Preparation method of OLED display panel and OLED display panel

Abstract

The embodiment of the invention provides a preparation method of an OLED display panel and the OLED display panel, the preparation method is aimed at a display substrate, a first protective film and a second protective film are sequentially arranged on one side, far away from a substrate, of a packaging layer, the second protective film is cut firstly, a first part, located in a target area, of orthographic projection of the second protective film is reserved, and a second part, located in the target area, of the second protective film is reserved; tearing off the rest part of the second protective film; the target area is the position where the intersection point on the first protective film is cut, when the first protective film is cut, the first part is taken as the intersection point in the two cutting directions, and the second protective film can absorb a part of laser energy to be carbonized in the first cutting process; the first protective film can absorb a part of laser energy to be carbonized during the second cutting, and redundant laser energy cannot damage a packaging layer of the display substrate, so that the packaging layer cannot be influenced, and the yield of the OLED display panel can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of preparation of OLED display panels, and in particular to a preparation method of an OLED display panel and an OLED display panel. Background Art

[0002] OLED (Organic Light-Emitting Diode) display panels are generally arranged in an array on a substrate. In order to protect the internal structure of the OLED display panel, a protective film is provided on the side of the encapsulation layer away from the substrate. The protective film covers multiple OLED display panels. The protective film needs to be cut to separate the multiple OLED display panels. However, during the laser cutting process, carbonization is prone to occur where the cutting lines overlap, thereby damaging the encapsulation layer. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a method for preparing an OLED display panel and an OLED display panel, so as to solve the problem that carbonization is easily generated at the overlapping position of the cutting lines during the cutting process of the OLED display panel, thereby damaging the encapsulation layer.

[0004] The specific technical solutions are as follows:

[0005] A first aspect of the present application provides a method for preparing an OLED display panel, comprising at least the following steps:

[0006] A display substrate is obtained, wherein the display substrate is arranged on a base substrate, the display substrate includes a functional layer and an encapsulation layer, and along the direction away from the base substrate, a first protective film and a second protective film are sequentially provided on a side of the encapsulation layer away from the base substrate, and the orthographic projection of the display substrate on the base substrate is located within the orthographic projection range of the first protective film and the second protective film on the base substrate.

[0007] Determine the boundary position of the target OLED display panel.

[0008] A target area of ​​the target OLED display panel is determined, where the target area is located at four vertex corners of the boundary position of the OLED display panel, and the vertex corners are the boundaries or the center of the target area.

[0009] The second protective film is cut to reserve a first portion of the second protective film whose orthographic projection is located in the target area, and the remaining portion of the second protective film is torn off.

[0010] The first protective film is cut along the first direction and the second direction to four sides of the target display substrate with the first portion as the intersection point. The first direction and the second direction are respectively parallel to the two sides of the target display substrate that intersect with each other.

[0011] The first protective film outside the cutting line formed in the first direction or the second direction is torn off to obtain a target OLED display panel with the first protective film attached thereto, wherein the outside refers to a side away from the edge of the display substrate.

[0012] In addition, according to the method for preparing the OLED display panel of the first aspect of the present application, it may also have the following technical features:

[0013] In some embodiments, the orthographic projection area of ​​the second protective film is located within the orthographic projection range of the first protective film on the base substrate.

[0014] In some embodiments, a barrier dam is disposed around the target OLED display panel, and the target area is located within the range of the barrier dam.

[0015] In some embodiments, the first portion is a triangular prism, a hexagonal prism or a cylinder, or the first portion is an irregular hexahedral structure.

[0016] In some embodiments, the side length or diameter of a cross section of the first portion along a direction parallel to the plane where the substrate is located, or the diameter of an inscribed circle thereof, is greater than or equal to 200 μm.

[0017] In some embodiments, when the second protective film is cut, the angle between the extension line of the cutting head and the second protective film is 45 degrees to 135 degrees; when the first protective film is cut along the first direction and the second direction, the angle between the extension line of the cutting head and the first protective film is 90 degrees.

