Packaging and film covering device suitable for integrated circuit chip processing

Abstract

The invention discloses a packaging and film covering device suitable for integrated circuit chip processing, which comprises a top plate, a lifting plate is arranged below the top plate, and a first hydraulic telescopic rod for driving the lifting plate to move in the Y-axis direction is arranged at the center position of the upper surface of the top plate; the bottom end of the first hydraulic telescopic rod penetrates through the surface of the top plate and is connected with the lifting plate, the lifting plate is provided with a film covering mechanism used for pressing and cutting a protective film covering a wafer and eliminating bubbles, and a wafer containing assembly used for containing the wafer and ejecting the wafer out is arranged under the film covering mechanism. And the wafer placement assembly is mounted at the top end of the mounting rack. According to the invention, bubbles generated by pasting between the wafer and the protective film can be effectively removed, wrinkles generated by pasting between the wafer and the protective film can be effectively avoided, and the quality of a film coated on the surface of the wafer can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip coating, and in particular to a packaging coating device suitable for integrated circuit chip processing. Background Art

[0002] The production and processing of integrated circuit chips involves the wafer coating and packaging process. Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer. During chip processing, the wafer needs to be cut, and before cutting, the circuit side of the wafer needs to be coated and packaged for protection. After the film material covers the wafer, the covering film material needs to be cut off, and then the next wafer is replaced for coating.

[0003] In actual use, the existing packaging and coating devices for integrated circuit chip processing generally only need to coat one side of the wafer. The wafer to be coated is placed on a processing table, and when the protective film is transported to the top of the wafer, the pressure plate is driven to move down to cover the protective film on the surface of the wafer, thereby coating and packaging the wafer. However, when the protective film is covered on one side of the wafer, certain bubbles and wrinkles will be generated when the protective film is applied to the wafer, affecting the quality of the coating on the wafer surface. Therefore, a packaging and coating device suitable for integrated circuit chip processing is designed. Summary of the invention

[0004] In view of the defects or shortcomings of the packaging and coating device for integrated circuit chip processing, the purpose of the present invention is to provide a packaging and coating device suitable for integrated circuit chip processing, which can effectively remove bubbles generated by the adhesion between the wafer and the protective film and effectively avoid wrinkles generated by the adhesion between the wafer and the protective film, thereby ensuring the quality of the coating on the wafer surface.

[0005] In order to achieve the above-mentioned object of the invention, the present invention adopts the following technical solutions: The present invention provides a packaging film coating device suitable for integrated circuit chip processing, comprising a top plate, a lifting plate is arranged below the top plate, a first hydraulic telescopic rod for driving the lifting plate to move in the Y-axis direction is installed at the center position of the upper surface of the top plate, and the bottom end of the first hydraulic telescopic rod penetrates the surface of the top plate and is connected to the lifting plate, a film coating mechanism for pressing and cutting the protective film covered on the wafer and eliminating bubbles is arranged on the lifting plate, a wafer placement assembly for placing the wafer and ejecting the wafer is arranged directly below the film coating mechanism, and the wafer placement assembly is installed on the top of the mounting frame, and a film collection roller assembly for collecting the protective film and a film placement roller assembly for placing the protective film are respectively installed on both sides of the top of the mounting frame; The film coating mechanism is provided with a bubble scraping assembly for scraping bubbles between the wafer and the protective film, and a film pressing assembly for pressing and limiting the protective film covered on the wafer. The film coating mechanism is provided with a cutting shell, and a ring-shaped cutter for rotating and cutting the protective film is installed at the bottom end of the cutting shell. A first sealing bearing is installed at the center of the upper surface of the cutting shell, and a mounting plate is installed on the inner side of the first sealing bearing. A vacuum pump for evacuating the inside of the cutting shell is installed on one side of the upper surface of the mounting plate; The lifting plate is provided with a driving mechanism for driving the cutting shell and the bubble scraping assembly to rotate.

[0006] Preferably, a first through hole is opened at the four corners of the surface of the lifting plate, a guide rod is installed in the first through hole, the outer wall of the guide rod is connected to the hole wall of the first through hole with a gap, the top end of the guide rod is installed on the lower surface of the top plate, and the bottom end of the guide rod is installed on the top of the mounting frame.

[0007] Preferably, a stepper motor is provided on the driving mechanism, and the stepper motor is installed on one side of the upper surface of the lifting plate. The output shaft on the stepper motor passes through the surface of the lifting plate and is connected to the first connecting shaft through a coupling, and a double-groove pulley is installed at the bottom end of the first connecting shaft, and a first transmission assembly and a second transmission assembly are respectively provided on both sides of the double-groove pulley.

