Electronic device

Abstract

The invention relates to electronic equipment. The electronic equipment comprises a rotating mechanism, a middle frame and a circuit board. One side of the middle frame is connected with the rotating mechanism, the circuit board is arranged on the other side of the middle frame, the circuit board comprises a first sub-circuit board and a second sub-circuit board which are mutually stacked in a first direction, and the first sub-circuit board comprises a first part and a second part which are mutually connected in a second direction; the first sub-circuit board comprises a first surface and a second surface which are oppositely arranged, the second surface of the first part is opposite to the second sub-circuit board, and at least one part of the second surface of the second part is used for being opposite to the middle frame; the design of the second part of the first sub-circuit board increases the area of the circuit board, can reduce the layout length of the stacked circuit boards, and further can reduce the overall size of the electronic equipment or increase the volume of the battery module.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] In recent years, as the technology in the field of electronic equipment has become more and more mature, folding screen devices have increasingly pursued lightweight and portable designs. In order to enable folding screen devices to achieve the above-mentioned technical effects, the solution adopted in related technologies is to shorten the width of the hinge area of ​​the folding screen, and the middle frame of the folding screen is arranged side by side with the circuit board.

[0003] However, such a solution is difficult to implement and ignores the free space above the hinge area. The free space above the hinge area is not conducive to the development of lightweight and portable electronic devices. Summary of the invention

[0004] In order to overcome the above technical problems existing in the related art, the present disclosure provides an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, an electronic device is provided, comprising a rotating mechanism; a middle frame, one side of the middle frame being connected to the rotating mechanism; a circuit board arranged on the other side of the middle frame, the circuit board comprising a first sub-circuit board and a second sub-circuit board stacked on each other in a first direction, the first sub-circuit board comprising a first part and a second part connected to each other in a second direction.

[0006] The first sub-circuit board includes a first surface and a second surface arranged opposite to each other in the first direction, the second surface of the first part is opposite to the second sub-circuit board, and at least a part of the second surface of the second part is opposite to the middle frame.

[0007] In some embodiments, the circuit board includes a supporting portion, the supporting portion is disposed at a position where the first portion and the second portion of the first sub-circuit board meet, and the supporting portion is located on the second surface of the first sub-circuit board.

[0008] In some embodiments, the circuit board includes an adapter board, which is arranged between the first sub-circuit board and the second sub-circuit board, and the adapter board includes a first side and a second side arranged opposite to each other, and the first side and the first sub-circuit board and the second sub-circuit board form a receiving space for setting electronic components, wherein the support portion is connected to at least a portion of the second side of the adapter board.

[0009] In some embodiments, the first sub-circuit board includes a contact layer, and the contact layer is disposed on the second surface of the second portion.

[0010] In some embodiments, the middle frame includes a third portion and a fourth portion, the circuit board is disposed at the third portion, wherein at least a portion of the second surface of the second portion of the first sub-circuit board is opposite to the fourth portion of the middle frame.

[0011] In some embodiments, the fourth portion includes a third surface and a fourth surface that are opposite to each other in the first direction, and the third surface is in contact with the contact layer.

[0012] In some embodiments, the middle frame includes an adhesive layer, the adhesive layer is disposed on the third surface, and the adhesive layer contacts the contact layer.

[0013] In some embodiments, the third portion is provided with a receiving groove, at least a portion of the circuit board is disposed in the receiving groove, the receiving groove includes a side wall, the side wall includes an avoidance portion, and the avoidance portion is disposed opposite to the support portion.

[0014] In some embodiments, the avoidance portion corresponds to the support portion one by one.

[0015] In some embodiments, the circuit board further includes a shielding cover, which is disposed on the first surface of the first sub-circuit board, and the shielding cover covers at least a portion of the second portion.

[0016] In some embodiments, the rotating mechanism includes a hinge mechanism and a connecting rod mechanism, the connecting rod mechanism is rotatable relative to the hinge mechanism, and the connecting rod mechanism is connected to the middle frame to support the middle frame.

[0017] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0018] The circuit board of the electronic device provided by the embodiment of the present disclosure includes a first sub-circuit board and a second sub-circuit board. The second surface of the first part of the first sub-circuit board is opposite to the second sub-circuit board, and at least a part of the second surface of the second part of the first sub-circuit board is used to be opposite to the middle frame, so that the second part of the first sub-circuit board presents a suspended design. Therefore, the second part of the first sub-circuit board can occupy the empty space above the middle frame. The design of the suspended second part of the first sub-circuit board increases the area of ​​the circuit board, can reduce the layout length of the stacked circuit boards, and further can reduce the overall size of the electronic device or increase the volume of the battery module.

