All-in-one machine for IV detection of 0BB silicon wafer

By designing an IV detection all-in-one machine for 0BB silicon wafers, integrating IV and EL detection structures, and using UVW bias correction alignment components and modules, efficient detection of 0BB silicon wafers is achieved, which solves the problem of detection difficulties after the main gate line is cancelled in the new silicon wafers, and improves detection efficiency and yield.

CN119581372APending Publication Date: 2025-03-07FOLUNGWIN AUTOMATIC EQUIP CO LTD
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Patent Information

Application Number
CN202411727426.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-03-07

AI Technical Summary

Technical Problem

In existing silicon wafers, the existence of the front main gate line affects the light absorption efficiency of the solar cell, and after the main gate line is cancelled in the new 0BB silicon wafer, quality detection becomes difficult, affecting the detection of yield.

Method used

Design an IV detection integrated machine for 0BB silicon wafers. By integrating the IV detection structure and EL detection structure, the electrical performance detection of single-chip silicon wafers is realized, and the UVW deviation correction alignment component and X-axis and Y-axis modules are used to achieve accurate connection and detection.

Benefits of technology

It has realized the automation of IV and EL detection of 0BB silicon wafers, improved the detection efficiency, reduced the emergence of defective products, and met the needs of the front and rear production links.

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Abstract

The invention discloses an all-in-one machine for IV detection of an 0BB silicon wafer. The all-in-one machine comprises a front-section conveying rail, an IV detection mechanism and an EL detection mechanism. A single-piece conveying rail is arranged on the front-section conveying rail; the IV detection mechanism comprises a first working platform, a first four-station turntable and a first UVW base, the first UVW base is movably connected with a gold wire bar and a silver bar test frame in the vertical direction, an IV gold wire is mounted on the gold wire bar, and an IV silver bar is mounted on the silver bar test frame; the EL detection mechanism comprises a second working platform, a second four-station rotating disc and a second UVW base, a silver bent frame and a copper bar frame are movably connected to the second UVW base in the vertical direction, EL silver bars are installed on the silver bent frame, and EL copper bars are installed on the copper bar frame; the first UVW base and the second UVW base are each provided with a UVW deviation rectifying and aligning assembly. According to the all-in-one machine for IV detection of the 0BB silicon wafer, IV and EL detection is carried out on a single silicon wafer, work is automatically carried out, grid lines on the single silicon wafer are accurately connected, the detection efficiency is improved, the productivity is improved along with the improvement, and the requirements of previous and later production are met through an integrated multifunctional structure.
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Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, and in particular to an all-in-one machine for performing IV detection on 0BB silicon wafers. Background Art

[0002] After printing, crystalline silicon photovoltaic solar wafers need to undergo IV and EL testing. IV testing refers to testing the current-voltage characteristic curve (IV curve) of photovoltaic modules. Only silicon wafers that have passed the test and are considered good will enter the next production process equipment; while EL testing mainly detects internal defects such as hidden cracks, broken grids, cold solder joints, and broken pieces. In existing silicon wafers, there are main grid lines on the front, which will block the surface of the solar cell, affecting the cell's absorption of light and thus affecting the power generation efficiency. In subsequent new silicon wafers, the main grid lines on the front are removed, resulting in difficulties in quality inspection during the production of silicon wafers, affecting the inspection of the yield rate. Therefore, it is necessary to integrate 0BB IV and EL testing into one device. Summary of the invention

[0003] One purpose of the present invention is to provide an all-in-one machine for IV detection of OBB silicon wafers, which reduces costs and increases efficiency during the use of OBB silicon wafers. The IV detection structure for OBB is integrated with the EL detection structure to achieve electrical performance detection of single silicon wafers and reduce the occurrence of defective products.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] An all-in-one machine for performing IV detection on 0BB silicon wafers, comprising a front-end conveyor rail, an IV detection mechanism and an EL detection mechanism, wherein the IV detection mechanism is located between the front-end conveyor rail and the EL detection mechanism;

[0006] A single-piece conveyor rail is provided on the front conveyor rail;

[0007] The IV detection mechanism includes a first working platform, a first four-station turntable and a first UVW base, wherein the first four-station turntable is located in the middle of the first working platform, the first UVW base is located at both sides of the front end of the first working platform, and the first UVW base is movably connected with a gold wire row and a silver row test frame along the vertical direction, the gold wire row is installed with IV gold wire, and the silver row test frame is installed with IV silver row;

[0008] The EL detection mechanism includes a second working platform, a second four-station turntable and a second UVW base, wherein the second four-station turntable is located in the middle of the second working platform, the second UVW base is located at both sides of the front end of the second working platform, and the second UVW base is movably connected with a silver rack and a copper rack along the vertical direction, the silver rack is installed with an EL silver bar, and the copper rack is installed with an EL copper bar;

[0009] The first UVW base and the second UVW base are both equipped with UVW deflection correction and alignment components, and the UVW deflection correction and alignment components include two groups of X-axis modules and one group of Y-axis modules.

[0010] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the single-piece conveying rail.

