Copper electroplating device for metal electrode

Abstract

The invention provides a metal electrode copper electroplating device which comprises an electroplating bath, a base material foil conveying mechanism, a plating material foil conveying mechanism, a first conductive device and a second conductive device, the base material foil conveying mechanism comprises a base material foil conveying roller, a base material foil feeding roller and a base material foil discharging roller, and a first lifting mechanism is connected to the upper portion of the base material foil conveying roller; the plating material foil conveying mechanism comprises a plating material foil conveying roller, a plating material foil feeding roller and a plating material foil discharging roller, the upper portion of the plating material foil conveying roller is connected with a second lifting mechanism, the first conductive device is suitable for being in sliding contact with the base material foil, and the second conductive device is suitable for being in sliding contact with the plating material foil. The production efficiency of manufacturing the electro-coppering electrode can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of battery production, and in particular to a copper electroplating device for metal electrodes. Background Art

[0002] Heterojunction cells are a type of solar cell that consists of p-type semiconductors and n-type semiconductors. Heterojunction cells have the characteristic of converting solar energy into electrical energy, so they are widely used in solar equipment such as solar panels, solar chargers, and solar street lights. In addition, heterojunction cells can also be used in electronic products such as wireless communications, computers, and smartphones.

[0003] The electrode material of the heterojunction battery is usually an electroplated copper electrode. When making the electroplated copper electrode, the cut single-piece electrode foil is usually immersed in an electroplating tank for copper plating, which has low production efficiency. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art to at least a certain extent. To this end, an embodiment of the present invention provides a copper electroplating device for metal electrodes, which can improve the production efficiency of manufacturing copper electroplating electrodes.

[0005] The embodiment of the present invention provides a copper electroplating device for metal electrodes, comprising: an electroplating tank, a substrate foil transmission mechanism, a plating material foil transmission mechanism, a first conductive device and a second conductive device, wherein the electroplating tank has an electroplating chamber for containing electroplating solution and a liquid inlet and a liquid outlet connected to the electroplating chamber; the substrate foil transmission mechanism comprises a substrate foil transmission roller, a substrate foil feed roller and a substrate foil discharge roller, the substrate foil transmission roller is arranged in the electroplating chamber and is located below the liquid level of the electroplating solution, the upper part of the substrate foil transmission roller is connected to a first lifting mechanism, the substrate foil feed roller is arranged on the feeding side outside the electroplating tank, the substrate foil discharge roller is arranged on the discharge side outside the electroplating tank, the substrate foil transmission roller, the substrate foil feed roller and the substrate foil discharge roller are all made of insulating material, and the first lifting mechanism is located at the electroplating solution. The coating material foil conveying mechanism comprises a coating material foil conveying roller, a coating material foil feeding roller and a coating material foil discharging roller, the coating material foil conveying roller is arranged in the electroplating chamber and is located below the liquid surface of the electroplating solution, the coating material foil conveying roller is connected to the second lifting mechanism above, the coating material foil feeding roller is arranged on the feeding side outside the electroplating tank, the coating material foil discharging roller is arranged on the discharging side outside the electroplating tank, the coating material foil conveying roller, the coating material foil feeding roller and the coating material foil discharging roller are all made of insulating material, and the second lifting mechanism is located above the liquid surface of the electroplating solution; the first conductive device is electrically connected to the first power supply, and the first conductive device is suitable for sliding contact with the substrate foil to energize the substrate foil; the second conductive device is electrically connected to the second power supply, and the second conductive device is suitable for sliding contact with the coating material foil to energize the coating material foil.

[0006] In some embodiments, the first conductive device is a substrate foil brush, and the second conductive device is a coating foil brush.

[0007] In some embodiments, the first lifting mechanism is a first hydraulic cylinder, including a first cylinder body and a first hydraulic rod, the first hydraulic rod is telescopic at the lower end of the first cylinder body, and the first hydraulic rod is connected to the substrate foil conveying roller; the second lifting mechanism is a second hydraulic cylinder, including a second cylinder body and a second hydraulic rod, the second hydraulic rod is telescopic at the lower end of the second cylinder body, and the second hydraulic rod is connected to the plated foil conveying roller.

[0008] In some embodiments, the first hydraulic rod is insulated from the substrate foil conveying roller, and the second hydraulic rod is insulated from the coating foil conveying roller.

[0009] In some embodiments, the lower end of the first hydraulic rod is connected to a first support rod, both ends of the first support rod are respectively connected to both ends of the substrate foil conveying roller, and the outer side of the first support rod is coated with insulating paint;

[0010] The lower end of the second hydraulic rod is connected to the second support rod, the two ends of the second support rod are respectively connected to the two ends of the plated foil transmission roller, and the outer side of the second support rod is coated with insulating paint.