[0019] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0021] Figure 1 The figure is a schematic diagram showing the structure of a circuit board according to an exemplary embodiment.

[0022] Figure 2 The figure is a schematic diagram showing the structure of a middle frame according to an exemplary embodiment.

[0023] Figure 3 It is a schematic diagram of an assembly structure of an electronic device according to an exemplary embodiment.

[0024] Figure 4 The figure is a partially enlarged schematic diagram of a connection between a circuit board and a middle frame according to an exemplary embodiment.

[0025] Figure 5 The figure is a schematic diagram of assembling a middle frame and a rotating mechanism according to an exemplary embodiment.

[0026] Reference numerals:

[0027] Circuit board 1, middle frame 2, electronic device 3;

[0028] The first sub-circuit board 10, the first surface 101, the second surface 102, the first portion 110, the second portion 120, the contact layer 130, the second sub-circuit board 20, the support portion 30, the adapter board 40, the first side 401, the second side 402, the first shielding cover 510, and the second shielding cover 520;

[0029] The third portion 210, the receiving groove 211, the side wall 212, the avoiding portion 213, the fourth portion 220, the third surface 221, the fourth surface 222, and the adhesive layer 230;

[0030] Rotation mechanism 60 , hinge mechanism 610 , and link mechanism 620 . DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the claims.

[0032] In recent years, as the technology in the field of electronic equipment has become more and more mature, various electronic devices have shown a trend of becoming lighter, and folding screen devices have also increasingly pursued lightweight and portable designs. In order to enable folding screen devices to achieve the above-mentioned technical effects, the solution adopted in related technologies is to shorten the width of the hinge area of ​​the folding screen as much as possible, and the middle frame of the folding screen is arranged side by side with the circuit board.

[0033] However, such a solution involves problems such as the transmission of the hinge mechanism and the connecting rod mechanism, which is difficult to implement and ignores the free space above the hinge area of ​​the middle frame. The free space above the hinge area is not conducive to the development of lightweight and portable electronic devices.

[0034] In order to solve the above technical problem, an electronic device is provided according to an embodiment of the present disclosure.

[0035] The electronic device provided by the present disclosure includes a rotating mechanism; a middle frame, one side of the middle frame is connected to the rotating mechanism; a circuit board is arranged on the other side of the middle frame, the circuit board includes a first sub-circuit board and a second sub-circuit board stacked on each other in a first direction, the first sub-circuit board includes a first part and a second part connected to each other in a second direction, wherein the first sub-circuit board includes a first surface and a second surface arranged opposite to each other in the first direction, the second surface of the first part is opposite to the second sub-circuit board, and at least a part of the second surface of the second part is opposite to the middle frame.

[0036] In the present disclosure, the first direction and the second direction may be different. The first direction may be the thickness direction of the electronic device. For example, the electronic device may include a display screen, and the direction from the display surface of the display screen toward the back surface may be considered as the thickness direction of the electronic device. Alternatively, the direction from the display screen toward the middle frame may be the thickness direction of the electronic device. The second direction may be a direction parallel to the extension plane of the electronic device. For example, the second direction may be a direction parallel to the extension plane of the display screen.

[0037] In the circuit board provided by the embodiment of the present disclosure, the second surface of the first part of the first sub-circuit board is opposite to the second sub-circuit board, and at least a part of the second surface of the second part of the first sub-circuit board is used to be opposite to the middle frame, so that the second part of the first sub-circuit board presents a suspended design. As a result, the second part of the first sub-circuit board can occupy the empty space above the middle frame. The design of the second part increases the surface area of ​​the circuit board, can reduce the layout length of the stacked circuit boards, and further can reduce the overall size of the electronic device or increase the volume of the battery module.

[0038] Figure 1 The figure is a schematic diagram showing the structure of a circuit board according to an exemplary embodiment.

[0039] Reference Figure 1 As shown, an electronic device 3 is provided. The electronic device 3 may include a rotating mechanism 60, a middle frame 2, and a circuit board 1. One side of the middle frame 2 is connected to the rotating mechanism 60, and the circuit board 1 is arranged on the other side of the middle frame 2. The circuit board 1 may include a first sub-circuit board 10 and a second sub-circuit board 20 stacked on each other in a first direction. The first sub-circuit board 10 may include a first part 110 and a second part 120 connected to each other in a second direction.

[0040] The first sub-circuit board 10 may include a first surface 101 and a second surface 102 arranged opposite to each other in a first direction, the second surface 102 of the first part 110 is opposite to the second sub-circuit board 20 , and at least a portion of the second surface 102 of the second part 120 is used to be opposite to the middle frame 2 .

