Preparation method of conductive film
By covering the coating and conductive layer on the substrate and cleaning with a dissolving agent, the problem of high production costs of existing conductive films is solved, and the effect of simplifying the preparation process and reducing costs is achieved.
Patent Information
- Application Number
- CN202311122151.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-31
- Publication Date
- 2025-02-28
AI Technical Summary
The production cost of existing conductive films is high, mainly due to the high cost of laser station equipment, large area, and the complex laser or yellow light etching process, which leads to a long time.
The preparation of the conductive film is achieved by covering the first coating and the first conductive layer on the first surface of the substrate and cleaning with a dissolving agent capable of dissolving the first coating. This method does not require a laser station or expensive imprint mold, simplifying the preparation process.
It effectively reduces the production cost of conductive films, simplifies the preparation process, reduces the complexity of equipment and processes, and improves production efficiency.
Smart Images
Figure CN119541946A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of conductive films, and in particular to a method for preparing a conductive film. Background Art
[0002] Transparent conductive film is an important component of touch screen. Existing transparent conductive films mainly include indium tin oxide film (Indium-Tin-Oxide, referred to as ITO), metal mesh film (Metal Mesh, referred to as MM) and silver nanowire film (Silver Nanowire, referred to as SNW). However, these three conductive films are basically first coated or sputtered on the substrate during preparation, and then taken to the laser station for laser or yellow light etching, and finally a conductive film with a preset conductive pattern is obtained.
[0003] However, the laser station not only has high equipment costs, but also occupies a large area. In addition, the laser or yellow light etching process is complicated, which leads to a long time to prepare the conductive film, and thus leads to high production costs of the conductive film and touch screen. Among them, although some metal mesh films can directly obtain the preset conductive pattern by mold embossing, and thus do not need to go through the laser station, the mold used for embossing has high precision requirements and mold demolding costs, which also leads to high production costs of the conductive film and touch screen. Summary of the invention
[0004] The embodiment of the present application provides a method for preparing a conductive film to solve the technical problem of high production cost of existing conductive films.
[0005] To achieve the above-mentioned purpose, the method for preparing the conductive film proposed in the present application comprises:
[0006] providing a substrate having a first surface;
[0007] Covering a first coating layer on a partial area of the first surface, wherein an area on the first surface not covered by the first coating layer at least partially constitutes a first conductive pattern area;
[0008] At least the first conductive pattern area covers the first conductive layer; and,
[0009] A dissolving agent is provided, and the substrate covered with the first coating layer and the first conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the first coating layer.
[0010] Optionally, in one embodiment, the first coating is a water-soluble coating, and the dissolving agent is water.
[0011] Optionally, in one embodiment, the first coating is any one of amino acid resin, acrylic resin, polyurethane resin, water-based epoxy resin, and water-based alkyd resin.
[0012] Optionally, in one embodiment, the first coating is printed on the substrate by a gravure printing tool.
[0013] Optionally, in one embodiment, the precision of the gravure printing tool is not less than 5 nanometers and not more than 200 nanometers.
[0014] Optionally, in one embodiment, the coating thickness of the first coating on the substrate is not less than 20 microns and not more than 200 microns.
[0015] Optionally, in one embodiment, the step of covering the first conductive layer at least in the first conductive pattern area includes:
[0016] The first conductive layer covers both the first conductive pattern area and the first coating layer, and a coating thickness of the first conductive layer in the first conductive pattern area is smaller than a coating thickness of the first coating layer on the first surface.
[0017] Optionally, in one embodiment, the first conductive layer includes a metal layer and a first insulating layer covering the metal layer, and after the step of cleaning the substrate covered with the first coating layer and the first conductive layer by the solvent, the method further includes:
[0018] The area on the first surface not covered by the first conductive layer is covered with a second coating, and the coating height of the second coating on the first surface is not lower than the coating height of the first conductive layer on the first surface;
[0019] Covering a second conductive layer at least on the first insulating layer of the first conductive layer;
[0020] The substrate covered with the first conductive layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.
