Glue-filled sealed micro electro mechanical system (MEMS) automobile pressure sensor

Abstract

The invention, which belongs to the technical field of the automobile pressure sensor, discloses a glue-filled sealed micro-electro-mechanical system automobile pressure sensor comprising a housing, the outer side wall of the housing is provided with a plurality of first contact pins, and one side, close to the first contact pins, in the housing is provided with a plurality of second contact pins matched with the first contact pins. The second pin is arranged at the bottom of the shell; wherein the first contact pins and the second contact pins are connected in a one-to-one correspondence manner; the circuit unit is connected with the inner bottom wall of the shell through circuit unit bonding glue and is electrically connected with the second contact pin; the circuit unit pouring sealant is arranged in the inner cavity of the shell and is positioned at the top of the circuit unit; and the connecting wire harness is in plug-in connection with the first pin through a wire harness connector. Through glue pouring protection of the silicon piezoresistive MEMS flip-chip bonding pressure chip and the electronic component, the silicon piezoresistive MEMS flip-chip bonding pressure chip can be suitable for a high-temperature, high-humidity and high-corrosion working environment, and is good in durability and long in service life.

Description

Technical Field

[0001] The invention belongs to the technical field of automobile pressure sensors, and in particular relates to a glue-filled and sealed micro-electromechanical system automobile pressure sensor. Background Art

[0002] Common pressure sensors use ceramic capacitors, ceramic piezoresistors, sputtered thin films, glass micro-melting, MEMS, etc. Ceramic capacitors and ceramic resistors can only be sealed with O-rings and are not compatible with a variety of pressure media. They have a long-term risk of failure and leakage under certain media, and the package size is large. Glass micro-melting uses glass to sinter the sensing chip onto the diaphragm, which has a complex process and requires large equipment investment. Sputtered thin films sputter the pressure sensing module onto the base, which requires large equipment investment and is costly, and is not widely used. Summary of the invention

[0003] In order to solve the above problems, the present invention adopts the following technical solutions:

[0004] A glue-filled sealed micro-electromechanical system automobile pressure sensor, comprising:

[0005] A housing, wherein the outer wall of the housing is provided with a plurality of first pins, a side of the housing close to the first pins is provided with a plurality of second pins matching the first pins, and the second pins are provided at the bottom of the housing; wherein the first pins are connected to the second pins in a one-to-one correspondence;

[0006] A circuit unit, wherein the circuit unit is connected to the inner bottom wall of the housing through a circuit unit adhesive and is electrically connected to the second pin;

[0007] Circuit unit potting glue, the circuit unit potting glue is arranged in the inner cavity of the shell and is located on the top of the circuit unit;

[0008] A connecting wire harness is plugged into the first plug pin via a wire harness connector.

[0009] Furthermore, the circuit unit includes a pressure module, a conditioning chip, a circuit substrate and electronic components;

[0010] The pressure module, the conditioning chip and the electronic components are respectively arranged on the circuit substrate, and a side of the circuit substrate close to the pressure module is connected to the inner bottom wall of the shell.

[0011] Furthermore, the pressure module, the conditioning chip and the electronic components are all soldered to the circuit substrate through a reflow soldering process.

[0012] Furthermore, the pressure module is surrounded by enclosures, and protective glue is provided inside the enclosures to protect the pressure module.

[0013] Furthermore, the enclosure is cofferdam glue.

[0014] Furthermore, the pressure module includes a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter board, the ceramic adapter board is connected to the circuit substrate, and the silicon piezoresistive MEMS flip-chip pressure chip is arranged on the ceramic adapter board; wherein, the solder balls at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip are used to achieve structural support and electrical signal connection.

[0015] Furthermore, the silicon piezoresistive MEMS flip-chip pressure chip is welded to the ceramic adapter board through a reflow process.