[0018] In some embodiments, the cutting head is a laser beam.

[0019] In some embodiments, the first protective film is a polyethylene terephthalate plastic gasket, and the second protective film is polyethylene terephthalate plastic or polyimide.

[0020] In some embodiments, when the second protective film is made of polyethylene terephthalate plastic, the first protective film and the second protective film have the same thickness.

[0021] In some embodiments, when the second protective film is polyimide, the thickness of the second protective film is less than the thickness of the first protective film.

[0022] In some embodiments, the thickness of the polyethylene terephthalate plastic is 60 μm-80 μm, and the thickness of the polyimide is 40 μm-60 μm.

[0023] A second aspect of the present application provides an OLED display panel, which is obtained by the above-mentioned method for preparing an OLED display panel.

[0024] Beneficial effects of the embodiments of the present application:

[0025] The embodiments of the present application provide a method for preparing an OLED display panel and an OLED display panel. The method for preparing an OLED display panel has two layers of protective films at the intersection, namely a first protective film and a second protective film. The second protective film can absorb a portion of the laser energy and be carbonized during the first cutting, and the first protective film can absorb a portion of the laser energy and be carbonized during the second cutting. Excess laser energy cannot damage the encapsulation layer of the display substrate, so it will not affect the encapsulation layer, thereby improving the yield rate of the OLED display panel.

[0026] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0028] Figure 1 A schematic diagram of the structure of a display substrate provided in an embodiment of the present application;

[0029] Figure 2 For Figure 1 A schematic diagram showing cutting of the second protective film of the substrate is shown in FIG.

[0030] Figure 3 For Figure 2 The schematic diagram showing the substrate after the second protective film is cut;

[0031] Figure 4 A schematic diagram showing that only the first part is retained after the second protective film is torn off;

[0032] Figure 5 For Figure 1 A schematic diagram showing cutting of the first protective film of the substrate is shown in FIG.

[0033] Figure 6It is a schematic diagram of the structure after the redundant first protective film is torn off;

[0034] Figure 7 for Figure 1 A top view of the substrate is shown in FIG.

[0035] Figure 8 is a schematic top view of cutting the second protective film;

[0036] Fig. 9 A top view showing only the first portion remaining after the second protective film is torn off;

[0037] Figure 10-13 A schematic diagram of cutting a display substrate having only one protective film;

[0038] Fig.14 for Figure 10-13 The schematic diagram showing the GDS failure after substrate cutting is shown in FIG.

[0039] Fig.15 A schematic diagram of a process for preparing a display substrate provided in an embodiment of the present application;

[0040] Fig.16 A schematic diagram of another process for preparing a display substrate provided in an embodiment of the present application;

[0041] Fig.17 A schematic diagram of a cylindrical structure in which the first portion reserved for the display substrate provided in an embodiment of the present application is a cylindrical structure;

[0042] Fig.18 A schematic diagram of a hexagonal prism structure in which the first portion reserved for the display substrate provided in an embodiment of the present application is a first portion reserved for the display substrate provided in an embodiment of the present application;

[0043] Fig.19 A schematic diagram of a triangular prism structure in which the first portion reserved for the display substrate provided in an embodiment of the present application is a triangular prism structure;

[0044] Fig. 20 A schematic diagram of a hexagonal prism structure in which the first portion reserved for the display substrate provided in an embodiment of the present application is a first portion reserved for the display substrate provided in an embodiment of the present application;

[0045] Fig.21 A schematic diagram of a spherical structure of the first portion reserved for the display substrate provided in the embodiment of the present application;

[0046] Fig. 22 A schematic diagram showing that the first portion reserved for the display substrate provided in an embodiment of the present application is an irregular hexahedral structure.

