Inductor preparation method, inductor and electronic device

Abstract

The invention is applicable to the technical field of inductors, and provides a preparation method of an inductor, the inductor and an electronic device.The preparation method comprises the steps that a metal substrate is provided; the metal substrate is patterned and penetrates through the metal substrate to form an inductance coil circuit, the inductance coil circuit at least comprises a first coil and a second coil which are adjacent, a hollow area is formed between the first coil and the second coil, and the inductance coil circuit comprises a first electrode port and a second electrode port which are located at the two ends of the inductance coil circuit; and manufacturing an insulating layer on the metal substrate to fill the hollow area and coat the inductance coil circuit, wherein the insulating layer is provided with a window for exposing the first electrode port and the second electrode port. The metal substrate penetrates to prepare the inductance coil circuit, the inductance coil circuit is coated with the insulating layer, the insulating layer is provided with the window to expose the first electrode port and the second electrode port, winding is not needed, the device size is reduced, the process is simpler, unnecessary support is reduced, and the production cost is reduced accordingly.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic components, and in particular relates to a method for preparing an inductor, an inductor and an electronic device. Background Art

[0002] Inductor, also known as choke, reactor, dynamic reactor, is a component that works on the principle of electromagnetic induction. If there is no current flowing through the inductor, it will try to prevent the current from flowing through it when the circuit is connected; if there is current flowing through the inductor, it will try to maintain the current when the circuit is disconnected. When current flows through the wire of the inductor, a certain electromagnetic field will be generated around the wire, and the wire of this electromagnetic field itself will induce the wire within the range of this electromagnetic field. The effect on the wire that generates the electromagnetic field is called "self-inductance", that is, the changing current generated by the wire itself generates a changing magnetic field, and this magnetic field further affects the current in the wire; the effect on other wires within the range of this electromagnetic field is called "mutual inductance".

[0003] Currently, the inductors on the market are mainly of the winding type, including a magnetic core, a coil wound on the magnetic core, and a casing. They are large in size, complex in process, and high in cost. Summary of the invention

[0004] The embodiment of the present application provides a method for preparing an inductor, aiming to solve the problems of large size, complex process and high cost of existing inductors.

[0005] The embodiment of the present application is implemented by providing a method for preparing an inductor, comprising:

[0006] Providing a metal substrate;

[0007] Patterning and penetrating the metal substrate to form an inductor coil circuit, the inductor coil circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and the inductor coil circuit includes a first electrode port and a second electrode port located at two ends of the inductor coil circuit;

[0008] An insulating layer is formed on the metal substrate to fill the hollow area and cover the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port.

[0009] Furthermore, the metal substrate includes a first surface and a second surface opposite to each other, and the steps of patterning and penetrating the metal substrate to form an inductor coil circuit include:

[0010] forming a first pattern on the first surface, wherein the first pattern is recessed in the first surface;

[0011] forming a second figure on the second surface, the second figure being recessed in the second surface, and a projection of the second figure on the first surface being coincident with the first figure;

[0012] The depth of the depressions of the first and second figures allows the metal substrate to penetrate and form a hollow area, and the inductor coil circuit surrounds the hollow area.

[0013] Furthermore, after the step of patterning and penetrating the metal substrate to form an inductor coil circuit, the preparation method further includes:

[0014] The inductor coil circuit is electroplated to prepare a plated layer, and the plated layer covers the inductor coil circuit.

[0015] Furthermore, the thickness of the plated layer is less than half of the distance between adjacent first coils and second coils.

[0016] Furthermore, the material of the plated layer is the same as that of the metal substrate.

[0017] Furthermore, after the step of forming an insulating layer on the metal substrate to fill the hollow area and cover the inductor coil circuit, the preparation method further includes:

[0018] A conductive terminal is prepared at the window opening, one end of the conductive terminal is electrically connected to the corresponding electrode port, and the other end of the conductive terminal is used to be electrically connected to an external circuit.

[0019] Furthermore, a nickel-gold plating layer is provided on the conductive terminal.

[0020] Furthermore, the thickness of the metal substrate is 10um to 500um.

[0021] Furthermore, a seed layer is provided on the insulating layer, and the seed layer is used to prepare the functional circuit.