[0041] Specifically, the first sub-circuit board 10 and the second sub-circuit board 20 are stacked in the first direction, the first sub-circuit board 10 and the second sub-circuit board 20 have different extension lengths in the second direction, the first portion 110 of the first sub-circuit board 10 is stacked opposite to the second sub-circuit board 20, the second portion 120 of the first sub-circuit board 10 is suspended, and at least a portion of the second surface 102 of the second portion 120 of the first sub-circuit board 10 is used to be opposite to the middle frame 2. The overall shape of the circuit board 1 is that the first portion 110 of the first sub-circuit board 10 and the second sub-circuit board 20 are stacked on each other in the first direction, and the second portion 120 of the first sub-circuit board 10 extends outward in the second direction from the position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 are connected, and is in a suspended state.

[0042] It should be noted that, structurally, the first sub-circuit board 10 is not limited to a printed circuit board (PCB) or a flexible printed circuit board (FPC). Functionally, the first sub-circuit board 10 is not limited to a main board, a module board, a frame board, a radio frequency board (RFPCB), etc. In the present disclosure, the material, structure, and function of the first sub-circuit board 10 are not specifically limited.

[0043] Structurally, the second sub-circuit board 20 is not limited to a printed circuit board (PCB) or a flexible printed circuit board (FPC). Functionally, the second sub-circuit board 20 is not limited to a main board, a module board, a frame board, a radio frequency board (RFPCB), etc. In the present disclosure, the material, structure, and function of the second sub-circuit board 20 are not specifically limited.

[0044] In an exemplary embodiment of the present disclosure, the circuit board 1 may include a support portion 30 , which is disposed at a position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 meet, and the support portion 30 is located on the second surface 102 of the first sub-circuit board 10 .

[0045] Specifically, the support portion 30 is disposed at the position where the first portion 110 of the first sub-circuit board 10 is connected to the suspended second portion 120. The support portion 30 can strengthen the connection between the first portion 110 and the second portion 120, and improve the structural strength of the first sub-circuit board 10. The support portion 30 can also disperse stress and reduce stress concentration at the position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 are connected. The support portion 30 can also improve the anti-vibration performance. The first sub-circuit board 10 is often exposed to vibration and impact environments. The support portion 30 can prevent the first sub-circuit board 10 from loosening or breaking under vibration and impact environments.

[0046] It should be noted that the present disclosure does not specifically limit the function of the support portion 30 , and the specific function of the support portion 30 may be one or more of the above-mentioned functions.

[0047] The present disclosure does not specifically limit the process of the support portion 30, such as dispensing, welding, reinforcing ribs and other processes. In the following embodiments, unless otherwise specified, the support portion 30 is described as a dispensing process. The present disclosure does not specifically limit the shape of the support portion 30, which can be one or more of a triangle, a circle, a rectangle, and an irregular polygon. The present disclosure does not specifically limit the number of the support portion 30, which can be one or more, and can be matched and set according to factors such as the length, width, and stress distribution of the second portion 120.

[0048] In an exemplary embodiment of the present disclosure, the circuit board 1 may include an adapter board 40, which may be disposed between the first sub-circuit board 10 and the second sub-circuit board 20, and the adapter board 40 includes a first side 401 and a second side 402 disposed opposite to each other, and the first side 401 and the first sub-circuit board 10 and the second sub-circuit board 20 form a receiving space for arranging electronic components. The support portion 30 is connected to at least a portion of the second side 402 of the adapter board 40.

[0049] Specifically, the first side 401 of the adapter board 40 forms a certain space with the second surface 102 of the first part 110 of the first sub-circuit board 10 and the surface of the second sub-circuit board 20, which can be used to accommodate electronic components on the first sub-circuit board 10 or the second sub-circuit board 20. The adapter board 40 can increase the electronic component capacity of the circuit board 1.

[0050] In the exemplary embodiment of the present disclosure, the support portion 30 may be connected to a portion of the second side 402 of the adapter plate 40. A portion of the second side 402 of the adapter plate 40 is connected to the support portion 30, which can ensure the stability of the support portion 30 without destroying the normal connection between the adapter plate 40 and the first sub-circuit board 10.

[0051] However, the present disclosure is not limited thereto. In some other exemplary embodiments of the present disclosure, the support portion 30 may be connected to the entire second side 402 of the adapter plate 40 .

[0052] The present disclosure does not specifically limit the area of ​​the connecting portion between the second side 402 of the adapter plate 40 and the support portion 30; the connecting portion may be a portion of the second side 402 of the adapter plate 40, that is, the support portion 30 is connected to a portion of the second side 402 of the adapter plate 40; the connecting portion may also be the entire second side 402 of the adapter plate 40, that is, the support portion 30 is completely connected to the second side 402 of the adapter plate 40.