[0047] The reference numerals are as follows:

[0048] Display substrate 10; base substrate 11; OLED display panel 12; gap 121; barrier dam 13; carbon dots 14; first protective film 20; second protective film 30; first portion 31; cutting head 40; angle α; target OLED display panel A; target area B. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0050] The currently popular OLED display panel 12 is generally a rigid substrate plus a flexible package, wherein the rigid substrate can be a glass substrate. The technology of the rigid substrate plus a flexible package of the OLED display panel 12 is called Hybrid technology. Compared with the traditional rigid substrate and rigid package and flexible substrate and flexible package technology, Hybrid has the huge advantages of high strength and low cost. However, when cutting the Hybrid OLED display panel, the following steps are usually followed: laser cutting → tearing off the cutting path and the excess protective film in the dummy area → glass knife cutting the cutting path → splitting, wherein the tearing off of the cutting path and the excess protective film in the dummy area refers to the protective film not attached to the top of the display panel. However, in the process of laser cutting, the laser probe is completed at one time on a large-size (such as 1500mm*925mm) glass plate; during the cutting movement, the trajectory will cross, resulting in the intersection position being subjected to laser radiation twice. The energy radiated by the laser can be absorbed by the protective film for the first time, and the protective film is carbonized and disappears. The second radiation is equivalent to directly radiating on the outermost film layer of the OLED display panel, i.e., the encapsulation layer, resulting in damage to the surface encapsulation layer, and poor reliability test of the display panel.

[0051] To solve the above problems, a first aspect of an embodiment of the present application provides a method for preparing an OLED display panel 12, which comprises at least the following steps:

[0052] Step S1: Obtain a display substrate 10, the display substrate 10 is disposed on a base substrate 11, the display substrate 10 includes a functional layer and an encapsulation layer, and along a direction away from the base substrate 11, a first protective film 20 and a second protective film 30 are sequentially disposed on a side of the encapsulation layer away from the base substrate 11, and an orthographic projection of the display substrate 10 on the base substrate 11 is located within the orthographic projection range of the first protective film 20 and the second protective film 30 on the base substrate 11, such as Figure 1 shown.

[0053] Step S2: Determine the boundary position of the target OLED display panel A, such as Figure 2 shown.

[0054] Step S3: Determine the target area B of the target OLED display panel A. The target area B is located at the four vertex positions of the boundary position of the OLED display panel 12, and the vertex is the boundary or the center of the target area B. Figure 2 shown.

[0055] Step S4: cutting the second protective film 30, leaving a first portion 31 of the second protective film 30 whose orthographic projection is located in the target area B, and tearing off the remaining portion of the second protective film 30, such as Figure 3 , Figure 4 As shown, Figure 3 is a schematic diagram of cutting the second protective film 30, Figure 4 It is a schematic diagram of tearing off the remaining part of the second protective film 30.

[0056] Step S5: Using the first portion 31 as the intersection point, the first protective film 20 is cut along the first direction and the second direction to the four sides of the target display substrate 10, respectively. The first direction and the second direction are parallel to the two sides of the target display substrate 10 that intersect with each other. Figure 5 As shown, Figure 5 It is a schematic diagram of cutting the first protection film 20 along the first direction / the second direction.

[0057] Step S6: tear off the first protective film 20 outside the cutting line formed in the first direction or the second direction to obtain the target OLED display panel A with the first protective film 20 attached thereto, wherein the outside refers to the side away from the edge of the display substrate 10, such as Figure 6 As shown, Figure 6 It is a schematic diagram of tearing off the first protective film 20 outside the cutting line.

[0058] In this embodiment, the boundary position of the target OLED display panel A is obtained, and then the protective film around the target OLED display panel A is cut to separate the OLED display panel 12. The second protective film 30 is cut first, and after cutting, the first part 31 corresponding to the target area B is reserved, and the rest of the second protective film 30 is torn off. When the first protective film 20 is cut, the first part 31 is used as the intersection of the two cutting directions. The second protective film 30 can absorb a part of the laser energy and be carbonized during the first cutting, and the first protective film 20 can absorb a part of the laser energy and be carbonized during the second cutting. The excess laser energy cannot damage the encapsulation layer of the display substrate 10, so it will not affect the encapsulation layer, thereby improving the yield rate of the OLED display panel 12.

