Wafer lossless cutting equipment capable of eliminating edge cracking and warping and cutting process

Abstract

The invention relates to the technical field of wafer cutting processing, in particular to wafer lossless cutting equipment capable of eliminating edge cracking and warping and a cutting process, and the wafer lossless cutting equipment comprises a base, a cutting machine and a bearing seat; a clamping unit for clamping a wafer is arranged on the periphery of the bearing seat, the clamping unit comprises a plurality of clamping seats evenly distributed around the bearing seat, the bearing seat is of a circular structure, the clamping seats are movably arranged on one side of the bearing seat in the radial direction of the bearing seat, two clamping rollers are arranged on the clamping seats in the vertical direction, and the clamping rollers are arranged on the clamping seats. Two clamping rollers are arranged on the bearing seat, a gap is formed between the two clamping rollers, the clamping rollers extend in the radial direction of the bearing seat and point to the bearing seat, the clamping rollers are rotationally arranged on the clamping seat, the rotating directions of the two clamping rollers are opposite, air cavities are formed in the two clamping rollers, and an air pump communicated with the air cavities is arranged on one side of each clamping roller. The wafer can still be driven to rotate in a clamping state, so that the cutting efficiency is improved, and the working space of cutting equipment is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cutting and processing, and in particular to a wafer non-destructive cutting device and a cutting process for eliminating edge cracking and warping. Background Art

[0002] During the processing of the wafer, the wafer needs to be fixed. If the fixing effect is not ideal, the wafer may move easily, causing the cutting position to deviate, resulting in the wafer shaking easily during the cutting process, causing the wafer edge to break, reducing the processing quality of the wafer and causing waste of wafer production during processing.

[0003] Chinese patent application CN115519687A discloses an anti-chipping wafer dicing and cutting device, comprising: a base, the base having a fixed base, and a movable base installed on the top of the base, the top of the movable base is slidably connected to a lifting adjustment frame, and the base is fixedly connected to a placement rack at a position close to the movable base; a load-bearing arm, the load-bearing arm having a mounting end, and a flushing pipe installed on the outer surface of the load-bearing arm, the flushing pipe is slidably connected to the lifting adjustment frame at a position away from the load-bearing arm, the load-bearing arm is rotatably connected to a cutting wheel at a position away from the lifting adjustment frame, and the load-bearing arm is far away from the lifting adjustment frame. The position away from the cutting wheel is fixedly connected to the lifting and adjusting frame, and the placing frame includes: a rotating rod, the rotating rod has a motor, and a displacement plate installed on the outer surface of the rotating rod, the bottom of the displacement plate is located on both sides of the rotating rod and is rotatably connected to a guide frame, the top of the displacement plate is fixedly connected to a protective frame, and the top of the protective frame is connected to a mounting tube; a rotating end, the rotating end has a rotating column, and an assembly frame installed at the rotating end near the load-bearing arm, the assembly frame extends to the outside of the lifting and adjusting frame away from the rotating end, and the rotating end is rotatably connected to the lifting and adjusting frame at a position away from the assembly frame.

[0004] Although the above solution can clamp the wafer, the fixed wafer cannot be moved, and the efficiency of cutting is low. That is, the machine needs to be stopped continuously during cutting, and then the wafer is rotated, and then cut again. This process can be repeated many times to complete the cutting of the wafer. After cutting, the wafer needs to be transferred and the periphery of the wafer needs to be polished, which is inefficient. If a mechanism is set for the cutter to rotate around the wafer, the space occupied by the entire device will be larger. Summary of the invention

[0005] In view of the above problems, a non-destructive wafer cutting device and a cutting process are provided to eliminate edge cracking and warping. A plurality of clamping seats are arranged around a receiving seat, and two vertically arranged clamping rollers are arranged on the clamping seats. The wafer is allowed to rotate around the axis of the receiving seat after being clamped by the clamping rollers, thereby reducing the working space of the cutting machine. At the same time, the requirement that the wafer can still rotate normally in the clamped state is achieved, thereby improving the cutting efficiency.

[0006] To solve the problems of the prior art, the present invention provides a non-destructive wafer cutting device for eliminating edge cracking and warping, comprising a base and a cutting machine arranged above the base, wherein a receiving seat for receiving the wafer is arranged on the upper part of the base; a clamping unit for clamping the wafer is arranged around the receiving seat, the clamping unit comprising a plurality of clamping seats evenly distributed around the receiving seat, the receiving seat being a circular structure, the clamping seat being movable along the radial direction of the receiving seat and arranged on one side of the receiving seat, two clamping rollers being arranged on the clamping seat in a vertical direction, and a gap being present between the two clamping rollers, the clamping rollers extending along the radial direction of the receiving seat and pointing to the receiving seat, the clamping rollers being rotatably arranged on the clamping seat, the two clamping rollers having opposite rotation directions, air cavities being present in the two clamping rollers, an air pump connected to the air cavity being arranged on one side of the clamping roller, and when the clamping unit clamps the wafer on the receiving seat, the air pump inflates the air cavity, and the wafer is located in the gap between the two clamping rollers and contacts with the outer peripheral walls of the two clamping rollers.

