Resin composition, layer-adding film, preparation method of layer-adding film and packaging substrate

Abstract

The invention relates to the technical field of packaging substrates, in particular to a resin composition, a layer-adding film, a preparation method of the layer-adding film and a packaging substrate. The resin composition is prepared from the following raw materials in parts by weight: 10 to 40 parts of modified polyphenyl ether prepolymer, 10 to 50 parts of functional resin, 10 to 50 parts of curing agent, 1 to 10 parts of curing accelerator and 50 to 300 parts of inorganic filler, wherein the modified polyphenyl ether prepolymer is prepared from the following raw materials: acrylate type polyphenyl ether resin and an amine phosphorus-containing compound. The cured product of the resin composition provided by the invention has the flame retardant rating reaching UL94V0, high glass-transition temperature, good heat resistance, extremely low thermal expansion coefficient, low water absorption and extremely strong dielectric property, and is suitable for preparing a high-performance packaging carrier plate.

Description

Technical Field

[0001] The present application relates to the technical field of packaging carriers, and in particular to a resin composition, a build-up film and a preparation method thereof, and a packaging carrier. Background Art

[0002] As electronic products develop towards miniaturization, lightness, high functionality and high safety, electronic circuits are also developing towards multi-layer and high wiring density. Among them, Flip Chip Ball Grid Array (FCBGA) technology is an advanced packaging process that flips the chip upside down and attaches it to the carrier, and connects the chip and the carrier through solder balls to achieve electrical connection and signal transmission. FCBGA technology performs well in high speed, high density and high reliability, and is widely used in computer, communication, medical, consumer electronics and industrial control.

[0003] Compared with other packaging substrate technologies, FCBGA technology has higher integration, smaller packaging volume, higher reliability and lower power consumption, so it puts forward higher requirements on the performance of its main raw material, build-up film, such as low thermal expansion coefficient, high heat resistance, high flame retardancy and excellent dielectric properties. Among them, the thermal expansion coefficient and heat resistance of the build-up film directly affect the dimensional stability and reliability of electronic devices, the flame retardancy will affect the reliability of the product, and the dielectric properties will affect the signal transmission speed of the product. However, traditional resin compositions cannot have low thermal expansion coefficient, high heat resistance, high flame retardancy and excellent dielectric properties, and are difficult to be used in the production of build-up films for FCBGA technology. Summary of the invention

[0004] Based on this, it is necessary to provide a resin composition, a build-up film and a preparation method thereof, and a packaging carrier to solve the problem that traditional resin compositions cannot have low thermal expansion coefficient, high heat resistance, high flame retardancy and excellent dielectric properties, and are difficult to be applied to the preparation of build-up films for FCBGA technology.

[0005] The above-mentioned purpose of the present application is achieved through the following technical solutions:

[0006] In a first aspect of the present application, a resin composition is provided, comprising the following raw materials in parts by weight:

[0007] ;

[0008] The raw materials of the modified polyphenylene ether prepolymer include acrylate polyphenylene ether resin and amine phosphorus-containing compound, and the amine phosphorus-containing compound has a structure as shown in general formula (I):

[0009] (I).

[0010] In some embodiments, the acrylate polyphenylene ether resin has a structure as shown in the general formula (III):

[0011] (III);

[0012] Wherein, m and n are each independently selected from positive integers, and the sum of m and n is 5 to 60;

[0013] Y is absent or selected from C1-C3 alkylene.

[0014] In some embodiments, the mass ratio of the acrylic ester polyphenylene ether resin to the amine phosphorus-containing compound is 100:(50-100).

[0015] In some embodiments, the method for preparing the modified polyphenylene ether prepolymer comprises the following steps:

[0016] The acrylate polyphenylene ether resin and the amine phosphorus-containing compound are mixed and prepolymerized at 100° C. to 150° C. for 60 min to 180 min to obtain the modified polyphenylene ether prepolymer.

[0017] In some embodiments, the functional resin includes one or more of an epoxy resin, a benzoxazine resin, and a hydrocarbon resin.

[0018] In some embodiments, the epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene epoxy resin, phosphorus-containing epoxy resin, unsaturated epoxy resin, phenolic epoxy resin, o-cresol epoxy resin, bisphenol A phenolic epoxy resin, multifunctional epoxy resin, alicyclic epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin and dicyclopentadiene epoxy resin.

[0019] In some embodiments, the benzoxazine resin includes one or more of bisphenol A-type benzoxazine resin, bisphenol F-type benzoxazine resin, bisphenol S-type benzoxazine resin, main chain benzoxazine resin, phosphorus-containing benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl-type benzoxazine resin, tetraphenol ethane benzoxazine resin and naphthalene-type benzoxazine resin.

[0020] In some embodiments, the hydrocarbon resin includes one or more of polybutadiene and styrene-butadiene copolymer.

[0021] In some embodiments, the curing agent includes one or more of an amine curing agent, a phenolic curing agent, an anhydride curing agent, a cyanate curing agent, an active ester curing agent, and an olefin curing agent.

[0022] In some embodiments, the curing accelerator includes one or more of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organic phosphorus accelerator, and a transition metal carboxylate accelerator.

[0023] In some embodiments, the inorganic filler includes one or more of modified silica and modified alumina.

[0024] In some embodiments, the resin composition further comprises an auxiliary agent and a solvent, wherein the auxiliary agent comprises one or more of a dispersant, a leveling agent, a defoaming agent and a coupling agent.

[0025] In a second aspect of the present application, a build-up film is provided, comprising the resin composition as described above.

[0026] In a third aspect of the present application, a method for preparing a build-up film is provided, comprising the following steps:

[0027] Covering the resin composition as described above on a support to obtain a liquid film;

[0028] The liquid film is dried to obtain the build-up layer film.

[0029] In some embodiments, the drying process comprises the following steps: constant temperature drying at 80°C to 180°C for 5 min to 20 min.

[0030] In some embodiments, the support includes one or more of a polymer film and a metal foil.

