Auxiliary driving device, polishing mechanism for wafer processing and polishing equipment

Abstract

The invention provides an auxiliary driving device, a polishing mechanism for wafer processing and polishing equipment. The auxiliary driving device comprises an auxiliary driver; the magnetic coupling mechanism comprises an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; the electromagnetic wheel is configured to be driven to rotate by the auxiliary driver; the conductive gear is provided with a conductive disc and a gear surrounding the conductive disc, and the conductive gear is in power connection with a polishing head station switching mechanism of the polishing equipment; the electromagnetic wheel is configured to have magnetism when powered on so as to be in magnetic connection with the conductive gear, so that power of the auxiliary driver is transmitted to the polishing head station switching mechanism through the conductive gear, and polishing head station switching is conducted. According to the polishing mechanism, the polishing head station switching mechanism can be driven by the auxiliary driver to conduct polishing head station switching and posture adjustment, and the maintenance or repair convenience of the polishing mechanism is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor processing technology, and in particular to an auxiliary drive device, a polishing mechanism and a polishing device for wafer processing. Background Art

[0002] In the field of semiconductor processing, polishing equipment is mainly used to remove excess materials from the surface of components such as wafers through chemical mechanical polishing (CMP) technology, so that the wafer surface becomes highly flat to facilitate subsequent processes.

[0003] The current single-disk multi-head polishing equipment is equipped with two or more polishing heads, which can control some polishing heads to polish at the polishing disk, while allowing other polishing heads to work at other workstations (such as loading and unloading platforms), thereby increasing the WPH (Wafer Per Hour) of the polishing equipment.

[0004] However, at present, single-disk multi-head polishing equipment usually uses a motor with a large speed ratio reducer to drive the polishing heads to rotate in conjunction for station switching. This high speed ratio structure makes it difficult to switch stations or adjust postures when the motor cannot provide power, resulting in time-consuming maintenance and troubleshooting. Summary of the invention

[0005] In view of this, the embodiments of the present application provide an auxiliary driving device, a polishing mechanism and a polishing device for wafer processing to at least partially solve the above-mentioned problems.

[0006] According to one aspect of the present application, an auxiliary drive device is provided for polishing equipment, comprising: an auxiliary drive; and a magnetic coupling mechanism, the magnetic coupling mechanism comprising an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; the electromagnetic wheel is configured to be driven to rotate by the auxiliary drive; the conductive gear has a conductive disk and a gear surrounding the conductive disk, and the conductive gear is power-connected to the polishing head station switching mechanism of the polishing equipment; the electromagnetic wheel is configured to have magnetism when energized so as to be magnetically connected to the conductive gear, thereby transmitting the power of the auxiliary drive to the polishing head station switching mechanism via the conductive gear to perform polishing head station switching.

[0007] Optionally or alternatively, the electromagnetic wheel comprises a plurality of electromagnets uniformly distributed along the circumferential direction, and the magnetic poles of adjacent electromagnets are opposite, and the plurality of electromagnets generate corresponding magnetic fields when the electromagnetic wheel is energized.

[0008] Optionally or alternatively, there is a gap between the electromagnetic wheel and the conductive gear along the axial direction, and the gap is configured so that the conductive disk is in the magnetic field generated by the multiple electromagnets when the electromagnetic wheel is energized, and is configured so that the magnetic force between the electromagnetic wheel and the conductive gear can drive the conductive gear to rotate.

[0009] Optionally or alternatively, the conductive disk is configured to generate eddy currents induced by the rotating magnetic field of the electromagnetic wheel when the electromagnetic wheel is energized and rotates, and the eddy currents cause the conductive disk to generate an induced magnetic field corresponding to the magnetic pole distribution of the magnetic field of the electromagnetic wheel, and the electromagnetic wheel and the conductive gear are magnetically connected through the interaction between the magnetic field of the electromagnetic wheel and the induced magnetic field of the conductive disk.

[0010] Optionally or alternatively, the conductive disk comprises a base disk and a copper disk embedded in the base disk.

