Vapor chamber supporting capillary structure

Abstract

A vapor chamber supporting capillary structure comprises a first plate body, a second plate body and a capillary layer, the capillary layer is clamped between the first plate body and the second plate body and is provided with a first capillary part and a second capillary part, the second capillary part is connected with the first capillary part and extends out, a notch part is formed in any side of the second capillary part, and the first capillary part is connected with the second capillary part. The notch part is formed along the extending direction of the second capillary part; wherein the first plate body is provided with a plurality of capillary supporting structures and a plurality of plate body supporting structures, the capillary supporting structures correspond to the first capillary parts and the second capillary parts, and the plate body supporting structures correspond to the notch parts. Therefore, a large steam space is provided.

Description

Technical Field

[0001] The present application is related to a heat exchange component, in particular to a temperature evaporating plate supporting a capillary structure. Background Art

[0002] Vapor Chamber is a common heat exchange component nowadays and is widely used in occasions such as heat dissipation or heat transfer. It improves the heat transfer or heat dissipation effect by rapidly transferring heat through the phase change of the working fluid sealed inside it.

[0003] However, since the electronic products used are no longer light and thin, the thickness of the heat spreader is also increasingly required to be thinner. Therefore, the capillary structure inside the heat spreader as the working fluid refluxes also continuously occupies the entire cavity, thus affecting the transmission of the vaporized working fluid, and ultimately causing obstacles to heat transfer.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied scientific theories, and finally proposed an application with a reasonable design that effectively improves the above-mentioned deficiencies. Summary of the invention

[0005] The main purpose of the present application is to provide a temperature averaging plate supporting a capillary structure, which improves the heat conduction efficiency by providing a larger vapor space for the vaporized working fluid through the configuration of the capillary and supporting structures in the temperature averaging plate.

[0006] Another object of the present application is to provide a temperature-averaging plate supporting a capillary structure, which helps to shorten the path required for the working fluid to undergo a vapor-liquid phase change, thereby facilitating heat and mass transfer effects.

[0007] In order to achieve the above-mentioned purpose, the present application provides a temperature equalizing plate supporting capillary structure, including a first plate body, a second plate body and a capillary layer, the first plate body has a first inner surface, the second plate body has a second inner surface and covers the first inner surface of the first plate body, and a chamber is provided between the first plate body and the second plate body, the capillary layer is sandwiched between the first plate body and the second plate body and is located in the chamber, and the capillary layer has at least a first capillary portion and a second capillary portion, the second capillary portion is connected to the first capillary portion and extends out, and a notch portion is formed at either side of the second capillary portion, and the notch portion is formed along the extension direction of the second capillary portion; wherein, the first plate body is provided with a plurality of capillary support structures and a plurality of plate body support structures on the first inner surface, and the capillary support structures at least correspond to the first capillary portion and the second capillary portion, and the plate body support structures correspond to the notch portion of the capillary layer.

[0008] In one embodiment, a plurality of strip support structures arranged at intervals are disposed on the first inner surface of the first plate body, and the plurality of strip support structures correspond to the notches of the capillary layer and partially surround the outer sides of the plurality of plate body support structures.

[0009] In one embodiment, the first inner surface of the first plate body and the second inner surface of the second plate body are respectively concave to form a cavity together.

[0010] In one embodiment, one of the first inner surface of the first plate body and the second inner surface of the second plate body is concave, and the other is planar and covers each other to form a chamber.

[0011] In one embodiment, the first plate body is provided with a first sealing edge surrounding the first inner surface, and the second plate body is also provided with a second sealing edge surrounding the second inner surface, and the first sealing edge and the second sealing edge are fitted to seal the chamber.

[0012] In one embodiment, a plurality of docking support structures are disposed on the second inner surface of the second plate body, and the plurality of docking support structures are abutted against the plate body support structure.

[0013] In one embodiment, the second capillary portion is smaller in width than the first capillary portion.

[0014] In one embodiment, the capillary layer further has a third capillary portion, and the second capillary portion is connected between the first capillary portion and the third capillary portion.

[0015] In one embodiment, the first capillary portion and the third capillary portion are respectively located at two ends of the chamber that are far away from each other.

[0016] In one embodiment, the second capillary portion is smaller in width than the first capillary portion and the third capillary portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional exploded view of the first embodiment of the present application.

[0018] Figure 2 This is a plan view of the first embodiment of the present application.

[0019] Figure 3 Based on Figure 2 Sectional view of section 3-3.

[0020] Figure 4 It is a three-dimensional exploded view of the second embodiment of the present application.

[0021] Figure 5 This is a plan view of the second embodiment of the present application.