[0008] Preferably, the first transmission assembly and the second transmission assembly are both provided with a hollow single-groove pulley, the double-groove pulley is respectively connected to the hollow single-groove pulley on the first transmission assembly and the hollow single-groove pulley on the second transmission assembly through a transmission belt, both sides of the top of the hollow single-groove pulley are connected to the arc-shaped slider through a first connecting rod, the other end of the arc-shaped slider is installed on the annular slide rail, the arc-shaped slider and the annular slide rail are slidably connected, and the annular slide rail is installed on the lower surface of the lifting plate; A rotating disk is provided on the inner side of the hollow single-groove pulley, and a second groove is opened on the circumferential outer wall of the rotating disk, and there are four second grooves, and the four second grooves are distributed in a ring array, a second electromagnet is installed at one end of the inner side of the second groove, and a second iron block is magnetically adsorbed on one end of the second electromagnet, and the second iron block is connected to the first iron block through a second connecting rod, and there is a gap fit between the outer walls of the first iron block and the second iron block and the groove wall of the second groove, a first groove is opened on the circumferential inner wall of the hollow single-groove pulley, and there are four first grooves, and the four first grooves are distributed in a ring array, a first electromagnet is installed at one end of the inner side of the first groove, and the inner diameter of the first groove is equal to the inner diameter of the second groove.

[0009] Preferably, a second connecting shaft is installed at the center position of the lower surface of the rotating disk on the first transmission assembly, the other end of the second connecting shaft passes through the second sealed bearing, extends to the interior of the cutting shell and is connected to the top of the bubble scraping assembly, and the second sealed bearing is arranged at the center position of the surface of the mounting plate, a third connecting shaft is installed at the center position of the upper surface of the rotating disk on the second transmission assembly, the other end of the third connecting shaft is installed in the bearing seat, the bearing seat is located on the inner side of the annular slide rail, and the third connecting shaft is installed on one side of the lower surface of the lifting plate, a fourth connecting shaft is installed at the center position of the lower surface of the rotating disk on the second transmission assembly, a driving gear is installed at the bottom end of the fourth connecting shaft, the driving gear is meshed with the driven gear, and the driven gear is installed above the circumferential outer wall of the cutting shell.

[0010] Preferably, the bubble scraping assembly is provided with a first connecting column, a mounting slot is opened at the center position of the bottom end of the first connecting column, a connecting plate is installed in the mounting slot, and the outer wall of the connecting plate is connected with the hole wall of the mounting slot by a gap, a spring is arranged between the upper surface of the connecting plate and the top end of the inner side of the mounting slot, a limiting block is installed on the circumferential outer wall of the connecting plate, there are four limiting blocks, and the four limiting blocks are distributed in a ring array, the other end of the limiting block is installed in the limiting slot, the outer wall of the limiting block is connected with the hole wall of the limiting slot, the limiting slot is opened on the hole wall of the mounting slot, there are four limiting slots, and the four limiting slots are distributed in a ring array, a second connecting column is installed on the lower surface of the connecting plate, and the other end of the second connecting column extends to the outside and is connected to the bubble scraper.

[0011] Preferably, a second hydraulic telescopic rod is provided on the film pressing assembly, and the second hydraulic telescopic rod is at the front and rear ends of the upper surface of the cutting shell, the bottom end of the second hydraulic telescopic rod penetrates the cutting shell and extends to the interior of the cutting shell and is connected to the pressing plate, and a second annular sealing ring is provided at the connection between the second hydraulic telescopic rod and the cutting shell, and a strip groove hole is opened on the surface of the pressing plate.

[0012] Preferably, the wafer placement assembly is provided with a third hydraulic telescopic rod, the bottom end of the third hydraulic telescopic rod is mounted on the inner bottom end of the mounting frame, the top end of the third hydraulic telescopic rod passes through the second through hole and is connected to the wafer ejection plate, and the second through hole is arranged at the center position of the lower surface of the wafer placement plate, the wafer ejection plate is arranged in the wafer placement groove, and the wafer placement groove is arranged at the center position of the surface of the wafer placement plate, a cutting knife placement groove is arranged on the outer side of the wafer placement groove, a bump placement groove is arranged on the outer side of the cutting knife placement groove, the bump placement groove is located above the cutting knife placement groove, and the cutting knife placement groove and the bump placement groove are both arranged on the surface of the wafer placement plate, a sealing groove is arranged at the inner bottom end of the bump placement groove, a third annular sealing ring is installed at the center position of the lower surface of the wafer ejection plate, and the wafer placement plate is mounted on the top end of the mounting frame.

[0013] Preferably, the upper surface of the mounting plate is connected to the lower surface of the lifting plate through a third connecting rod, an annular protrusion is installed below the outer wall of the cutting shell, and a first annular sealing ring is installed on the lower surface of the annular protrusion.

[0014] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects: In the present invention, through the coordinated arrangement of a series of structures, when the staff performs the coating operation on the wafer, after the staff places the wafer into the wafer placement groove, the staff starts the first hydraulic telescopic rod to extend and retract, and makes the first hydraulic telescopic rod drive the lifting plate and the coating mechanism to make a downward linear motion in the Y-axis direction, the staff makes the pressure plate exert a certain pressing force on the wafer and the protective film, after the protective film covers the upper surface of the wafer, the staff closes the first hydraulic telescopic rod, the staff starts the driving mechanism and makes the annular cutter on the cutting shell cut the protective film, after which the staff starts the first hydraulic telescopic rod again and makes the annular cutter move into the cutter placement groove, after the third annular sealing ring moves into the sealing groove, at this time, the internal cavity between the coating mechanism and the wafer placement component is in a sealed state, the staff starts the vacuum pump to evacuate the internal cavity between the coating mechanism and the wafer placement component, in the vacuum environment, the bubbles generated between the wafer and the covered protective film can be gradually reduced or disappeared, the bubbles generated by the application between the wafer and the protective film can be effectively removed, and the quality of the coating on the wafer surface can be ensured.