[0007] Preferably, the side wall of the clamping seat facing the receiving seat is an arc-shaped structure, the axis of the arc-shaped structure is colinear with the axis of the receiving seat, and limiting rollers are respectively arranged on both sides of the arc-shaped structure for vertical rotation. The peripheral wall of the limiting roller protrudes from one side of the clamping seat, and the clamping seat contacts the edge of the chip through the limiting roller, and the limiting roller and the edge of the chip are rollingly matched.

[0008] Preferably, a grinding unit is also provided on the clamping seat, and a telescopic groove is horizontally opened on one side of the clamping seat facing the receiving seat, and the extension direction of the telescopic groove is parallel to the moving direction of the clamping seat. A grinding rod is arranged in the telescopic groove for movement along the extension direction of the telescopic groove, and the grinding rod can rotate around its own vertical direction, and the rotation direction of the grinding rod is opposite to the rotation direction of the chip.

[0009] Preferably, a driving unit for driving the clamping roller to rotate is provided on the clamping seat, and the driving unit includes a first gear and a second gear respectively arranged at the ends of two clamping rollers on the same clamping seat, the first gear and the second gear are meshed with each other, a third gear is arranged on the upper part of the first gear, the third gear is meshed with the first gear, and a rotating driver for driving the third gear to rotate is arranged at the end of the third gear.

[0010] Preferably, a transmission unit is provided between the third gear and the polishing rod, and the third gear drives the polishing rod to rotate through the transmission unit.

[0011] Preferably, the transmission unit comprises a synchronous belt, and a tensioning unit for tensioning the synchronous belt is arranged in the inner ring of the synchronous belt, and the tensioning unit comprises a tensioning wheel rollingly engaged with the side wall of the inner ring of the synchronous belt.

[0012] Preferably, a pushing unit for driving the clamping seat to move is provided on the clamping seat, the pushing unit includes a pushing groove arranged on the periphery of the clamping seat, the extension direction of the pushing groove is parallel to the moving direction of the clamping seat, the clamping seat is movable in the pushing groove, and a corrugated sleeve is provided between the clamping seat and the end of the pushing groove along the extension direction of the pushing groove.

[0013] Preferably, a lower pressure plate is provided on the socket seat for movement along the axis of the socket seat, a socket sleeve is provided at the lower part of the lower pressure plate, the lower pressure plate extends into the socket sleeve and slidably cooperates with the socket sleeve, an extrusion chamber is formed in the socket sleeve, when the lower pressure plate descends, the air in the extrusion chamber is discharged, an elastic tank is provided on one side of the socket sleeve, a one-way valve is provided between the elastic tank and the socket sleeve to connect the two, the one-way valve allows the air in the extrusion chamber to flow into the elastic tank, a first switch valve is also provided on the side of the elastic tank, the elastic tank is connected to the corrugated sleeve through the first switch valve.

[0014] Preferably, a third spring is vertically arranged in the receiving sleeve, and both ends of the third spring are fixedly connected to the lower end of the lower pressure plate and the bottom of the receiving sleeve respectively, a return pipe is arranged at the end of the corrugated sleeve away from the clamping seat, a second switch valve is arranged on the return pipe, a third switch valve is arranged at the bottom of the receiving sleeve, and a second electromagnet capable of adsorbing the clamping seat is arranged at the end of the pushing groove away from the receiving seat.

[0015] The present invention also relates to a non-destructive wafer cutting process for eliminating edge chipping and warping, using a non-destructive wafer cutting device for eliminating edge chipping and warping, and the specific steps are as follows:

[0016] S1. The clamping seat has a first stop position and a second stop position when moving along the radial direction of the receiving seat. When the clamping seat is at the first stop position, the clamping seat arranged around the receiving seat is in an open state, and the wafer is placed on the receiving seat from the top.

[0017] S2. After the wafer is placed on the receiving seat, all the clamping seats arranged around the receiving seat move synchronously, the clamping seats move from the first stop position to the second stop position, the clamping seats arranged around the receiving seat gradually shrink, and the two clamping rollers arranged on the clamping seats pass through the upper and lower parts of the wafer respectively when the clamping seats shrink, so that the wafer is located in the gap between the two clamping rollers.

[0018] S3. Then the air pump inflates the air cavity of the clamping roller. After the two clamping rollers contact the upper and lower parts of the wafer respectively, the cutting machine descends to contact the edge of the wafer and starts. Then the two clamping rollers rotate, and the wafer starts to rotate around the axis of the receiving seat.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. When cutting the wafer, the two clamping rollers on the clamping seat can contact the upper and lower parts of the wafer respectively, and the two clamping rollers start to rotate synchronously in opposite directions, and the wafer rotates around the axis of the receiving seat, so that the cutting machine no longer needs to rotate around the wafer, reducing the space occupied by the cutting equipment. At the same time, the wafer is clamped by the clamping unit, and the wafer is driven to rotate after clamping, without the need to rotate the wafer manually, thereby improving the cutting efficiency.