[0011] In some embodiments, the first support rod and the second support rod are both in an n-shaped structure.

[0012] In some embodiments, the first support rod and the second support rod are both semicircular arc structures.

[0013] In some embodiments, the two ends of the first support rod are respectively fixedly connected with a first buckle, and the substrate foil transmission roller is detachably connected to the first buckle; the two ends of the second support rod are respectively fixedly connected with a second buckle, and the plated foil transmission roller is detachably connected to the second buckle, and the first buckle and the second buckle are both made of plastic.

[0014] In some embodiments, the longitudinal cross-sections of the first buckle and the second buckle are both major arc structures with downward openings.

[0015] In some embodiments, the lower end of the first hydraulic rod is fixedly connected to the first insulating sleeve, and the first support rod is inserted into the first insulating sleeve; the lower end of the second hydraulic rod is fixedly connected to the second insulating sleeve, and the second support rod is inserted into the second insulating sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings.

[0017] in:

[0018] Figure 1is a schematic structural diagram of a copper electroplating device for a metal electrode in an embodiment of the present invention;

[0019] Figure 2 for Figure 1 A left side view of the substrate foil transport mechanism in FIG.

[0020] Reference numerals:

[0021] 1. First cylinder body; 2. Second cylinder body; 3. First insulating sleeve; 4. First support rod; 5. First buckle; 6. Base foil transfer roller; 7. Plating tank; 8. Second insulating sleeve; 9. Second support rod; 10. Second buckle; 11. Plated foil transfer roller; 12. First power supply; 13. Base foil feed roller; 14. Base foil brush; 15. Base foil discharge roller. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0023] The copper electroplating apparatus for metal electrodes according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0024] like Figure 1-2 As shown, an embodiment of the present invention proposes a copper electroplating device for metal electrodes, comprising: a plating tank 7, a substrate foil transmission mechanism, a plating material foil transmission mechanism, a first conductive device and a second conductive device, the plating tank 7 has a plating chamber for containing a plating solution and a liquid inlet and a liquid outlet connected to the plating chamber; the substrate foil transmission mechanism comprises a substrate foil transmission roller 6, a substrate foil feed roller 13 and a substrate foil discharge roller 15, the substrate foil transmission roller 6 is arranged in the plating chamber and below the liquid level of the plating solution, the upper part of the substrate foil transmission roller 6 is connected to the first lifting mechanism, the substrate foil feed roller 13 is arranged on the feeding side of the outside of the plating tank 7, the substrate foil discharge roller 15 is arranged on the discharge side of the outside of the plating tank 7, the substrate foil transmission roller 6, the substrate foil feed roller 13 and the substrate foil discharge roller 15 are all made of insulating material, the first lifting mechanism Located above the liquid surface of the electroplating solution; the plating foil transmission mechanism includes a plating foil transmission roller 11, a plating foil feed roller and a plating foil discharge roller, the plating foil transmission roller 11 is arranged in the electroplating chamber and is located below the liquid surface of the electroplating solution, the top of the plating foil transmission roller 11 is connected to the second lifting mechanism, the plating foil feed roller is arranged on the feeding side outside the electroplating tank 7, the plating foil discharge roller is arranged on the discharge side outside the electroplating tank 7, the plating foil transmission roller 11, the plating foil feed roller and the plating foil discharge roller are all made of insulating material, and the second lifting mechanism is located above the liquid surface of the electroplating solution; the first conductive device is electrically connected to the first power supply 12, and the first conductive device is suitable for sliding contact with the substrate foil to energize the substrate foil; the second conductive device is electrically connected to the second power supply, and the second conductive device is suitable for sliding contact with the plating foil to energize the plating foil.

[0025] The embodiment of the present invention sets a substrate foil transmission mechanism and a plating foil transmission mechanism, so that the substrate foil and the plating foil are electroplated in a whole roll, and then cut according to actual needs, thereby improving production efficiency. By setting a lifting mechanism, on the one hand, the tension of the transmission roller can be adjusted, and on the other hand, the depth of the transmission roller below the liquid surface of the electroplating solution can be adjusted, so that the substrate foil is fully electroplated. By making the substrate foil transmission roller 6, the substrate foil feed roller 13, the substrate foil discharge roller 15, the plating foil transmission roller 11, the plating foil feed roller and the plating foil discharge roller all made of insulating materials, on the one hand, it can prevent electricity from escaping and affecting the operation of the equipment and personal safety, and on the other hand, it can make the electric energy as completely as possible for electroplating, so as to maximize the efficiency of electric energy use; thirdly, it can prevent the transmission roller from participating in electroplating, polluting the electroplating solution, and then affecting the electroplating effect of electroplated copper. By setting the lifting mechanism above the electroplating liquid surface, it is also to prevent the lifting mechanism from being immersed in the electroplating solution and participating in electroplating. By setting the first conductive device and the second conductive device, the electroplating tank 7 can be energized.