[0011] As a preferred technical solution, a splint positioning mechanism is arranged in the middle part of the single-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning rotating wheel. The driving end of the splint positioning motor is connected with the splint positioning wheel, and the splint positioning synchronous belt is transmission-connected with the splint positioning wheel. A splint positioning support is installed on the splint positioning synchronous belt, and the splint positioning rotating wheel rotates at the upper end of the splint positioning support.

[0012] As a preferred technical solution, an air blowing and cooling pipe is provided at the front end of the single-piece conveyor rail, and an ion anti-static air knife is provided at the rear end of the single-piece conveyor rail.

[0013] As a preferred technical solution, the first four-station turntable and the second four-station turntable both include an electrical integrated slip ring, a turntable support frame and a turntable plate. The electrical integrated slip ring is fixed on the turntable support frame. The electrical integrated slip ring drives the turntable to rotate. Suction nozzles are installed on the four stations of the turntable.

[0014] As a preferred technical solution, docking conveyor rails are installed on both sides of the first four-station turntable and both sides of the second four-station turntable, and a walking linear module is arranged on the rear side of the docking conveyor rail, and a driving end of the walking linear module is connected to a transfer adsorption plate.

[0015] As a preferred technical solution, a first upper linear module and a first lower linear module are provided on the first UVW base, the first upper linear module is connected to the gold wire row, and the first lower linear module is connected to the silver row test frame; a second upper linear module and a second lower linear module are provided on the second UVW base, the second upper linear module is connected to the silver row frame, and the second lower linear module is connected to the copper row frame.

[0016] As a preferred technical solution, a first circuit board and a tension spring are provided on both sides of the gold wire bank, both ends of the IV gold wire are connected to the tension spring, a first wire is connected between the first circuit board and the tension spring, mounting grooves are provided at both ends of the silver bank test frame, the IV silver bank is inserted into the mounting groove, a pressure plate is pressed on the mounting groove, and the outer end of the IV silver bank is connected to a second wire.

[0017] As a preferred technical solution, both ends of the EL silver bar are fixed on the silver bar frame, one side of the EL silver bar is connected to a third wire, both ends of the EL copper bar are fixed on the copper bar frame, one side of the EL copper bar is connected to a fourth wire, and a number of copper needles are distributed on the EL copper bar.

[0018] The beneficial effects of the present invention are as follows: an all-in-one machine for performing IV detection on 0BB silicon wafers is provided, the all-in-one machine for performing IV detection on 0BB silicon wafers performs IV and EL detection on a single silicon wafer, works automatically, and accurately connects the gate lines on the single silicon wafer through two groups of X-axis modules and one group of Y-axis modules, thereby improving detection efficiency and increasing production capacity, and the integrated multifunctional structure meets the needs of front-end and back-end production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the overall structure of an integrated machine for performing IV detection on 0BB silicon wafers according to an embodiment;

[0021] Figure 2 It is a schematic structural diagram of the front section conveyor rail described in the embodiment;

[0022] Figure 3 This is a schematic diagram of the structure of the air blowing cooling pipe described in the embodiment;

[0023] Figure 4 It is a structural schematic diagram of the clamping plate positioning mechanism described in the embodiment;

[0024] Figure 5 This is a schematic diagram of the structure of the ion static removal air knife described in the embodiment;

[0025] Figure 6 It is a structural schematic diagram of the IV detection mechanism described in the embodiment;

[0026] Figure 7 It is a structural schematic diagram of the gold wire array described in the embodiment;

[0027] Figure 8 It is a structural schematic diagram of the silver bar test stand described in the embodiment;

[0028] Fig. 9 It is a first structural schematic diagram of the EL detection mechanism described in the embodiment;

[0029] Fig.10 It is a second structural schematic diagram of the EL detection mechanism described in the embodiment;

[0030] Fig.11 It is a structural schematic diagram of the silver rack described in the embodiment;

[0031] Fig.12 It is a structural schematic diagram of the copper rack described in the embodiment;

[0032] Fig.13 It is a structural schematic diagram of the first four-station turntable (or the second four-station turntable) described in the embodiment;

[0033] Fig.14 It is a schematic diagram of the structure of the X-axis module (or Y-axis module) described in the embodiment.

[0034] Figures 1 to 14 middle:

[0035] 1. Front conveyor rail; 101. Single-piece conveyor rail; 102. Temporary storage linear module; 103. Temporary storage frame; 104. Clamp positioning mechanism; 105. Clamp positioning motor; 106. Clamp positioning synchronous belt; 107. Clamp positioning rotating wheel; 108. Clamp positioning wheel; 109. Clamp positioning support; 110. Air blowing cooling pipe; 111. Ion anti-static air knife;

[0036] 2. IV detection mechanism; 201. First working platform; 202. First four-station turntable; 203. First UVW base; 204. Gold wire row; 205. Silver row test frame; 206. IV gold wire; 207. IV silver row; 208. X-axis module; 209. Electrical integrated slip ring; 210. Turntable support frame; 211. Turntable; 212. Suction nozzle; 213. Docking conveyor rail; 214. Walking linear module; 215. Transfer adsorption plate; 216. First upper linear module; 217. First lower linear module; 218. First circuit board; 219. Tension spring; 220. First wire; 221. Press plate; 222. Second wire; 223. Motor mounting seat; 224. Module motor; 225. Adjusting screw rod; 226. Adjusting slide; 227. Connecting bearing;

