Antenna packaging structure

Abstract

The invention provides an antenna packaging structure. The antenna packaging structure comprises a substrate, an antenna tuner, communication equipment and an antenna layer, the antenna tuner is disposed on a top surface of the substrate. The communication device is disposed on the bottom surface of the substrate. The antenna layer vertically overlaps the antenna tuner and includes a dielectric layer and an antenna element. The antenna element is disposed in the dielectric layer and electrically connected to the substrate.

Description

Technical Field

[0001] The present invention relates to semiconductor technology, and in particular to an antenna packaging structure. Background Art

[0002] Wireless communication devices are becoming more and more popular and more complex. Wireless communication devices typically include antennas to support communications over a range of frequencies. In order to integrate one or more antennas with other circuits in the same package, antenna-in-package (AiP) technology is often used. AiP technology, which integrates antennas into semiconductor packaging structures, can balance antenna performance, cost, and device size reduction. For example, integrating an antenna and a radio frequency chip in the same unit can enhance the signal and reduce transmission losses.

[0003] Although the existing antenna packaging structure generally meets the requirements, it is not completely satisfactory in all aspects. With the trend of miniaturization of electronic products, it is necessary to continuously reduce the size of the antenna packaging structure. Therefore, it is necessary to further improve the antenna packaging structure. Summary of the invention

[0004] The present invention provides an antenna package structure. An exemplary embodiment of the antenna package structure includes a substrate, an antenna tuner, a communication device, and an antenna layer. The antenna tuner is disposed on the top surface of the substrate. The communication device is disposed on the bottom surface of the substrate. The antenna layer vertically overlaps the antenna tuner and includes a dielectric layer and an antenna element. The antenna element is disposed in the dielectric layer and electrically connected to the substrate.

[0005] The antenna package structure of another embodiment includes a substrate, an antenna tuner, a communication device and an antenna layer. The antenna tuner is arranged above the substrate. The communication device is arranged below the substrate. The antenna layer is arranged above the antenna tuner and separated from it. The antenna layer includes a plurality of dielectric layers and a plurality of antenna elements. The antenna element is arranged in the dielectric layer and electrically connected to the substrate.

[0006] The antenna packaging structure of another embodiment includes a substrate, an antenna tuner, a molding material and a main radiator. The antenna tuner is arranged on the top surface of the substrate. The molding material surrounds the antenna tuner. The main radiator is arranged above the molding material and connected to the substrate. The main radiator partially overlaps the antenna tuner.

[0007] The antenna packaging structure of the present invention can modify the antenna impedance, frequency, polarization direction and radiation direction, and can reduce the size of the antenna packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention may be more fully understood by reading the following detailed description and referring to the accompanying drawings, in which:

[0010] Figures 1 to 3 is a cross-sectional view of an exemplary antenna package structure according to some embodiments of the present invention;

[0011] Figure 4 is a partial top view of an exemplary antenna package structure according to some embodiments of the present invention;

[0012] Figures 5 to 13 is a cross-sectional view of an exemplary antenna package structure according to some embodiments of the present invention;

[0013] Fig.14 is a top view of an exemplary antenna package structure according to some embodiments of the present invention;

[0014] Figures 15 to 18 is a cross-sectional view of an exemplary antenna package structure according to some embodiments of the present invention. DETAILED DESCRIPTION

[0015] The following description is intended to illustrate the general principles of the invention and should not be considered as limiting. The scope of the invention is best determined by the appended claims.

[0016] The present invention will be described with reference to specific embodiments and certain illustrations, but the invention is not limited thereto and only by the claims. The illustrations described are illustrative only and are not restrictive. In the illustrations, the dimensions of certain elements may be exaggerated and not drawn to scale for illustrative purposes. Dimensions and relative dimensions do not correspond to actual dimensions in actual application of the present invention.

[0017] Additional elements may be added based on the embodiments described below. For example, the description of "a first element is on / above a second element" may include an embodiment in which the first element directly contacts the second element, or an embodiment in which an additional element is disposed between the first element and the second element so that the first element and the second element do not directly contact each other.

[0018] In addition, the description of "a first element passes through a second element" may include embodiments in which the first element is disposed in the second element and extends from one side of the second element to the other side, wherein a surface of the first element may be substantially flush with a surface of the second element, or a surface of the first element may be outside a surface of the second element.

[0019] The spatial relative description of the first element and the second element may change as the structure is operated or used in different directions. In addition, the present invention may reuse reference numbers and / or letters in various embodiments. This repetition is for simplicity and clarity and does not itself determine the relationship between the various embodiments discussed.

[0020] Some embodiments of the present invention describe an antenna package structure including an antenna layer and an antenna tuner. The antenna tuner can be disposed below the antenna layer. Thus, the antenna impedance, frequency, polarization, and radiation direction can be modified. In addition, the size of the antenna package structure can be reduced.

[0021] Figure 1 1 is a cross-sectional view of an antenna package structure 100 according to some embodiments of the present invention. Additional features may be added to the antenna package structure 100. Some of the features described below may be replaced or omitted in different embodiments. To simplify the illustration, only a portion of the antenna package structure 100 is shown.