[0053] It should be noted that the width of the adapter board 40 is less than or equal to the width of the first portion 110 of the first sub-circuit board 10 to ensure that the second portion 120 can extend outward and be in a suspended state.

[0054] However, the present disclosure is not limited to this. In some other exemplary embodiments of the present disclosure, the adapter board 40 can be arranged between multiple second sub-circuit boards 20, the width of the adapter board 40 is less than or equal to the width of the second sub-circuit board 20, and the first side 401 of the adapter board 40 forms a receiving space for setting electronic components with two adjacent second sub-circuit boards 20, and the electronic components on the second sub-circuit board 20 can be set in the receiving space.

[0055] The present disclosure does not specifically limit the number of the second sub-circuit boards 20 , and the number, shape, size, and other factors of the electronic components required by the circuit board 1 to meet the corresponding functions can be matched and set.

[0056] It should be noted that the adapter plate 40 may include an adapter plate 40 disposed between the first sub-circuit board 10 and the second sub-circuit board 20 and an adapter plate 40 disposed between a plurality of second sub-circuit boards 20. The present disclosure does not specifically limit the number of adapter plates 40, and the adapter plates 40 may be matched and set according to factors such as the number, shape, and size of electronic components to be accommodated by the first sub-circuit board 10 and the second sub-circuit board 20 and the number of second sub-circuit boards 20.

[0057] In an exemplary embodiment of the present disclosure, the first sub-circuit board 10 may include a contact layer 130, which is arranged on the second surface 102 of the second part 120 of the first sub-circuit board 10, and at least a portion of the second surface 102 of the second part 120 is used to be opposite to the middle frame 2, and the contact layer 130 is used to contact the middle frame 2.

[0058] Specifically, the contact layer 130 has a low viscosity characteristic. The contact layer 130 is arranged on the second surface 102 of the second part 120 of the first sub-circuit board 10. At least a portion of the second surface 102 of the second part 120 is opposite to the middle frame 2, so the contact layer 130 can contact the middle frame 2. At the same time, the low viscosity characteristic of the contact layer 130 makes the contact layer 130 and the middle frame 2 detachably connected to form a detachable connection between the circuit board 1 and the middle frame 2, which can prevent the circuit board 1 from being damaged or even failing due to the connection relationship with the middle frame 2 during the disassembly process of the circuit board 1, so that the circuit board 1 has reworkability.

[0059] It should be noted that the present disclosure does not specifically limit the role of the contact layer 130, and the role of the contact layer 130 can be one or more of interference connection, buffering, and sealing. The present disclosure does not specifically limit the material of the contact layer 130, and it can be Teflon (polytetrafluoroethylene, PTFE), polyurethane (PU), polyethylene (PE), polytetrafluoroethylene aluminum foil (PTFE aluminum foil) and other materials. The present disclosure does not specifically limit the area of ​​the contact layer 130, and the contact layer 130 can be set on the entire position of the second surface 102 of the second part 120 of the first sub-circuit board 10, and the contact layer 130 can also be set on a part of the second surface 102 of the second part 120 of the first sub-circuit board 10.

[0060] Figure 2 The figure is a schematic diagram showing the structure of a middle frame according to an exemplary embodiment.

[0061] In the exemplary embodiment of the present disclosure, referring to Figure 2 As shown, the middle frame 2 may include a third portion 210 and a fourth portion 220 , and the circuit board 1 may be disposed on the third portion 210 , wherein at least a portion of the second surface 102 of the second portion 120 of the first sub-circuit board 10 is opposite to the fourth portion 220 of the middle frame 2 .

[0062] The circuit board 1 is arranged on the third part 210, and the second part 120 of the first sub-circuit board 10 extends toward the fourth part of the middle frame 2 and is in a suspended state. At least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is opposite to the fourth part 220 of the middle frame 2, that is, at least a portion of the second part 120 of the first sub-circuit board 10 is arranged opposite to the fourth part 220 of the middle frame 2.

[0063] Figure 3 It is a schematic diagram of an assembly structure of an electronic device according to an exemplary embodiment.

[0064] Figure 4 The figure is a partially enlarged schematic diagram of a connection between a circuit board and a middle frame according to an exemplary embodiment.

[0065] In the exemplary embodiment of the present disclosure, the fourth portion 220 includes a third surface 221 and a fourth surface 222 that are disposed opposite to each other in the first direction, and the third surface 221 is in contact with the contact layer 130 .

