Three-dimensional heat transfer device

Abstract

The invention discloses a three-dimensional heat transfer device. The three-dimensional heat transfer device comprises a first heat conduction shell, a second heat conduction shell and at least one cold area heat conduction group, the second heat conduction shell is arranged on the first heat conduction shell, so that the first heat conduction shell and the second heat conduction shell jointly form a liquid-tight cavity. The liquid-tight chamber accommodates a cooling fluid. The at least one cold area heat conduction group is positioned in the liquid-tight cavity and is arranged on the second heat conduction shell, each cold area heat conduction group comprises a plurality of cold area extension heat conduction structures which are arranged side by side, and the plurality of cold area extension heat conduction structures in at least one row are separated from one another to form at least one pressure reduction notch; vapor pressure drop and high liquid pressure drop are provided in the liquid-tight chamber through the cold zone extension thermally conductive structure; after the cooling fluid absorbs heat of the heat source and is vaporized, the flow path of the vaporized cooling fluid is dispersed through the at least one pressure reduction notch.

Description

Technical Field

[0001] The invention relates to a heat transfer device, in particular to a three-dimensional heat transfer device. Background Art

[0002] The technical principle of the heat spreader is similar to that of the heat pipe, but there is a difference in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat spreader is conducted on a two-dimensional surface, so it is more efficient. Specifically, the heat spreader mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone and vaporizes and rapidly expands to the entire cavity. Heat is released in the condensation zone and condenses into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure to form a cooling cycle.

[0003] Most of the temperature spreaders and heat pipes operate independently, resulting in only planar or linear heat transfer for individual temperature spreaders or individual heat pipes, rather than integrated three-dimensional heat transfer, so that the heat dissipation effect has not been fully exerted. At present, some manufacturers have integrated temperature spreaders and heat pipes to produce heat transfer devices that can transfer heat in three dimensions. Generally speaking, manufacturers will improve the heat dissipation efficiency by increasing the capillary force of the capillary structure of the three-dimensional heat transfer device or increasing the thermal conductivity of the evaporation zone of the three-dimensional heat transfer device. However, the efficiency of the reflux of the vaporized working fluid in the current three-dimensional heat transfer device is still insufficient, so that the overall heat dissipation efficiency does not meet the needs of users. Therefore, how to improve the reflux efficiency of the gaseous working fluid to further improve the heat dissipation efficiency of the three-dimensional heat transfer device is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides a three-dimensional heat transfer device to improve the reflux efficiency of gaseous working fluid and further improve the heat dissipation efficiency of the three-dimensional heat transfer device.

[0005] An embodiment of the present invention discloses a three-dimensional heat transfer device, comprising:

[0006] a first heat-conducting shell;

[0007] a second heat-conducting shell installed on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber, and the liquid-tight chamber contains a cooling fluid;

[0008] At least one cold zone heat conduction group is located in the liquid-tight chamber and is disposed on the second heat-conducting shell, each of the cold zone heat conduction groups includes a plurality of cold zone extension heat conduction structures arranged side by side, and at least one row of the plurality of cold zone extension heat conduction structures are separated from each other to form at least one pressure reduction gap, and the cold zone extension heat conduction structures provide a vapor pressure drop and a high liquid pressure drop in the liquid-tight chamber;

[0009] After the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid is dispersed through at least one of the pressure reduction gaps.

[0010] The above-mentioned three-dimensional heat transfer device comprises:

[0011] A plurality of heat pipes are disposed in the first heat-conducting shell and communicated with the liquid-tight chamber;

[0012] At least one hot zone heat conduction group is located in the liquid-tight chamber and is arranged in the second heat-conducting shell, and includes a plurality of hot zone extension heat conduction structures arranged side by side. At least one cold zone heat conduction group is arranged side by side on one side of the at least one hot zone heat conduction group. The hot zone extension heat conduction structure provides a vapor pressure drop and a high liquid pressure drop in the liquid-tight chamber.

[0013] In the above-mentioned three-dimensional heat transfer device, each heat zone extension heat conductive structure is separated from the first heat conductive shell by a gap, forming a top side space on the top side of the heat zone extension heat conductive structure for the flow of cooling fluid, wherein after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid is dispersed through the top side space and at least one of the pressure reduction gaps.