[0015] In the present invention, through the coordinated arrangement of a series of structures, when removing bubbles in a vacuum environment, the staff starts the extension and retraction of the second hydraulic telescopic rod and makes the pressure plate make an upward linear motion in the Y-axis direction. After the staff moves the pressure plate to a certain horizontal height, the pressure on the protective film covering the wafer and the limit on the bubble scraper plate are released. Then, the staff starts the driving mechanism and rotates the bubble scraper assembly. The rotation of the bubble scraper assembly will cause the bubble scraper to rotate. The bubble scraper can flatten the protective film covering the upper surface of the wafer and scrape off the bubbles generated between the wafer and the covered protective film, thereby further effectively removing the bubbles generated by the adhesion between the wafer and the protective film and effectively avoiding the wrinkles generated by the adhesion between the wafer and the protective film, thereby further ensuring the quality of the film coated on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0017] Figure 1It is a schematic diagram of the overall three-dimensional structure of the present invention.

[0018] Figure 2 It is a cross-sectional view of the overall structure of the present invention.

[0019] Figure 3 It is a structural schematic diagram of the lifting plate of the present invention.

[0020] Figure 4 It is a cross-sectional view of the lifting plate of the present invention.

[0021] Figure 5 It is a structural schematic diagram of the driving mechanism of the present invention.

[0022] Figure 6 It is a cross-sectional view of the driving mechanism of the present invention.

[0023] Figure 7 It is a cross-sectional view of the first transmission assembly and the second transmission assembly of the present invention.

[0024] Figure 8 The present invention Figure 7 Schematic diagram of the local enlarged structure at A in the figure.

[0025] Fig. 9 It is a structural schematic diagram of the laminating mechanism of the present invention.

[0026] Fig.10 It is a cross-sectional view of the laminating mechanism of the present invention.

[0027] Fig.11 It is a structural schematic diagram of the bubble scraping component of the present invention.

[0028] Fig.12 It is a cross-sectional view of the connection structure between the first connection column and the second connection column of the present invention.

[0029] Fig.13 It is a structural schematic diagram of the film pressing assembly of the present invention.

[0030] Fig.14 It is a structural schematic diagram of the wafer placement assembly of the present invention.

[0031] Fig.15 It is a cross-sectional view of the wafer placement assembly of the present invention.

[0032] In the figure: 100. Mounting frame; 200, wafer placement assembly; 210, third hydraulic telescopic rod; 220, wafer placement plate; 221, cutter placement groove; 222, bump placement groove; 223, sealing groove; 224, second through hole; 225, wafer placement groove; 230, wafer ejection plate; 231, third annular sealing ring; 300, film collection roller assembly; 400, film placing roller assembly; 500, driving mechanism; 510, stepping motor; 520, double-groove pulley; 521, first connecting shaft; 530, transmission belt; 540, first transmission assembly; 550, second connecting shaft; 560, bearing seat; 570, third connecting shaft; 580, second transmission assembly; 581, arc-shaped slider; 582, first connecting rod; 583, annular slide rail; 584, hollow single-groove pulley; 5841, first electromagnet; 5842, first groove; 585, rotating disk; 5851, first iron block; 5852, second groove; 5853, second iron block; 5854, second connecting rod; 5855, second electromagnet; 590, driving gear; 591, fourth connecting shaft; 600, laminating mechanism; 610, cutting shell; 611, first sealing bearing; 612, driven gear; 613, annular convex block; 614, annular cutter; 615, first annular sealing ring; 620, vacuum pump; 630, mounting plate; 631, third connecting rod; 632, second sealing bearing; 640, laminating assembly; 641, second hydraulic telescopic rod; 642, pressing plate; 6421, strip slot; 650, bubble scraping assembly; 651, first connecting column; 652, second connecting column; 653, bubble scraper; 654, mounting slot; 655, spring; 656, limiting slot; 657, limiting block; 658, connecting plate; 660, second annular sealing ring; 700. Lifting plate; 710. First through hole; 800, top plate; 810, guide rod; 900. A first hydraulic telescopic rod. DETAILED DESCRIPTION