[0066] Specifically, at least a portion of the second surface 102 of the second part 120 of the first sub-circuit board 10 is opposite to the third surface 221 of the fourth part 220 of the middle frame 2, and the contact layer 130 is arranged on the second surface 102 of the second part 120 of the first sub-circuit board 10, and the third surface 221 of the fourth part 220 of the middle frame 2 is in contact with the contact layer 130.

[0067] In an exemplary embodiment of the present disclosure, the circuit board 1 may include a shielding cover, such as Figure 1 As shown, the shielding cover can be a first shielding cover 510. The first shielding cover 510 is disposed on the first surface 101 of the first sub-circuit board 10, and the first shielding cover 510 can shield external signals that interfere with the electronic components on the first surface 101 of the first sub-circuit board 10 in the first shielding cover 510, thereby protecting the normal operation of the electronic components.

[0068] In an exemplary embodiment of the present disclosure, the first shielding cover 510 covers a portion of the second portion 120 , and the first shielding cover 510 is non-detachably connected to the first sub-circuit board 10 , and the first shielding cover 510 can support the second portion 120 of the first sub-circuit board 10 .

[0069] However, the present disclosure is not limited to this. In some other exemplary embodiments of the present disclosure, the first shielding cover 510 covers the entire second part 120. In this case, the connection between the first shielding cover 510 and the first sub-circuit board 10 is located at the end of the second part 120. The fixed connection between the first shielding cover 510 and the first sub-circuit board 10 can support the second part 120.

[0070] It should be noted that the present disclosure does not specifically limit the area of ​​the first portion 110 of the first sub-circuit board covered by the first shielding cover 510 .

[0071] In the exemplary embodiment of the present disclosure, the first shielding cover 510 does not cover the first part 110 of the first sub-circuit board 10. At this time, the first shielding cover 510 only covers at least a portion of the second part 120. The first shielding cover 510 only protects the electronic components of the second part 120 within its coverage area from interference from external interference signals, thereby protecting the normal operation of the electronic components.

[0072] In an exemplary embodiment of the present disclosure, the first shielding cover 510 covers a portion of the first part 110 of the first sub-circuit board 10. At this time, the first shielding cover 510 can protect the electronic components of the first part 110 within its coverage area from interference from external interference signals, thereby protecting the normal operation of the electronic components.

[0073] In an exemplary embodiment of the present disclosure, the first shielding cover 510 completely covers the first part 110 of the first sub-circuit board 10. At this time, the first shielding cover 510 can protect the electronic components of the first part 110 within its coverage from interference from external interference signals, thereby protecting the normal operation of the electronic components, that is, protecting all electronic components on the first surface 101 of the first part 110 of the first sub-circuit board 10.

[0074] In an exemplary embodiment of the present disclosure, the circuit board of the present disclosure may further include a second shielding cover 520, which is disposed on the second sub-circuit board 20. The second shielding cover 520 may shield external signals that interfere with electronic components on the second sub-circuit board 20 in the second shielding cover 520, thereby protecting the normal operation of the electronic components.

[0075] It should be noted that the present disclosure does not specifically limit the shielding area of ​​the second shielding cover 520 . The second shielding cover 520 may cover a portion of the second sub-circuit board 20 , or the second shielding cover 520 may cover the entire second sub-circuit board 20 .

[0076] The present disclosure does not impose any specific restrictions on the shape of the shielding cover (including the first shielding cover 510 and the second shielding cover 520), which can be one or more of a triangle, a circle, a rectangle, and an irregular polygon. The present disclosure does not impose any specific restrictions on the material of the shielding cover, and the material of the shielding cover is not limited to metal materials, metal alloys, and composite materials. The present disclosure does not impose any specific restrictions on the number of shielding covers, which can be matched and set according to factors such as the area of ​​the first sub-circuit board 10 and the second sub-circuit board 20, the number of electronic components, and the working relationship between the electronic components.

[0077] It is understandable that the shapes, materials, and quantities of the first shielding cover 510 and the second shielding cover 520 may be the same or different.

[0078] In the exemplary embodiment of the present disclosure, the middle frame 2 includes an adhesive layer 230 . The adhesive layer 230 is disposed on the third surface 221 , and the adhesive layer 230 contacts the contact layer 130 .

[0079] Specifically, the adhesive layer 230 can be a curing glue. In its original state, the adhesive layer 230 is in liquid state. The adhesive layer 230 contacts the contact layer 130. The adhesive layer 230 can flow to a suitable position according to the height of the suspended position of the second part 120 of the first sub-circuit board 10. After curing, the adhesive layer 230 supports the second part 120 of the first sub-circuit board 10.