[0031] In some embodiments, the thickness of the support body is 3 μm to 105 μm.

[0032] In some embodiments, the thickness of the liquid film is 5 μm to 150 μm.

[0033] In a fourth aspect of the present application, a packaging carrier is provided, comprising the resin composition as described above, or comprising the build-up film as described above, or comprising a build-up film prepared by the method for preparing the build-up film as described above.

[0034] This application has at least the following beneficial effects:

[0035] In the resin composition provided by the present application, the modified polyphenylene ether prepolymer is prepolymerized by an acrylate polyphenylene ether resin and an amine phosphorus-containing compound, and its molecular structure contains a polyphenylene ether structure, a DOPO group, a naphthalene ring and an amino group; wherein, the introduction of high-rigidity benzene rings, biphenyl rings and naphthalene rings can reduce the structural symmetry of the prepolymer to improve the compatibility of the prepolymer with the functional resin, and significantly reduce the thermal expansion coefficient while improving the glass transition temperature, heat resistance and dielectric properties; the introduction of DOPO groups and amino groups can achieve more stable and lasting flame retardant properties through the synergistic effect of nitrogen and phosphorus elements. At the same time, the modified polyphenylene ether prepolymer, functional resin, curing agent, curing accelerator and inorganic filler are synergistically acted in a specific ratio, which greatly reduces the number of polar groups in the composition, thereby effectively improving the dielectric properties. Therefore, the cured product of the resin composition provided by the present application has a flame retardant grade of UL94V0, a ​​high glass transition temperature, good heat resistance, extremely low thermal expansion coefficient, low water absorption and extremely strong dielectric properties, and is suitable for preparing high-performance packaging substrates. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present application, the present application is further described in detail below in conjunction with specific embodiments. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0038] In the present application, the meaning of "and / or" includes any and all combinations of one or more related listed items. "At least one" means more than one, such as one, two and more than two. "Multiple" or "several" means at least two, such as two, three, etc., and "multi-layer" means at least two layers, such as two layers, three layers, etc., unless otherwise clearly and specifically defined. In the description of the present application, "several" means at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0039] When a numerical range is disclosed in this application, the above range is considered to be continuous and includes the minimum and maximum values ​​of the range, as well as every value between such minimum and maximum values. Further, when a range refers to an integer, every integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be combined. In other words, unless otherwise indicated, all ranges disclosed in this application should be understood to include any and all subranges included therein.

[0040] Unless otherwise specified, all steps of the present application may be performed sequentially or randomly. For example, the method includes steps (a) and (b), which means that the method may include steps (a) and (b) performed sequentially, or may include steps (b) and (a) performed sequentially. For example, the method may also include step (c), which means that step (c) may be added to the method in any order. For example, the method may include steps (a), (b) and (c), or may include steps (a), (c) and (b), or may include steps (c), (a) and (b), etc.

[0041] In this application, "above" or "below" includes the number itself. For example, "1 below" includes 1.

[0042] The temperature parameters in this application, unless otherwise specified, are allowed to be either constant temperature treatment or to vary within a certain temperature range. It should be understood that the constant temperature treatment allows the temperature to fluctuate within the accuracy range controlled by the instrument. Fluctuations within the range of ±5°C, ±4°C, ±3°C, ±2°C, and ±1°C are allowed.

[0043] In the present application, room temperature refers to indoor temperature, normal temperature or general temperature. Generally speaking, the range of room temperature can be any one of the following temperature intervals: 23°C ± 2°C, 25°C ± 5°C or 20°C ± 5°C.

[0044] the term

[0045] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0046] In the present application, when a substituent with the same symbol appears multiple times, each substituent may be the same or different from each other. For example, when a general formula contains multiple R, R may be the same or different from each other.

[0047] "Alkyl" refers to a monovalent residue formed by the loss of a hydrogen atom from a saturated hydrocarbon containing a primary (normal) carbon atom, a secondary carbon atom, a tertiary carbon atom, a quaternary carbon atom, or a combination thereof. Alkyl can represent a straight chain, branched and / or cyclic alkyl group. The carbon number of the alkyl group can be 1 to 50, 1 to 30, 1 to 20, 1 to 10 or 1 to 6. Phrases containing this term, for example, "C1 to C9 alkyl" refers to an alkyl group containing 1 to 9 carbon atoms, and each occurrence can be independently C1 alkyl, C2 alkyl, C3 alkyl, C4 alkyl, C5 alkyl, C6 alkyl, C7 alkyl, C8 alkyl or C9 alkyl. Suitable examples include, but are not limited to, methyl (Me, -CH3), ethyl (Et, -CH2CH3), 1-propyl (n-Pr, n-propyl, -CH2CH2CH3), 2-propyl (i-Pr, i-propyl, -CH(CH3)2), 1-butyl (n-Bu, n-butyl, -CH2CH2CH2CH3), 2-methyl-1-propyl (i-Bu, i-butyl, -CH2CH(CH3)2), 2-butyl (s-Bu, s-butyl, -CH(C H3)CH2CH3), 2-methyl-2-propyl (t-Bu, t-butyl, -C(CH3)3), 1-pentyl (n-pentyl, -CH2CH2CH2CH2CH3), 2-pentyl (-CH(CH3)CH2CH2CH3), 3-pentyl (-CH(CH2CH3)2), 2-methyl-2-butyl (-C(CH3)2CH2CH3), 3-methyl-2-butyl (-CH(CH3)CH(CH3)2), 3-methyl-1-butyl (- CH2CH2CH(CH3)2), 2-methyl-1-butyl (-CH2CH(CH3)CH2CH3), 1-hexyl (-CH2CH2CH2CH2CH2CH3), 2-hexyl (-CH(CH3)CH2CH2CH2CH3), 3-hexyl (-CH(CH2CH3)(CH2CH2CH3)), 2-methyl-2-pentyl (-C(CH3)2CH2CH2CH3), 3-methyl-2-pentyl (-CH(CH3)CH( CH3)CH2CH3), 4-methyl-2-pentyl (-CH(CH3)CH2CH(CH3)2), 3-methyl-3-pentyl (-C(CH3)(CH2CH3)2), 2-methyl-3-pentyl (-CH(CH2CH3)CH(CH3)2), 2,3-dimethyl-2-butyl (-C(CH3)2CH(CH3)2), 3,3-dimethyl-2-butyl (-CH(CH3)C(CH3)3, octyl (-(CH2)7CH3).

