Supporting column driving structure on wafer supporting disc of single wafer cleaning device

Abstract

The invention relates to a supporting column driving structure on a wafer supporting disc of a single wafer cleaning device, and belongs to the technical field of wafer production equipment. Outer teeth are arranged on an outer ring of a rotating piece of the supporting column driving structure on the wafer supporting disc of the single wafer cleaning device, the outer teeth are meshed with a supporting column driving gear and a balance weight body at the same time, the balance weight body plays a damping role in rotation of the rotating piece, and meanwhile the damping action direction is kept consistent with the rotating direction of the rotating piece. Rotation of the rotating part can be stabilized, vibration is reduced, and the safety of clamping the wafer by the supporting column is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a support column driving structure on a wafer support plate of a single-wafer cleaning device. Background Art

[0002] Chinese invention patent document CN118099074A discloses an integrated wafer support plate structure for a single wafer cleaning device. It includes: a plate surface, a support column and a driving mechanism. The driving mechanism drives the driving gear at the bottom of the support column through the gear, thereby driving the support column of the plate surface to rotate and clamp the wafer. Since the entire mechanism needs to rotate quickly, the vibration is relatively severe, and the vibration may also cause the wafer to be easily damaged when clamped. Summary of the invention

[0003] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a support column driving structure on a wafer support plate of a single-wafer cleaning device with damped rotation to improve wafer safety.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A support column driving structure on a wafer support plate of a single wafer cleaning device, comprising:

[0006] The disk has an installation space inside;

[0007] The rotating member comprises an inner ring and an outer ring, wherein the inner ring has inner teeth and the outer ring has outer teeth;

[0008] A driving member meshing with the internal teeth for driving the rotating member to rotate so that the rotating member changes between an initial state and a clamping state;

[0009] An elastic member, used for applying elastic force to the rotating member to restore the rotating member to an initial state;

[0010] A counterweight body, comprising a rotating column and a protrusion arranged on the rotating column, wherein one end of the protrusion close to the rotating column has a counterweight body gear meshing with the external teeth, and the other end of the protrusion extends in a direction away from the rotating column and forms a weight end;

[0011] The support column driving gear is meshed with the outer teeth, and the rotating member can drive the support column driving gear to swing when changing from an initial state to a clamping state.

[0012] Preferably, in the support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention, the counterweight gear is a sector gear.

[0013] Preferably, in the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention, the elastic member comprises a spring, one end of the spring is connected to the fixed column located on the rotating member, and the other end is connected to the fixed member located on the disk surface.

[0014] Preferably, in the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention, an arc groove is provided on the rotating part, and the fixed part is connected to the disk surface through the arc groove, so that all the fixed columns and the connecting columns between the fixed part and the disk surface are located in the same circle.

[0015] Preferably, the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention is provided with a first clamping block and / or a second clamping block on the disk surface, the first clamping block is used to press the inner ring, and the second clamping block is used to press the outer ring.

[0016] Preferably, in the support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention, the inner sides of the inner ring and the outer ring have recessed steps, and the first pressing block and the second pressing block abut against the steps.

[0017] Preferably, in the support column driving structure on the wafer support disk of the single-wafer cleaning device of the present invention, the first clamping block and the second clamping block are arc-shaped blocks, and the first clamping block and the second clamping block are connected to the disk surface by screws.

[0018] Preferably, in the driving structure of the support column on the wafer support disk of the single-wafer cleaning device of the present invention, a plurality of clamping wheels are further arranged on the disk surface, and the clamping wheels are tightly attached to the inner wall of the outer ring.

