Multilayer capacitor

Abstract

The present disclosure provides a multilayer capacitor including: a body including a first internal electrode and a second internal electrode disposed in a first direction with a dielectric layer interposed between the first internal electrode and the second internal electrode; and first and second external electrodes disposed at end portions of the body in the second direction, respectively. The first internal electrode includes a first capacitance forming portion and a plurality of first lead-out portions extending from the first capacitance forming portion to be connected to the first external electrode. The second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead-out portions extending from the second capacitance forming portion to be connected to the second external electrode. For a thickness in the first direction, a thickness of at least one of the plurality of first lead-out portions is less than a thickness of the first capacitance forming portion, and a thickness of at least one of the plurality of second lead-out portions is less than a thickness of the second capacitance forming portion.

Description

Technical Field

[0001] The present disclosure relates to a multilayer capacitor. Background Art

[0002] Multilayer capacitors refer to chip capacitors that are mounted on printed circuit boards of various electronic products such as imaging devices, computers, smartphones, and mobile phones to be used for charging or discharging in the products.

[0003] Since multilayer capacitors have the characteristics of small size, high capacitance and easy installation, they are used as components in various electronic devices. In recent years, as components in electronic devices become smaller, the demand for small-sized and high-capacitance multilayer capacitors has been increasing.

[0004] Because the multilayer capacitor has an ultra-small size and high capacitance, the inner electrode of the multilayer capacitor is also required to have a small thickness. In the case of the inner electrode manufactured by the existing screen printing method, due to technical limitations, the inner electrode may have a less uniform thickness and may be difficult to have a small thickness below a predetermined thickness. Therefore, it is necessary to develop the inner electrode by using a sputtering method. Summary of the invention

[0005] The present disclosure aims to provide a multilayer capacitor which can reduce the cutting stress of the inner electrode, prevent the electrode from breaking, improve the poor contact between the inner electrode and the outer electrode, and improve the capacitance of the multilayer capacitor.

[0006] However, the problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and various extensions can be made within the scope of the spirit of the present disclosure included in the embodiments.

[0007] According to an embodiment, a multilayer capacitor includes: a capacitor body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and the capacitor body includes a plurality of dielectric layers and a first inner electrode and a second inner electrode alternately arranged in the first direction, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; and a first outer electrode and a second outer electrode, respectively arranged at both ends of the capacitor body in the second direction. The first inner electrode includes a first capacitance forming part and a plurality of first lead-out parts, the plurality of first lead-out parts extending from the first capacitance forming part to the third surface of the capacitor body and connected to the first outer electrode. The second inner electrode includes a second capacitance forming part and a plurality of second lead-out parts, the second capacitance forming part overlaps with the first capacitance forming part in the first direction, and the plurality of second lead-out parts extend from the second capacitance forming part to the fourth surface of the capacitor body and connected to the second outer electrode. Regarding the thickness in the first direction, at least one of the plurality of first lead portions has a thickness less than that of the first capacitance forming portion, and at least one of the plurality of second lead portions has a thickness less than that of the second capacitance forming portion.

[0008] Regarding the width in the third direction, at least one of the plurality of first lead portions may have a width that decreases toward the third surface of the capacitor body, and at least one of the plurality of second lead portions may have a width that decreases toward the fourth surface of the capacitor body.

[0009] The thickness of the at least one of the plurality of first lead out portions may decrease toward one end of the capacitor body, and the thickness of the at least one of the plurality of second lead out portions may decrease toward the other end of the capacitor body.

[0010] An upper surface of the at least one first lead-out portion among the plurality of first lead-out portions and an upper surface of the at least one second lead-out portion among the plurality of second lead-out portions in the first direction may have gradually decreasing heights in the first direction.

[0011] The at least one first lead-out portion among the plurality of first lead-out portions and the at least one second lead-out portion among the plurality of second lead-out portions may each have an upper surface inclined with respect to the first surface.

[0012] The first internal electrode and / or the second internal electrode may be a sputtered layer.

[0013] The first inner electrode may further include: a third lead-out portion extending from the first capacitance forming portion to the fifth surface of the capacitor body and connected to the first outer electrode, and a fourth lead-out portion extending from the first capacitance forming portion to the sixth surface of the capacitor body and connected to the first outer electrode.

[0014] The width of the portion of the third lead portion connected to the first external electrode in the second direction may be greater than the width of the portion of the at least one first lead portion among the multiple first lead portions connected to the first external electrode in the third direction, and the width of the portion of the fourth lead portion connected to the first external electrode in the second direction may be greater than the width of the portion of the at least one first lead portion among the multiple first lead portions connected to the first external electrode in the third direction.

[0015] The second inner electrode may further include: a fifth lead-out portion extending from the second capacitance forming portion to the fifth surface of the capacitor body and connected to the second outer electrode, and a sixth lead-out portion extending from the second capacitance forming portion to the sixth surface of the capacitor body and connected to the second outer electrode.

[0016] Regarding the width in the third direction, the sum of the widths of the corresponding portions of the plurality of first lead portions exposed to the third surface of the capacitor body may be smaller than the width of the first capacitance forming portion, and the sum of the widths of the corresponding portions of the plurality of second lead portions exposed to the fourth surface of the capacitor body may be smaller than the width of the second capacitance forming portion.

[0017] The plurality of first lead-out portions may include two first lead-out portions, and the plurality of second lead-out portions may include two second lead-out portions.

[0018] The plurality of first lead-out portions may include four first lead-out portions, and the plurality of second lead-out portions may include four second lead-out portions.

[0019] According to another embodiment, a multilayer capacitor includes: a capacitor body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and the capacitor body includes a plurality of dielectric layers and a first inner electrode and a second inner electrode alternately arranged in the first direction, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; and a first outer electrode and a second outer electrode, respectively arranged at both ends of the capacitor body in the second direction. The first inner electrode includes a first capacitance forming portion and a plurality of first lead portions, the plurality of first lead portions extending from the first capacitance forming portion to the third surface of the capacitor body and connected to the first outer electrode. The second inner electrode includes a second capacitance forming portion and a plurality of second lead portions, the second capacitance forming portion overlaps with the first capacitance forming portion in the first direction, and the plurality of second lead portions extend from the second capacitance forming portion to the fourth surface of the capacitor body and connected to the second outer electrode. Regarding the width in the third direction, at least one of the plurality of first lead out portions has a width decreasing toward the first external electrode, and at least one of the plurality of second lead out portions has a width decreasing toward the second external electrode.