[0011] Optionally or alternatively, the electromagnetic wheel is configured to be de-energized when the main drive of the polishing head station switching mechanism operates to drive the polishing head station switching mechanism, and to be energized when the main drive fails; the auxiliary drive is configured to start when the main drive fails.

[0012] Optionally or alternatively, the auxiliary drive device further comprises a control mechanism, wherein the control mechanism is configured to control the start and stop of the auxiliary drive and control the power on and off of the electromagnetic wheel.

[0013] Optionally or alternatively, the control mechanism is configured to control the electromagnetic wheel to be energized before controlling the auxiliary drive to start.

[0014] Optionally or alternatively, the auxiliary drive is a pneumatic motor or a DC motor.

[0015] According to another aspect of the present application, a polishing mechanism for wafer processing is provided, comprising a main drive, a polishing head position switching mechanism connected to the main drive, at least two polishing head assemblies connected to the polishing head position switching mechanism, and an auxiliary drive device as described in the aforementioned aspects.

[0016] Optionally or alternatively, the main drive and the polishing head position switching mechanism are connected via an axially connected first transmission wheel and a second transmission wheel, the first transmission wheel is connected to the output shaft of the main drive and is meshed with the conductive gear of the auxiliary drive device, the second transmission wheel is connected to the polishing head position switching mechanism, and the first transmission wheel is configured to drive the second transmission wheel to rotate and thereby drive the polishing head position switching mechanism to switch the polishing head position.

[0017] Optionally or alternatively, the polishing head station switching mechanism includes a reducer connected to the second transmission wheel and a slewing support mechanism configured to support the polishing head assembly.

[0018] According to another aspect of the present application, a polishing device for wafer processing is provided, comprising a polishing plate, a loading platform, a dresser and a liquid supply arm, and the polishing mechanism as described in the above aspects.

[0019] According to the auxiliary drive device, the polishing mechanism for wafer processing and the polishing equipment for wafer processing of the present application, by setting a magnetic coupling mechanism capable of driving the polishing head station switching mechanism, an auxiliary method of switching the polishing head station is provided for the polishing mechanism or the polishing equipment, which ensures the convenience of switching the polishing head station during maintenance and troubleshooting, reduces the difficulty of operation for the operator, significantly shortens the downtime and improves the production capacity. In addition, the magnetic coupling mechanism is a non-contact driving method, the electromagnetic wheel and the conductive gear are not in mechanical contact, and there is no wear between the two, which makes the magnetic coupling mechanism have a long service life and reduces the cost of the overall equipment.

[0020] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0022] Figure 1 It is a structural schematic diagram of a polishing device; Figure 2 is a schematic structural diagram of a polishing device according to an embodiment of the present application, which includes an auxiliary driving device according to an embodiment of the present application; Figure 3 for Figure 2 A schematic diagram of the structure of the magnetic coupling mechanism of the auxiliary drive device is shown; Figure 4 for Figure 3 A schematic structural diagram showing another angle of the magnetic coupling mechanism; Figure 5 for Figure 2 The schematic diagram of the magnetic coupling mechanism structure of the auxiliary drive device shown includes a connection structure; Figure 6 for Figure 5 A schematic structural diagram of the magnetic coupling mechanism from another angle is shown.

[0023] Reference numerals: Polishing equipment 100, polishing mechanism 110, liquid supply arm 120, dresser 130, polishing disk 140, loading platform 150, polishing pad 160, main drive 111, polishing head station switching mechanism 113, reducer 1131, drive wheel 1131A of reducer, slewing support mechanism 1132, polishing head assembly 114, carrier head 115, auxiliary drive device 200, auxiliary drive 210, magnetic coupling mechanism 220, electromagnetic wheel 221, electromagnet 2211, conductive gear 222, conductive disk 2221, gear 2222 of conductive gear, first transmission wheel 111B, second transmission wheel 111A, output shaft 111C. DETAILED DESCRIPTION

[0024] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0025] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0026] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] In the related art, when a single-disk multi-head polishing device controls the polishing head to switch between two or more workstations (for example, the polishing station at the polishing disk and the loading and unloading station at the loading and unloading platform), a motor is generally used in conjunction with a large speed ratio reducer to drive the polishing head components to rotate in conjunction for workstation switching. However, when the motor cannot provide power (for example, the motor fails or the power is off), this large speed ratio structure makes it difficult to switch workstations or adjust the posture, which seriously affects the maintenance or troubleshooting of the polishing equipment.

