Graphene copper-based high-conductivity wire processing method

Abstract

The invention provides a graphene copper-based high-conductivity wire machining method. The machining method comprises the steps that the end faces of graphene-based high-conductivity copper bars are oppositely arranged, and gaps are reserved; bonding metal is arranged at the gap, and the graphene-based high-conductivity copper bar is electrified to melt the bonding metal; the graphene powder with the single charges is attached to the surface of the molten bonding metal, and the graphene-based high-conductivity copper bar is cooled after power failure; the graphene-based high-conductivity copper bar is subjected to drawing treatment, and a copper wire is obtained; and preparing an insulating film on the surface of the copper wire to obtain the superfine wire. According to the processing method, the graphene-based high-conductivity copper material can be prepared into the superfine wire, the technological process is short, the technological steps are simple and easy to implement, and the processing method is suitable for large-scale industrial production; the prepared superfine wire has good mechanical properties and conductivity, and can meet the production requirements in the fields of transformers and the like.

Description

Technical Field

[0001] The invention belongs to the field of new material processing and application, and relates to a method for processing ultrafine wires, and in particular to a method for processing graphene copper-based high-conductivity wires. Background Art

[0002] At present, the majority of conductor materials used in the power industry are traditional industrial conductive materials such as copper. With the further improvement of the national energy efficiency level, the physical and chemical properties of traditional conductor materials can no longer be further optimized by changing the design and calculation scheme. Therefore, the application of new material conductors in power equipment has become more and more popular among mainstream power companies.

[0003] Graphene materials have been attracting much attention in the development direction of assisting the improvement of traditional single-element conductors due to their advantages such as good electrical conductivity and excellent thermal stability. However, the process of combining graphene and copper through physical and chemical reactions to form graphene high-conductivity copper materials is still mainly based on laboratory synthesis at this stage. Compared with the large-scale smelting and processing of hundreds of tons of traditional copper, it has defects such as low monomer output, small volume, and difficulty in continuous processing. For this reason, if you want to successfully use graphene high-conductivity copper composite materials in actual power equipment, especially transformers, which require a large amount of ultra-fine wire to be continuously wound, you must solve the last key step of graphene high-conductivity copper composite substrates from laboratory to factory production. Summary of the invention

[0004] In order to solve the technical problems existing in the prior art, the present invention provides a method for processing graphene copper-based high-conductivity wire, which can prepare graphene-based high-conductivity copper materials into ultrafine wires. The process flow is short, the process steps are simple and easy, and it is suitable for large-scale industrial production; the prepared ultrafine wires have good mechanical properties and electrical conductivity, which can meet the production needs of transformers and other fields.

[0005] In order to achieve the above technical effects, the present invention adopts the following technical solutions:

[0006] The present invention provides a method for processing a graphene copper-based high-conducting wire, the processing method comprising:

[0007] The end faces of the graphene-based high-conductivity copper rods are arranged opposite to each other and a gap is reserved;

[0008] A bonding metal is provided at the gap, and electricity is applied to the graphene-based high-conductivity copper rod to melt the bonding metal;

[0009] Attaching a single-charged graphene powder to the surface of a molten bonding metal, and cooling the graphene-based high-conductivity copper rod after power is turned off;

[0010] The graphene-based high-conductivity copper rod is drawn to obtain copper wire.

[0011] As a preferred technical solution of the present invention, the graphene-based high-conductivity copper rod is obtained by sequentially performing a tempering treatment, an extrusion treatment and a first drawing treatment on a graphene-based high-conductivity copper ingot.

[0012] As a preferred technical solution of the present invention, the tensile strength of the graphene-based high-conductivity copper ingot after tempering is not less than 460 MPa, and the conductivity at room temperature is not less than 103.5%.

[0013] As a preferred technical solution of the present invention, the width of the gap is 1 to 3 mm.

[0014] As a preferred technical solution of the present invention, the bonding metal includes any one of silver, copper-silver alloy or copper-tin alloy, or a combination of at least two of them.