[0048] "Alkylene" refers to a hydrocarbon group with two monovalent radical centers derived from an alkyl group by removing a hydrogen atom, which can be a saturated branched alkyl group or a saturated straight-chain alkyl group. For example, "C1-C9 alkylene" means that the alkyl portion contains 1 to 9 carbon atoms, and each occurrence can be independently C1 alkylene, C4 alkylene, C5 alkylene, C6 alkylene, C7 alkylene, C8 alkylene or C9 alkylene. Suitable examples include, but are not limited to, methylene (-CH2-), 1,1-ethyl (-CH(CH3)-), 1,2-ethyl (-CH2CH2-), 1,1-propyl (-CH(CH2CH3)-), 1,2-propyl (-CH2CH(CH3)-), 1,3-propyl (-CH2CH2CH2-) and 1,4-butyl (-CH2CH2CH2CH2-).

[0049] In the first aspect of the present application, a resin composition is provided to solve the problem that traditional resin compositions cannot have low thermal expansion coefficient, high heat resistance, high flame retardancy and excellent dielectric properties and are difficult to be applied to the preparation of build-up films of FCBGA technology.

[0050] In some embodiments, the resin composition includes the following raw materials in parts by weight:

[0051] ;

[0052] The raw materials of the modified polyphenylene ether prepolymer include acrylate polyphenylene ether resin and amine phosphorus-containing compound, and the amine phosphorus-containing compound has a structure as shown in the general formula (I):

[0053] (I).

[0054] It can be understood that 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, referred to as DOPO, has a structure as shown in the general formula (II):

[0055] (II);

[0056] The molecular structure of DOPO contains biphenyl rings and cyclic O=PO bonds, and compared with traditional non-annulated organic phosphates, it has very excellent thermal stability, chemical stability and halogen-free flame retardancy. The amine phosphorus-containing compound in this application contains two DOPO groups, three naphthalene rings and four amino groups (2 -NH2 and 2 -NH-), which is conducive to reducing the thermal expansion coefficient, giving it excellent heat resistance and lasting flame retardancy, and the amino group can combine with the acrylate group in the acrylate polyphenylene ether resin to form a prepolymer.

[0057] In the resin composition provided by the present application, the modified polyphenylene ether prepolymer is prepolymerized by an acrylate polyphenylene ether resin and an amine phosphorus-containing compound, and its molecular structure contains a polyphenylene ether structure, a DOPO group, a naphthalene ring and an amino group; wherein, the introduction of high-rigidity benzene rings, biphenyl rings and naphthalene rings can reduce the structural symmetry of the prepolymer to improve the compatibility of the prepolymer with the functional resin, and significantly reduce the thermal expansion coefficient while improving the glass transition temperature, heat resistance and dielectric properties; the introduction of DOPO groups and amino groups can achieve more stable and lasting flame retardant properties through the synergistic effect of nitrogen and phosphorus elements. At the same time, the modified polyphenylene ether prepolymer, functional resin, curing agent, curing accelerator and inorganic filler are synergistically acted in a specific ratio, which greatly reduces the number of polar groups in the composition, thereby effectively improving the dielectric properties. Therefore, the cured product of the resin composition provided by the present application has a flame retardant grade of UL94V0, a ​​high glass transition temperature, good heat resistance, extremely low thermal expansion coefficient, low water absorption and extremely strong dielectric properties, and is suitable for preparing high-performance packaging substrates.

[0058] As an example, in the resin composition, the weight parts of the modified polyphenylene ether prepolymer include but are not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts or 40 parts, and can be further selected as 10 parts to 30 parts.

[0059] As an example, in the resin composition, the weight proportion of the functional resin includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts, 48 ​​parts or 50 parts, and may further be 10 parts to 40 parts.

[0060] As an example, in the resin composition, the weight of the curing agent includes but is not limited to 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts, 48 ​​parts or 50 parts, and can be further selected as 10 parts to 40 parts.

[0061] As an example, in the resin composition, the weight of the curing accelerator includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts, and can be further selected as 1 part to 5 parts.

[0062] As an example, in the resin composition, the weight of the inorganic filler includes but is not limited to 50 parts, 80 parts, 100 parts, 120 parts, 140 parts, 160 parts, 180 parts, 200 parts, 220 parts, 240 parts, 260 parts, 280 parts or 300 parts, and can further be selected as 100 parts to 250 parts.

[0063] In some embodiments, the resin composition includes the following raw materials in parts by weight:

[0064] .

[0065] In some embodiments, the resin composition includes the following raw materials in parts by weight:

[0066] .

[0067] In some embodiments, the acrylate polyphenylene ether resin has a structure as shown in the general formula (III):

[0068] (III);

[0069] Wherein, m and n are each independently selected from positive integers, and the sum of m and n is 5 to 60;

[0070] Y is absent or selected from C1~C3 alkylene;

[0071] The molecular structure of polyphenylene oxide (PPO) resin contains a large number of benzene rings and does not contain strong polar groups, which gives it excellent properties such as high glass transition temperature (glass transition temperature, Tg), low coefficient of thermal expansion (coefficient of thermal expansion, CTE), low dielectric constant (dielectric constant, Dk) and low dielectric loss (dissipation factor, Df). Modification of polyphenylene oxide resin and introduction of unsaturated groups such as olefinic, alkynyl or acrylate groups can improve compatibility and reduce melt viscosity.

