that a skid structure is formed, the integration level and the structural stability of the heat dissipation structure are improved, unified transportation and delivery are achieved, and the heat dissipation efficiency is improved. And the concrete can be directly placed in place after being delivered, so that the requirements on land flatness and concrete foundations are reduced.

Description

Technical Field

[0001] The present application relates to the technical field of data centers, and in particular to a heat dissipation structure, a container, and a data center. Background Art

[0002] Data centers are generally equipped with multiple computing devices and cooling equipment for cooling each computing device. Before the data center is delivered, each computing device and cooling equipment is independent of each other and needs to be packaged separately, which results in high transportation costs. Moreover, after the data center is delivered, the layout of the computing equipment and cooling equipment needs to be adjusted to match the site, and then assembled and tested, resulting in a long deployment cycle. Summary of the invention

[0003] The embodiments of the present application provide a heat dissipation structure, a container, and a data center to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present application, an embodiment of the present application provides a heat dissipation structure, including:

[0005] At least one rack, the rack comprising a cabinet and a medium flow path, the cabinet is used to integrate and install multiple computing devices, and the medium flow path is used to allow cooling medium to flow through the multiple computing devices;

[0006] A cooling device comprises a heat exchange module and a first pipeline group, wherein the first pipeline group is connected between the heat exchange module and a medium flow path of at least one rack;

[0007] A top frame, fixed to the top of at least one frame, wherein at least a portion of the first pipeline group is supported by the top frame;

[0008] A support platform, at least one rack and a cooling device are integrated on the support platform, a heat exchange module is arranged on one side of at least one rack in a first direction, a first pipeline group is located on one side of the heat exchange module in a second direction, and the second direction intersects with the first direction.

[0009] In one embodiment, the support platform comprises:

[0010] A frame structure, a support plate and a frame body, wherein the frame structure has a first area and a second area arranged in a first direction, the support plate covers the first area; and the frame body is arranged in the second area;

[0011] At least one frame is arranged on the support plate, and the heat exchange module is supported on the upper part of the frame.

[0012] In one embodiment, the cooling device further comprises a second pipeline group, and the second pipeline group is connected between the heat exchange module and the cold source device;

[0013] The second area includes three sub-areas arranged in the second direction, the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area;

[0014] The orthographic projections of at least part of the pipe sections of the first pipeline group and at least part of the pipe sections of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on the two sides.

[0015] In one embodiment, the support plate includes a plurality of plates arranged in a spliced ​​relationship with each other, and each plate is connected to the frame structure through a corresponding fastener;

[0016] A gap is defined between two adjacent plate bodies, and the gap is used to guide the liquid on the support plate to the bottom of the support plate.

[0017] In one embodiment, a plurality of convex structures distributed at intervals are formed on the upper surface of the plate.

[0018] In one embodiment, the top frame includes a plurality of cross beams and at least one longitudinal beam; the plurality of cross beams extend in a first direction and are spaced side by side in a second direction, and the cross beams are fixedly connected to the top of at least one frame; the longitudinal beam extends in the second direction;

[0019] Among them, at least one longitudinal beam is fixedly connected between two adjacent cross beams, and part of the first pipeline group is supported by the longitudinal beam.

[0020] In one embodiment, the plurality of beams include a first beam body and a second beam body, and the first beam body and the second beam body are fixedly connected to the top of at least one frame;

[0021] The longitudinal beam comprises a first section and a second section connected to each other, wherein the first section is connected between the first beam body and the second beam body; the second section is located on a side of the second beam body away from the first beam body and extends to the outside of the frame in the second direction;

[0022] Part of the first pipeline group is supported on the second section.

[0023] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along the first direction;

[0024] There are multiple longitudinal beams, and the multiple longitudinal beams correspond to the multiple racks one by one. The longitudinal beams are located at the tops of the corresponding racks.

[0025] In one embodiment, the top frame further includes at least one pipeline support seat, at least one pipeline support seat corresponds one-to-one with at least one longitudinal beam, the pipeline support seat is arranged in the second section of the corresponding longitudinal beam, and part of the first pipeline group is supported by the pipeline support seat.

[0026] In one embodiment, the pipeline support seat has a slot having an opening arranged upward, and the inner wall surface of the slot is an arc surface that matches the shape of the outer peripheral wall of the pipeline of the first pipeline group.

[0027] In one embodiment, the heat dissipation structure further includes: a power distribution cabinet, which is disposed on the support platform and located on the other side of the at least one rack in the first direction so as to be opposite to the heat exchange module in the first direction;

[0028] The rack also includes a power distribution unit arranged inside the cabinet, and the power distribution unit is connected to the power distribution cabinet through a power supply cable.

[0029] In one embodiment, the top frame also includes at least one bracket, at least one bracket corresponds to at least one rack, the bracket is arranged on the top of the corresponding rack and is located between the first beam and the second beam; the top of the bracket has a supporting surface, and the supporting surface is used to support the power supply cable.

[0030] In one embodiment, a first cable hole is formed on the top of the cabinet of the rack, and the first cable hole is located on a side of the corresponding bracket away from the power distribution cabinet in the first direction, and the first cable hole is used for the corresponding power supply cable to pass through and be connected to the corresponding power distribution unit;

[0031] A second wire hole is formed on the top of the power distribution cabinet, and the second wire hole is used for the power supply cable to pass through and connect to the power distribution cabinet.

[0032] In one embodiment, the heat exchange module has a first heat exchange flow path for a cooling medium to flow and a second heat exchange flow path for a cooling medium to flow, and the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium;

[0033] The first pipeline group includes a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the liquid inlet of the medium flow path of the rack; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the medium flow path;

[0034] The cooling device also includes a second pipeline group, which is connected between the second heat exchange flow path of the heat exchange module and the cold source device and is located on the other side of the heat exchange module in the second direction.

[0035] In one embodiment, the first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected to each other, the first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend respectively along the first direction, and are arranged side by side and at intervals in the second direction;

[0036] The first liquid supply sub-pipeline has a liquid supply inlet at one end adjacent to the heat exchange module, and the liquid supply inlet is connected to the output end of the first heat exchange flow path; the second liquid supply sub-pipeline has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path;

[0037] The first liquid return pipeline comprises a first liquid return section, which extends along a first direction; the first liquid return section has a liquid return inlet, which is connected to the liquid outlet of the medium flow path.

[0038] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along the first direction;

[0039] There are multiple liquid supply outlets, which are arranged at intervals in the first direction of the second liquid supply sub-pipeline and are connected to the liquid inlets of the medium flow paths of the multiple racks in a one-to-one correspondence;

[0040] There are multiple liquid return inlets, which are arranged at intervals in the first direction of the first liquid return section and are connected to the liquid outlets of the medium flow paths of the multiple racks in a one-to-one correspondence.

[0041] In one embodiment, the first liquid supply sub-pipeline, the second liquid supply sub-pipeline and the first liquid return section are all supported on the top frame, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

[0042] In one embodiment, the first liquid return pipeline also includes a second liquid return section and a third liquid return section connected to each other, and the second liquid return section and the third liquid return section extend vertically respectively; the first liquid return section is closed at one end away from the heat exchange module, and the end of the first liquid return section adjacent to the heat exchange module is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

[0043] In one embodiment, the support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively a sub-area located in the middle and two sub-areas located on both sides;

[0044] The orthographic projections of the second liquid return section and the third liquid return section in the horizontal plane are located in a sub-region adjacent to one side of the first liquid supply pipeline.

[0045] In one embodiment, the second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source equipment.

[0046] In one embodiment, the supporting platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively a sub-area located in the middle and two sub-areas located on both sides;

[0047] The orthographic projections of the second liquid supply pipeline and the second liquid return pipeline in the horizontal plane are located in a sub-region on a side away from the first liquid supply pipeline.

[0048] In one embodiment, the cooling device further includes a first power device and a second power device, the first power device is connected to the first pipeline group for providing power for the flow of the cooling medium, and the second power device is connected to the second pipeline group for providing power for the flow of the heat exchange medium.

[0049] In one embodiment, the support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively a sub-area located in the middle and two sub-areas located on both sides;

[0050] The first power device and the second power device of the cooling device are respectively arranged in two sub-areas on both sides.

[0051] In one embodiment, the cooling device also includes a liquid storage module, which includes a first liquid storage tank and a second liquid storage tank. The first liquid storage tank is connected to the first pipeline group for replenishing cooling medium to the first pipeline group, and the second liquid storage tank is connected to the second pipeline group for replenishing heat exchange medium to the second pipeline group.

[0052] In one embodiment, the cooling device also includes a pressure stabilizing module, which includes a first pressure stabilizing tank and a second pressure stabilizing tank. The first pressure stabilizing tank is connected to the first pipeline group and is used to stabilize the pressure of the first pipeline group. The second pressure stabilizing tank is connected to the second pipeline group and is used to stabilize the pressure of the second pipeline group.

[0053] In one embodiment, the support platform includes a frame structure and a frame body, and the frame body is arranged on the frame structure; wherein the liquid storage module and / or the voltage stabilizing module of the cooling device is arranged inside the frame body.

[0054] In one embodiment, the medium flow path includes a cooling pipeline, a liquid inlet distribution pipeline, and a liquid return distribution pipeline, the cooling pipeline is used to be in thermal contact with a heat-generating component of the computing device to cool the heat-generating component;

[0055] The liquid inlet distribution pipeline and the liquid return distribution pipeline are arranged on one side of the cabinet, the liquid inlet distribution pipeline has a liquid inlet and a plurality of liquid delivery ports, the liquid inlet is connected to the liquid supply inlet of the first pipeline group, and the plurality of liquid delivery ports are used to correspond to the cooling pipelines of the plurality of computing devices one by one, and are respectively used to be connected to the input ends of the cooling pipelines of the plurality of computing devices;

[0056] The liquid return distribution pipeline has multiple liquid return ports and liquid outlets. The multiple liquid return ports are used to correspond one-to-one with the cooling pipelines of multiple computing devices and are used to connect to the output ends of the cooling pipelines of multiple computing devices. The liquid outlet is connected to the liquid return inlet of the first pipeline group.

[0057] In one embodiment, the cabinet defines a first accommodation space, and the first accommodation space is used to integrate and install a plurality of computing devices arranged vertically;

[0058] The liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively arranged vertically on one side of the cabinet adjacent to the first pipeline group in the second direction, and the plurality of liquid delivery ports and the plurality of liquid return ports are respectively arranged at intervals along the vertical direction.

[0059] In one embodiment, the liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively located on both sides of the projection of the plurality of computing devices on the vertical plane;

[0060] The multiple liquid delivery ports and the multiple liquid return ports are distributed opposite to each other in the first direction, and the multiple liquid delivery ports are adjacent to one side of the multiple computing devices in the first direction, and the multiple liquid return ports are adjacent to the other side of the multiple computing devices in the first direction.

[0061] In one embodiment, the liquid inlet is formed on a side of the liquid inlet distribution pipeline adjacent to the first pipeline group in the second direction and adjacent to the top of the liquid inlet distribution pipeline; the liquid outlet is formed on a side of the liquid return distribution pipeline adjacent to the first pipeline group in the second direction and adjacent to the top of the liquid return distribution pipeline.

[0062] In one embodiment, an exhaust valve is disposed at the top of the liquid inlet distribution pipeline and the top of the liquid return distribution pipeline.

[0063] In one embodiment, the exhaust port of the exhaust valve is connected to a flexible connecting pipe, and the flexible connecting pipe extends to the bottom of the cabinet to exhaust the gas in the liquid inlet distribution pipeline and the liquid return distribution pipeline respectively.

[0064] In one embodiment, the cabinet includes a cabinet body and a shelf disposed inside the cabinet body, the shelf defines a first accommodation space, the shelf and the cabinet body define a second accommodation space, and the second accommodation space and the first accommodation space are distributed side by side in a first direction;

[0065] The rack also includes a plurality of power distribution units, which are vertically arranged in the second accommodating space.

[0066] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along a first direction; the rack also includes a top connecting plate, which is arranged on the top of the cabinet and extends to the top of the adjacent cabinet; the top connecting plate and the top of the adjacent cabinet respectively have top connecting holes that are opposite to each other in the vertical direction, and the cabinet and the adjacent cabinet are fixed by fasteners passing through the top connecting holes.

[0067] In one embodiment, the rack further includes a lifting ring, which is detachably disposed on the top of the cabinet, and is used to connect a lifting rope to carry the cabinet or the heat dissipation structure.

[0068] In one embodiment, the rack further includes a bottom connecting plate, which extends downwardly and obliquely on the outside of the bottom of the cabinet in the second direction, and the upper end of the bottom connecting plate is fixed to the cabinet, and the lower end of the bottom connecting plate is fixed to the supporting platform.

[0069] As another aspect of the embodiment of the present application, the embodiment of the present application further provides a container, including:

[0070] The heat dissipation structure of any of the above embodiments;

[0071] The box body and the heat dissipation structure are arranged inside the box body.

[0072] In one embodiment, the box body includes a frame, and the frame is protruded upward on one side of the bottom of the box body in the second direction;

[0073] The support platform is spaced apart from the frame at one side adjacent to the frame in the second direction to form a groove for draining liquid.

[0074] In one embodiment, the frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

[0075] As another aspect of the embodiments of the present application, the embodiments of the present application also provide a data center, including: a heat dissipation structure of any of the above embodiments or a container of any of the above embodiments and multiple computing devices, wherein the multiple computing devices are integrated and installed in a cabinet of the heat dissipation structure.

[0076] According to the heat dissipation structure of the embodiment of the present application, the rack and the cooling equipment are integrated into a unified supporting platform to form a skid structure, which improves the integration and structural stability of the heat dissipation structure, and realizes unified transportation and delivery. After delivery, it can be directly put into place, reducing the requirements for land flatness and concrete foundation.

[0077] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0079] Figure 1 A schematic structural diagram of a heat dissipation structure according to an embodiment of the present application is shown;

[0080] Figure 2A A schematic diagram showing a three-dimensional structure of a support platform of a heat dissipation structure according to an embodiment of the present application;

[0081] Figure 2B A schematic diagram showing the exploded structure of a support platform of a heat dissipation structure according to an embodiment of the present application;

[0082] Figure 2C A schematic diagram showing the structure of a support platform of a heat dissipation structure according to an embodiment of the present application at a viewing angle;

[0083] Figure 2D A schematic diagram showing the structure of the support platform of the heat dissipation structure according to an embodiment of the present application from another perspective;

[0084] Figure 3A A schematic diagram showing the structure of a top frame of a heat dissipation structure according to an embodiment of the present application;

[0085] Figure 3B Show Figure 1 A magnified image of area A;

[0086] Figure 3C A partial schematic diagram showing a top frame of a heat dissipation structure according to an embodiment of the present application;

[0087] Figure 4A A schematic diagram showing the cooling principle of the heat dissipation structure according to an embodiment of the present application is shown;

[0088] Figure 4B A schematic diagram showing the structure of a cooling device with a heat dissipation structure according to an embodiment of the present application at a certain viewing angle;

[0089] Figure 4C A schematic diagram showing the structure of a cooling device of a heat dissipation structure according to an embodiment of the present application from another perspective;

[0090] Figure 5A A schematic diagram showing the structure of a rack of a heat dissipation structure according to an embodiment of the present application;

[0091] Figure 5B An enlarged view of region A in 5A is shown;

[0092] Figure 5C A schematic diagram showing the structure of a rack of a heat dissipation structure according to an embodiment of the present application at a certain viewing angle;

[0093] Figure 5D A schematic structural diagram showing a rack of a heat dissipation structure according to an embodiment of the present application from another perspective;

[0094] Figure 5E Show Figure 5D Enlarged view of area B;

[0095] Fig. 5F A schematic diagram showing a top view of a rack of a heat dissipation structure according to an embodiment of the present application;

[0096] Figure 6 A schematic structural diagram of a container according to an embodiment of the present application is shown.