[0020] The first internal electrode and / or the second internal electrode may be a sputtered layer.

[0021] The first inner electrode may further include: a third lead-out portion extending from the first capacitance forming portion to the fifth surface of the capacitor body and connected to the first outer electrode, and a fourth lead-out portion extending from the first capacitance forming portion to the sixth surface of the capacitor body and connected to the first outer electrode.

[0022] The width of the portion of the third lead portion connected to the first external electrode in the second direction may be greater than the width of the portion of the at least one first lead portion among the multiple first lead portions connected to the first external electrode in the third direction, and the width of the portion of the fourth lead portion connected to the first external electrode in the second direction may be greater than the width of the portion of the at least one first lead portion among the multiple first lead portions connected to the first external electrode in the third direction.

[0023] The second inner electrode may further include: a fifth lead-out portion extending from the second capacitance forming portion to the fifth surface of the capacitor body and connected to the second outer electrode, and a sixth lead-out portion extending from the second capacitance forming portion to the sixth surface of the capacitor body and connected to the second outer electrode.

[0024] Regarding the width in the third direction, the sum of the widths of the corresponding portions of the plurality of first lead portions exposed to the third surface of the capacitor body may be smaller than the width of the first capacitance forming portion, and the sum of the widths of the corresponding portions of the plurality of second lead portions exposed to the fourth surface of the capacitor body may be smaller than the width of the second capacitance forming portion.

[0025] The plurality of first lead-out portions may include two first lead-out portions, and the plurality of second lead-out portions may include two second lead-out portions.

[0026] The plurality of first lead-out portions may include four first lead-out portions, and the plurality of second lead-out portions may include four second lead-out portions.

[0027] As described above, the multilayer capacitor according to the embodiment can reduce the cutting stress of the inner electrode, prevent the electrode from being broken, improve the poor contact between the inner electrode and the outer electrode, and improve the capacitance of the multilayer capacitor.

[0028] The multilayer capacitor according to the embodiment can reduce the area of ​​the connection portion between the inner electrode and the outer electrode and improve defects caused by the penetration of the plating solution, thereby improving product reliability.

[0029] The multilayer capacitor according to the embodiment can increase connectivity between internal electrodes and external electrodes, and disperse cutting stress of the internal electrodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a perspective view schematically showing a multilayer capacitor according to an embodiment of the present disclosure.

[0031] Figure 2 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0032] Figure 3A and Figure 3B are respectively shown according to the embodiment of the application Figure 1 1. A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor.

[0033] Figure 4A and Figure 4B 1 and 2 are plan views respectively showing first and second internal electrodes in modified examples.

[0034] Figure 5A and Figure 5B 2 are plan views respectively showing a first internal electrode and a second internal electrode according to another embodiment.

[0035] Figure 6 is a multilayer capacitor according to another embodiment of the present disclosure and Figure 2 Corresponding cross-sectional views illustrate a first internal electrode and a second internal electrode according to another embodiment.

[0036] Figure 7 is a cross-sectional view showing a first internal electrode and a second internal electrode in a modified example.

[0037] Figure 8 is a cross-sectional view showing a first internal electrode and a second internal electrode in a modified example. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure belongs can easily practice the present disclosure. In order to clearly describe the present disclosure, parts irrelevant to the description are omitted, and throughout the specification, the same or similar components are represented by the same reference numerals. In addition, it should be noted that some components shown in the drawings are enlarged, omitted or schematically shown, and the size of each component does not accurately reflect its actual size.

[0039] It should be understood that the drawings are provided only to easily understand the embodiments of the present disclosure, and the spirit of the present disclosure is not limited by the drawings, and all modifications, equivalents, and replacements of the embodiments of the present disclosure should be understood to be included in the spirit and scope of the present disclosure.

[0040] Terms including ordinal numbers such as "first", "second", etc. may be used to describe various components. However, these components are not limited by these terms. These terms are only used to distinguish one component from another component.

[0041] In addition, when an element such as a layer, film, region, or plate is referred to as being "on" or "over" another element, the element may be "directly" "on" the other element or may have a third element interposed therebetween. In contrast, when an element is referred to as being "directly on" another element, there is no third element interposed therebetween. In addition, when an element is referred to as being "on" or "over" a reference element, the element may be disposed on or below the reference element and may not necessarily be "on" or "over" the reference element in a direction opposite to the direction of gravity.

[0042] It should be understood that the terms "include" and "comprising" used in this specification specify the presence of features, numbers, steps, operations, components, parts or combinations thereof mentioned in this specification, and do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof. Unless explicitly described to the contrary, "include" any component will be understood to imply the inclusion of other components without excluding other components.

[0043] Furthermore, throughout the specification, the expression “on a plane” may indicate a case where a target is viewed from the top, and the expression “on a cross section” may indicate a case where a cross section of a target taken in a vertical direction is viewed from the side of the target.

[0044] Throughout the specification, when an element is referred to as being “connected to” another element, it may mean not only that the element and the other element are “directly connected or physically connected to” each other, but also that the element and the other element are “indirectly connected or non-contactly connected to” each other with a third element interposed therebetween.

[0045] In addition, when it is mentioned that any component is “connected” to another component, it may mean not only that two or more components are directly connected to each other but also that two or more components are indirectly connected to each other through another component, not only that two or more components are physically connected to each other but also that two or more components are electrically connected, or that two or more components are a single entity although mentioned by different names according to their positions or functions.

