Copper powder sintering surface communicating micro-channel heat dissipation heat sink device and preparation method thereof

Abstract

The invention belongs to the technical field of chip heat dissipation, and discloses a copper powder sintering surface communicating micro-channel heat dissipation heat sink device and a preparation method thereof.The preparation of a heat sink surface communicating micro-channel is achieved by utilizing the heat conductivity and sintering performance of copper powder and combining the micro-channel structural design, and compared with a traditional preparation process, the preparation process is simple, the cost is low, and the production efficiency is high. The radiator is simple in structure, low in cost and higher in heat dissipation efficiency and heat conduction performance, meanwhile, copper powder is used as a preparation material, so that the radiator has good plasticity, and shape design and customized manufacturing can be conducted according to actual needs; the problems that in the prior art, a micro-channel radiator is complex in preparation process and high in cost and cannot meet the requirements for the shape, size, material and the like of the radiator in special scenes are solved, and the micro-channel radiator is suitable for the fields of electronic devices, photoelectric devices and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a copper powder sintered surface connected microchannel heat sink device and a preparation method thereof. Background Art

[0002] With the continuous development of electronic products and the expansion of their application fields, the demand for heat dissipation is becoming increasingly prominent. Microchannel heat dissipation technology is an important technical means to solve the heat dissipation problem of high-power electronic devices. Compared with traditional fan heat dissipation, aluminum plate heat dissipation and other methods, microchannel heat sinks can quickly export heat through micro channels, and have the advantages of high heat dissipation efficiency, small size and light weight.

[0003] However, the existing microchannel heat sink preparation process is complicated, requires expensive preparation equipment and materials, has high manufacturing costs, and cannot meet the requirements for heat sink shape, size, material, etc. in certain special scenarios.

[0004] Therefore, the present invention proposes a method for preparing a microchannel heat dissipation structure, which realizes the preparation of microchannels connected to the surface of the heat sink by utilizing the thermal conductivity and sintering properties of copper powder and combining the microchannel structure design.

[0005] content

[0006] The present invention is intended to provide a copper powder sintered surface connected microchannel heat sink device and its preparation method, so as to solve the problems of complicated preparation process and high cost of microchannel heat sink in the prior art and the problem of failure to meet the requirements of heat sink shape, size, material and other aspects in special scenarios.

[0007] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0008] A copper powder sintered surface connected microchannel heat dissipation heat sink device comprises a microchannel template and a graphite mold, the microchannel template comprises a substrate and a microchannel structure obtained on the substrate by etching or machining, the graphite mold is connected up and down, and the internal structure of the graphite mold is adapted to the microchannel structure; when the graphite mold is assembled and connected with the microchannel template, a gap is left between the graphite mold and the microchannel structure.

[0009] Preferably, the microchannel template is made of copper.

[0010] A copper powder sintered surface connected microchannel heat sink device and a preparation method thereof, comprising the following steps:

[0011] S1. Processing is performed on a substrate according to the desired microchannel structure to obtain a microchannel template, and a graphite mold adapted to the microchannel template is obtained by processing, and the raw materials are prepared to include at least copper powder and an organic binder;

[0012] S2, assembling the microchannel template and the graphite mold, and reserving a gap between the microchannel template and the graphite mold;

[0013] S3, filling the copper powder into the gap between the microchannel template and the graphite mold, and shaking to make the copper powder evenly fill the gap;

[0014] S4, placing the microchannel template filled with copper powder in step S3 into a tubular furnace for sintering, and setting a sintering program in the furnace, including a maximum temperature of 950° C. and a holding time of 90 minutes;

[0015] S5. Perform surface treatment on the sintered microchannel structure heat sink to remove residual copper powder.

[0016] Preferably, the thickness of the microporous layer is determined by changing the size of the graphite mold in step S1.

[0017] Preferably, the copper powder in step S1 is electrolytic copper powder with a mesh size of 100-300, and the organic binder is acetone.

[0018] Preferably, the atmosphere in the furnace in step S4 is set to 5% hydrogen and 95% nitrogen.

[0019] The principle of the technical solution is: copper powder is filled into the gap between the microchannel template and the graphite mold, and the copper powder is evenly filled in the gap between the microchannel template and the graphite mold by shaking. The filled copper powder forms a microchannel structure by sintering, and the thermal conductivity and sintering properties of the copper powder are combined with the design of the microchannel structure to realize the preparation of microchannels connected to the surface of the radiator; the atmosphere in the furnace is set to 5% hydrogen and 95% nitrogen to prevent the sample from being oxidized during the sintering process.