[0015] As a preferred technical solution of the present invention, the electrical properties of the graphene powder with a single charge and the graphene-based high-conductivity copper rod that is electrified are opposite.

[0016] As a preferred technical solution of the present invention, the mass ratio of the graphene powder with a single charge to the bonding metal is 1:4500-5500.

[0017] As a preferred technical solution of the present invention, the molten bonding metal is subjected to ultrasonic oscillation treatment during the cooling process.

[0018] As a preferred technical solution of the present invention, the frequency of ultrasonic oscillation treatment is 20 to 50 kHz.

[0019] As a preferred technical solution of the present invention, the diameter of the copper rod is 15 to 20 mm.

[0020] Compared with the prior art, the present invention has at least the following beneficial effects:

[0021] (1) The present invention provides a method for processing a graphene copper-based high-conductivity wire, which can prepare a graphene-based high-conductivity copper material into an ultra-fine wire, has a short process flow, simple and easy process steps, and is suitable for large-scale industrial production;

[0022] (2) The present invention provides a method for processing graphene copper-based high-conductivity wires. The ultra-fine wires prepared by the processing method have good mechanical properties and electrical conductivity, and can meet the production needs of transformers and other fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of key points of a method for processing graphene copper-based high-conductor wire provided in a specific embodiment of the present invention;

[0024] Figure 2 A schematic flow chart of a method for processing graphene copper-based high-conductivity wire provided for a specific embodiment of the present invention.

[0025] The present invention is further described in detail below. However, the following examples are only simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims. DETAILED DESCRIPTION

[0026] The technical solution of the present application is further described below through specific implementation methods.

[0027] A specific embodiment of the present invention provides a method for processing a graphene copper-based high-conducting wire, the processing method comprising:

[0028] The end faces of the graphene-based high-conductivity copper rods are arranged opposite to each other and a gap is reserved;

[0029] A bonding metal is provided at the gap, and electricity is applied to the graphene-based high-conductivity copper rod to melt the bonding metal;

[0030] Attaching a single-charged graphene powder to the surface of a molten bonding metal, and cooling the graphene-based high-conductivity copper rod after power is turned off;

[0031] The graphene-based high-conductivity copper rod is drawn to obtain copper wire.

[0032] In a specific embodiment of the present invention, the graphene-based high-conductivity copper rod is obtained by sequentially performing a tempering treatment, an extrusion treatment and a first drawing treatment on a graphene-based high-conductivity copper ingot.

[0033] In a specific embodiment of the present invention, the graphene-based high-conductivity copper ingot is obtained by mixing graphene powder and elemental copper powder and then sintering. The mass ratio of graphene powder and elemental copper powder, as well as the temperature and time of the sintering treatment, can be selected according to production and processing needs and are not further limited here.

[0034] In a specific embodiment of the present invention, in order to satisfy the tensile strength and high conductivity at room temperature of the graphene-based high-conductivity copper ingot, the graphene-based high-conductivity copper ingot is tempered. The temperature and time of the tempering treatment can be selected according to the properties of the graphene-based high-conductivity copper ingot. As an example, the tempering temperature can be 210-320°C, such as 210°C, 220°C, 230°C, 240°C, 250°C, 260°C, 270°C, 280°C, 290°C, 300°C, 310°C or 320°C, etc.; the tempering time is not less than 2h, such as 2h, 2.5h, 3h, 3.5h, 4h, 4.5h or 5h, etc., but it is not limited to the listed data, and other unlisted data within the above numerical ranges are also applicable.

[0035] In a specific embodiment of the present invention, the tensile strength of the graphene-based high-conductivity copper ingot after tempering is not less than 460MPa, and the high conductivity at room temperature is not less than 103.5%. The tensile strength can be 460MPa, 465MPa, 470MPa, 475MPa, 480MPa, 485MPa, 490MPa, 495MPa or 500MPa, and the high conductivity at room temperature can be 103.5%, 104%, 104.5%, 105%, 105.5%, 106%, 107%, 108%, 109% or 110%, but are not limited to the listed data, and other unlisted data within the above numerical ranges are also applicable.