[0016] Furthermore, the micro-electromechanical system automobile pressure sensor is provided in plurality and is respectively mounted on the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the vehicle seat;

[0017] Wherein, a plurality of said micro-electromechanical system automobile pressure sensors are wirelessly connected to the main control system respectively;

[0018] The main control system includes a rear seat adjustment unit and a sound field adjustment unit;

[0019] The rear seat adjustment unit comprises:

[0020] A pressure signal acquisition module, the pressure signal acquisition module is respectively connected to the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the micro-electromechanical system automobile pressure sensor of the vehicle seat, and is used to preliminarily collect the body information of the passenger and the pressure information applied by the passenger on the seat; the pressure signal acquisition module is also connected to the rear floor pressure sensor;

[0021] A microcontrol module, the microcontrol module is connected to the pressure signal acquisition module and is used to perform logic judgment and control decision according to the information data received from the pressure signal acquisition module;

[0022] An adjustment action execution module, the input end of which is connected to the microcontroller module, and the output end of which is connected to the adjustment action execution mechanism; used to send corresponding control instructions to the adjustment action execution mechanism according to the control signal sent by the microcontroller module, and control the adjustment action execution mechanism to perform pre-adjustment and precise adjustment of the rear seats of the vehicle;

[0023] The sound field adjustment unit comprises:

[0024] A sound field center positioning module, the sound field center positioning module is connected to the micro-electromechanical system automobile pressure sensor of the vehicle seat, and is used to detect the pressure on the vehicle seat in real time. When a pressure change is detected, the passenger distribution information in the vehicle body is determined according to the pressure change signal, and the sound field center position is determined according to the passenger distribution information;

[0025] The sound field adjustment control module is connected to the sound field center positioning module, and is used for the vehicle navigation multimedia terminal to control and adjust the delay ratio information of each audio channel of the audio DSP according to the center position of the sound field and send it to each audio channel through DAC conversion. Each audio channel controls the speaker to sound according to the analog audio signal of the delay ratio through the power amplifier.

[0026] Furthermore, the microcontroller module includes:

[0027] A data storage module, connected to the pressure signal acquisition module, and used to store the data collected by the pressure signal acquisition module;

[0028] A data processing module connected to the data storage module; the data processing module is a model based on a convolutional neural network, and is used to provide a parameter matching solution according to the real-time parameters of the pressure collected by the pressure signal acquisition module and stored in the data storage module;

[0029] A training module, connected to the data processing module and the data storage module, for selecting the best matching parameters among the real-time parameters collected by the data collection module through a genetic algorithm, forming a parameter matching scheme and uploading it to the data processing module for training;

[0030] Among them, the data processing module is connected to the adjustment action execution module, and is used to send corresponding control instructions to the adjustment action execution mechanism according to the parameter matching scheme given by the data processing module, so as to control the adjustment action execution mechanism to pre-adjust and precisely adjust the rear seats of the car.

[0031] Beneficial effects:

[0032] 1. The present invention can be applied to high temperature, high humidity and high corrosion working environment by glue potting protection for silicon piezoresistive MEMS flip-chip pressure chips and electronic components, and has good durability and long service life.

[0033] 2. The present invention realizes sealing through circuit unit bonding + overall potting process, with low leakage rate and high reliability.

[0034] 3. The present invention realizes the connection of external electrical signals by directly plugging the housing and the connector, which has the advantage of simple assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 Schematic diagram of the shell structure in the present invention Figure 1 ;

[0037] Figure 3 Schematic diagram of the shell structure in the present invention Figure 2 ;

[0038] Figure 4 is a cross-sectional view of the automobile pressure sensor of the present invention;

[0039] Among them, 1. Shell; 2. Wiring harness connector; 3. First pin; 4. Second pin; 5. Circuit unit potting glue; 6. Circuit unit; 7. Pressure module. DETAILED DESCRIPTION

[0040] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Example 1

[0042] refer to Figure 1-Figure 4 , a glue-encapsulated micro-electromechanical system automotive pressure sensor, comprising:

[0043] A housing 1, wherein a plurality of first pins 3 are disposed on the outer side wall of the housing 1, and a plurality of second pins 4 matching the first pins 1 are disposed on one side of the housing 1 close to the first pins 1, and the second pins 4 are disposed at the bottom of the housing 1; wherein the first pins 3 are connected to the second pins 4 in a one-to-one correspondence;

[0044] Circuit unit 6, which is connected to the inner bottom wall of the housing 1 through circuit unit adhesive and is electrically connected to the second pin 4;

[0045] Circuit unit potting glue 5, which is arranged in the inner cavity of the housing 1 and located on the top of the circuit unit 6;

[0046] The connecting wire harness is plugged into the first plug pin 3 through the wire harness connector 2 .

[0047] In this embodiment, three first pins and three second pins are provided, and three connecting wire harnesses are provided.

[0048] Preferably, the circuit unit 6 includes a pressure module 7, a conditioning chip, a circuit substrate and electronic components;

[0049] The pressure module 7 , the conditioning chip and the electronic components are respectively arranged on a circuit substrate, and a side of the circuit substrate close to the pressure module 7 is connected to the inner bottom wall of the housing 1 .

[0050] Preferably, the pressure module 7, the conditioning chip and the electronic components are all soldered to the circuit substrate by a reflow soldering process.

[0051] Preferably, the pressure module 7 is surrounded by enclosures, and protective glue is provided inside the enclosures to protect the pressure module 7 .

[0052] Preferably, the enclosure is cofferdam glue.

[0053] Preferably, the pressure module 7 includes a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter board, the ceramic adapter board is connected to the circuit substrate, and the silicon piezoresistive MEMS flip-chip pressure chip is arranged on the ceramic adapter board; wherein, the solder balls at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip are used to achieve structural support and electrical signal connection.

[0054] Preferably, the silicon piezoresistive MEMS flip-chip pressure chip is soldered to the ceramic adapter board by a reflow soldering process.

[0055] Example 2

[0056] This embodiment adopts the glue-filled and sealed micro-electromechanical system automobile pressure sensor in Embodiment 1;

[0057] A plurality of micro-electromechanical system automobile pressure sensors are provided, which are respectively installed on the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the vehicle seat;

[0058] Wherein, a plurality of said micro-electromechanical system automobile pressure sensors are wirelessly connected to the main control system respectively;

[0059] The main control system includes a rear seat adjustment unit and a sound field adjustment unit;

[0060] The rear seat adjustment unit consists of:

[0061] A pressure signal acquisition module, the pressure signal acquisition module is respectively connected to the micro-electromechanical system automobile pressure sensors of the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the vehicle seat, and is used to preliminarily collect the body information of the passenger and the pressure information applied by the passenger on the seat; the pressure signal acquisition module is also connected to the rear ground pressure sensor;

[0062] A microcontrol module, which is connected to the pressure signal acquisition module and is used to make logical judgments and control decisions based on the information data received from the pressure signal acquisition module;

[0063] An adjustment action execution module, the input end of the adjustment action execution module is connected to the micro-control module, and the output end of the adjustment action execution module is connected to the adjustment action execution mechanism; used to send corresponding control instructions to the adjustment action execution mechanism according to the control signal sent by the micro-control module, and control the adjustment action execution mechanism to perform pre-adjustment and precise adjustment of the rear seats of the vehicle;

[0064] The sound field adjustment unit includes:

[0065] The sound field center positioning module is connected to the micro-electromechanical system automobile pressure sensor of the vehicle seat, and is used to detect the pressure on the vehicle seat in real time. When the pressure change is detected, the passenger distribution information in the vehicle body is determined according to the pressure change signal, and the sound field center position is determined according to the passenger distribution information;

[0066] The sound field adjustment control module is connected to the sound field center positioning module and is used for the vehicle navigation multimedia terminal to control and adjust the delay ratio information of each audio channel of the audio DSP according to the center position of the sound field and send it to each audio channel through DAC conversion. Each audio channel controls the speaker to sound according to the analog audio signal of the delay ratio through the power amplifier.