[0059] Among them, the functional layer of the display substrate refers to a plurality of pixel units of the OLED display panel, the pixel unit includes a thin film transistor and a light-emitting layer, the light-emitting layer is electrically connected to the thin film transistor, and the light-emitting layer includes a cathode, an anode and a light-emitting material disposed between the cathode and the anode. Specifically, the light-emitting material of the OLED display panel can be an organic light-emitting semiconductor. OLED is also known as organic electroluminescence display or organic light-emitting semiconductor (Organic Electroluminescence Display, OLED). OLED is a current-type organic light-emitting device, which is a phenomenon of luminescence caused by the injection and recombination of carriers, and the luminous intensity is proportional to the injected current. Therefore, the OLED display panel has the advantages of faster response speed and higher contrast. In addition, the OLED display panel also has many advantages such as being thin and light, having better flexibility and curvature, and being able to display normally at minus 40 degrees.

[0060] Figure 7-Figure 9 A schematic structural diagram of cutting and tearing off the first protective film 20 is provided from a top view perspective.

[0061] When there is only one protective film, such as Figure 10-Figure 14 As shown in the schematic diagram of the process of cutting the display substrate 10 with only one protective film, the laser probe is completed on the base substrate 11 at one time; during the cutting movement, the track will cross, resulting in two laser radiation effects at the intersection position. The first time is absorbed by the first protective film 20, and the first protective film 20 is carbonized and disappears. The second time is equivalent to the direct laser probe directly radiating the upper surface of the OLED display panel 12, resulting in damage to the encapsulation layer on the surface of the OLED display panel 12, poor reliability of the OLED display panel 12, and the appearance of growing dark spots (GDS), such as Fig.14 shown.

[0062] The display substrate 10 provided in this embodiment can avoid the occurrence of GDS defects during the cutting process because it has two layers of protective films. The formation process of the display substrate 10 is as follows: Fig.15 and Fig.16 As shown, a first protective film 20 is first formed on the side of the encapsulation layer of the display substrate 10 away from the base substrate 11, and then a second protective film 30 is formed on the side of the first protective film 20 away from the base substrate 11. The second protective film 30 can be made of the same material as the first protective film 20, such as Fig.15 The second protective film 30 and the first protective film 20 may also be made of different materials, such as Fig.16 The two are shown to be made of different materials.

[0063] In some embodiments, Fig.15 , Fig.16As shown, the orthographic projection area of ​​the second protection film 30 is located within the orthographic projection range of the first protection film 20 on the base substrate 11 .

[0064] In this embodiment, the orthographic projection area of ​​the second protective film 30 is located within the orthographic projection range of the first protective film 20 on the base substrate 11, which means that the edge of the second protective film 30 is located on the inner side of the edge of the first protective film 20, and the two layers of protective film have a height difference in the thickness direction, which facilitates the tearing off of the excess second protective film 30 at the edge and improves work efficiency.

[0065] In some embodiments, Figure 2 , Fig.15 and Fig.16 As shown, barrier dams 13 are provided around the target OLED display panel A, and the target area B is located within the range of the barrier dams 13 .

[0066] In this embodiment, the barrier dam 13 is a strip-shaped protrusion provided around the target OLED display panel A. On the one hand, when the base substrate 11 is subjected to severe impact such as vibration, the barrier dam 13 can absorb most of the impact energy and reduce the risk of cracks in the base substrate 11. On the other hand, when cracks occur in the base substrate 11, the barrier dam 13 can prevent the cracks from continuing to expand. The target area B is located within the range of the barrier dam 13. On the one hand, it is convenient to use the barrier dam 13 as a reference to determine the position of the target area B. On the other hand, the target area B is located within the range of the barrier dam 13. When the first protective film 20 is cut, the barrier dam 13 can absorb the laser energy reaching its surface to avoid the generation of cracks, thereby ensuring the yield rate of the OLED display panel 12 after cutting.