[0097] Description of reference numerals:

[0098] 1-heat dissipation structure, 2-container;

[0099] 1000- rack, 100- cabinet, 100a- first accommodating space, 100b- second accommodating space, 101- roller, 110- cabinet, 111- fixing hole, 112- cover plate, 113- power supply cable, 114- first cable hole;

[0100] 120-shelf, 1200-support frame, 121-column, 122-support plate, 122a-fixing plate, 122b-carrying plate, 123-mounting plate, 124-power supply support seat, 130-wiring column, 131-threading groove;

[0101] 140-return liquid distribution pipeline, 141-liquid outlet, 142-return liquid outlet, 150-inlet liquid distribution pipeline, 151-liquid inlet, 152-liquid delivery port, 153-connecting piece, 160-second exhaust valve, 161-exhaust port, 170-lifting ring, 180-bottom connecting plate, 190-top connecting plate;

[0102] 200-cooling device, 10-heat exchange module, 10a-first heat exchange flow path, 10b-second heat exchange flow path, 210-medium flow path, 215-cooling pipeline, 216-liquid delivery connection pipeline, 217-liquid return connection pipeline, 230-computing device;

[0103] 20-first pipeline group, 21-first liquid supply pipeline, 211-first liquid supply sub-pipeline, 212-second liquid supply sub-pipeline, 212a-liquid supply outlet, 212b-first exhaust valve, 213-liquid inlet pipeline, 22-first liquid return pipeline, 221-first liquid return section, 221a-liquid return inlet, 222-second liquid return section, 223-third liquid return section, 224-first liquid replenishment branch pipe, 224a-first liquid replenishment interface, 225-first pressure stabilizing branch pipe, 226-liquid outlet pipeline;

[0104] 30-second pipeline group, 31-second liquid supply pipeline, 311-first liquid supply section, 312-second liquid supply section, 313-second liquid replenishment branch pipe, 313a-second liquid replenishment interface, 314-second pressure stabilizing branch pipe, 32-second liquid return pipeline;

[0105] 40 - first power device, 50 - second power device, 60 - first pressure stabilizing tank, 70 - second pressure stabilizing tank, 80 - first liquid storage tank, 90 - second liquid storage tank;

[0106] 300-top frame, 310-crossbeam, 3101-first beam body, 3111-first through hole; 3102-second beam body, 320-longitudinal beam, 321-first section, 322-second section, 3221-installation groove;

[0107] 330 - pipeline support seat, 331 - slot, 332 - first elastic leg, 333 - second elastic leg, 340 - bracket, 341 - vertical plate, 342 - horizontal plate;

[0108] 400-support platform, 410-frame structure, 410a-first area, 410b-second area, 410b1-sub-area, 411-first support beam, 412-second support beam, 413-third support beam, 420-support plate, 421-plate body, 422-gap, 423-protrusion structure, 4231-first protrusion, 4232-second protrusion, 424-vertical portion, 430-frame body, 431-vertical frame, 432-horizontal frame, 440-foot, 441-base, 442-screw;

[0109] 500-cold source equipment, 600-power distribution cabinet, 601-second wire hole, 700-box, 701-frame, 702-drain hole;

[0110] L1-first direction, L2-second direction. DETAILED DESCRIPTION

[0111] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0112] In the related art, the computing devices 230 and cooling devices 200 of the heat dissipation structure 1 are independent of each other and need to be packaged separately, resulting in high transportation costs. Moreover, after the heat dissipation structure 1 is delivered, the layout of the computing devices 230 and cooling devices 200 needs to be adjusted to match the site, and then assembled and tested, resulting in a long deployment cycle.

[0113] Based on the above-mentioned defects existing in the related technology, an embodiment of the present application provides a heat dissipation structure 1, which can integrate the computing device 230 and the cooling device 200 of the heat dissipation structure 1, realize overall modular delivery and optimal space utilization, thereby improving the convenience and efficiency of the deployment of the heat dissipation structure 1.

[0114] Figure 1 A schematic structural diagram of a heat dissipation structure 1 according to an embodiment of the present application is shown.

[0115] See also Figure 1 , and combined with Figure 4A As shown, the heat dissipation structure 1 provided in the embodiment of the present application includes at least one rack 1000, a cooling device 200, a top frame 300 and a support platform 400. Specifically, the rack 1000 includes a cabinet 100 and a medium flow path 210, the cabinet 100 is used to integrate and install multiple computing devices 230, and the medium flow path 210 is used to allow cooling medium to flow through the multiple computing devices 230. The cooling device 200 includes a heat exchange module 10 and a first pipeline group 20, and the first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of at least one rack 1000.

[0116] In the embodiment of the present application, the cooling device 200 can use liquid cooling to cool the computing devices 230 of each rack 1000. The medium flow path 210 passes through the multiple computing devices 230, and is used to allow the cooling medium to flow through each computing device 230 during the flow inside the computing device 230, so that the cooling medium can exchange heat with each computing device 230, thereby transferring the heat generated by the computing device 230 during operation to the cooling medium, thereby achieving cooling of the multiple computing devices 230.

[0117] The first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the rack 1000, and is used to transport the low-temperature cooling medium cooled by the heat exchange module 10 to the medium flow path 210 of the rack 1000, and then transport the high-temperature cooling medium after flowing through the rack 1000 from the medium flow path 210 of the rack 1000 back to the heat exchange module 10, so as to realize the circulation of the cooling medium between the heat exchange module 10 and the medium flow path 210 of the rack 1000, thereby circulating cooling of each computing device 230.

[0118] In the embodiment of the present application, the top frame 300 is fixed to the top of at least one rack 1000, and at least part of the first pipeline group 20 is supported on the top frame 300. At least one rack 1000 and the cooling device 200 are integrated on the support platform 400, the heat exchange module 10 is arranged on one side of the at least one rack 1000 in the first direction L1, and the first pipeline group 20 is located on one side of the heat exchange module 10 in the second direction L2, and the second direction L2 intersects with the first direction L1.

[0119] In the embodiment of the present application, the first direction L1 and the second direction L2 may be two horizontal directions perpendicular to each other.

[0120] The rack 1000 and cooling device 200 of the heat dissipation structure 1 of the embodiment of the present application are integrated into a unified support platform 400 to form a skid structure, which improves the integration of the heat dissipation structure 1, realizes unified transportation and delivery, and can be directly put into place after delivery, reducing the requirements for land flatness and concrete foundation. In addition, the heat exchange module 10, the first pipeline group 20 and the rack 1000 are adapted in spatial position, and the top frame 300 provides a supporting and fixing structure for the first pipeline group 20 of the cooling device 200, which improves the stability of the overall structure of the heat dissipation structure 1.

[0121] In one embodiment, the heat dissipation structure 1 may further include a power distribution cabinet 600. When the heat dissipation structure 1 is applied to a data center, the power distribution cabinet 600 directly supplies power to the computing device 230 of the data center. In a high-density equipment environment such as a data center, water-electricity separation can effectively prevent the potential safety hazards caused by liquid leakage to power equipment, and ensure the efficient, safe and stable operation of the data center.

[0122] Exemplarily, the power distribution cabinet 600 may be spaced apart from the cooling device 200 .

[0123] In some examples, the power distribution cabinet 600 and the cooling device 200 are distributed on opposite sides of at least one rack 1000 in the first direction L1, that is, the cooling device 200 is arranged on one side of at least one rack 1000 in the first direction L1, and the power distribution cabinet 600 is arranged on the other side of at least one rack 1000 in the first direction L1. While increasing the distance between the power distribution cabinet 600 and the cooling device 200, the power distribution cabinet 600 and the cooling device 200 are physically isolated by the rack 1000, thereby greatly improving the overall reliability of the data center.

[0124] In other examples, the power distribution cabinet 600 and the cooling device 200 are distributed on opposite sides of at least one rack 1000 in the second direction L2, and the power distribution cabinet 600 and the cooling device 200 are isolated by at least one rack 1000 to improve the safety of water-electricity separation.

[0125] It should be noted that the above is only an example and does not constitute a limitation to the present application.

[0126] Those skilled in the art can understand that, based on the basic principle of spacing the power distribution cabinet 600 and the cooling device 200, there can be many other ways to space the power distribution cabinet 600 and the cooling device 200. For example, the power distribution cabinet 600 and the cooling device 200 are spaced apart in the up and down directions of at least one rack 1000, that is, one of the power distribution cabinet 600 and the cooling device 200 is located above the rack 1000, and the other is located below the rack 1000, so as to achieve physical isolation between the power distribution cabinet 600 and the cooling device 200; for another example, the power distribution cabinet 600 and the cooling device 200 are not isolated by the rack 1000, and water and electricity separation can be achieved by adding other objects for isolation or directly increasing the distance between the two. It should be noted that this is only for example, and the spacing between the power distribution cabinet 600 and the cooling device 200 is not limited to the aforementioned example.

[0127] In addition, it should be noted that in the example of setting the heat dissipation structure 1 inside the box 700 to form a container-type, the positional relationship between the power distribution cabinet 600 and the cooling device 200 and the box 700, in addition to both being contained inside the box 700, can also have other positional relationships, for example, one of the power distribution cabinet 600 and the cooling device 200 can be set inside the box 700, and the other can be set outside the box 700, and the power distribution cabinet 600 and the cooling device 200 are physically isolated by the box 700, thereby improving the safety of water-electricity separation; for another example, the power distribution cabinet 600 and the cooling device 200 are both located outside the box 700, and are respectively located on different sides of the box 700, and the power distribution cabinet 600 and the cooling device 200 are physically isolated by the box 700 to ensure the safety of water-electricity separation. It should be noted that this is only an example, and the positional relationship between the power distribution cabinet 600 and the cooling device 200 relative to the box 700 is not limited to the aforementioned example.

[0128] In one embodiment, the rack 1000 also includes a power distribution unit. Multiple power distribution units may be provided in the cabinet 100 of each rack 1000. The power distribution unit is connected to the power distribution cabinet 600 via a power supply cable 113. The power distribution unit is connected to the computing device 230 in the cabinet 100, thereby improving the convenience of power supply to the computing device 230.

[0129] In one embodiment, there are multiple racks 1000, and the multiple racks 1000 are arranged side by side along the first direction L1; the heat exchange module 10 is set on one side of the multiple racks 1000 in the first direction L1, and the first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the multiple racks 1000.

[0130] In one embodiment, the cooling device 200 also includes a second pipeline group 30, which is connected between the heat exchange module 10 and the cold source device 500, and is used to transport the heat exchange medium that has been heated by absorbing the heat of the cooling medium through the heat exchange module 10 to the cold source device 500, and then transport the heat exchange medium cooled by the cold source device 500 back to the heat exchange module 10, thereby realizing the circulation of the heat exchange medium between the heat exchange module 10 and the cold source device 500, thereby circulating and cooling the cooling medium.

[0131] The support platform 400, the top frame 300, the cooling device 200 and the rack 1000 of the heat dissipation structure 1 according to the embodiment of the present application are respectively described in detail below.

[0132] Figure 2A 1 is a schematic diagram showing a three-dimensional structure of a support platform 400 of a heat dissipation structure 1 according to an embodiment of the present application, Figure 2B A schematic diagram of the exploded structure of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application is shown. Figure 2C A schematic structural diagram of a support platform 400 of a heat dissipation structure 1 according to an embodiment of the present application at a viewing angle is shown. Figure 2D A schematic structural diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application is shown at another viewing angle.

[0133] See also FIG. 2A to FIG. 2D The support platform 400 of the heat dissipation structure 1 of the embodiment of the present application may include a frame structure 410, a support plate 420 and a frame 430. The frame structure 410 has a first area 410a and a second area 410b arranged in the first direction L1. The support plate 420 covers the first area 410a, and the frame is arranged in the second area 410b. At least one rack 1000 is arranged on the support plate 420, and the heat exchange module 10 is supported on the upper part of the frame. On the one hand, the stability of the rack 1000 and the heat exchange module 10 is improved, and on the other hand, the heat exchange module 10 is raised to facilitate the connection between the heat exchange module 10 and the first pipeline group 20 supported on the top frame 300.

[0134] Exemplarily, the frame structure 410 includes a plurality of first support beams 411 extending along the first direction L1 and a plurality of second support beams 412 extending along the second direction L2 , and a plurality of second support beams 412 are connected between two adjacent first support beams 411 .

[0135] In some examples, the first support beam 411 and the second support beam 412 are fixedly connected by welding.

[0136] In other examples, the first support beam 411 and the second support beam 412 are fixedly connected by fasteners.

[0137] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the first support beam 411 and the second support beam 412 can be connected in many other ways, such as riveting, latch connection or snap connection, to achieve a fixed connection between the first support beam 411 and the second support beam 412, but are not limited to this.

[0138] Exemplarily, the material of the first support beam 411 and the second support beam 412 may be metal, and the shapes of the first support beam 411 and the second support beam 412 are regular shapes.

[0139] In some examples, the material of the first support beam 411 and the second support beam 412 may be steel, and the vertical cross-sections of the first support beam 411 and the second support beam 412 may both be I-shaped.

[0140] In other examples, the material of the first support beam 411 and the second support beam 412 may be an aluminum alloy, and the vertical cross-sections of the first support beam 411 and the second support beam 412 may both be rectangular.

[0141] It should be noted that the shape and material of the first support beam 411 and the second support beam 412 are not limited to the above examples, and their cross-sectional shapes can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, etc., and their materials can also be copper, carbon steel, alloy steel, etc. or other composite materials with higher strength and support, etc., but are not limited to these.

[0142] For example, the plurality of second support beams 412 connected between two adjacent first support beams 411 and distributed in the second direction L2 may be relatively distributed and / or staggered. Figure 2B As shown, at least part of the second support beams 412 are staggered in the second direction L2 to optimize load distribution, avoid local stress concentration, and improve the structural stability and rigidity of the support platform 400.

[0143] In some examples, the frame 430 is welded to the first region 410 a of the frame structure 410 .

[0144] In other examples, the frame 430 may be connected to the first region 410a of the frame structure 410 by fasteners, rivets, latches, or snaps. This is just an example, and the connection between the frame 430 and the frame structure 410 is not limited thereto.

[0145] Exemplarily, the frame 430 includes a vertical frame 431 and a horizontal frame 432 , the bottom end of the vertical frame 431 is connected to the first area 410 a , and the horizontal frame 432 is connected to the top end of the vertical frame 431 .

[0146] In some examples, a size of the first area 410 a in the first direction L1 is greater than a size of the second area 410 b in the first direction L1 , so that space is properly allocated for the rack 1000 and the cooling device 200 .

[0147] In some examples, the size of the first area 410a in the second direction L2 is approximately equal to the size of the second area 410b in the second direction L2, while meeting the space requirements of the rack 1000 and the cooling device 200 in the second direction L2, maintaining the overall regularity of the support platform 400, facilitating the placement of the heat dissipation structure 1 in a container, and improving the convenience of carrying the heat dissipation structure 1.

[0148] It should be noted that the sizes of the first area 410a and the second area 410b can be flexibly set according to actual conditions to provide bearing space for the rack 1000 and the cooling device 200 and ensure that the rack 1000 and the cooling device 200 are distributed in different areas on the support platform 400.