[0030] In response to the above problems, an embodiment of the present application provides an auxiliary drive device, which can assist in driving the polishing head station switching mechanism after a motor failure or power failure, thereby driving the polishing head assembly to switch stations and adjust postures.

[0031] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0032] See also Figure 1 , Figure 1 The structure diagram of a polishing device 100 applicable to the auxiliary drive device in the embodiment of the present application is shown. As shown in the figure, the polishing device 100 includes a polishing mechanism 110, a liquid supply arm 120, a trimmer 130, a polishing plate 140 and a loading platform 150. The polishing mechanism 110 may include a main drive ( Figure 1 Not shown), a polishing head station switching mechanism 113 and two polishing head assemblies 114, the lower side of the polishing head assembly 114 (relative to Figure 1 In the state shown in FIG. 1 , a carrier head 115 (or polishing head) is provided, and a polishing pad 160 is provided on the polishing plate 140. The two polishing head assemblies 114 are both connected to the polishing head station switching mechanism 113, and the main driver is connected to the polishing head station switching mechanism 113 through the polishing head station switching mechanism 113. The main driver 111 drives the polishing head station switching mechanism 113 to rotate, thereby switching the two polishing head assemblies 114 between the polishing plate 140 and the loading platform 150.

[0033] The dresser 130 can be located on the left side of the polishing plate 140 (relative to the left side of the polishing plate 140). Figure 1The dresser 130 swings at a fixed point (as shown in the state) to dress the surface of the polishing pad 160, and the dressing disk configured by the dresser 130 rotates itself and applies a downward load; the liquid supply arm 120 is arranged above the polishing pad 160 to spread the polishing liquid on the surface of the polishing pad 160 according to the process requirements.

[0034] During the polishing operation, the carrier head 115 brings the surface to be polished of the wafer or other components into contact with the surface of the polishing pad 160, and the carrier head 115 performs a rotational motion and reciprocates along the radial direction of the polishing disk 140; at the same time, the polishing disk 140 rotates, and the liquid supply arm 120 sprays the polishing liquid onto the surface of the polishing pad 160. Under the chemical action of the polishing liquid, the relative movement of the carrier head 115 and the polishing disk 140 causes the wafer and the abrasive particles in the polishing liquid to move relative to each other, so as to remove the material on the surface of the wafer.

[0035] In this example, when the two polishing head assemblies 114 need to switch positions, the main driver transmits power to the polishing head position switching mechanism 113, thereby increasing the driving torque and completing the position switching of the two polishing head assemblies 114. In addition, when one of the polishing head assemblies 114 is in normal polishing operation, the main driver 111 and the reducer 1131 of the polishing head position switching mechanism 113 can also provide a sufficiently large torque to overcome the dynamic polishing resistance and maintain the stable state of the polishing head assembly 114.

[0036] It should be noted that Figure 1 In the example shown, two polishing head assemblies 114 are provided. It can be understood that, in a specific implementation, there may be more than two polishing head assemblies 114, which is not limited here.

[0037] Figure 2The structure diagram of a polishing mechanism for wafer processing according to an embodiment of the present application includes a main drive 111, a polishing head station switching mechanism 113 connected to the main drive 111, at least two polishing head assemblies 114 connected to the polishing head station switching mechanism 113, and an auxiliary drive device 200. Specifically, the polishing head station switching mechanism 113 may include a reducer 1131 and a slewing support mechanism 1132 configured to install the polishing head assembly. The auxiliary drive device 200 includes an auxiliary drive 210 and a magnetic coupling mechanism 220, and the magnetic coupling mechanism 220 includes an electromagnetic wheel 221 and a conductive gear 222 opposite to the electromagnetic wheel 221; the electromagnetic wheel 221 is configured to be driven to rotate by the auxiliary drive 210; and the conductive gear 222 is connected to the polishing head station switching mechanism 113 in power. The main drive 111 and the polishing head position switching mechanism 113 are connected via an axially connected first transmission wheel 111B and a second transmission wheel 111A. The first transmission wheel 111B is connected to the output shaft 111C of the main drive 111 and is meshed with the conductive gear 222 of the auxiliary drive device 200. The second transmission wheel 111A is connected to the polishing head position switching mechanism 113, specifically to the driving wheel 1131A of the reducer 1131. The first transmission wheel 111B is configured to drive the second transmission wheel 111A and then drive the polishing head position switching mechanism 113 to switch the polishing head position.