[0021] 2. By arranging a limiting roller on the clamping seat, the wafer can be stably clamped by the limiting roller around the receiving seat, and one side of the clamping seat with the limiting roller is an arc structure, so that the clamping seat can better fit the edge of the wafer when clamping the edge of the wafer through the limiting roller. At the same time, an air cavity is arranged on the limiting roller and the clamping roller made of rubber material, so that the wafer will not be damaged after contact with the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A three-dimensional schematic diagram of a wafer is provided, which is a non-destructive wafer cutting device that eliminates edge cracking and warping.

[0023] Figure 2 A side view of a non-destructive wafer dicing device that eliminates edge chipping and warping.

[0024] Figure 3 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 2 Schematic cross-sectional view at AA in the middle.

[0025] Figure 4 The invention is a three-dimensional schematic diagram of a cutaway view of a non-destructive wafer cutting device for eliminating edge chipping and warping.

[0026] Figure 5 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A local enlarged schematic diagram of point B in the middle.

[0027] Figure 6 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A partial enlarged schematic diagram of point C in the middle.

[0028] Figure 7 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A partial enlarged schematic diagram of point D in the middle.

[0029] Figure 8 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4A partial enlarged schematic diagram of point E in the middle.

[0030] Fig. 9 It is a three-dimensional schematic diagram of a wafer non-destructive cutting device that eliminates edge cracking and warping.

[0031] Fig.10 It is a three-dimensional schematic diagram of a wafer non-destructive cutting device that eliminates edge cracking and warping, with the base removed.

[0032] Fig.11 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Fig.10 A partial enlarged schematic diagram of point F in the middle.

[0033] Fig.12 The invention discloses a three-dimensional schematic diagram of a wafer non-destructive cutting device for eliminating edge chipping and warping, and a clamping seat provided with a pushing unit.

[0034] The numbers in the figure are:

[0035] 1. Base; 2. Cutting machine; 3. Wafer; 4. Clamping unit; 41. Clamping seat; 42. Clamping roller; 43. Air pump; 44. Limiting roller; 45. Grinding unit; 451. Telescopic slot; 452. Grinding rod; 46. Driving unit; 461. Rotary driver; 462. First gear; 463. Second gear; 464. Third gear; 47. Transmission unit; 471. First bevel gear; 472. Second bevel gear; 473. First synchronous wheel; 474. Second synchronous wheel; 475. Synchronous belt; 476. First electromagnet; 477. First elastic Spring; 478, first translation block; 479, tensioning unit; 4791, tensioning wheel; 4792, second translation block; 4793, second spring; 48, pushing unit; 481, pushing groove; 4811, second electromagnet; 482, corrugated sleeve; 483, lower pressure plate; 4831, second receiving wheel; 484, receiving sleeve; 485, one-way valve; 486, elastic tank; 487, first switch valve; 488, third spring; 489, return pipe; 4891, second switch valve; 4892, third switch valve; 5, receiving seat; 51, first receiving wheel. DETAILED DESCRIPTION

[0036] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] Reference Figure 1-Figure 4 , Figure 6 and Figure 7: A non-destructive wafer cutting device for eliminating edge cracking and warping, comprising a base 1 and a cutting machine 2 arranged above the base 1, a receiving seat 5 for receiving a wafer 3 is arranged on the upper part of the base 1; a clamping unit 4 for clamping the wafer 3 is arranged around the receiving seat 5, the clamping unit 4 comprises a plurality of clamping seats 41 evenly distributed around the receiving seat 5, the receiving seat 5 is a circular structure, the clamping seat 41 is arranged on one side of the receiving seat 5 in a radial direction of the receiving seat 5, and two clamping rollers are arranged on the clamping seat 41 in a vertical direction. 42, and there is a gap between the two clamping rollers 42, the clamping rollers 42 extend along the radial direction of the receiving seat 5 and point to the receiving seat 5, the clamping rollers 42 are rotatably set on the clamping seat 41, and the rotation directions of the two clamping rollers 42 are opposite. There are air cavities in the two clamping rollers 42, and an air pump 43 connected to the air cavity is set on one side of the clamping rollers 42. When the clamping unit 4 clamps the chip 3 on the receiving seat 5, the air pump 43 inflates the air cavity, and the chip 3 is located in the gap between the two clamping rollers 42 and contacts with the outer peripheral walls of the two clamping rollers 42.