[0149] In one embodiment, the second area 410b includes three sub-areas 410b1 arranged in the second direction L2, the orthographic projection of the frame 430 in the horizontal plane is located in the middle sub-area 410b1, and the bottom end of the frame 430 is connected to the middle sub-area 410b1; the orthographic projections of at least part of the pipe sections of the first pipeline group 20 and at least part of the pipe sections of the second pipeline group 30 in the horizontal plane are respectively located in the two sub-areas 410b1 on both sides, that is, at least part of the pipe sections of the first pipeline group 20 and at least part of the pipe sections of the second pipeline group 30 are respectively located on the opposite sides of the heat exchange module 10 in the second direction L2. In this way, the space on both sides of the heat exchange module 10 in the second direction L2 is fully utilized, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and the compactness of the heat dissipation structure 1 is improved, which is conducive to improving the convenience of pipeline connection between the cooling device 200 and the rack 1000 and the cold source device 500.

[0150] In one embodiment, the support plate 420 includes a plurality of plate bodies 421 that are spliced ​​and arranged with each other.

[0151] In some examples, each plate 421 is connected to the frame structure 410 via corresponding fasteners.

[0152] Exemplarily, screw holes are formed at relative positions of the support plate 420, the first support beam 411 and / or the second support beam 412 of the frame structure 410, and the support plate 420 is fixed to the frame structure 410 by sequentially passing through the screw holes corresponding to the plate body 421 and the first support beam 411 and / or the second support beam 412.

[0153] In some other examples, the plate body 421 is welded and fixedly connected to the frame structure 410. Exemplarily, the plate body 421 is welded and fixedly connected to the first support beam 411 and / or the second support beam 412 of the frame structure 410, respectively.

[0154] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the connection between the plate body 421 and the frame structure 410 can also be in many other ways, such as riveting, latch connection or snap connection, etc. These connection methods can achieve a fixed connection between the plate body 421 and the frame structure 410. This is also only an example, and the connection between the plate body 421 and the frame structure 410 is not limited to this.

[0155] Exemplarily, the power distribution cabinet 600 and the cooling device 200 may be arranged on the supporting platform 400 .

[0156] In some examples, the power distribution cabinet 600 and the cooling equipment 200 are integrated in different areas of the support platform 400. On the one hand, the support platform 400 elevates the power distribution cabinet 600 so that it does not contact the placement surface of the data center, thereby preventing the cooling equipment 200 from leaking and causing water on the placement surface to affect the power distribution cabinet 600. On the other hand, the support platform 400 can guide possible leakage of the cooling equipment 200 to the outside of the support platform 400, completely isolating water and electricity, and further improving the safety of the data center.

[0157] In a specific example, the power distribution cabinet 600 and the rack 1000 are both arranged on the support plate 420 of the first area 410a of the support platform 400, and the cooling device 200 is arranged in the second area 410b of the support platform 400. Due to the frame structure of the second area 410b, possible leakage of the cooling device 200 can be discharged to the outside of the support platform 400 through the second area 410b, and will not be deposited on the support platform 400, and will not flow from the second area 410b to the support plate 420 at the first area 410a, thereby avoiding the problem of the power distribution cabinet 600 contacting the leakage.

[0158] The power distribution cabinet 600, rack 1000 and cooling equipment 200 of this embodiment are all integrated into the support platform 400, which not only ensures that water and electricity can be completely isolated, but also improves the integration of the heat dissipation structure 1 or the data center, which not only effectively utilizes the vertical and horizontal space, reduces the physical footprint, and facilitates overall transportation and delivery; but also simplifies the monitoring and management process, and facilitates operation and maintenance by operation and maintenance personnel; furthermore, the integrated design can reduce the distance and time of power and signal transmission, improve the response speed of the data center, and enhance the overall reliability of the data center.

[0159] Exemplarily, the support platform 400 of this embodiment has a defensive design for draining liquid. Specifically, a gap 422 is defined between two adjacent plates 421, and the gap 422 is used to guide the liquid on the support plate 420 to the lower side of the support plate 420 to prevent the liquid from being deposited on the support plate 420.

[0160] It can be understood that the liquid in this embodiment refers to a cooling medium for cooling the computing device 230 and / or a heat exchange medium that exchanges heat with the cooling medium to cool the cooling medium. The cooling medium and the heat exchange medium can be selected from fluid media with good thermal conductivity and stability, such as cooling water, refrigerant, etc., and this embodiment of the application does not specifically limit this.

[0161] Exemplarily, the width of the gap 422 between two adjacent plates 421 can be 0.5 to 2 mm, for example, 0.5 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm, etc. A gap 422 of such size can ensure smooth discharge of liquid while having almost no effect on the supporting strength and rigidity of the supporting platform 400.

[0162] Exemplarily, the thickness of the plate body 421 may be 2-4 mm, thereby ensuring the structural strength of the support plate 40 and controlling the overall weight of the support plate 420 .

[0163] In one embodiment, the upper surface of the plate body 421 is formed with spaced-apart raised structures 423 , which are used to prevent slipping, thereby preventing workers from slipping when stepping on the support plate 420 . At the same time, the raised structures 423 can also improve the structural strength and toughness of the support plate 420 .

[0164] The plurality of protrusion structures 423 may be evenly distributed on the upper surface of the plate body 421 .

[0165] In some examples, the multiple protrusion structures 423 include multiple first protrusions 4231 and multiple second protrusions 4232, the first protrusions 4231 intersect with the second protrusions 4232 in the extension direction of the horizontal plane, and the first protrusions 4231 and the second protrusions 4232 are alternately distributed in the second direction L2 to increase the anti-slip effect and structural strength of the support plate 420.

[0166] like Figure 2A As shown, the extension direction of the first protrusion 4231 is approximately perpendicular to the extension direction of the second protrusion 4232, and the plate body 421 has multiple rows of first protrusions 4231 and multiple rows of second protrusions 4232 in the second direction L2, each row of first protrusions 4231 includes multiple first protrusions 4231 spaced apart in the first direction L1, each row of second protrusions 4232 includes multiple second protrusions 4232 spaced apart in the first direction L1, and each row of first protrusions 4231 and each row of second protrusions 4232 are alternately distributed in the second direction L2.

[0167] In one embodiment, the frame structure 410 is connected to two third support beams 413 on opposite sides of the second direction L2, and the third support beams 413 extend along the first direction L1. The support plate 420 covers the top of the two third support beams 413 and the frame structure 410, and the support plate 420 has two vertical portions 424 extending downward on opposite sides of the second direction L2, and the two vertical portions 424 are respectively located on opposite sides of the two third support beams 413 in the second direction L2. In this embodiment, the support plate 420 is supported by the frame structure 410 located in the middle and the two third support beams 413 located on both sides, thereby improving the support strength. In addition, the two vertical portions 424 of the support plate 420 on opposite sides of the second direction L2 can play a positioning role in the assembly of the support plate 420 and the frame structure 410, so as to facilitate the placement of the support plate 420.

[0168] In some examples, the support plate 420 is fixedly connected to the third support beam 413 by welding.

[0169] In other examples, the support plate 420 is fixedly connected to the third support beam 413 by fasteners.

[0170] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the support plate 420 and the third support beam 413 may be connected in many other ways, such as riveting, latching or snap-fitting, but are not limited thereto.

[0171] In one embodiment, the third support beam 413 may be provided with a plurality of feet 440 arranged at intervals along the first direction L1, the feet 440 including a base 441 and a screw 442 connected to the base 441 and extending vertically through the bottom wall of the third support beam 413, the screw 442 being used to cooperate with a nut to level the support platform 400. In this way, the influence of the unevenness of the surface to be placed, such as the ground or the bottom wall of the container, on the stability of the support platform 400 can be overcome, and the overall stability of the support platform 400 can be ensured.

[0172] Exemplarily, a rubber pad may be provided at the bottom of the base 441 to increase friction and prevent sliding.

[0173] In some examples, the third support beam 413 is fixedly connected to the first support beam 411 of the frame structure 410 by welding.

[0174] In other examples, the third support beam 413 is fixedly connected to the first support beam 411 via fasteners.

[0175] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will appreciate that there may be other ways to connect the third support beam 413 to the first support beam 411, such as riveting, latch connection, or snap connection, as long as the third support beam 413 and the first support beam 411 can be fixedly connected, and are not limited thereto.

[0176] Exemplarily, the third support beam 413 has a regular shape, and the material of the third support beam 413 is metal.

[0177] In some examples, the vertical cross-section of the third support beam 413 is an I-shape, and the material of the third support beam 413 may be steel.

[0178] In other examples, the vertical cross-section of the third support beam 413 may be rectangular, and the material of the third support beam 413 may be aluminum alloy.

[0179] It should be noted that the shape and material of the third support beam 413 are not limited to the above examples, and its cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, and its material can also be copper, carbon steel, alloy steel, etc. or other composite materials with higher strength and support, etc., but is not limited to these.

[0180] Figure 3A A schematic structural diagram of a top frame 300 of a heat dissipation structure 1 according to an embodiment of the present application is shown. Figure 3B Show Figure 1 A magnified image of area A. Figure 3C A partial schematic diagram of a top frame 300 of a heat dissipation structure 1 according to an embodiment of the present application is shown.

[0181] See also FIG. 3A to FIG. 3C , and combined with Figure 1 The top frame 300 of the heat dissipation structure 1 of this embodiment may include a plurality of cross beams 310 and at least one longitudinal beam 320. The plurality of cross beams 310 extend along the first direction L1 and are arranged side by side and spaced apart in the second direction L2. The cross beams 310 are fixedly connected to the top of at least one rack 1000. At least one longitudinal beam 320 extends along the second direction L2 so that the cross beams 310 and the longitudinal beams 320 intersect. At least one longitudinal beam 320 is fixedly connected between two adjacent cross beams 310, and part of the first pipeline group 20 is supported by the longitudinal beam 320.

[0182] The top frame 300 of the heat dissipation structure 1 of the embodiment of the present application can connect the tops of multiple racks 1000 through multiple beams 310 by fixing them on the top of the racks 1000, so that the tops of multiple racks 1000 are fixed, thereby preventing the racks 1000 from shaking and colliding with each other due to bumps during the transportation of the heat dissipation structure 1.

[0183] In addition, by providing a longitudinal beam 320 that intersects and connects to the cross beam 310, the stability of the top frame 300 is increased, and at the same time, a supporting and fixing structure is provided for part of the first pipeline group 20 of the cooling equipment 200, which not only facilitates the connection between the first pipeline group 20 and the medium flow path 210 of the rack 1000, but also eliminates the need for an additional fixing structure to fix the first pipeline group 20, which is beneficial to improving the compactness of the structure and space utilization.

[0184] For example, the crossbeam 310 and the top of the cabinet 100 of the rack 1000 may be fixedly connected by fasteners. The connection method may include, but is not limited to, bolt connection, screw connection, riveting, key connection, pin connection, magnetic connection or snap connection, etc., which is not specifically limited in the embodiment of the present application.

[0185] In some examples, the longitudinal beam 320 and the transverse beam 310 may be fixedly connected by means of clamping, welding, or the like.

[0186] In other examples, the longitudinal beam 320 and the cross beam 310 may be connected by fasteners, rivets, bolt connections, etc. This is only an example, and the connection method between the longitudinal beam 320 and the cross beam 310 is not limited thereto.

[0187] In one embodiment, the top frame 300 may be disposed directly above the top of the rack 1000 , and a portion of the first pipeline group 20 supported by the longitudinal beam 320 of the top frame 300 is also located directly above the top of the rack 1000 , thereby ensuring the stability of the first pipeline group 20 .

[0188] In another embodiment, the plurality of cross beams 310 of the top frame 300 include a first beam body 3101 and a second beam body 3102, and the first beam body 3101 and the second beam body 3102 are fixedly connected to the top of at least one frame 1000. The longitudinal beam 320 includes a first section 321 and a second section 322 connected to each other, the first section 321 is connected between the first beam body 3101 and the second beam body 3102, and the second section 322 is located on a side of the second beam body 3102 away from the first beam body 3101 and extends to the outside of the frame 1000 in the second direction L2, wherein part of the first pipeline group 20 is supported by the second section 322. That is to say, the entire top frame 300 is not located directly above the top of the rack 1000, and a portion of the longitudinal beam 320 of the top frame 300, namely the second section 322, extends from the top of the rack 1000 to the outside of the rack 1000 in the second direction L2, so that at least a portion of the pipe section of the first pipeline group 20 supported by the second section 322 is located outside the rack 1000 in the second direction L2, rather than directly above the top of the rack 1000.

[0189] Therefore, when the first pipeline group 20 leaks, the liquid will drip to the outside of the rack 1000 instead of dripping to the top of the rack 1000, thereby avoiding affecting the rack 1000; moreover, the first pipeline group 20 is located on the outside of the rack 1000 in the second direction, and a reasonable layout space is reserved for the connecting pipeline between the medium flow path 210 of the rack 1000 and the first pipeline group 20, so as to facilitate the connection between the medium flow path 210 of the rack 1000 and the first pipeline group 20.

[0190] Exemplarily, the projection of the first section 321 of the longitudinal beam 320 in the horizontal plane is within the range of the projection of the rack 1000 in the horizontal plane, and the projection of the second section 322 of the longitudinal beam 320 in the horizontal plane is outside the range of the projection of the rack 1000 in the horizontal plane, that is, the second section 322 is located as a whole on the outside of the rack 1000 in the second direction L2, so that all the pipe sections of the first pipeline group 20 supported by the second section 322 are located on the outside of the rack 1000 in the second direction L2, which facilitates the connection between the medium flow path 210 of the rack 1000 and the first pipeline group 20, while allowing the first pipeline group 20 to completely avoid the top of the rack 1000, avoiding the impact on the rack 1000 when the first pipeline group 20 leaks, thereby improving the safety of the heat dissipation structure 1.

[0191] A plurality of first mounting holes may be provided on the top of the rack 1000, and corresponding second mounting holes may be provided on the first beam 3101 and the second beam 3102, and the connection and fixation between the first beam 3101 and the second beam 3102 and the rack 1000 may be achieved by bolts passing through the first mounting holes and the second mounting holes.

[0192] The first beam 3101 can be disposed adjacent to the side edge of the top of the rack 1000 away from the first pipeline group 20, and the second beam 3102 can be disposed adjacent to the side edge of the top of the rack 1000 close to the first pipeline group 20. That is, the first beam 3101 and the second beam 3102 are respectively connected to both sides of the rack 1000 in the second direction L2, so that both sides of the rack 1000 in the second direction L2 are fixedly limited by the first beam 3101 and the second beam 3102, which is conducive to improving the connection stability of multiple racks 1000.

[0193] In one embodiment, there are multiple racks 1000 and the multiple racks 1000 are arranged side by side along the first direction L1, there are multiple longitudinal beams 320, the multiple longitudinal beams 320 correspond to the multiple racks 1000 one by one, and the longitudinal beams 320 are located at the top of the corresponding racks 1000, that is, a longitudinal beam 320 extending along the second direction L2 is arranged on the top of each rack 1000, and accordingly, the cross beam 310 connects the multiple racks 1000. On the one hand, the load distribution on the longitudinal beam 320 is optimized to avoid local stress concentration, improve the structural stability and strength of the top frame 300, and ensure stable support for the first pipeline group 20; on the other hand, the top of each rack 1000 is limited by each longitudinal beam 320 and the cross beam 310, so as to improve the stability of the top connection of the multiple racks 1000.