[0021] Optionally, in one embodiment, the first conductive layer includes a metal layer, and after the step of cleaning the substrate covered with the first coating layer and the first conductive layer by the solvent, the method further includes:
[0022] A second insulating layer is covered on the area on the first surface not covered by the first conductive layer and on the metal layer of the first conductive layer;
[0023] A partial area on the second insulating layer is covered with a second coating layer, and an area on the second insulating layer not covered by the second coating layer at least partially constitutes a second conductive pattern area;
[0024] At least the second conductive pattern area covers the second conductive layer;
[0025] The substrate covered with the first conductive layer, the second insulating layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.
[0026] Optionally, in one embodiment, the substrate further has a second surface opposite to the first surface, and after the step of cleaning the substrate covered with the first coating layer and the first conductive layer by the solvent, the method further includes:
[0027] Covering the first conductive layer with a protective film layer;
[0028] Covering a partial area of the second surface with a second coating, wherein an area on the second surface not covered by the second coating at least partially constitutes a second conductive pattern area;
[0029] At least the second conductive pattern area covers the second conductive layer; and,
[0030] The substrate covered with the first conductive layer, the protective film layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.
[0031] The preparation method of the conductive film provided by the present application first covers the first surface of the substrate with a first coating, and the first coating covers a part of the first surface, so that the area on the first surface not covered by the first coating at least partially constitutes a first conductive pattern area, and then covers the first conductive layer at least in the first conductive pattern area, and finally uses a solvent to clean the substrate covered with the first coating and the first conductive layer, wherein the solvent can dissolve the first coating, and then in the cleaning process, the first coating will be dissolved by the solvent, and only the first conductive layer will be left on the first surface of the substrate. It can be understood that because the first conductive layer is covered in the first conductive pattern area, after the substrate is cleaned by the solvent, a conductive film with a preset conductive pattern can be obtained.
[0032] That is, the preparation method of the conductive film provided in the present application does not require a laser station or a costly imprinting mold. The entire preparation process only requires sequential coating of the first coating layer and the first conductive layer, and finally cleaning with a solvent that can dissolve the first coating layer. This is very simple and convenient, and effectively reduces the production cost of the conductive film. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0034] Figure 1 This is a schematic diagram of a process of an embodiment of a method for preparing a conductive film of the present application;
[0035] Figure 2 for Figure 1 Product variation diagram corresponding to the preparation method of the conductive film;
[0036] Figure 3 This is a structural schematic diagram of another embodiment of the method for preparing a conductive film of the present application;
[0037] Figure 4 for Figure 3 Product variation diagram corresponding to the preparation method of the conductive film;
[0038] Figure 5 This is a structural schematic diagram of another embodiment of the method for preparing the conductive film of the present application;
[0039] Figure 6 for Figure 5 Product variation diagram corresponding to the preparation method of the conductive film;
[0040] Figure 7 This is a structural schematic diagram of another embodiment of the method for preparing the conductive film of the present application;
[0041] Figure 8 for Figure 7 Product variation diagram corresponding to the preparation method of the conductive film.
[0042] Explanation of the accompanying drawings: 100, conductive film; 10, substrate; 11, first surface; 12, second surface; 20, first coating layer; 30, first conductive pattern area; 40, first conductive layer; 41, metal layer; 42, first insulating layer; 50, second coating layer; 60, second conductive layer; 70, second insulating layer; 80, second conductive pattern area; 90, protective film layer.
[0043] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0044] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.
[0045] The embodiment of the present application provides a method for preparing a conductive film to solve the problem of high production cost of existing conductive films, which will be described below with reference to the accompanying drawings.
[0046] In the embodiments of the present application, Figure 1 and Figure 2 As shown, the method for preparing the conductive film includes:
[0047] Step S1: Figure 1 As shown, a substrate 10 is provided, wherein the substrate 10 has a first surface 11 .
[0048] Among them, for the conductive film, the substrate 10 is mainly used to provide a preparation basis for the metal conductive layer and other functional coatings. The size, thickness, material, etc. of the substrate 10 can be flexibly selected according to needs. For example, the material of the substrate 10 can be PET, PC, PMMA, glass, etc. In addition, Figure 1 As shown, the substrate 10 is in a plate or sheet shape and has a first surface 11 and a second surface 12 opposite to each other along its thickness direction. The first surface 11 and the second surface 12 can both be used as processing surfaces for coating metal conductive layers and other functional coatings. This embodiment is described by taking the first surface 11 as an example of the processing surface.