[0072] As an example, in the acrylate polyphenylene ether resin, m and n are each independently selected from a positive integer, and the sum of m and n includes but is not limited to 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55 or 60; Y is not present, or Y is selected from a C1 alkylene, a C2 alkylene or a C3 alkylene, suitable examples of which include: -CH2-, -CH(CH3)-, -CH2CH2-, -CH(CH2CH3)-, -CH2CH(CH3)-, -CH2CH2CH2-.

[0073] In some embodiments, the mass ratio of the acrylate polyphenylene ether resin to the amine phosphorus-containing compound is 100:(50-100). As an example, the mass ratio of the acrylate polyphenylene ether resin to the amine phosphorus-containing compound includes but is not limited to 100:50, 100:55, 100:60, 100:65, 100:70, 100:75, 100:80, 100:85, 100:90, 100:95 or 100:100.

[0074] By controlling the mass ratio of acrylate polyphenylene ether resin and amine phosphorus-containing compound, the content of polyphenylene ether structure, DOPO group, naphthalene ring and amino group in the modified polyphenylene ether prepolymer can be regulated, thereby improving its compatibility, thermal expansion coefficient, glass transition temperature, flame retardancy and dielectric properties.

[0075] In some embodiments, the method for preparing the modified polyphenylene ether prepolymer comprises the following steps:

[0076] The acrylic ester polyphenylene ether resin and the amine phosphorus-containing compound are mixed and prepolymerized at 100° C. to 150° C. for 60 min to 180 min to obtain a modified polyphenylene ether prepolymer.

[0077] As an example, the reaction temperature of the prepolymerization reaction includes but is not limited to 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C or 150°C, and can be further selected as 120°C~140°C; the reaction time of the prepolymerization reaction includes but is not limited to 60min, 70min, 80min, 90min, 100min, 110min, 120min, 130min, 140min, 150min, 160min, 170min or 180min, and can be further selected as 120min~150min.

[0078] In some embodiments, the method of mixing the acrylate polyphenylene ether resin and the amine phosphorus-containing compound comprises the following steps: heating at 100° C. to 150° C. to melt the amine phosphorus-containing compound, and adding the acrylate polyphenylene ether resin.

[0079] As an example, the temperature of the heating treatment includes but is not limited to 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C or 150°C, and can further be 120°C~135°C.

[0080] In some embodiments, after the prepolymerization reaction, a step of cooling to room temperature is further included.

[0081] In some embodiments, the functional resin includes one or more of an epoxy resin, a benzoxazine resin, and a hydrocarbon resin.

[0082] It can be understood that the functional resin can be selected from any one of epoxy resin, benzoxazine resin and hydrocarbon resin, or can be selected from at least two of epoxy resin, benzoxazine resin and hydrocarbon resin, such as epoxy resin and benzoxazine resin, epoxy resin and hydrocarbon resin, benzoxazine resin and hydrocarbon resin.

[0083] Among the above functional resins, the molecular structure of benzoxazine resin contains benzene rings and six-membered oxazine rings, and the molecular polarity is low, which makes the dielectric constant relatively low and the dielectric loss small, and has excellent dielectric properties; the cross-linked network formed by curing of benzoxazine resin is relatively tight, the intermolecular force is strong, and the thermal expansion coefficient is low; at the same time, it has high heat resistance, the glass transition temperature is above 150°C, the curing shrinkage is almost 0, the halogen-free flame retardancy is good, the water absorption rate is low, and the elastic modulus is good. The molecular structure of hydrocarbon resin contains only two elements, carbon and hydrogen, does not contain heteroatoms, and has very few polar groups, and has good dielectric properties. Epoxy resin can be cured and cross-linked to form a network structure, which has excellent physical and mechanical properties, electrical insulation properties, bonding properties and processing properties, but its molecular structure contains polar groups such as epoxy and hydroxyl groups, which makes its dielectric constant and dielectric loss relatively high. By rationally matching functional resins of different components, the number of polar groups in the cured product of the resin composition can be greatly reduced, further improving its dielectric properties, and maintaining an extremely low thermal expansion coefficient, excellent heat resistance and good halogen-free flame retardancy in the cured product.

[0084] In some embodiments, the epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene epoxy resin, phosphorus-containing epoxy resin, unsaturated epoxy resin, phenolic epoxy resin, o-cresol epoxy resin, bisphenol A phenolic epoxy resin, multifunctional epoxy resin, alicyclic epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin and dicyclopentadiene epoxy resin, and further selected from one or more of naphthalene epoxy resin, phosphorus-containing epoxy resin, biphenyl epoxy resin and dicyclopentadiene epoxy resin.

[0085] In some embodiments, the benzoxazine resin includes one or more of bisphenol A-type benzoxazine resin, bisphenol F-type benzoxazine resin, bisphenol S-type benzoxazine resin, main chain benzoxazine resin, phosphorus-containing benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl benzoxazine resin, tetraphenol ethane benzoxazine resin and naphthalene benzoxazine resin, and can further be selected from one or more of phosphorus-containing benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl benzoxazine resin and naphthalene benzoxazine resin.

[0086] In some embodiments, the hydrocarbon resin includes one or more of polybutadiene and styrene-butadiene copolymer, and may further be polybutadiene.

[0087] In some embodiments, the curing agent includes one or more of an amine curing agent, a phenolic curing agent, an anhydride curing agent, a cyanate curing agent, an active ester curing agent, and an olefin curing agent.

[0088] In some embodiments, the amine curing agent includes one or more of ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, dicyandiamide, polyetheramine, and polyamide.

[0089] In some embodiments, the phenolic curing agent includes one or more of linear phenol formaldehyde resin, linear bisphenol A formaldehyde resin, linear o-cresol formaldehyde resin, neophenol resin, biphenyl aralkylphenol resin, halogen-free flame retardant nitrogen-containing phenolic resin and halogen-free flame retardant phosphorus-containing phenolic resin.

