Soldering paste printing and ball mounting clamp for BGA (Ball Grid Array) packaging multi-chip assembly

Abstract

The invention discloses a soldering paste printing and ball mounting clamp used for a BGA packaging multi-chip assembly, and belongs to the technical field of microelectronic packaging, the soldering paste printing and ball mounting clamp comprises a boss arranged on a workbench, a printing cover body, a ball mounting cover body and a bearing assembly, the upper surface of the workbench is fixedly provided with two rails through supporting rods, and the two rails are arranged on the boss. The cross section of each track is of a U-shaped structure, the two ends of each track are sealed, each track is provided with an opening, the printing cover body and the ball mounting cover body are both slidably connected between the two tracks, and the bearing assembly is movably connected with the printing cover body and ascends and descends along with the printing cover body; the printing and ball mounting operation steps are simplified, in the switching process of the printing cover body and the ball mounting cover body, the bearing plate is driven by the turnover mechanism to turn over, the positions of the first groove and the second groove can be exchanged, operation is easy, and the quality of soldering paste printing and ball mounting is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic packaging, and in particular to a solder paste printing and ball planting fixture for BGA packaging multi-chip components. Background Art

[0002] BGA packaged multi-chip assembly is a high-density microelectronic assembly that assembles bare chips, discrete components and other components on a high-density interconnect substrate and interconnects and packages them, and electrically connects them to the motherboard through the base plate ball grid array (BGA, Ball Grid Array). In the assembly process of BGA packaged multi-chip assembly, solder paste printing and ball planting are necessary processes to form the solder ball array at the bottom of the multi-chip assembly. In the development process of BGA packaged multi-chip assembly, manual ball planting with the help of a fixture is a more economical and efficient method.

[0003] In the prior art, the solder paste printing and ball planting fixture is generally composed of a printing cover, a ball planting cover and a fixture body, wherein grooves of different depths are respectively opened on both sides of the chip carrier. When printing the solder paste, the chip is first placed on the groove on one side of the chip carrier. After printing is completed, the chip carrier is turned over and the chip is placed on the groove on the other side. It is also necessary to replace the printing cover and the ball planting cover. The operation process is relatively cumbersome and has certain requirements on the proficiency of the operator. Otherwise, deviations in the assembly process will directly affect the quality of solder paste printing and ball planting. Summary of the invention

[0004] The purpose of the present invention is to provide a solder paste printing and ball planting fixture for BGA packaging multi-chip components to solve the following technical problems: the operation process of the existing fixture is relatively cumbersome and has certain requirements on the proficiency of the operator. Otherwise, deviations in the assembly process will directly affect the quality of solder paste printing and ball planting.

[0005] The purpose of the present invention can be achieved by the following technical solutions: A solder paste printing and ball planting fixture for BGA packaged multi-chip components, comprising a boss, a printing cover, a ball planting cover, and a bearing assembly arranged on a workbench, wherein two tracks are fixed to the upper surface of the workbench through a support rod, the cross section of the track is a U-shaped structure and both ends are blocked, an opening is arranged on the track, the printing cover and the ball planting cover are both slidably connected between the two tracks, and the bearing assembly is movably connected to the printing cover and rises and falls with the printing cover; The carrying component includes a carrying frame and a carrying plate located inside the carrying frame, a first groove is provided on one side of the carrying plate, and a second groove is provided on the other side, first rotating shafts are rotatably installed on both side walls of the carrying frame, and the ends of the two first rotating shafts that are close to each other are fixedly connected to the carrying plate, and a flipping mechanism is provided between the ball planting cover and one of the first rotating shafts for driving the carrying plate to flip.

[0006] As a further solution of the present invention: the printing cover body and the ball planting cover body are both composed of an upper cover plate, a screen plate and a lower cover plate and are connected by screws, a plurality of through holes are arranged on the two screen plates, a connected slide groove is provided at the bottom of the two lower cover plates, two sliders are slidably connected in the slide groove, a movable rod is fixed to the bottom end of the slider, a straight slot is provided on the movable rod, two first rotating shafts are respectively located in the two straight slots, and two through holes are provided on the workbench, and the two through holes are respectively located directly below the two movable rods.