[0033] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0034] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0035] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0036] like Figure 1-15As shown, a packaging film coating device suitable for integrated circuit chip processing includes a top plate 800, a lifting plate 700 is arranged below the top plate 800, a first hydraulic telescopic rod 900 is installed at the center of the upper surface of the top plate 800 for driving the lifting plate 700 to move in the Y-axis direction, and the bottom end of the first hydraulic telescopic rod 900 passes through the surface of the top plate 800 and is connected to the lifting plate 700, and a film coating mechanism for pressing and cutting the protective film covered on the wafer and eliminating bubbles is arranged on the lifting plate 700 600, a wafer placement assembly 200 for placing wafers and ejecting wafers is arranged directly below the film coating mechanism 600, and the wafer placement assembly 200 is installed at the top of the mounting frame 100, and a film collection roller assembly 300 for collecting the protective film and a film placing roller assembly 400 for placing the protective film are respectively installed on both sides of the top of the mounting frame 100, and the film collection roller assembly 300 and the film placing roller assembly 400 are arranged in coordination, so that the protective film can be transported between the film coating mechanism 600 and the wafer placement assembly 200; The film coating mechanism 600 is provided with a bubble scraping assembly 650 for scraping bubbles between the wafer and the protective film, and a film pressing assembly 640 for pressing and limiting the protective film covered on the wafer. The film coating mechanism 600 is provided with a cutting shell 610, and a ring-shaped cutter 614 for rotating and cutting the protective film is installed at the bottom end of the cutting shell 610. A first sealing bearing 611 is installed at the center of the upper surface of the cutting shell 610, and a mounting plate 630 is installed on the inner side of the first sealing bearing 611. A vacuum pump 620 for evacuating the interior of the cutting shell 610 is installed on one side of the upper surface of the mounting plate 630. The vacuum pump 620 can evacuate the internal cavity between the film coating mechanism 600 and the wafer placement assembly 200, and can effectively eliminate bubbles generated between the protective film covered on the wafer under a vacuum state. The lifting plate 700 is provided with a driving mechanism 500 for driving the cutting housing 610 and the bubble scraping assembly 650 to rotate. When the driving mechanism 500 is activated, the cutting housing 610 or the bubble scraping assembly 650 can be driven to rotate.

[0037] The first through holes 710 are opened at the four corners of the surface of the lifting plate 700, and a guide rod 810 is installed in the first through hole 710. The outer wall of the guide rod 810 and the hole wall of the first through hole 710 are connected by a gap. The top end of the guide rod 810 is installed on the lower surface of the top plate 800, and the bottom end of the guide rod 810 is installed on the top of the mounting frame 100. Because the outer wall of the guide rod 810 and the hole wall of the first through hole 710 are connected by a gap, the movement of the lifting plate 700 can be limited and guided, thereby enhancing the stability of the lifting plate 700 when moving in the Y-axis direction.

[0038] A stepper motor 510 is provided on the driving mechanism 500, and the stepper motor 510 is installed on one side of the upper surface of the lifting plate 700. The output shaft of the stepper motor 510 passes through the surface of the lifting plate 700 and is connected to the first connecting shaft 521 through a coupling, and a double-groove pulley 520 is installed at the bottom end of the first connecting shaft 521. The first transmission assembly 540 and the second transmission assembly 580 are respectively provided on both sides of the double-groove pulley 520. When the stepper motor 510 is started, it will drive the first connecting shaft 521 to rotate, and the rotation of the first connecting shaft 521 will drive the double-groove pulley 520 to rotate.

[0039] The first transmission assembly 540 and the second transmission assembly 580 are both provided with a hollow single-groove pulley 584. The double-groove pulley 520 is connected to the hollow single-groove pulley 584 on the first transmission assembly 540 and the hollow single-groove pulley 584 on the second transmission assembly 580 through a transmission belt 530. The rotation of the double-groove pulley 520 will drive the hollow single-groove pulley 584 to rotate through the transmission belt 530. Both sides of the top of the hollow single-groove pulley 584 are connected by a first connecting rod 5 82 is connected to the arc-shaped slider 581, and the other end of the arc-shaped slider 581 is installed on the annular slide rail 583. The arc-shaped slider 581 and the annular slide rail 583 are slidably connected, and the annular slide rail 583 is installed on the lower surface of the lifting plate 700. The coordinated arrangement of the arc-shaped slider 581, the annular slide rail 583, the first connecting rod 582 and other structures can guide the rotation of the hollow single-groove pulley 584, thereby enhancing the stability of the hollow single-groove pulley 584 or the rotating disk 585 when rotating; A rotating disk 585 is provided on the inner side of the hollow single-groove pulley 584, and a second groove 5852 is provided on the circumferential outer wall of the rotating disk 585, and there are four second grooves 5852, and the four second grooves 5852 are distributed in a ring array, and a second electromagnet 5855 is installed at one end of the inner side of the second groove 5852, and a second iron block 5853 is magnetically adsorbed on one end of the second electromagnet 5855, and the second iron block 5853 is connected to the first iron block 5851 through a second connecting rod 5854, and there is a clearance fit between the outer walls of the first iron block 5851 and the second iron block 5853 and the groove wall of the second groove 5852, and a first groove 5842 is provided on the circumferential inner wall of the hollow single-groove pulley 584, and there are four first grooves 5842, and the four first grooves 5842 are distributed in a ring array, and the first groove 584 2 is installed with a first electromagnet 5841 at one end of the inner side, the inner diameter of the first groove 5842 is equal to the inner diameter of the second groove 5852, because the outer wall of the first iron block 5851 and the second iron block 5853 and the groove wall of the second groove 5852 are clearance-matched, the inner diameter of the first groove 5842 is equal to the inner diameter of the second groove 5852, so that the movement of the first iron block 5851 and the second iron block 5853 can be limited and guided. The first electromagnet 5841, the second electromagnet 5855, the first groove 5842, the second groove 5852, the first iron block 5851 and the second iron block 5853 are arranged in coordination, and the staff can control the cutting shell 610 or the bubble scraping assembly 650 to rotate by controlling the connection state between the hollow single-groove pulley 584 and the rotating disk 585.