[0049] Step S2: Figure 2 As shown, a partial area of the first surface 11 is covered with the first coating 20 , and an area of the first surface 11 not covered by the first coating 20 at least partially constitutes a first conductive pattern area 30 .
[0050] Specifically, in this embodiment, the first coating 20 is a material layer that can be dissolved by a corresponding solvent, for example, the first coating 20 can be a water-soluble coating that can be dissolved in water; or, the first coating 20 can be a fat-soluble coating that can be dissolved in a non-polar solvent (such as benzene, ether, carbon tetrachloride, petroleum ether, etc.). In specific implementation, the material of the first coating 20 can be selected according to actual conditions. For example, the cleaning of the conductive film is usually carried out using anhydrous alcohol, deionized water, acetone, etc. At this time, a material that can be dissolved in anhydrous alcohol, deionized water or acetone can be selected as the first coating 20, and then the conductive film can be cleaned when the first coating 20 is dissolved.
[0051] For example, in this embodiment, the first coating 20 is a water-soluble coating, which can be any one of amino acid resin, acrylic resin, polyurethane resin, water-based epoxy resin, and water-based alkyd resin. At this time, the solvent is water. It can be understood that when the solvent is water, the production cost is lower, especially when the area of the conductive film is large and more solvent is required for cleaning, the production cost can be further reduced, and when the solvent is water, there will be no chemical reaction between the solvent and the substrate 10 or the metal conductive layer.
[0052] The reason why the present application requires that the first coating 20 can be dissolved by the corresponding dissolving agent is that the first coating 20 is mainly used to assist the metal conductive layer to form a preset conductive pattern, and after assisting the metal conductive layer to form the preset conductive pattern, the first coating 20 needs to be able to be easily removed from the substrate 10.
[0053] Therefore, when the first coating 20 is applied to the first surface 11, it is necessary to determine the coverage area of the first coating 20 on the first surface 11 according to the preset conductive pattern. For example, when the preset conductive pattern is in a grid shape, the first coating 20 may include a plurality of coating blocks, and the plurality of coating blocks are spaced apart from each other on the first surface 11 and arranged in a matrix of multiple rows and columns. At this time, the area on the first surface 11 not covered by the first coating 20 includes the grid-shaped first conductive pattern area 30.
[0054] That is to say, when the first coating 20 is applied to the first surface 11 of the substrate 10, the first coating 20 needs to enclose a preset conductive pattern, that is, the first coating 20 needs to cover a specific area on the first surface 11. In this embodiment, in order to more conveniently cover the first coating 20 in a specific area on the first surface 11, the first coating 20 is printed on the substrate 10 by a gravure printing tool. It can be understood that the gravure printing process is simple and convenient, with low cost, and the first coating 20 is an auxiliary coating that needs to be removed later, and its printing accuracy is much lower than that of "directly printing a metal grid through a mold", which can greatly reduce the production cost of the conductive film.
[0055] Of course, because the first coating 20 is used as a boundary to define the preset conductive pattern, in order to ensure the molding quality of the conductive pattern (such as ensuring that the conductive pattern has uniform width and good straightness, etc.), when selecting a gravure printing tool, the accuracy of the gravure printing tool is not less than 5 nanometers and not more than 200 nanometers, such as the accuracy of the gravure printing tool can be 5 nanometers, 10 nanometers, 50 nanometers, 100 nanometers, 150 nanometers, 200 nanometers, etc. And when printing, the coating thickness of the first coating 20 on the substrate 10 is not less than 20 microns and not more than 200 microns, specifically 20 microns, 50 microns, 80 microns, 100 microns, 120 microns, 150 microns, 180 microns, 200 microns, etc. It can be understood that please refer to Figure 2 If the coating thickness of the first coating layer 20 is less than 20 microns, the separation of the first conductive pattern area 30 by the first coating layer 40 may not be obvious enough, and the metal materials in the two first conductive pattern areas 30 are easy to adhere; and if the thickness of the first coating layer 20 is greater than 200 microns, it will cause material waste of the first coating layer 20, which is not conducive to reducing production costs. Therefore, when the coating thickness of the first coating layer 20 on the substrate 10 is not less than 20 microns and not more than 200 microns, the first conductive pattern area 30 can be well separated without causing material waste.