[0007] As a further solution of the present invention: the flipping mechanism includes a fixed rod fixed on the workbench and an iron sliding rod slidably connected between two tracks, a second rotating shaft is rotatably installed on the fixed rod, one end of the second rotating shaft is connected to the first rotating shaft by magnetic adsorption, and the other end is connected to a gear, a guide rod is fixed on the workbench, a sliding sleeve is slidably sleeved on the guide rod, a lifting rod is fixed on one side of the sliding sleeve, a rack meshing with the gear is arranged on the side wall of the lifting rod, a limiting block is fixed on the top of the guide rod, a mounting rod is fixed at one end of one of the tracks, a guide wheel is installed at one end of the mounting rod, a magnetic part adsorbed with the iron sliding rod is arranged on one side of the upper cover plate of the ball planting cover body, a pull rope is connected to one side of the iron sliding rod, and one end of the pull rope passes through the guide wheel and is connected to the lifting rod.

[0008] As a further solution of the present invention: a second magnetic component is fixed to one end of the first rotating shaft close to the second rotating shaft, and an adsorption component is provided to one end of the second rotating shaft close to the first rotating shaft.

[0009] As a further solution of the present invention: both ends of the iron slide bar are provided with anti-slip grooves.

[0010] As a further solution of the present invention: the printing cover body and the ball planting cover body upper cover plate are both provided with mounting grooves on their adjacent sides, and the magnetic component three and the adsorption component two are respectively fixed in the two mounting grooves.

[0011] As a further solution of the present invention: a card slot is opened on the side away from each other of the two tracks, a magnetic part four is fixed in the card slot, and an L-shaped card rod is fixed on both side walls of the supporting frame, an adsorption part three is fixed on the end of the card rod away from the supporting frame, and the card rod matches the size of the card slot.

[0012] As a further solution of the present invention: the magnetic component 1, the magnetic component 2, the magnetic component 3 and the magnetic component 4 are all magnets, and the adsorption component 1, the adsorption component 2 and the adsorption component 3 are all made of iron materials.

[0013] Beneficial effects of the present invention: (1) The present invention provides a track so that the printing cover and the ball planting cover can be freely moved and switched along the track. The receiving plate in the bearing assembly is used to place the chip. During the switching process between the printing cover and the ball planting cover, the bearing plate is driven to flip through the flipping mechanism so that the positions of the first groove and the second groove are swapped, which greatly simplifies the operation steps, reduces the difficulty of operation, and ensures the quality of solder paste printing and ball planting. (2) In the present invention, the printed cover and the bearing assembly can be raised and lowered together, and when the printed cover is switched to the ball planting cover, the bearing assembly can be raised and lowered together with the ball planting cover, thereby ensuring the continuity of operation and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a schematic diagram of the first perspective structure of the present invention as a whole; Figure 2 It is a second perspective structural schematic diagram of the present invention as a whole; Figure 3 It is a schematic diagram of the structure of the present invention after the printed cover body, the ball planting cover body and the bearing assembly are integrally hidden; Figure 4 It is a schematic diagram of the structure of the printed cover, the ball-planting cover and the bearing assembly from a first perspective of the present invention; Figure 5 It is a schematic diagram of the structure of the printed cover, the ball-planting cover and the bearing assembly from a second viewing angle of the present invention; Figure 6 yes Figure 2 The enlarged view of point A in the middle; Figure 7 yes Figure 1 The enlarged view of point B in the middle; Figure 8 yes Figure 1 Enlarged view of point C in the middle.

[0016] In the figure: 1, workbench; 101, perforation; 2, boss; 201, arc groove; 202, square groove; 3, support rod; 4, track; 401, opening; 5, printing cover; 6, ball planting cover; 7, bearing assembly; 701, bearing frame; 702, bearing plate; 703, first groove; 704, second groove; 705, first rotating shaft; 706, second magnetic part; 8, slide groove; 9, slider; 10, movable rod ; 11. Clamping rod; 12. Adsorption component three; 13. Clamping slot; 14. Magnetic component four; 15. Magnetic component three; 16. Adsorption component two; 17. Magnetic component one; 18. Iron sliding rod; 19. Fixed rod; 20. Second rotating shaft; 21. Gear; 22. Adsorption component one; 23. Guide rod; 24. Sliding sleeve; 25. Lifting rod; 26. Rack; 27. Limit block; 28. Pull rope; 29. ​​Mounting rod; 30. Guide wheel.