[0080] At the same time, since the contact layer 130 has the characteristic of low viscosity, the contact between the adhesive layer 230 and the contact layer 130 can be separated, and the second part 120 of the first sub-circuit board 10 and the fourth part 220 of the middle frame 2 are detachably connected to form a detachable connection between the circuit board 1 and the middle frame 2, which can prevent the circuit board 1 from being damaged or even failing due to the connection relationship with the middle frame 2 during the disassembly process of the circuit board 1, so that the circuit board 1 has reworkability.

[0081] It should be noted that the present disclosure does not specifically limit the area of ​​the adhesive layer 230. The adhesive layer 230 can be arranged at a partial position of the third surface 221 of the fourth part 220, or the adhesive layer 230 can be arranged on the entire third surface 221 of the fourth part; the present disclosure does not specifically limit the material of the adhesive layer 230. The material of the adhesive layer 230 can be one or more of thermosetting adhesive (Thermosetting adhesive), light curing adhesive (UV-curable adhesive), two-component adhesive (Two-component adhesive), and hot-melt adhesive (Hot-melt adhesive).

[0082] In an exemplary embodiment of the present disclosure, the third portion 210 may be provided with a receiving groove 211 , and at least a portion of the circuit board 1 is disposed in the receiving groove 211 .

[0083] Specifically, the second shielding cover 520 is arranged on the outermost second sub-circuit board 20, and the outermost second sub-circuit board 20 is arranged opposite to the bottom of the accommodating groove 211. The length of the outermost second sub-circuit board 20 in the second direction is smaller than the length of the accommodating groove 211 in the second direction. At this time, the second shielding cover 520 and the second sub-circuit board 20 and at least a part of the electronic components on the second sub-circuit board 20 are arranged in the accommodating groove 211.

[0084] In an exemplary embodiment of the present disclosure, the adapter plate 40 may be disposed in the receiving groove 211. The length of the adapter plate 40 in the second direction is less than or equal to the width of the outermost second sub-circuit board 20, and the length of the outermost second sub-circuit board 20 in the second direction is less than the length of the receiving groove 211 in the second direction. In this case, the adapter plate 40, the outermost second sub-circuit board 20, and the second shielding cover 520 are disposed in the receiving groove 211.

[0085] It should be noted that the adapter board 40 includes an adapter board 40 disposed between the first sub-circuit board 10 and the second sub-circuit board 20 and an adapter board 40 disposed between a plurality of second sub-circuit boards 20 .

[0086] The present disclosure does not impose any specific limitation on the number of the second sub-circuit boards 20 and the adapter boards 40 disposed in the receiving grooves 211 .

[0087] In the exemplary embodiment of the present disclosure, the circuit board 1 includes a support portion 30 , which is disposed at a position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 meet, and the support portion 30 is located on the second surface 102 of the first sub-circuit board 10 .

[0088] Specifically, the support portion 30 is arranged at the position where the first portion 110 of the first sub-circuit board 10 is connected to the suspended second portion 120. The support portion 30 can strengthen the connection between the first portion 110 and the second portion 120, thereby improving the structural strength of the first sub-circuit board 10; the support portion 30 can also disperse stress and reduce stress concentration at the position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 are connected; the support portion 30 can also improve the vibration resistance. The first sub-circuit board 10 is often faced with a vibration and impact environment, and the support portion 30 can be placed in a vibration environment of the first sub-circuit board 10 to prevent it from loosening or breaking.

[0089] It should be noted that the present disclosure does not specifically limit the function of the support portion 30 , and the specific function of the support portion 30 may be one or more of the above-mentioned functions.

[0090] The present disclosure does not make any specific limitation on the process of the support portion 30, such as dispensing, welding, reinforcing ribs and other processes. In the following embodiments, unless otherwise specified, the support portion 30 is described as a dispensing process; the present disclosure does not make any specific limitation on the shape of the support portion 30, which may be one or more of a triangle, a circle, a rectangle, and an irregular polygon; the present disclosure does not make any specific limitation on the number of the support portion 30, which may be one or more, and can be matched and set according to factors such as the length and width of the second portion 120.

[0091] In an exemplary embodiment of the present disclosure, the receiving groove 211 may include a side wall 212 , and the side wall 212 may include an escape portion 213 , and the escape portion 213 is disposed opposite to the support portion 30 .

[0092] The receiving groove 211 may include a side wall 212, the side wall 212 extends in the first direction, and the bottom of the receiving groove 211 extends in the second direction. The present disclosure does not specifically limit the extension length of the side wall 212 in the first direction, and can be matched and set according to the extension length of the first sub-circuit board 10, the second sub-circuit board 20, and the adapter board 40 in the second direction and the position of the support portion 30. It is understandable that different side walls 212 may also extend to different lengths in the first direction.