[0019] The beneficial effects of the present invention are:

[0020] The support column driving structure on the wafer support plate of the single-wafer cleaning device of the present invention has external teeth on the outer ring of the rotating part, and the external teeth are meshed with the support column driving gear and the counterweight body at the same time. The counterweight body has a damping effect on the rotation of the rotating part. At the same time, the direction of the damping effect is consistent with the rotation direction of the rotating part, which can stabilize the rotation of the rotating part, reduce vibration, and improve the safety of the support column when clamping the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 4 is a front view of a support column driving structure on a wafer support plate of a single wafer cleaning device according to an embodiment of the present application;

[0023] Figure 2 It is a three-dimensional diagram of the driving structure of the support column on the wafer support plate of the single wafer cleaning device according to the embodiment of the present application;

[0024] Figure 3 It is a partial enlarged view of the driving structure of the support column on the wafer support plate of the single wafer cleaning device of the embodiment of the present application;

[0025] The reference numerals in the figure are:

[0026] 1 disk;

[0027] 2 rotating parts;

[0028] 21 inner ring;

[0029] 22 outer ring;

[0030] 23 steps;

[0031] 24 arc grooves;

[0032] 211 internal teeth;

[0033] 221 external teeth;

[0034] 3. Driving parts;

[0035] 41 first pressing block;

[0036] 42 second pressing block;

[0037] 5. Clamping wheel;

[0038] 6 elastic parts;

[0039] 61 Spring;

[0040] 62 fixed column;

[0041] 63 fixings;

[0042] 7. Counterweight;

[0043] 71 Rotating Column;

[0044] 72 Bump;

[0045] 721 counterweight gear;

[0046] 722 Heavy End;

[0047] 8 Support column drive gear. DETAILED DESCRIPTION

[0048] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0049] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0050] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0051] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0052] Example

[0053] This embodiment provides a support column driving structure on a wafer support plate of a single wafer cleaning device, such as Figure 1 As shown, including:

[0054] The disk 1 has an installation space inside;

[0055] The rotating member 2 comprises an inner ring 21 and an outer ring 22. The inner ring 21 has inner teeth 211, and the outer ring 22 has outer teeth 221. The inner ring 21 and the outer ring 22 are connected by a connecting portion, and other parts except the connecting portion are hollow.

[0056] The driving member 3 is meshed with the inner teeth 211 and is used to drive the rotating member 2 to rotate so that the rotating member 2 changes between an initial state and a clamping state;

[0057] The elastic member 6 is used to apply elastic force to the rotating member 2 to restore the rotating member 2 to an initial state;

[0058] The counterweight body 7 includes a rotating column 71 and a protrusion 72 disposed on the rotating column 71, wherein one end of the protrusion 72 close to the rotating column 71 has a counterweight body gear 721 meshing with the external teeth 221, and the other end of the protrusion 72 extends in a direction away from the rotating column 71 and forms a weight end 722;

[0059] The support column driving gear 8 is meshed with the outer teeth 221, and the rotating member 2 changes from the initial state to the clamping state to drive the support column driving gear 8 to swing.

[0060] The support column driving structure on the wafer support plate of the single-wafer cleaning device of this embodiment has an outer tooth 221 on the outer ring 22 of the rotating part 2. The outer tooth 221 is meshed with the support column driving gear 8 and the counterweight body 7 at the same time. The counterweight body 7 has a damping effect on the rotation of the rotating part 2. At the same time, the direction of the damping effect is consistent with the rotation direction of the rotating part 2, which can stabilize the rotation of the rotating part 2, reduce vibration, and improve the safety of the support column when clamping the wafer.

[0061] The unenlarged end of the weight end 722 may also be a mounted weight block.

[0062] Furthermore, the counterweight gear 721 is a sector gear, that is, a gear having only one arc section. The sector gear can save materials and reduce the volume of the disc 1 at the same time.

[0063] Furthermore, the elastic member 6 always applies elastic force to the rotating member 2, and once the driving member 3 no longer applies driving force, the rotating member 2 can immediately return from the clamped state to the initial state. The elastic member 6 includes a spring 61, one end of the spring 61 is connected to a fixing column 62 located on the rotating member 2, and the other end is connected to a fixing member 63 located on the disk surface 1.

