Printed circuit board, manufacturing method, functional circuit board, system and optical modem

Abstract

The invention discloses a printed circuit board, a manufacturing method, a functional circuit board, a system and an optical modem. The printed circuit board comprises a bonding pad spacing part, a first bonding pad and a second bonding pad, wherein the first bonding pad and the second bonding pad are arranged in mirror symmetry about the bonding pad spacing part; the first bonding pad, the second bonding pad and the bonding pad spacing part are all covered with soldering tin, and the soldering tin of the bonding pad spacing part is connected with the soldering tin of the first bonding pad and the soldering tin of the second bonding pad; each of the first bonding pad and the second bonding pad comprises a trapezoidal part and a rectangular part; wherein in the same bonding pad, the lower bottom edge of the trapezoidal part coincides with the long edge of the corresponding rectangular part, and the upper bottom edge of the trapezoidal part is connected with the printed wire; according to the technical scheme, the material cost and the production cost of the PON product or the OUN product are reduced, and the benefits of the PON product or the OUN product are increased.

Description

Technical Field

[0001] The present application relates to the technical field of optical gateways, and in particular to a printed circuit board, a manufacturing method, a functional circuit board, a system and an optical modem. Background Art

[0002] In existing conventional ONU PON products, a large number of 0-ohm resistors are used on the circuit board as jumpers or for overcurrent. Taking a conventional 1G GPON / EPON ONU product as an example, the number of 0-ohm resistors in different packages used in this product is about 50. Existing PON products on the market generally use 0-ohm resistors to achieve the role of jumpers, but the large-scale use of 0-ohm resistors will increase the pressure on enterprises in terms of material production costs. Summary of the invention

[0003] The main purpose of this application is to provide a printed circuit board, a manufacturing method, a functional circuit board, a system and an optical modem, aiming to solve the technical problem that the large-scale use of 0 ohm resistors increases production costs.

[0004] To achieve the above-mentioned objectives, the present application provides a printed circuit board, a manufacturing method, a functional circuit board, a system and an optical modem, comprising a pad spacer, and a first pad and a second pad arranged in a mirror-symmetrical manner with the pad spacer; the first pad, the second pad and the pad spacer are covered with solder; the first pad and the second pad each comprise: a trapezoidal portion, the lower base of which coincides with the long side of the rectangular portion, and the upper base is connected to the printed conductor; a rectangular portion, which is arranged opposite to the other rectangular portion, and the two rectangular portions are respectively located on both sides of the pad spacer.

[0005] Optionally, the trapezoidal portion includes: an upper base with a length of 4 mils; a lower base with a length of 23 mils; a first hypotenuse with a length of 17.75 mils; and a second hypotenuse with a length of 17.75 mils.

[0006] Optionally, the rectangular portion includes: a long side with a length of 23 mils; and a wide side with a length of 5 mils.

[0007] Optionally, the pad spacing portion has a width of 5 mils.

[0008] Optionally, the first pad and the second pad maintain consistent shape and size changes.

[0009] To achieve the above object, the present invention also provides a functional circuit board having a printed circuit board.

[0010] On the basis of the above embodiments, the present invention further provides a photoelectric conversion system, comprising: a driving module, used to receive an optical signal, process the optical signal to obtain a target voice and image signal, and send the target voice and image signal to a target receiving device; a WiFi module, used to create a wireless local area network, and provide a wireless network service to the target receiving device in response to an access request from the target receiving device; a voice module, used to provide an IP network-based voice service to the target receiving device in response to a request from the target receiving device; a display module, used to display status information; a control module, used to initialize the status of the driving module, the voice module, the WiFi module and the voice module, and detect the status of the driving module, the voice module, the WiFi module and the voice module to obtain the status information, and display the status information on the display module; wherein the driving module and the control module both have a functional circuit board.

[0011] Optionally, the photoelectric conversion system further includes: a power supply module, used to provide power to the driving module, the WiFi module, the voice module, and the control module.

[0012] To achieve the above-mentioned purpose, the present invention also provides an optical modem, including a photoelectric conversion system.

[0013] To achieve the above-mentioned purpose, the present invention also provides a method for manufacturing a printed circuit board, which is applied to a printed circuit board, and the method for manufacturing a printed circuit board comprises: obtaining a printed circuit board, and performing solder mask opening on the copper foil at the opposite ends of two printed wires to be connected on the top surface of the printed circuit board to form a first solder pad and a second solder pad respectively connected to the two printed wires; covering the surface of the printed circuit board with a steel mesh, the steel mesh being provided with openings, and the openings being provided corresponding to the first solder pad, the second solder pad and the pad spacer; performing tin brushing treatment on the surface of the steel mesh away from the copper foil; and performing reflow soldering treatment on the printed circuit board after the tin brushing treatment.