[0022] like Figure 1 As shown, according to some embodiments, the antenna package structure 100 includes a substrate 102. The substrate 102 may be a package substrate, a carrier, or any suitable substrate. The substrate 102 may include a wiring layer 102M disposed in a dielectric layer 102D. The dielectric layer 102D may be made of a polymer, including polyimide (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), epoxy resin, ceramic, the like, or a combination thereof. Alternatively, the dielectric layer 102D may be made of silicon oxide, silicon nitride, silicon oxynitride, the like, or a combination thereof.

[0023] The wiring layer 102M may include horizontal interconnects, such as conductive layers or conductive pads, and vertical interconnects, such as conductive vias. The conductive vias may electrically connect conductive layers and conductive pads at different levels. The wiring layer 102M may be made of metal, including tungsten, titanium, tantalum, ruthenium, cobalt, copper, aluminum, platinum, tin, silver, gold, the like, alloys thereof, or combinations thereof.

[0024] The substrate 102 may have a first surface 102a and a second surface 102b opposite to the first surface 102a. For example, the first surface 102a may be on the back side of the substrate 102, and the second surface 102b may be on the front side of the substrate 102, or vice versa. A plurality of conductive pads 104 may be formed on the first surface 102a and the second surface 102b of the substrate 102 and electrically connected to the wiring layer 102M. The conductive pads 104 may be made of a material similar to the wiring layer 102M.

[0025] Then, according to some embodiments, the communication device 108 is mounted on the second surface 102b of the substrate 102. The communication device 108 may include a radio-frequency integrated circuit (RFIC) or any other suitable device.

[0026] The communication device 108 can be electrically connected to the conductive pad 104 through a plurality of conductive connectors 106. The conductive connectors 106 can include microbumps, controlled collapse chip connection (C4) bumps, conductive pillars, solder paste, ball grid array (BGA) balls, frame plates, the like, or a combination thereof. The conductive connectors 106 can be made of metals, including tungsten, titanium, tantalum, ruthenium, cobalt, copper, aluminum, platinum, tin, silver, gold, the like, alloys thereof, or a combination thereof.

[0027] According to some embodiments, one or more electronic components 110 are mounted near the communication device 108. The electronic components 110 may be electrically connected to the wiring layer 102M. The electronic components 110 may include passive components including resistors, inductors, capacitors, or combinations thereof.

[0028] Then, an underfill material not shown can be formed to surround each conductive connector 106 and be used to fill the gaps between the conductive connectors 106 to provide structural support. The underfill material can include a polymer, such as an epoxy resin. The underfill material can be distributed by capillary force and can then be cured by any suitable curing process. According to an embodiment of the present invention, the underfill material is optional.

[0029] Then, according to some embodiments, a molding material 112 is formed on the second surface 102b of the substrate 102 to encapsulate the communication device 108, the electronic component 110, and the underfill material (if present). The molding material 112 can protect these components from environmental influences, thereby protecting them from damage by stress, chemicals, and moisture. The molding material 112 can be made of a non-conductive material, including moldable polymer, epoxy, resin, the like, or a combination thereof.

[0030] like Figure 1As shown, the molding material 112 may partially cover the second surface 102b of the substrate 102. In such an embodiment, the connector 114 is disposed on the exposed portion of the second surface 102b of the substrate 102. The connector 114 may be electrically connected to the wiring layer 102M, and may be electrically connected to the communication device 108 and / or the electronic component 110 through the wiring layer 102M. The antenna package structure 100 may be electrically connected to other electronic components, such as a printed circuit board (PCB) or any suitable component (not shown) through the connector 114.

[0031] Then, according to some embodiments, a plurality of antenna tuners 118 are mounted on the first surface 102a of the substrate 102. Each antenna tuner 118 may independently include an aperture tuner, an impedance tuner, a phase shifter, a switch (e.g., a single-pole, single-throw (SPST) switch), a transformer, a tuning capacitor, a tuning inductor, an open circuit, a short circuit, a delay line, or any suitable component. For example, an antenna tuner 118 may include an SPST switch, a tuning capacitor, and a delay line. The antenna tuner 118 may change the antenna state, such as antenna impedance, operating frequency, polarization direction, radiation direction, or a combination thereof, according to the radio frequency environment.

[0032] In some embodiments, all components of the antenna tuner 118 are disposed on the substrate 102. In other embodiments, one or more components of the antenna tuner 118 are disposed in the substrate 102, and these components may be formed when forming the wiring layer 102M. For example, the antenna tuner 118 may include a SPST switch and a tuning capacitor disposed on the substrate 102, and may include a delay line disposed in the substrate 102.

[0033] The communication device 108 and the antenna tuner 118 may be stacked in a vertical direction (e.g., a direction perpendicular to the first surface 102a of the substrate 102) to implement a double-sided mounting (and / or double-sided molding) system-in-package (SiP). The antenna tuner 118 may be mounted on the substrate 102 when the communication device 108 and the electronic component 110 are mounted. Alternatively, the antenna tuner 118, the communication device 108, and the electronic component 110 may be mounted on the substrate 102 separately in different processes.