[0014] The above-mentioned three-dimensional heat transfer device, wherein the second heat-conducting shell includes a bottom plate, a first convex structure and a second convex structure, the first convex structure protrudes from the bottom plate in a direction away from the first heat-conducting shell, the second convex structure protrudes from the first convex structure in a direction away from the first heat-conducting shell, the second convex structure has an inner surface facing the first heat-conducting shell, and the at least one hot zone heat-conducting group and the at least one cold zone heat-conducting group protrude from the inner surface of the second convex structure.

[0015] The above-mentioned three-dimensional heat transfer device further includes multiple hot zone support structures and multiple cold zone support structures, wherein the hot zone support structures respectively protrude from the hot zone extended heat conductive structure, and the cold zone support structures respectively protrude from the cold zone extended heat conductive structure, and the lengths of the hot zone support structures are greater than the lengths of the cold zone support structures.

[0016] The above-mentioned three-dimensional heat transfer device further comprises a first capillary structure, and the first capillary structure is disposed on the first heat-conducting shell.

[0017] The above-mentioned three-dimensional heat transfer device further comprises a second capillary structure, which is arranged on the second heat-conducting shell, the at least one hot zone heat-conducting group, the at least one cold zone heat-conducting group, the hot zone support structures and the cold zone support structures.

[0018] The above-mentioned three-dimensional heat transfer device, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the right side of the second convex hull structure.

[0019] The above-mentioned three-dimensional heat transfer device, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the left side of the second convex hull structure.

[0020] The above-mentioned three-dimensional heat transfer device, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the left side of the second convex hull structure.

[0021] The above-mentioned three-dimensional heat transfer device, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the right side of the second convex hull structure.

[0022] The above-mentioned three-dimensional heat transfer device, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is separated from the bottom side, the top side, the left side and the right side of the second convex hull structure.

[0023] According to the three-dimensional heat transfer device of the above embodiment, since these cold zone extended heat-conducting structures are separated and form a plurality of pressure-reducing gaps, after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through these pressure-reducing gaps to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

[0024] In addition, the pressure loss between at least one hot zone heat conduction group and at least one cold zone heat conduction group will cause a temperature difference and form thermal resistance. The pressure loss can be reduced through these pressure reduction gaps to reduce thermal resistance and further improve heat dissipation efficiency.

[0025] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 FIG. 4 is a schematic three-dimensional diagram of a three-dimensional heat transfer device according to a first embodiment of the present invention.

[0027] Figure 2 for Figure 1 A three-dimensional schematic diagram of a second heat-conducting shell of a three-dimensional heat transfer device.

[0028] Figure 3 for Figure 1 A cross-sectional schematic diagram of a three-dimensional heat transfer device.

[0029] Figure 4 for Figure 1 A schematic plan view of a second heat-conducting shell of a three-dimensional heat transfer device.

[0030] Figure 5 for Figure 1 A plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device.

[0031] Figure 6 4 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a second embodiment of the present invention.

[0032] Figure 7 4 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a third embodiment of the present invention.

[0033] Figure 8 4 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a fourth embodiment of the present invention.

[0034] Fig. 9 4 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a fifth embodiment of the present invention.

[0035] Fig.10 4 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a sixth embodiment of the present invention.

[0036] Wherein, the reference numerals are:

[0037] 10,10A,10B,10C,10D,10E: Three-dimensional heat transfer device

[0038] 11: First heat-conducting shell

[0039] 12: Second heat-conducting shell

[0040] 121: Bottom plate

[0041] 122: first convex hull structure

[0042] 123: Second convex hull structure

[0043] 1231: Inner surface

[0044] 1232: Heat exchange surface

[0045] 1233: Bottom side

[0046] 1234: Top side

[0047] 1235: Left side

[0048] 1236: Right side

[0049] 13,13A,13B,13C,13D,13E: Hot zone heat conduction group

[0050] 131: Hot zone extension heat conduction structure

[0051] 14: Cold zone heat conduction group

[0052] 141: Cold zone extended heat conduction structure

[0053] 15: Hot zone support structure

[0054] 16: Cold zone support structure

[0055] 17: Heat pipe

[0056] 18: First capillary structure

[0057] 19: Second capillary structure

[0058] A1,A2,B1,B2,C1,C2,D1,D2,E1,E2,F1,F2: Direction

[0059] H: Heat source

[0060] H1: Hotspot

[0061] L1, L2: Length

[0062] N: step-down gap

[0063] S: Liquid-tight chamber DETAILED DESCRIPTION

[0064] See also Figures 1 to 3 . Figure 1 FIG. 4 is a schematic three-dimensional diagram of a three-dimensional heat transfer device according to a first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a second heat-conducting shell of a three-dimensional heat transfer device. Figure 3 for Figure 1 A cross-sectional schematic diagram of a three-dimensional heat transfer device.