[0014] A printed circuit board, a manufacturing method, a functional circuit board, a system and an optical modem proposed in the embodiments of the present application, which include a pad spacer, and a first pad and a second pad that are arranged in a mirror-symmetrical manner with respect to the pad spacer; the first pad, the second pad and the pad spacer are all covered with solder, and the solder of the pad spacer is connected to the solder of the first pad and the solder of the second pad; the first pad and the second pad both include a trapezoidal portion and a rectangular portion; wherein, in the same pad, the lower base of the trapezoidal portion coincides with the long side of the corresponding rectangular portion, and the upper base of the trapezoidal portion is connected to the printed conductor; the trapezoidal portions of the two pads are located on a side away from the rectangular portions of the two pads, thereby reducing the material cost and production cost of the PON product or OUN product and increasing the efficiency of the PON product or OUN product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a printed circuit board provided in an embodiment of the present application; Figure 2 A schematic diagram of the first pad structure in a printed circuit board provided in an embodiment of the present application; Figure 3 A structural block diagram of a photoelectric conversion system provided in an embodiment of the present application; Figure 4 A flow chart of a method for manufacturing a printed circuit board provided in an embodiment of the present application.

[0016] In the figure: 1, printed circuit board; 100, photoelectric conversion system; 101, drive module; 102, WiFi module; 103, voice module; 104, display module; 105, control module; 21, first solder pad; 22, second solder pad; 25, packaging circuit; 26, first printed conductor; 27, second printed conductor; 28, solder pad spacer; 31, upper bottom edge; 32, first oblique edge; 33, second oblique edge; 34, first wide side; 35, second wide side; 36, long side.

[0017] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0018] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] In existing conventional optical network units (ONUs) and passive optical networks (PONs), a large number of 0-ohm resistors are used as jumpers on the circuit board. 0-ohm resistors can be packaged in 0201, 0402, 0603 and / or 0805. 0-ohm resistors can be used as jumpers or as overcurrent conductors. For example, a conventional 1G GPON / EPON ONU product can use up to 50 0-ohm resistors in different packages on the ONU product.

[0020] In order to solve the problem of high material and production costs of 0-ohm resistors, a new packaging design can be used to replace 0-ohm resistors in the production of optical modem passive optical networks, PON, Ethernet passive optical networks, EPON and optical network unit products. This example designs and verifies a special packaged printed circuit board, which uses the steel screen printing process and solder paste printing method in the surface mount technology (SMT) production process to package the solder paste into a 0-ohm jumper by reflow. The 0-ohm jumper can be used to replace the 0-ohm resistor.

[0021] Figure 1 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present application, Figure 2 A schematic diagram of the first pad structure in the printed circuit board provided in the embodiment of the present application, referring to Figure 1 and Figure 2 A printed circuit board 1 comprises a pad spacer 28, and a first pad 21 and a second pad 22 which are arranged in mirror symmetry with respect to the pad spacer 28; the first pad 21, the second pad 22 and the pad spacer 28 are all covered with solder, and the solder of the pad spacer 28 is connected to the solder of the first pad 21 and the solder of the second pad 22; the first pad 21 and the second pad 22 each comprise: a trapezoidal portion and a rectangular portion, wherein, in the same pad, the lower base of the trapezoidal portion coincides with the corresponding long side 36 of the rectangular portion, the upper base 31 of the trapezoidal portion is connected to the printed conductor, and the trapezoidal portions of the two pads are located on a side away from the rectangular portions of the two pads.

[0022] As attached Figure 1As shown, exemplarily, an embodiment of the present invention provides a package circuit 25 for a printed circuit board 1, and the package circuit 25 is made on the printed circuit board 1. The package circuit 25 in the present application includes a left half and a right half, and the left half and the right half can be a first pad 21 and a second pad 22, respectively, and the first pad 21 and the second pad 22 are respectively connected to the two ends of the first printed wire 26 and the second printed wire 27. It should be noted that the first pad 21 and the second pad 22 are not directly connected, and there is a pad spacer 28 between the two, which not only conforms to the existing circuit board design scheme, but also saves tin solder paste. The printed circuit board 1 uses a surface mount technology (SMT) production process to cover the surface of the first pad 21 and the second pad 22 with a steel mesh, and then uses a steel mesh printing process to print and fill the surface of the first pad 21, the second pad 22 and the pad spacer 28 with tin solder paste. The tin solder paste is then dissolved on the surface of the first pad 21, the second pad 22 and the pad spacer 28 through a reflow process in the surface mount technology (SMT). Finally, after the tin solder paste cools, the first pad 21 and the second pad 22 are connected on the surface of the pad spacer 28, thereby achieving the connection between the first printed conductor 26 and the second printed conductor 27, and using soldering instead of a 0 ohm resistor saves costs.