[0038] In an optional embodiment, the auxiliary driver 210 is a pneumatic motor or a DC motor.

[0039] Figure 3 for Figure 2 The structure schematic diagram of the magnetic coupling mechanism 220 of the auxiliary drive device 200 is shown; Figure 4 for Figure 3 A schematic structural diagram of the magnetic coupling mechanism 220 from another angle is shown. It can be seen that the conductive gear 222 has a conductive disk 2221 and a gear 2222 surrounding the conductive disk. Specifically, the conductive disk 2221 may include a base disk and a copper disk or other disk capable of generating a magnetic attraction effect embedded in the base disk. The electromagnetic wheel 221 includes a plurality of electromagnets 2211 uniformly distributed along the circumference, and the magnetic poles of adjacent electromagnets 2211 are opposite. When the electromagnetic wheel 221 is powered on, the plurality of electromagnets 2211 generate corresponding magnetic fields, for example, arranged NSNS in the circumferential direction...

[0040] Figure 5 and Figure 6 The connection structures of the electromagnetic wheel 221 and the conductive gear 222 are also shown. For example, the shaft connected to the electromagnetic wheel 221 and extending upward can be the output shaft of the auxiliary driver 210, and the shaft connected to the conductive gear 222 and extending downward can be connected to the frame or housing of the polishing device. Figure 5 and Figure 6It can be seen that there is an axial gap between the electromagnetic wheel 221 and the conductive gear 222. The gap is configured to make the conductive disk 2221, for example, a copper disk of the conductive disk 2221, be in the above-mentioned magnetic field generated by the multiple electromagnets 2211 when the electromagnetic wheel 221 is energized, thereby generating a magnetic attraction effect. The conductive disk 2221 is configured to generate eddy currents induced by the rotating magnetic field of the electromagnetic wheel 221 when the electromagnetic wheel 221 is energized and rotates. The eddy currents cause the conductive disk 2221 to generate an induced magnetic field corresponding to the magnetic pole distribution of the magnetic field of the electromagnetic wheel 221. Since like charges repel and opposite charges attract, the electromagnetic wheel 221 and the conductive gear 222 are magnetically coupled and driven to be connected through the interaction between the magnetic field of the electromagnetic wheel and the induced magnetic field of the conductive disk. The electromagnetic wheel 221 can thus drive the conductive gear 222 to rotate, thereby transmitting the rotation of the output shaft of the auxiliary driver 210 to the conductive gear 222, and then transmitting it to the polishing head station switching mechanism 113 through the first transmission wheel 111B and the second transmission wheel 111A, providing auxiliary power for the polishing head station switching mechanism 113.

[0041] Furthermore, the gap is also configured so that the magnetic force between the electromagnetic wheel 221 and the conductive gear 222 is large enough to drive the conductive gear 222 to rotate and drive the polishing head station switching mechanism 113. The gap can be adjusted according to the torque required to drive the polishing head station switching mechanism 113 to rotate, so as to ensure that there is no slip between the electromagnetic wheel 221 and the conductive gear 222, so as to ensure that the auxiliary drive device 200 can effectively drive the polishing head station switching mechanism 113.

[0042] In a specific implementation, the auxiliary driving device 200 and the polishing head station switching mechanism 113 can be arranged in parallel. Specifically, the axes of the electromagnetic wheel 221, the conductive gear 222 and the reducer 1131 can be arranged in parallel.