[0034] The antenna tuner 118 can be electrically connected to the conductive pad 104 through a plurality of conductive connectors 116. The conductive connector 116 can be electrically connected to the wiring layer 102M. The conductive connector 116 can include a microbump, a controlled collapse chip connection (controlled collapse chip connection, referred to as C4) bump, a conductive column, a solder ball, a solder paste, a ball grid array (BGA) ball, a frame plate, the like, or a combination thereof. The conductive connector 116 can be made of metal, including materials similar to the conductive connector 106.

[0035] Then, similar to the above discussion, an underfill material (not shown) can be formed to surround each conductive connector 116 and can be used to fill the gaps between the conductive connectors 116 to provide structural support. The underfill material is optional. The underfill material surrounding the conductive connectors 116 can be formed before, during, or after the underfill material surrounding the conductive connectors 106 is formed.

[0036] Then, according to some embodiments, an encapsulation material 120 is formed on the first surface 102a of the substrate 102 to encapsulate the antenna tuner 118. The encapsulation material 120 may surround each antenna tuner 118 and may cover or expose the top surface of the antenna tuner 118. The encapsulation material 120 may be formed before, during, or after the molding material 112 is formed. The encapsulation material 120 may include a molding material, an underfill material, or a combination thereof. The encapsulation material 120 may be made of a material similar to the aforementioned molding material 112 and / or underfill material, which is not repeated here. The sidewalls of the encapsulation material 120 may be roughly aligned with the sidewalls of the substrate 102. The sidewalls of the encapsulation material 120 may be roughly aligned with the sidewalls of the molding material 112.

[0037] Then, according to some embodiments, a plurality of openings 121 are formed in the encapsulation material 120. The openings 121 may be formed through the encapsulation material 120 and may expose the conductive pads 104 by laser drilling or any suitable method. The width of the openings 121 may decrease toward the substrate 102.

[0038] Then, according to some embodiments, the antenna layer 150 is mounted on the first surface 102a of the substrate 102 through a plurality of conductive connectors 122. The conductive connectors 122 may be disposed in the openings 121 of the packaging material 120. The conductive connectors 122 may include microbumps, controlled collapse chip connection (C4) bumps, conductive pillars, solder balls, solder paste, ball grid array (BGA) balls, frame plates, the like, or a combination thereof. The conductive connectors 122 may be electrically connected to the wiring layer 102M. The conductive connectors 122 may be made of metal, including materials similar to the conductive connectors 106.

[0039] The size (e.g., thickness or width) of the conductive connector 122 may be greater than the size (e.g., thickness or width) of the conductive connector 116. The distance D1 between the antenna layer 150 and the substrate 102 may be greater than the thickness T1 of the antenna tuner 118 to accommodate the antenna tuner 118. In particular, the thickness of one conductive connector 122 may be greater than the sum of the thickness of one conductive connector 116 and the thickness T1 of the antenna tuner 118.

[0040] The antenna layer 150 includes a dielectric layer 126, a plurality of conductive pads 124, and a plurality of antenna elements 134, according to some embodiments. The conductive pads 124 and the antenna elements 134 may be disposed in the dielectric layer 126. The dielectric layer 126 may be formed of a polymer including polyimide (PI), polybenzoxazole (PBO), benzocyclobutene (BCB), epoxy resin, the like, or a combination thereof. Alternatively, the dielectric layer 126 may be formed of silicon oxide, silicon nitride, silicon oxynitride, the like, or a combination thereof.

[0041] The sidewalls of encapsulation material 120 may be substantially aligned with the sidewalls of dielectric layer 126. Dielectric layer 126 may be separated from antenna tuner 118 by encapsulation material 120.

[0042] The conductive pad 124 may be disposed at the bottom of the dielectric layer 126 near the substrate 102. The conductive pad 124 may be electrically connected to the wiring layer 102M through the conductive connector 122. The conductive pad 124 may be formed of metal, including a similar material as the conductive pad 104.

[0043] Each antenna element 134 may include a conductive line 128, an antenna feed assembly 130, and a main radiator 132. The conductive line 128 may be disposed above the conductive pad 124. The antenna feed assembly 130 may be disposed above the conductive line 128. The main radiator 132 may be disposed on top of the dielectric layer 126 away from the substrate 102. Each main radiator 132 may be disposed directly above an antenna feed assembly 130 and electrically connected thereto.

[0044] The antenna element 134 can vertically overlap the antenna tuner 118. In particular, each main radiator 132 can vertically overlap an antenna tuner 118. The projected area of ​​one main radiator 132 can overlap the projected area of ​​one antenna tuner 118. Therefore, the antenna impedance, antenna aperture, or a combination thereof can be modified. In other words, the antenna frequency, radiation direction, and polarization direction can be modified, which can be referred to as a frequency reconfigurable antenna, a mode reconfigurable antenna, or a polarization reconfigurable antenna. For example, the antenna radiation direction can include two different directions, such as the top and side directions.

[0045] One or more primary radiators 132 may vertically overlap the communication device 108. The projected area of ​​the primary radiator 132 may overlap the projected area of ​​the communication device 108. Likewise, one or more antenna tuners 118 may vertically overlap the communication device 108. The projected area of ​​the antenna tuner 118 may overlap the projected area of ​​the communication device 108.