[0036] In a specific embodiment of the present invention, the extrusion process includes extruding the graphene-based high-conductivity copper ingot after the retreat process multiple times into a strip shape, and when the strip-shaped graphene-based high-conductivity copper material meets the first drawing condition after extrusion deformation, the first drawing process is performed.

[0037] In a specific embodiment of the present invention, the temperature, stretching degree and number of times of the first drawing process can be selected according to the properties of the strip graphene-based highly conductive copper material, and are not further limited herein.

[0038] In a specific embodiment of the present invention, the diameter of the graphene-based high-conductivity copper rod can be 15 to 20 mm, such as 15 mm, 16 mm, 17 mm, 18 mm, 19 mm or 20 mm, but is not limited to the listed data, and other unlisted data within the numerical range are also applicable.

[0039] In a specific embodiment of the present invention, the weight of the graphene-based high-conductivity copper rod is not less than 120% of the target weight of ultrafine wire production, such as 120%, 125%, 130%, 135%, 140%, 145% or 150%, etc., but is not limited to the listed data, and other unlisted data within the numerical range are also applicable.

[0040] In a specific embodiment of the present invention, the end faces of the graphene-based high-conductivity copper rod are arranged relative to each other and fixed by a clamping device to keep them insulated from the ground, and a gap is formed between the end faces. The width of the gap is 1 to 3 mm, such as 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, 2.5 mm, 2.8 mm or 3 mm, but is not limited to the listed data, and other unlisted data within the numerical range are also applicable.

[0041] In a specific embodiment of the present invention, when the production equipment meets the requirements, multiple graphene-based high-conductivity copper rods can be arranged in sequence, the end faces of adjacent graphene-based high-conductivity copper rods are arranged opposite to each other, and a gap is formed before subsequent processing.

[0042] In a specific embodiment of the present invention, the room temperature conductivity of the bonding metal is lower than that of copper because the resistivity of the conductor after being melted and recovered by heat is much higher than its original resistivity. Therefore, the original resistivity of the bonding metal needs to be lower than that of copper. Adding graphene powder after melting can ensure that the resistivity is close to that of copper. The bonding metal can be a metal element or an alloy formed by at least two metals that meets the above conditions, such as silver, copper-silver alloy or copper-tin alloy, etc., preferably silver.

[0043] In a specific embodiment of the present invention, physical means such as mechanical friction, charged contact, electrostatic induction, etc. are used to make the graphene powder carry a single charge (positive charge or negative charge) to obtain graphene powder with a single charge, and the charge carried by the graphene powder is opposite to the charge of the graphene-based high-conductivity copper rod.

[0044] In the present invention, the graphene powder with a single charge effectively prevents the graphene powder from agglomerating by the principle of like charges repelling each other; and the graphene powder is fully combined with the surface of the molten metal according to the principle of opposite charges attracting each other. Due to the skin effect of the conductive material, when the conductor flows through the current, the electric density close to the conductor surface is much greater than the electric density inside the conductor, so that the comprehensive conductivity of the molten metal surface after the graphene powder is attached is almost unaffected.

[0045] In a specific embodiment of the present invention, the mass ratio of the graphene powder with a single charge to the bonding metal is 1:4500-5500, such as 1:4500, 1:4600, 1:4700, 1:4800, 1:4900, 1:5000, 1:5100, 1:5200, 1:5300, 1:5400 or 1:5500, but is not limited to the listed data, and other unlisted data within the numerical range are also applicable.

[0046] In a specific embodiment of the present invention, the graphene powder with a single charge can be attached to the surface of the molten metal by spraying, spraying, etc. In order to make the graphene powder more evenly distributed on the surface of the molten metal, the graphene-based high-conductivity copper rod can be rotated during the attachment process.