[0065] The three-dimensional heat transfer device 10 of this embodiment includes a first heat-conducting shell 11, a second heat-conducting shell 12, two hot zone heat-conducting groups 13, two cold zone heat-conducting groups 14, a plurality of hot zone support structures 15, a plurality of cold zone support structures 16, a plurality of heat pipes 17, a first capillary structure 18 and a second capillary structure 19.

[0066] The second heat-conducting shell 12 is installed on the first heat-conducting shell 11, so that the first heat-conducting shell 11 and the second heat-conducting shell 12 together form a liquid-tight chamber S. The liquid-tight chamber S is used to contain a cooling fluid (not shown). The cooling fluid is, for example, water or a refrigerant.

[0067] The second heat-conducting shell 12 includes a bottom plate 121, a first convex structure 122 and a second convex structure 123. The first convex structure 122 protrudes from the bottom plate 121 away from the first heat-conducting shell 11, and the second convex structure 123 protrudes from the first convex structure 122 away from the first heat-conducting shell 11.

[0068] Please also read Figure 4 and Figure 5 . Figure 4 for Figure 1 A schematic plan view of a second heat-conducting shell of a three-dimensional heat transfer device. Figure 5 for Figure 1 A plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device.

[0069] The second convex hull structure 123 has an inner surface 1231, a heat exchange surface 1232, a bottom side 1233, a top side 1234, a left side 1235 and a right side 1236. The inner surface 1231 faces the first heat-conducting shell 11. The heat exchange surface 1232 faces away from the inner surface 1231 and is used to thermally couple to a heat source H, so that the cooling fluid located in the liquid-tight chamber S can absorb the heat transferred from the heat source to the heat-conducting convex hull structure through the heat exchange surface 1232. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media. The bottom side 1233 is opposite to the top side 1234, and the left side 1235 is opposite to the right side 1236. The bottom side 1233, the top side 1234, the left side 1235 and the right side 1236 together surround the inner surface 1231 and the heat exchange surface 1232.

[0070] The two hot zone heat conducting groups 13 and the two cold zone heat conducting groups 14 are located in the liquid-tight chamber S and protrude from the inner surface 1231 of the second convex hull structure 123, and one of the two hot zone heat conducting groups 13 is adjacent to the top side 1234 and the right side 1236 of the second convex hull structure 123, and the other of the two hot zone heat conducting groups 13 is adjacent to the bottom side 1233 and the left side 1235 of the second convex hull structure 123. In other words, the two hot zone heat conducting groups 13 are arranged along the diagonal line of the second convex hull structure 123. The two cold zone heat conducting groups 14 are arranged side by side on one side of the two hot zone heat conducting groups 13. The two hot zone heat conducting groups 13 are used to correspond to the two hot spots H1 of the heat source H respectively. It should be noted that, relative to the hot zone indicated by the two hot zone heat conducting groups 13, the cold zone indicated by the two cold zone heat conducting groups 14 refers to the area in the corresponding heat source whose temperature is lower than the hot spot H1.

[0071] Each hot zone heat conductive group 13 includes a plurality of hot zone extension heat conductive structures 131 arranged side by side, and each cold zone heat conductive group 14 includes a plurality of cold zone extension heat conductive structures 141 arranged side by side. These hot zone extension heat conductive structures 131 are separated from the first heat conductive shell 11 by a gap, that is, the top sides of these hot zone extension heat conductive structures 131 have spaces for cooling fluid to flow. These hot zone extension heat conductive structures 131 and these cold zone extension heat conductive structures 141 can provide the required vapor pressure drop in the liquid-tight chamber S and reduce the high liquid pressure drop caused by the capillary action of the powder sintered capillary structure to improve the heat dissipation efficiency. The number of these cold zone extension heat conductive structures 141 in each row is multiple and separated to form a plurality of pressure reduction gaps N.