[0046] Hereinafter, in order to clearly describe the embodiments of the present disclosure, the direction of the capacitor body 110 may be defined as follows: the x-axis direction, the y-axis direction, and the z-axis direction shown in the drawings may represent the length direction, the width direction, and the thickness direction of the capacitor body 110, respectively. Here, the z-axis direction (or the thickness direction) may be a direction perpendicular to the wide surface (or the main surface) of the sheet component (e.g., the capacitor body 110), and may be used as, for example, the same concept as the stacking direction of the stacked dielectric layer 111. The x-axis direction (or the length direction) may be a direction extending parallel to the wide surface (or the main surface) of the sheet component and substantially perpendicular to the z-axis direction (or the thickness direction). For example, the x-axis direction may be a direction in which the first external electrode 130 and the second external electrode 140 are disposed on both sides of the component. The y-axis direction (or the width direction) may be a direction extending parallel to the wide surface (or the main surface) of the sheet component and substantially perpendicular to the z-axis direction (or the thickness direction) and the x-axis direction (or the length direction). The length of the sheet-like component in the x-axis direction (or length direction) may be greater than its width in the y-axis direction (or width direction).

[0047] Therefore, the first direction in which the dielectric layer 111 is stacked with the first and second internal electrodes 121 and 122 may be the z-axis direction (or thickness direction), and the second and third directions, each perpendicular to the first direction and to each other, may be the x-axis direction (or length direction) and the y-axis direction (or width direction), respectively.

[0048] Figure 1 is a perspective view schematically showing a multilayer capacitor according to an embodiment of the present disclosure.

[0049] Figure 2 It is along Figure 1A cross-sectional view taken along line II-II'. Figure 2 is a diagram showing an xz cross section passing through a point where the first lead-out portion 121 b and the first external electrode 130 contact each other and a point where the second lead-out portion 122 b and the second external electrode 140 contact each other.

[0050] Reference Figure 1 and Figure 2 , the multilayer capacitor 100 according to this embodiment may include a capacitor body 110 and first and second external electrodes 130 and 140 .

[0051] The capacitor body 110 may include a plurality of dielectric layers 111 , a plurality of first internal electrodes 121 , and a plurality of second internal electrodes 122 , which are alternately disposed in the z-axis direction with the dielectric layers 111 interposed therebetween.

[0052] The capacitor body 110 may be manufactured by stacking a plurality of dielectric layers 111 in the z-axis direction and then sintering the dielectric layers 111. Boundaries between adjacent dielectric layers 111 of the capacitor body 110 may be integrated with each other to such an extent that they are difficult to distinguish without using a scanning electron microscope (SEM).

[0053] The capacitor body 110 may have an approximately hexahedral shape, and at the same time have a predetermined thickness in the z-axis direction, a predetermined length in the x-axis direction, and a predetermined width in the y-axis direction. However, the shape and size of the capacitor body 110 and the number of stacking of the dielectric layer 111 are not limited to the shape and size of the capacitor body and the number of stacking of the dielectric layer shown in the drawings of this embodiment.

[0054] In this embodiment, for the convenience of description, the first surface S1 and the second surface S2 of the capacitor body 110 refer to relative surfaces of the capacitor body 110 opposite to each other in the z-axis direction, the third surface S3 and the fourth surface S4 of the capacitor body 110 refer to relative surfaces of the capacitor body 110 connected to the first surface 1 and the second surface 2 and opposite to each other in the x-axis direction, and the fifth surface S5 and the sixth surface S6 of the capacitor body 110 refer to relative surfaces of the capacitor body 110 connected to the first surface S1 and the second surface S2, connected to the third surface S3 and the fourth surface S4 and opposite to each other in the y-axis direction.

[0055] In addition, in this embodiment, the mounting surface of the multilayer capacitor 100 may be the first surface S1 of the capacitor body 110 .

[0056] The dielectric layer 111 may include a ceramic material having a high dielectric constant, such as a barium titanate (BaTiO 3 )-based ceramic powder or a strontium titanate (SrTiO 3 )-based ceramic powder. However, the material of the dielectric layer 111 is not limited thereto as long as sufficient capacitance can be obtained.

[0057] Furthermore, the dielectric layer 111 may further include a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, etc., in addition to the ceramic powder.

[0058] The ceramic additive may include, for example, a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), or aluminum (Al).

[0059] The capacitor body 110 may include an effective region contributing to forming capacitance of the capacitor, and an upper cover 112 and a lower cover 113 formed as upper and lower edge portions on upper and lower surfaces of the effective region in the z-axis direction, respectively.

[0060] The upper cover 112 and the lower cover 113 may have the same material as the dielectric layer 111 , except that the upper cover 112 and the lower cover 113 do not include an inner electrode.

[0061] The upper cover 112 and the lower cover 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active area, respectively, in the z-axis direction, and may be mainly used to prevent damage to the first and second internal electrodes 121 and 122 due to physical stress or chemical stress.

[0062] The first and second internal electrodes 121 and 122, which are electrodes having different polarities, may be alternately arranged in the z-axis direction with the dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, and one end of the first and second internal electrodes 121 and 122 may be exposed through the third and fourth surfaces S3 and S4 of the capacitor body 110, respectively.

[0063] The first and second internal electrodes 121 and 122 may include a plurality of first and second internal electrodes 121 and 122 , respectively.

[0064] The first and second internal electrodes 121 and 122 may be electrically insulated from each other by a dielectric layer 111 disposed between the first and second internal electrodes 121 and 122 .

[0065] The ends of the first inner electrode 121 and the second inner electrode 122 alternately exposed through the third surface S3 and the fourth surface S4 of the capacitor body 110 can be respectively connected and electrically connected to the first outer electrode 130 and the second outer electrode 140 described below, which are respectively arranged on the third surface S3 and the fourth surface S4 of the capacitor body 110.

[0066] Therefore, it is possible to improve adhesion between the inner and outer electrodes, reduce poor contact therebetween, and prevent the capacitance of the multilayer capacitor 100 from being reduced.

[0067] In addition, the first and second internal electrodes 121 and 122 are not limited to any specific material.

[0068] The first internal electrode 121 and / or the second internal electrode 122 may be a sputtered layer.

[0069] That is, the first internal electrode 121 and / or the second internal electrode 122 may be a sputtered layer formed by a sputtering method.

[0070] The first internal electrode 121 and / or the second internal electrode 122 may be formed by a sputtering method, thereby forming a pattern more precisely than when a conductive paste is used.

[0071] The first internal electrode 121 may include a first capacitance forming portion 121 a and a plurality of first lead-out portions 121 b .