[0056] Step S3: Figure 2 As shown, at least the first conductive pattern area 30 covers the first conductive layer 40 .
[0057] Specifically, the material of the first conductive layer 40 can be indium tin oxide (ITO), nano silver wire (SNW), copper wire, aluminum wire and other conductive metals, and the process method of the first conductive layer 40 covering the first conductive pattern area 30 is not limited, and can be magnetron sputtering, chemical vapor deposition, vacuum vaporization, conductive solution coating, etc. It should be noted that when the conductive solution is directly coated, the conductive solution does not need to contain a solvent that can dissolve the first coating 20. For example, when the first coating 20 is a water-soluble coating, the conductive solution can use a non-polar solvent that cannot dissolve water-soluble materials (such as benzene, ether, carbon tetrachloride, petroleum ether, etc.) as a solvent.
[0058] It should also be noted that, if the coating technology is feasible, the first conductive layer 40 may only cover the first conductive pattern area 30, or may cover the entire first surface 11 of the substrate 10 (including the top surface of the first coating 20). For example, in one embodiment, Figure 2As shown, this step S3 includes: covering the first conductive layer 40 on both the first conductive pattern area 30 and the first coating 20, and the coating thickness of the first conductive layer 40 in the first conductive pattern area 30 is less than the coating thickness of the first coating 20 on the first surface 11. That is, when the first conductive layer 40 is sputtered or coated, the first conductive layer 40 can cover the entire first surface 11, that is, the first conductive layer 40 is covered in the first conductive pattern area 30, and the top surface of the first coating 20 facing away from the first surface 11 is also covered with the first conductive layer 40, and at the same time, it is ensured that the coating thickness of the first conductive layer 40 in the first conductive pattern area 30 is not greater than the coating thickness of the first coating 20 on the substrate 10. In this way, it can be ensured that the first conductive layer 40 in the first conductive pattern area 30 will not adhere to the first conductive layer 40 on the first coating 20, and the first conductive layer 40 on the first coating 20 will flow away with the cleaning solution (i.e., the dissolving agent) after the first coating 20 is dissolved, so that only the first conductive layer 40 in the first conductive pattern area 30 is left on the substrate 10.
[0059] It can be understood that compared to the solution of only coating the first conductive layer 40 in the first conductive pattern area 30, the present solution coats the first conductive layer 40 on both the first conductive pattern area 30 and the first coating 20, so that there is no need to spray or sputter "select areas" but rather spray or sputter directly on the entire first surface 11, thereby improving production efficiency and reducing production costs.
[0060] Step S4: Figure 2 As shown, a dissolving agent is provided, and the substrate 10 covered with the first coating layer 20 and the first conductive layer 40 is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the first coating layer 20 .
[0061] Specifically, in this step, the substrate 10 can be cleaned by using an existing conductive film cleaning device, and the cleaning liquid used in the conductive film cleaning device is a solvent in this application that can dissolve the first coating layer 20. It can be understood that during the cleaning process, the first coating layer 20 will be dissolved by the solvent, and only the first conductive layer 40 will be left on the first surface 11 of the substrate 10. Because the first conductive layer 40 is covered in the first conductive pattern area 30, after the substrate 10 is cleaned by the solvent, a conductive film with a preset conductive pattern can be obtained.
[0062] That is, the preparation method of the conductive film provided in the present application does not require a laser station or a costly imprinting mold. The entire preparation process only requires sequential coating of the first coating layer 20 and the first conductive layer 40, and finally cleaning with a solvent that can dissolve the first coating layer 20. This is very simple and convenient, and effectively reduces the production cost of the conductive film.