[0026] It should be noted that the equipment or components not involved in electroplating are all insulated, which will not be described in detail here. The substrate foil is the electrode material to be electroplated.

[0027] Furthermore, the substrate foil transmission mechanism and the plating foil transmission mechanism are driven and transmitted by a driving mechanism respectively. The driving mechanism can adjust the start and stop and transmission speed of the substrate foil transmission mechanism and the plating foil transmission mechanism to allow the substrate foil to be electroplated in the electroplating solution for a sufficient time.

[0028] When in use, the base foil and the plating foil are respectively wound around the lower ends of the corresponding transmission rollers, and then the respective lifting mechanisms are driven to slowly lower the base foil and the plating foil below the liquid level of the electroplating solution, and then the power is turned on for electroplating. When the electroplating of the part below the liquid level of the electroplating solution is completed, the respective driving mechanisms are driven to transfer the electroplated part above the liquid level, and immerse the unplated part below the liquid level until all the base foils are electroplated.

[0029] Furthermore, the structure of the substrate foil conveying mechanism is the same as that of the plating material foil conveying mechanism.

[0030] Furthermore, the liquid inlet is arranged at a top position of the electroplating tank 7 , and the liquid outlet is arranged at a bottom position of the electroplating tank 7 .

[0031] In some embodiments, Figure 2 As shown, the first conductive device is a base foil brush 14, and the second conductive device is a coating foil brush, so that the base foil and the coating foil can be electrically conductive while being transmitted.

[0032] In some embodiments, Figure 1As shown, the first lifting mechanism is a first hydraulic cylinder, including a first cylinder body 1 and a first hydraulic rod, the first hydraulic rod is telescopic at the lower end of the first cylinder body 1, and the first hydraulic rod is connected to the substrate foil conveying roller 6; the second lifting mechanism is a second hydraulic cylinder, including a second cylinder body 2 and a second hydraulic rod, the second hydraulic rod is telescopic at the lower end of the second cylinder body 2, and the second hydraulic rod is connected to the plated foil conveying roller 11.

[0033] In some embodiments, the first hydraulic rod is insulated from the substrate foil conveying roller 6 , and the second hydraulic rod is insulated from the coating foil conveying roller 11 .

[0034] In some embodiments, Figure 1 As shown, the lower end of the first hydraulic rod is connected to the first support rod 4, the two ends of the first support rod 4 are respectively connected to the two ends of the substrate foil conveying roller 6, and the outer side of the first support rod 4 is coated with insulating paint; the lower end of the second hydraulic rod is connected to the second support rod 9, the two ends of the second support rod 9 are respectively connected to the two ends of the plated foil conveying roller 11, and the outer side of the second support rod 9 is coated with insulating paint. The support rods can be prevented from participating in electroplating.

[0035] In some embodiments, Figure 1 As shown, the first support rod 4 and the second support rod 9 are both in an n-shaped structure.

[0036] In some alternative embodiments, the first support rod 4 and the second support rod 9 may also both be semicircular arc structures.

[0037] In some embodiments, Figure 1 , 2 As shown, the first support rod 4 is fixedly connected with a first buckle 5 at both ends, and the substrate foil transmission roller 6 is detachably connected to the first buckle 5; the second support rod 9 is fixedly connected with a second buckle 10 at both ends, and the plated foil transmission roller 11 is detachably connected to the second buckle 10, and the first buckle 5 and the second buckle 10 are both made of plastic. The plastic material is ductile, which makes it easy for the transmission roller to be clipped into the buckle.

[0038] In some embodiments, Figure 2 As shown, the longitudinal sections of the first buckle 5 and the second buckle 10 are both downwardly open superior arc structures, which facilitates the disassembly and assembly between the transmission roller and the buckle.

[0039] In some embodiments, Figure 1 , 2 As shown, the lower end of the first hydraulic rod is fixedly connected to the first insulating sleeve 3, and the first support rod 4 is inserted in the first insulating sleeve 3; the lower end of the second hydraulic rod is fixedly connected to the second insulating sleeve 8, and the second support rod 9 is inserted in the second insulating sleeve 8. This can further prevent the lifting mechanism from conducting electricity, thereby causing damage to the equipment and endangering personal safety.