[0072] The first capacitance forming part 121 a may be spaced apart from the third surface S3 , the fourth surface S4 , the fifth surface S5 , and the sixth surface S6 of the capacitor body 110 , and contribute to forming capacitance of the capacitor.

[0073] The first lead-out portion 121 b may extend from the first capacitance forming portion 121 a to be exposed to the third surface S3 of the capacitor body 110 and connected to the first external electrode 130 .

[0074] The second internal electrode 122 may include a second capacitance forming portion 122 a and a plurality of second lead-out portions 122 b .

[0075] The second capacitance forming part 122a may be spaced apart from the third, fourth, fifth, and sixth surfaces S3, S4, S5, and S6 of the capacitor body 110, overlap the first capacitance forming part 121a in the z-axis direction, and contribute to forming capacitance of the capacitor.

[0076] The second lead-out portion 122 b may extend from the second capacitance forming portion 122 a to be exposed to the fourth surface S4 of the capacitor body 110 , and may be connected to the second external electrode 140 .

[0077] The first lead-out portion 121 b and the second lead-out portion 122 b may be disposed to be offset from each other in the length direction of the capacitor body 110 and alternately exposed to both ends of the capacitor body 110 in the length direction.

[0078] Through the above configuration, when a predetermined voltage is applied to the first and second external electrodes 130 and 140 , charges may be accumulated between the first and second internal electrodes 121 and 122 .

[0079] Here, the capacitance of the multilayer capacitor 100 may be proportional to an area where the first capacitance forming portion 121a of the first internal electrode 121 and the second capacitance forming portion 122a of the second internal electrode 122 overlap each other in the z-axis direction in the active region of the capacitor body 110 .

[0080] The first external electrode 130 and the second external electrode 140 can be provided with voltages of different polarities, can be arranged at both ends of the capacitor body 110 in the x-axis direction, and can be respectively connected to the exposed portions of the first internal electrode 121 and the exposed portions of the second internal electrode 122, and electrically connected to the exposed portions of the first internal electrode 121 and the exposed portions of the second internal electrode 122.

[0081] For example, the first external electrode 130 may be connected to and electrically connected to a plurality of first lead-out portions 121 b (to be described below), and the second external electrode 140 may be connected to and electrically connected to a plurality of second lead-out portions 122 b (to be described below).

[0082] The first external electrode 130 may include a first conductive layer 131 disposed on a surface of the capacitor body 110 and connected to the first internal electrode 121 , a first inner plating layer 132 disposed to cover the first conductive layer 131 , and a first outer plating layer 133 disposed to cover the first inner plating layer 132 .

[0083] In addition, the second external electrode 140 may include a second conductive layer 141 disposed on the surface of the capacitor body 110 and connected to the second internal electrode 122 , a second inner plating layer 142 disposed to cover the second conductive layer 141 , and a second outer plating layer 143 disposed to cover the second inner plating layer 142 .

[0084] The first conductive layer 131 may include a first connection portion 131 a and a first band portion 131 b .

[0085] The first connection portion 131 a may be disposed on the third surface S3 of the capacitor body 110 and connected to an exposed portion of the first internal electrode 121 .

[0086] In detail, the first connection portion 131 a may be connected to the plurality of first lead-out portions 121 b exposed from the third surface S3 of the capacitor body 110 .

[0087] The first band portion 131 b may extend from the first connection portion 131 a to a portion of the first surface S1 of the capacitor body 110 .

[0088] Here, the first tape portion 131 b may further extend to a portion of the fifth surface S5 , a portion of the sixth surface S6 , and a portion of the second surface S2 of the capacitor body 110 to have improved adhesive strength.

[0089] The second conductive layer 141 may include a second connection portion 141 a and a second band portion 141 b .

[0090] The second connection portion 141 a may be disposed on the fourth surface S4 of the capacitor body 110 and connected to an exposed portion of the second internal electrode 122 .

[0091] In detail, the second connection portion 141 a may be connected to the plurality of second lead-out portions 122 b exposed from the fourth surface S4 of the capacitor body 110 .

[0092] The second band portion 141 b may extend from the second connection portion 141 a to a portion of the first surface S1 of the capacitor body 110 .

[0093] Here, the second tape portion 141 b may further extend to a portion of the fifth surface S5 , a portion of the sixth surface S6 , and a portion of the second surface S2 of the capacitor body 110 to have improved adhesive strength.

[0094] The first conductive layer 131 and / or the second conductive layer 141 may include at least one of copper (Cu) and silver (Ag), and in addition thereto, may further include glass and epoxy resin.

[0095] The first conductive layer 131 and / or the second conductive layer 141 may be formed by coating a conductive paste containing a metal and firing the conductive paste.

[0096] The first inner plating layer 132 and / or the second inner plating layer 142 may include nickel (Ni), and may further include phosphorus (P).

[0097] In addition, the first and second inner plated layers 132 and 142 may be formed by plating a first metal layer including nickel and phosphorus on the first and second conductive layers 131 and 141 , respectively.

[0098] The first inner plating layer 132 and the second inner plating layer 142 may each be formed by electroless plating.

[0099] When the first inner plating layer 132 and / or the second inner plating layer 142 are formed by electroless plating in this manner, the first inner plating layer 132 and / or the second inner plating layer 142 can have better corrosion resistance than a film formed by electrolytic plating while having plating performance that is not significantly different from electrolytic plating, and can have a uniformly formed plating thickness because the plating growth at each location is approximately equal.

[0100] Furthermore, electroless plating can plate only the object to be plated without a dummy, making it easier to prepare for plating and to pick out defects in the object to be plated after plating.

[0101] The first outer plating layer 133 and / or the second outer plating layer 143 may include palladium (Pd), and may further include phosphorus (P).

[0102] In addition, the first and second outer plating layers 133 and 143 may be formed by plating a second metal layer including palladium and phosphorus on the first and second inner plating layers 132 and 142 , respectively, using electroless plating.

[0103] The first and second outer plating layers 133 and 143 may respectively serve to prevent oxidation of nickel components of the first and second inner plating layers 132 and 142 , and thus may have a smaller thickness by using a material including a precious metal that is hardly oxidized.