[0194] In one embodiment, the top frame 300 further includes at least one pipeline support seat 330, at least one pipeline support seat 330 is arranged corresponding to at least one longitudinal beam 320, the pipeline support seat 330 is arranged at the second section 322 corresponding to the longitudinal beam 320, and part of the first pipeline group 20 is supported by the pipeline support seat 330. The pipeline support seat 330 can position the installation of the first pipeline group 20, facilitate the installation of the first pipeline group 20, and at the same time, the first pipeline group 20 is supported and fixed at different positions in the first direction L1 by multiple pipeline support seats 330, thereby improving the stability of the first pipeline group 20.

[0195] In one embodiment, the pipeline support seat 330 is provided with a card slot 331, and the card slot 331 has an upward opening. The pipeline of the first pipeline group 20 is card-connected in the corresponding card slot 331, and the inner wall surface of the card slot 331 is an arc surface adapted to the outer peripheral wall shape of the pipeline of the first pipeline group 20, so that the outer wall surface of the pipeline and the inner wall surface of the card slot 331 can fit as closely as possible, thereby improving the stability of the pipeline support.

[0196] Exemplarily, the pipeline support seat 330 has a plurality of slots 331 , and a plurality of pipe sections of the first pipeline group 20 are engaged with the corresponding slots 331 .

[0197] Exemplarily, the pipeline support seat 330 includes a first elastic leg 332 and a second elastic leg 333, and the first elastic leg 332 and the second elastic leg 333 are made of elastic material. The first elastic leg 332 and the second elastic leg 333 are respectively connected to the second section 322 of the longitudinal beam 320 and extend upward. A slot 331 for accommodating the pipeline of the first pipeline group 20 is formed between the first elastic leg 332 and the second elastic leg 333.

[0198] The first elastic leg 332 and the second elastic leg 333 are squeezed by the pipeline of the first pipeline group 20 and deformed, and the opening of the clamping slot 331 is opened, so that the pipeline of the first pipeline group 20 is clamped into the clamping slot 331 from the opening of the clamping slot 331, thereby improving the installation efficiency of the pipeline of the first pipeline group 20. After the pipeline of the first pipeline group 20 is clamped into the clamping slot 331, the first elastic leg 332 and the second elastic leg 333 can clamp the pipeline of the first pipeline group 20, thereby improving the connection stability between the pipeline of the first pipeline group 20 and the pipeline support seat 330.

[0199] Exemplarily, the second section 322 is provided with a mounting groove 3221 extending along the second direction L2, the pipeline support seat 330 is disposed in the mounting groove 3221, and the mounting groove 3221 is used to limit the pipeline support seat 330 in the first direction L1. The pipeline support seat 330 is fixedly connected to the mounting groove 3221 by a fastener, or the pipeline support seat 330 is welded in the mounting groove 3221.

[0200] In one embodiment, see Figure 3B , the longitudinal beam 320 is engaged with the first beam body 3101 and the second beam body 3102. Specifically, the first beam body 3101 is provided with at least one first through hole 3111, and the first through hole 3111 penetrates the first beam body 3101 in the second direction L2. The second beam body 3102 is provided with at least one second through hole, and the second through hole penetrates the second beam body 3102 in the second direction L2. Among them, at least one first through hole 3111 and at least one second through hole are arranged in a one-to-one correspondence in the second direction L2, and at least one longitudinal beam 320 is penetrated in the corresponding first through hole 3111 and second through hole.

[0201] Exemplarily, the shape of the first through hole 3111 and the shape of the second through hole are adapted to the shape of the longitudinal beam 320 , so that the longitudinal beam 320 can be clamped in the first through hole 3111 and the second through hole to achieve fixation between the longitudinal beam 320 , the first beam body 3101 and the second beam body 3102 .

[0202] Exemplarily, the material of at least one of the first beam body 3101 , the second beam body 3102 , and the longitudinal beam 320 may be metal, and the shape of at least one of the first beam body 3101 , the second beam body 3102 , and the longitudinal beam 320 is a regular shape.

[0203] In some examples, the first beam body 3101 , the second beam body 3102 , and the longitudinal beam 320 may be made of steel and may be C-shaped.

[0204] In other examples, the materials of the first beam body 3101 , the second beam body 3102 , and the longitudinal beam 320 may be aluminum profiles, so as to reduce the weight of the top frame 300 while ensuring the strength of the top frame 300 .

[0205] It should be noted that the shapes and materials of the first beam 3101, the second beam 3102 and the longitudinal beam 320 are not limited to the above examples, and their materials can also be carbon steel, alloy steel, etc. or other composite materials with high strength and support, and their shapes can also be I-shaped, rectangular, circular, H-shaped, T-shaped, C-shaped or Z-shaped, etc., but are not limited to these.

[0206] The first beam body 3101 , the second beam body 3102 and the longitudinal beam 320 may not only be designed differently in terms of material and shape, but also optimize the design of the structure to achieve the effect of reducing weight and improving strength at the same time.

[0207] Specifically, in some examples, the first beam body 3101 and the second beam body 3102 may have openings disposed opposite to each other in the second direction L2 , and the longitudinal beam 320 may have an opening disposed upward, so that the installation groove 3221 is formed by using the opening of the longitudinal beam 320 .

[0208] In other examples, each side of the first beam 3101 and the second beam 3102 may define a first slot extending along the first direction L1 to reduce the weight of the first beam 3101 and the second beam 3102. Each side of the longitudinal beam 320 may define a second slot extending along the second direction L2 to reduce the weight of the longitudinal beam 320.

[0209] In other examples, a plurality of reinforcing ribs may be provided inside the first beam 3101 , the second beam 3102 , and the longitudinal beam 320 to increase the tensile, compressive, and bending strengths of the top frame 300 , so that the top frame 300 can withstand a greater load without being damaged.

[0210] It should be noted that the above examples are only for illustration and do not constitute a limitation to the present application. Those skilled in the art can understand that the structures of the first beam body 3101, the second beam body 3102 and the longitudinal beam 320 can also have other various designs, such as honeycomb beams, corrugated beams, etc. These designs can reduce materials and reduce weight while enhancing their strength. This is also only for illustration, and its structure is not limited to the above examples.

[0211] In some embodiments, see Figure 3C, the longitudinal beam 320 can overlap the upper part of the first beam body 3101 and the second beam body 3102. Specifically, the lower surface of the longitudinal beam 320 has a first support plane, the upper surfaces of the first beam body 3101 and the second beam body 3102 have a second support plane, and the second support planes of the first beam body 3101 and the second beam body 3102 overlap the first support plane of the longitudinal beam 320.

[0212] In some examples, the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 may be fixed at the overlapped parts by fasteners respectively.

[0213] In other examples, the overlaps between the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 may be fixed by welding.

[0214] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the longitudinal beam 320 and the first beam body 3101 and the second beam body 3102 can be connected in various other ways at the overlap, such as riveting, bolt connection or snap connection, etc., and are not limited thereto.

[0215] In one embodiment, the top frame 300 further includes at least one bracket 340, at least one bracket 340 corresponds to at least one rack 1000, the bracket 340 is disposed on the top of the corresponding rack 1000, and is located between the first beam 3101 and the second beam 3102, and the top of the bracket 340 has a supporting surface, and the supporting surface is used to carry the power supply cable 113. The bracket 340 can support the power supply cable 113 on the top of the rack 1000, facilitate the connection of the power supply cable 113 with the power distribution cabinet 600 and the power distribution unit, and uniformly organize the power supply cable 113 to avoid cable clutter.

[0216] Exemplarily, the bracket 340 includes two vertical plates 341 and a horizontal plate 342. The two vertical plates 341 are respectively arranged on opposite sides of the horizontal plate 342 in the second direction L2. The lower ends of the vertical plates 341 are connected to the cabinet 100 of the rack 1000. The horizontal plate 342 is connected to the upper ends of the two vertical plates 341. The upper surface of the horizontal plate 342 defines a supporting surface, and the power supply cable 113 is supported on the upper surface of the horizontal plate 342.

[0217] Exemplarily, the horizontal position of the horizontal plate 342 is higher than the horizontal position of the cross beam 310 and / or the longitudinal beam 320 , so that the arrangement of the cross beam 310 and the longitudinal beam 320 does not affect the layout of the power supply cable 113 .

[0218] Exemplarily, the top frame 300 includes a plurality of brackets corresponding to the plurality of racks 1000 arranged side by side in the first direction L1, and a bracket is disposed on the top of the cabinet 100 of each rack 1000. The power supply cable 113 extends along the first direction L1 and is supported by the plurality of brackets arranged in the first direction L1, thereby improving the stability and neatness of the arrangement of the power supply cable 113.

[0219] In some examples, the bracket 340 may be made of aluminum to reduce the weight of the bracket 340 .

[0220] In other examples, the material of the bracket 340 may be copper, carbon steel, alloy steel, or plastic with high strength and support, so as to enhance the support strength of the bracket 340 .

[0221] It should be noted that the above is only an example and does not constitute a limitation to the present application. Those skilled in the art will appreciate that the material of the bracket 340 is not limited to the above description, and may also be a composite material composed of any combination of different materials, such as a composite of metal and plastic, a composite of metal and rubber, glass fiber reinforced plastic or carbon fiber reinforced plastic, etc., but is not limited thereto.

[0222] In one embodiment, a first wire hole 114 is formed on the top of the cabinet 100 of the rack 1000. The first wire hole 114 is located on the side of the corresponding bracket 340 away from the power distribution cabinet 600 in the first direction L1. The first wire hole 114 is used for the corresponding power supply cable 113 to pass through and connect to the corresponding power distribution unit; a second wire hole 601 is formed on the top of the power distribution cabinet 600. The second wire hole 601 is used for the power supply cable 113 to pass through and connect to the power distribution cabinet 600. In this way, the power supply cable 113 is arranged in the space above the power distribution cabinet 600 and the rack 1000, which improves the space utilization rate and facilitates the connection of the power supply cable 113 with the power distribution cabinet 600 and the power distribution unit of the rack 1000.

[0223] Exemplarily, the heat dissipation structure 1 has multiple bundles of power supply cables 113 corresponding one by one to multiple racks 1000. The multiple bundles of power supply cables 113 are distributed side by side in the second direction L2 and are supported by multiple brackets 340 arranged in the first direction L1. This can avoid crossing and entanglement between the multiple bundles of power supply cables 113 and reduce the difficulty of organizing the power supply cables 113.

[0224] Figure 4A A schematic diagram showing the cooling principle of the heat dissipation structure 1 according to an embodiment of the present application is shown. Figure 4B A schematic structural diagram of a cooling device 200 of the heat dissipation structure 1 according to an embodiment of the present application at a certain viewing angle is shown. Figure 4CA schematic structural diagram of a cooling device 200 of the heat dissipation structure 1 according to an embodiment of the present application is shown at another viewing angle.

[0225] Reference FIG. 4A to FIG. 4C , and combined with Figure 1 As shown, in the cooling device 200 of the heat dissipation structure 1 provided in this embodiment, a first heat exchange flow path 10a and a second heat exchange flow path 10b may be defined inside the heat exchange module 10. The first heat exchange flow path 10a may be used for the flow of a cooling medium, and the second heat exchange flow path 10b may be used for the flow of a heat exchange medium. The cooling medium in the first heat exchange flow path 10a may perform heat exchange with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium.

[0226] The first pipeline group 20 may include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 may be connected to the output end of the first heat exchange flow path 10a, and the first liquid supply pipeline 21 may be connected to the liquid inlet 151 of the medium flow path 210 of the rack 1000; the first liquid return pipeline 22 may be connected to the input end of the first heat exchange flow path 10a, and the first liquid return pipeline 22 may be connected to the liquid outlet 141 of the medium flow path 210 of the rack 1000.

[0227] The second pipeline group 30 may include a second liquid supply pipeline 31 and a second liquid return pipeline 32; the second liquid supply pipeline 31 may be connected to the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 may be connected to the medium output end of the cold source device 500; the second liquid return pipeline 32 may be connected to the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 may be connected to the medium return end of the cold source device 500; wherein, the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10.

[0228] In the embodiment of the present application, the heat exchange module 10 can realize the heat exchange of fluids in different heat exchange flow paths. The heat exchange module 10 can adopt a plate type, a shell and tube type, or a spiral plate type structure, and its shell and partition can be made of materials with high thermal conductivity and corrosion resistance, such as copper, stainless steel, nickel-based alloy or titanium alloy, so as to improve the heat exchange efficiency and durability of the heat exchange module 10. The embodiment of the present application does not limit the specific type and structure of the heat exchange module 10.

[0229] like Figure 1 and Figure 4A As shown, the first pipeline group 20 is connected to the first heat exchange flow path 10a, and the second pipeline group 30 is connected to the second heat exchange flow path 10b. The first pipeline group 20 and the second pipeline group 30 can be respectively arranged on opposite sides of the heat exchange module 10. It should be noted that, Figure 1The illustration of the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 is to facilitate understanding of the connection relationship between the first heat exchange flow path 10a, the second heat exchange flow path 10b and the first pipeline group 20 and the second pipeline group 30. The embodiment of the present application does not limit the specific structural design of the heat exchange between the first heat exchange flow path 10a and the second heat exchange flow path 10b. For example, parallel heat exchange flow paths, cross heat exchange flow paths or spiral heat exchange flow paths can be used.

[0230] For example, the heat exchange module 10 can realize heat exchange between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium and ensure that the cooling medium is in a low temperature state before entering the first pipeline group 20 through the output end of the first heat exchange flow path 10a. The cold source device 500 can be used to refrigerate the circulating heat exchange medium to ensure that it is in a low temperature state before entering the second heat exchange flow path 10b.

[0231] Specifically, the low-temperature cooling medium can enter the first liquid supply pipeline 21 through the output end of the first heat exchange flow path 10a, and enter the medium flow path 210 of the rack 1000 through the first liquid supply pipeline 21 to absorb the heat generated by the rack 1000 during operation; the high-temperature cooling medium after absorbing heat can flow back to the input end of the first heat exchange flow path 10a through the first return liquid pipeline 22, and perform heat exchange with the heat exchange medium in the second heat exchange flow path 10b in the first heat exchange flow path 10a, thereby circulating.

[0232] The low-temperature heat exchange medium can flow out from the medium output end of the cold source device 500 and enter the second heat exchange flow path 10b via the second liquid supply pipeline 31. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After the heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b increases, and the high-temperature heat exchange medium flows back to the medium return end of the cold source device 500 through the second return liquid pipeline 32. The cold source device 500 further processes the heat exchange medium to cool it down again and prepare to enter the next cooling cycle. The embodiment of the present application does not specifically limit the structure and type of the cold source device 500. For example, the cold source device 500 can cool the heat exchange medium by utilizing a gaseous medium or a liquid medium, and specifically a cooling tower or a dry cooler can be used.

[0233] In the embodiment of the present application, by respectively arranging the first pipeline group 20 and the second pipeline group 30 on the opposite sides of the heat exchange module 10, on the one hand, it is beneficial to improve the convenience of the pipeline connection between the cooling equipment 200 and the rack 1000 and the cold source equipment 500, and on the other hand, it can make full use of the space on both sides of the heat exchange module 10, so that the first pipeline group 20 and the second pipeline group 30 do not interfere with each other, and can also improve the utilization rate of the space, thereby improving the structural compactness of the heat dissipation structure 1.