[0017] The drawings are only used for illustrative purposes and should not be construed as limitations on this patent. In order to better illustrate this embodiment, some parts of the drawings may be omitted, enlarged, or reduced, and do not represent the size and shape of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-5As shown, the present invention is a solder paste printing and ball planting fixture for BGA packaging multi-chip components, including a boss 2, a printing cover 5, a ball planting cover 6, and a bearing assembly 7 arranged on a workbench 1. Two rails 4 are fixed to the upper surface of the workbench 1 through a support rod 3. The cross section of the rail 4 is a U-shaped structure and both ends are blocked. An opening 401 is arranged on the rail 4. The printing cover 5 and the ball planting cover 6 are both slidably connected between the two rails 4. The bearing assembly 7 is movably connected to the printing cover 5 and rises and falls with the printing cover 5; the bearing assembly 7 includes a bearing frame 701 and a bearing plate 702 located inside the bearing frame 701. A first groove 703 is provided on one side of the carrier plate 702, and a second groove 704 is provided on the other side. First rotating shafts 705 are rotatably installed on both side walls of the carrier frame 701, and the ends of the two first rotating shafts 705 close to each other are fixedly connected to the carrier plate 702. A flipping mechanism is provided between the ball planting cover body 6 and one of the first rotating shafts 705, which is used to drive the carrier plate 702 to flip; the printing cover body 5 and the ball planting cover body 6 are composed of an upper cover plate, a screen plate and a lower cover plate and are connected by screws. A plurality of through holes are provided on the two screen plates, and a connected slide groove 8 is provided at the bottom of the two lower cover plates, and two slides are slidably connected in the slide groove 8. Block 9, a movable rod 10 is fixed to the bottom end of the slider 9, and a straight slot is opened on the movable rod 10, and two first rotating shafts 705 are respectively located in the two straight slots. Two through holes 101 are opened on the workbench 1, and the two through holes 101 are respectively located directly below the two movable rods 10; in the initial state, the printing cover body 5 is located at the opening 401, the chip is placed in the first groove 703, and then the printing cover body 5 is pressed down, and the bearing assembly 7 is synchronously lowered. When the bearing assembly 7 enters the boss 2 and is fixed, the printing cover body 5 continues to descend, and the movable rod 10 moves downward through the through hole 101, so that the printing cover body 5 can be assembled with the bearing assembly 7. Then the printing operation is carried out. After the printing is completed, the printing cover 5 is raised and reset. The movable rod 10 can be used to drive the supporting assembly 7 to reset together, and the ball planting cover 6 is pushed to move to the opening 401. During the movement of the ball planting cover 6, the supporting plate 702 is driven to rotate 180° through the flip mechanism, and the positions of the first groove 703 and the second groove 704 are interchanged. The printed chip is placed in the second groove 704, and then the ball planting cover 6 is pressed down until the boss 2, the supporting assembly 7 and the ball planting cover 6 are assembled. Then the ball planting operation can be carried out. The whole operation process is simple and the difficulty is low, which ensures the quality of solder paste printing and ball planting.

[0020] See also Figure 1 , Figure 2 , Figure 4 , Figure 6 and Figure 7The flip mechanism includes a fixed rod 19 fixed on the workbench 1 and an iron slide rod 18 slidably connected between the two tracks 4. A second rotating shaft 20 is rotatably mounted on the fixed rod 19. One end of the second rotating shaft 20 is connected to the first rotating shaft 705 by magnetic adsorption, and the other end is connected to a gear 21. A guide rod 23 is fixed on the workbench 1. A sliding sleeve 24 is slidably sleeved on the guide rod 23. A lifting rod 25 is fixed on one side of the sliding sleeve 24. A rack 26 meshing with the gear 21 is arranged on the side wall of the lifting rod 25. The guide rod 23 is provided with a guide sleeve 24. A limit block 27 is fixed on the top, a mounting rod 29 is fixed at one end of one of the tracks 4, a guide wheel 30 is installed at one end of the mounting rod 29, a magnetic piece 17 adsorbed with the iron slide bar 18 is arranged on one side of the upper cover plate of the ball planting cover body 6, a pull rope 28 is connected to one side of the iron slide bar 18, one end of the pull rope 28 passes through the guide wheel 30 and is connected to the lifting rod 25, a magnetic piece 2 706 is fixed to one end of the first rotating shaft 705 close to the second rotating shaft 20, an adsorption piece 22 is arranged at one end of the second rotating shaft 20 close to the first rotating shaft 705, and the iron slide bar 18 is connected to one side of the iron slide bar 18. Both ends of the rod 18 are provided with anti-slip grooves; since the first rotating shaft 705 and the second rotating shaft 20 are magnetically adsorbed and matched through the magnetic member 2 706 and the adsorption member 1 22, when the bearing assembly 7 is lowered, the first rotating shaft 705 and the second rotating shaft 20 are automatically separated to avoid interference. After the bearing assembly 7 is reset, the first rotating shaft 705 and the second rotating shaft 20 are automatically adsorbed and connected. When the ball planting cover 6 is pushed to move, the magnetic member 17 will adsorb the iron sliding rod 18 and move together, so that the lifting rod 25 and the rack 26 are pulled up by the pull rope 28, so that The gear 21, the second rotating shaft 20 and the first rotating shaft 705 rotate, driving the supporting plate 702 to flip. When the ball planting cover body 6 moves to the opening 401, the ball planting cover body 6 is pressed down, the magnetic part 17 is separated from the iron slide bar 18, and the ball planting cover body 6 can be lowered. Anti-slip grooves are provided at both ends of the iron slide bar 18 to prevent the iron slide bar 18 from moving freely in the track 4 after the magnetic part 17 is separated from the iron slide bar 18. By increasing the friction between the iron slide bar 18 and the track 4, the iron slide bar 18 can move only under the action of external force.