[0063] It should be noted here that the preparation method of the conductive film of the present application can be used to prepare a single conductive film, in which case the substrate 10 is a part of the independent conductive film; it can also be used to prepare a conductive film layer attached to other components. For example, when conductive glass is prepared by the preparation method of the conductive film of the present application, the glass substrate is the substrate 10 in the present application, and the conductive film is a conductive film layer on one side that does not contain the glass and is attached to the glass.
[0064] In addition, in addition to the above steps S1 to S4, the preparation method of the conductive film of the present application may also include other process steps, such as before step S2, a shadow elimination film layer may be coated on the first surface 11 of the substrate 10 to reduce the moiré effect; or a transmittance enhancement layer may be coated on the first surface 11 of the substrate 10 to increase the transmittance; or a silicon primer layer may be coated on the first surface 11 of the substrate 10 to improve the bonding strength of the first conductive layer 40. For another example, after step S4, the substrate 10 may be dried, static electricity eliminated, etc., and further, a conductive film cleaning device with drying and static electricity elimination functions may be used to clean the substrate 10, so that cleaning, drying, and static electricity elimination can be completed in the same work station, thereby improving production efficiency and reducing production costs.
[0065] The above introduces a method for preparing a conductive layer (i.e., the first conductive layer 40) on the substrate 10. In many existing conductive films, two or even more metal conductive layers are provided on the substrate 10. The following will introduce a method for applying the technical concept of the present application to prepare multiple metal conductive layers on the substrate 10.
[0066] First, the method for forming the first conductive layer 40 on the substrate 10 is the same as the above steps S1 to S4, and will not be repeated here. When forming the second conductive layer 60, there are two cases according to the location of the second conductive layer 60. One is that the second conductive layer 60 is also arranged on the first surface 11 of the substrate 10, and the other is that the second conductive layer 60 is arranged on the second surface 12 of the substrate 10. Among them, when the second conductive layer 60 is also arranged on the first surface 11 of the substrate 10, different treatments are also required depending on whether the first conductive layer 40 has its own insulating layer. Therefore, when forming the second conductive layer 60, it can be roughly divided into three cases, as shown in the following embodiments 1 to 3.
[0067] It should be noted here that, as to whether the first conductive layer 40 has its own insulating layer, the first conductive layer 40 is usually made entirely of metallic conductive material and does not include an insulating layer. However, in some existing technologies, when covering a layer of metal material, an insulating layer is also covered on the metal material layer. Thus, the first conductive layer 40 includes a metal layer and an insulating layer.
[0068] Embodiment 1:
[0069] like Figure 3 and Figure 4 As shown, the second conductive layer 60 is also disposed on the first surface 11 of the substrate 10, and the first conductive layer 40 has its own insulating layer, that is, the first conductive layer 40 includes a metal layer 41 and a first insulating layer 42 covering the metal layer 41. In this regard, after the above step S4, it also includes:
[0070] Step S5A: Figure 4 As shown, the area on the first surface 11 not covered by the first conductive layer 40 is covered with the second coating 50, and the coating height of the second coating 50 on the first surface 11 is not lower than the coating height of the first conductive layer 40 on the first surface 11. In other words, the second coating 50 covers the area covered by the first coating 20 before it is dissolved, and the coating height of the second coating 50 is not lower than the coating height of the first conductive layer 40, so as to enclose the first conductive pattern area 30 above the first conductive layer 40.
[0071] Step S6A: Figure 4 As shown, at least the second conductive layer 60 is covered on the first insulating layer 42 of the first conductive layer 40. It can be understood that, because the first conductive layer 40 has its own first insulating layer 42, the second conductive layer 60 can be directly coated on the first conductive layer 40. At this time, the second conductive layer 60 and the first conductive layer 40 are insulated from each other by the first insulating layer 42 to avoid mutual interference between the signals of the second conductive layer 60 and the first conductive layer 40. In addition, the sputtering or coating process of the second conductive layer 60 can refer to step S3, which will not be described in detail here.