[0040] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0045] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A copper electroplating device for a metal electrode, characterized in that: include: An electroplating tank, wherein the electroplating tank has an electroplating cavity for containing electroplating solution and a liquid inlet and a liquid outlet connected to the electroplating cavity; A substrate foil transmission mechanism, the substrate foil transmission mechanism comprises a substrate foil transmission roller, a substrate foil feed roller and a substrate foil discharge roller, the substrate foil transmission roller is arranged in the electroplating chamber and is located below the liquid level of the electroplating solution, the upper part of the substrate foil transmission roller is connected to a first lifting mechanism, the substrate foil feed roller is arranged on the feeding side outside the electroplating tank, the substrate foil discharge roller is arranged on the discharge side outside the electroplating tank, the substrate foil transmission roller, the substrate foil feed roller and the substrate foil discharge roller are all made of insulating material, and the first lifting mechanism is located above the liquid level of the electroplating solution; A coating foil transmission mechanism, the coating foil transmission mechanism comprises a coating foil transmission roller, a coating foil feed roller and a coating foil discharge roller, the coating foil transmission roller is arranged in the electroplating chamber and is located below the liquid level of the electroplating solution, the coating foil transmission roller is connected to a second lifting mechanism above, the coating foil feed roller is arranged on the feeding side outside the electroplating tank, the coating foil discharge roller is arranged on the discharge side outside the electroplating tank, the coating foil transmission roller, the coating foil feed roller and the coating foil discharge roller are all made of insulating material, and the second lifting mechanism is located above the liquid level of the electroplating solution; a first conductive device, the first conductive device being electrically connected to a first power source, the first conductive device being adapted to be in sliding contact with the substrate foil to energize the substrate foil; The second conductive device is electrically connected to a second power source and is suitable for sliding contact with the plating material foil to energize the plating material foil.

2. The copper electroplating device for metal electrodes according to claim 1, characterized in that: The first conductive device is a base foil brush, and the second conductive device is a plating foil brush.

3. The copper electroplating device for metal electrodes according to claim 1, characterized in that: The first lifting mechanism is a first hydraulic cylinder, comprising a first cylinder body and a first hydraulic rod, the first hydraulic rod is retracted at the lower end of the first cylinder body, and the first hydraulic rod is connected to the substrate foil transport roller; The second lifting mechanism is a second hydraulic cylinder, which includes a second cylinder body and a second hydraulic rod. The second hydraulic rod is retracted at the lower end of the second cylinder body, and the second hydraulic rod is connected to the plated foil conveying roller.

4. The copper electroplating device for metal electrodes according to claim 3, characterized in that: The first hydraulic rod is insulated from the base foil conveying roller, and the second hydraulic rod is insulated from the plating foil conveying roller.

5. The copper electroplating device for metal electrodes according to claim 4, characterized in that: The lower end of the first hydraulic rod is connected to a first support rod, both ends of the first support rod are respectively connected to both ends of the substrate foil conveying roller, and the outer side of the first support rod is coated with insulating paint; The lower end of the second hydraulic rod is connected to the second support rod, the two ends of the second support rod are respectively connected to the two ends of the plated foil transmission roller, and the outer side of the second support rod is coated with insulating paint.

6. The copper electroplating device for metal electrodes according to claim 5, characterized in that: The first support rod and the second support rod are both in an n-shaped structure.

7. The copper electroplating device for metal electrodes according to claim 5, characterized in that: The first support rod and the second support rod are both semicircular arc structures.

8. The copper electroplating device for metal electrodes according to claim 5, characterized in that: The two ends of the first support rod are respectively fixedly connected with a first buckle, and the substrate foil transmission roller is detachably connected to the first buckle; the two ends of the second support rod are respectively fixedly connected with a second buckle, and the plated foil transmission roller is detachably connected to the second buckle, and the first buckle and the second buckle are both made of plastic.

9. The copper electroplating device for metal electrodes according to claim 8, characterized in that: The longitudinal sections of the first buckle and the second buckle are both major arc structures with downward openings.

10. The copper electroplating device for metal electrodes according to claim 5, characterized in that: The lower end of the first hydraulic rod is fixedly connected to the first insulating sleeve, and the first support rod is inserted into the first insulating sleeve; the lower end of the second hydraulic rod is fixedly connected to the second insulating sleeve, and the second support rod is inserted into the second insulating sleeve.

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