[0040] A second connecting shaft 550 is installed at the center position of the lower surface of the rotating disk 585 on the first transmission component 540, and the other end of the second connecting shaft 550 passes through the second sealing bearing 632 and extends to the interior of the cutting shell 610 and is connected to the top of the bubble scraping component 650, and the second sealing bearing 632 is arranged at the center position of the surface of the mounting plate 630. When the rotating disk 585 on the first transmission component 540 rotates, the bubble scraping component 650 is driven to rotate through the second connecting shaft 550. A third connecting shaft 570 is installed at the center position of the upper surface of the rotating disk 585 on the second transmission component 580, and the other end of the third connecting shaft 570 is installed in the bearing seat 560, and the bearing seat 560 is located in the annular On the inner side of the slide rail 583, the third connecting shaft 570 is installed on one side of the lower surface of the lifting plate 700. A fourth connecting shaft 591 is installed at the center position of the lower surface of the rotating disk 585 on the second transmission assembly 580. A driving gear 590 is installed at the bottom end of the fourth connecting shaft 591. The driving gear 590 is meshed and connected with the driven gear 612, and the driven gear 612 is installed above the circumferential outer wall of the cutting shell 610. When the rotating disk 585 on the second transmission assembly 580 rotates, the driving gear 590 is driven to rotate through the fourth connecting shaft 591. The rotation of the driving gear 590 drives the driven gear 612 to rotate. The rotation of the driven gear 612 drives the cutting shell 610 to rotate.

[0041] A first connecting column 651 is provided on the bubble scraping assembly 650, and a mounting slot 654 is provided at the center position of the bottom end of the first connecting column 651. A connecting plate 658 is installed in the mounting slot 654, and the outer wall of the connecting plate 658 is connected with the hole wall of the mounting slot 654 with a gap. Since the outer wall of the connecting plate 658 is connected with the hole wall of the mounting slot 654 with a gap, the movement of the connecting plate 658 can be limited and guided. A spring 655 is provided between the upper surface of the connecting plate 658 and the top of the inner side of the mounting slot 654. The setting of the spring 655 is that when the cutting shell 610 moves downward, the pressure plate 642 and the bubble scraper 653 will first contact the surface of the protective film. When the protective film is cut, the staff starts the second hydraulic telescopic rod 641 to move the pressure plate 642 upward a certain distance. When the staff moves the cutting shell 610 downward again, the spring 655 is compressed at this time, and the bubble scraper 653 will not continue to move downward. A limiting block 657 is installed on the circumferential outer wall of the plate 658. There are four limiting blocks 657, and the four limiting blocks 657 are arranged in a ring array. The other end of the limiting block 657 is installed in the limiting slot 656. The outer wall of the limiting block 657 and the hole wall of the limiting slot 656 are connected by a gap. Since the outer wall of the limiting block 657 and the hole wall of the limiting slot 656 are connected by a gap, the movement of the connecting plate 658 can be further limited and guided. The limiting slot 656 is provided in the installation slot 6 There are four limit slots 656 on the hole wall of 54, and the four limit slots 656 are distributed in a ring array. A second connecting column 652 is installed on the lower surface of the connecting plate 658. The other end of the second connecting column 652 extends to the outside and is connected to the bubble scraper 653. Due to the matching arrangement of the limit block 657 and the limit slot 656, when the first connecting column 651 rotates, the rotation of the first connecting column 651 will drive the connecting plate 658 and the second connecting column 652 to rotate through the limit block 657.

[0042] A second hydraulic telescopic rod 641 is provided on the film pressing assembly 640. The second hydraulic telescopic rod 641 is at the front and rear ends of the upper surface of the cutting shell 610. The bottom end of the second hydraulic telescopic rod 641 penetrates the cutting shell 610 and extends to the interior of the cutting shell 610 and is connected to the pressing plate 642. A second annular sealing ring 660 is provided at the connection between the second hydraulic telescopic rod 641 and the cutting shell 610. The second annular sealing ring 660 can seal the connection between the second hydraulic telescopic rod 641 and the cutting shell 610. A strip groove 6421 is provided on the surface of the pressing plate 642.