[0023] It should be noted that the printed circuit board 1 may have multiple groups of first printed conductors 26 and second printed conductors 27 . Correspondingly, the printed circuit board 1 may use multiple groups of packaging circuits 25 to achieve the connection between the first printed conductors 26 and the second printed conductors 27 .

[0024] In an embodiment of the present invention, the length ratio of the upper base to the lower base of the trapezoidal portion may be 1 / 6 to 5 / 23, such as 0.167, 0.18, 0.19, 0.20 or 0.21, etc. The length ratio of the upper base to the hypotenuse of the trapezoidal portion may be 2 / 9 to 1 / 4, such as 0.222, 0.23, 0.24 or 0.25, etc. The length ratio of the long side to the wide side of the rectangular portion may be 4 to 5, such as 4, 4.25, 4.5, 4.7, or 5, etc.

[0025] It should be noted that the adjustment of the length ratio of the upper bottom side to the lower bottom side of the trapezoidal portion will affect the load-bearing capacity and heat dissipation performance of the pad. For example, when the ratio is 1 / 6, the upper bottom side of the pad is shorter, which is suitable for small electronic components; when the ratio is 5 / 23, the upper bottom side of the pad is longer, which may be more suitable for carrying larger electronic components. Specific ratio values ​​such as 0.167, 0.18, etc. provide a finer adjustment range to meet specific design requirements.

[0026] Adjusting the length ratio of the upper base and the bevel of the trapezoidal portion will affect the shape and structural stability of the pad. The ratio varies from 2 / 9 to 1 / 4, which can make the pad have a good appearance ratio while maintaining a certain structural strength. For example, a ratio of 0.222 may be suitable for applications that require a gentle bevel, while a ratio of 0.25 is suitable for designs with steeper bevels. Refinements such as 0.167, 0.18 or 0.19 can also provide designers with more options to meet specific structural design requirements.

[0027] Adjusting the length ratio of the long side to the wide side of the rectangular part will affect the space utilization of the pad and the symmetry of the structure. A ratio between 4 and 5 means that the long side is 4 to 5 times the wide side, which allows the pad to adapt to different spatial layout requirements while maintaining a certain ratio. Refinements such as 4.25, 4.5 or 4.7 can also provide more options to meet specific structural design requirements.

[0028] In an embodiment of the present invention, the ratio of the width of the pad spacer to the length of the upper base of the trapezoidal portion is 1 to 1.5. For example, the ratio of the width of the pad spacer to the length of the upper base of the trapezoidal portion may be 1, 1.25, 1.3, 1.5 or 2.

[0029] It should be noted that the adjustment of this ratio can affect the layout of the pads and the overall design of the circuit board. A ratio between 1 and 1.5 means that the width of the pad spacer is similar to the length of the upper bottom side of the trapezoidal part, which helps to maintain the compactness and functionality of the circuit board. The ratio of the width of the pad spacer to the length of the upper bottom side of the trapezoidal part can be further refined to 1.25, 1.3 or 1.5. These refined ratios can make the design of the pad spacer more precise to meet different circuit board design requirements.

[0030] In an embodiment of the present application, the trapezoidal portion includes an upper base 31, a lower base, a first oblique side 32 and a second oblique side 33, wherein the upper base 31 may be 4 mils in length; the lower base may be 23 mils in length; the first oblique side 32 may be 17.75 mils in length; and the second oblique side 33 may be 17.75 mils in length.

[0031] Specifically, the trapezoidal portion includes an upper base 31, a first hypotenuse 32, a second hypotenuse 33, and a lower base (not shown in the figure), wherein the length of the upper base 31 can be 4 mils; the length of the lower base can be 23 mils; the length of the first hypotenuse 32 can be 17.75 mils; and the length of the second hypotenuse 33 can be 17.75 mils.

[0032] In an embodiment of the present application, the rectangular portion includes a long side 36 , a first wide side 34 and a second wide side 35 , wherein the length of the long side 36 may be 23 mils; the lengths of the first wide side 34 and the second wide side 35 may both be 5 mils.

[0033] In an embodiment of the present application, the width of the pad spacing portion may be 5 mils.

[0034] Specifically, 1 mil = 0.0254 millimeters.