[0090] In some embodiments, the anhydride curing agent includes one or more of phthalic anhydride, styrene maleic anhydride copolymer, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, maleic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, benzophenonetetracarboxylic anhydride, glutaric anhydride, polyazetaic anhydride, dichloromaleic anhydride, trimellitic anhydride, pyromellitic anhydride, pyromellitic anhydride, dibenzophenonetetracarboxylic anhydride, dodecylmaleic anhydride, succinic anhydride, hexahydrophthalic anhydride and cyclopentanetetracarboxylic anhydride.

[0091] In some embodiments, the cyanate ester curing agent includes one or more of bisphenol A cyanate ester resin, bisphenol F cyanate ester resin, bisphenol S cyanate ester resin, bisphenol M cyanate ester resin, bisphenol E cyanate ester resin, phenolic cyanate ester resin, biphenyl cyanate ester resin, naphthalene cyanate ester resin, multifunctional cyanate ester resin and dicyclopentadiene bisphenol cyanate ester resin.

[0092] In some embodiments, the active ester curing agent includes one or more of bis(2-methacryloyloxyethyl)-3,3′-dithiodipropionate active ester and pentaerythritol tetrakis(3-mercaptopropionate) active ester.

[0093] In some embodiments, the olefin curing agent includes one or more of pentaerythritol triacrylate, triallyl cyanurate (TAC), trimethylolpropane trimethacrylate, tripropylene glycol diacrylate, and triallyl isocyanurate (TAIC).

[0094] In some embodiments, the curing accelerator includes one or more of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organic phosphorus accelerator, and a transition metal carboxylate accelerator.

[0095] In some embodiments, the tertiary amine accelerator includes one or more of triethylamine, benzyldimethylamine, tris(dimethylaminomethyl)phenol, triethylenediamine, and dimethylaniline.

[0096] In some embodiments, the imidazole accelerator includes one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-cyano-2-methylimidazole.

[0097] In some embodiments, the peroxide-based accelerator includes one or more of benzoyl peroxide, di-tert-butyl peroxide, dicumyl peroxide (DCP), tert-butyl perbenzoate, and tert-butyl peroxyoctanoate.

[0098] In some embodiments, the organophosphorus accelerator includes one or more of triphenylphosphine and tributyl phosphate.

[0099] In some embodiments, the transition metal carboxylate promoter includes one or more of manganese acetate, zinc octoate, zinc isooctanoate, zinc naphthenate, zinc acetylacetonate, stannous octoate, dibutyltin dilaurate, cobalt octoate, cobalt naphthenate, cobalt acetylacetonate, aluminum acetylacetonate, copper acetylacetonate, and nickel acetylacetonate.

[0100] In some embodiments, the inorganic filler includes one or more of modified silica and modified alumina.

[0101] Adding a suitable inorganic filler into the resin composition can play a synergistic role with the modified polyphenylene ether prepolymer and the functional resin, and significantly reduce the thermal expansion coefficient of the resin composition.

[0102] In some embodiments, the modified silica includes one or more of epoxy-modified silica, aniline-modified silica, vinyl-modified silica, hollow silica, acrylic (polymethyl methacrylate, PMMA)-modified silica, fluoroalkyl-modified silica, and molybdate-modified silica.

[0103] In some embodiments, the modified alumina includes one or more of epoxy-modified alumina, aniline-modified alumina, vinyl-modified alumina, hollow alumina, acrylic (polymethyl methacrylate, PMMA)-modified alumina, fluoroalkyl-modified alumina, and molybdate-modified alumina.

[0104] In some embodiments, the shape of the modified silicon dioxide and the shape of the modified aluminum oxide are each independently selected from one or more of sphere, ellipsoid, strip, and amorphous, and can further be selected to be spherical.

[0105] It is understood that the average particle size of the inorganic filler is not particularly limited. In some embodiments, the average particle size of the inorganic filler is ≤10 μm, including but not limited to 10 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, 0.1 μm, 0.05 μm or 0.01 μm.

[0106] In some embodiments, the resin composition further comprises an auxiliary agent and a solvent, wherein the auxiliary agent comprises one or more of a dispersant, a leveling agent, a defoaming agent and a coupling agent.

[0107] Adding appropriate additives to the resin composition can improve the dispersibility, fluidity, uniformity and bonding ability of the resin composition, improve the curing ability of the resin composition, and enhance the various properties of its cured product. Adding solvents can improve the compatibility between multiple components and avoid the undesirable phenomenon of stratification or precipitation.

[0108] In some embodiments, the solvent includes one or more of ethanol, acetone, cyclohexanone, butanone, toluene, xylene, N,N-dimethylformamide, N,N-dimethylacetamide and propylene glycol methyl ether. Further optionally, the solvent includes one or more of butanone, toluene and propylene glycol methyl ether. Further optionally, in the solvent, the mass ratio of butanone, toluene and propylene glycol methyl ether is 1:1:1.

[0109] In some embodiments, in the auxiliary agent, the coupling agent includes one or more of a silane coupling agent, a titanate coupling agent, an aluminate coupling agent, and a zirconate coupling agent, and may further be a silane coupling agent.

[0110] In some embodiments, among the auxiliary agents, the defoaming agent includes one or more of alcohol defoaming agents, fatty acid defoaming agents, fatty acid ester defoaming agents, phosphate defoaming agents, mineral oil defoaming agents, amide defoaming agents, polyether defoaming agents, silicone defoaming agents and polyether-modified silicone defoaming agents, and silicone defoaming agents can be further selected.

[0111] In some embodiments, the resin composition further comprises the following raw materials in parts by weight: 80 to 200 parts of a solvent and 1 to 5 parts of an auxiliary agent.

[0112] As an example, in the resin composition, the weight parts of the solvent include but are not limited to 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, 150 parts, 160 parts, 170 parts, 180 parts, 190 parts or 200 parts, and can further be selected as 100 parts to 150 parts.

