High-efficiency heat dissipation structure of semiconductor laser

Abstract

The efficient heat dissipation structure of the semiconductor laser comprises a heat dissipation device body, and a cooling liquid inlet and a cooling liquid outlet are formed in one side of the heat dissipation device body; a heat dissipation cavity is formed between the cooling liquid inlet and the cooling liquid outlet; the heat dissipation cavity is formed by sequentially communicating a first heat dissipation cavity, a turbulence buffer cavity and a second heat dissipation cavity; a first laser mounting platform group is arranged above the first heat dissipation cavity; a second laser mounting platform group is arranged above the second heat dissipation cavity; the first laser installation platform set and the second laser installation platform set are each provided with a plurality of laser installation platforms which are arranged in a stepped mode. A height difference exists between the adjacent laser mounting platforms on the first laser mounting platform group and the second laser mounting platform group; and an exhaust hole of the heat dissipation cavity is formed in the cooling liquid inlet. According to the high-efficiency heat dissipation structure of the semiconductor laser, the impact force of the cooling liquid on the water cooling plate is reduced, and the deformation of the water cooling plate is small; bubbles are reduced and can be automatically discharged; the heat dissipation is uniform, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor lasers, and in particular relates to a high-efficiency heat dissipation structure of a semiconductor laser. Background Art

[0002] The working substance of semiconductor laser is semiconductor material, and the working principle is to convert electrical energy into light energy. Semiconductor laser is one of the most commonly used optoelectronic devices. With the continuous development of technology and the improvement of the mass production level of devices, it can now be applied to more fields. Semiconductor laser is a laser that mainly uses semiconductor material as a working substance. Because of the different material structures, the laser produced will also be different. The characteristics of semiconductor laser are small size and long life. In addition to the communication field, it can now also be used in radar, sound measurement, and medical treatment.

[0003] For high-power semiconductor laser devices, the electro-optical conversion efficiency is generally between 50% and 60%. The remaining electrical energy will generate heat, causing the temperature of the semiconductor chip to rise rapidly. Because a single chip of a high-power laser has a large light output power and generates a lot of heat per unit area, if the heat dissipation technology is not properly used, it is easy to cause the chip to die and the characteristics to deteriorate rapidly.

[0004] Therefore, for high-power semiconductor lasers, corresponding heat dissipation devices need to be configured to dissipate heat. Currently, there are three most commonly used heat sinks: circulating water cooling, air cooling and semiconductor refrigerator cooling. For high-power semiconductor lasers, the best heat dissipation method is to use circulating water cooling.

[0005] Circulating water cooling mainly uses water cooling plates to dissipate heat for semiconductor lasers, but in actual use, there are often some problems that affect the stability of the system when the water cooling plate dissipates heat. First of all, the most common problem is uneven heat dissipation. If the semiconductor laser dissipates heat unevenly, it will cause thermal stress in the active area of ​​the chip, affecting the quality of the laser output beam, thereby affecting the use effect, especially in many occasions where the stability and reliability of the laser are required to be high. Secondly, when the coolant flows in the flow channel, it will have an impact force on the water cooling plate, causing a certain amount of deformation of the water cooling plate, affecting the working performance of the laser, and increasing the difficulty of laser beam coupling, shaping and other technologies. Finally, when the coolant flows in a complex flow channel, the pressure it is subjected to in various places is uneven, which will cause turbulent cavitation in the coolant. In addition, it is impossible to completely exhaust the air in the cooling system, and it is impossible for the entire system to be completely sealed without leakage, so a large number of bubbles will be generated; the bubbles in the flow channel will not only reduce the heat conduction efficiency of the cooling medium and the water cooling plate, but also cause cavitation, damage the inner wall of the flow channel of the water cooling plate, and reduce the service life of the water cooling plate. Summary of the invention

[0006] Purpose of the invention: In order to overcome the above shortcomings, the purpose of the present invention is to provide an efficient heat dissipation structure for a semiconductor laser, which reduces the impact force of the coolant on the water-cooling plate, reduces the deformation of the water-cooling plate, reduces the number of bubbles and can be automatically discharged, and improves the heat dissipation efficiency while dissipating the heat evenly.