[0035] It should be noted that the data of the first pad 21 and the second pad 22 in the package circuit 25 are optimized dimensions and specification parameters. The pad spacer 28 also provides optimized dimensions and specification parameters. According to the dimensions and specification parameters provided by the example of the present invention, the first printed conductor 26 and the second printed conductor 27 can be better connected by using solder paste, thereby replacing the 0 ohm resistor to connect the first printed conductor 26 and the second printed conductor 27.

[0036] In an embodiment of the present application, the first pad, the second pad, and the pad spacer are connected by smooth soldering.

[0037] Specifically, in order to replace the larger 0 ohm resistor to bridge the first printed conductor 26 and the second printed conductor 27, the first solder pad, the second solder pad and the solder pad spacer in the present invention are connected by smooth soldering, so that the resistance value is smaller and it is more suitable to replace the 0 ohm resistor to connect the first printed conductor 26 and the second printed conductor 27.

[0038] The embodiment of the present invention combines the production process practice with the above-mentioned technical solution to make appropriate optimization on the basis of the above-mentioned example. Specifically, the optimization method can be exemplified as follows: the area and the outer dimensions of the first pad 21, the second pad 22 and the pad spacer 28 are proportionally enlarged, and the first pad 21, the second pad 22 and the pad spacer 28 are ensured to maintain the same appearance during the proportional enlargement process. It is worth noting that the various dimensions of the optimized first pad 21, the second pad 22 and the pad spacer 28 need to be tested through the production process practice to verify whether the optimized dimensions meet the design purpose.

[0039] Based on the above embodiments, the present invention further provides a functional circuit board, which has a printed circuit board 1 .

[0040] It should be noted that the function of the functional circuit board is to provide a circuit board for carrying various functional modules of different electronic devices. Different functional modules are respectively installed on different functional circuit boards, and each functional circuit board can be connected to the first printed conductor 26 and the second printed conductor 27 according to the technical solution used in the printed circuit board 1 to save 0 ohm resistance.

[0041] Figure 3 The structure diagram of the photoelectric conversion system provided in the embodiment of the present application is shown in FIG. Figure 3 On the basis of the above embodiments, the present invention further provides a photoelectric conversion system 100, which may include a driving module 101, a WiFi module 102, a voice module 103, a display module 104 and a control module 105, wherein the driving module 101 may be used to receive an optical signal, process the optical signal to obtain a target voice and image signal, and send the target voice and image signal to a target receiving device; the WiFi module 102 may be used to create a wireless local area network, and provide a wireless network service to the target receiving device in response to an access request of the target receiving device; the voice module 103 may provide an IP network-based voice service to the target receiving device in response to a request of the target receiving device; the display module 104 may be used to display status information; the control module 105 may be used to initialize the status of the driving module, the voice module, the WiFi module 102 and the voice module 103, and detect the status of the driving module 101, the voice module 103, the WiFi module 102 and the voice module 103 to obtain status information, and display the status information on the display module; wherein the driving module 101 and the control module 105 both have functional circuit boards.

[0042] It should be noted that the target receiving device can be a TV box, mobile phone, handheld computer, host and other devices that need to be connected to the Internet.

[0043] In an embodiment of the present application, the photoelectric conversion system 100 may further include a power module, which is used to provide power to the driving module 101 , the WiFi module 102 , the voice module 103 , the display module 104 and the control module 105 .

[0044] Based on the above embodiments, the present invention also provides an optical modem, including a photoelectric conversion system.

[0045] It should be noted that the optical modem can be a PON product or an EPON product, and the optical modem has all or part of the modules in the optoelectronic conversion system.

[0046] Figure 4 The flowchart of the method for manufacturing a printed circuit board provided in the embodiment of the present application is shown in FIG. Figure 4 Based on the above embodiment, the present invention further provides a method for manufacturing a printed circuit board. The manufacturing process of the printed circuit board 1 can be as follows: S10, obtaining a printed circuit board, and performing solder mask opening on the copper sheets at opposite ends of two printed conductors to be connected on the top surface of the printed circuit board to form a first soldering pad and a second soldering pad respectively connected to the two printed conductors; S20, covering the surface of the printed circuit board with a steel mesh, wherein the steel mesh is provided with openings, and the openings are provided corresponding to the area formed by the first pad, the second pad, and the pad spacer; S30, brushing tin on the surface of the steel mesh away from the copper sheet; Specifically, the method covers a steel mesh to the top surface of a printed circuit board 1 through surface mounting technology (SMT), the steel mesh is provided with openings, the openings are provided corresponding to the areas formed by the first pad, the second pad and the pad spacer, and solder paste is printed into the openings of the steel mesh during the steel mesh printing process.