[0234] In one embodiment, the first liquid supply pipeline 21 may include a first liquid supply sub-pipeline 211 and a second liquid supply sub-pipeline 212 that are connected to each other. The first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 may extend respectively along the first direction L1, and are arranged side by side and at intervals in the second direction L2. The first liquid supply sub-pipeline 211 has a liquid supply inlet at one end adjacent to the heat exchange module 10, and the liquid supply inlet is connected to the output end of the first heat exchange flow path 10a. The second liquid supply sub-pipeline 212 is connected to the end of the first liquid supply sub-pipeline 211 away from the heat exchange module 10. The second liquid supply sub-pipeline 211 has a liquid supply outlet 212a, and the liquid supply outlet 212a is connected to the liquid inlet 151 of the medium flow path 210. The first liquid return pipeline 22 may include a first liquid return section 221 extending along the first direction L1 . The first liquid return section 221 may be provided with a liquid return inlet 221 a connected to the liquid outlet 141 of the medium flow path 210 .

[0235] This embodiment arranges two liquid supply sub-pipelines side by side at intervals. On the one hand, it can evenly distribute the flow of the medium to prevent a single pipeline from being subjected to excessively high flow velocity and pressure, thereby reducing the pressure loss of the fluid flow and reducing the local resistance of the fluid when entering and leaving the pipeline. On the other hand, by independently arranging each liquid supply sub-pipeline, it can reduce the thermal interference of the cooling fluid between the pipelines and improve the overall heat exchange efficiency of the cooling device 200.

[0236] In one embodiment, the second liquid supply sub-pipeline 212 may be provided with a plurality of liquid supply outlets 212a, and the plurality of liquid supply outlets 212a may be arranged at intervals along the first direction L1 and correspond one-to-one to the liquid inlets 151 of the medium flow paths 210 of the plurality of racks 1000, and each liquid supply outlet 212a may be connected to the liquid inlet 151 of the medium flow path 210 of the corresponding rack 1000.

[0237] For example, each liquid supply outlet 212a can be connected to the liquid inlet 151 of the medium flow path 210 of the corresponding rack 1000 through the liquid inlet pipeline 213. The liquid supply outlet 212a can be opened at the bottom of the wall of the second liquid supply sub-pipeline 212.

[0238] In one embodiment, the first liquid return section 221 may be provided with a plurality of liquid return inlets 221a, and the plurality of liquid return inlets 221a may be arranged at intervals along the first direction L1 and correspond one-to-one to the liquid outlets 141 of the medium flow paths 210 of the plurality of racks 1000, and each liquid return inlet 221a may be connected to the liquid outlet 141 of the medium flow path 210 of the corresponding rack 1000.

[0239] Exemplarily, each liquid return inlet 221a can be connected to the liquid outlet 141 of the medium flow path 210 of the corresponding rack 1000 through the liquid outlet pipeline 226. The high-temperature cooling medium in the medium flow path 210 of each rack 1000 enters the first liquid return pipeline 22 through the liquid return inlet 221a, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first liquid return pipeline 22.

[0240] In some examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a hose to adapt to space limitations and facilitate installation and removal.

[0241] In other examples, at least one of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 is a hard pipe to improve the structural strength of the pipeline.

[0242] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the hoses used in the liquid inlet pipeline 213 and the liquid outlet pipeline 226 can be bendable and elastic pipes such as plastic pipes and corrugated pipes, and the hard pipes can be metal pipes with greater hardness such as copper pipes, aluminum pipes, stainless steel pipes, or plastic pipes with greater hardness and support, or hard pipes made of plastic, metal or composite materials with a certain hardness and bending ability.

[0243] The materials of the liquid inlet pipeline 213 and the liquid outlet pipeline 226 are not limited to the above examples, and can also be any combination of the above materials, such as a combination of soft and hard pipelines, both are hoses or both are hard pipes, etc., but are not limited thereto. According to the above embodiment, by setting a plurality of liquid return inlets 221a arranged at intervals along the first direction L1, the return path of the cooling medium is evenly distributed, and the space utilization is optimized. At the same time, the modular design of the liquid supply outlet 212a and the liquid return inlet 221a corresponding to the rack 1000 is conducive to the overall expansion and maintenance of the cooling device 200. When it is necessary to increase or decrease the rack 1000, it is only necessary to adjust the position and number of the corresponding liquid supply outlet 212a and the liquid return inlet 221a, thereby improving the flexibility and maintenance efficiency of the cooling device 200.

[0244] In one embodiment, the first liquid supply pipeline 21 and the first liquid return pipeline 22 can be both arranged on one side of the rack 1000 in the second direction L2, for example, on one side of the medium flow path 210 adjacent to the rack 1000 in the second direction L2, and fixedly supported by a support structure arranged on one side of the rack 1000 in the second direction L2 to ensure the stability of each pipeline.

[0245] In one embodiment, the first liquid supply sub-pipeline 211 of the first liquid supply pipeline 21, the second liquid supply sub-pipeline 212 and the first liquid return section 221 of the first liquid return pipeline 22 can be supported on the top frame 300. The top frame 300 not only fixes the multiple racks 1000, but also provides fixed support for partial sections of the first liquid supply pipeline 21 and the first liquid return pipeline 22, thereby avoiding the problems of increased space occupancy and increased costs caused by setting up a separate support structure.

[0246] Furthermore, the first liquid return section 221 is arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212, so as to reduce the intersection and overlap between the pipelines and reduce the heat exchange between the first liquid supply pipeline 21 and the first liquid return pipeline 22, which is beneficial to maintaining the uniformity of the temperature of the cooling medium and improving the cooling effect. At the same time, the compactness of the arrangement of the first liquid supply pipeline 21 and the first liquid return pipeline 22 and the rack 1000 is improved, which facilitates the connection between the liquid supply outlet 212a of the first pipeline group 20 and the liquid inlet 151 of the medium flow path 210 of the rack 1000, and facilitates the connection between the liquid return inlet 221a of the first pipeline group 20 and the liquid outlet 141 of the medium flow path 210 of the rack 1000.

[0247] Exemplarily, the ends of the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 away from the heat exchange module 10 are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212 in the second direction L2, thereby making full use of the space between the first liquid supply sub-pipeline 211 and the second liquid supply sub-pipeline 212.

[0248] In one embodiment, a first exhaust valve 212b is provided at the end of the second liquid supply sub-pipeline 212 adjacent to the heat exchange module 10 to exhaust air in the system, prevent air from being blocked during the flow of the cooling medium, reduce pressure loss caused by air during the flow of the cooling medium, and ensure smooth flow of the cooling medium.

[0249] In one embodiment, the first liquid return pipeline 22 further includes a second liquid return section 222 and a third liquid return section 223 connected to each other, and the second liquid return section 222 and the third liquid return section 223 extend vertically respectively. The first liquid return section 221 is closed at one end away from the heat exchange module 10, and one end of the first liquid return section 221 adjacent to the heat exchange module 10 is connected to the first end of the second liquid return section 222, the second end of the second liquid return section 222 is connected to the first end of the third liquid return section 223, and the second end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a.

[0250] The upper end of the second liquid return section 222 forms its first end, and the upper end of the second liquid return section 222 is connected to one end of the first liquid return section 221 adjacent to the heat exchange module 10; the lower end of the second liquid return section 222 forms its second end, and the lower end of the second liquid return section 222 is connected to the first end of the third liquid return section 223. The lower end of the third liquid return section 223 forms its first end, the upper end of the third liquid return section 223 forms its second end, and the upper end of the third liquid return section 223 is connected to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0251] More specifically, the second liquid return section 222 and the third liquid return section 223 can be arranged side by side and spaced apart in the first direction L1, so that the second liquid return section 222 and the third liquid return section 223 are arranged coplanarly in a vertical plane, thereby further reducing the space occupied by the first liquid return pipeline 22 in the second direction L2. Thus, the pipeline layout can be effectively optimized, the structure of the cooling device 200 is compact, and the installation and maintenance of the pipeline are convenient.

[0252] Exemplarily, the orthographic projections of the second liquid return section 222 and the third liquid return section 223 in the horizontal plane are located in a sub-area 410b1 of the frame structure 410 of the bottom supporting platform 400. Specifically, the second area 410b of the frame structure 410 has three sub-areas 410b1 arranged in the second direction L2, and the three sub-areas 410b1 are respectively a sub-area 410b1 located in the middle and two sub-areas 410b1 located on both sides. The middle sub-area 410b1 is provided with a frame, and the heat exchange module 10 is arranged on the upper part of the frame. The second liquid return section 222 and the third liquid return section 223 are both located in a sub-area 410b1 on one side adjacent to the first liquid supply pipeline 21, which makes full use of the space above the supporting platform 400 and facilitates the connection of the third liquid return section 223 with the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0253] In one embodiment, the projections of the second liquid supply pipeline 31 and the second liquid return pipeline 32 on the horizontal plane are located in a sub-area 410b1 on the side of the support platform 400 away from the first liquid supply pipeline 21, that is, the second liquid supply pipeline 31 and the second liquid return pipeline 32 of the second pipeline group 30 and the second liquid return section 222 and the third liquid return section 223 of the first pipeline group 20 are distributed on opposite sides of the heat exchange module 10 in the first direction. In this way, the pipelines of the cooling device 200 are further centrally arranged to improve the structural compactness of the cooling device 200.

[0254] In one embodiment, the cooling device 200 further includes a first power device 40, which is in communication with the first pipeline group 20 and is used to provide power for the flow of the cooling medium.

[0255] Exemplarily, the first power device 40 is disposed between the second end of the second liquid return section 222 and the first end of the third liquid return section 223 .

[0256] Exemplarily, the first power device 40 can be arranged in a sub-area 410b1 on one side of the supporting platform 400, that is, the first power device 40 is arranged on one side of the heat exchange module 10 in the first direction, and can be fixed in the sub-area 410b1 on this side of the supporting platform 400 to improve the structural compactness of the cooling equipment 200.

[0257] Exemplarily, the first power device 40 may be a fluid power pump for driving the cooling medium to flow in the pipeline. Optionally, the first power device 40 may be a fluid power pump with a head of 3 bar and a delivery flow of 60 m3 / h.

[0258] In one embodiment, the cooling device 200 further includes a liquid storage module, which includes a first liquid storage tank 80 , which is connected to the first pipeline group 20 , and is used to contain cooling medium and replenish cooling medium to the first pipeline group 20 .

[0259] In one embodiment, the first liquid return pipeline 22 may also include a first liquid replenishment branch 224, the first end and the second end of the first liquid replenishment branch 224 may be respectively connected to the interior of the second liquid return section 222, and the tube wall of the first liquid replenishment branch 224 may be provided with a first liquid replenishment interface 224a, and the first liquid replenishment interface 224a is connected to the interior of the first liquid storage tank 80 through a first connecting branch (not shown in the figure).

[0260] In the embodiment of the present application, the cooling device 200 can realize the liquid replenishment function for the cooling medium through the cooperation of the first liquid storage tank 80 and the first liquid replenishment branch pipe 224. For example, the cooling medium in the first pipeline group 20 can be replenished by an automatic water replenishment pump, and the cooling medium can be filtered by a filter.

[0261] The cooling device 200 can automatically replenish the cooling medium during operation through the first liquid storage tank 80, the first liquid replenishment branch pipe 224 and the automatic water replenishment pump to ensure that the total amount of cooling medium inside the cooling device 200 is maintained in an appropriate state. Optionally, the volume of the first liquid storage tank 80 can be 30L.

[0262] In one embodiment, the first liquid storage tank 80 can be disposed inside the frame of the support platform 400, that is, the first liquid storage tank 80 is located below the heat exchange module 10, so as to make full use of the space below the heat exchange module 10, reduce the space occupied by the first liquid storage tank 80 in the horizontal direction, and further improve the structural compactness of the cooling device 200. Exemplarily, the first liquid storage tank 80 is fixed to the frame inside the frame.

[0263] In one embodiment, the cooling device 200 further includes a pressure stabilizing module, which includes a first pressure stabilizing tank, which is connected to the first pipeline group 20 and is used to stabilize the pressure of the first pipeline group 20 .

[0264] In one embodiment, the first liquid return pipeline 22 may further include a first pressure stabilizing branch pipe 225 , a first end of the first pressure stabilizing branch pipe 225 may be connected to the interior of the first pressure stabilizing tank 60 , and a second end of the first pressure stabilizing branch pipe 225 may be connected to the interior of the third liquid return section 223 .

[0265] In the embodiment of the present application, the pressure in the cooling device 200 can be adjusted and stabilized by a pressure-stabilizing tank. During the operation of the cooling device 200, temperature changes and fluid flow may cause fluctuations in its internal pressure. The first pressure-stabilizing tank 60 can be used to maintain the pressure balance of the cooling device 200 to avoid the influence of excessively high or low pressure on the heat dissipation effect. In addition, when the flow rate of the cooling medium in the cooling device 200 changes suddenly, the first pressure-stabilizing tank 60 can play a buffering role, reduce the impact of flow fluctuations on the system, and protect other components of the cooling device 200.

[0266] Through the first pressure stabilizing branch pipe 225, the cooling medium can flow freely between the third liquid return section 223 and the first pressure stabilizing tank 60. When the system pressure is too high, the excess cooling medium will enter the first pressure stabilizing tank 60; when the system pressure is too low, the cooling medium in the first pressure stabilizing tank 60 will flow back to the system to keep the pressure stable. This improves the stability, reliability and heat dissipation exchange efficiency of the cooling device 200. Optionally, the volume of the first pressure stabilizing tank 60 can be 20L.

[0267] In one embodiment, the first pressure stabilizing tank 60 may be disposed inside the frame of the support platform 400. Exemplarily, the first pressure stabilizing tank 60 is fixed in the middle sub-region 410b1 of the support platform 400, and the heat exchange module 10, the first liquid storage tank 80 and the first pressure stabilizing tank 60 are arranged in sequence from top to bottom in the vertical direction, so that the space below the heat exchange module 10 can be further utilized, reducing the space occupied by the first pressure stabilizing tank 60 in the horizontal direction, and further improving the structural compactness of the cooling device 200.

[0268] In one embodiment, the second liquid supply pipeline 31 may include a first liquid supply section 311 and a second liquid supply section 312 connected to each other, the first end of the first liquid supply section 311 may be connected to the medium output end of the cold source device 500, the second end of the first liquid supply section 311 may be connected to the first end of the second liquid supply section 312, and the second end of the second liquid supply section 312 may be connected to the input end of the second heat exchange flow path 10b; wherein the first liquid supply section 311 and the second liquid supply section 312 may extend vertically respectively and be spaced apart in the first direction L1.

[0269] Exemplarily, the upper end of the first liquid supply section 311 forms its first end, and the upper end of the first liquid supply section 311 is connected to the medium output end of the cold source device 500 through a pipeline. The lower end of the first liquid supply section 311 forms its second end, and the lower end of the first liquid supply section 311 is connected to the first end of the second liquid supply section 312. The lower end of the second liquid supply section 312 forms its first end, the upper end of the second liquid supply section 312 forms its second end, and the upper end of the second liquid supply section 312 is connected to the input end of the second heat exchange flow path 10b.

[0270] In this way, the first liquid supply section 311 and the second liquid supply section 312 can form a continuous liquid supply path. During the cooling process, the low-temperature heat exchange medium can flow out from the medium output end of the cold source device 500, and enter the second heat exchange flow path 10b through the first liquid supply section 311 and the second liquid supply section 312. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After the heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b increases. The heat exchange medium can return to the medium return end of the cold source device 500 through the second liquid return pipeline 32, and the cold source device 500 further processes the heat exchange medium to cool it down again and prepare to enter the next cooling cycle. In this way, the heat exchange efficiency of the cooling device 200 in the heat dissipation structure 1 can be improved, and the performance degradation and hardware damage of the computing elements of the computing device 230 caused by overheating can be prevented.