[0007] Technical solution: In order to achieve the above-mentioned purpose, the present invention provides an efficient heat dissipation structure of a semiconductor laser, including a heat dissipation device body, a coolant inlet and a coolant outlet are provided on one side of the heat dissipation device body; a heat dissipation cavity is provided between the coolant inlet and the coolant outlet; the heat dissipation cavity is composed of a first heat dissipation cavity, a turbulent buffer cavity and a second heat dissipation cavity connected in sequence; a first laser mounting platform group is provided above the first heat dissipation cavity; a second laser mounting platform group is provided above the second heat dissipation cavity; a plurality of laser mounting platforms are provided on the first laser mounting platform group and the second laser mounting platform group, and are all arranged in a stepped manner; there is a height difference between adjacent laser mounting platforms on the first laser mounting platform group and the second laser mounting platform group; an exhaust hole of the heat dissipation cavity is provided at the coolant inlet.

[0008] Furthermore, each laser mounting platform of the first laser mounting platform group and the second laser mounting platform group is arranged in a stepped manner, and there is also a height difference between adjacent laser mounting platforms of the first laser mounting platform group and the second laser mounting platform group, which is beneficial to the heat dissipation of each laser and reduces the thermal impact between them.

[0009] Furthermore, the surface of the first heat dissipation cavity near the first laser mounting platform group is the first heat dissipation slope; the first heat dissipation slope is at the same average distance from each laser mounting platform on the first laser mounting platform group, and this distance is called the first distance; the surface of the second heat dissipation cavity near the second laser mounting platform group is the second heat dissipation slope; the second heat dissipation slope is at the same average distance from each laser mounting platform on the second laser mounting platform group, and this distance is called the second distance; the first distance is greater than the second distance. The average distance between the heat dissipation slope and the laser mounting platform is equal, which ensures that the temperature of all lasers is uniform; at the same time, since the temperature of the coolant will rise to a certain extent after passing through the first laser mounting platform group and the flow rate will be slightly reduced due to the influence of flow resistance, the second distance is less than the first distance to reduce the heat transfer wall thickness, further ensuring that the temperature of all lasers is uniform.

[0010] Furthermore, the cross-sections of the first heat dissipation cavity and the second heat dissipation cavity are arch-shaped, and a plurality of elliptical spoiler fins are arranged inside to enhance the heat exchange effect.

[0011] Furthermore, a gas-liquid separation baffle is provided at the coolant inlet; the gas-liquid separation baffle is a curved plate; the gas-liquid separation baffle is provided with a plurality of small holes perpendicular to the baffle curved surface to ensure that the bubbles are discharged smoothly to the exhaust hole.

[0012] Furthermore, the exhaust hole is spiral-shaped, which is conducive to separating bubbles for exhaust.

[0013] Furthermore, an automatic exhaust valve is provided near the coolant inlet of the heat dissipation device body; the automatic exhaust valve cooperates with the exhaust hole to exhaust air. The automatic exhaust valve is provided near the coolant inlet to ensure that bubbles do not affect the heat dissipation process.

[0014] Furthermore, the laser installation platform is provided with a plurality of laser installation holes for installing the laser.

[0015] Furthermore, a plurality of heat sink mounting holes are provided on the periphery of the heat sink body, so as to be mounted on the semiconductor manufacturing equipment in cooperation with the heat sink body.