[0064] Furthermore, the rotating member 2 is provided with an arc groove 24, and the fixing member 63 passes through the arc groove 24 to connect with the disk surface 1, so that all the fixing columns 62 and the connecting columns of the fixing member 63 and the disk surface 1 are located in the same circle. All the fixing columns 62 and the connecting columns of the fixing member 63 and the disk surface 1 are in the same circle, which can make the elastic force consistent with the rotation direction of the rotating member 2, and make the elastic force highly efficiently converted into the force to drive the rotating member 2 (that is, the elastic force is basically distributed along the tangent direction of the arc, and there is no need to decompose it in the diameter direction of the circle, thereby reducing the driving efficiency of the elastic force). In the actual assembly process, the different spring elastic coefficients will not cause the rotating member 2 to be subjected to force in one direction (the force in the diameter direction cannot be balanced).

[0065] The support column driving gear 8 is connected to the support column, and the support column is located on the top surface of the disk surface 1. The support column can swing to clamp or loosen the wafer.

[0066] Furthermore, a first pressing block 41 and / or a second pressing block 42 are provided on the disk surface 1 . The first pressing block 41 is used to press the inner ring 21 , and the second pressing block 42 is used to press the outer ring 22 .

[0067] Furthermore, the inner sides of the inner ring 21 and the outer ring 22 have inwardly recessed steps 23 , and the first pressing block 41 and the second pressing block 42 abut against the steps 23 .

[0068] Furthermore, the first pressing block 41 and the second pressing block 42 are arc-shaped blocks, and the first pressing block 41 and the second pressing block 42 are connected to the disk surface 1 by screws.

[0069] Furthermore, a plurality of clamping wheels 5 are provided on the disk surface 1 , and the clamping wheels 5 are tightly attached to the inner wall of the outer ring 22 .

[0070] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A support column driving structure on a wafer support plate of a single wafer cleaning device, characterized in that: include: A disk (1) having an installation space therein; The rotating member (2) comprises an inner ring (21) and an outer ring (22), wherein the inner ring (21) has inner teeth (211) and the outer ring (22) has outer teeth (221); A driving member (3) meshing with the inner teeth (211) and used for driving the rotating member (2) to rotate so that the rotating member (2) changes between an initial state and a clamping state; An elastic member (6) is used to apply elastic force to the rotating member (2) so that the rotating member (2) returns to an initial state; A counterweight body (7), comprising a rotating column (71), and a protrusion (72) arranged on the rotating column (71), wherein one end of the protrusion (72) close to the rotating column (71) has a counterweight body gear (721) meshing with the external teeth (221), and the other end of the protrusion (72) extends in a direction away from the rotating column (71) and forms a weight end (722); The support column driving gear (8) is meshed with the outer teeth (221), and the rotating member (2) can drive the support column driving gear (8) to swing when changing between the initial state and the clamping state.

2. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 1, characterized in that: The counterweight gear (721) is a sector gear.

3. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 1, characterized in that: The elastic member (6) comprises a spring (61), one end of the spring (61) is connected to a fixed column (62) located on the rotating member (2), and the other end of the spring (61) is connected to a fixed member (63) located on the disk surface (1).

4. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 3, characterized in that: The rotating member (2) is provided with an arc groove (24), and the fixing member (63) passes through the arc groove (24) to be connected to the disk surface (1), so that all the fixing columns (62) and the connecting columns between the fixing member (63) and the disk surface (1) are located in the same circle.

5. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 4, characterized in that: The disk surface (1) is provided with a first pressing block (41) and / or a second pressing block (42), the first pressing block (41) being used to press the inner ring (21), and the second pressing block (42) being used to press the outer ring (22).

6. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 5, characterized in that: The inner sides of the inner ring (21) and the outer ring (22) are provided with an inwardly recessed step (23), and the first pressing block (41) and the second pressing block (42) are pressed against the step (23).

7. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 5, characterized in that: The first pressing block (41) and the second pressing block (42) are arc-shaped blocks, and the first pressing block (41) and the second pressing block (42) are connected to the disk surface (1) by means of screws.

8. The support column driving structure on the wafer support plate of the single wafer cleaning device according to claim 1, characterized in that: A plurality of clamping wheels (5) are also arranged on the disk surface (1), and the clamping wheels (5) are tightly attached to the inner wall of the outer ring (22).

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