[0022] Furthermore, there are multiple inductor coil circuits, and the multiple inductor coil circuits are arranged at intervals;

[0023] The metal substrate is penetrated and cut according to the inductor coil circuit to form a plurality of inductor coil circuits.

[0024] In a second aspect, the present application further provides an inductor, which is manufactured by adopting the above-mentioned manufacturing method.

[0025] In a third aspect, the present application also provides an inductor, comprising an inductor coil circuit and an insulating layer;

[0026] The inductor coil circuit is made of a penetrating metal substrate, the inductor coil circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and two ends of the inductor coil circuit are respectively a first electrode port and a second electrode port;

[0027] The insulating layer fills the hollow area and covers the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port.

[0028] In a fourth aspect, the present application further provides an electronic device, comprising the inductor as described above.

[0029] Beneficial effects of the present application: The preparation method of the inductor provided in the present application includes providing a metal substrate; patterning and penetrating the metal substrate to form an inductor coil circuit, the inductor coil circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and the inductor coil circuit includes a first electrode port and a second electrode port located at both ends of the inductor coil circuit; an insulating layer is made on the metal substrate to fill the hollow area and cover the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port. By penetrating the metal substrate, the penetrated part is the hollow area, and the remaining part is the inductor coil circuit, the inductor coil circuit is coated with an insulating layer, and the insulating layer is provided with a window to expose the first electrode port and the second electrode port of the inductor coil circuit. The inductor coil circuit in the present application does not need to be wound, and does not require other substrates, which reduces the size of the device, makes the process more streamlined, reduces unnecessary support, and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a flow chart of an embodiment of a method for preparing an inductor provided in the present application;

[0031] Figure 2 It is a schematic diagram of the process of etching a metal substrate in one embodiment of the method for preparing an inductor provided by the present application;

[0032] Figure 3 It is a schematic diagram of a process for preparing a conductive terminal according to an embodiment of a method for preparing an inductor provided in the present application;

[0033] Figure 4 This is a schematic diagram of the structure of an inductor coil circuit of an embodiment of the inductor provided in this application.

[0034] Figure 5 It is a structural schematic diagram of an embodiment of an inductor provided by the present application, in which a portion of the insulating layer exposes the inductor coil circuit;

[0035] Figure 6 It is a schematic structural diagram of a plurality of inductor coil circuits arranged on a metal substrate in one embodiment of an inductor provided by the present application;

[0036] Figure 7 It is a structural schematic diagram of an inductor preparation process of an embodiment of the inductor provided in the present application;

[0037] Figure 8is a structural schematic diagram of an inductor preparation process of another embodiment of the inductor provided by the present application;

[0038] Fig. 9 It is a schematic structural diagram of two inductor coils connected in series in one embodiment of the inductor provided by the present application.

[0039] Explanation of the reference numerals: 110 - metal substrate, 111 - photoresist, 112 - hollow area, 113 - first graphic, 114 - second graphic, 120 - inductor coil circuit, 121 - first electrode port, 122 - second electrode port, 130 - insulating layer, 131 - window, 140 - plating layer, 150 - conductive terminal, 160 - seed layer. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0041] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference values ​​and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0046] The preparation method of the inductor provided in the present application includes providing a metal substrate; patterning and penetrating the metal substrate to form an inductor coil circuit, the inductor coil circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and the inductor coil circuit includes a first electrode port and a second electrode port located at both ends of the inductor coil circuit; an insulating layer is made on the metal substrate to fill the hollow area and cover the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port. By penetrating the metal substrate, the penetrated part is the hollow area, and the remaining part is the inductor coil circuit, the inductor coil circuit is coated with an insulating layer, and the insulating layer is provided with a window to expose the first electrode port and the second electrode port of the inductor coil circuit, the inductor coil circuit does not need to be wound, and no other substrate is required, which reduces the size of the device, makes the process more streamlined, reduces unnecessary support, and reduces production costs accordingly.

[0047] like Figures 1 to 9 As shown, an embodiment of the present application provides a method for preparing an inductor, comprising:

[0048] S1100, providing a metal substrate 110;

[0049] Optionally, the metal substrate 110 includes at least one of copper, aluminum, lead, silver and tin, and preferably a copper substrate with good electrical conductivity is used.