[0067] In some embodiments, Figure 17-Figure 22 As shown, the first portion 31 is a triangular prism, a hexagonal prism or a cylinder, or the first portion 31 is an irregular hexahedral structure.

[0068] In this embodiment, the specific shape of the first portion 31 depends on the running trajectory of the cutting head 40 .

[0069] When the first portion 31 is a triangular prism structure, it can be understood that Fig.19 As shown, the cross section of the triangular prism structure is a triangle, and the detailed cutting steps of the second protective film 30 are as follows:

[0070] Step S11: First, cutting is performed along the boundary of the target area B to separate the target area B from the area to be torn off.

[0071] Step S12: starting from a point on the boundary line of the target area B, cutting the second protection film 30 along the gap 121 between adjacent target OLED display panels A.

[0072] Step S13: tear off the second protective film 30 outside the reserved target area B to obtain a protective film for the reserved area.

[0073] like Fig.17 is a schematic diagram of a cylindrical structure of the first part 31, Fig.18 The first part 31 is a schematic diagram of a hexagonal structure. When cutting along the boundary of the target area B, such as the cylindrical first part 31, the boundary of the target area B is circular, which can be completed in two times, and each movement trajectory is a semicircle. The boundary of the target area B of the triangular prism first part 31 is a triangle, and the boundary of the target area B of the hexagonal first part 31 is a quadrilateral, such as a square, rectangle and other regular quadrilaterals. The hexagonal prism can be a cuboid, cube and other hexahedron.

[0074] In addition, when cutting an irregular hexahedron, Fig. 22 As shown, on the one hand, the motion trajectory of the target area B can be controlled to be an irregular trapezoid, and on the other hand, the angle α between the extension line of the cutting head 40 and the second protective film 30 can be adjusted to be greater than or less than 90 degrees. By adjusting the angle α between the extension line of the cutting head 40 and the second protective film 30, the first part 31 can also be cut into a spherical shape, such as Fig.21 It can be understood that the sphere is not a complete sphere, but a spherical structure that is close to a sphere as a whole.

[0075] In some embodiments, Fig.17 , Fig.18 and Fig.19 As shown, the side length or diameter of the cross section of the first portion 31 parallel to the plane of the substrate 11 or the diameter of the inscribed circle is greater than or equal to 200 μm. For example, the side length or diameter or the diameter of the inscribed circle of the first portion 31 can be 210 μm, 220 μm, 250 μm, 270 μm, 300 μm, etc.

[0076] In this embodiment, the side length or diameter of the cross section of the first portion 31 parallel to the substrate 11 or the diameter of the inscribed circle determines the size of the cross-sectional area of ​​the first portion 31. When the thickness of the first portion 31 is constant, the volume of the first portion 31 is also determined. When the volume of the first portion 31 is larger, more laser energy is absorbed when the first protective film 20 is subsequently cut, so it is easier to avoid the possibility of generating carbon dots 14. In addition, the excess uncarbonized second protective film 30 can also be torn off manually.

[0077] In some embodiments, Figure 2As shown, when the second protective film 30 is cut, the angle α between the extension line of the cutting head 40 and the second protective film 30 is 45 degrees to 135 degrees; when the first protective film 20 is cut along the first direction and the second direction, the angle α between the extension line of the cutting head 40 and the first protective film 20 is 90 degrees.