[0072] Step S7A: Figure 4 As shown, the substrate 10 covered with the first conductive layer 40, the second coating layer 50 and the second conductive layer 60 is cleaned by the solvent, wherein the solvent can dissolve the second coating layer 50. That is, the second coating layer 50 and the first coating layer 20 are made of the same material, and can be dissolved by the same solvent, and after the second coating layer 50 is dissolved, a conductive film covered with the first conductive layer 40 (including the metal layer 41 and the first insulating layer 42) and the second conductive layer 60 on the first surface 11 of the substrate 10 can be obtained.
[0073] Of course, if it is necessary to further arrange a third conductive layer or more conductive layers on the second conductive layer 60 , the arrangement can be continued according to the above steps S5A to S7A.
[0074] Embodiment 2:
[0075] like Figure 5 and Figure 6 As shown, the second conductive layer 60 is also disposed on the first surface 11 of the substrate 10, and the first conductive layer 40 includes a metal layer and does not include an insulating layer. To this end, after the above step S4, the following is further included:
[0076] Step S5B: Figure 6 As shown, the area on the first surface 11 not covered by the first conductive layer 40 and the metal layer 41 of the first conductive layer 40 are covered with the second insulating layer 70, that is, the second insulating layer 70 covers both the first conductive layer 40 and the area covered by the first coating 20 before dissolution, and the material of the second insulating layer 70 is not limited, and can be any one of PP, PV, and PET.
[0077] Step S6B: Figure 6 As shown, a part of the area on the second insulating layer 70 is covered with the second coating 50, and the area on the second insulating layer 70 not covered by the second coating 50 at least partially constitutes the second conductive pattern area 80. Specifically, the material of the second coating 50 is the same as that of the first coating 20, and can be dissolved by the same solvent; the specific coating position of the second coating 50 needs to be determined by the preset conductive pattern corresponding to the second conductive layer 60. When the preset conductive pattern of the second conductive layer 60 is the same as the preset conductive pattern of the first conductive layer 40, the second coating 50 can be set corresponding to the area covered before the first coating 20 is dissolved, and the same gravure printing tool can be used to print the second coating 50, so that multiple sets of gravure printing tools can be avoided and the production cost can be reduced. If the preset conductive pattern of the second conductive layer 60 is different from the preset conductive pattern of the first conductive layer 40, the second coating 50 can be printed specifically according to the preset conductive pattern of the second conductive layer 60. However, regardless of the coverage area of the second coating 50, the area on the second insulating layer 70 not covered by the second coating 50 constitutes the second conductive pattern area 80.
[0078] Step S7B: Figure 6 As shown, at least the second conductive pattern area 80 covers the second conductive layer 60 . The sputtering or coating process of the second conductive layer 60 can refer to step S3 , which will not be described in detail here.
[0079] Step S8B: Figure 6As shown, the substrate 10 covered with the first conductive layer 40, the second insulating layer 70, the second coating layer 50 and the second conductive layer 60 is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer 50. That is, after the second coating layer 50 is dissolved, a conductive film covered with the first conductive layer 40, the second insulating layer 70 and the second conductive layer 60 on the substrate 10 can be obtained. If it is necessary to continue to set a third conductive layer or more conductive layers on the second conductive layer 60, the setting can be continued according to steps S5B to S8B.
[0080] Embodiment three:
[0081] like Figure 7 and Figure 8 As shown, the second conductive layer 60 is disposed on the second surface 12 opposite to the first surface 11. To this end, after the above step S4, the method further includes:
[0082] Step S5C: Figure 8 As shown, a protective film layer 90 is covered on the first conductive layer 40. The material of the protective film layer 90 can be any one of PP, PV, and PET. The reason for setting the protective film layer 90 on the first conductive layer 40 is that when the second conductive layer 60 is set on the second surface 12, the substrate 10 needs to be turned over and placed on the workbench. During the turning process or when placed on the workbench, the first conductive layer 40 may be scratched or damaged by collision. Therefore, by setting the protective film layer 90, the first conductive layer 40 that has been manufactured can be protected during the process of turning over and manufacturing the second conductive layer 60.
[0083] Step S6C: covering a portion of the second surface 12 with the second coating 50 , wherein the region of the second surface 12 not covered by the second coating 50 at least partially constitutes a second conductive pattern region 80 .