[0043] The magnetic coupling mechanism used in the embodiment of the present application is a non-contact driving method. The electromagnetic wheel and the conductive gear are not in mechanical contact, and there is no wear between the two, which makes the magnetic coupling mechanism have a long service life and can effectively reduce the cost of the overall equipment. In addition, the magnetic coupling mechanism has an overload protection function, which can avoid overload failures of the polishing equipment, reduce the downtime of the polishing equipment, and improve production capacity.

[0044] In the embodiment of the present application, the failure of the main driver 111 may include various situations such as failure of the main driver 111, power failure, process maintenance, etc., which cannot provide power to the reducer 1131. For example, the main driver 111 is powered off to maintain one of the dual polishing heads.

[0045] In the embodiment of the present application, when the main driver 111 cannot provide power for the reducer 1131, the reducer 1131 can be driven by the auxiliary driver 210 to drive the polishing head assembly 114 to switch positions and adjust the posture. Since the polishing mechanism of the double polishing head needs to be repeatedly maintained, or for some processes with serious wear and tear, consumables need to be replaced more frequently, by providing the auxiliary drive device of the present application, the convenience of troubleshooting, maintenance or repair of the polishing mechanism can be effectively improved, the downtime can be shortened, and the normal operation time of the system can be increased, thereby improving production efficiency and reducing production losses caused by downtime.

[0046] In a specific embodiment, the electromagnetic wheel 221 is configured to be de-energized when the main drive 111 operates normally to drive the polishing head station switching mechanism 113, and to be energized when the main drive 111 fails; the auxiliary drive 210 is configured to start when the main drive 111 fails. The auxiliary drive device 200 may also include a control mechanism (not shown in the figure), which is configured to control the start and stop of the auxiliary drive 210 and control the power on and off of the electromagnetic wheel 221. Preferably, the control mechanism is configured to control the electromagnetic wheel 221 to be energized before controlling the auxiliary drive 210 to start, thereby causing the electromagnetic wheel 221 to generate a magnetic field first, which helps the electromagnetic wheel 221 and the conductive gear 222 to establish a stable magnetic coupling connection. Furthermore, when the auxiliary drive is not needed, the auxiliary drive 210 can be controlled to stop first, and then the electromagnetic wheel 221 can be controlled to be de-energized after stopping so that the electromagnetic wheel 221 and the conductive gear 222 are disconnected from the magnetic coupling. This delay setting can ensure the stability of the system operation during the switching process of starting and stopping the auxiliary drive device. Preferably, the controller is configured to prevent the main drive 111 and the auxiliary drive 210 from interfering with each other in the deceleration polishing head station switching mechanism 113 .

[0047] In specific implementation, the control mechanism may be a controller, such as a single chip microcomputer, a programmable logic controller, etc.

[0048] In specific implementation, the delay time when starting and stopping can be determined according to actual conditions and is not limited here.

[0049] Preferably, a switch may be provided between the electromagnetic wheel 221 and a power source (not shown) supplying power thereto, the switch being electrically connected or communication-connected to the control mechanism and being controlled by the control mechanism, and the control mechanism controls the switch to power on or off the electromagnetic wheel 221, so as to establish or cut off the magnetic connection between the electromagnetic wheel 221 and the conductive gear 222. In addition, the power source supplying power to the electromagnetic wheel 221 may be the original power source in the polishing device, so as to reduce the introduction of additional components and simplify the system structure.

[0050] According to the auxiliary drive device, polishing mechanism for wafer processing and polishing equipment for wafer processing of the present application, by setting a magnetic coupling mechanism capable of driving the polishing head station switching mechanism, an auxiliary method of switching the polishing head station is provided for the polishing mechanism or polishing equipment, which ensures the convenience of switching the polishing head station during maintenance and troubleshooting, reduces the difficulty of operation for the operator, significantly shortens the downtime and improves the production capacity. The dual-drive polishing mechanism and polishing equipment with main drive and auxiliary drive, the dual-drive mechanisms cooperate with each other, ensure the efficient operation of the system in various stages such as machine operation and shutdown maintenance, and improve the overall efficiency of the equipment.