[0021] See also Figure 4 The printing cover body 5 and the ball planting cover body 6 are provided with mounting grooves on the sides close to each other, and the two mounting grooves are respectively fixed with magnetic parts 3 15 and adsorption parts 2 16; the printing cover body 5 and the ball planting cover body 6 are magnetically adsorbed and connected by magnetic parts 3 15 and adsorption parts 2 16, and when the printing cover body 5 or the ball planting cover body 6 is located at the opening 401, it is prevented from falling freely.

[0022] See also Figure 1 , Figure 4 , Figure 5 and Figure 8, a slot 13 is provided on the side away from each other of the two tracks 4, a magnetic component four 14 is fixed in the slot 13, an L-shaped clamping rod 11 is fixed to the two side walls of the carrying frame 701, an adsorption component three 12 is fixed at one end of the clamping rod 11 away from the carrying frame 701, the size of the clamping rod 11 matches the slot 13, the magnetic component one 17, the magnetic component two 706, the magnetic component three 15 and the magnetic component four 14 are all magnets, and the adsorption component one 22, the adsorption component two 16 and the adsorption component three 12 are all made of iron material; when the printing cover 5 and the ball planting cover 6 are switched, the clamping rod 11 is located in the slot 13, so that the carrying component 7 is always located in the same position and will not move horizontally.

[0023] Working principle of the present invention: in the initial state, the printing cover 5 is located at the opening 401, the chip is placed in the first groove 703, and then the printing cover 5 is pressed down, the bearing assembly 7 is synchronously lowered, the first rotating shaft 705 and the second rotating shaft 20 are automatically separated, and after the bearing assembly 7 is fixed in the boss 2, the printing cover 5 continues to descend, and the movable rod 10 moves downward through the perforation 101, so that the printing cover 5 can be assembled with the bearing assembly 7, and then the printing operation is performed. After the printing is completed, the printing cover 5 is raised and reset, and the movable rod 10 can be used to drive the bearing assembly 7 to reset together. The printing cover 5 and the ball planting cover 6 are magnetically adsorbed and connected through the magnetic part three 15 and the adsorption part two 16. At this time, the printing cover 5 will not fall, and the clamping rod 11 is located in the clamping groove 13. The magnetic part four 14 and the adsorption part three 12 make the bearing assembly 7 always at the same height; Then push the ball planting cover 6 to move to the opening 401. Since the printing cover 5 and the lower cover plate of the ball planting cover 6 are provided with a slide groove 8, the printing cover 5 and the ball planting cover 6 can be switched freely without affecting the position of the bearing component 7. During the movement of the ball planting cover 6, the magnetic part 17 will absorb the iron slide bar 18 and move together, so that the lifting rod 25 and the rack 26 are pulled up by the pull rope 28, so that the gear 21, the second rotating shaft 20 and the first rotating shaft 705 rotate, and the bearing plate 702 is driven to flip 180°. When the ball planting cover 6 moves to the opening 401, the printed chip is placed in the second groove 704, and the ball planting cover 6 is pressed down. The magnetic part 17 is separated from the iron slide bar 18, and the ball planting cover 6 can be lowered until the boss 2, the bearing component 7 and the ball planting cover 6 are assembled, and the ball planting operation can be carried out. The whole operation process is simple and the difficulty is low, which ensures the quality of solder paste printing and ball planting.