[0067] Preferably, the microcontroller module comprises:

[0068] A data storage module, connected to the pressure signal acquisition module, and used to store data collected by the pressure signal acquisition module;

[0069] A data processing module is connected to the data storage module; the data processing module is a model based on a convolutional neural network, and is used to provide a parameter matching solution according to the real-time parameters of the pressure collected by the pressure signal collection module stored in the data storage module;

[0070] The training module is connected to the data processing module and the data storage module, and is used to select the best matching parameters between the real-time parameters collected by the data acquisition module through a genetic algorithm, and form a parameter matching scheme and upload it to the data processing module for training;

[0071] Among them, the data processing module is connected to the adjustment action execution module, which is used to send corresponding control instructions to the adjustment action execution mechanism according to the parameter matching scheme given by the data processing module, and control the adjustment action execution mechanism to pre-adjust and precisely adjust the rear seats of the car.

[0072] In this embodiment, the process of collecting and obtaining preliminary data on the passenger's body shape, including weight and height, is as follows: by detecting the contact position between the passenger's head and the pillow at the top of the seat back, the passenger's height is determined, and the middle position area in the vertical direction of the pillow is used as the boundary area. If the position where the passenger's head contacts the pillow is concentrated above the boundary area, the passenger's height is determined to be large. The pressure data between the passenger's knees and the front seat back and the number of times the passenger's knees contact the front seat back to achieve triggering are collected; the above data are summarized in the convolutional neural network model, the optimal parameter matching scheme is matched, the action execution mechanism is adjusted, and the most suitable posture of the rear seat is automatically adjusted.

[0073] Example 3

[0074] This embodiment is further configured on the basis of the second embodiment.

[0075] The rear seats are provided with massage switches, which are arranged one by one with the rear seats. The rear seats are also provided with massage mechanisms.

[0076] The main control system also includes a massage unit;

[0077] The massage unit comprises:

[0078] The sensing module is connected to the micro-electromechanical system automobile pressure sensors of the rear seat back and the headrest above the rear seat back, and the sensing module is also connected to the massage switch to sense that the massage switch at that position is turned on and detect a change in pressure at that position, and then send out an execution signal.

[0079] The execution massage module is connected to the sensing module and the massage mechanism respectively, and is used to send corresponding control instructions to the massage mechanism according to the execution signal sent by the sensing module, so as to control the massage mechanism to perform massage.

[0080] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A glue-encapsulated micro-electromechanical system automotive pressure sensor, characterized in that: include: A housing, wherein the outer side wall of the housing is provided with a plurality of first pins, a side of the housing close to the first pins is provided with a plurality of second pins matching the first pins, and the second pins are provided at the bottom of the housing; wherein the first pins are connected to the second pins in a one-to-one correspondence; A circuit unit, wherein the circuit unit is connected to the inner bottom wall of the housing through a circuit unit adhesive and is electrically connected to the second pin; Circuit unit potting glue, the circuit unit potting glue is arranged in the inner cavity of the shell and is located on the top of the circuit unit; A connecting wire harness is plugged into the first plug pin via a wire harness connector.

2. The glue-potted and sealed MEMS automotive pressure sensor according to claim 1, characterized in that: The circuit unit includes a pressure module, a conditioning chip, a circuit substrate and electronic components; The pressure module, the conditioning chip and the electronic components are respectively arranged on the circuit substrate, and a side of the circuit substrate close to the pressure module is connected to the inner bottom wall of the shell.

3. The glue-potted and sealed MEMS automotive pressure sensor according to claim 2, characterized in that: The pressure module, the conditioning chip and the electronic components are all soldered to the circuit substrate through a reflow soldering process.

4. The glue-potted and sealed MEMS automotive pressure sensor according to claim 2, characterized in that: The pressure module is surrounded by enclosures, and protective glue is provided inside the enclosures to protect the pressure module.