[0093] The side wall 212 may include an escape portion 213 , which is disposed at a connection between the side wall 212 of the receiving groove 211 and the fourth portion 220 of the middle frame 2 . At this time, the escape portion 213 is disposed opposite to the support portion 30 .

[0094] In the exemplary embodiment of the present disclosure, the avoidance portions 213 correspond to the support portions 30 one by one.

[0095] Specifically, since the present disclosure does not specifically limit the number of the support portions 30, it can be matched and set to one or more according to factors such as the length and width of the second portion 120 of the first sub-circuit board 10, so the number of the avoidance portions 213 corresponds to the number of the support portions 30. Since the present disclosure does not specifically limit the shape of the support portion 30, it can be one or more of a triangle, a circle, a rectangle, and an irregular polygon. The shape of the avoidance portion 213 is adapted to the shape of the corresponding support portion 30, so as to reserve enough space to meet the installation requirements when the circuit board 1 and the middle frame 2 are installed.

[0096] The avoidance portion 213 is designed to meet the installation, maintenance, movement and safety requirements of the circuit board 1 and the middle frame 2 , and ensure good coordination and interaction between the circuit board 1 and the middle frame 2 .

[0097] Figure 5 The figure is a schematic diagram of assembling a middle frame and a rotating mechanism according to an exemplary embodiment.

[0098] In the exemplary embodiment of the present disclosure, referring to Figure 5 As shown, the rotating mechanism 60 may include a hinge mechanism 610 and a connecting rod mechanism 620 . The connecting rod mechanism 620 is rotatable relative to the hinge mechanism 610 . The connecting rod mechanism 620 may be connected to the middle frame 2 to support the middle frame 2 .

[0099] Specifically, the hinge mechanism 610 can provide stable rotation and swinging motion for the connecting rod mechanism 620, the connecting rod mechanism 620 can rotate relative to the hinge mechanism 610, the connecting rod mechanism 620 can be connected to the middle frame 2, and the connecting rod mechanism 620 can support the middle frame 2 and drive the middle frame 2 to rotate together.

[0100] It should be noted that the present disclosure does not specifically limit the specific technical principles and specific structural forms of the hinge mechanism 610 and the connecting rod mechanism 620 involved in the rotating mechanism 60. The hinge mechanism 610 and the connecting rod mechanism 620 work together to realize the rotation movement of the middle frame 2.

[0101] In an exemplary embodiment of the present disclosure, the electronic device 3 may include a rotating mechanism 60, a middle frame 2, and a circuit board 1. One side of the middle frame 2 is connected to the rotating mechanism 60, and the circuit board 1 is arranged on the other side of the middle frame 2. The circuit board 1 may include a first sub-circuit board 10 and a second sub-circuit board 20 stacked on each other in a first direction; the middle frame 2 may include a third part 210 and a fourth part 220.

[0102] The first sub-circuit board 10 may include a first part 110 and a second part 120 connected to each other in the second direction, wherein the first sub-circuit board 10 may include a first surface 101 and a second surface 102 arranged opposite to each other, the second surface 102 of the first part 110 is opposite to the second sub-circuit board 20, and at least a portion of the second surface 102 of the second part 120 is used to be opposite to the fourth part 220 of the middle frame 2.

[0103] The circuit board 1 may include a support portion 30 and an adapter board 40. The support portion 30 is arranged at a position where the first portion 110 and the second portion 120 of the first sub-circuit board 10 are connected, and the support portion 30 is located on the second surface 102 of the first sub-circuit board 10; the adapter board 40 may be arranged between the first sub-circuit board 10 and the second sub-circuit board 20, and the support portion 30 is connected to at least a portion of the second side 402 of the adapter board 40.

[0104] The third part 210 of the middle frame 2 can be provided with a receiving groove 211, and the second sub-circuit board 20 is arranged in the receiving groove 211. The receiving groove 211 may include a side wall 212, and the side wall 212 may include an avoidance portion 213. The avoidance portion 213 is arranged opposite to the support portion 30, and the avoidance portion 213 corresponds to the support portion 30 one by one.

[0105] The first sub-circuit may include a contact layer 130, which is arranged on the second surface 102 of the second part 120 of the first sub-circuit board 10, and at least a portion of the second surface 102 of the second part 120 is used to be opposite to the fourth part 220 of the middle frame 2; the fourth part 220 of the middle frame 2 includes a third surface 221 and a fourth surface 222 arranged opposite to each other, and the adhesive layer 230 is arranged on the third surface 221, and the adhesive layer 230 of the fourth part 220 of the middle frame 2 is in contact with the contact layer 130 of the second surface 102 of the second part 120 of the first sub-circuit board 10.