[0078] In this embodiment, when the second protective film 30 is cut, the angle α between the extension line of the cutting head 40 and the second protective film 30 is not required to be strictly perpendicular. This is because the shape formed after cutting is only for the purpose of protecting the first protective film 20 when it is cut, and does not affect the final shape of the OLED display panel 12. Therefore, the angle α between the extension line of the cutting head 40 and the second protective film 30 can be appropriately relaxed, such as 45°-135°, such as 45°, 60°, 80°, 90°, 110°, 120°, 135°, etc. When the angle α between the extension line of the cutting head 40 and the second protective film 30 is less than 90°, the cross section of the first portion 31 formed by cutting along the direction perpendicular to the plane where the base substrate 11 is located is an inverted trapezoid, that is, the bottom area of ​​the trapezoid is smaller. When the angle α between the extension line of the cutting head 40 and the second protective film 30 is greater than 90°, the cross section of the first portion 31 formed by cutting along the direction perpendicular to the plane of the base substrate 11 is a regular trapezoid, that is, the bottom area of ​​the trapezoid is larger.

[0079] In some embodiments, the cutting head 40 is a laser beam. Using laser cutting can achieve contactless cutting and reduce pollution to the display substrate 10.

[0080] In some embodiments, Fig.15 , Fig.16 As shown, the first protective film 20 is a polyethylene terephthalate plastic spacer (PET), and the second protective film 30 is PET or polyimide (PI).

[0081] In this embodiment, PET or PI is convenient to make into film material. PET has good mechanical properties, and its impact strength is 3 to 5 times that of other films. It has good folding resistance, and is resistant to oil, fat, dilute acid, dilute alkali, and most solvents. It can play a good protective role when attached to the outside of the encapsulation layer. PI also has good mechanical properties, and good heat resistance and radiation resistance. Therefore, it can be attached to the outside of the first protective film 20 for protection. Its heat resistance can just withstand the high temperature during laser cutting.

[0082] In some embodiments, Fig.15 As shown, when the second protective film 30 is made of polyethylene terephthalate plastic, the first protective film 20 and the second protective film 30 have the same thickness; Fig.16When the second protective film 30 is PI, the thickness of the second protective film 30 is smaller than the thickness of the first protective film 20 .

[0083] In this embodiment, when the first protective film 20 and the second protective film 30 are made of the same material, the thickness of the two can be made equal, so that during laser cutting, there is no need to adjust the energy of the laser beam, which can simplify the cutting method. When the first protective film 20 and the second protective film 30 are made of different materials, the parameters of the cutting method can be determined based on the difficulty of cutting the two materials, with a certain thickness of one of the materials as the standard, and then the thickness of the other material can be determined based on the parameter, so that when cutting the two materials, there is no need to adjust the cutting method parameters, simplifying the cutting method process. According to this principle, when the first protective film 20 is PET and the second protective film 30 is PI, since the cutting difficulty of PI is greater than that of PET, the thickness of the second protective film PI is less than the thickness of the first protective film PET.

[0084] In some embodiments, the thickness of polyethylene terephthalate plastic is 60μm-80μm, such as 60μm, 65μm, 70μm, 75μm, 80μm, etc., and the thickness of polyimide is 40μm-60μm, such as 40μm, 45μm, 50μm, 55μm, 60μm.

[0085] In this embodiment, the thickness of PET is 60 μm-80 μm, which can play a good protective role, and the thickness of PI is 40 μm-60 μm, which can absorb the laser energy during the first cutting at the cross-cutting point.

[0086] The OLED display panel 12 prepared by the above method only patterns the first protective film 20, but does not cut and split the bottom large-sized substrate 11 to form independent display panels of the required size. The cutting process is generally performed by downstream manufacturers, so a large-sized substrate 11 and multiple OLED display panels 12 thereon are packaged and transported together during transportation. After packaging and transporting to the OEM factory, the OEM factory first needs to thin the substrate 11, such as a glass substrate. This is because the thickness of the glass substrate is generally thicker when preparing the OLED display panel 12, generally about 300μm-500μm, which can increase the strength of the glass substrate and is not easily damaged during transportation. Cutting the glass substrate after thinning can reduce the difficulty of cutting, and after thinning, the glass substrate has better flexibility and is not easy to produce defects such as cracks during cutting. Optionally, the glass substrate is thinned to about 150μm-300μm and then cut, for example, it can be thinned to 150μm, 200μm, 250μm, etc.