[0271] In addition, by arranging the first liquid supply section 311 and the second liquid supply section 312 at intervals in the first direction L1, the space occupied by the second liquid supply pipeline 31 in the second direction L2 can be reduced, further improving the structural compactness of the cooling device 200.

[0272] In one embodiment, the cooling device 200 further includes a second power device 50, which is in communication with the second pipeline group 30 and is used to provide power for the flow of the heat exchange medium.

[0273] Exemplarily, the second power device 50 can be arranged in a sub-area 410b1 located on the other side of the supporting platform 400, that is, the second power device 50 is arranged on the other side of the heat exchange module 10 in the first direction L1, and is respectively distributed in two sub-areas 410b1 on both sides with the first power device 40, and can be fixed in the sub-area 410b1 on that side of the supporting platform 400 to improve the structural compactness of the cooling equipment 200.

[0274] Exemplarily, the second power device 50 is disposed between the second end of the first liquid supply section 311 and the first end of the second liquid supply section 312. Exemplarily, the second power device 50 may be a fluid power pump to push the heat exchange medium to flow in the pipeline. Optionally, the second power device 50 may use a fluid power pump with a head of 2.5 bar and a delivery flow of 65 m3 / h.

[0275] In one embodiment, the liquid storage module of the cooling device 200 further includes a second liquid storage tank 90 , which is connected to the second pipeline group 30 , and is used to contain cooling medium and to supplement heat exchange medium to the second pipeline group 30 .

[0276] In one embodiment, the second liquid supply pipeline 31 may also include a second liquid infusion branch 313, the first end and the second end of the second liquid infusion branch 313 may be respectively connected to the interior of the first liquid supply section 311, and the tube wall of the second liquid infusion branch 313 may be provided with a second liquid infusion interface 313a, and the second liquid infusion interface 313a may be connected to the interior of the second liquid storage tank 90 through a second connecting branch (not shown in the figure).

[0277] In the embodiment of the present application, the cooling device 200 can realize the refilling function for the heat exchange medium through the cooperation of the second liquid storage tank 90 and the second refilling branch pipe 313. For example, the cooling medium in the second pipeline group 30 can be replenished by an automatic water replenishment pump, and the cooling medium can be filtered by a filter. The second refilling interface 313a can be connected to the interior of the second liquid storage tank 90 below the heat exchange module 10 through a second connecting branch pipe (not shown in the figure). Furthermore, the cooling device 200 can automatically replenish the cooling medium during operation through the second liquid storage tank 90, the second refilling branch pipe 313 and the automatic water replenishment pump to ensure that the total amount of the heat exchange medium inside the cooling device 200 is maintained in an appropriate state.

[0278] In one embodiment, the second liquid storage tank 90 can be arranged inside the frame of the frame structure 410 of the supporting platform 400, that is, the second liquid storage tank 90 is located below the heat exchange module 10, so that the space below the heat exchange module 10 can be fully utilized, reducing the space occupied by the second liquid storage tank 90 in the horizontal direction, and further improving the structural compactness of the cooling equipment 200.

[0279] Exemplarily, the second liquid storage tank 90 and the first liquid storage tank 80 can be arranged side by side and adjacent to each other in the second direction L2, further fully utilizing the space below the heat exchange module 10, reducing the space occupied by the second liquid storage tank 90 in the horizontal direction, and further improving the structural compactness of the cooling device 200.

[0280] In one embodiment, the pressure stabilizing module of the cooling device 200 may further include a second pressure stabilizing tank 70 , which is in communication with the second pipeline group 30 and is used to stabilize the pressure of the second pipeline group 30 .

[0281] In one embodiment, the second liquid supply pipeline 31 may further include a second pressure stabilizing branch pipe 314, the first end of the second pressure stabilizing branch pipe 314 is connected to the interior of the second pressure stabilizing tank 70, and the second end of the second pressure stabilizing branch pipe 314 may be connected to the interior of the first liquid supply section 311. Through the cooperation of the second liquid storage tank 90 and the second liquid replenishment branch pipe 313, the liquid replenishment function of the second pipeline group 30 in the cooling device 200 is realized, and the pressure in the cooling device 200 can be adjusted and stabilized by the second pressure stabilizing tank 70, thereby improving the stability, reliability and heat dissipation exchange efficiency of the cooling system operation. Optionally, the volume of the second liquid storage tank 90 may be 30L, and the volume of the second pressure stabilizing tank 70 may be 20L.

[0282] In one embodiment, the second pressure stabilizing tank 70 may be disposed inside the frame of the support platform 400. Exemplarily, the second pressure stabilizing tank 70 is fixed in the middle sub-region 410b1 of the support platform 400 and is arranged side by side with the first pressure stabilizing tank 60 in the second direction L2. That is, the heat exchange module 10, the second liquid storage tank 90 and the second pressure stabilizing tank 70 are arranged in sequence from top to bottom in the vertical direction, and the second pressure stabilizing tank 70 and the first pressure stabilizing tank 60 are adjacent and arranged side by side in the second direction L2, thereby further utilizing the space below the heat exchange module 10, further improving the structural compactness of the cooling device 200, and reducing the space occupied by the second pressure stabilizing tank 70 in the horizontal direction.

[0283] In one embodiment, the input end of the first heat exchange flow path 10a may be located below the output end of the first heat exchange flow path 10a; the input end of the second heat exchange flow path 10b may be located above the output end of the second heat exchange flow path 10b. In some examples, the flow direction of the medium in the first pipeline group 20 and the second pipeline group 30 can be set according to specific application requirements, and the specific position relationship between the input end and the output end of the heat exchange flow path can be set accordingly according to the actual flow direction of the cooling medium and the heat exchange medium in the pipeline group.

[0284] Figure 5A A schematic structural diagram of a rack 1000 of a heat dissipation structure 1 according to an embodiment of the present application is shown. Figure 5B An enlarged view of region A in 5A is shown. Figure 5C A schematic structural diagram of a rack 1000 of a heat dissipation structure 1 according to an embodiment of the present application at a certain viewing angle is shown. Figure 5D A schematic structural diagram of a rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application at another viewing angle is shown. Figure 5E Show Figure 5D The enlarged image of area B in the middle. Fig. 5F A schematic diagram of the structure of a rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application is shown in a top view.

[0285] See also FIG. 5A to FIG. 5F , and combined with Figure 4A As shown, in the heat dissipation structure 1 of the embodiment of the present application, the medium flow path 210 of the rack 1000 includes a cooling pipeline 215, a liquid inlet distribution pipeline 150 and a liquid return distribution pipeline 140. The cooling pipeline 215 is used to thermally contact with the heat-generating components of the computing device 230 to cool the heat-generating components.

[0286] Exemplarily, the cooling circuit 215 may be disposed inside the computing device 230. The cooling circuit 215 may be attached to or embedded in key heat generating components of the computing device 230, such as heat generating electronic components such as a central processing unit, a graphics processing unit, and a memory module.

[0287] The liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are arranged on one side of the cabinet 100. The liquid inlet distribution pipeline 150 has a liquid inlet 151 and a plurality of liquid delivery ports 152. The liquid inlet 151 is connected to the liquid supply inlet of the first pipeline group 20. The plurality of liquid delivery ports 152 correspond to the cooling pipelines 215 of the plurality of computing devices 230 one by one, and are respectively connected to the input ends of the cooling pipelines 215 of the plurality of computing devices 230. The liquid return distribution pipeline 140 has a plurality of liquid return ports 142 and a liquid outlet 141. The plurality of liquid return ports 142 correspond to the cooling pipelines 215 of the plurality of computing devices 230 one by one, and are respectively connected to the output ends of the cooling pipelines 215 of the plurality of computing devices 230. The liquid outlet 141 is connected to the liquid return inlet of the first pipeline group 20.

[0288] In the rack 1000 of this embodiment, the cabinet 100 realizes cooling of each computing device 230 while carrying each computing device 230, and has a compact structure and small space occupation, thereby facilitating maintenance and reducing costs. In addition, liquid delivery distribution and liquid return distribution to multiple computing devices 230 are realized through a liquid inlet distribution pipeline 150 and a liquid return distribution pipeline 140, reducing the number of components of the rack 1000 and simplifying the overall structure of the cabinet 100. It is also convenient for centralized management, which is conducive to more effective temperature control and reduced energy consumption.

[0289] In one embodiment, the cabinet 100 defines a first accommodation space 100a, which can be used to integrate and install multiple computing devices 230 arranged vertically, and the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 are respectively arranged vertically on one side of the cabinet 100 adjacent to the first pipeline group 20 in the second direction L2, and multiple liquid delivery ports 152 and multiple liquid return ports 142 are respectively arranged vertically at intervals. On the one hand, it is convenient for the liquid inlet 151 of the liquid inlet distribution pipeline 150 and the liquid outlet 141 of the liquid return distribution pipeline 140 to be connected to the liquid supply outlet 212a and the liquid return inlet 221a of the first pipeline group 20 respectively; on the other hand, the arrangement direction of each liquid delivery port 152 and the arrangement direction of each liquid return port 142 are consistent with the arrangement direction of each computing device 230, so that each liquid delivery port 152 and each liquid return port 142 are convenient to be connected to the cooling pipeline 215 inside each computing device 230.

[0290] In some examples, the cross-sections of the inlet distribution pipeline 150 and the return liquid distribution pipeline 140 can be square, for example, a square. In other examples, the inlet distribution pipeline 150 and the return liquid distribution pipeline 140 can be circular tubes. It should be noted that this is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the inlet distribution pipeline 150 and the return liquid distribution pipeline 140 can also be corrugated pipes, special-shaped pipes, spiral pipes, multi-layer composite pipes, etc., and are not limited thereto.

[0291] Exemplarily, the inner diameters of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 may be 70 mm to 160 mm, so as to ensure the flow rate of the cooling medium and reduce the pressure loss.

[0292] Exemplarily, the inner diameter of the liquid inlet 151 and the liquid outlet 141 can be 50 mm to 150 mm, ensuring that a sufficient flow of cooling medium passes through the liquid inlet 151 and the liquid outlet 141, while reducing the flow rate at the liquid inlet 151 and the liquid outlet 141, thereby reducing friction loss and pressure drop, and ensuring that the cooling medium at each liquid inlet 151 and the liquid outlet 141 has sufficient pressure.

[0293] Exemplarily, the inner diameter of the liquid delivery port 152 and the liquid return port 142 can be 8 mm to 20 mm, increasing the flow rate of the cooling medium at the liquid delivery port 152 and the liquid return port 142, and ensuring that the flow rate at the liquid delivery port 152 and the liquid return port 142 matches the flow rate at the liquid inlet 151 and the liquid outlet 141, respectively.

[0294] Exemplarily, each liquid delivery port 152 can be connected to the input end of each cooling pipeline 215 of each computing device 230 through a liquid delivery connecting pipeline 216, and each liquid return port 142 can be connected to the output end of each cooling pipeline 215 of each computing device 230 through a liquid return connecting pipeline 217.

[0295] In some examples, at least one of the liquid delivery connection line 216 and the liquid return connection line 217 is a hose to adapt to space limitations and facilitate installation and removal.

[0296] In other examples, at least one of the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 is a hard pipe to improve the structural strength of the pipeline.

[0297] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the hoses used in the liquid delivery connection pipeline 216 and the liquid return connection pipeline 217 can be bendable and elastic pipes such as plastic pipes and corrugated pipes, and the hard pipes can be metal pipes with greater hardness such as copper pipes, aluminum pipes, stainless steel pipes, or plastic pipes with greater hardness and support, or hard pipes made of plastic, metal or composite materials with a certain hardness and bending ability.

[0298] The materials of the liquid delivery connecting pipeline 216 and the liquid return connecting pipeline 217 are not limited to the above examples, and can also be any combination of the above materials, such as soft and hard combined pipelines, all hoses or all hard pipes, etc., but are not limited thereto.

[0299] In one embodiment, the projections of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 on the vertical plane are respectively located on both sides of the projections of the multiple computing devices 230 on the vertical plane; the multiple liquid delivery ports 152 and the multiple liquid return ports 142 are distributed facing each other in the first direction L1, and the multiple liquid delivery ports 152 are adjacent to one side of the multiple computing devices 230 in the first direction L1, and the multiple liquid return ports 142 are adjacent to the other side of the multiple computing devices 230 in the first direction L1. In this way, the arrangement of the liquid delivery hose between each liquid delivery port 152 and the input end of each cooling pipeline 215 and the arrangement of the liquid return hose between each liquid return port 142 and the output end of each cooling pipeline 215 can be simplified, thereby shortening the length of the liquid delivery hose and the liquid return hose.

[0300] In one embodiment, the liquid inlet 151 is formed on one side of the liquid inlet distribution pipeline 150 adjacent to the first pipeline group 20 in the second direction L2, and adjacent to the top of the liquid inlet distribution pipeline 150; the liquid outlet 141 is formed on one side of the liquid return distribution pipeline 140 adjacent to the first pipeline group 20 in the second direction L2, and adjacent to the top of the liquid return distribution pipeline 140. In this way, the distance between the liquid inlet 151 of the liquid inlet distribution pipeline 150 and the liquid outlet 141 of the liquid return distribution pipeline 140 and the first pipeline group 20 is shortened, and the liquid inlet 151 and the liquid outlet 141 are conveniently connected to the liquid supply inlet and the liquid return inlet 221a of the first pipeline group 20, respectively.

[0301] In one embodiment, an exhaust valve, i.e., a second exhaust valve 160, may be provided at the top of the liquid inlet distribution pipeline 150 and the top of the liquid return distribution pipeline 140 to utilize the natural rising property of the gas to make it easier for the gas to reach the second exhaust valve 160 and be discharged, thereby reducing the gas content in the pipeline, which is beneficial to improving the transportation efficiency of the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 for the cooling medium.

[0302] Exemplarily, the second exhaust valve 160 is a mechanical valve. Under normal circumstances, the valve of the second exhaust valve 160 is closed. When the cooling medium in the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 gathers air or gas, the gas rises and gathers at the top of the second exhaust valve 160. When the gas pressure is high enough, the valve of the second exhaust valve 160 is opened, and the gas is discharged. After the gas is discharged, the valve is quickly closed.

[0303] In one embodiment, the exhaust port 161 of the second exhaust valve 160 may be connected to a flexible connecting pipe (not shown), which may extend to the bottom of the cabinet 100 to respectively exhaust the gas in the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140. The water vapor is guided to the support platform 400 at the bottom of the cabinet 100 through the flexible connecting pipe, and is discharged to the outside through the gap of the bottom support platform 400, so as to prevent the water vapor from affecting the computing device 230 inside the cabinet 100.

[0304] In one embodiment, the cabinet 100 includes a cabinet body 110 and a shelf 120. The shelf 120 is arranged inside the cabinet body 110. The shelf 120 defines a first accommodating space 100a. By providing an accommodating space for the computing device 230 through the independent shelf 120, the weight of the computing device 230 can be dispersed, the overall structure of the cabinet 100 can be prevented from being overstressed, and the overall stability and safety of the cabinet 100 can be improved.