[0104] When the first and second outer plating layers 133 and 143 have increased thicknesses, the possibility of plating cracks may increase.

[0105] When the first outer plating layer 133 and / or the second outer plating layer 143 are formed by electroless plating in this manner, the first outer plating layer 133 and / or the second outer plating layer 143 can have better corrosion resistance than a film formed by electrolytic plating while having plating performance that is not significantly different from electrolytic plating, and can have a uniformly formed plating thickness because the plating growth at each location is approximately equal.

[0106] In the following, reference will be made to FIG. 3A to FIG. 8 The structures of the first and second internal electrodes 121 and 122 are described in detail.

[0107] Figure 3A and Figure 3B are respectively shown according to the embodiment of the application Figure 1 A plan view of a first inner electrode and a second inner electrode of a multilayer capacitor, Figure 4A and Figure 4B are plan views respectively showing a first inner electrode and a second inner electrode in a modified example, and Figure 5A and Figure 5B 2 are plan views respectively showing a first internal electrode and a second internal electrode according to another embodiment.

[0108] Reference Figure 3A , a plurality of first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a.

[0109] For example, two first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a , and the present disclosure is not limited thereto.

[0110] The width of the first lead-out portion 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0111] The width of the first inner electrode 121 or the second inner electrode 122 may refer to the maximum value, minimum value or arithmetic mean value of the lengths of multiple line segments connected from a point on the rear surface of the first inner electrode 121 or the second inner electrode 122 to the front surface of the first inner electrode 121 or the second inner electrode 122 along the y-axis direction based on an xy cross-section passing through a point at which the first inner electrode 121 and the first outer electrode 130 contact each other or a point at which the second inner electrode 122 and the second outer electrode 140 contact each other.

[0112] The width of the first internal electrode 121 or the second internal electrode 122 may be measured using an optical microscope, a scanning electron microscope, or the like.

[0113] In addition, the sum of the respective widths of the plurality of first lead-out portions 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0114] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the first external electrode 130 .

[0115] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the third surface S3 of the capacitor body 110 .

[0116] Therefore, the sum of widths of corresponding portions of the plurality of first lead-out portions 121 b exposed to the third surface S3 of the capacitor body 110 in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0117] Reference Figure 3B , a plurality of second lead-out portions 122b may be disposed at one end of the second capacitance forming portion 122a.

[0118] For example, two second lead-out portions 122 b may be provided at one end of the second capacitance forming portion 122 a .

[0119] The width of the second lead-out portion 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0120] In addition, the sum of the respective widths of the plurality of second lead-out portions 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0121] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the second external electrode 140 .

[0122] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the fourth surface S4 of the capacitor body 110 .

[0123] Therefore, the sum of widths of corresponding portions of the plurality of second lead-out portions 122 b exposed to the fourth surface S4 of the capacitor body 110 in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0124] As described above, in the process of manufacturing a multilayer capacitor, the width of a portion of the first lead-out portion 121b or the second lead-out portion 122b exposed to the surface of the capacitor body 110 (corresponding to the cutting area) can be formed to be smaller than the width of the first capacitor forming portion 121a or the second capacitor forming portion 122a, thereby reducing cutting stress, preventing electrode breakage, improving poor contact between the inner electrode and the outer electrode, and improving the capacitance of the multilayer capacitor.

[0125] In addition, the width of each of the multiple first lead-out portions 121b in the y-axis direction may gradually decrease toward the first external electrode 130 and / or the width of each of the multiple second lead-out portions 122b in the y-axis direction may gradually decrease toward the second external electrode 140, thereby reducing the area of ​​the connecting portion between the internal electrode and the external electrode, and improving defects caused by penetration of the plating solution, thereby improving product reliability, and easily controlling the shape of the internal electrode.

[0126] Reference Figure 4A , a plurality of first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a.

[0127] For example, four first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a , and the present disclosure is not limited thereto.

[0128] The width of the first lead-out portion 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0129] In addition, the sum of the respective widths of the plurality of first lead-out portions 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0130] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the first external electrode 130 .

[0131] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the third surface S3 of the capacitor body 110 .

[0132] Therefore, the sum of widths of corresponding portions of the plurality of first lead-out portions 121 b exposed to the third surface S3 of the capacitor body 110 in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0133] Each of the plurality of first lead-out portions 121b may have a triangular cross-sectional shape. As an example, each of the plurality of first lead-out portions 121b may have a triangular shape in a plan view.

[0134] Reference Figure 4B , a plurality of second lead-out portions 122b may be disposed at one end of the second capacitance forming portion 122a.

[0135] For example, four second lead-out portions 122 b may be provided at one end of the second capacitance forming portion 122 a .

[0136] The width of the second lead-out portion 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0137] In addition, the sum of the respective widths of the plurality of second lead-out portions 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0138] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the second external electrode 140 .

[0139] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the fourth surface S4 of the capacitor body 110 .

[0140] Therefore, the sum of widths of corresponding portions of the plurality of second lead-out portions 122 b exposed to the fourth surface S4 of the capacitor body 110 in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0141] Each of the plurality of second lead-out portions 122b may have a triangular cross-sectional shape. As an example, each of the plurality of second lead-out portions 122b may have a triangular shape in a plan view.

[0142] In this modified example, each of the first lead-out portion 121b and the second lead-out portion 122b may have a smaller width in the y-axis direction, and the number of the first lead-out portion 121b and the second lead-out portion 122b may be greater than that of FIG. 3 .

[0143] Therefore, connectivity between the first lead-out portion 121 b and the first external electrode 130 and / or connectivity between the second lead-out portion 122 b and the second external electrode 140 may be improved.

[0144] As described above, in the process of manufacturing a multilayer capacitor, the width of a portion of the first lead-out portion 121b or the second lead-out portion 122b exposed to the surface of the capacitor body 110 (corresponding to the cutting area) can be formed to be smaller than the width of the first capacitor forming portion 121a or the second capacitor forming portion 122a, thereby reducing cutting stress, preventing electrode breakage, improving poor contact between the inner electrode and the outer electrode, and improving the capacitance of the multilayer capacitor.