[0038] In the existing chip 3 cutting equipment, when cutting the edge of the chip 3, the cutting is usually completed by rotating the cutting machine 2 around the chip 3. The rotation of the cutting machine 2 around the chip 3 causes the cutting equipment to occupy a large space. At the same time, in order to ensure that the working area of ​​the cutting machine 2 is not obstructed, the chip 3 being cut cannot be stably fixed. During cutting, the chip 3 is prone to shaking, which in turn causes the edge of the chip 3 to crack and warp. If the position of the cutting machine 2 is fixed and the clamping stability is to be ensured, the chip 3 needs to be manually adjusted and rotated regularly during cutting, which is inefficient.

[0039] In order to avoid the above situation, the position of the cutting machine 2 is fixed so that the cutting machine 2 no longer rotates around the wafer 3, and the clamping unit 4 is further optimized so that the wafer 3 itself rotates. A plurality of first receiving wheels 51 are arranged on the upper part of the receiving seat 5, and the first receiving wheels 51 are arranged on the receiving seat 5 in a rotatable manner along the radial direction of the receiving seat 5. The plurality of first receiving wheels 51 are evenly arranged around the axis of the receiving seat 5, and the wafer 3 placed on the receiving seat 5 is received by the first receiving wheels 51. In this way, when the wafer 3 rotates, the lower part of the wafer 3 will not directly rub against the upper part of the receiving seat 5, but will roll with the lower part of the wafer 3 through the first receiving wheels 51, thereby reducing the friction coefficient and avoiding the situation where the wafer 3 is damaged due to a large friction coefficient. The clamping seat 41 has a first stop position and a second stop position when moving along the radial direction of the receiving seat 5, and the first stop position is farther from the receiving seat 5 than the second stop position. When the wafer 3 is cut, the clamping seat 41 is located at the first stop position. At this time, all the clamping seats 41 arranged around the receiving seat 5 are in an open state. When the wafer 3 is placed on the receiving seat 5, the two clamping rollers 42 arranged on the clamping seat 41 will not hinder the wafer 3. After the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 begin to shrink, that is, at this time, the clamping seat 41 moves from the first stop position to the second stop position. During the movement of the clamping seat 41, the two clamping rollers 42 on the clamping seat 41 pass through the upper and lower parts of the wafer 3 respectively. When the clamping seat 41 moves to the second stop position, the clamping seat 41 stops moving, and at this time, the wafer 3 is located in the gap between the two clamping rollers 42, and the outer peripheries of the two clamping rollers 42 do not contact the upper and lower parts of the wafer 3. Then the air pump 43 starts to inflate the air cavity. After the air cavity is inflated, the outer peripheral walls of the two clamping rollers 42 can contact the upper and lower parts of the wafer 3 respectively, and the two clamping rollers 42 start to rotate synchronously in opposite directions. In this way, driven by the two clamping rollers 42, the wafer 3 starts to rotate around the axis of the receiving seat 5. Before the clamping rollers 42 start to rotate, the cutting machine 2 first descends and contacts the edge of the wafer 3. At the same time, the cutting machine 2 starts to run before the clamping rollers 42, and then the clamping rollers 42 start to rotate. In this way, the cutting machine 2 no longer needs to rotate around the wafer 3, reducing the space occupied by the cutting equipment. At the same time, the wafer 3 is clamped by the clamping unit 4, and the wafer 3 is driven to rotate after clamping. There is no need to rotate the wafer 3 manually, which improves the cutting efficiency.

[0040] Reference Figure 6 The side wall of the clamping seat 41 facing the receiving seat 5 is an arc-shaped structure, the axis of the arc-shaped structure is colinear with the axis of the receiving seat 5, and limiting rollers 44 are respectively arranged on both sides of the arc-shaped structure for vertical rotation. The peripheral wall of the limiting roller 44 protrudes from one side of the clamping seat 41, and the clamping seat 41 contacts the edge of the chip 3 through the limiting roller 44, and the limiting roller 44 rolls with the edge of the chip 3.

[0041] The limiting roller 44 is preferably made of rubber material, which ensures that when the limiting roller 44 contacts the edge of the chip 3, the edge of the chip 3 will not be crushed by the limiting roller 44. By arranging two limiting rollers 44 on the side wall of the clamping seat 41, the chip 3 is prevented from shaking after being clamped, thereby preventing the edge of the chip 3 from cracking and warping due to shaking during cutting.

[0042] Reference Figure 6 and Fig.12 : A grinding unit 45 is also provided on the clamping seat 41, and a telescopic groove 451 is horizontally opened on one side of the clamping seat 41 facing the receiving seat 5, and the extension direction of the telescopic groove 451 is parallel to the moving direction of the clamping seat 41. A grinding rod 452 is arranged in the telescopic groove 451 and moves along the extension direction of the telescopic groove 451, and the grinding rod 452 can rotate around its own vertical direction, and the rotation direction of the grinding rod 452 is opposite to the rotation direction of the chip 3.