[0047] In a specific embodiment of the present invention, the molten bonding metal is subjected to ultrasonic oscillation treatment during the cooling process, and the frequency of the ultrasonic oscillation treatment is 20 to 50 kHz, such as 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz or 50 kHz, etc., but it is not limited to the listed data, and other unlisted data within the numerical range are also applicable. The graphene powder is more evenly integrated into the surface of the molten bonding metal by means of ultrasonic oscillation, so as to prevent local melting and burning at the graphene high-conductivity copper joint position due to excessive resistivity difference during actual use.

[0048] In a specific embodiment of the present invention, the process of drawing a graphene-based highly conductive copper rod to form a copper wire may include a second drawing process and a final drawing process performed sequentially.

[0049] In a specific embodiment of the present invention, the temperature of the second drawing process is 400-430°C, such as 400°C, 405°C, 410°C, 415°C, 420°C, 425°C or 430°C, but is not limited to the listed data, and other unlisted data within the numerical range are also applicable. After the second drawing process, a copper wire with a diameter of 5-10 mm is obtained.

[0050] In a specific embodiment of the present invention, the temperature of the final drawing process is 410-440°C, such as 410°C, 415°C, 420°C, 425°C, 430°C, 435°C or 440°C, but is not limited to the listed data, and other unlisted data within the numerical range are also applicable. The final drawing process obtains a copper wire with a diameter of 0.1-1 mm.

[0051] In a specific embodiment of the present invention, the copper wire after the final drawing process is rolled up and subjected to a final annealing process. The annealing process conditions are conventional conditions for copper wire processing and are not specifically limited herein.

[0052] In a specific embodiment of the present invention, an insulating film is prepared on the surface of a copper wire to obtain an ultra-fine wire.

[0053] In one specific embodiment of the present invention, the method for preparing the insulating film may be to coat the surface of the copper wire with an insulating varnish and then dry the insulating varnish, which may be dimethyl terephthalate (DMT) insulating varnish.

[0054] In a specific embodiment of the present invention, a sampling measurement is performed to determine whether the diameter of the copper wire coated with the insulating film meets the design requirements. If not, the final drawing is repeated until the diameter meets the design requirements.

[0055] The specific embodiment of the present invention provides a method for processing a graphene copper-based high-conductor wire, the process of which is as follows: Figure 1 and Figure 2 As shown, the processing method includes:

[0056] The graphene-based high-conductivity copper ingot is tempered at a temperature of 210-320°C for a period of not less than 2 hours, and the graphene-based high-conductivity copper ingot after the tempering treatment is tested to ensure that its tensile strength is not less than 460MPa and its high conductivity at room temperature is not less than 103.5%;

[0057] The graphene-based high-conductivity copper ingot after tempering is repeatedly extruded into a strip shape, and when the strip graphene-based high-conductivity copper material meets the first drawing condition after extrusion deformation, a first drawing process is performed to obtain a 15-20 mm rod;

[0058] The weight of the graphene-based high-conductivity copper rod is not less than 120% of the target weight of ultra-fine wire production for material preparation, and the end faces of two graphene-based high-conductivity copper rods are arranged opposite to each other to form a gap of 1 to 3 mm in width, and fixed to a fixture to maintain insulation from the ground;

[0059] A silver sheet is placed at the gap, and the graphene-based highly conductive copper rod is electrified to heat the silver sheet until it is melted; a physical method is used to make the graphene powder carry a single charge to obtain a graphene powder with a single charge, and the charge carried by the graphene powder is opposite to the charge of the graphene-based highly conductive copper rod; the graphene-based highly conductive copper rod is rotated, and the graphene powder with a single charge is evenly sprinkled on the surface of the molten elemental silver, and the mass ratio of the graphene powder to the silver sheet is 1:4500-5500;

[0060] After power is turned off, the graphene-based high-conductivity copper rod is naturally cooled, and during the cooling process, the molten bonding metal is subjected to ultrasonic oscillation treatment, and the frequency of the ultrasonic oscillation treatment is 20 to 50 kHz;

[0061] The graphene-based high-conductivity copper rod is subjected to a second drawing at a temperature of 400-430° C. to obtain a copper wire with a diameter of 5-10 mm; the copper wire is subjected to a final drawing at a drawing temperature of 410-440° C. to obtain a copper wire with a diameter of 0.1-1 mm;

[0062] The copper wire is rolled and finally annealed, coated with dimethyl terephthalate (DMT) insulating varnish, and immediately vacuum dried so that the polyester insulating varnish film evenly covers the copper wire to obtain an ultra-fine wire.