[0145] In addition, the width of each of the multiple first lead-out portions 121b in the y-axis direction may gradually decrease toward the first external electrode 130 and / or the width of each of the multiple second lead-out portions 122b in the y-axis direction may gradually decrease toward the second external electrode 140, thereby reducing the area of ​​the connecting portion between the internal electrode and the external electrode and improving defects caused by penetration of the plating solution, thereby improving product reliability.

[0146] Reference Figure 5A , the first internal electrode 121 according to another embodiment may include a first capacitance forming portion 121 a , a plurality of first lead-out portions 121 b , a third lead-out portion 121 c , and a fourth lead-out portion 121 d .

[0147] A plurality of first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a .

[0148] For example, four first lead-out portions 121 b may be provided at one end of the first capacitance forming portion 121 a , and the present disclosure is not limited thereto.

[0149] The width of the first lead-out portion 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0150] In addition, the sum of the respective widths of the plurality of first lead-out portions 121 b in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0151] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the first external electrode 130 .

[0152] A width of each of the plurality of first lead-out portions 121 b in the y-axis direction may gradually decrease toward the third surface S3 of the capacitor body 110 .

[0153] Therefore, the sum of widths of corresponding portions of the plurality of first lead-out portions 121 b exposed to the third surface S3 of the capacitor body 110 in the y-axis direction may be smaller than the width of the first capacitance forming portion 121 a in the y-axis direction.

[0154] Each of the plurality of first lead-out portions 121b may have a triangular cross-sectional shape. As an example, each of the plurality of first lead-out portions 121b may have a triangular shape in a plan view.

[0155] In addition, the third lead-out portion 121 c may extend from the first capacitance forming portion 121 a to the fifth surface S5 of the capacitor body 110 , and may be connected to the first external electrode 130 .

[0156] The fourth lead-out portion 121 d may extend from the first capacitance forming portion 121 a to the sixth surface S6 of the capacitor body 110 , and may be connected to the first external electrode 130 .

[0157] The third lead portion 121c and the fourth lead portion 121d may extend from the first capacitance forming portion 121a in opposite directions, respectively. In addition, although not shown, the third lead portion 121c and the fourth lead portion 121d may be opposite to each other in the y-axis direction or offset from each other in the y-axis direction, and the width of each of the third lead portion 121c and the fourth lead portion 121d in the x-axis direction may remain unchanged or gradually increase in the y-axis direction. The width of the portion of the third lead portion 121c or the fourth lead portion 121d connected to the first external electrode 130 in the x-axis direction may be greater than the width of the portion of the first lead portion 121b connected to the first external electrode 130 in the y-axis direction.

[0158] Reference Figure 5B , the first internal electrode 122 according to another embodiment may include a second capacitance forming portion 122a, a plurality of second lead-out portions 122b, a fifth lead-out portion 122c, and a sixth lead-out portion 122d.

[0159] A plurality of second lead-out portions 122b may be disposed at one end of the second capacitance forming portion 122a. For example, four second lead-out portions 122b may be disposed at one end of the second capacitance forming portion 122a, and the present disclosure is not limited thereto.

[0160] The width of the second lead-out portion 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0161] In addition, the sum of the respective widths of the plurality of second lead-out portions 122 b in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0162] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the second external electrode 140 .

[0163] A width of each of the plurality of second lead-out portions 122 b in the y-axis direction may gradually decrease toward the fourth surface S4 of the capacitor body 110 .

[0164] Therefore, the sum of widths of corresponding portions of the plurality of second lead-out portions 122 b exposed to the fourth surface S4 of the capacitor body 110 in the y-axis direction may be smaller than the width of the second capacitance forming portion 122 a in the y-axis direction.

[0165] Each of the plurality of second lead-out portions 122b may have a triangular cross-sectional shape. As an example, each of the plurality of second lead-out portions 122b may have a triangular shape in a plan view.

[0166] In addition, the fifth lead-out portion 122 c may extend from the second capacitance forming portion 122 a to the fifth surface S5 of the capacitor body 110 , and may be connected to the second external electrode 140 .

[0167] The sixth lead-out portion 122 d may extend from the second capacitance forming portion 122 a to the sixth surface S6 of the capacitor body 110 , and may be connected to the second external electrode 140 .

[0168] The fifth and sixth lead-out portions 122c and 122d may have the same configurations as the third and fourth lead-out portions 121c and 121d, respectively.

[0169] and Figure 4A and Figure 4B Compared with the first and second internal electrodes 121 and 122 in the embodiment, the first and second internal electrodes 121 and 122 in this embodiment may further include a third lead-out portion 121c, a fourth lead-out portion 121d, a fifth lead-out portion 122c and a sixth lead-out portion 122d.

[0170] Therefore, it is possible to increase connectivity between the first internal electrode 121 and the first external electrode 130 and / or the second internal electrode 122 and the second external electrode 140 , and disperse cutting stress of the first internal electrode 121 or the second internal electrode 122 .

[0171] As described above, in the process of manufacturing a multilayer capacitor, the width of a portion of the first lead-out portion 121b or the second lead-out portion 122b exposed to the surface of the capacitor body 110 (corresponding to the cutting area) can be formed to be smaller than the width of the first capacitor forming portion 121a or the second capacitor forming portion 122a, thereby reducing cutting stress, preventing electrode breakage, improving poor contact between the inner electrode and the outer electrode, and improving the capacitance of the multilayer capacitor.

[0172] In addition, the width of each of the multiple first lead-out portions 121b in the y-axis direction may gradually decrease toward the first external electrode 130 and / or the width of each of the multiple second lead-out portions 122b in the y-axis direction may gradually decrease toward the second external electrode 140, thereby reducing the area of ​​the connecting portion between the internal electrode and the external electrode and improving defects caused by penetration of the plating solution, thereby improving product reliability.

[0173] Figure 6 is a multilayer capacitor according to another embodiment of the present disclosure and Figure 2 corresponding cross-sectional views showing a first inner electrode and a second inner electrode according to another embodiment, and Figure 7 and Figure 8 2 are cross-sectional views respectively showing a first internal electrode and a second internal electrode in modified examples.

[0174] Reference Figure 6 , the thickness of each of the plurality of first lead-out portions 121 b in the z-axis direction may be smaller than the thickness of the first capacitance forming portion 121 a .