[0024] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A solder paste printing and ball planting fixture for BGA packaged multi-chip components, comprising a boss (2) arranged on a workbench (1), a printing cover (5), a ball planting cover (6), and a bearing component (7), characterized in that: The upper surface of the workbench (1) is fixed with two rails (4) via support rods (3); the cross section of the rails (4) is a U-shaped structure with both ends blocked; an opening (401) is provided on the rails (4); the printing cover (5) and the ball planting cover (6) are both slidably connected between the two rails (4); the bearing assembly (7) is movably connected to the printing cover (5) and rises and falls together with the printing cover (5); The bearing assembly (7) comprises a bearing frame (701) and a bearing plate (702) located inside the bearing frame (701); a first groove (703) is provided on one side of the bearing plate (702), and a second groove (704) is provided on the other side; first rotating shafts (705) are rotatably mounted on both side walls of the bearing frame (701), and the ends of the two first rotating shafts (705) that are close to each other are fixedly connected to the bearing plate (702); a flipping mechanism is provided between the ball planting cover (6) and one of the first rotating shafts (705) for driving the bearing plate (702) to flip.

2. The solder paste printing and ball planting fixture for BGA packaged multi-chip modules according to claim 1, characterized in that: The printing cover body (5) and the ball planting cover body (6) are both composed of an upper cover plate, a screen plate and a lower cover plate and are connected by screws. The two screen plates are both provided with a plurality of through holes. The bottoms of the two lower cover plates are provided with interconnected slide grooves (8). Two sliders (9) are slidably connected in the slide grooves (8). A movable rod (10) is fixed at the bottom end of the slider (9). A straight slot is provided on the movable rod (10). Two first rotating shafts (705) are respectively located in the two straight slots. Two through holes (101) are provided on the workbench (1), and the two through holes (101) are respectively located directly below the two movable rods (10).

3. The solder paste printing and ball planting fixture for BGA packaged multi-chip modules according to claim 2, characterized in that: The flip mechanism comprises a fixed rod (19) fixed on the workbench (1) and an iron sliding rod (18) slidably connected between two rails (4); a second rotating shaft (20) is rotatably mounted on the fixed rod (19); one end of the second rotating shaft (20) is connected to the first rotating shaft (705) by magnetic adsorption, and the other end is connected to a gear (21); a guide rod (23) is fixed on the workbench (1); a sliding sleeve (24) is slidably sleeved on the guide rod (23); a lifting rod (25) is fixed on one side of the sliding sleeve (24); and the lifting rod (25) is fixed on the lifting rod (25). A rack (26) meshing with the gear (21) is arranged on the side wall of the lowering rod (25); a limit block (27) is fixed on the top of the guide rod (23); a mounting rod (29) is fixed at one end of one of the tracks (4); a guide wheel (30) is installed at one end of the mounting rod (29); a magnetic part (17) attracted to the iron slide rod (18) is arranged on one side of the upper cover plate of the ball planting cover body (6); a pull rope (28) is connected to one side of the iron slide rod (18); one end of the pull rope (28) passes through the guide wheel (30) and is connected to the lifting rod (25).

4. The solder paste printing and ball planting fixture for BGA package multi-chip assembly according to claim 3, characterized in that: A second magnetic component (706) is fixed to one end of the first rotating shaft (705) close to the second rotating shaft (20), and an adsorption component (22) is provided to one end of the second rotating shaft (20) close to the first rotating shaft (705).

5. The solder paste printing and ball planting fixture for BGA package multi-chip assembly according to claim 3, characterized in that: Anti-slip grooves are provided at both ends of the iron slide bar (18).

6. The solder paste printing and ball planting fixture for BGA package multi-chip assembly according to claim 4, characterized in that: The printing cover body (5) and the ball planting cover body (6) are both provided with mounting grooves on the side close to each other, and the magnetic component 3 (15) and the adsorption component 2 (16) are respectively fixed in the two mounting grooves.

7. The solder paste printing and ball planting fixture for BGA packaged multi-chip modules according to claim 6, characterized in that: A slot (13) is provided on one side of the two rails (4) that are away from each other, a magnetic component four (14) is fixed in the slot (13), an L-shaped clip rod (11) is fixed to the two side walls of the support frame (701), an adsorption component three (12) is fixed to one end of the clip rod (11) away from the support frame (701), and the size of the clip rod (11) matches that of the slot (13).

8. The solder paste printing and ball planting fixture for BGA package multi-chip assembly according to claim 7, characterized in that: The magnetic component 1 (17), the magnetic component 2 (706), the magnetic component 3 (15) and the magnetic component 4 (14) are all magnets, and the adsorption component 1 (22), the adsorption component 2 (16) and the adsorption component 3 (12) are all made of iron materials.

9. The solder paste printing and ball planting fixture for BGA package multi-chip assembly according to claim 7, characterized in that: The two side walls of the boss (2) are provided with arc grooves (201), and the other two side walls are provided with square grooves (202). The arc groove (201) matches the size of the first rotating shaft (705), and the square groove (202) matches the size of the clamping rod (11).

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