[0046] The antenna element 134 can be electrically connected to the wiring layer 102M through the conductive connector 122. In some embodiments, the wiring layer 102M includes a ground layer GND. Since the distance D2 between the main radiator 132 and the ground layer GND is related to the antenna bandwidth, it is necessary to make the distance D2 between the main radiator 132 and the ground layer GND greater than a certain value. Therefore, the grounding in the antenna reference substrate 102 can reduce the overall height of the antenna package structure 100.

[0047] It should be noted that the above manufacturing sequence is for illustration purposes only, and other manufacturing sequences may be used without departing from the scope of the present invention. For example, the encapsulation material 120 may fill the space between the antenna layer 150 and the substrate 102 after the antenna layer 150 is mounted on the substrate 102 .

[0048] Figure 2 is a cross-sectional view of an antenna package structure 200 according to some embodiments of the present invention. It should be noted that the antenna package structure 200 may include Figure 1 For the sake of simplicity, the same or similar components of the antenna package structure 100 will not be discussed in detail. In the following embodiments, the ground layer 202 is disposed in the antenna layer 150 .

[0049] like Figure 2 As shown, according to some embodiments, the ground layer 202 is embedded in the dielectric layer 126. The ground layer 202 may be disposed above the conductive pad 124 and electrically connected thereto. Since it is necessary to make the distance D3 between the main radiator 132 and the ground layer 202 greater than a certain value, the ground layer 202 formed in the dielectric layer 126 increases the thickness T3 of the dielectric layer 126. Therefore, the thickness T3 of the dielectric layer 126 in the antenna package structure 200 may be greater than the thickness T2 of the dielectric layer 126 in the antenna package structure 100.

[0050] Figure 3 is a cross-sectional view of an antenna package structure 300 according to some embodiments of the present invention. It should be noted that the antenna package structure 300 may include Figure 1 For the sake of simplicity, the same or similar components of the antenna package structure 100 will not be discussed in detail. In the following embodiments, the packaging material is not formed between the antenna layer 150 and the substrate 102.

[0051] like Figure 3 As shown, the antenna tuner 118 and the conductive connector 122 are exposed. The antenna layer 150 can be separated from the antenna tuner 118. In particular, the bottom surface of the antenna layer 150 can be higher than the top surface of the antenna tuner 118. In some embodiments, the thickness T1 of each antenna tuner 118 is reduced to reduce the silicon wafer conductive loss of the antenna tuner 118 caused by the coupling of the main radiator 132. In some other embodiments, the metal layer 402 is disposed on the bottom surface of the dielectric layer 126, located above the plurality of conductive connectors 302, to isolate the coupling path from the main radiator 132 to the antenna tuner 118. The conductive connector 302 can be made of a material similar to the conductive connector 122, which will not be described again here. Each conductive connector 302 can be disposed along an edge of the antenna tuner 118. The metal layer 402 can be electrically connected to the wiring layer 102M through the conductive connector 302. The metal layer 402 can refer to Figure 4 Further discussion.

[0052] Figure 4 is a partial top view of an antenna package structure 300 according to some embodiments of the present invention. Figure 3 The portion of the antenna package structure 300 indicated by the dotted line is along Figure 4 The cross-sectional view taken along the line II' shown in FIG. Figure 4 Only a portion or several components of the semiconductor package structure 300 are shown.

[0053] like Figure 4 As shown, the conductive connector 122 can surround the conductive connector 302, and the conductive connector 302 can surround the antenna tuner 118. According to some embodiments, the metal layer 402 is disposed over the conductive connector 302. The metal layer 402 can be disposed in the dielectric layer 126 and between the antenna tuner 118 and the primary radiator 132. The metal layer 402 can vertically overlap the antenna tuner 118.

[0054] Figure 5 is a cross-sectional view of an antenna package structure 500 according to some embodiments of the present invention. It should be noted that the antenna package structure 500 may include Figure 1 For the sake of simplicity, the components of the antenna package structure 100 shown are the same or similar, and these components will not be discussed in detail. In the following embodiments, the shielding layer 502 is formed on the sidewall of the antenna layer 150 .

[0055] like Figure 5As shown, according to some embodiments, a shielding layer 502 is formed on the sidewalls of the substrate 102, the antenna layer 150, the molding material 112, and the packaging material 120 for electromagnetic interference (EMI) shielding. The shielding layer 502 can be formed by sputtering metal or any suitable material. The shielding layer 502 can be formed after the antenna layer 150 is installed and the molding material 112 is formed, so that the shielding layer 502 can extend continuously from the sidewall portion of the antenna layer 150 to the molding material 112.

[0056] The shielding layer 502 may cover the bottom surface of the molding material 112. The surface of the shielding layer 502 may be substantially aligned with the second surface 102b of the substrate 102 at the edge of the substrate 102. The shielding layer 502 may partially cover the second surface 102b of the substrate 102. A portion of the second surface 102b of the substrate 102 and the connector 114 may be exposed. The bottom portion of the antenna layer 150 may be surrounded by the shielding layer 502, while the top portion and the top surface of the antenna layer 150 may be exposed.