[0072] The hot zone support structures 15 protrude from the hot zone extended heat conductive structures 131, respectively, and the cold zone support structures 16 protrude from the cold zone extended heat conductive structures 141, respectively, and the length L1 of the hot zone support structures 15 is, for example, greater than the length L2 of the cold zone support structures 16. The heat pipes 17 are disposed in the first heat conductive shell 11 and communicate with the liquid-tight chamber S, so that the cooling fluid absorbs the heat of the heat source and evaporates, flows along the direction A1 between the hot zone extended heat conductive structures 131, flows along the direction A2 through the top side spaces of the hot zone extended heat conductive structures 131 and the pressure reduction notches N, and then flows into the heat pipes 17 for heat dissipation.

[0073] The first capillary structure 18 is disposed on the first heat-conducting shell 11. The second capillary structure 19 is disposed on the second heat-conducting shell 12, the two hot zone heat-conducting groups 13, the two cold zone heat-conducting groups 14, the hot zone support structures 15, and the cold zone support structures 16. By disposing the first capillary structure 18 and the second capillary structure 19, the cooling fluid can absorb the heat of the heat source and evaporate and then flow back through the first capillary structure 18 and the second capillary structure 19.

[0074] As for the second capillary structure 19, part of the second capillary structure 19 is disposed in the long and unsegmented hot zone extended heat conductive structures 131 in the second hot zone heat conductive group 13, and can be used to transfer the heat of the hot spot H1. Part of the second capillary structure 19 is disposed in the segmented and cold zone extended heat conductive structures 141 in the second cold zone heat conductive group 14 to form a plurality of pressure reduction gaps N, and can be used to allow the vaporized cooling fluid to flow to reduce the vapor pressure.

[0075] In this embodiment, the cold zone support structures 16 are in a quadrangular column shape, and the second capillary structures 19 disposed on the cold zone support structures 16 are in a cylindrical shape. That is, the shapes of the cold zone support structures 16 and the second capillary structures 19 disposed on the cold zone support structures 16 are different.

[0076] In the present embodiment, the top sides of these hot zone extended thermal conductive structures 131 have spaces for the flow of cooling fluid and these cold zone extended thermal conductive structures 141 are separated and form a plurality of pressure reduction gaps N. The advantage is that after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through the top side spaces of these hot zone extended thermal conductive structures 131 and these pressure reduction gaps N to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

[0077] In addition, the pressure loss between the second hot zone heat conducting group 13 and the second cold zone heat conducting group 14 will cause a temperature difference and form thermal resistance. The pressure reduction gaps N can reduce the pressure loss, thereby reducing the thermal resistance and further improving the heat dissipation efficiency.

[0078] In this embodiment, the 3D heat transfer device 10 is arranged upright according to the location of the heat source, so the second convex structure 123 of the 3D heat transfer device 10 has a bottom side 1233, a top side 1234, a left side 1235 and a right side 1236, but the present invention is not limited thereto. In other embodiments, the 3D heat transfer device can also be arranged flat according to the location of the heat source, so the second convex structure of the 3D heat transfer device can also have a front side, a rear side, a left side and a right side.

[0079] In this embodiment, the length L1 of the hot zone support structures 15 is greater than the length L2 of the cold zone support structures 16, but the present invention is not limited thereto. In other embodiments, the length of the hot zone support structures may be less than or equal to the length of the cold zone support structures.

[0080] In this embodiment, the second capillary structures 19 disposed in the second heat-conducting shell 12, the second hot zone heat-conducting groups 13, the second cold zone heat-conducting groups 14, the hot zone support structures 15, and the cold zone support structures 16 are, for example, made of the same material, but not limited thereto. In other embodiments, the second capillary structures disposed in the second heat-conducting shell, the second hot zone heat-conducting groups, the second cold zone heat-conducting groups, the hot zone support structures, and the cold zone support structures may also be made of different materials.