[0063] To better illustrate the present invention and facilitate understanding of the technical solution of the present invention, typical but non-limiting embodiments of the present invention are as follows:

[0064] Example 1

[0065] This embodiment provides a method for processing a graphene copper-based high-conducting wire, the processing method comprising:

[0066] The graphene-based high-conductivity copper ingot is tempered at a temperature of 320°C for 2 hours, and the graphene-based high-conductivity copper ingot after the tempering treatment is tested to ensure that its tensile strength is not less than 460MPa and its high conductivity at room temperature is not less than 103.5%;

[0067] The graphene-based high-conductivity copper ingot after tempering is extruded multiple times into a strip shape. When the strip graphene-based high-conductivity copper material meets the first drawing condition after extrusion deformation, the first drawing process is performed to obtain a 20 mm rod;

[0068] The weight of the graphene-based high-conductivity copper rod is 120% of the target weight of the ultra-fine wire production. The end faces of two graphene-based high-conductivity copper rods are arranged opposite to each other to form a gap of 1 mm in width, and fixed to a fixture to maintain insulation from the ground.

[0069] A silver sheet is placed at the gap, and the graphene-based highly conductive copper rod is electrified to heat the silver sheet until it is melted; a physical method is used to make the graphene powder carry a single charge to obtain a graphene powder with a single charge, and the charge carried by the graphene powder is opposite to the charge of the graphene-based highly conductive copper rod; the graphene-based highly conductive copper rod is rotated, and the graphene powder with a single charge is evenly sprinkled on the surface of the molten elemental silver, and the mass ratio of the graphene powder to the silver sheet is 1:5500;

[0070] After power is turned off, the graphene-based high-conductivity copper rod is cooled naturally, and during the cooling process, the molten bonding metal is subjected to ultrasonic oscillation treatment at a frequency of 50 kHz;

[0071] The graphene-based high-conductivity copper rod is subjected to a second drawing at a temperature of 400°C to obtain a copper wire with a diameter of 10 mm; the copper wire is subjected to a final drawing at a drawing temperature of 410°C to obtain a copper wire with a diameter of 1 mm;

[0072] The copper wire is rolled and finally annealed, coated with dimethyl terephthalate (DMT) insulating varnish, and immediately vacuum dried so that the polyester insulating varnish film evenly covers the copper wire to obtain an ultra-fine wire.

[0073] Example 2

[0074] This embodiment provides a method for processing a graphene copper-based high-conducting wire, the processing method comprising:

[0075] The graphene-based high-conductivity copper ingot is tempered at a temperature of 210°C for 5 hours, and the graphene-based high-conductivity copper ingot after the tempering treatment is tested to ensure that its tensile strength is not less than 460MPa and its high conductivity at room temperature is not less than 103.5%;

[0076] The graphene-based high-conductivity copper ingot after tempering is extruded multiple times into a strip shape. When the strip graphene-based high-conductivity copper material meets the first drawing condition after extrusion deformation, the first drawing process is performed to obtain a 15 mm rod;

[0077] The weight of the graphene-based high-conductivity copper rod is 120% of the target weight of the ultra-fine wire production. The end faces of two graphene-based high-conductivity copper rods are arranged opposite to each other to form a gap of 3 mm in width, and fixed to a fixture to maintain insulation from the ground.