[0106] The low viscosity of the contact layer 130 enables the contact layer 130 to be detachably connected to the fourth portion 220 of the middle frame 2, so as to form a detachable connection between the circuit board 1 and the middle frame 2, which can prevent the circuit board 1 from being damaged or even failing due to the connection relationship with the middle frame 2 during the process of disassembling the circuit board 1, thereby making the circuit board 1 reworkable.

[0107] The rotating mechanism 60 may include a hinge mechanism 610 and a connecting rod mechanism 620. The hinge mechanism 610 may provide stable rotation and swinging motion for the connecting rod mechanism 620. The connecting rod mechanism 620 may rotate relative to the hinge mechanism 610. The connecting rod mechanism 620 may be connected to the middle frame 2. The connecting rod mechanism 620 may support the middle frame 2 and drive the middle frame 2 to rotate together.

[0108] The electronic devices involved in the present disclosure may also be referred to as user equipment (UE), mobile station (MS), electronic device (MT), etc. Exemplarily, the electronic product may be a smart phone (Mobile Phone), a tablet computer, a wearable device (e.g., a smart watch, a Bluetooth headset), a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA) and other mobile terminals, or may also be a digital camera, a SLR camera / micro-single camera, a pan-tilt camera, a sports camera, a drone and other professional shooting equipment. It should be understood that the present disclosure does not specifically limit the specific technology and specific device form adopted by the electronic device. In the description of the above embodiments, a mobile phone is taken as an example for description, but the present disclosure is not limited to this.

[0109] It is understandable that the electronic device provided by the embodiment of the present disclosure includes hardware structures and / or software modules corresponding to the execution of each function in order to realize the above functions. In combination with the units of each example disclosed in the embodiment of the present disclosure, the embodiment of the present disclosure can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the technical solution of the embodiment of the present disclosure.

[0110] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0111] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0112] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0113] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0114] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0115] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the scheme disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and examples are only considered to be exemplary, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.

[0116] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. An electronic device, characterized in that: include: Rotating mechanism; A middle frame, one side of which is connected to the rotating mechanism; A circuit board is arranged on the other side of the middle frame, the circuit board includes a first sub-circuit board and a second sub-circuit board stacked on each other in a first direction, the first sub-circuit board includes a first part and a second part connected to each other in a second direction, The first sub-circuit board includes a first surface and a second surface arranged opposite to each other in the first direction, the second surface of the first part is opposite to the second sub-circuit board, and at least a part of the second surface of the second part is opposite to the middle frame.

2. The electronic device according to claim 1, characterized in that: The circuit board includes a supporting portion, which is disposed at a position where the first portion and the second portion of the first sub-circuit board meet, and the supporting portion is located on the second surface of the first sub-circuit board.

3. The electronic device according to claim 2, characterized in that: The circuit board includes an adapter board, the adapter board is arranged between the first sub-circuit board and the second sub-circuit board, the adapter board includes a first side and a second side arranged opposite to each other, the first side and the first sub-circuit board and the second sub-circuit board form a receiving space for arranging electronic components, Wherein, the supporting portion is connected to at least a portion of the second side of the adapter plate.

4. The electronic device according to claim 2, characterized in that: The first sub-circuit board includes a contact layer, and the contact layer is disposed on the second surface of the second portion.

5. The electronic device according to claim 4, characterized in that: The middle frame includes a third part and a fourth part, and the circuit board is arranged on the third part. Wherein, at least a portion of the second surface of the second portion of the first sub-circuit board is opposite to the fourth portion of the middle frame.

6. The electronic device according to claim 5, characterized in that: The fourth portion includes a third surface and a fourth surface that are opposite to each other in the first direction, and the third surface is in contact with the contact layer.

7. The electronic device according to claim 6, characterized in that: The middle frame includes an adhesive layer, the adhesive layer is disposed on the third surface, and the adhesive layer is in contact with the contact layer.

8. The electronic device according to claim 5, characterized in that: The third part is provided with a receiving groove, at least a part of the circuit board is arranged in the receiving groove, the receiving groove includes a side wall, the side wall includes an avoidance portion, and the avoidance portion is arranged opposite to the supporting portion.

9. The electronic device according to claim 8, characterized in that: The avoidance portions correspond to the support portions one by one.

10. The electronic device according to claim 1, characterized in that: The circuit board includes a shielding cover, which is disposed on the first surface of the first sub-circuit board and covers at least a portion of the second portion.

11. The electronic device according to claim 1, characterized in that: The rotating mechanism includes a hinge mechanism and a connecting rod mechanism, the connecting rod mechanism is rotatable relative to the hinge mechanism, and the connecting rod mechanism is connected to the middle frame to support the middle frame.

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