[0043] The wafer placement assembly 200 is provided with a third hydraulic telescopic rod 210, the bottom end of the third hydraulic telescopic rod 210 is mounted on the inner bottom end of the mounting frame 100, the top end of the third hydraulic telescopic rod 210 passes through the second through hole 224 and is connected to the wafer ejection plate 230, and the second through hole 224 is opened at the center of the lower surface of the wafer placement plate 220, the wafer ejection plate 230 is arranged in the wafer placement groove 225, and the wafer placement groove 225 is opened at the center of the surface of the wafer placement plate 220, and the third hydraulic telescopic rod 210 is connected to the wafer ejection plate 230. The three hydraulic telescopic rods 210, the wafer placement groove 225, the wafer placement plate 220, the wafer ejection plate 230 and other structures are arranged in coordination. The wafer is placed on the top of the wafer ejection plate 230, and the wafer is located in the wafer placement groove 225. When the wafer needs to be removed after the film is completed, the staff starts the third hydraulic telescopic rod 210. The extension of the third hydraulic telescopic rod 210 will drive the wafer ejection plate 230 to move in the Y-axis direction. The staff makes the third hydraulic telescopic rod 210 drive the wafer ejection plate 230 to move. The wafer 30 is moved upward in the Y-axis direction, so that the wafer after coating is moved out of the wafer placement groove 225, which is convenient for the staff to take out the wafer after coating. The outer side of the wafer placement groove 225 is provided with a cutter placement groove 221, and the outer side of the cutter placement groove 221 is provided with a bump placement groove 222, and the bump placement groove 222 is located above the cutter placement groove 221, and the cutter placement groove 221 and the bump placement groove 222 are both provided on the surface of the wafer placement plate 220, and the bump placement groove A sealing groove 223 is provided at the inner bottom end of 222, and a third annular sealing ring 231 is installed at the center position of the lower surface of the wafer ejection plate 230. The third annular sealing ring 231 is arranged so that when the annular cutter 614 moves to the cutter placement groove 221 and the third annular sealing ring 231 moves into the sealing groove 223, the third annular sealing ring 231 can seal the connection between the cutting shell 610 and the wafer placement plate 220. The wafer placement plate 220 is installed at the top of the mounting frame 100.

[0044] The upper surface of the mounting plate 630 is connected to the lower surface of the lifting plate 700 through the third connecting rod 631, and an annular protrusion 613 is installed below the outer wall of the cutting shell 610, and a first annular sealing ring 615 is installed on the lower surface of the annular protrusion 613. When the wafer ejection plate 230 is located at the inner bottom end of the wafer placement groove 225, the first annular sealing ring 615 is located in the second through hole 224. At this time, the first annular sealing ring 615 can seal the top of the second through hole 224.