[0084] Step S7C: covering the second conductive layer 60 at least in the second conductive pattern area 80 .
[0085] Step S8C: cleaning the substrate 10 covered with the first conductive layer 40 , the protective film layer 90 , the second coating layer 50 and the second conductive layer 60 by using the dissolving agent, wherein the dissolving agent can dissolve the second coating layer 50 .
[0086] The above steps S6C to S8C can refer to steps S2 to S4, and will not be described in detail here. Through the above steps S6C to S8C, a conductive film having the first conductive layer 40 and the second conductive layer 60 respectively disposed on the first surface 11 and the second surface 12 of the substrate 10 can be obtained.
[0087] In the above embodiments, the description of each embodiment has its own emphasis. For parts not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. In the description of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.
[0088] The above is a detailed introduction to the preparation method of the conductive film provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A method for preparing a conductive film, characterized in that: include: providing a substrate having a first surface; Covering a first coating layer on a partial area of the first surface, wherein an area on the first surface not covered by the first coating layer at least partially constitutes a first conductive pattern area; At least the first conductive pattern area covers the first conductive layer; as well as, A dissolving agent is provided, and the substrate covered with the first coating layer and the first conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the first coating layer.
2. The method for preparing a conductive film according to claim 1, wherein: The first coating is a water-soluble coating, and the dissolving agent is water.
3. The method for preparing a conductive film according to claim 2, wherein: The first coating is any one of amino acid resin, acrylic resin, polyurethane resin, water-based epoxy resin, and water-based alkyd resin.
4. The method for preparing a conductive film according to claim 1, wherein: The first coating layer is printed on the substrate by a gravure printing tool.
5. The method for preparing a conductive film according to claim 4, wherein: The precision of the gravure printing tool is not less than 5 nanometers and not more than 200 nanometers.
6. The method for preparing a conductive film according to claim 1, wherein: The coating thickness of the first coating on the substrate is not less than 20 micrometers and not more than 200 micrometers.
7. The method for preparing a conductive film according to claim 1, wherein: The step of covering the first conductive layer at least in the first conductive pattern area comprises: The first conductive layer covers both the first conductive pattern area and the first coating layer, and a coating thickness of the first conductive layer in the first conductive pattern area is smaller than a coating thickness of the first coating layer on the first surface.
8. The method for preparing a conductive film according to any one of claims 1 to 7, characterized in that: The first conductive layer includes a metal layer and a first insulating layer covering the metal layer. After the step of cleaning the substrate covered with the first coating layer and the first conductive layer by the solvent, the method further includes: The area on the first surface not covered by the first conductive layer is covered with a second coating, and the coating height of the second coating on the first surface is not lower than the coating height of the first conductive layer on the first surface; Covering a second conductive layer at least on the first insulating layer of the first conductive layer; The substrate covered with the first conductive layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.
9. The method for preparing a conductive film according to any one of claims 1 to 7, characterized in that: The first conductive layer includes a metal layer, and after the step of cleaning the substrate covered with the first coating and the first conductive layer by the dissolving agent, the method further includes: A second insulating layer is covered on the area on the first surface not covered by the first conductive layer and on the metal layer of the first conductive layer; A partial area on the second insulating layer is covered with a second coating layer, and an area on the second insulating layer not covered by the second coating layer at least partially constitutes a second conductive pattern area; At least the second conductive pattern area covers the second conductive layer; The substrate covered with the first conductive layer, the second insulating layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.
10. The method for preparing a conductive film according to any one of claims 1 to 7, characterized in that: The substrate further has a second surface opposite to the first surface, and after the step of cleaning the substrate covered with the first coating and the first conductive layer by the dissolving agent, the method further comprises: Covering the first conductive layer with a protective film layer; Covering a partial area of the second surface with a second coating, wherein an area on the second surface not covered by the second coating at least partially constitutes a second conductive pattern area; At least the second conductive pattern area covers the second conductive layer; and, The substrate covered with the first conductive layer, the protective film layer, the second coating layer and the second conductive layer is cleaned by the dissolving agent, wherein the dissolving agent can dissolve the second coating layer.