[0305] A second accommodating space 100b is defined between the shelf 120 and the cabinet 110. The second accommodating space 100b is arranged in the first direction L1 with the first accommodating space 100a. Multiple power distribution units of the rack 1000 can be arranged vertically in the second accommodating space 100b. Multiple computing devices 230 and multiple power distribution units are concentrated in one cabinet 100, which improves space utilization and facilitates power management and maintenance. Moreover, by distributing the power of the power distribution cabinet 600 outside the cabinet 100 to each computing device 230 inside the cabinet 100 through multiple power distribution units, power wiring can be simplified and cable clutter can be avoided.

[0306] For example, the number of power distribution units may be less than the number of computing devices 230 , that is, one power distribution unit may distribute power to multiple computing devices 230 .

[0307] In some examples, the shelf 120 may be welded and fixed to the interior of the cabinet 110 .

[0308] In other examples, the shelf 120 may be fixed to the interior of the cabinet 110 by fasteners.

[0309] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the shelf 120 and the cabinet 110 may be fixed in various other ways, such as riveting, slot embedded fixing, magnet adsorption fixing or suction cup adsorption fixing.

[0310] Exemplarily, the material of the shelf 120 may be metal. In some examples, the material of the shelf 120 may be steel. In other examples, the material of the shelf 120 may be aluminum alloy. It should be noted that the material of the shelf 120 is not limited to the aforementioned examples, and the material may also be copper, carbon steel, alloy steel, or other composite materials with high strength and support, and is not limited thereto.

[0311] In one embodiment, the shelf 120 includes two support frames 1200 spaced apart in the first direction L1, that is, the first accommodation space 100a is defined by the two support frames 1200. The support frame 1200 includes a plurality of columns 121 and a plurality of support plates 122, wherein the plurality of columns 121 are spaced apart in the second direction L2, and the plurality of support plates 122 are spaced apart in the vertical direction and connected to the plurality of columns 121. The plurality of support plates 122 of one support frame 1200 and the plurality of support plates 122 of another support frame 1200 are disposed one by one in the first direction L1, so that the computing device 230 is supported by the two support frames 1200 disposed in opposite directions, which can not only improve the stability of the placement of the computing device 230, but also provide a regular and neat arrangement space for the computing device 230, so as to facilitate the management and maintenance of the computing device 230.

[0312] Exemplarily, each support frame 1200 includes two columns 121, and the two columns 121 are respectively arranged on both sides in the second direction L2 to constitute vertical pillars of the support frame 1200. A plurality of support plates 122 arranged at intervals in the vertical direction are connected between the two columns 121. The plurality of support plates 122 constitute a support platform 400 for each computing device 230 to enhance the overall strength of the shelf 120.

[0313] Exemplarily, the support plate 122 may include a vertically extending fixed sheet 122a and a horizontally extending bearing sheet 122b, wherein the fixed sheet 122a is fixed to the corresponding plurality of columns 121, and the bearing sheet 122b extends horizontally from the lower end of the fixed sheet 122a toward the support plate 122 of another support frame 1200, forming a plurality of pairs of facing bearing sheets 122b arranged at intervals in the vertical direction. Each computing device 230 can be directly pushed into the top of the corresponding pair of bearing sheets 122b along the second direction L2, which is easy to place and convenient to operate.

[0314] For example, a carrying platform may be arranged between two opposing fixing plates 122a, and the carrying platform is located above the two opposing carrying plates 122b. The computing device 230 may be placed on the corresponding carrying platform to improve the stability of the placement of the computing device 230.

[0315] In one embodiment, the rack 1000 may further include a plurality of power supply support bases 124 vertically spaced and arranged in the second accommodation space 100b, and the plurality of power supply support bases 124 are connected between the cabinet 110 and the shelf 120 to respectively support a plurality of power distribution units to ensure the stability of the placement of the power distribution units. Figure 5C As shown, a plurality of power supply support bases 124 arranged vertically are connected between the support frame 1200 located on the right side of the shelf 120 in the first direction L1 and the right side wall of the cabinet 110 in the first direction L1. For example, each power supply support base 124 can hold a power distribution unit.

[0316] In some examples, the power supply support base 124 can be welded and fixed between the cabinet 110 and the shelf 120. In other examples, the power supply support base 124 can be fixed between the cabinet 110 and the shelf 120 by fasteners. It should be noted that this is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that the power supply support base 124 can be connected to the cabinet 110 and the shelf 120 in many other ways, such as riveting, latch connection or snap connection, etc., but is not limited to this.

[0317] Exemplarily, the liquid inlet distribution pipeline 150 is vertically arranged on one side of one support frame 1200 of the shelf 120 adjacent to the first pipeline group 20 in the second direction L2, and the liquid return distribution pipeline 140 is vertically arranged on one side of the other support frame 1200 adjacent to the first pipeline group 20 in the second direction L2.

[0318] Exemplarily, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be fixed to the shelf 120 in a detachable manner.

[0319] In some examples, a plurality of mounting plates 123 arranged at intervals in a vertical direction are connected between the column 121 and the cabinet body 110 of the cabinet 100, and the column 121 is adjacent to the second accommodating space 100b in the first direction L1, and adjacent to the first pipeline group 20 in the second direction L2. The inlet distribution pipeline 150 is fixed to the corresponding mounting plate 123 through the connecting piece 153 thereon. One of the columns 121 of the other support frame 1200 may be provided with a plurality of other mounting plates (not shown) arranged at intervals in a vertical direction, and the return liquid distribution pipeline 140 is fixed to the corresponding other mounting plate through the connecting piece 153 thereon.

[0320] In other examples, the liquid inlet distribution pipeline 150 and the liquid return distribution pipeline 140 can be detachably connected to the shelf 120 by snap connection, magnet adsorption or suction cup adsorption, but it is not limited thereto.

[0321] Exemplarily, the inlet distribution pipeline 150 and the return distribution pipeline 140 can be fixedly connected to the shelf 120. For example, the connectors 153 of the inlet distribution pipeline 150 and the return distribution pipeline 140 are fixed to the corresponding columns 121 of the shelf 120 by screws, welding or riveting.

[0322] It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art will understand that the connection between the liquid inlet distribution pipeline 150, the liquid return distribution pipeline 140 and the shelf 120 can also be connected in many other ways, such as clamp fixation, binding fixation or buckle fixation, but is not limited to these.

[0323] In one embodiment, the rack 1000 also includes a wiring column 130, which is vertically arranged on the other side of the shelf 120 in the second direction L2. The wiring column 130 is formed with a plurality of threading grooves 131 for network cables to pass through. The network cables are used to connect to the network interface of the computing device 230 to achieve network connection of the computing device 230.

[0324] Exemplarily, the wiring column 130 is provided with a plurality of weight-reducing holes to reduce its overall weight.

[0325] In some examples, the wiring post 130 can be welded and fixed to the inside of the cabinet 110. In other examples, the wiring post 130 can be fixed to the inside of the cabinet 110 by fasteners. It should be noted that the above is only an example and does not constitute a limitation of the present application. Those skilled in the art can understand that there can be many other ways to fix the wiring post 130 to the cabinet 110, such as riveting fixation, slot embedded fixation, magnet adsorption fixation or suction cup adsorption fixation, etc., but it is not limited to this.

[0326] In one embodiment, the rack 1000 further includes a top connection plate 190, which is disposed on the top of the cabinet 100 and extends above the adjacent cabinet 100; the top connection plate and the top of the adjacent cabinet 100 respectively have top connection holes that are opposite to each other in the vertical direction, and the cabinet 100 and the adjacent cabinet 100 are fixed by fasteners passing through the top connection holes. That is, two adjacent cabinets 100 arranged in the first direction L1 can be connected together by the top connection plate 190 to construct a plurality of racks 1000 that are arranged and connected in sequence, thereby forming a plurality of stable integrated racks 1000, which is convenient for transportation and delivery.

[0327] Exemplarily, the top connecting plate 190 may be disposed on an edge of the top of the cabinet body 110 in the first direction L1 to facilitate connection with an adjacent cabinet 100 .

[0328] Exemplarily, two top connecting plates 190 spaced apart in the second direction L2 are installed on the top of the cabinet 100 on the first side in the first direction L1. The cabinet 100 is connected to adjacent cabinets 100 through the two top connecting plates 190 in the second direction L2, thereby improving the stability of the connection between two adjacent cabinets 100, thereby making the connection between multiple racks 1000 more stable and avoiding shaking of the racks 1000 during transportation.

[0329] In one embodiment, see Fig. 5F, the first wire hole 114 is covered with a cover plate 112, and the cover plate 112 is installed on the top wall of the cabinet 110. Specifically, the top of the cabinet 110 is defined with a plurality of first fixing holes on the periphery of the first wire hole 114, and the cover plate 112 has a plurality of second fixing holes corresponding to the plurality of first fixing holes one by one, and the cover plate 112 is fixed to the top of the wire hole by fasteners that pass through the second fixing holes and the first fixing holes in sequence before the power supply cable 113 is connected. That is to say, before the power supply cable 113 is connected, the first wire hole 114 is covered by the cover plate 112. For example, during the transportation and handling of the cabinet 100, the cover plate 112 covers the first wire hole 114 to prevent debris from falling into the cabinet 100. After delivery, the cover plate 112 is removed, and the power supply cable 113 passes through the first wire hole 114 to connect to the power distribution unit inside the cabinet 100.

[0330] In one embodiment, a lifting ring 170 may be provided on the top of the cabinet 100. The lifting ring 170 is detachably provided on the top of the cabinet 100 and is used to connect a lifting rope to facilitate the transportation of the cabinet 100. There may be multiple lifting rings 170 to improve the stability of the cabinet 100 during transportation.

[0331] Exemplarily, a lifting ring 170 is respectively provided at the four corners of the top of the cabinet 100 , which is helpful to maintain the balance and stability of the cabinet 100 when it is lifted.

[0332] Exemplarily, the lifting ring 170 includes an annular portion and a mounting portion, the mounting portion is connected to the top of the cabinet 100, and the annular portion is located above the mounting portion, which is convenient for connection with the lifting rope. The lifting ring 170 is arranged vertically as a whole, so that the cabinet 100 can be kept in a vertical state as a whole when it is lifted, which is conducive to maintaining the stability of the cabinet 100 and facilitating the placement of the cabinet 100. Exemplarily, the mounting portion can be a bolt, and a screw hole is formed at the top of the cabinet 100 corresponding to the mounting portion. The bolt and the screw hole cooperate to facilitate the installation and removal of the lifting ring 170.

[0333] In one embodiment, a vertically extending fixing hole 111 may be formed at the bottom of the cabinet 100 so that the cabinet 100 can be fixed to the supporting platform 400 by a fastener passing through the fixing hole 111 to keep the cabinet 100 stable and easy to transport.

[0334] Exemplarily, four corner areas at the bottom of the cabinet 100 may be respectively formed with fixing holes 111 , and the cabinet 100 is fixed to the supporting platform 400 through the four fixing holes 111 , which makes it more stable and less likely to shake during transportation.

[0335] In one embodiment, the rack 1000 further includes a bottom connecting plate 180, which extends downwardly and obliquely at the outside of the second direction L2 at the bottom of the cabinet 100, and the upper end of the bottom connecting plate 180 is fixed to the cabinet 100, and the lower end of the bottom connecting plate 180 is fixed to the support platform 400. In this way, a stable triangular structure of the bottom connecting plate 180 is formed, which improves the stability of the connection between the cabinet 100 and the support platform 400.

[0336] Exemplarily, the bottom connecting plate 180 is formed with connecting holes for connecting with the cabinet 100 and connecting holes for connecting with the supporting platform 400, and the bottom connecting plate 180 is fixed to the cabinet 100 and the supporting platform 400 respectively by fasteners passing through the corresponding connecting holes.

[0337] Exemplarily, bottom connecting plates 180 are respectively provided on two outer sides of the bottom of the cabinet 100 in the second direction L2 to improve the stability of the connection between the cabinet 100 and the supporting platform 400 .

[0338] In one embodiment, a plurality of rollers 101 may be installed at the bottom of the cabinet 100 to facilitate the independent movement of the cabinet 100. For example, four rollers 101 are installed at the bottom of the cabinet 100, and the four rollers 101 are evenly spaced and installed at the bottom of the cabinet 100 near the four corners.

[0339] The embodiment of the present application also provides a container 2, including a box body 700 and a heat dissipation structure 1 of any of the above embodiments, wherein the heat dissipation structure 1 is arranged inside the box body 700. Thus, a container-type heat dissipation structure 1 is formed, which is convenient for transportation and delivery, and provides a solid structure to prevent the influence of the external environment.

[0340] In some examples, the heat dissipation structure 1 is directly placed inside the box 700. To ensure the stability of the heat dissipation structure 1 during the transportation of the container 2, the inner dimensions of the box 700 can be matched with the outer dimensions of the heat dissipation structure 1 to prevent it from moving; or a buffer protection layer can be added between the heat dissipation structure 1 and the box 700 to provide additional protection to prevent it from moving.

[0341] In other examples, the heat dissipation structure 1 is fixed inside the box 700. For example, the support platform 400 and / or the top frame 300 of the heat dissipation structure 1 can be fixed to the bottom wall and / or side wall of the box 700 by fasteners.

[0342] It should be noted that the above is only an example and does not constitute a limitation to the present application.

[0343] Those skilled in the art can understand that the arrangement of the heat dissipation structure 1 relative to the box 700 can also be in other forms. For example, an anti-skid pad can be added to the bottom of the box 700, or a shock-absorbing pad or shock absorber can be used to isolate the heat dissipation structure 1 from the box 700 to reduce the vibration and impact of the box 700 during transportation. In addition, a clamp or buckle can be set inside the box 700, or the heat dissipation structure 1 can be fixed by magnetic attraction or vacuum adsorption. This is only for example, and the arrangement of the heat dissipation structure 1 relative to the box 700 is not limited to the above example.

[0344] In one embodiment, the box body 700 includes a frame 701, which is protruding upward on one side of the bottom of the box body 700 in the second direction L2. The support platform 400 is spaced apart from the frame 701 on one side adjacent to the frame 701 in the second direction L2 to form a groove for liquid drainage. That is, when the support platform 400 is arranged at the bottom of the box body 700, it needs to maintain a certain distance from the frame 701 of the box body 700 in the second direction to reserve a channel for liquid discharge, so as to facilitate timely discharge of liquid.

[0345] The frame 701 may be formed with a plurality of drainage holes 702 spaced apart in the first direction L1 , and the liquid in the groove is discharged to the outside of the box body 700 through the drainage holes 702 , so as to avoid water accumulation at the bottom of the box body 700 .

[0346] Exemplarily, there are two drainage holes 702. The two drainage holes 702 can together form a forklift hole, which is convenient for a forklift to carry the container.

[0347] In some examples, the shape and size of the box 700 can be set accordingly with reference to a standard container of 40 feet, and the overall size is 12.192m*2.438m*2.438m. Therefore, after the heat dissipation structure 1 is integrated and deployed inside the box 700, the heat dissipation structure 1 can be directly packaged and transported by sea or land transportation, and no secondary assembly is required after the transportation is completed, thereby improving the convenience of transportation and delivery.

[0348] The above is only a specific example and does not constitute a limitation of the present application. It will be appreciated by those skilled in the art that the shape and size of the box 700 can be arbitrarily set according to actual conditions. For ease of transportation, the shape and size of the box 700 can be set accordingly with reference to a standard container, for example, the same shape and size as a standard container of 20 feet, 40 feet or 45 feet can be adopted, but it is not limited thereto.