[0043] When the wafer 3 is placed on the receiving seat 5, the grinding rod 452 is retracted into the telescopic groove 451. At this time, the grinding rod 452 will not contact the edge of the wafer 3. When the wafer 3 is placed on the receiving seat 5 and the clamping roller 42 starts to drive the wafer 3 to rotate, the grinding rod 452 located in the telescopic groove 451 starts to extend. The grinding rod 452 can rotate around its own axis, and the rotation direction of the grinding rod 452 is opposite to the rotation direction of the wafer 3. This improves the grinding efficiency of the grinding rod 452 for the edge of the wafer 3, avoids the occurrence of burrs on the edge of the wafer 3 after being cut, and ensures the smoothness of the edge of the wafer 3.

[0044] Reference Figure 5 and Fig.10 : A driving unit 46 for driving the clamping roller 42 to rotate is arranged on the clamping seat 41, and the driving unit 46 includes a first gear 462 and a second gear 463 which are respectively arranged at the ends of two clamping rollers 42 on the same clamping seat 41, the first gear 462 and the second gear 463 are meshed with each other, and a third gear 464 is arranged on the upper part of the first gear 462, the third gear 464 is meshed with the first gear 462, and a rotation driver 461 for driving the third gear 464 to rotate is arranged at the end of the third gear 464.

[0045] The rotary driver 461 is preferably a servo motor. When the rotary driver 461 is started, the rotary driver 461 drives the third gear 464 to rotate, thereby causing the second gear 463 and the first gear 462 to rotate synchronously. Driven by the first gear 462 and the second gear 463, the two clamping rollers 42 arranged on the same clamping seat 41 rotate synchronously in opposite directions, so that the chip 3 located between the two clamping rollers 42 can rotate around the axis of the receiving seat 5.

[0046] Reference Figure 5 , Fig.10 , Fig.11 and Fig.12 : A transmission unit 47 is provided between the third gear 464 and the polishing rod 452, and the third gear 464 drives the polishing rod 452 to rotate through the transmission unit 47.

[0047] The transmission unit 47 includes a first bevel gear 471 fixedly arranged at the end of the third gear 464, a second bevel gear 472 is rotatably arranged on one side of the first bevel gear 471, the axis of the second bevel gear 472 is in a vertical state, a first synchronous wheel 473 and a second synchronous wheel 474 are fixedly arranged at the end of the second bevel gear 472 and the upper end of the grinding rod 452, respectively, a synchronous belt 475 is sleeved on the first synchronous wheel 473 and the second synchronous wheel 474, and the synchronous belt 475 is respectively connected to the first synchronous wheel 473 and the second synchronous wheel 474. 74 transmission cooperation, a first translation groove is opened on the upper part of the clamping seat 41 along the moving direction of the clamping seat 41, and a first translation block 478 is arranged in the first translation groove for movement along the extension direction of the first translation groove. There is a first gap between the side of the first translation block 478 away from the receiving seat 5 and the end of the first translation groove, and a first spring 477 is arranged in the first gap. The two ends of the first spring 477 are fixedly connected to the first translation block 478 and the end of the first translation groove respectively, and the grinding rod 452 moves synchronously with the first translation block 478.

[0048] Reference Fig.11 and Fig.12 The transmission unit 47 includes a synchronous belt 475 , and a tensioning unit 479 for tensioning the synchronous belt 475 is arranged on the inner ring side of the synchronous belt 475 . The tensioning unit 479 includes a tensioning wheel 4791 rotatably arranged on the inner ring side of the synchronous belt 475 .

[0049] A second translation slot is also provided at the upper part of the clamping seat 41, in which a second translation block 4792 is movably provided along the extension direction of the second translation slot, a tensioning wheel 4791 is rotatably provided at the upper part of the second translation block 4792, a second gap exists between the second translation block 4792 and the end of the second translation slot, a second spring 4793 is provided in the second gap along the movement direction of the second translation block 4792, and the two ends of the second spring 4793 are fixedly connected to the second translation block 4792 and the end of the second translation slot respectively. The first translation slot is communicated with the telescopic slot 451, and when the second synchronous wheel 474 rotates, the grinding rod 452 rotates synchronously with the second synchronous wheel 474. When the wafer 3 needs to be placed on the receiving seat 5, the clamping seat 41 is located at the first stop position, and the first electromagnet 476 is energized, the first electromagnet 476 attracts the first translation block 478, and the first spring 477 is compressed. Since the grinding rod 452 moves synchronously with the first translation block 478, when the first translation block 478 is adsorbed by the first electromagnet 476, the grinding rod 452 retracts into the telescopic groove 451. When the wafer 3 is placed on the receiving seat 5, the edge of the wafer 3 will not be scratched by the grinding rod 452. After the wafer 3 is placed, the clamping seat 41 retracts. , and the limiting roller 44 contacts the edge of the wafer 3. After the air cavity in the clamping roller 42 is inflated, the rotary driver 461 is started. The rotary driver 461 can not only drive the two clamping rollers 42 to rotate, but also drive the first synchronous wheel 473 to rotate through the first bevel gear 471 and the second bevel gear 472. Under the action of the synchronous belt 475, the second synchronous wheel 474 can also be driven to rotate. The tensioning unit 479 arranged at the inner ring of the synchronous belt 475 is to ensure that the synchronous belt 475 can stably cooperate with the first synchronous wheel 473 and the second synchronous wheel 474. After the clamping roller 42 starts to rotate, that is, after the rotary driver 461 is started, the power of the first electromagnet 476 gradually decreases until it is powered off, so as to avoid the first spring 477 from quickly pushing out the first translation block 478 during the resetting process, thereby causing the grinding rod 452 to quickly hit the edge of the wafer 3, thereby ensuring that the edge of the wafer 3 will not be damaged when it contacts the grinding rod 452.