[0175] In addition, the thickness of each of the plurality of second lead-out portions 122 b in the z-axis direction may be smaller than the thickness of the second capacitance forming portion 122 a .

[0176] The thickness of the first inner electrode 121 or the second inner electrode 122 may refer to the maximum value, minimum value or arithmetic mean value of the lengths of multiple line segments connected from points on the upper surface of the first inner electrode 121 or the second inner electrode 122 to the lower surface of the first inner electrode 121 or the second inner electrode 122 along the z-axis direction based on an xz cross-section passing through the points at which the first inner electrode 121 and the first outer electrode 130 contact each other or the points at which the second inner electrode 122 and the second outer electrode 140 contact each other.

[0177] The thickness of the first internal electrode 121 or the second internal electrode 122 may be measured using an optical microscope, a scanning electron microscope, or the like.

[0178] The thickness of each of the plurality of first lead portions 121 b in the z-axis direction may decrease toward one end of the capacitor body 110 , and the thickness of each of the plurality of second lead portions 122 b in the z-axis direction may decrease toward the other end of the capacitor body 110 .

[0179] In detail, the thickness of each of the plurality of first lead-out portions 121 b in the z-axis direction may gradually decrease toward the third surface S3 of the capacitor body 110 in the x-axis direction.

[0180] In addition, the thickness of each of the plurality of second lead-out portions 121 b in the z-axis direction may gradually decrease toward the fourth surface S4 of the capacitor body 110 in the x-axis direction.

[0181] The height of the upper surface of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b in the z-axis direction may gradually become lower. As an example, the height of the upper surface of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b may gradually become lower toward one end or the other end of the capacitor body. In addition, the thickness of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b may gradually decrease toward one end or the other end of the capacitor body.

[0182] However, the present disclosure is not limited thereto, and each of the plurality of first lead-out portions 121 b or each of the plurality of second lead-out portions 122 b may have any shape as long as the thickness thereof in the z-axis direction is small.

[0183] For example, refer to Figure 7 , the height of the lower surface of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b in the z-axis direction may gradually increase in the z-axis direction. As an example, the height of the lower surface of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b may gradually increase toward one end or the other end of the capacitor body. In addition, the thickness of each of the plurality of first lead-out portions 121b or each of the plurality of second lead-out portions 122b may gradually decrease toward one end or the other end of the capacitor body.

[0184] For example, refer to Figure 8 , each of the plurality of first lead portions 121b or each of the plurality of second lead portions 122b may have an upper surface of a lower height and a lower surface of a higher height. As an example, the height of the upper surface of each of the plurality of first lead portions 121b or each of the plurality of second lead portions 122b may gradually become lower toward one end or the other end of the capacitor body. The height of the lower surface of each of the plurality of first lead portions 121b or each of the plurality of second lead portions 122b may gradually become higher toward one end or the other end of the capacitor body. In addition, the thickness of each of the plurality of first lead portions 121b or each of the plurality of second lead portions 122b may gradually decrease toward one end or the other end of the capacitor body.

[0185] For example, refer to FIG. 3A to FIG. 4B , the first internal electrode 121 may include a plurality of first lead portions 121b, and the first internal electrode 122 may include a plurality of second lead portions 122b. The thickness of each of the plurality of first lead portions 121b in the z-axis direction may decrease toward one end of the capacitor body 110, and the thickness of each of the plurality of second lead portions 122b in the z-axis direction may decrease toward the other end of the capacitor body 110.

[0186] For example, refer to Figure 5A and Figure 5B , the first internal electrode 121 may include a plurality of first lead-out portions 121b, third lead-out portions 121c, and fourth lead-out portions 121d, and the second internal electrode 122 may include a plurality of second lead-out portions 122b, fifth lead-out portions 122c, and sixth lead-out portions 122d.

[0187] The thickness of each of the plurality of first lead portions 121 b in the z-axis direction may decrease toward one end of the capacitor body 110 , and the thickness of each of the plurality of second lead portions 122 b in the z-axis direction may decrease toward the other end of the capacitor body 110 .

[0188] Alternatively, the thickness of each of the plurality of first lead portions 121b, the third lead portion 121c, and the fourth lead portion 121d in the z-axis direction may decrease toward one end of the capacitor body 110, and the thickness of each of the plurality of second lead portions 122b, the fifth lead portion 122c, and the sixth lead portion 122d in the z-axis direction may decrease toward the other end of the capacitor body 110. That is, the scheme that the widths of the first and second lead portions in the y-axis direction gradually decrease toward the respective ends of the capacitor body and the scheme that the thicknesses of the first and second lead portions in the z-axis direction gradually decrease toward the respective ends of the capacitor body may be combined with each other, or one of them may be applied selectively.

[0189] As described above, in the process of manufacturing a multilayer capacitor, the thickness of a portion of the first lead-out portion 121b or the second lead-out portion 122b exposed to the surface of the capacitor body 110 (corresponding to the cutting area) can be formed to be smaller than the thickness of the first capacitance forming portion 121a or the second capacitance forming portion 122a, thereby reducing cutting stress, preventing electrode breakage, improving poor contact between the inner electrode and the outer electrode, and improving the capacitance of the multilayer capacitor.

[0190] Although the embodiments of the present disclosure have been described, it should be understood that the present disclosure is not limited to the disclosed embodiments. Various modifications can be made within the scope of the claims, description and drawings of the present disclosure, and these modifications also fall within the scope of the present disclosure.

Claims

1. A multilayer capacitor comprising: a capacitor body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and the capacitor body comprising a plurality of dielectric layers and first and second inner electrodes alternately arranged in the first direction, and the dielectric layer being interposed between the first and second inner electrodes; and The first external electrode and the second external electrode are respectively arranged at two ends of the capacitor body in the second direction, wherein the first inner electrode comprises a first capacitance forming portion and a plurality of first lead portions, the plurality of first lead portions extending from the first capacitance forming portion to the third surface of the capacitor body and connected to the first outer electrode, the second inner electrode includes a second capacitance forming portion and a plurality of second lead portions, the second capacitance forming portion overlapping the first capacitance forming portion in the first direction, the plurality of second lead portions extending from the second capacitance forming portion to the fourth surface of the capacitor body and connected to the second outer electrode, and Regarding the thickness in the first direction, at least one of the plurality of first lead portions has a thickness less than that of the first capacitance forming portion, and at least one of the plurality of second lead portions has a thickness less than that of the second capacitance forming portion.