[0113] As an example, in the resin composition, the weight of the auxiliary agent includes but is not limited to 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts or 5 parts, and can further be selected from 3 parts to 5 parts.

[0114] In a second aspect of the present application, a build-up film is provided, comprising the resin composition as described above.

[0115] In a third aspect of the present application, a method for preparing a build-up film is provided, which uses the resin composition as described above.

[0116] In some embodiments, the method for preparing the build-up film comprises the following steps:

[0117] Covering the resin composition as described above on a support to obtain a liquid film;

[0118] The liquid film is dried to obtain a build-up film.

[0119] In some embodiments, the method of coating the resin composition on the support includes one or more of a coating method and a screen printing method. The coating method includes one or more of a brushing method, a spin coating method, a spray coating method, a scraper coating method, and a dip coating method, and can further be a spray coating method.

[0120] In some embodiments, the drying process comprises the following steps: constant temperature drying at 80° C. to 180° C. for 5 min to 20 min.

[0121] As an example, the temperature of the drying process includes, but is not limited to, 80° C., 90° C., 100° C., 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C., or 180° C., and may further be 130° C. to 150° C. The time of the drying process includes, but is not limited to, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, 11 min, 12 min, 13 min, 14 min, 15 min, 16 min, 17 min, 18 min, 19 min, or 20 min, and may further be 10 min to 15 min.

[0122] In some embodiments, the thickness of the liquid film is 5 μm to 150 μm, including but not limited to 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm or 150 μm.

[0123] In some embodiments, the thickness of the support is 3 μm to 105 μm, including but not limited to 3 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm or 105 μm.

[0124] In some embodiments, the support includes one or more of a polymer film and a metal foil. Optionally, the polymer film includes one or more of a polyethylene terephthalate (PET) film, a polycarbonate (PC) film, and a polymethyl methacrylate (PMMA) film; and the metal foil includes one or more of a copper foil and an aluminum foil.

[0125] It can be understood that the build-up film refers to a semi-cured product and / or cured product of the resin composition. Generally, the support body only plays a supporting role in the preparation process of the build-up film, and the support body needs to be removed in the process of using the build-up film to make a packaging carrier. In addition, when the support body is a metal foil, it is also possible to choose not to remove the support body, but to directly make the package carrier from the combination formed by stacking the build-up film and the support body.

[0126] In a fourth aspect of the present application, a packaging carrier is provided, comprising the resin composition as described above, or comprising the build-up film as described above, or comprising a build-up film prepared by the method for preparing the build-up film as described above.

[0127] In some embodiments, the number of the build-up films in the package carrier is one or more layers.

[0128] In some embodiments, one or both sides of each build-up layer film are coated with metal foil.

[0129] In some embodiments, the metal foil includes one or more of copper foil and aluminum foil.

[0130] In some embodiments, the thickness of the metal foil is 3 μm to 105 μm, including but not limited to 3 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm or 105 μm.

[0131] In some embodiments, the method for preparing the package carrier includes vacuum hot pressing.

[0132] The following is further described in conjunction with specific examples and comparative examples. The raw materials involved in the following specific examples and comparative examples, unless otherwise specified, can all be sourced from commercial sources, the instruments used, unless otherwise specified, can all be sourced from commercial sources, and the processes involved, unless otherwise specified, are all routinely selected by those skilled in the art. Among them, the sources of some raw materials are as follows:

[0133] Phosphazene compound: Otsuka Chemical SPB100;

[0134] Acrylate polyphenylene ether resin: Sabic SA9000, the structure is shown in the general formula (III), the glass transition temperature is 160°C, the specific gravity is 1.02, the intrinsic viscosity is 0.09 dL / g, the number average molecular weight (Mn) is 2300, the vinyl functionality is 1.9, the dielectric constant (1MHz) is 2.54, and the dielectric loss (1MHz) is 0.0007;

[0135] Dicyclopentadiene (DCPD) benzoxazine resin: Cologne KZH-5031MP70;

[0136] Olefin curing agent: TAIC from Zhisheng Technology;

[0137] Peroxide curing accelerator: Nouryon DCP;

[0138] Vinyl modified spherical silica: Yaduma SO-C2, average particle size 0.4μm~0.6μm;

[0139] Additive: BYK-1650, a silicone defoamer.

[0140] Example 1

[0141] The method for preparing the packaging substrate provided in this embodiment is specifically as follows:

[0142] (1) Preparation of amine phosphorus-containing compounds:

[0143] Deionized water and 1 mol of 2,3-naphthalenediamine were added to a flask, heated and stirred at 140°C until dissolved, 0.5 mol of 2,3-naphthalenedicarbaldehyde was added, and the mixture was reacted at 130°C in a nitrogen atmosphere for 4 hours to obtain a mixed solution; the mixed solution was filtered to obtain an intermediate; then 2 mol of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) was added, and the reaction was continued at 150°C for 5 hours to obtain an amine phosphorus-containing compound.

[0144] (2) Preparation of modified polyphenylene ether prepolymer:

[0145] Please refer to Table 1. By weight, 50 parts of amine phosphorus-containing compounds were taken and heated to a molten state at 120°C. Then, 100 parts of acrylate polyphenylene ether resin were added and prepolymerized at 120°C. After 120 minutes, the prepolymer was cooled to room temperature to obtain a modified polyphenylene ether prepolymer, which was recorded as prepolymer A.

[0146] (3) Preparation of resin composition:

[0147] Please refer to Table 2. In parts by weight, 10 parts of prepolymer A, 40 parts of DCPD benzoxazine resin, 10 parts of olefin curing agent, 3 parts of peroxide curing accelerator, 100 parts of vinyl modified spherical silica and 1 part of auxiliary agent are dissolved in 100 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0148] (4) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 130° C. for 10 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite.