[0057] Figure 6 is a cross-sectional view of an antenna package structure 600 according to some embodiments of the present invention. It should be noted that the antenna package structure 600 may include Figure 5 For the sake of simplicity, the components of the antenna package structure 500 shown are the same or similar, and these components will not be discussed in detail. In the following embodiments, the shielding layer 602 is discontinuous on the sidewall of the packaging material 120 .

[0058] like Figure 6 As shown, according to some embodiments, the shielding layer 602 is formed on the sidewalls of the substrate 102, the antenna layer 150, and the molding material 112. The shielding layer 602 may have a first portion 602a formed on the sidewalls of the antenna layer 150, and a second portion 602b formed on the sidewalls of the substrate 102 and the molding material 112. Then, the antenna layer 150 may be mounted on the substrate 102, and then the packaging material 120 is filled into the space between the substrate 102 and the antenna layer 150. Therefore, the shielding layer 602 may not be formed on the sidewalls of the packaging material 120 and may be discontinuous. The first portion 602a may be separated from the second portion 602b.

[0059] The bottom surface of the first portion 602a of the shielding layer 602 may be substantially aligned with the bottom surface of the antenna layer 150 on the opposite sidewall of the antenna layer 150. The first portion 602a of the shielding layer 602 may have a length L1 in a direction parallel to the sidewall of the dielectric layer 126. The ratio of the length L1 of the first portion 602a of the shielding layer 602 to the thickness T2 of the dielectric layer 126 may be in a range of about 0.25 to about 0.75, for example, about 0.50.

[0060] The second portion 602b of the shielding layer 602 may extend continuously from the first surface 102a of the substrate 102 through the sidewalls and the bottom surface of the molding material 112 to the second surface 102b of the substrate 102. The top surface of the second portion 602b of the shielding layer 602 may be substantially aligned with the first surface 102a of the substrate 102, and the bottom surface may be substantially aligned with the second surface 102b of the substrate 102 at an edge of the substrate 102.

[0061] Figure 7 is a cross-sectional view of an antenna package structure 700 according to some embodiments of the present invention. It should be noted that the antenna package structure 700 may include Figure 1 For the sake of simplicity, the same or similar components of the antenna package structure 100 will not be discussed in detail. In the following embodiments, the antenna layer 150 includes a plurality of dielectric layers 126 .

[0062] like Figure 7 As shown, according to some embodiments, the antenna layer 150 includes a plurality of discontinuous dielectric layers 126. The dielectric layers 126 may be spaced apart from each other. The dimensions of the dielectric layers 126 (e.g., the length in a direction parallel to the top surface of the dielectric layers 126) may be different, and different numbers of antenna elements 134 may be provided in the dielectric layers 126. For example, Figure 7 As shown, one or two antenna elements 134 may be disposed in one dielectric layer 126. More than two antenna elements 134 may be disposed in one dielectric layer 126.

[0063] The antenna tuner 118 and the conductive connector 122 may be exposed. The thickness of the antenna tuner 118 may be reduced, or a metal layer may be provided on the bottom surface of the dielectric layer 126 to reduce the silicon conductive loss of the antenna tuner 118 caused by the coupling of the main radiator 132, similar to the reference Figure 3 and Figure 4 The situation discussed.

[0064] Figure 8 8 is a cross-sectional view of an antenna package structure 800 according to some embodiments of the present invention. It should be noted that the antenna package structure 800 may include Figure 7 For simplicity, the antenna package structure 700 shown has the same or similar components, which will not be discussed in detail. In the following embodiments, each antenna tuner 118 is disposed between two dielectric layers 126 .

[0065] like Figure 8As shown, according to some embodiments, the antenna tuner 118 is disposed between two adjacent dielectric layers 126. The antenna element 134 may partially vertically overlap the antenna tuner 118. In particular, each main radiator 132 may partially vertically overlap one antenna tuner 118. The projected area of ​​one main radiator 132 may partially overlap the projected area of ​​one antenna tuner 118.

[0066] The antenna tuner 118 and the conductive connector 122 may be exposed. The thickness of the antenna tuner 118 may be reduced, or a metal layer may be provided on the bottom surface of the dielectric layer 126 to reduce the silicon conductive loss of the antenna tuner 118 caused by the coupling of the main radiator 132, similar to the reference Figure 3 and Figure 4 The situation discussed.

[0067] Fig. 9 is a cross-sectional view of an antenna package structure 900 according to some embodiments of the present invention. It should be noted that the antenna package structure 900 may include Figure 7 For simplicity, the same or similar components as those of the antenna package structure 700 will not be discussed in detail. In the following embodiments, the molding material 902 surrounds the dielectric layer 126 .

[0068] like Fig. 9 As shown, according to some embodiments, a molding material 902 is formed on the first surface 102a of the substrate 102 to encapsulate the antenna tuner 118 and the dielectric layer 126. The molding material 902 may surround each antenna tuner 118 and may cover the top surface of the antenna tuner 118. The molding material 902 may surround each dielectric layer 126 and may cover the top surface of the dielectric layer 126.