[0087] A second aspect of the present application provides an OLED display panel 12 , and the OLED display panel 12 is obtained by the above-mentioned method for preparing the OLED display panel 12 .

[0088] The OLED display panel 12 manufactured by the above manufacturing method is not prone to carbonization of the encapsulation layer, so the yield rate of the OLED display panel 12 can be improved.

[0089] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0090] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0091] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A method for preparing an OLED display panel, characterized in that: At least the following steps are included: Obtain a display substrate, wherein the display substrate is disposed on a base substrate, the display substrate comprises a functional layer and an encapsulation layer, and along a direction away from the base substrate, a first protective film and a second protective film are sequentially disposed on a side of the encapsulation layer away from the base substrate, and an orthographic projection of the display substrate on the base substrate is located within the orthographic projection range of the first protective film and the second protective film on the base substrate; Determine the boundary position of the target OLED display panel; Determine a target area of ​​the target OLED display panel, where the target area is located at four vertex corners of the boundary position of the OLED display panel, and the vertex corners are the boundaries or the center of the target area; Cutting the second protective film, leaving a first portion of the second protective film whose orthographic projection is located in the target area, and tearing off the remaining portion of the second protective film; Taking the first portion as an intersection, the first protective film is cut along a first direction and a second direction to four sides of the target display substrate, respectively, wherein the first direction and the second direction are respectively parallel to two sides of the target display substrate that intersect with each other; The first protective film outside the cutting line formed in the first direction or the second direction is torn off to obtain a target OLED display panel with the first protective film attached thereto, wherein the outside refers to a side away from the edge of the display substrate.

2. The method for preparing an OLED display panel according to claim 1, characterized in that: The orthographic projection area of ​​the second protective film is located within the orthographic projection range of the first protective film on the base substrate.

3. The method for preparing an OLED display panel according to claim 1, characterized in that: The target OLED display panel is provided with blocking dams around its periphery, and the target area is located within the range of the blocking dams.

4. The method for preparing an OLED display panel according to claim 1, wherein: The first part is a triangular prism, a hexagonal prism or a cylinder, or the first part is an irregular hexahedral structure.

5. The method for preparing an OLED display panel according to claim 4, characterized in that: The side length or diameter of the cross section of the first portion along a direction parallel to the plane where the substrate is located, or the diameter of the inscribed circle is greater than or equal to 200 μm.

6. The method for preparing an OLED display panel according to claim 1, characterized in that: When cutting the second protective film, the angle between the extension line of the cutting head and the second protective film is 45 degrees to 135 degrees; When the first protective film is cut along the first direction and the second direction, the angle between the extension line of the cutting head and the first protective film is 90 degrees.

7. The method for preparing an OLED display panel according to claim 1, characterized in that: The cutting head is a laser beam.

8. The method for preparing an OLED display panel according to any one of claims 1 to 7, characterized in that: The first protective film is a polyethylene terephthalate plastic gasket, and the second protective film is polyethylene terephthalate plastic or polyimide.

9. The method for preparing an OLED display panel according to claim 8, characterized in that: When the second protective film is made of polyethylene terephthalate plastic, the first protective film and the second protective film have the same thickness.

10. The method for preparing an OLED display panel according to claim 8, characterized in that: When the second protective film is made of polyimide, the thickness of the second protective film is smaller than the thickness of the first protective film.

11. The method for preparing an OLED display panel according to claim 8, characterized in that: The thickness of the polyethylene terephthalate plastic is 60 μm-80 μm, and the thickness of the polyimide is 40 μm-60 μm.

12. An OLED display panel, characterized in that: The OLED display panel is obtained by the method for preparing an OLED display panel according to any one of claims 1 to 11.

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