[0051] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An auxiliary drive device for polishing equipment, characterized in that: include: Auxiliary drive; as well as A magnetic coupling mechanism, the magnetic coupling mechanism comprising an electromagnetic wheel and a conductive gear opposite to the electromagnetic wheel; The electromagnetic wheel is configured to be driven to rotate by the auxiliary driver; the conductive gear has a conductive disk and a gear surrounding the conductive disk, and the conductive gear is connected to the polishing head station switching mechanism of the polishing device by power; The electromagnetic wheel is configured to have magnetism when powered on so as to be magnetically connected to the conductive gear, thereby transmitting the power of the auxiliary drive to the polishing head station switching mechanism via the conductive gear to perform polishing head station switching.

2. The auxiliary drive device according to claim 1, characterized in that: The electromagnetic wheel includes a plurality of electromagnets uniformly distributed along the circumferential direction, and the magnetic poles of adjacent electromagnets are opposite. When the electromagnetic wheel is energized, the plurality of electromagnets generate corresponding magnetic fields.

3. The auxiliary drive device according to claim 2, characterized in that: There is a gap between the electromagnetic wheel and the conductive gear in the axial direction. The gap is configured so that the conductive disk is in the magnetic field generated by the multiple electromagnets when the electromagnetic wheel is energized, and so that the magnetic force between the electromagnetic wheel and the conductive gear can drive the conductive gear to rotate.

4. The auxiliary drive device according to claim 3, characterized in that: The conductive disk is configured to generate eddy currents induced by the rotating magnetic field of the electromagnetic wheel when the electromagnetic wheel is energized and rotates, and the eddy currents cause the conductive disk to generate an induced magnetic field corresponding to the magnetic pole distribution of the magnetic field of the electromagnetic wheel, and the electromagnetic wheel and the conductive gear are magnetically connected through the interaction between the magnetic field of the electromagnetic wheel and the induced magnetic field of the conductive disk.

5. The auxiliary drive device according to claim 1, characterized in that: The conductive plate includes a base plate and a copper plate embedded in the base plate.

6. The auxiliary drive device according to claim 1, characterized in that: The electromagnetic wheel is configured to be de-energized when the main drive of the polishing head station switching mechanism operates to drive the polishing head station switching mechanism, and to be energized when the main drive fails; the auxiliary drive is configured to start when the main drive fails.

7. The auxiliary drive device according to claim 6, characterized in that: The auxiliary drive device further includes a control mechanism configured to control the start and stop of the auxiliary drive and control the power on and off of the electromagnetic wheel.

8. The auxiliary drive device according to claim 7, characterized in that: The control mechanism is configured to control the electromagnetic wheel to be energized before controlling the auxiliary drive to start.

9. The auxiliary drive device according to any one of claims 1 to 8, characterized in that: The auxiliary driver is a pneumatic motor or a DC motor.

10. A polishing mechanism for wafer processing, characterized in that: It comprises a main drive, a polishing head station switching mechanism connected to the main drive, at least two polishing head assemblies connected to the polishing head station switching mechanism, and an auxiliary drive device as claimed in any one of claims 1 to 9.

11. The polishing mechanism according to claim 10, characterized in that: The main drive and the polishing head position switching mechanism are connected via a first transmission wheel and a second transmission wheel axially connected in series, the first transmission wheel is connected to the output shaft of the main drive and is meshed with the conductive gear of the auxiliary drive device, the second transmission wheel is connected to the polishing head position switching mechanism, and the first transmission wheel is configured to drive the second transmission wheel to rotate and thereby drive the polishing head position switching mechanism to switch the polishing head position.

12. The polishing mechanism according to claim 10, characterized in that: Polishing head station switching mechanism The polishing head station switching mechanism includes a reducer connected to the second transmission wheel and a slewing support mechanism configured to support the polishing head assembly.

13. A polishing device for wafer processing, characterized in that: The invention comprises a polishing disc, a loading platform, a dresser and a liquid supply arm, and a polishing mechanism as claimed in any one of claims 10 to 12.

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