[0050] Reference Figure 7 , Fig.10 and Fig.12 : A pushing unit 48 for driving the clamping seat 41 to move is arranged on the clamping seat 41, and the pushing unit 48 includes a pushing groove 481 arranged on the periphery of the clamping seat 41, and the extension direction of the pushing groove 481 is parallel to the moving direction of the clamping seat 41. The clamping seat 41 is moved and arranged in the pushing groove 481, and a corrugated sleeve 482 is arranged between the clamping seat 41 and the end of the pushing groove 481 along the extension direction of the pushing groove 481.

[0051] When the bellows sleeve 482 is inflated, the clamping seat 41 moves toward the receiving seat 5 . When the air in the bellows sleeve 482 is discharged, the clamping seat 41 moves in a direction away from the receiving seat 5 .

[0052] Reference Figure 7 and Figure 8 : A lower pressure plate 483 is provided on the receiving seat 5 so as to move along the axis of the receiving seat 5, and a receiving sleeve 484 is provided at the lower part of the lower pressure plate 483. The lower pressure plate 483 extends into the receiving sleeve 484 and slides with the receiving sleeve 484 to form an extrusion chamber. When the lower pressure plate 483 descends, the air in the extrusion chamber is discharged, and an elastic tank 486 is provided on one side of the receiving sleeve 484. A one-way valve 485 is provided between the elastic tank 486 and the receiving sleeve 484 to connect the two. The one-way valve 485 allows the air in the extrusion chamber to flow into the elastic tank 486. A first switch valve 487 is also provided on the side of the elastic tank 486, and the elastic tank 486 is connected to the corrugated sleeve 482 through the first switch valve 487.

[0053] A plurality of second receiving wheels 4831 are evenly arranged on the upper part of the lower pressure plate 483 around the axis of the lower pressure plate 483 , and the second receiving wheels 4831 are rotatably arranged on the lower pressure plate 483 .

[0054] Reference Figure 7 , Figure 8 and Fig.12 : A third spring 488 is vertically arranged in the receiving sleeve 484, and the two ends of the third spring 488 are fixedly connected to the lower end of the lower pressure plate 483 and the bottom of the receiving sleeve 484 respectively, a return pipe 489 is arranged at the end of the corrugated sleeve 482 away from the clamping seat 41, and a second switch valve 4891 is arranged on the return pipe 489, and a third switch valve 4892 is arranged at the bottom of the receiving sleeve 484, and a second electromagnet 4811 capable of adsorbing the clamping seat 41 is arranged at the end of the pushing groove 481 away from the receiving seat 5.

[0055] When placing the wafer 3, the lower pressure plate 483 is pressed down by the wafer 3, and the lower pressure plate 483 squeezes the extrusion cavity in the receiving sleeve 484, and the third spring 488 in the extrusion cavity is also squeezed. At this time, the first switch valve 487, the second switch valve 4891 and the third switch valve 4892 are all in a closed state. At this time, the air in the extrusion cavity flows into the elastic tank 486 through the one-way valve 485. Due to the one-way action of the one-way valve 485, the third spring 488 cannot lift the lower pressure plate 483, thereby preventing the lower pressure plate 483 from being lifted again after being pressed down by the wafer 3. Then the first switch valve 487 is opened, and the air stored in the elastic tank 486 flows into the bellows and pushes the clamping seat 41. In order to prevent the limiting roller 44 on the clamping seat 41 from directly colliding with the edge of the wafer 3, a damper is provided at one end of the pushing groove 481 close to the receiving seat 5, and the damper has a slowing effect on the moving speed of the clamping seat 41. When the processing of the chip 3 is completed, the second switch valve 4891 is opened, the first switch valve 487 is closed, and the second electromagnet 4811 is energized to attract the clamping seat 41, so that the clamping seat 41 can move from the second stop position to the first stop position, and the clamping roller 42 on the clamping seat 41 is withdrawn from the chip 3, and the chip 3 can be smoothly taken out from the receiving seat 5, and then the third switch valve 4892 is opened, and the third spring 488 drives the lower pressure plate 483 to rise, and the outside air enters the extrusion chamber through the third switch valve 4892.