[0016] It can be seen from the above technical solution that the present invention has the following beneficial effects: 1. The present invention provides an efficient heat dissipation structure for a semiconductor laser. Each laser mounting platform of the first laser mounting platform group and the second laser mounting platform group is arranged in a stepped manner, and there is also a height difference between adjacent laser mounting platforms of the first laser mounting platform group and the second laser mounting platform group, which is beneficial to the heat dissipation of each laser and reduces the thermal influence between them; at the same time, the cross-sections of the first heat dissipation cavity and the second heat dissipation cavity are arch-shaped, and a plurality of elliptical spoiler fins are arranged inside, which enhances the heat exchange effect and improves the heat dissipation efficiency; 2. The present invention provides a high-efficiency heat dissipation structure for semiconductor lasers, wherein the average distance between the heat dissipation slope and the laser mounting platform is equal, thereby ensuring uniform temperature of all lasers; at the same time, since the temperature of the coolant will rise to a certain extent after passing through the first laser mounting platform group and the flow rate will be slightly reduced due to the influence of flow resistance, the second distance is smaller than the first distance, thereby reducing the heat transfer wall thickness, thereby further ensuring uniform heat dissipation of all lasers; 3. The invention provides a high-efficiency heat dissipation structure for a semiconductor laser. The cooling liquid inlet of the heat dissipation device is provided with a gas-liquid separation baffle, which can alleviate the impact force of the cooling liquid in the initial state, and a turbulent buffer zone is provided in the flow channel, so that the water flow pressure at each point in the flow channel is uniform and stable, ensuring that the impact force on the water cooling plate is small and the deformation of the water cooling plate is small; 4. The present invention provides an efficient heat dissipation structure for a semiconductor laser. The coolant inlet of the heat dissipation device is provided with a gas-liquid separation baffle. After the coolant and the bubbles contact the gas-liquid separation baffle together, the coolant above the baffle will flow into the flow channel through the small holes on the baffle, while the bubbles will run upward and be separated through the spiral exhaust holes and finally discharged through the automatic exhaust valve, thereby ensuring the reduction of bubbles and automatic discharge. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a general schematic diagram of a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; Figure 2 It is an oblique view of a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; Figure 3 A cross-sectional view of a heat dissipation cavity in a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; Figure 4 It is a partial enlarged view of the automatic exhaust valve and the exhaust hole cooperating to exhaust in the high-efficiency heat dissipation structure of a semiconductor laser described in the present invention; Figure 5 It is a cross-sectional view of a first heat dissipation cavity in a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; Figure 6 A cross-sectional view of a second heat dissipation cavity in a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; Figure 7 It is a cross-sectional view of a first heat dissipation cavity and a second heat dissipation cavity in a high-efficiency heat dissipation structure of a semiconductor laser according to the present invention; In the figure: 1-heat sink body; 12-coolant outlet; 13-heat sink cavity; 14-first laser mounting platform group; 15-second laser mounting platform group; 16-exhaust hole; 17-spoiler fin; 18-automatic exhaust valve; 19-heat sink mounting hole; 111-gas-liquid separation baffle; 131-first heat dissipation chamber; 132-turbulence buffer chamber; 133-second heat dissipation chamber; 141-laser installation platform; 1311 - first heat dissipation slope; 1331 - second heat dissipation slope; 1411 - laser mounting hole. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] Example 1 In this embodiment, Figures 1 to 4 The present invention discloses an efficient heat dissipation structure of a semiconductor laser, comprising a heat dissipation device body 1, wherein a cooling liquid inlet 11 and a cooling liquid outlet 12 are provided on one side of the heat dissipation device body 1; a heat dissipation cavity 13 is provided between the cooling liquid inlet 11 and the cooling liquid outlet 12; the heat dissipation cavity 13 is composed of a first heat dissipation cavity 131, a turbulent buffer cavity 132 and a second heat dissipation cavity 133 connected in sequence; Specifically, the turbulent flow buffer chamber 132 is equivalent to a liquid storage buffer tank in a hydraulic system, which makes the water flow pressure at each point in the flow channel uniform and stable; A first laser installation platform group 14 is provided above the first heat dissipation cavity 131; a second laser installation platform group 15 is provided above the second heat dissipation cavity 133; a plurality of laser installation platforms 141 are provided on both the first laser installation platform group 14 and the second laser installation platform group 15, and are all arranged in a stepped manner; Specifically, the first laser installation platform group 14 is distributed along the coolant inlet 11, and the second laser installation platform group 15 is distributed along the coolant outlet 12, which facilitates the installation of the laser and effective heat dissipation; Specifically, the laser is installed at the center of the laser installation platform 141 of the heat dissipation device, and the flow channel heat dissipation surfaces of the first heat dissipation cavity 131 and the second heat dissipation cavity 133 also pass through the center of the laser installation platform 141; There is a height difference between the adjacent laser mounting platforms 141 on the first laser mounting platform group 14 and the second laser mounting platform group 15 ; and an exhaust hole 16 of the heat dissipation cavity 13 is provided at the coolant inlet 11 .