[0149] (5) Preparation of packaging substrate: Use a laminating machine to laminate the build-up film in the assembly onto a 12 μm thick copper foil, remove the PET film, and then cover the build-up film with another 12 μm thick copper foil. Place the assembly in a programmable temperature and pressure controlled vacuum press and press the assembly under a vacuum of ≤10 mBar and 10 kgf / cm 2 The build-up layer film was completely cured under vacuum hot pressing at 100°C for 30 min, vacuum hot pressing at 150°C for 30 min, and vacuum hot pressing at 190°C for 120 min to obtain a packaging carrier.

[0150] Example 2

[0151] The method for preparing the packaging substrate provided in this embodiment is specifically as follows:

[0152] (1) Preparation of amine phosphorus-containing compounds: Same as Example 1.

[0153] (2) Preparation of modified polyphenylene ether prepolymer: same as Example 1.

[0154] (3) Preparation of resin composition:

[0155] Please refer to Table 2. According to parts by weight, 30 parts of prepolymer A, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0156] (4) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 150° C. for 12 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0157] (5) Preparation of packaging substrate: same as in Example 1.

[0158] Example 3

[0159] (1) Preparation of amine phosphorus-containing compounds: Same as Example 1.

[0160] (2) Preparation of modified polyphenylene ether prepolymer: same as Example 1.

[0161] (3) Preparation of resin composition:

[0162] Please refer to Table 2. According to parts by weight, 20 parts of prepolymer A, 10 parts of DCPD benzoxazine resin, 25 parts of olefin curing agent, 1 part of peroxide curing accelerator, 175 parts of vinyl modified spherical silica and 3 parts of auxiliary agents are dissolved in 120 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0163] (4) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 140° C. for 10 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0164] (5) Preparation of packaging substrate: same as in Example 1.

[0165] Example 4

[0166] The method for preparing the packaging substrate provided in this embodiment is specifically as follows:

[0167] (1) Preparation of amine phosphorus-containing compounds: Same as Example 1.

[0168] (2) Preparation of modified polyphenylene ether prepolymer:

[0169] Please refer to Table 1. In parts by weight, 100 parts of an amine phosphorus-containing compound are taken and heated to a molten state at 120°C. Then, 100 parts of an acrylate type polyphenylene ether resin are added and prepolymerized at 140°C. After 150 minutes, the prepolymer is cooled to room temperature to obtain a modified polyphenylene ether prepolymer, which is recorded as prepolymer B.

[0170] (3) Preparation of resin composition:

[0171] Please refer to Table 2. In parts by weight, 30 parts of prepolymer B, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0172] (4) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 140° C. for 12 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0173] (5) Preparation of packaging substrate: same as in Example 1.

[0174] Example 5

[0175] The method for preparing the packaging substrate provided in this embodiment is specifically as follows:

[0176] (1) Preparation of amine phosphorus-containing compounds: Same as Example 1.

[0177] (2) Preparation of modified polyphenylene ether prepolymer:

[0178] Please refer to Table 1. By weight, 75 parts of amine phosphorus-containing compounds were taken and heated to a molten state at 120°C. Then, 100 parts of acrylate polyphenylene ether resin were added and prepolymerized at 130°C. After 140 minutes, the prepolymer was cooled to room temperature to obtain a modified polyphenylene ether prepolymer, which was recorded as prepolymer C.

[0179] (3) Preparation of resin composition:

[0180] Please refer to Table 2. In parts by weight, 30 parts of prepolymer C, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0181] (4) Preparation of a build-up film: The resin composition was sprayed onto one surface of a PET film and baked at 150° C. for 13 min to obtain a build-up film, and the build-up film and the PET film were stacked to form a composite body.

[0182] (5) Preparation of packaging substrate: same as in Example 1.

[0183] Comparative Example 1

[0184] The preparation method of the packaging substrate provided in this comparative example is as follows:

[0185] (1) Preparation of resin composition:

[0186] Please refer to Table 2. In parts by weight, 30 parts of acrylate polyphenylene ether resin, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0187] (2) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 170° C. for 15 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0188] (3) Preparation of packaging substrate: the same as step (5) of Example 1.

[0189] Comparative Example 2

[0190] The preparation method of the packaging substrate provided in this comparative example is as follows:

[0191] (1) Preparation of resin composition:

[0192] Please refer to Table 2. In parts by weight, 50 parts of prepolymer A, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a gel state.

[0193] (2) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 150° C. for 12 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0194] (3) Preparation of packaging substrate: the same as step (5) of Example 1.

[0195] Comparative Example 3

[0196] The preparation method of the packaging substrate provided in this comparative example is as follows:

[0197] (1) Preparation of resin composition:

[0198] Please refer to Table 2. In parts by weight, 30 parts of phosphazene compound, 25 parts of DCPD benzoxazine resin, 40 parts of olefin curing agent, 5 parts of peroxide curing accelerator, 250 parts of vinyl modified spherical silica and 5 parts of auxiliary agent are dissolved in 150 parts of solvent (mixed by butanone, toluene and propylene glycol methyl ether in a mass ratio of 1:1:1), and stirred well to obtain a resin composition in a colloid state.

[0199] (4) Preparation of a build-up film: The resin composition is sprayed onto one surface of a PET film and baked at 150° C. for 12 min to obtain a build-up film, and the build-up film and the PET film are stacked to form a composite body.

[0200] (5) Preparation of packaging substrate: same as in Example 1.

[0201] Test Case

[0202] 1. Test items:

[0203] 1. Thermomechanical analysis (TMA) test: According to IPC-TM-650 2.4.24.5 test, the glass transition temperature (Tg) of the package substrate, as well as the coefficient of thermal expansion (CTE) of the package substrate below Tg and the CTE above Tg are obtained.

[0204] 2. Dielectric performance test: According to IPC-TM-650 2.5.5.2 test, the dielectric constant (Dk) and dielectric loss factor (Df) of the package substrate are obtained;

[0205] 3. Water absorption: Tested according to IPC-TM650 2.6.2.1.

[0206] 4. Flame retardancy test: Tested according to IPC-TM-650 2.3.10.