[0022] Figure 6 Based on Figure 5Sectional view of section 6-6.

[0023] Description of reference numerals:

[0024] 1: first plate;

[0025] 10: first inner surface;

[0026] 100: capillary support structure;

[0027] 101: Plate supporting structure;

[0028] 11: first sealing edge;

[0029] 110: filling slot;

[0030] 12: Support structure;

[0031] 2: second plate;

[0032] 20: second inner side;

[0033] 200: docking support structure;

[0034] 21: second sealing edge;

[0035] 3: capillary layer;

[0036] 30: first capillary part;

[0037] 31: second capillary part;

[0038] 310: notch;

[0039] 32: third capillary;

[0040] C: Chamber. DETAILED DESCRIPTION

[0041] In order to enable you, the examiner, to further understand the features and technical contents of this application, please refer to the following detailed description and drawings of this application. However, the attached drawings are only provided for reference and explanation and are not intended to limit this application.

[0042] See also Figure 1 and Figure 2 , which are respectively a three-dimensional exploded view and a planar unfolded view of the first embodiment of the present application. The present application provides a temperature-averaging plate supporting a capillary structure, comprising a first plate body 1, a second plate body 2, and a capillary layer 3; wherein:

[0043] The first plate 1 and the second plate 2 are overlapped to form a chamber C between the first and second plates 1 and 2 (i.e. Figure 3As shown). In the embodiment of the present application, the first plate body 1 has a first inner surface 10 and faces the second plate body 2, and the second plate body 2 also has a second inner surface 20 and faces the first plate body 1 or the first inner surface 10, and the chamber C is formed between the first inner surface 10 and the second inner surface 20; specifically, as in the first embodiment of the present application, the first inner surface 10 of the first plate body 1 and the second inner surface 20 of the second plate body 2 can be respectively concave to form the chamber C together, or only one of the first and second inner surfaces 10 and 20 can be concave, and the other can be planar and relatively cover to close the chamber C, as shown in the second embodiment of the present application, Figure 4 shown.

[0044] As mentioned above, the first plate body 1 may also be provided with a first sealing edge 11 surrounding the outside of the first inner surface 10, and the second plate body 2 may also be provided with a second sealing edge 21 surrounding the outside of the second inner surface 20, and when the first plate body 1 and the second plate body 2 are covered, the first sealing edge 11 and the second sealing edge 21 fit together and can be sealed by a process such as welding, so as to seal an appropriate amount of working fluid in the above-mentioned chamber C (figure omitted). Furthermore, as Figure 3 As shown, the first sealing edge 11 may protrude from the first inner surface 10, and the second sealing edge 21 may protrude from the second inner surface 21; in other feasible embodiments, only one of the first plate body 1 or the second plate body 2 may have the first sealing edge 11 or the second sealing edge 21, and the other may be flat and overlap each other, that is, Figure 4 For example, the second plate body 2 has the second sealing edge 21, and the first plate body 1 is flat and overlaps with the first plate body 1. In addition, the first sealing edge 11 (such as Figure 1 A filling groove 110 may be provided on the second sealing edge 21 (as shown) or the second sealing edge 21 (not shown) to facilitate the solder filling during the aforementioned welding process.

[0045] Please also refer to Figures 1 to 3As shown, the capillary layer 3 can be made of a metal woven mesh or powder sintering, and is sandwiched in the chamber C between the first and second plates 1 and 2, and the capillary layer 3 has a first capillary portion 30, a second capillary portion 31 and a third capillary portion 32. The first capillary portion 30 and the third capillary portion 32 are respectively located at two ends away from each other in the chamber C, and the second capillary portion 31 is connected between the first capillary portion 30 and the third capillary portion 32; specifically, the first capillary portion 30 is arranged in the heat receiving portion of the temperature equalizing plate, and the third capillary portion 32 is arranged in the condensing portion of the temperature equalizing plate, and the second capillary portion 31 extends from the first capillary portion 30 to the third capillary portion 32 to form an integral connection. The second capillary portion 31 is at least smaller in width than the first capillary portion 30 , or further smaller than the third capillary portion 32 , so as to form a notch portion 310 at any side of the second capillary portion 31 . The notch portion 310 is formed along the extension direction of the second capillary portion 31 .