[0020] Example 2 On the basis of Example 1, in this example, Figure 1 , Figure 2 , Figure 5 and Figure 6 The present invention discloses an efficient heat dissipation structure of a semiconductor laser, wherein the surface of the first heat dissipation cavity 131 near the first laser mounting platform group 14 is a first heat dissipation slope 1311; the first heat dissipation slope 1311 is at the same average distance from each laser mounting platform 141 on the first laser mounting platform group 14, and the distance is called the first distance; the surface of the second heat dissipation cavity 133 near the second laser mounting platform group 15 is a second heat dissipation slope 1331; the second heat dissipation slope 1331 is at the same average distance from each laser mounting platform 141 on the second laser mounting platform group 15, and the distance is called the second distance; the first distance is greater than the second distance.

[0021] Specifically, the temperature of the coolant will rise to a certain extent after passing through the first laser mounting platform group 14, and the flow rate will be slightly reduced due to the influence of flow resistance, resulting in poor heat dissipation effect of the second laser mounting platform group 15. The second distance is smaller than the first distance, which reduces the heat transfer wall thickness and further ensures that the temperature of all lasers is uniform.

[0022] In this embodiment, if Figure 3 and Figure 7 The cross-sections of the first heat dissipation cavity 131 and the second heat dissipation cavity 133 are arch-shaped, and a plurality of elliptical spoiler fins 17 are provided inside.

[0023] Specifically, the heat dissipation surfaces of the first heat dissipation cavity 131 and the second heat dissipation cavity 133 are planes, and the rest are arc surfaces.

[0024] Specifically, the spoiler fins 17 adjacent to each other in the coolant flow direction are staggered, so that the heat exchange efficiency is greatly improved without high flow resistance.

[0025] In particular, the cross section of the spoiler fin 17 may be in the shape of a water drop, with a small end of the water drop close to the coolant inlet 11 and a large end close to the coolant outlet 12 .

[0026] In this embodiment, if Figure 2 and Figure 4 A gas-liquid separation baffle 111 is provided at the coolant inlet 11; the gas-liquid separation baffle 111 is a curved plate; the gas-liquid separation baffle 111 is provided with a plurality of small holes perpendicular to the curved surface of the baffle.

[0027] In this embodiment, if Figure 4 , the exhaust hole 16 is spiral.

[0028] In this embodiment, if Figure 4 An automatic exhaust valve 18 is provided near the coolant inlet 11 of the heat dissipation device body 1; the automatic exhaust valve 18 cooperates with the exhaust hole 16 for exhaust.

[0029] Specifically, the automatic exhaust valve 18 is threadedly mounted on the heat dissipation device body 1 and is sealed by a sealing ring.

[0030] In particular, the mounting hole of the automatic exhaust valve is a threaded hole, and a light hole smaller than the threaded bottom hole is formed by additive manufacturing and then tapped by machining.

[0031] In this embodiment, if Figure 1 The laser installation platform 141 is provided with a plurality of laser installation holes 1411 .

[0032] Specifically, the laser mounting hole 1411 is a threaded hole, and a light hole smaller than the threaded bottom hole is formed by additive manufacturing and then threaded by machining.