[0050] S1200, patterning and penetrating the metal substrate 110 to form an inductor coil circuit 120, wherein the inductor coil circuit 120 at least includes a first coil and a second coil adjacent to each other, a hollow area 112 is formed between the first coil and the second coil, and the inductor coil circuit 120 includes a first electrode port 121 and a second electrode port 122 located at two ends of the inductor coil circuit 120;

[0051] S1300 , manufacturing an insulating layer 130 on the metal substrate 110 to fill the hollow area 112 and cover the inductor coil circuit 120 , wherein the insulating layer 130 has an opening 131 exposing the first electrode port 121 and the second electrode port 122 .

[0052] An inductor is a component that can convert electrical energy into magnetic energy and store it. An inductor has a winding. If there is no current flowing through the inductor, it will try to prevent current from flowing through it when the circuit is connected; if there is current flowing through the inductor, it will try to maintain the current unchanged when the circuit is disconnected.

[0053] By penetrating the metal substrate 110, the penetrated portion is a hollow area 112, and the remaining portion forms an inductor coil circuit 120, such as Figure 7 The inductor circuit 120 includes at least a first coil and a second coil, and the first coil and the second coil are arranged in an inner and outer ring, so that the inductor circuit 120 is a winding with at least two turns, that is, the projection of the inductor circuit 120 on the plane where the metal substrate 110 is located is in the shape of a mosquito coil or substantially in the shape of a mosquito coil, as shown in FIG. Figure 4 shown.

[0054] In some possible embodiments, the inductor circuit 120 has at least two coil groups, each coil group includes at least the first coil and the second coil. Fig. 9 As shown. The first coil is wound from inside to outside along a first direction, and the second coil is wound from outside to inside along a second direction, and the second direction is opposite to the first direction. In other embodiments, the first coil and the second coil can also be wound along the same direction.

[0055] The two ends of the inductor coil circuit 120 are respectively a first electrode port 121 and a second electrode port 122. During implementation, the first electrode port 121 and the second electrode port 122 are used to connect to terminals of other components or other circuit structures. At least two inductor coil circuits 120 can also be connected in series and parallel through the first electrode port 121 and the second electrode port 122.

[0056] The inductor coil circuit 120 is coated with an insulating layer 130, such as Figure 5 and Figure 7 As shown in (e) in FIG. 1 , the insulating layer 130 includes, but is not limited to, epoxy, PI (Polyimide Film), epoxy+ceramic powder, etc.

[0057] The insulating layer 130 is used to wrap and isolate the inductor coil circuit 120 to provide insulation, waterproofing, anti-oxidation, and anti-corrosion protection. On the one hand, it prevents the inductor coil circuit from being oxidized, and on the other hand, it prevents leakage or short circuit of the inductor coil circuit 120 .

[0058] The insulating layer 130 is provided with a window 131, such as Figure 7 As shown in (f) in the figure, the opening 131 is opposite to the first electrode port 121 and the second electrode port 122 of the inductor circuit 120 to expose the first electrode port 121 and the second electrode port 122 so that the first electrode port 121 and the second electrode port 122 can be connected to an external circuit through the opening 131.

[0059] Since the inductor coil circuit 120 is spread out in a plane as a whole, winding is not required, which reduces the size of the inductor device, makes the process more streamlined, reduces unnecessary supports, and reduces production costs.

[0060] Optionally, the thickness of the metal substrate 110 is 10um to 500um. For example, the thickness of the metal substrate 110 can be 10um, 20um, 50um, 110um, 120um, 125um, 130um, 140um, 150um, 200um, 300um, 400um or any value between 10um and 500um, without limitation.

[0061] Optionally, the middle of the coil is filled with a magnetic core material, that is, a magnetic core material is arranged in at least part of the hollow area. The magnetic core material refers to a sintered magnetic metal oxide composed of a mixture of various iron oxides, such as manganese-zinc ferrite and nickel-zinc ferrite, etc., to increase inductance and reduce energy loss.

[0062] Optionally, the metal substrate 110 is in a plate shape, including a first surface and a second surface opposite to each other, and the steps of patterning and penetrating the metal substrate 110 to form the inductor coil circuit 120 include:

[0063] S1210, forming a first pattern 113 on the first surface, wherein the first pattern 113 is recessed in the first surface;

[0064] S1220, forming a second graphic 114 on the second surface, wherein the second graphic 114 is recessed in the second surface, and a projection of the second graphic 114 on the first surface coincides with the first graphic 113;

[0065] S1230 , the first pattern 113 and the second pattern 114 are recessed to such a depth that the metal substrate 110 penetrates and forms a hollow area 112 , and the inductor coil circuit 120 surrounds the hollow area 112 .