[0349] The shape and size of the box 700 may also have other different designs. For example, a compact design may be adopted to make the internal shape and internal size of the box 700 close to the shape and size of the heat dissipation structure 1, reduce the redundant space, and prevent the heat dissipation structure 1 from moving inside the box 700; or, a redundant space design may be adopted to reserve a certain buffer space around the inside of the box 700 to facilitate the placement of fillers or buffer materials to provide additional protection. This is only an example, and the shape and size of the box 700 are not limited to the above examples.

[0350] This embodiment also provides a data center, including multiple computing devices 230 and the heat dissipation structure 1 or container 2 of any of the above-mentioned embodiments. Multiple computing devices 230 can be integrated and installed in the cabinet 100 of each heat dissipation structure 1 to form a skid-integrated data center, or the heat dissipation structure 1 can be placed in a box to form a container-type data center.

[0351] Compared with the traditional data center, the data center provided by this embodiment can be pre-assembled and tested. After delivery, the site only needs to connect the power distribution cabinet 600 and the network through the power supply cable 113 and the network cable respectively, and it can be put into use, thereby greatly saving deployment time; and the data center of this embodiment has a high degree of standardization and consistency, which can reduce the uncertainty and potential problems of on-site construction, thereby reducing construction costs and operating costs. In addition, the modular design of the data center can be customized according to different needs, including different power densities, cooling solutions and network configurations, to meet the needs of various application scenarios.

[0352] In the description of this specification, it should be understood that the terms "length", "up", "down", "front", "back", "left", "right", "vertical", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0353] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0354] In this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" can refer to electrical connection or communication; can refer to direct connection or indirect connection through an intermediate medium; can refer to the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0355] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0356] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0357] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation structure, characterized in that: include: at least one rack, the rack comprising a cabinet and a medium flow path, the cabinet being used to integrate and install a plurality of computing devices, the medium flow path being used to allow a cooling medium to flow through the plurality of computing devices; A cooling device, comprising a heat exchange module and a first pipeline group, wherein the first pipeline group is connected between the heat exchange module and a medium flow path of the at least one rack; A top frame fixed to the top of the at least one frame, wherein at least a portion of the first pipeline group is supported by the top frame; A support platform, the at least one rack and the cooling device are integrated on the support platform, the heat exchange module is arranged on one side of the at least one rack in a first direction, the first pipeline group is located on one side of the heat exchange module in a second direction, and the second direction intersects with the first direction.

2. The heat dissipation structure according to claim 1, characterized in that: The support platform comprises: A frame structure, a support plate and a frame body, wherein the frame structure has a first area and a second area arranged in the first direction, the support plate covers the first area; and the frame body is arranged in the second area; The at least one frame is arranged on the support plate, and the heat exchange module is supported on the upper part of the frame.

3. The heat dissipation structure according to claim 2, characterized in that: The cooling device further comprises a second pipeline group, wherein the second pipeline group is connected between the heat exchange module and the cold source device; The second area includes three sub-areas arranged in the second direction, the orthographic projection of the frame in the horizontal plane is located in the middle sub-area, and the bottom end of the frame is connected to the middle sub-area; Orthographic projections of at least part of the pipe sections of the first pipeline group and at least part of the pipe sections of the second pipeline group in the horizontal plane are respectively located in the two sub-areas on both sides.

4. The heat dissipation structure according to claim 2, characterized in that: The support plate includes a plurality of plates arranged in a spliced ​​relationship with each other, and each of the plates is connected to the frame structure through a corresponding fastener; A gap is defined between two adjacent plate bodies, and the gap is used to guide the liquid on the support plate to the bottom of the support plate.

5. The heat dissipation structure according to claim 4, characterized in that: A plurality of convex structures distributed at intervals are formed on the upper surface of the plate body.

6. The heat dissipation structure according to claim 1, characterized in that: The top frame includes a plurality of cross beams and at least one longitudinal beam; the plurality of cross beams extend respectively along the first direction and are spaced side by side in the second direction, the cross beams are fixedly connected to the top of the at least one frame; the longitudinal beam extends along the second direction; Wherein, at least one longitudinal beam is fixedly connected between two adjacent transverse beams, and a portion of the first pipeline group is supported by the longitudinal beam.

7. The heat dissipation structure according to claim 6, characterized in that: The plurality of beams include a first beam body and a second beam body, wherein the first beam body and the second beam body are fixedly connected to the top of the at least one frame; The longitudinal beam comprises a first section and a second section connected to each other, wherein the first section is connected between the first beam body and the second beam body; the second section is located on a side of the second beam body away from the first beam body and extends to the outer side of the frame in the second direction; Part of the first pipeline group is supported by the second section.

8. The heat dissipation structure according to claim 6, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; There are multiple longitudinal beams, and the multiple longitudinal beams correspond to the multiple racks one by one. The longitudinal beams are located at the tops of the corresponding racks.

9. The heat dissipation structure according to claim 7, characterized in that: The top frame also includes at least one pipeline support seat, which corresponds one-to-one to the at least one longitudinal beam. The pipeline support seat is arranged in the second section of the corresponding longitudinal beam, and part of the first pipeline group is supported by the pipeline support seat.

10. The heat dissipation structure according to claim 9, characterized in that: The pipeline support seat has a clamping groove, and the clamping groove has an opening arranged upward. The inner wall surface of the clamping groove is an arc surface adapted to the shape of the outer peripheral wall of the pipeline of the first pipeline group.

11. The heat dissipation structure according to claim 7, characterized in that: Also includes: a power distribution cabinet, arranged on the supporting platform and located on the other side of the at least one rack in the first direction, so as to be opposite to the heat exchange module in the first direction; The rack further comprises a power distribution unit arranged inside the cabinet, and the power distribution unit is connected to the power distribution cabinet via a power supply cable.

12. The heat dissipation structure according to claim 11, characterized in that: The top frame also includes at least one bracket, which corresponds to the at least one rack one by one. The bracket is arranged on the top of the corresponding rack and is located between the first beam and the second beam. The top of the bracket has a supporting surface, which is used to support the power supply cable.

13. The heat dissipation structure according to claim 12, characterized in that: A first wire hole is formed on the top of the cabinet of the rack, the first wire hole is located on the side of the corresponding bracket away from the power distribution cabinet in the first direction, and the first wire hole is used for the corresponding power supply cable to pass through and be connected to the corresponding power distribution unit; A second wire hole is formed on the top of the power distribution cabinet, and the second wire hole is used for the power supply cable to pass through and be connected to the power distribution cabinet.

14. The heat dissipation structure according to claim 1, characterized in that: The heat exchange module has a first heat exchange flow path for a cooling medium to flow and a second heat exchange flow path for a cooling medium to flow, and the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium; The first pipeline group includes a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path, and the first liquid supply pipeline is connected to the liquid inlet of the medium flow path of the rack; the first liquid return pipeline is connected to the input end of the first heat exchange flow path, and the first liquid return pipeline is connected to the liquid outlet of the medium flow path; The cooling device also includes a second pipeline group, which is connected between the second heat exchange flow path of the heat exchange module and the cold source device and is located on the other side of the heat exchange module in the second direction.

15. The heat dissipation structure according to claim 14, characterized in that: The first liquid supply pipeline comprises a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected to each other, the first liquid supply sub-pipeline and the second liquid supply sub-pipeline respectively extend along the first direction, and are arranged side by side and at intervals in the second direction; The first liquid supply sub-pipeline has a liquid supply inlet at one end adjacent to the heat exchange module, and the liquid supply inlet is connected to the output end of the first heat exchange flow path; the second liquid supply sub-pipeline has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path; The first liquid return pipeline includes a first liquid return section, which extends along the first direction; the first liquid return section has a liquid return inlet, which is connected to the liquid outlet of the medium flow path.

16. The heat dissipation structure according to claim 15, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; There are multiple liquid supply outlets, which are arranged at intervals in the first direction of the second liquid supply sub-pipeline and are connected to the liquid inlets of the medium flow paths of the multiple racks in a one-to-one correspondence; There are multiple liquid return inlets, which are arranged at intervals in the first direction of the first liquid return section and are connected to the liquid outlets of the medium flow paths of the multiple racks in a one-to-one correspondence.

17. The heat dissipation structure according to claim 15, characterized in that: The first liquid supply sub-pipeline, the second liquid supply sub-pipeline and the first liquid return section are all supported on the top frame, and the first liquid return section is arranged between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

18. The heat dissipation structure according to claim 15, characterized in that: The first liquid return pipeline also includes a second liquid return section and a third liquid return section connected to each other, and the second liquid return section and the third liquid return section extend vertically respectively; the first liquid return section is closed at one end away from the heat exchange module, and an end of the first liquid return section adjacent to the heat exchange module is connected to the first end of the second liquid return section, the second end of the second liquid return section is connected to the first end of the third liquid return section, and the second end of the third liquid return section is connected to the input end of the first heat exchange flow path.

19. The heat dissipation structure according to claim 18, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The orthographic projections of the second liquid return section and the third liquid return section in the horizontal plane are located in the sub-region adjacent to one side of the first liquid supply pipeline.

20. The heat dissipation structure according to claim 14, characterized in that: The second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path, and the second liquid supply pipeline is connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path, and the second liquid return pipeline is connected to the medium return end of the cold source equipment.

21. The heat dissipation structure according to claim 20, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The orthographic projections of the second liquid supply pipeline and the second liquid return pipeline in the horizontal plane are located in the sub-region on the side away from the first liquid supply pipeline.

22. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a first power device and a second power device, the first power device is connected to the first pipeline group and is used to provide power for the flow of the cooling medium, and the second power device is connected to the second pipeline group and is used to provide power for the flow of the heat exchange medium.

23. The heat dissipation structure according to claim 1, characterized in that: The support platform includes a frame structure, the frame structure has a second area, the second area includes three sub-areas arranged in the second direction, the three sub-areas are respectively the sub-area located in the middle and the two sub-areas located on both sides; The first power device and the second power device of the cooling device are respectively arranged in the two sub-areas on both sides.

24. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a liquid storage module, which includes a first liquid storage tank and a second liquid storage tank. The first liquid storage tank is connected to the first pipeline group for replenishing cooling medium to the first pipeline group, and the second liquid storage tank is connected to the second pipeline group for replenishing heat exchange medium to the second pipeline group.

25. The heat dissipation structure according to claim 14, characterized in that: The cooling device also includes a pressure stabilizing module, which includes a first pressure stabilizing tank and a second pressure stabilizing tank. The first pressure stabilizing tank is connected to the first pipeline group for stabilizing the pressure of the first pipeline group, and the second pressure stabilizing tank is connected to the second pipeline group for stabilizing the pressure of the second pipeline group.

26. The heat dissipation structure according to claim 1, characterized in that: The support platform comprises a frame structure and a frame body, wherein the frame body is arranged on the frame structure; wherein the liquid storage module and / or the voltage stabilizing module of the cooling device is arranged inside the frame body.

27. The heat dissipation structure according to claim 1, characterized in that: The medium flow path includes a cooling pipeline, a liquid inlet distribution pipeline and a liquid return distribution pipeline, wherein the cooling pipeline is used to be in thermal contact with a heat generating component of the computing device to cool the heat generating component; The liquid inlet distribution pipeline and the liquid return distribution pipeline are arranged on one side of the cabinet, the liquid inlet distribution pipeline has a liquid inlet and a plurality of liquid delivery ports, the liquid inlet is connected to the liquid supply inlet of the first pipeline group, and the plurality of liquid delivery ports are used to correspond to the cooling pipelines of the plurality of computing devices one by one, and are respectively used to be connected to the input ends of the cooling pipelines of the plurality of computing devices; The liquid return distribution pipeline has multiple liquid return ports and liquid outlets. The multiple liquid return ports are respectively used to correspond one-to-one with the cooling pipelines of the multiple computing devices and are respectively used to be connected to the output ends of the cooling pipelines of the multiple computing devices. The liquid outlet is connected to the liquid return inlet of the first pipeline group.

28. The heat dissipation structure according to claim 27, characterized in that: The cabinet defines a first accommodating space, and the first accommodating space is used to integrate and install a plurality of computing devices arranged vertically; The liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively vertically arranged on one side of the cabinet adjacent to the first pipeline group in the second direction, and the multiple liquid delivery ports and the multiple liquid return ports are respectively arranged at intervals along the vertical direction.

29. The heat dissipation structure according to claim 27, characterized in that: The projections of the liquid inlet distribution pipeline and the liquid return distribution pipeline on the vertical plane are respectively located on both sides of the projections of the plurality of computing devices on the vertical plane; The multiple liquid delivery ports and the multiple liquid return ports are distributed opposite to each other in the first direction, and the multiple liquid delivery ports are adjacent to one side of the multiple computing devices in the first direction, and the multiple liquid return ports are adjacent to the other side of the multiple computing devices in the first direction.

30. The heat dissipation structure according to claim 27, characterized in that: The liquid inlet is formed on a side of the liquid inlet distribution pipeline adjacent to the first pipeline group in the second direction, and adjacent to the top of the liquid inlet distribution pipeline; the liquid outlet is formed on a side of the liquid return distribution pipeline adjacent to the first pipeline group in the second direction, and adjacent to the top of the liquid return distribution pipeline.

31. The heat dissipation structure according to claim 27, characterized in that: The top end of the liquid inlet distribution pipeline and the top end of the liquid return distribution pipeline are both provided with exhaust valves.

32. The heat dissipation structure according to claim 31, characterized in that: The exhaust port of the exhaust valve is connected with a flexible connecting pipe, and the flexible connecting pipe extends to the bottom of the cabinet to respectively exhaust the gas in the liquid inlet distribution pipeline and the liquid return distribution pipeline.

33. The heat dissipation structure according to claim 28, characterized in that: The cabinet includes a cabinet body and a shelf arranged inside the cabinet body, the shelf defines the first accommodation space, the shelf and the cabinet body define a second accommodation space, and the second accommodation space and the first accommodation space are distributed side by side in the first direction; The rack further includes a plurality of power distribution units, and the plurality of power distribution units are vertically arranged in the second accommodating space.

34. The heat dissipation structure according to claim 1, characterized in that: There are multiple racks, and the multiple racks are arranged side by side along the first direction; The rack also includes a top connecting plate, which is arranged on the top of the cabinet and extends to the top of the adjacent cabinet; the top connecting plate and the top of the adjacent cabinet respectively have top connecting holes that are opposite to each other in the vertical direction, and the cabinet and the adjacent cabinet are fixed by fasteners passing through the top connecting holes.

35. The heat dissipation structure according to claim 1, characterized in that: The rack further comprises a lifting ring which is detachably arranged on the top of the cabinet and is used to connect a lifting rope to carry the cabinet or the heat dissipation structure.

36. The heat dissipation structure according to claim 1, characterized in that: The rack also includes a bottom connecting plate, which extends downwardly and obliquely at the outside of the second direction at the bottom of the cabinet, and the upper end of the bottom connecting plate is fixed to the cabinet, and the lower end of the bottom connecting plate is fixed to the supporting platform.

37. A container, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 36; The heat dissipation structure is arranged inside the box.

38. The container according to claim 37, characterized in that The box body comprises a frame, and the frame is protruded upwardly on one side of the bottom of the box body in the second direction; The support platform is spaced apart from the frame at one side adjacent to the frame in the second direction to form a groove for draining liquid.

39. The container according to claim 38, characterized in that The frame is formed with a plurality of drainage holes, and the plurality of drainage holes are distributed at intervals in the first direction.

40. A data center, characterized in that: include: The heat dissipation structure according to any one of claims 1 to 36 or the container according to any one of claims 37 to 39; A plurality of computing devices are integrated and installed in a cabinet of the heat dissipation structure.

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