[0033] In this embodiment, if Figure 1 A plurality of heat sink mounting holes 19 are provided on the periphery of the heat sink body 1 .

[0034] Specifically, the heat sink mounting hole 19 is a threaded through hole, which is directly formed by additive manufacturing.

[0035] The working principle of the above embodiment is: The present invention discloses an efficient heat dissipation structure for a semiconductor laser. When a coolant inlet 11 flows in, when bubbles are contained in the coolant, the bubbles float up. After the coolant and the bubbles contact a gas-liquid separation baffle 111 together, the coolant above the gas-liquid separation baffle 111 flows into a heat dissipation cavity 13 through small holes on the gas-liquid separation baffle 111, and the bubbles run upward and are separated through a spiral exhaust hole 16 and discharged through an automatic exhaust valve 18. The coolant flows through the first heat dissipation cavity 131 , the turbulent buffer cavity 132 and the second heat dissipation cavity 133 in sequence, and dissipates heat in cooperation with the spoiler fins 17 , and finally flows out from the coolant outlet 12 .

[0036] The above description is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements without departing from the principle of the present invention, and these improvements should also be regarded as within the protection scope of the present invention.

Claims

1. An efficient heat dissipation structure for a semiconductor laser, characterized in that: The heat dissipation device comprises a heat dissipation device body (1), wherein a cooling liquid inlet (11) and a cooling liquid outlet (12) are provided on one side of the heat dissipation device body (1); a heat dissipation cavity (13) is provided between the cooling liquid inlet (11) and the cooling liquid outlet (12); the heat dissipation cavity (13) is composed of a first heat dissipation cavity (131), a turbulent flow buffer cavity (132), and a second heat dissipation cavity (133) which are connected in sequence; A first laser installation platform group (14) is provided above the first heat dissipation cavity (131); and a second laser installation platform group (15) is provided above the second heat dissipation cavity (133); A plurality of laser mounting platforms (141) are provided on each of the first laser mounting platform group (14) and the second laser mounting platform group (15), and are all arranged in a stepped manner; there is a height difference between adjacent laser mounting platforms (141) on the first laser mounting platform group (14) and the second laser mounting platform group (15); An exhaust hole (16) of the heat dissipation cavity (13) is provided at the cooling liquid inlet (11).

2. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: The surface of the first heat dissipation cavity (131) close to the first laser mounting platform group (14) is a first heat dissipation inclined surface (1311); the average distance between the first heat dissipation inclined surface (1311) and each laser mounting platform (141) on the first laser mounting platform group (14) is the same, and this distance is referred to as a first distance; The surface of the second heat dissipation cavity (133) close to the second laser mounting platform group (15) is a second heat dissipation inclined surface (1331); the average distance between the second heat dissipation inclined surface (1331) and each laser mounting platform (141) on the second laser mounting platform group (15) is the same, and this distance is referred to as a second distance; The first distance is greater than the second distance.

3. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: The cross-sections of the first heat dissipation cavity (131) and the second heat dissipation cavity (133) are arch-shaped, and a plurality of elliptical spoiler fins (17) are provided inside.

4. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: A gas-liquid separation baffle (111) is provided at the coolant inlet (11); the gas-liquid separation baffle (111) is a curved plate; and the gas-liquid separation baffle (111) is provided with a plurality of small holes perpendicular to the baffle curved surface.

5. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: The exhaust hole (16) is spiral-shaped.

6. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: An automatic exhaust valve (18) is provided near the coolant inlet (11) of the heat dissipation device body (1); the automatic exhaust valve (18) cooperates with the exhaust hole (16) to exhaust air.

7. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: The laser installation platform (141) is provided with a plurality of laser installation holes (1411).

8. The high-efficiency heat dissipation structure of a semiconductor laser according to claim 1, characterized in that: A plurality of heat dissipation device mounting holes (19) are provided on the periphery of the heat dissipation device body (1).

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