[0081] In this embodiment, the shapes of the cold zone support structures 16 and the shapes of the second capillary structures 19 disposed on the cold zone support structures 16 are different, but not limited thereto. In other embodiments, the shapes of the cold zone support structures and the shapes of the second capillary structures disposed on the cold zone support structures may also be the same.

[0082] In this embodiment, the inner sides of the heat pipes 17 are not provided with capillary structures, but the present invention is not limited thereto. In other embodiments, the inner sides of the heat pipes 17 may also be provided with capillary structures.

[0083] In the first embodiment, the three-dimensional heat transfer device 10 includes two hot zone heat conduction groups 13 corresponding to two hot spots H of the heat source, but the invention is not limited thereto. Figure 6 . Figure 6 1 is a schematic plan view of a second convex hull structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a second embodiment of the present invention. The three-dimensional heat transfer device 10A of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10A only includes a hot zone heat conduction group 13A, and the hot zone heat conduction group 13A is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13A is adjacent to the top side 1234 and the right side 1236 of the second convex hull structure 123. In other words, the hot zone heat conduction group 13A is located at the upper right corner of the second convex hull structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it can reduce the vapor pressure by flowing between these hot zone extended heat conduction structures 131 along the direction B1 and flowing through the top side space of these hot zone extended heat conduction structures 131 and these pressure reduction notches N along the direction B2.

[0084] See also Figure 7 . Figure 71 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a third embodiment of the present invention. The three-dimensional heat transfer device 10B of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10B only includes a hot zone heat conduction group 13B, and the hot zone heat conduction group 13B is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13B is adjacent to the bottom side 1233 and the left side 1235 of the second convex structure 123. In other words, the hot zone heat conduction group 13B is located at the lower left corner of the second convex structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it can reduce the vapor pressure by flowing between these hot zone extended heat conduction structures 131 along the direction C1 and flowing through the top side space of these hot zone extended heat conduction structures 131 and these pressure reduction notches N along the direction C2.

[0085] See also Figure 8 . Figure 8 1 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a fourth embodiment of the present invention. The three-dimensional heat transfer device 10C of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10C only includes a hot zone heat conduction group 13C, and the hot zone heat conduction group 13C is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13C is adjacent to the top side 1234 and the left side 1235 of the second convex structure 123. In other words, the hot zone heat conduction group 13C is located at the upper left corner of the second convex structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it can reduce the vapor pressure by flowing between these hot zone extended heat conduction structures 131 along the direction D1 and flowing through the top side space of these hot zone extended heat conduction structures 131 and these pressure reduction notches N along the direction D2.

[0086] See also Fig. 9 . Fig. 91 is a schematic plan view of a second convex hull structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a fifth embodiment of the present invention. The three-dimensional heat transfer device 10D of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10D only includes a hot zone heat conduction group 13D, and the hot zone heat conduction group 13D is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13D is adjacent to the bottom side 1233 and the right side 1236 of the second convex hull structure 123. In other words, the hot zone heat conduction group 13D is located at the lower right corner of the second convex hull structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it can reduce the vapor pressure by flowing between these hot zone extended heat conduction structures 131 along the direction E1 and flowing through the top side space of these hot zone extended heat conduction structures 131 and these pressure reduction notches N along the direction E2.

[0087] See also Fig.10 . Fig.10 1 is a schematic plan view of a second convex structure of a second heat-conducting shell in a three-dimensional heat transfer device according to a sixth embodiment of the present invention. The three-dimensional heat transfer device 10E of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10E only includes a hot zone heat conduction group 13E, and the hot zone heat conduction group 13E is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13E is separated from the bottom side 1233, the top side 1234, the left side 1235 and the right side 1236 of the second convex structure 123. In other words, the hot zone heat conduction group 13E is located at the center of the second convex structure 123. After the cooling fluid absorbs the heat of the heat source and vaporizes, it can reduce the vapor pressure by flowing between these hot zone extended heat conduction structures 131 along the direction F1 and flowing through the top side space of these hot zone extended heat conduction structures 131 and these pressure reduction notches N along the direction F2.