2. The multilayer capacitor according to claim 1, wherein For the width in the third direction, The at least one first lead-out portion of the plurality of first lead-out portions has a width that decreases toward the third surface of the capacitor body, and The at least one second lead out portion of the plurality of second lead out portions has a width that decreases toward the fourth surface of the capacitor body.

3. The multilayer capacitor according to claim 1, wherein The thickness of at least one of the plurality of first lead-out portions decreases toward one end of the capacitor body, and The thickness of the at least one second lead-out portion among the plurality of second lead-out portions decreases toward the other end of the capacitor body.

4. The multilayer capacitor according to claim 3, wherein An upper surface of at least one of the plurality of first lead-out portions in the first direction and an upper surface of at least one of the plurality of second lead-out portions in the first direction each have a height that gradually decreases in the first direction.

5. The multilayer capacitor according to claim 3, wherein The at least one first lead-out portion among the plurality of first lead-out portions and the at least one second lead-out portion among the plurality of second lead-out portions each have an upper surface inclined with respect to the first surface.

6. The multilayer capacitor according to claim 1, wherein The first internal electrode and / or the second internal electrode is a sputtered layer.

7. The multilayer capacitor according to claim 1, wherein The first inner electrode further comprises: a third lead portion extending from the first capacitance forming portion to the fifth surface of the capacitor body and connected to the first external electrode, and A fourth lead portion extends from the first capacitance forming portion to the sixth surface of the capacitor body and is connected to the first external electrode.

8. The multilayer capacitor according to claim 7, wherein The width of a portion of the third lead portion connected to the first external electrode in the second direction is greater than the width of a portion of the at least one first lead portion of the plurality of first lead portions connected to the first external electrode in the third direction, and A width of a portion of the fourth lead portion connected to the first external electrode in the second direction is greater than a width of a portion of the at least one first lead portion of the plurality of first lead portions connected to the first external electrode in the third direction.

9. The multilayer capacitor according to claim 1 or 7, wherein: The second inner electrode further comprises: a fifth lead portion extending from the second capacitance forming portion to the fifth surface of the capacitor body and connected to the second external electrode, and A sixth lead portion extends from the second capacitance forming portion to the sixth surface of the capacitor body and is connected to the second external electrode.

10. The multilayer capacitor according to claim 1, wherein For the width in the third direction, The sum of widths of corresponding portions of the plurality of first lead portions exposed to the third surface of the capacitor body is smaller than a width of the first capacitance forming portion, and A sum of widths of corresponding portions of the plurality of second lead-out portions exposed to the fourth surface of the capacitor body is smaller than a width of the second capacitance forming portion.

11. The multilayer capacitor according to claim 1, wherein The plurality of first lead-out portions include two first lead-out portions, and the plurality of second lead-out portions include two second lead-out portions.

12. The multilayer capacitor according to claim 1, wherein The plurality of first lead-out portions include four first lead-out portions, and the plurality of second lead-out portions include four second lead-out portions.

13. A multilayer capacitor comprising: a capacitor body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, and the capacitor body comprising a plurality of dielectric layers and first and second inner electrodes alternately arranged in the first direction, and the dielectric layer being interposed between the first and second inner electrodes; and The first external electrode and the second external electrode are respectively arranged at two ends of the capacitor body in the second direction, wherein the first inner electrode comprises a first capacitance forming portion and a plurality of first lead portions, the plurality of first lead portions extending from the first capacitance forming portion to the third surface of the capacitor body and connected to the first outer electrode, the second inner electrode comprises a second capacitance forming portion and a plurality of second lead portions, the second capacitance forming portion overlapping the first capacitance forming portion in the first direction, the plurality of second lead portions extending from the second capacitance forming portion to the fourth surface of the capacitor body and connected to the second outer electrode, Regarding the width in the third direction, at least one of the plurality of first lead out portions has a width decreasing toward the first external electrode, and at least one of the plurality of second lead out portions has a width decreasing toward the second external electrode.

14. The multilayer capacitor according to claim 13, wherein The first internal electrode and / or the second internal electrode is a sputtered layer.

15. The multilayer capacitor according to claim 13, wherein The first inner electrode further comprises: a third lead portion extending from the first capacitance forming portion to the fifth surface of the capacitor body and connected to the first external electrode, and A fourth lead portion extends from the first capacitance forming portion to the sixth surface of the capacitor body and is connected to the first external electrode.

16. The multilayer capacitor according to claim 15, wherein The width of a portion of the third lead portion connected to the first external electrode in the second direction is greater than the width of a portion of the at least one first lead portion of the plurality of first lead portions connected to the first external electrode in the third direction, and A width of a portion of the fourth lead portion connected to the first external electrode in the second direction is greater than a width of a portion of the at least one first lead portion of the plurality of first lead portions connected to the first external electrode in the third direction.

17. The multilayer capacitor according to claim 13 or 15, wherein: The second inner electrode further comprises: a fifth lead portion extending from the second capacitance forming portion to the fifth surface of the capacitor body and connected to the second external electrode, and A sixth lead portion extends from the second capacitance forming portion to the sixth surface of the capacitor body and is connected to the second external electrode.

18. The multilayer capacitor according to claim 13, wherein For the width in the third direction, The sum of widths of corresponding portions of the plurality of first lead portions exposed to the third surface of the capacitor body is smaller than a width of the first capacitance forming portion, and A sum of widths of corresponding portions of the plurality of second lead-out portions exposed to the fourth surface of the capacitor body is smaller than a width of the second capacitance forming portion.

19. The multilayer capacitor according to claim 13, wherein The plurality of first lead-out portions include two first lead-out portions, and the plurality of second lead-out portions include two second lead-out portions.

20. The multilayer capacitor of claim 13, wherein: The plurality of first lead-out portions include four first lead-out portions, and the plurality of second lead-out portions include four second lead-out portions.

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