[0069] The molding material 902 may be formed before, during, or after the molding material 112 is formed. The molding material 902 may be made of a material similar to the molding material 112 and will not be repeated. Each dielectric layer 126 may be separated from the antenna tuner 118 by the molding material 902.

[0070] The sidewalls of the molding material 902 may be substantially aligned with the sidewalls of the substrate 102. The outermost sidewalls of the dielectric layer 126 may be substantially aligned with the sidewalls of the molding material 902, as shown. Alternatively, in some other embodiments, the outermost sidewalls of the dielectric layer 126 may be covered by the molding material 902. The sidewalls of the molding material 902 may be substantially aligned with the sidewalls of the molding material 112.

[0071] Fig.10 is a cross-sectional view of an antenna package structure 1000 according to some embodiments of the present invention. It should be noted that the antenna package structure 1000 may include Figure 7For the sake of simplicity, the components of the antenna package structure 700 shown are the same or similar, and will not be discussed in detail. In the following embodiments, the dielectric layer 126 includes a plurality of grooves 1002 .

[0072] like Fig.10 As shown, according to some embodiments, a plurality of grooves 1002 are formed at the bottom of the dielectric layer 126. The grooves 1002 may be formed by laser drilling or any suitable method. One or more grooves 1002 may be formed in one dielectric layer 126 to accommodate one or more antenna tuners 118. Thus, the thickness of the plurality of conductive connectors 1004 electrically connecting the antenna element 134 and the wiring layer 102M may be reduced.

[0073] The conductive connector 1004 may include microbumps, controlled collapse chip connection (C4) bumps, conductive pillars, solder balls, solder paste, ball grid array (BGA) balls, frame plates, etc. or a combination thereof. The conductive connector 1004 may be made of metal, including materials similar to the conductive connector 106.

[0074] The antenna tuner 118 and the conductive connector 122 may be exposed. The thickness of the antenna tuner 118 may be reduced, or a metal layer may be provided on the bottom surface of the dielectric layer 126 to reduce the silicon chip conductive loss of the antenna tuner 118 caused by coupling with the main radiator 132, similar to Figure 3 and Figure 4 The situation discussed in .

[0075] Fig.11 is a cross-sectional view of an antenna package structure 1100 according to some embodiments of the present invention. It should be noted that the antenna package structure 1100 may include Figure 7 For simplicity, the same or similar components as those of the antenna package structure 700 will not be discussed in detail. In the following embodiments, the main radiator 132 is disposed above the molding material.

[0076] like Fig.11 As shown, according to some embodiments, each antenna tuner 118 is disposed between two dielectric layers 126. Since the antenna tuner 118 is disposed outside the sidewalls of the dielectric layer 126, the thickness of the conductive connector 1004 can be reduced.

[0077] According to some embodiments, molding material 1102 is disposed on first surface 102a of substrate 102 to encapsulate antenna tuner 118 and dielectric layer 126. Molding material 1102 may surround each antenna tuner 118 and may cover the top surface of antenna tuner 118. Molding material 1102 may surround each dielectric layer 126 and may cover the top surface of dielectric layer 126. Molding material 1102 may be formed before, during, or after molding material 112 is formed. Molding material 1102 may be made of a material similar to molding material 112, which will not be repeated.

[0078] The main radiator 132 may be disposed outside the dielectric layer 126. Thus, the thickness of the dielectric layer 126 may be reduced. The main radiator 132 may be spaced apart from the antenna feed assembly 130. The main radiator 132 may be formed over the molding material 1102 by printing metal or any suitable method.

[0079] The antenna element 134 may partially vertically overlap the antenna tuner 118. In particular, each main radiator 132 may partially vertically overlap one antenna tuner 118. The projected area of ​​one main radiator 132 may partially overlap the projected area of ​​one antenna tuner 118.

[0080] The sidewalls of the molding material 1102 may be substantially aligned with the sidewalls of the substrate 102. The outermost sidewalls of the dielectric layer 126 may be covered by the molding material 1102. One sidewall of the molding material 1102 may be substantially aligned with one sidewall of the molding material 112.

[0081] Fig.12 1 is a cross-sectional view of an antenna package structure 1200 according to some embodiments of the present invention. It should be noted that the antenna package structure 1200 may include Fig.11 For the sake of simplicity, the same or similar components as those of the antenna package structure 1100 will not be discussed in detail. In the following embodiments, the antenna feeding component 1202 includes a through hole.

[0082] like Fig.12 As shown, according to some embodiments, the antenna feed assembly 1202 is disposed in the molding material 1102 and includes a through hole. The dielectric layer 126 is not provided. The antenna feed assembly 1202 can be formed by drilling the molding material 1102 to form an opening that penetrates the molding material 1102, and then filling the material into the opening. The material of the antenna feed assembly 1202 may include metal, such as copper, silver, gold, etc., or alloys or combinations thereof. The antenna feed assembly 1202 may be electrically connected to the conductive pad 104.

[0083] The primary radiator 132 may vertically overlap the antenna feed assembly 1202. The projected area of ​​the primary radiator 132 may overlap the projected area of ​​the antenna feed assembly 1202.