[0020] The beneficial effect of the technical solution is: the present invention utilizes the thermal conductivity and sintering properties of copper powder and combines it with the microchannel structure design to achieve the preparation of microchannels connected on the surface of the radiator. Compared with the existing technology, the present invention has the advantages of simple preparation process, low cost, high heat dissipation efficiency, etc. The radiator can be widely used in electronic devices, optoelectronic devices and other fields, and has important application prospects and economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of a microchannel template in an embodiment of the present invention;

[0022] Figure 2 This is a structural diagram of a graphite mold in an embodiment of the present invention;

[0023] Figure 3 It is an assembly diagram of a microchannel template and a graphite mold in an embodiment of the present invention;

[0024] Figure 4It is a partial side cross-sectional view of the microchannel template and the graphite mold after being assembled and filled with copper powder in an embodiment of the present invention;

[0025] The names of the corresponding marks in the drawings are: microchannel template 1, substrate 11, microchannel structure 12, graphite mold 2, copper powder 3. DETAILED DESCRIPTION

[0026] The present invention is further described in detail below with reference to the accompanying drawings and implementation modes:

[0027] like Figure 1 The figure shows a microchannel template 1 in a copper powder sintered surface connected microchannel heat sink device, the bottom of which is a copper-based substrate 11, and the top of the substrate 11 is processed to form a microchannel structure 12.

[0028] like Figure 2 The figure shows a graphite mold 2 in a copper powder sintered surface connected microchannel heat sink device. The graphite mold 2 is connected from top to bottom, and the internal structure of the graphite mold 2 is adapted to the microchannel structure 12.

[0029] like Figure 3 As shown, the graphite mold 2 can be assembled on the microchannel template 1. After the graphite mold 2 is assembled on the microchannel template 1, a certain gap is left between the microchannel structure 12 and the internal structure of the graphite mold 2 for filling the copper powder 3.

[0030] Figure 4 This is a side partial cross-sectional view of the microchannel template 1 after being filled with copper powder 3. There are gaps between the microchannel structure 12 and both sides of the internal structure of the graphite mold 2. There is also a gap between the bottom of the internal structure of the graphite mold 2 and the microchannel structure 12. The gaps are evenly filled with copper powder 3.

[0031] The specific implementation process is as follows:

[0032] Step 1, obtain a microchannel structure 12 on a microchannel template 1 by processing, such as Figure 1 As shown, the internal structure of the graphite mold 2 is adapted to the microchannel structure 12 by processing, as shown in FIG. Figure 2 As shown, copper powder (electrolytic copper powder, 100-300 mesh), organic binder (glycerol) and the like are prepared as raw materials;

[0033] Step 2, assemble the microchannel template 1 and the graphite mold 2, and reserve a certain gap between the internal structure of the graphite mold 2 and the microchannel structure 12, such as Figure 3 As shown;

[0034] Step 3, fill the copper powder 3 into the gap between the microchannel structure 12 and the graphite mold 2, and shake the entire device to make the copper powder 3 evenly fill the gap. The partial side cross-sectional view of the device filled with copper powder 3 is shown in FIG. Figure 4 As shown;

[0035] Step 4, placing the device filled with copper powder 3 into a tubular furnace for sintering, setting the sintering program in the furnace, setting the maximum temperature to 950° C., and maintaining the sintering time for 90 minutes. In order to prevent the sample from being oxidized during the sintering process, the atmosphere in the furnace is set to 5% hydrogen and 95% nitrogen;

[0036] Step 5: Surface treatment is performed on the sintered microchannel heat sink to remove residual copper powder and obtain the microchannel heat sink.

[0037] The above is only an embodiment of the present invention, and the common knowledge such as the known specific technical solutions or characteristics in the solution is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the technical solution, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A heat sink device with a sintered copper powder surface connected to a microchannel, characterized in that: The invention comprises a microchannel template and a graphite mold, wherein the microchannel template comprises a substrate and a microchannel structure obtained on the substrate by etching or machining, the graphite mold is connected up and down, and the internal structure of the graphite mold is adapted to the microchannel structure; when the graphite mold is assembled and connected with the microchannel template, a gap is left between the graphite mold and the microchannel structure.

2. A copper powder sintered surface connected microchannel heat sink device according to claim 1, characterized in that: The microchannel template is made of copper.

3. A copper powder sintered surface connected microchannel heat sink device and a preparation method thereof according to claim 1, comprising the following steps: S1. Processing is performed on a substrate according to the desired microchannel structure to obtain a microchannel template, and a graphite mold adapted to the microchannel template is obtained by processing, and the raw materials are prepared to include at least copper powder and an organic binder; S2, assembling the microchannel template and the graphite mold, and reserving a gap between the microchannel template and the graphite mold; S3, filling the copper powder into the gap between the microchannel template and the graphite mold, and shaking to make the copper powder evenly fill the gap; S4, placing the microchannel template filled with copper powder in step S3 into a tubular furnace for sintering, and setting a sintering program in the furnace, including a maximum temperature of 950° C. and a holding time of 90 minutes; S5. Surface treatment is performed on the sintered microchannel structure heat sink to remove residual copper powder.

4. A copper powder sintered surface connected microchannel heat sink device and a preparation method thereof according to claim 3, characterized in that: The thickness of the microporous layer is determined by changing the size of the graphite mold in step S1.

5. A copper powder sintered surface connected microchannel heat sink device and a preparation method thereof according to claim 3, characterized in that: The copper powder in step S1 is electrolytic copper powder with a mesh size of 100-300, and the organic binder is glycerol.

6. A copper powder sintered surface connected microchannel heat sink device and a preparation method thereof according to claim 3, characterized in that: In step S4, the atmosphere in the furnace is set to 5% hydrogen and 95% nitrogen.

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