[0078] A silver sheet is placed at the gap, and the graphene-based high-conductivity copper rod is electrified to heat the silver sheet until it is melted; a physical method is used to make the graphene powder carry a single charge to obtain a graphene powder with a single charge, and the charge carried by the graphene powder is opposite to the charge of the graphene-based high-conductivity copper rod; the graphene-based high-conductivity copper rod is rotated, and the graphene powder with a single charge is evenly sprinkled on the surface of the molten elemental silver, and the mass ratio of the graphene powder to the silver sheet is 1:4500;

[0079] After power is turned off, the graphene-based high-conductivity copper rod is cooled naturally, and the molten bonding metal is subjected to ultrasonic oscillation treatment during the cooling process, and the frequency of the ultrasonic oscillation treatment is 20kHz;

[0080] The graphene-based high-conductivity copper rod is subjected to a second drawing at a temperature of 430°C to obtain a copper wire with a diameter of 5 mm; the copper wire is subjected to a final drawing at a drawing temperature of 440°C to obtain a copper wire with a diameter of 0.1 mm;

[0081] The copper wire is rolled and finally annealed, coated with dimethyl terephthalate (DMT) insulating varnish, and immediately vacuum dried so that the polyester insulating varnish film evenly covers the copper wire to obtain an ultra-fine wire.

[0082] Example 3

[0083] This embodiment provides a method for processing a graphene copper-based high-conducting wire, the processing method comprising:

[0084] The graphene-based high-conductivity copper ingot is tempered at a temperature of 300°C for 2.5 hours, and the graphene-based high-conductivity copper ingot after tempering is tested to ensure that its tensile strength is not less than 460MPa and its high conductivity at room temperature is not less than 103.5%;

[0085] The graphene-based high-conductivity copper ingot after tempering is extruded multiple times into a strip shape. When the strip graphene-based high-conductivity copper material meets the first drawing condition after extrusion deformation, the first drawing process is performed to obtain a 15 mm rod;

[0086] The weight of the graphene-based high-conductivity copper rod is 120% of the target weight of the ultra-fine wire production. The end faces of two graphene-based high-conductivity copper rods are arranged opposite to each other to form a gap of 2 mm in width, and fixed to a fixture to maintain insulation from the ground.

[0087] A silver sheet is placed at the gap, and the graphene-based highly conductive copper rod is electrified to heat the silver sheet until it is melted; a physical method is used to make the graphene powder carry a single charge to obtain a graphene powder with a single charge, and the charge carried by the graphene powder is opposite to the charge of the graphene-based highly conductive copper rod; the graphene-based highly conductive copper rod is rotated, and the graphene powder with a single charge is evenly sprinkled on the surface of the molten elemental silver, and the mass ratio of the graphene powder to the silver sheet is 1:5000;

[0088] After power is turned off, the graphene-based high-conductivity copper rod is cooled naturally, and the molten bonding metal is subjected to ultrasonic oscillation treatment during the cooling process, and the frequency of the ultrasonic oscillation treatment is 35kHz;

[0089] The graphene-based high-conductivity copper rod is subjected to a second drawing at a temperature of 420°C to obtain a copper wire with a diameter of 5 mm; the copper wire is subjected to a final drawing at a drawing temperature of 430°C to obtain a copper wire with a diameter of 0.1 mm;

[0090] The copper wire is rolled and finally annealed, coated with dimethyl terephthalate (DMT) insulating varnish, and immediately vacuum dried so that the polyester insulating varnish film evenly covers the copper wire to obtain an ultra-fine wire.

[0091] Comparative Example 1

[0092] In this comparative example, except that the graphene on the surface of the molten silver sheet does not carry a single charge during the preparation process, other conditions are the same as those of Example 3.

[0093] Comparative Example 2

[0094] In this comparative example, except that ultrasonic oscillation treatment is not performed during the cooling process, other conditions are the same as those of Example 3.

[0095] Comparative Example 3

[0096] In this comparative example, except that the mass ratio of graphene powder to silver flakes is 1:2000, all other conditions are the same as those of Example 3.

[0097] Comparative Example 4

[0098] In this comparative example, except that graphene powder is not provided on the surface of the molten silver sheet, other conditions are the same as those of Example 3.

[0099] The graphene-based highly conductive copper ingots used in Examples 1-3 and Comparative Examples 1-4 are obtained by mixing graphene powder and elemental copper powder and then sintering. Specifically, the mass ratio of graphene powder of 100 mm to elemental copper powder of 200 mm is 3:1000. The sintering method is to disperse the graphene powder in the copper powder by a molecular level mixing method, and then use spark plasma sintering.