[0088] According to the three-dimensional heat transfer device of the above embodiment, since the top sides of these hot zone extended heat conductive structures have spaces for the flow of cooling fluid and these cold zone extended heat conductive structures are separated and form a plurality of pressure reduction gaps, after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through the top side spaces of these hot zone extended heat conductive structures and these pressure reduction gaps to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

[0089] In addition, the pressure loss between the hot zone heat conduction group and the cold zone heat conduction group will cause a temperature difference and form thermal resistance. These pressure reduction gaps can reduce the pressure loss, thereby reducing thermal resistance and further improving heat dissipation efficiency.

[0090] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any relevant technician familiar with the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the protection scope of the claims attached to this application.

Claims

1. A three-dimensional heat transfer device, characterized in that: Include: a first heat-conducting shell; a second heat-conducting shell installed on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber, and the liquid-tight chamber contains a cooling fluid; At least one cold zone heat conduction group is located in the liquid-tight chamber and is disposed on the second heat-conducting shell, each of the cold zone heat conduction groups includes a plurality of cold zone extension heat conduction structures arranged side by side, and at least one row of the plurality of cold zone extension heat conduction structures are separated from each other to form at least one pressure reduction gap, and the cold zone extension heat conduction structures provide a vapor pressure drop and a high liquid pressure drop in the liquid-tight chamber; After the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid is dispersed through at least one of the pressure reduction gaps.

2. The three-dimensional heat transfer device according to claim 1, characterized in that: Include: A plurality of heat pipes are disposed in the first heat-conducting shell and communicated with the liquid-tight chamber; At least one hot zone heat conduction group is located in the liquid-tight chamber and is arranged in the second heat-conducting shell, and includes a plurality of hot zone extension heat conduction structures arranged side by side. At least one cold zone heat conduction group is arranged side by side on one side of the at least one hot zone heat conduction group. The hot zone extension heat conduction structure provides a vapor pressure drop and a high liquid pressure drop in the liquid-tight chamber.

3. The three-dimensional heat transfer device according to claim 2, characterized in that: Each hot zone extended heat-conducting structure is separated from the first heat-conducting shell by a gap, forming a top side space on the top side of the hot zone extended heat-conducting structure for the flow of cooling fluid, wherein after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid is dispersed through the top side space and at least one of the pressure reduction gaps.

4. The three-dimensional heat transfer device according to claim 3, characterized in that: The second heat-conducting shell includes a bottom plate, a first convex structure and a second convex structure. The first convex structure protrudes from the bottom plate in a direction away from the first heat-conducting shell, and the second convex structure protrudes from the first convex structure in a direction away from the first heat-conducting shell. The second convex structure has an inner surface facing the first heat-conducting shell, and the at least one hot zone heat-conducting group and the at least one cold zone heat-conducting group protrude from the inner surface of the second convex structure.

5. The three-dimensional heat transfer device according to claim 4, characterized in that: It further comprises a plurality of hot zone support structures and a plurality of cold zone support structures, wherein the hot zone support structures respectively protrude from the hot zone extended heat conductive structure, the cold zone support structures respectively protrude from the cold zone extended heat conductive structure, and the lengths of the hot zone support structures are greater than those of the cold zone support structures.

6. The three-dimensional heat transfer device according to claim 5, characterized in that: It further comprises a first capillary structure, and the first capillary structure is disposed on the first heat-conducting shell.

7. The three-dimensional heat transfer device according to claim 6, characterized in that: It further comprises a second capillary structure, which is disposed on the second heat-conducting shell, the at least one hot zone heat-conducting group, the at least one cold zone heat-conducting group, the hot zone supporting structures and the cold zone supporting structures.

8. The three-dimensional heat transfer device according to claim 4, characterized in that: The second convex structure has a bottom side, a top side, a left side and a right side. The bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the right side of the second convex structure.

9. The three-dimensional heat transfer device according to claim 4, characterized in that: The second convex structure has a bottom side, a top side, a left side and a right side. The bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the left side of the second convex structure.

10. The three-dimensional heat transfer device according to claim 4, characterized in that: The second convex structure has a bottom side, a top side, a left side and a right side. The bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the left side of the second convex structure.

11. The three-dimensional heat transfer device according to claim 4, characterized in that: The second convex structure has a bottom side, a top side, a left side and a right side. The bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the right side of the second convex structure.

12. The three-dimensional heat transfer device according to claim 4, characterized in that: The second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is separated from the bottom side, the top side, the left side and the right side of the second convex hull structure.

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