[0084] Fig.13 is a cross-sectional view of an antenna package structure 1300 according to some embodiments of the present invention. It should be noted that the antenna package structure 1300 may include Fig.11 For the sake of simplicity, the same or similar components as those of the antenna package structure 1100 will not be discussed in detail. In the following embodiments, the antenna feeding component 1302 includes a coupling slot.

[0085] like Fig.13 As shown, according to some embodiments, the antenna feed assembly 1302 includes a coupling slot formed on the first surface 102a of the substrate 102. The wiring layer 102M may include a coupling line, and the coupling slot may expose the coupling line in the substrate 102. The main radiator 132 may be connected to the substrate 102 by using a slot coupling feeding technology. The dielectric layer 126 is not provided. The molding material 1102 may extend into the coupling slot. The antenna feed assembly 1302 may refer to Fig.14 Further discussion.

[0086] Fig.14 FIG. 1 is a top view of an antenna package structure 1300 according to some embodiments of the present invention. To simplify the illustration, only a portion of the semiconductor package structure 1300 is shown.

[0087] like Fig.14 As shown, the antenna feed assembly 1302 can be disposed directly below the primary radiator 132. The primary radiator 132 can vertically overlap the antenna feed assembly 1302. The projected area of ​​the primary radiator 132 can overlap the projected area of ​​the antenna feed assembly 1302.

[0088] Fig.15 is a cross-sectional view of an antenna package structure 1500 according to some embodiments of the present invention. It should be noted that the antenna package structure 1500 may include Figure 1 For the sake of simplicity, the same or similar components of the antenna package structure 100 will not be discussed in detail. In the following embodiments, the substrate 102 is connected to the conductive terminal 1502 .

[0089] like Fig.15As shown, according to some embodiments, a plurality of conductive terminals 1502 are disposed on the second surface 102b of the substrate 102. The conductive terminals 1502 can be electrically connected to the wiring layer 102M. The antenna package structure 1500 can be electrically connected to a printed circuit board (PCB) or any suitable component (not shown) through the conductive terminals 1502. The conductive terminals 1502 may include microbumps, controlled collapse chip connection (controlled collapse chip connection, referred to as C4) bumps, conductive columns, solder paste, ball grid array (BGA) balls, frame plates, etc. or combinations thereof. The conductive terminals 1502 can be made of metal, including materials similar to the conductive connectors 106.

[0090] In some embodiments, the thickness of the conductive terminal 1502 is greater than the thickness of the molding material 112. The bottom surface of the conductive terminal 1502 may be located below the bottom surface of the molding material 112.

[0091] In some other embodiments, the thickness of the conductive terminal 1502 is less than the thickness of the molding material 112. For example, the conductive terminal 1502 may include solder paste. In these embodiments, the underlying structure (not shown) connected to the conductive terminal 1502, such as a printed circuit board (PCB), has a groove to accommodate the molding material 112.

[0092] In some other embodiments, the molding material 112 surrounds the conductive terminals 1502 to protect them from damage. For example, the conductive terminals 1502 may include copper pillars. The bottom surface of the conductive terminals 1502 may be exposed by the molding material 112 to connect to the underlying structure.

[0093] Fig.16 1 is a cross-sectional view of an antenna package structure 1600 according to some embodiments of the present invention. It should be noted that the antenna package structure 1600 may include Fig.15 For the sake of simplicity, the components of the antenna package structure 1500 shown are the same or similar, and these components will not be discussed in detail. In the following embodiments, the encapsulation material and the molding material are not formed on the opposite surfaces 102 a and 102 b of the substrate 102 .

[0094] like Fig.16 As shown, according to some embodiments, the antenna tuner 118, the conductive connector 122, the communication device 108, and the electronic component 110 are exposed. The thickness of the antenna tuner 118 can be reduced, or a metal layer can be provided on the bottom surface of the dielectric layer 126 to reduce the silicon conductive loss of the antenna tuner 118 caused by the coupling of the main radiator 132, similar to the reference Figure 3 and Figure 4 Those discussed.

[0095] Fig.17 1 is a cross-sectional view of an antenna package structure 1700 according to some embodiments of the present invention. It should be noted that the antenna package structure 1700 may include Fig.16 For simplicity, the antenna package structure 1600 shown has the same or similar components, which will not be discussed in detail. In the following embodiments, the antenna layer 150 includes a plurality of dielectric layers 126 .

[0096] like Fig.17 As shown, according to some embodiments, the antenna layer 150 includes a plurality of discontinuous dielectric layers 126. The dielectric layers 126 may be spaced apart from each other. The dimensions of the dielectric layers 126 (e.g., the length in a direction parallel to the top surface of the dielectric layers 126) may be different, and different numbers of antenna elements 134 may be provided in the dielectric layers 126. For example, Fig.17 As shown, one or two antenna elements 134 may be disposed in one dielectric layer 126. More than two antenna elements 134 may be disposed in one dielectric layer 126.

[0097] The antenna tuner 118 and the conductive connector 122 may be exposed. The thickness of the antenna tuner 118 may be reduced, or a metal layer may be provided on the bottom surface of the dielectric layer 126 to reduce the silicon conductive loss of the antenna tuner 118 caused by the coupling of the main radiator 132, similar to the reference Figure 3 and Figure 4 Those discussed.