[0046] like Figure 2 and Figure 3 As shown, the first plate body 1 is provided with a plurality of capillary support structures 100 and a plurality of plate support structures 101 on the first inner surface 10. Each capillary support structure 100 and the plate support structure 101 can be a columnar protrusion on the first inner surface 10, and the capillary support structure 100 at least corresponds to the first capillary portion 30 and the second capillary portion 31 of the capillary layer 3, and can also be further arranged on the corresponding third capillary portion 32, and the plate support structure 101 corresponds to the notch portion 310 of the capillary layer 3, so that the capillary support structure 100 can push the capillary layer 3 against the second inner surface 20 of the second plate body 2, and the plate support structure 101 can push against a plurality of docking support structures 200 provided on the second inner surface 20 of the second plate body 2, or can also directly push against the second inner surface 20.

[0047] Therefore, by means of the above-mentioned structural composition, the capillary structure supporting the temperature equalizing plate of the present application can be obtained.

[0048] Accordingly, please refer to Figure 2 and Figure 3 As shown, when the temperature plate contacts the heat generating component (not shown) through the first capillary portion 30 as the heat receiving portion, the working fluid sealed inside it will be vaporized into steam and will move toward the location of the third capillary portion 32 through the space above the capillary layer 3 in the chamber C. When passing above the second capillary portion 31, since a notch portion 310 is formed on one side of the second capillary portion 31 to increase the space for accommodating steam, the heat conduction efficiency of the steam can be improved, so that the steam can reach the condensation portion more quickly for cooling. On the other hand, the formation of the notch portion 310 also helps to shorten the required path for the working fluid to undergo a vapor-liquid phase change, so as to facilitate heat transfer and mass transfer effects.

[0049] Furthermore, if Figures 4 to 6 As shown, in the second embodiment of the present application, a plurality of strip support structures 12 arranged at intervals can be further provided on the first inner surface 10 of the first plate body 1, and the plurality of strip support structures 12 also correspond to the notch portion 310 of the capillary layer 3, and partially surround the outer sides of the plurality of plate support structures 101, so as to form a flow channel for steam flow between any two adjacent strip support structures 12, and the steam can be guided from the outer sides of the plurality of plate support structures 101 through the flow channel and then guided back to the third capillary portion 32 of the capillary layer 3 for cooling, thereby facilitating the use of the enlarged steam space for steam transfer to achieve a uniform temperature effect.

[0050] In addition, if Figure 6 As shown, the capillary support structure 100 and the plate support structure 101 may also be formed by recessing the outer side of the first plate 1 toward the first inner side 10. Therefore, the capillary support structure 100 and the plate support structure 101 may not be limited to the embodiments of this application in terms of shape.

Claims

1. A temperature-averaging plate supporting a capillary structure, characterized in that: include: A first plate body having a first inner surface; A second plate body having a second inner surface and facing the first inner surface of the first plate body so as to cover the first inner surface of the first plate body, and having a chamber between the first plate body and the second plate body; and A capillary layer is sandwiched between the first plate body and the second plate body and is located in the chamber, and the capillary layer has at least a first capillary portion and a second capillary portion, the second capillary portion is connected to the first capillary portion and extends out, and a notch portion is formed at any side of the second capillary portion, and the notch portion is formed along the extension direction of the second capillary portion; The first plate body is provided with a plurality of capillary support structures and a plurality of plate support structures on the first inner surface, and the plurality of capillary support structures at least correspond to the first capillary portion and the second capillary portion, and the plurality of plate support structures correspond to the notch portion of the capillary layer.

2. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: A plurality of strip support structures arranged at intervals are disposed on the first inner surface of the first plate body, and the plurality of strip support structures correspond to the notches of the capillary layer and partially surround the outer sides of the plurality of plate body support structures.

3. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: The first inner surface of the first plate body and the second inner surface of the second plate body are respectively concave and together form the chamber.

4. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: One of the first inner surface of the first plate body and the second inner surface of the second plate body is concave, and the other is flat and covers each other to form the chamber.

5. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: The first plate body is provided with a first sealing edge surrounding the first inner surface, and the second plate body is also provided with a second sealing edge surrounding the second inner surface, and the first sealing edge and the second sealing edge are fitted together to seal the chamber.

6. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: A plurality of docking support structures are disposed on the second inner surface of the second plate body, and the plurality of docking support structures are abutted against the plate body support structure.

7. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: The second capillary portion is smaller in width than the first capillary portion.

8. The temperature homogenizing plate supporting capillary structure according to claim 1, characterized in that: The capillary layer further has a third capillary portion, and the second capillary portion is connected between the first capillary portion and the third capillary portion.

9. The temperature homogenizing plate supporting capillary structure according to claim 8, characterized in that: The first capillary portion and the third capillary portion are respectively located at two ends of the chamber that are far away from each other.

10. The temperature homogenizing plate supporting capillary structure according to claim 8, characterized in that: The second capillary portion is smaller in width than the first capillary portion and the third capillary portion.

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