[0045] When in use, the external power supply is turned on. When the staff performs the coating operation on the wafer, after the staff places the wafer into the wafer placement slot 225, the staff starts the first hydraulic telescopic rod 900 to extend and retract, and makes the first hydraulic telescopic rod 900 drive the lifting plate 700 and the coating mechanism 600 to make a downward linear motion in the Y-axis direction. The staff makes the pressing plate 642 exert a certain pressing force on the wafer and the protective film. After the protective film covers the upper surface of the wafer, the first hydraulic telescopic rod 900 is closed. The staff makes the first electromagnet 5841 on the second transmission assembly 580 energized and magnetic, and makes the second electromagnet 5855 on the second transmission assembly 580 de-energized and loses its magnetism. Then, the first electromagnet 58 After the magnetism is obtained, the first iron block 5851 can be sucked from the second groove 5852 into the first groove 5842, and the first electromagnet 5841 and the first iron block 5851 are magnetically attracted to each other. The hollow single-groove pulley 584 on the second transmission assembly 580 and the rotating disk 585 are in a connected state. At this time, the staff starts the stepper motor 510 on the driving mechanism 500. The stepper motor 510 starts to drive the hollow single-groove pulley 584 and the rotating disk 585 on the second transmission assembly 580 to rotate. The rotating disk 585 on the second transmission assembly 580 rotates, which drives the driving gear 590 on the fourth connecting shaft 591 to rotate. The driving gear 590 rotates, which drives the driven gear 612 to rotate. , the rotation of the driving gear 590 will drive the annular cutter 614 on the cutting shell 610 to rotate, and the annular cutter 614 can rotate and cut the protective film when it rotates. When the protective film cutting and laminating are completed, the stepper motor 510 is turned off, and the staff starts the first hydraulic telescopic rod 900 to extend and retract, and makes the lifting plate 700 and the laminating mechanism 600 move downward in the Y-axis direction again. The staff moves the annular cutter 614 into the cutter placement groove 221, and the third annular sealing ring 231 moves into the sealing groove 223. At this time, the internal cavity between the laminating mechanism 600 and the wafer placement assembly 200 is in a sealed state, and the staff starts the vacuum pump 620 to vacuum the laminating mechanism 600 and the wafer placement assembly 20 0 is evacuated. In a vacuum environment, the bubbles generated between the wafer and the protective film can be gradually reduced or disappeared, and the bubbles generated by the adhesion between the wafer and the protective film can be effectively removed, which can ensure the quality of the film on the wafer surface. When removing bubbles in a vacuum environment, the staff starts the second hydraulic telescopic rod 641 to extend and retract and make the pressing plate 642 move upward in a straight line in the Y-axis direction. The staff moves the pressing plate 642 to a certain horizontal height, releases the pressure on the protective film covered on the wafer and releases the limit on the bubble scraper plate, and then closes the second hydraulic telescopic rod 641. The staff disconnects the power to the first electromagnet 5841 on the second transmission assembly 580 and makes it lose its magnetism.After the second electromagnet 5855 on the second transmission component 580 is energized and has magnetism, the second electromagnet 5855 can absorb and magnetically adsorb the second iron block 5853 after it has magnetism, and the first iron block 5851 will move from the first groove 5842 to the second groove 5852, releasing the connection between the hollow single-groove pulley 584 and the rotating disk 585 on the second transmission component 580. The staff energizes the first electromagnet 5841 on the first transmission component 540 and makes it magnetic, so that the second electromagnet 5855 on the first transmission component 540 is powered off and loses magnetism, and the first iron block 5851 on the first transmission component 540 is absorbed into the first groove 5842, and after the first iron block 5851 and the first electromagnet 5841 are magnetically adsorbed, at this time, the hollow single-groove pulley 584 on the first transmission component 540 and the rotating disk are connected. In the connected state, the staff starts the stepper motor 510 on the driving mechanism 500 again. At this time, the stepper motor 510 starts to drive the single groove pulley and the rotating disk 585 on the first transmission component 540 to rotate. The rotation of the rotating disk 585 on the first transmission component 540 drives the second connecting shaft 550 to rotate. The rotation of the second connecting shaft 550 drives the bubble scraping component 650 to rotate. The rotation of the bubble scraping component 650 causes the bubble scraper 653 to rotate. The bubble scraper 653 can flatten the protective film covering the upper surface of the wafer and scrape off the bubbles generated between the wafer and the protective film, thereby further effectively removing the bubbles generated by the adhesion between the wafer and the protective film and effectively avoiding the wrinkles generated by the adhesion between the wafer and the protective film, and further ensuring the quality of the film coated on the wafer surface.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging film coating device suitable for integrated circuit chip processing, comprising a top plate (800), characterized in that: A lifting plate (700) is arranged below the top plate (800), a first hydraulic telescopic rod (900) for driving the lifting plate (700) to move in the Y-axis direction is installed at the center of the upper surface of the top plate (800), and the bottom end of the first hydraulic telescopic rod (900) passes through the surface of the top plate (800) and is connected to the lifting plate (700), a coating mechanism (600) for pressing and cutting the protective film covered on the wafer and eliminating bubbles is arranged on the lifting plate (700), a wafer placement assembly (200) for placing the wafer and ejecting the wafer is arranged directly below the coating mechanism (600), and the wafer placement assembly (200) is installed at the top of the mounting frame (100), and a film collection roller assembly (300) for collecting the protective film and a film placement roller assembly (400) for releasing the protective film are respectively installed on both sides of the top of the mounting frame (100); The film coating mechanism (600) is provided with a bubble scraping assembly (650) for scraping bubbles between the wafer and the protective film, and a film pressing assembly (640) for pressing and limiting the protective film covered on the wafer; the film coating mechanism (600) is provided with a cutting shell (610), and a ring-shaped cutter (614) for rotary cutting the protective film is installed at the bottom end of the cutting shell (610); a first sealing bearing (611) is installed at the center of the upper surface of the cutting shell (610), and a mounting plate (630) is installed on the inner side of the first sealing bearing (611); and a vacuum pump (620) for evacuating the interior of the cutting shell (610) is installed on one side of the upper surface of the mounting plate (630); The lifting plate (700) is provided with a driving mechanism (500) for driving the cutting shell (610) and the bubble scraping assembly (650) to rotate.

2. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The lifting plate (700) has first through holes (710) at four corners of its surface, a guide rod (810) is installed in the first through hole (710), an outer wall of the guide rod (810) and a hole wall of the first through hole (710) are connected with a gap, the top end of the guide rod (810) is installed on the lower surface of the top plate (800), and the bottom end of the guide rod (810) is installed on the top end of the mounting frame (100).

3. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The driving mechanism (500) is provided with a stepper motor (510), which is mounted on one side of the upper surface of the lifting plate (700); an output shaft on the stepper motor (510) passes through the surface of the lifting plate (700) and is connected to a first connecting shaft (521) via a coupling; a double-groove pulley (520) is mounted at the bottom end of the first connecting shaft (521); and a first transmission assembly (540) and a second transmission assembly (580) are respectively disposed on both sides of the double-groove pulley (520).

4. The packaging and coating device suitable for integrated circuit chip processing according to claim 3 is characterized in that: The first transmission component (540) and the second transmission component (580) are both provided with a hollow single-groove pulley (584); the double-groove pulley (520) is respectively connected to the hollow single-groove pulley (584) on the first transmission component (540) and the hollow single-groove pulley (584) on the second transmission component (580) via a transmission belt (530); both sides of the top end of the hollow single-groove pulley (584) are connected to an arc-shaped slider (581) via a first connecting rod (582); the other end of the arc-shaped slider (581) is mounted on an annular slide rail (583); the arc-shaped slider (581) and the annular slide rail (583) are slidably connected, and the annular slide rail (583) is mounted on the lower surface of the lifting plate (700); A rotating disk (585) is arranged on the inner side of the hollow single groove pulley (584), and a second groove (5852) is provided on the circumferential outer wall of the rotating disk (585), and there are four second grooves (5852), and the four second grooves (5852) are distributed in a ring array, and a second electromagnet (5855) is installed at one end of the inner side of the second groove (5852), and a second iron block (5853) is magnetically attracted to one end of the second electromagnet (5855), and the second iron block (5853) is connected to the first iron block (5853) through a second connecting rod (5854). 51), and the outer walls of the first iron block (5851) and the second iron block (5853) are clearance-matched with the groove wall of the second groove (5852); a first groove (5842) is provided on the circumferential inner wall of the hollow single-groove pulley (584); there are four first grooves (5842), and the four first grooves (5842) are distributed in a ring-shaped array; a first electromagnet (5841) is installed at one end of the inner side of the first groove (5842); and the inner diameter of the first groove (5842) is equal to the inner diameter of the second groove (5852).