[0098] Fig.18 is a cross-sectional view of an antenna package structure 1800 according to some embodiments of the present invention. It should be noted that the antenna package structure 1800 may include Fig.17 For the sake of simplicity, the same or similar components of the antenna package structure 1700 will not be discussed in detail. In the following embodiments, the dielectric layer 126 includes different thicknesses.

[0099] like Fig.18 As shown, the dielectric layer 126 may have different thicknesses in a direction perpendicular to the first surface 102a of the substrate 102. The size of the antenna element 134 may also be different accordingly. For example, the thickness of the antenna feed assembly 130 in a direction perpendicular to the first surface 102a of the substrate 102 may be different.

[0100] The antenna tuner 118 and the conductive connector 122 may be exposed. The thickness of the antenna tuner 118 may be reduced, or a metal layer may be provided on the bottom surface of the dielectric layer 126 to reduce the silicon conductive loss of the antenna tuner 118 caused by coupling of the main radiator 132, similar to the reference Figure 3 and Figure 4 The situation discussed.

[0101] In summary, the antenna package structure according to the present invention includes a vertically stacked antenna layer and an antenna tuner. Therefore, the antenna impedance, frequency, polarization direction and radiation direction can be modified, and the size of the antenna package structure can be reduced. According to some embodiments, the antenna grounding in the substrate can reduce the overall height of the antenna package structure.

[0102] Although the present invention has been described by way of examples and preferred embodiments, it should be understood that the present invention is not limited to the disclosed embodiments. On the contrary, the present invention is intended to cover various modifications and similar arrangements (as will be apparent to those skilled in the art). Therefore, the scope of the appended claims should be given the broadest interpretation to cover all such modifications and similar arrangements.

Claims

1. An antenna packaging structure, characterized in that: include: a substrate; an antenna tuner disposed on the top surface of the substrate; a communication device disposed on the bottom surface of the substrate; An antenna layer vertically overlapping the antenna tuner and comprising: a dielectric layer; An antenna element is disposed in the dielectric layer and electrically connected to the substrate.

2. The antenna packaging structure according to claim 1, characterized in that: Further including: A ground layer is disposed in the substrate.

3. The antenna packaging structure according to claim 1, characterized in that: Further including: A metal layer is disposed on the bottom surface of the dielectric layer and vertically overlaps the antenna tuner.

4. The antenna packaging structure according to claim 1, characterized in that: Further including: A ground layer is disposed in the dielectric layer.

5. The antenna packaging structure according to claim 1, characterized in that: Further including: A shielding layer extends on the sidewalls of the substrate and the antenna layer.

6. The antenna packaging structure according to claim 1, characterized in that: The dielectric layer is separated from the antenna tuner.

7. The antenna packaging structure according to claim 6, characterized in that: Further including: A packaging material surrounds the antenna tuner and separates the antenna tuner from the dielectric layer.

8. The antenna packaging structure according to claim 1, characterized in that: The antenna tuner is disposed in the recess of the dielectric layer.

9. The antenna packaging structure according to claim 1, characterized in that: Further including: A connector or a conductive terminal is disposed on the bottom surface of the substrate and electrically connected to the substrate.

10. An antenna packaging structure, characterized in that: include: a substrate; an antenna tuner disposed above the substrate; a communication device disposed below the substrate; an antenna layer disposed above and separated from the antenna tuner, wherein the antenna layer comprises: multiple dielectric layers; A plurality of antenna elements are disposed in the dielectric layer and electrically connected to the substrate.

11. The antenna packaging structure according to claim 10, characterized in that: The antenna tuner is arranged between two of the antenna elements and is partially covered by the antenna elements.

12. The antenna packaging structure according to claim 10, characterized in that: Further including: A molding material surrounds each of the dielectric layers.

13. The antenna packaging structure according to claim 10, characterized in that: The dielectric layers have different thicknesses and / or lengths.

14. The antenna packaging structure according to claim 10, characterized in that: Each of the antenna elements comprises: an antenna feed assembly; A main radiator is arranged above the antenna feeding assembly.

15. The antenna packaging structure according to claim 14, characterized in that: Further including: A molding material surrounds the antenna feed assembly, wherein the main radiator is disposed above the molding material.

16. The antenna packaging structure according to claim 10, characterized in that: Further including: A connector or a conductive terminal is adjacent to the communication device.

17. An antenna packaging structure, characterized in that: include: a substrate; an antenna tuner disposed on the top surface of the substrate; a molding material surrounding the antenna tuner; A main radiator is disposed above the molding material and connected to the substrate, wherein the main radiator partially overlaps the antenna tuner.

18. The antenna packaging structure according to claim 17, characterized in that: Further including: An antenna feed assembly is located directly below the primary radiator, wherein the antenna feed assembly and the antenna tuner are separated by the molding material.

19. The antenna packaging structure according to claim 18, characterized in that: The antenna feed assembly includes a through hole extending through the molding material.

20. The antenna packaging structure according to claim 17, characterized in that: The antenna feeding assembly includes a coupling slot formed on the top surface of the substrate so that the main radiator is connected to the substrate by using a slot coupling feeding technique.

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