[0056] Reference Figure 1-Figure 12 The present invention also relates to a non-destructive wafer cutting process for eliminating edge chipping and warping, using a non-destructive wafer cutting device for eliminating edge chipping and warping, and the specific steps are as follows:

[0057] S1, the clamping seat 41 has a first stop position and a second stop position when moving along the radial direction of the receiving seat 5. When the clamping seat 41 is at the first stop position, the clamping seat 41 arranged around the receiving seat 5 is in an open state, and the wafer 3 is placed on the receiving seat 5 from the top;

[0058] S2, after the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 move synchronously, the clamping seats 41 move from the first stop position to the second stop position, the clamping seats 41 arranged around the receiving seat 5 gradually shrink, and the two clamping rollers 42 arranged on the clamping seats 41 pass through the upper and lower parts of the wafer 3 respectively when the clamping seats 41 shrink, so that the wafer 3 is located in the gap between the two clamping rollers 42;

[0059] S3. Then the air pump 43 inflates the air cavity of the clamping roller 42. After the two clamping rollers 42 contact the upper and lower parts of the wafer 3 respectively, the cutting machine 2 descends to contact the edge of the wafer 3 and starts. Then the two clamping rollers 42 rotate, and the wafer 3 begins to rotate around the axis of the receiving seat 5.

[0060] Working principle: When the wafer 3 is cut, the clamping seat 41 is located at the first stop position. At this time, all the clamping seats 41 arranged around the receiving seat 5 are in an open state. When the wafer 3 is placed on the receiving seat 5, the two clamping rollers 42 arranged on the clamping seat 41 will not hinder the wafer 3. After the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 begin to shrink, that is, at this time, the clamping seat 41 moves from the first stop position to the second stop position. During the movement of the clamping seat 41, the two clamping rollers 42 on the clamping seat 41 pass through the upper and lower parts of the wafer 3 respectively. When the clamping seat 41 moves to the second stop position, the clamping seat 41 stops moving, and at this time the wafer 3 is located in the gap between the two clamping rollers 42, and the outer periphery of the two clamping rollers 42 does not contact the upper and lower parts of the wafer 3. Then the air pump 43 starts to inflate the air cavity. After the air cavity is inflated, the outer peripheral walls of the two clamping rollers 42 can contact the upper and lower parts of the wafer 3 respectively, and the two clamping rollers 42 start to rotate synchronously in opposite directions. In this way, driven by the two clamping rollers 42, the wafer 3 starts to rotate around the axis of the receiving seat 5. Before the clamping rollers 42 start to rotate, the cutting machine 2 first descends and contacts the edge of the wafer 3. At the same time, the cutting machine 2 starts to run before the clamping rollers 42, and then the clamping rollers 42 start to rotate, so that the cutting machine 2 no longer needs to rotate around the wafer 3.

[0061] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the protection scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A non-destructive wafer cutting device for eliminating edge cracking and warping, comprising a base (1) and a cutting machine (2) arranged above the base (1), wherein a receiving seat (5) for receiving a wafer (3) is arranged on the upper part of the base (1); It is characterized in that A clamping unit (4) for clamping the wafer (3) is arranged around the receiving seat (5), the clamping unit (4) comprises a plurality of clamping seats (41) evenly distributed around the receiving seat (5), the receiving seat (5) is a circular structure, the clamping seat (41) is arranged on one side of the receiving seat (5) in a radial direction of the receiving seat (5), two clamping rollers (42) are arranged in a vertical direction on the clamping seat (41), and a gap exists between the two clamping rollers (42), and the clamping rollers (42) are arranged in a radial direction of the receiving seat (5). The two clamping rollers (42) are rotatably arranged on the clamping seat (41), and the rotation directions of the two clamping rollers (42) are opposite. There are air cavities in the two clamping rollers (42). An air pump (43) connected to the air cavity is arranged on one side of the clamping rollers (42). When the clamping unit (4) clamps the chip (3) on the receiving seat (5), the air pump (43) inflates the air cavity, and the chip (3) is located in the gap between the two clamping rollers (42) and contacts the outer peripheral walls of the two clamping rollers (42).

2. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: The side wall of the clamping seat (41) facing the receiving seat (5) is an arc-shaped structure, the axis of the arc-shaped structure is colinear with the axis of the receiving seat (5), and limiting rollers (44) are respectively arranged on both sides of the arc-shaped structure for vertical rotation, and part of the peripheral wall of the limiting roller (44) protrudes outward from one side of the clamping seat (41), and the clamping seat (41) contacts the edge of the chip (3) through the limiting roller (44), and the limiting roller (44) and the edge of the chip (3) are rollingly matched.

3. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: A grinding unit (45) is also provided on the clamping seat (41), and a telescopic groove (451) is horizontally provided on one side of the clamping seat (41) facing the receiving seat (5), the extension direction of the telescopic groove (451) is parallel to the moving direction of the clamping seat (41), and a grinding rod (452) is provided in the telescopic groove (451) to move along the extension direction of the telescopic groove (451), and the grinding rod (452) can rotate around its own vertical direction, and the rotation direction of the grinding rod (452) is opposite to the rotation direction of the wafer (3).

4. The wafer non-destructive cutting device for eliminating edge chipping and warping according to claim 3, characterized in that: A driving unit (46) for driving the clamping roller (42) to rotate is arranged on the clamping seat (41), and the driving unit (46) includes a first gear (462) and a second gear (463) respectively arranged at the ends of two clamping rollers (42) on the same clamping seat (41), the first gear (462) and the second gear (463) are meshed with each other, a third gear (464) is arranged above the first gear (462), the third gear (464) is meshed with the first gear (462), and a rotation driver (461) for driving the third gear (464) to rotate is arranged at the end of the third gear (464).

5. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 4, characterized in that: A transmission unit (47) is provided between the third gear (464) and the grinding rod (452), and the third gear (464) drives the grinding rod (452) to rotate via the transmission unit (47).

6. The wafer non-destructive cutting device for eliminating edge chipping and warping according to claim 5, characterized in that: The transmission unit (47) includes a synchronous belt (475), and a tensioning unit (479) for tensioning the synchronous belt (475) is arranged in the inner ring of the synchronous belt (475). The tensioning unit (479) includes a tensioning wheel (4791) that rolls with the side wall of the inner ring of the synchronous belt (475).

7. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: A pushing unit (48) for driving the clamping seat (41) to move is arranged on the clamping seat (41), and the pushing unit (48) includes a pushing groove (481) arranged on the periphery of the clamping seat (41), and the extension direction of the pushing groove (481) is parallel to the movement direction of the clamping seat (41), and the clamping seat (41) is movably arranged in the pushing groove (481), and a corrugated sleeve (482) is arranged between the clamping seat (41) and the end of the pushing groove (481) along the extension direction of the pushing groove (481).

8. The wafer non-destructive cutting device for eliminating edge chipping and warping according to claim 7, characterized in that: A lower pressure plate (483) is provided on the receiving seat (5) so as to move along the axis of the receiving seat (5), and a receiving sleeve (484) is provided at the lower part of the lower pressure plate (483). The lower pressure plate (483) extends into the receiving sleeve (484) and is slidably matched with the receiving sleeve (484). An extrusion chamber is formed in the receiving sleeve (484). When the lower pressure plate (483) descends, the air in the extrusion chamber is discharged. An elastic tank (486) is provided on one side of the receiving sleeve (484), and a one-way valve (485) is provided between the elastic tank (486) and the receiving sleeve (484) to connect the two. The one-way valve (485) allows the air in the extrusion chamber to flow into the elastic tank (486). A first switch valve (487) is also provided on the side of the elastic tank (486), and the elastic tank (486) is connected to the corrugated sleeve (482) through the first switch valve (487).

9. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 8, characterized in that: A third spring (488) is vertically arranged in the receiving sleeve (484), and the two ends of the third spring (488) are fixedly connected to the lower end of the lower pressure plate (483) and the bottom of the receiving sleeve (484) respectively. A return pipe (489) is arranged at the end of the corrugated sleeve (482) away from the clamping seat (41), and a second switch valve (4891) is arranged on the return pipe (489). A third switch valve (4892) is arranged at the bottom of the receiving sleeve (484), and a second electromagnet (4811) capable of adsorbing the clamping seat (41) is arranged at the end of the pushing groove (481) away from the receiving seat (5).

10. A non-destructive wafer cutting process for eliminating edge chipping and warping, using a non-destructive wafer cutting device for eliminating edge chipping and warping as claimed in any one of claims 1 to 9, characterized in that: The specific steps are as follows: S1, the clamping seat (41) has a first stop position and a second stop position when moving along the radial direction of the receiving seat (5), when the clamping seat (41) is located at the first stop position, the clamping seat (41) arranged around the receiving seat (5) is in an open state, and the wafer (3) is placed on the receiving seat (5) from the top; S2, after the wafer (3) is placed on the receiving seat (5), all the clamping seats (41) arranged around the receiving seat (5) move synchronously, the clamping seats (41) move from the first stop position to the second stop position, the clamping seats (41) arranged around the receiving seat (5) gradually shrink, and the two clamping rollers (42) arranged on the clamping seats (41) respectively pass through the upper part and the lower part of the wafer (3) when the clamping seats (41) shrink, so that the wafer (3) is located in the gap between the two clamping rollers (42); S3. Then, the air pump (43) inflates the air cavity of the clamping roller (42). After the two clamping rollers (42) respectively contact the upper and lower parts of the wafer (3), the cutting machine (2) descends to contact the edge of the wafer (3) and starts. Then, the two clamping rollers (42) rotate, and the wafer (3) begins to rotate around the axis of the receiving seat (5).

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