5. The packaging and coating device suitable for integrated circuit chip processing according to claim 4, characterized in that: A second connecting shaft (550) is installed at a central position on the lower surface of the rotating disk (585) on the first transmission assembly (540); the other end of the second connecting shaft (550) passes through the second sealing bearing (632), extends into the interior of the cutting shell (610), and is connected to the top of the bubble scraping assembly (650); the second sealing bearing (632) is arranged at a central position on the surface of the mounting plate (630); a third connecting shaft (570) is installed at a central position on the upper surface of the rotating disk (585) on the second transmission assembly (580); the third connecting shaft (570) The other end of the second transmission assembly (580) is mounted in a bearing seat (560), the bearing seat (560) is located on the inner side of the annular slide rail (583), and the third connecting shaft (570) is mounted on one side of the lower surface of the lifting plate (700). A fourth connecting shaft (591) is mounted at the center of the lower surface of the rotating disk (585) on the second transmission assembly (580), and a driving gear (590) is mounted at the bottom end of the fourth connecting shaft (591). The driving gear (590) is meshedly connected with a driven gear (612), and the driven gear (612) is mounted above the circumferential outer wall of the cutting shell (610).

6. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The bubble scraping assembly (650) is provided with a first connecting column (651), a mounting slot (654) is provided at the center of the bottom end of the first connecting column (651), a connecting plate (658) is installed in the mounting slot (654), and a gap connection is formed between the outer wall of the connecting plate (658) and the hole wall of the mounting slot (654), a spring (655) is provided between the upper surface of the connecting plate (658) and the top end of the inner side of the mounting slot (654), and a limiting block (657) is installed on the circumferential outer wall of the connecting plate (658), and there are four limiting blocks (657), and the four limiting blocks (657) are provided in a plurality of sizes. The limit blocks (657) are distributed in a ring-shaped array, the other end of the limit blocks (657) is installed in the limit slot (656), the outer wall of the limit block (657) and the hole wall of the limit slot (656) are gap-connected, the limit slot (656) is opened on the hole wall of the installation slot (654), there are four limit slots (656), and the four limit slots (656) are distributed in a ring-shaped array, the lower surface of the connecting plate (658) is installed with a second connecting column (652), the other end of the second connecting column (652) extends to the outside and is connected to the bubble scraper (653).

7. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The film pressing assembly (640) is provided with a second hydraulic telescopic rod (641), and the second hydraulic telescopic rod (641) is at the front and rear ends of the upper surface of the cutting shell (610). The bottom end of the second hydraulic telescopic rod (641) penetrates the cutting shell (610) and extends into the interior of the cutting shell (610) and is connected to the pressing plate (642). A second annular sealing ring (660) is provided at the connection between the second hydraulic telescopic rod (641) and the cutting shell (610), and a strip-shaped slot (6421) is opened on the surface of the pressing plate (642).

8. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The wafer placement assembly (200) is provided with a third hydraulic telescopic rod (210), the bottom end of the third hydraulic telescopic rod (210) is mounted on the inner bottom end of the mounting frame (100), the top end of the third hydraulic telescopic rod (210) passes through the second through hole (224) and is connected to the wafer ejection plate (230), and the second through hole (224) is opened at the center position of the lower surface of the wafer placement plate (220), the wafer ejection plate (230) is arranged in the wafer placement groove (225), and the wafer placement groove (225) is opened at the center position of the surface of the wafer placement plate (220), and the wafer placement groove (225) is opened at the center position of the surface of the wafer placement plate (220). 25) is provided with a cutting knife placement groove (221), and a bump placement groove (222) is provided on the outer side of the cutting knife placement groove (221), the bump placement groove (222) is located above the cutting knife placement groove (221), and the cutting knife placement groove (221) and the bump placement groove (222) are both provided on the surface of the wafer placement plate (220), a sealing groove (223) is provided at the inner bottom end of the bump placement groove (222), a third annular sealing ring (231) is installed at the center position of the lower surface of the wafer ejection plate (230), and the wafer placement plate (220) is installed on the top of the mounting frame (100).

9. The packaging and coating device suitable for integrated circuit chip processing according to claim 1, characterized in that: The upper surface of the mounting plate (630) is connected to the lower surface of the lifting plate (700) via a third connecting rod (631); an annular protrusion (613) is installed below the outer wall of the cutting shell (610); and a first annular sealing ring (615) is installed on the lower surface of the annular protrusion (613).

Images