5. The glue-potted and sealed MEMS automotive pressure sensor according to claim 4, characterized in that: The enclosure is cofferdam rubber.

6. The glue-potted and sealed MEMS automotive pressure sensor according to claim 2, characterized in that: The pressure module includes a silicon piezoresistive MEMS flip-chip pressure chip and a ceramic adapter board, the ceramic adapter board is connected to the circuit substrate, and the silicon piezoresistive MEMS flip-chip pressure chip is arranged on the ceramic adapter board; wherein, the solder balls at the bottom of the silicon piezoresistive MEMS flip-chip pressure chip are used to achieve structural support and electrical signal connection.

7. The glue-potted and sealed MEMS automotive pressure sensor according to claim 6, characterized in that: The silicon piezoresistive MEMS flip-chip pressure chip is welded to the ceramic adapter plate through a reflow process.

8. The glue-potted and sealed MEMS automotive pressure sensor according to any one of claims 1 to 7, characterized in that: The micro-electromechanical system automobile pressure sensor is provided in plurality and is respectively mounted on the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the vehicle seat; Wherein, a plurality of said micro-electromechanical system automobile pressure sensors are wirelessly connected to the main control system respectively; The main control system includes a rear seat adjustment unit and a sound field adjustment unit; The rear seat adjustment unit comprises: A pressure signal acquisition module, the pressure signal acquisition module is respectively connected to the rear seat backrest, the headrest above the rear seat backrest, the front seat backrest and the micro-electromechanical system automobile pressure sensor of the vehicle seat, and is used to preliminarily collect the body information of the passenger and the pressure information applied by the passenger on the seat; the pressure signal acquisition module is also connected to the rear floor pressure sensor; A microcontrol module, the microcontrol module is connected to the pressure signal acquisition module and is used to perform logic judgment and control decision according to the information data received from the pressure signal acquisition module; An adjustment action execution module, the input end of which is connected to the microcontroller module, and the output end of which is connected to the adjustment action execution mechanism; used to send corresponding control instructions to the adjustment action execution mechanism according to the control signal sent by the microcontroller module, and control the adjustment action execution mechanism to perform pre-adjustment and precise adjustment of the rear seats of the vehicle; The sound field adjustment unit comprises: A sound field center positioning module, the sound field center positioning module is connected to the micro-electromechanical system automobile pressure sensor of the vehicle seat, and is used to detect the pressure on the vehicle seat in real time. When a pressure change is detected, the passenger distribution information in the vehicle body is determined according to the pressure change signal, and the sound field center position is determined according to the passenger distribution information; The sound field adjustment control module is connected to the sound field center positioning module, and is used for the vehicle navigation multimedia terminal to control and adjust the delay ratio information of each audio channel of the audio DSP according to the center position of the sound field and send it to each audio channel through DAC conversion. Each audio channel controls the speaker to sound according to the analog audio signal of the delay ratio through the power amplifier.

9. The glue-potted and sealed MEMS automotive pressure sensor according to claim 8, characterized in that: The microcontroller module comprises: A data storage module, connected to the pressure signal acquisition module, and used to store the data collected by the pressure signal acquisition module; A data processing module connected to the data storage module; the data processing module is a model based on a convolutional neural network, and is used to provide a parameter matching solution according to the real-time parameters of the pressure collected by the pressure signal acquisition module and stored in the data storage module; A training module, connected to the data processing module and the data storage module, for selecting the best matching parameters among the real-time parameters collected by the data collection module through a genetic algorithm, forming a parameter matching scheme and uploading it to the data processing module for training; Among them, the data processing module is connected to the adjustment action execution module, and is used to send corresponding control instructions to the adjustment action execution mechanism according to the parameter matching scheme given by the data processing module, so as to control the adjustment action execution mechanism to pre-adjust and precisely adjust the rear seats of the car.

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