[0207] (II) Results analysis:

[0208] As shown in Table 3, the packaging substrates of Examples 1 to 5 have a Tg of ≥173°C, a CTE of ≤28ppm / °C below Tg, a CTE of ≤88ppm / °C above Tg, Dk ≤3.65, Df ≤0.0063, a water absorption rate of ≤0.13%, and a flame retardancy rating of UL94V0. This indicates that the addition of an appropriate amount of a modified polyphenylene ether prepolymer obtained by reacting an acrylate-type polyphenylene ether resin and an amine phosphorus-containing compound can significantly reduce the thermal expansion coefficient of the cured product of the resin composition while greatly improving the heat resistance, flame retardancy, and dielectric properties of the resin composition, so that the packaging substrate exhibits extremely low thermal expansion coefficient, extremely high heat resistance, extremely low dielectric constant and dielectric loss, and more stable and lasting flame retardancy, and is very suitable for preparing high-performance FCBGA substrates.

[0209] The difference between Comparative Example 1 and Example 2 is that the prepolymer A is replaced with an equal mass of acrylic ester polyphenylene ether resin, resulting in a significant deterioration in the glass transition temperature, thermal expansion coefficient, flame retardancy, dielectric properties and water absorption of the packaging carrier.

[0210] In Comparative Example 2, the amount of prepolymer A is increased, and the glass transition temperature, thermal expansion coefficient, flame retardancy, dielectric properties and water absorption of the packaging substrate are slightly improved compared with those of Comparative Example 1, but each performance is significantly lower than that of the packaging substrates of Examples 1 to 5, indicating that the amount of modified polyphenylene ether prepolymer has a crucial influence on the heat resistance, flame retardancy and dielectric properties of the packaging substrate.

[0211] The difference between Comparative Example 3 and Example 2 is that replacing prepolymer A with an equal mass of phosphazene compound also results in significant deterioration of the glass transition temperature, thermal expansion coefficient, flame retardancy, dielectric properties and water absorption of the packaging carrier.

[0212] Table 1. Prepolymer formulation

[0213]

[0214] Table 2. Resin composition formula

[0215]

[0216] Note: “-” means no addition.

[0217] Table 3. Test results of package substrate

[0218]

[0219] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0220] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of protection of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the attached claims.

Claims

1. A resin composition, characterized in that The invention comprises the following raw materials in parts by weight: ； The raw materials of the modified polyphenylene ether prepolymer include acrylate polyphenylene ether resin and amine phosphorus-containing compound, and the amine phosphorus-containing compound has a structure as shown in general formula (I): （Ⅰ）。 2. The resin composition according to claim 1, characterized in that The acrylate polyphenylene ether resin has a structure as shown in the general formula (III): （Ⅲ）； Wherein, m and n are each independently selected from positive integers, and the sum of m and n is 5 to 60; Y is absent or selected from C1-C3 alkylene.

3. The resin composition according to claim 2, characterized in that The mass ratio of the acrylic ester polyphenylene ether resin to the amine phosphorus-containing compound is 100:(50-100).

4. The resin composition according to any one of claims 1 to 3, characterized in that The preparation method of the modified polyphenylene ether prepolymer comprises the following steps: The acrylate polyphenylene ether resin and the amine phosphorus-containing compound are mixed and prepolymerized at 100° C. to 150° C. for 60 min to 180 min to obtain the modified polyphenylene ether prepolymer.

5. The resin composition according to any one of claims 1 to 3, characterized in that The functional resin includes one or more of epoxy resin, benzoxazine resin and hydrocarbon resin.

6. The resin composition according to claim 5, characterized in that One or more of the following conditions are met: (1) The epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, naphthalene epoxy resin, phosphorus-containing epoxy resin, unsaturated epoxy resin, novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, multifunctional epoxy resin, alicyclic epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin and dicyclopentadiene epoxy resin; (2) The benzoxazine resin includes one or more of bisphenol A type benzoxazine resin, bisphenol F type benzoxazine resin, bisphenol S type benzoxazine resin, main chain type benzoxazine resin, phosphorus-containing benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl type benzoxazine resin, tetraphenol ethane benzoxazine resin and naphthalene type benzoxazine resin; (3) The hydrocarbon resin includes one or more of polybutadiene and styrene-butadiene copolymer.

7. The resin composition according to any one of claims 1 to 3, characterized in that One or more of the following conditions are met: (1) The curing agent includes one or more of an amine curing agent, a phenolic curing agent, an anhydride curing agent, a cyanate curing agent, an active ester curing agent and an olefin curing agent; (2) The curing accelerator includes one or more of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organic phosphorus accelerator and a transition metal carboxylate accelerator; (3) The inorganic filler includes one or more of modified silica and modified alumina.

8. The resin composition according to any one of claims 1 to 3, characterized in that The resin composition further comprises an auxiliary agent and a solvent, wherein the auxiliary agent comprises one or more of a dispersant, a leveling agent, a defoaming agent and a coupling agent.

9. A build-up film, characterized in that: The invention comprises the resin composition as described in any one of claims 1 to 8.

10. A method for preparing a build-up film, characterized in that: The following steps are involved: Covering the resin composition according to any one of claims 1 to 8 on a support to obtain a liquid film; The liquid film is dried to obtain the build-up layer film.

11. The method for preparing a build-up film according to claim 10, characterized in that: The drying process comprises the following steps: constant temperature drying at 80° C. to 180° C. for 5 min to 20 min.

12. The method for preparing a build-up film according to claim 10, characterized in that: One or more of the following conditions are met: (1) The support comprises one or more of a polymer film and a metal foil; (2) The thickness of the support is 3 μm to 105 μm; (3) The thickness of the liquid film is 5 μm to 150 μm.

13. A packaging carrier, characterized in that: The invention comprises the resin composition as claimed in any one of claims 1 to 8, or comprises the build-up film as claimed in claim 9, or comprises the build-up film prepared by the method for preparing the build-up film as claimed in any one of claims 10 to 12.

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