[0047] S40, performing reflow soldering on the printed circuit board after the tinning treatment.

[0048] Specifically, the method processes the printed circuit board 1 through a reflow soldering process, obtains a solder paste liquid after the printed circuit board 1 is processed through the reflow soldering process, and automatically overlaps the first pad 21 and the second pad 22 across the pad spacing portion 28 of this example by utilizing the fluidity and surface tension of the solder paste liquid. After the solder paste liquid is cooled, the first printed conductor 26 and the second printed conductor 27 can be connected through the first pad 21 and the second pad 22, respectively, so that the 0 ohm resistor on the printed circuit board 1 can be replaced to connect the first printed conductor 26 and the second printed conductor 27.

[0049] The embodiment of the present invention uses a pad of a specific shape and size to connect two printed conductors to achieve the purpose of saving tin solder paste. Using a small amount of solder paste instead of 0 ohm resistor material to connect two printed conductors can greatly reduce material costs, warehouse management costs and production costs, and thus has good practical value.

[0050] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A printed circuit board, characterized in that: include: A pad spacer, and a first pad and a second pad disposed in mirror symmetry with respect to the pad spacer; The first pad, the second pad and the pad spacer are all covered with solder, and the solder of the pad spacer is connected to the solder of the first pad and the solder of the second pad; The first pad and the second pad each include a trapezoidal portion and a rectangular portion; Wherein, in the same pad, the lower base of the trapezoidal portion coincides with the long side of the corresponding rectangular portion, and the upper base of the trapezoidal portion is connected to the printed conductor; The trapezoidal portions of the two pads are located on a side where the rectangular portions of the two pads are away from each other.

2. The printed circuit board according to claim 1, wherein: The length ratio of the upper base to the lower base of the trapezoidal portion is 1 / 6 to 5 / 23; the length ratio of the upper base to the hypotenuse of the trapezoidal portion is 2 / 9 to 1 / 4; The length ratio of the long side to the wide side of the rectangular portion is 4-5.

3. The printed circuit board according to claim 1, wherein: The ratio of the width of the pad spacing portion to the length of the upper bottom side of the trapezoidal portion is 1-3 / 2.

4. The printed circuit board according to claim 1, wherein: The trapezoidal portion comprises: The upper bottom edge is 4 mils in length; The lower hem, length is 23 mils; The first hypotenuse has a length of 17.75 mils; The second hypotenuse has a length of 17.75 mils; The rectangular portion comprises: long side, 23 mils in length; Broadside, 5 mils in length; The pad spacing portion has a width of 5 mils.

5. A printed circuit board according to any one of claims 1 to 4, characterized in that: The first pad, the second pad, and the pad spacer are connected by smooth soldering.

6. A functional circuit board, characterized in that: A printed circuit board as claimed in any one of claims 1 to 5.

7. A photoelectric conversion system, characterized in that: include: A driving module, used for receiving the optical signal, processing the optical signal to obtain the target voice and image signal, and sending the target voice and image signal to the target receiving device; A WiFi module, used to create a wireless local area network and provide wireless network services to the target receiving device in response to an access request from the target receiving device; A voice module, providing a voice service based on an IP network to the target receiving device in response to a request of the target receiving device; A display module, used for displaying status information; A control module, used for initializing the states of the driving module, the voice module, the WiFi module and the voice module, detecting the states of the driving module, the voice module, the WiFi module and the voice module to obtain the state information, and displaying the state information on the display module; Wherein, the driving module and the control module both have the functional circuit board as claimed in claim 6.

8. The photoelectric conversion system according to claim 7, wherein: The photoelectric conversion system also includes: A power module is used to provide power to the driving module, the WiFi module, the voice module, and the control module.

9. An optical modem, characterized in that: Comprising the photoelectric conversion system as claimed in claim 7.

10. A method for manufacturing a printed circuit board, characterized in that: Applied to a printed circuit board as claimed in any one of claims 1 to 5, the method for manufacturing the printed circuit board comprises: Obtain a printed circuit board, and perform solder resist opening on the copper sheets at opposite ends of two printed conductors to be connected on the top surface of the printed circuit board to form a first soldering pad and a second soldering pad respectively connected to the two printed conductors; Covering a steel mesh to the surface of the printed circuit board, the steel mesh is provided with openings, and the openings are arranged corresponding to the area formed by the first pad, the second pad and the pad spacer; Performing tinning treatment on the surface of the steel mesh away from the copper sheet; The printed circuit board after tinning is subjected to reflow soldering.

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