[0066] The first graphic 113 and the second graphic 114 correspond to the hollow area 112, and the first graphic 113 and the second graphic 114 are identical and correspond in position, so that the projection of the second graphic 114 on the first surface coincides with the first graphic 113. Exemplarily, during implementation, a photoresist 111 is coated on the first surface and the second surface of the metal substrate 110, and the shape of the photoresist 111 corresponds to the inductor coil circuit 120. The two side surfaces of the metal substrate 110 are etched, that is, the portion other than the photoresist 111 is etched away to form a concave first graphic 113 and a second graphic 114. The depth of the concave first graphic 113 and the second graphic 114 is sufficient to penetrate the metal substrate 110 to form the hollow area 112, that is, only the portion coated with the photoresist 111 is retained to form the inductor coil circuit 120, such as Figure 7 As shown in (a), (b1) and (b2) in FIG. , the double-sided etching process makes the etching more transparent and the process is simple.

[0067] In some embodiments, after the inductor coil circuit 120 is formed, the photoresist may be removed. Figure 7 As shown in (c) in .

[0068] In some embodiments, after the inductor coil circuit 120 is manufactured, the inductor coil circuit 120 may be smoothed and burred-free, for example, by grinding the surface of the inductor coil circuit 120 to avoid leakage or even short circuit caused by burrs protruding from the insulating layer 130.

[0069] Optionally, after the step of patterning and penetrating the metal substrate 110 to form the inductor coil circuit 120, the preparation method provided by the present application further includes:

[0070] The inductor coil circuit 120 is electroplated to prepare a plated layer 140, and the plated layer 140 covers the inductor coil circuit 120. Figure 7 As shown in (d) in .

[0071] The plated layer 140 is prepared by electroplating metal, and the plated layer 140 covers and wraps the inductor coil circuit 120. In other words, the inductor coil circuit 120 is a metal strip with at least two spiral turns, and the plated layer 140 is a tube that wraps the inductor coil circuit 120. The longitudinal cross-sectional view of the inductor coil circuit 120 and the plated layer 140 is as shown in FIG. Figure 7 As shown in (d) in FIG. 1 , the plating layer 140 can be provided to increase the cross-sectional area of ​​the inductor line, reduce resistance, reduce electrical loss, and thus improve the transmission efficiency of the inductor.

[0072] Optionally, the thickness of the plated layer 140 is less than half of the spacing between adjacent first coils and second coils, thereby reducing the spacing between adjacent coils and avoiding the situation where adjacent coils contact and short circuit.

[0073] Optionally, the material of the plated layer 140 is the same as that of the metal substrate 110 , which will not be described in detail.

[0074] In another embodiment, the plating layer may only cover the first surface where the inductor coil circuit is located, but not fill in the space between two adjacent coil circuits. This method reduces the resistance of the inductor coil and makes it less likely for short circuits to occur between two adjacent coils.

[0075] Optionally, after the step of forming an insulating layer 130 on the metal substrate 110 to fill the hollow area 112 and cover the inductor coil circuit 120, the preparation method provided by the present application further includes:

[0076] S1400, preparing a conductive terminal 150 at the opening 131, one end of the conductive terminal 150 is electrically connected to the corresponding electrode port, and the other end of the conductive terminal 150 is used to be electrically connected to an external circuit.

[0077] The conductive terminal 150 is a pad prepared by electroplating at the window 131, which facilitates the electrical connection between the inductor and an external circuit or other device, such as Figure 7 As shown in (g) in .

[0078] As a possible implementation, the conductive terminal 150 is a copper column, one end of which is electrically connected to the corresponding electrode port, and the other end of which is provided with solder such as tin paste for electrically connecting to an external circuit.

[0079] Optionally, a nickel-gold plating layer is provided on the conductive terminal 150. The nickel-gold plating layer can effectively prevent the solder joint from being oxidized, and improve the stability and life of the solder joint. In addition, the nickel-gold plating layer also has good welding performance, can adapt to various welding processes, and ensure a good connection between the electronic component and the circuit board.