[0100] The mechanical properties and conductive properties of the ultrafine wires prepared in Examples 1-3 and Comparative Examples 1-4 were tested, and the results are shown in Table 1.

[0101] The test method for mechanical properties is to compare the data of the sample to be tested with the conventional copper / aluminum conductor of the same model and specification, and cut off 1.5m of each whole wire. During the test, the DC resistance meter is used to hold both ends of the wire, and a single 5000V DC voltage is applied. The resistance at room temperature (20℃) is measured by the DC resistance formula, and all are converted into international %IACS standard conductivity values ​​for comparative analysis.

[0102] The test method for conductivity is to compare the sample to be tested with the conventional copper / aluminum conductor of the same model and specification as data, cut off 1.5m of each whole wire, and then split each wire into three sections of 50cm in length. During the test, the wire tensile strength tester is used to hold both ends of the wire, and vertical tension is applied on both sides starting from 50N, with 5N as the tension step until the wire sample is broken, and the maximum yield strength of the wire is measured. The two material conductors are repeated 3 times each, and the final data is taken as the arithmetic mean.

[0103] Table 1

[0104] Tensile Strength Standard conductivity Example 1 204MPa 103.5％ Example 2 203MPa 103.2％ Example 3 203MPa 103.4％ Comparative Example 1 200MPa 101.2％ Comparative Example 2 198MPa 102.6％ Comparative Example 3 202MPa 103.0％ Comparative Example 4 196MPa 101.7％

[0105] The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed structural features, that is, it does not mean that the present invention must rely on the above-mentioned detailed structural features to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of the components selected by the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

[0106] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, a variety of simple modifications can be made to the technical solution of the present invention, and these simple modifications all belong to the protection scope of the present invention.

[0107] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

[0108] In addition, various embodiments of the present invention may be arbitrarily combined, and as long as they do not violate the concept of the present invention, they should also be regarded as the contents disclosed by the present invention.

Claims

1. A method for processing graphene copper-based high-conductivity wire, characterized in that: The processing method comprises: The end faces of the graphene-based high-conductivity copper rods are arranged opposite to each other and a gap is reserved; Arranging a bonding metal at the gap, and applying electricity to the graphene-based high-conductivity copper rod to melt the bonding metal; Attaching a single-charged graphene powder to the molten surface of the bonding metal, and cooling the graphene-based high-conductivity copper rod after power is turned off; The graphene-based high-conductivity copper rod is subjected to a drawing process to obtain a copper wire.

2. The processing method according to claim 1, characterized in that: The graphene-based high-conductivity copper rod is obtained by sequentially performing tempering treatment, extrusion treatment and first drawing treatment on a graphene-based high-conductivity copper ingot.

3. The processing method according to claim 2, characterized in that: The tensile strength of the graphene-based high-conductivity copper ingot after the tempering treatment is not less than 460 MPa, and the conductivity at room temperature is not less than 103.5%.

4. The processing method according to claim 1, characterized in that: The width of the gap is 1 to 3 mm.

5. The processing method according to claim 1, characterized in that: The bonding metal includes any one of silver, copper-silver alloy, or copper-tin alloy, or a combination of at least two thereof.

6. The processing method according to claim 1, characterized in that: The graphene powder with a single charge has an electrical property opposite to that of the graphene-based high-conductivity copper rod that is electrified.

7. The processing method according to claim 1, characterized in that: The mass ratio of the single-charged graphene powder to the bonding metal is 1:4500-5500.

8. The processing method according to claim 1, characterized in that: During the cooling process, the molten bonding metal is subjected to ultrasonic vibration treatment.

9. The processing method according to claim 8, characterized in that: The frequency of the ultrasonic oscillation treatment is 20 to 50 kHz.

10. The processing method according to claim 1, characterized in that: The diameter of the copper rod is 15-20 mm.

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