[0080] Optionally, a plurality of windows are provided on the insulating layer 130, and the windows are distributed along the routing of the inductor coil circuit 120, and corresponding conductive terminals 150 are provided at the windows. In other words, the lengths of the inductor coil circuit 120 between two window combinations are different, and the corresponding inductance values ​​are also different, and the corresponding conductive terminal 150 can be selected for connection according to the required inductance value.

[0081] Optionally, a seed layer 160 is disposed on the insulating layer 130, and the seed layer 160 is used to prepare a functional circuit, such as Figure 8 As shown in (h) in FIG. 1 , the seed layer 160 is a metal film layer disposed on the insulating layer 130. For example, the seed layer 160 is generated on the insulating layer 130 by electroplating, sputtering, etc. The seed layer 160 can be etched to form a functional circuit, and other functions can be expanded, such as signal amplification, conversion function, etc., without specific limitation.

[0082] Optionally, there are multiple inductor coil circuits 120, and the multiple inductor coil circuits 120 are arranged at intervals;

[0083] The metal substrate 110 is cut according to the inductor circuits 120 to form a plurality of inductor circuits 120 .

[0084] A large metal substrate 110 is provided, and then a plurality of patterns are arranged in an array on the large metal substrate 110. These patterns are arranged at intervals and correspond to the inductor coil circuits 120, that is, these patterns are the first pattern 113 and the second pattern 114 mentioned above. Then, the metal substrate 110 is penetrated according to these patterns to form an integrated body of a plurality of inductor coil circuits 120, and then the metal substrate 110 is cut according to the position of each inductor coil circuit 120 to be divided into a plurality of inductor coil circuits 120, and the inductor coil circuits 120 are mass-produced to improve production efficiency.

[0085] In one embodiment, an inductor is further provided. The inductor is manufactured by adopting the above-mentioned manufacturing method.

[0086] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the inductor described above can refer to the corresponding structure and implementation principle in the aforementioned embodiment, and will not be repeated here.

[0087] The inductor provided in the present application is formed by patterning the provided metal substrate 110 and penetrating the metal substrate 110 to form an inductor coil circuit 120, wherein the inductor coil circuit 120 includes at least a first coil and a second coil adjacent to each other, and a hollow area 112 is formed between the first coil and the second coil. The inductor coil circuit 120 includes a first electrode port 121 and a second electrode port 122 located at both ends of the inductor coil circuit 120; an insulating layer 130 is formed on the metal substrate 110 to fill the hollow area 112 and cover the inductor coil circuit 120, and the insulating layer 130 has a window 131 exposing the first electrode port 121 and the second electrode port 122. By penetrating the metal substrate 110, the penetrated part is the hollow area 112, and the remaining part is the inductor coil circuit 120. The inductor coil circuit 120 is covered with an insulating layer 130. The insulating layer 130 is provided with a window 131 to expose the first electrode port 121 and the second electrode port 122 of the inductor coil circuit 120. The inductor coil circuit 120 does not need to be wound and does not require other substrates, thereby reducing the size of the device, streamlining the process, reducing unnecessary supports, and reducing production costs.

[0088] In one embodiment, an inductor is also provided, comprising an inductor coil circuit 120 and an insulating layer 130;

[0089] The inductor coil circuit 120 is made by penetrating the metal substrate 110. The inductor coil circuit 120 at least includes a first coil and a second coil adjacent to each other. A hollow area 112 is formed between the first coil and the second coil. Two ends of the inductor coil circuit 120 are respectively a first electrode port 121 and a second electrode port 122.

[0090] The insulating layer 130 fills the hollow area 112 and covers the inductor coil circuit 120 . The insulating layer 130 has an opening 131 exposing the first electrode port 121 and the second electrode port 122 .

[0091] In one embodiment, an electronic device is also provided, and the electronic device includes the inductor as described above. The electronic device provided in the present application includes the inductor as described above, and the inductor includes an inductor coil circuit 120 formed by patterning a metal substrate 110 and penetrating the metal substrate 110, the inductor coil circuit 120 includes at least a first coil and a second coil adjacent to each other, a hollow area 112 is formed between the first coil and the second coil, and the inductor coil circuit 120 includes a first electrode port 121 and a second electrode port 122 located at both ends of the inductor coil circuit 120; an insulating layer 130 is made on the metal substrate 110 to fill the hollow area 112 and cover the inductor coil circuit 120, and the insulating layer 130 has a window 131 exposing the first electrode port 121 and the second electrode port 122. By penetrating the metal substrate 110, the penetrated part is the hollow area 112, and the remaining part is the inductor coil circuit 120. The inductor coil circuit 120 is covered with an insulating layer 130. The insulating layer 130 is provided with a window 131 to expose the first electrode port 121 and the second electrode port 122 of the inductor coil circuit 120. The inductor coil circuit 120 does not need to be wound and does not require other substrates, thereby reducing the size of the device, streamlining the process, reducing unnecessary supports, and reducing production costs.

[0092] It should be noted that, in one embodiment, the inductor coil circuit can be used as a power inductor, and can also be other types such as a radio frequency inductor, a filter inductor, a chip inductor, etc.

[0093] This embodiment also provides an electronic device, which can be, for example, some semi-finished devices such as power supply devices, radio frequency devices, filter devices, etc., and can also be a terminal device such as consumer electronic products, communication electronic products, medical equipment, automotive electronics, etc. The electronic device includes the inductor mentioned in the above embodiment.

[0094] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for preparing an inductor, characterized in that: include: Providing a metal substrate; Patterning and penetrating the metal substrate to form an inductor coil circuit, wherein the inductor coil circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and the inductor coil circuit includes a first electrode port and a second electrode port located at two ends of the inductor coil circuit; An insulating layer is formed on the metal substrate to fill the hollow area and cover the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port.

2. The preparation method according to claim 1, characterized in that The metal substrate comprises a first surface and a second surface opposite to each other, and the step of patterning and penetrating the metal substrate to form an inductor coil circuit comprises: forming a first pattern on the first surface, wherein the first pattern is recessed in the first surface; forming a second figure on the second surface, wherein the second figure is recessed in the second surface, and a projection of the second figure on the first surface coincides with the first figure; The depths of the depressions of the first figure and the second figure allow the metal substrate to penetrate and form the hollow area, and the inductor coil circuit surrounds the hollow area.

3. The preparation method according to claim 1, characterized in that: After the step of patterning and penetrating the metal substrate to form an inductor coil circuit, the preparation method further includes: The inductor coil circuit is electroplated to prepare a plated layer, and the plated layer covers the inductor coil circuit.

4. The preparation method according to claim 3, characterized in that: The thickness of the plated layer is less than half of the distance between adjacent first coils and second coils.

5. The preparation method according to claim 3 or 4, characterized in that: The material of the plated layer is the same as that of the metal substrate.

6. The preparation method according to claim 1, characterized in that: After the step of making an insulating layer on the metal substrate to fill the hollow area and cover the inductor coil circuit, the preparation method further includes: A conductive terminal is prepared at the window opening, one end of the conductive terminal is electrically connected to the corresponding electrode port, and the other end of the conductive terminal is used to be electrically connected to an external circuit.

7. The preparation method according to claim 6, characterized in that: The conductive terminal is provided with a nickel-gold plating layer.

8. The preparation method according to claim 1, characterized in that: The thickness of the metal substrate is 10um to 500um.

9. The preparation method according to claim 1, characterized in that: A seed layer is arranged on the insulating layer, and the seed layer is used to prepare a functional circuit.

10. The preparation method according to claim 1, characterized in that: The number of the inductor coil circuits is multiple, and the multiple inductor coil circuits are arranged at intervals; The metal substrate is cut according to the inductor coil circuit to form a plurality of the inductor coil circuits.

11. An inductor, characterized in that: The inductor is manufactured by adopting the manufacturing method according to any one of claims 1 to 10.

12. An inductor, comprising an inductor coil circuit and an insulating layer; The inductor circuit is made of a penetrating metal substrate, the inductor circuit at least includes a first coil and a second coil adjacent to each other, a hollow area is formed between the first coil and the second coil, and two ends of the inductor circuit are respectively a first electrode port and a second electrode port; The insulating layer fills the hollow area and covers the inductor coil circuit, and the insulating layer has a window exposing the first electrode port and the second electrode port.

13. An electronic device, characterized in that: The electronic device includes the inductor according to claim 11.

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