[0037] 3. EL detection mechanism; 301. second working platform; 302. second UVW base; 303. silver rack; 304. copper rack; 305. EL silver row; 306. EL copper row; 307. third wire; 308. fourth wire; 309. copper needle; 310. second four-station turntable. DETAILED DESCRIPTION

[0038] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] like Figures 1 to 14 As shown, in this embodiment, an integrated machine for IV detection of 0BB silicon wafers includes a front-end conveyor rail 1, an IV detection mechanism 2 and an EL detection mechanism 3, wherein the IV detection mechanism 2 is located between the front-end conveyor rail 1 and the EL detection mechanism 3; a single-wafer conveyor rail 101 is arranged on the front-end conveyor rail 1; the IV detection mechanism 2 includes a first working platform 201, a first four-station turntable 202 and a first UVW base 203, wherein the first four-station turntable 202 is located in the middle of the first working platform 201, and the first UVW base 203 is located on both sides of the front end of the first working platform 201, and a gold wire row 204 and a silver row test frame 205 are movably connected to the first UVW base 203 along the vertical direction, and an IV gold wire 206 is installed on the gold wire row 204, IV silver bars 207 are installed on the silver bar test frame 205; the EL detection mechanism 3 includes a second working platform 301, a second four-station turntable 310 and a second UVW base 302, the second four-station turntable 310 is located in the middle of the second working platform 301, the second UVW base 302 is located on both sides of the front end of the second working platform 301, and the second UVW base 302 is movably connected with silver bar racks 303 and copper bar racks 304 along the vertical direction, the silver bar racks 303 are installed with EL silver bars 305, and the copper bar racks 304 are installed with EL copper bars 306; UVW correction and alignment components are installed on the first UVW base 203 and the second UVW base 302, and the UVW correction and alignment components include two groups of X-axis modules 208 and one group of Y-axis modules.

[0040] In more specific structure, the X-axis module 208 and the Y-axis module both include a motor mounting seat 223, a module motor 224, an adjustment screw 225 and an adjustment slide 226. The module motor 224 is fixed on the motor mounting seat 223. The driving end of the module motor 224 is connected to the adjustment screw 225 in a transmission manner. The adjustment screw 225 is threadedly connected to the adjustment nut of the adjustment slide 226. The adjustment slide 226 slides along the length direction of the adjustment screw 225. The adjustment slide 226 has a connecting bearing 227, which slides on the adjusting screw 225. On the adjustment slide 226, the moving direction of the connecting bearing 227 is perpendicular to the moving direction of the adjustment slide 226, the edge of the UVW base is locked in the connecting bearing 227, and two groups of X-axis modules 208 plus a group of Y-axis modules jointly control the T-axis steering of the UVW base on one side. In the UVW alignment, the two groups of X-axis modules 208 and a group of Y-axis in the above structure realize the X-axis translation, Y-axis translation and T-axis rotation of the gold wire row 204, the silver row test frame 205, the silver row frame 303 and the copper row frame 304 to meet the alignment requirements.

[0041] The UVW deflection correction and alignment component is a high-precision mobile structure specially designed for high-precision alignment equipment. It is also commonly called the XXY platform. As a three-axis parallel motion mechanism, it can realize rotational motion centered on any point on the plane and translation in any direction (X, Y, and θ three-axis motion in the plane) by controlling the parallel motion of three linear moving structures. The UVW deflection correction and alignment component, in conjunction with the visual module, can realize high-precision alignment functions and can be used in the silicon wafer printing industry.

[0042] More specifically, the implementation process of the UVW correction and alignment component includes determining the transformation matrix from the camera coordinate system to the UVW platform coordinate system through a visual calibration method, as well as the coordinate value of the marker template based on the origin coordinate system on the UVW correction and alignment component, and obtaining the x, y, and θ offsets between the marker template position and the marker to be corrected (based on the origin coordinate system of the UVW correction and alignment component) through the visual module. Then, the initial coordinates of the three axes are entered according to the formula, the rotation center is set to (0, 0), and the θ offset is entered to obtain the new coordinate values ​​of the UVW three axes, the new coordinates of the object to be corrected, and the corresponding feed amounts of the three motors. This series of operations decomposes the motion process into translation and rotation parts, and calculates the motor feed amounts separately, thereby achieving precise automatic positioning, and the alignment accuracy can reach the micron level.

[0043] The single silicon wafer enters the front conveyor track 1 and is transported by the single wafer conveyor track 101. First, the first four-station turntable 202 adsorbs the single silicon wafer to the front. The gold wire row 204 and the silver row test rack 205 are respectively close to the single silicon wafer. The IV gold wire 206 and the IV silver row 207 are connected to the auxiliary grid of the 0BB. After the passage is formed, the electrical performance can be tested. Then, the second four-station turntable 310 adsorbs the single silicon wafer that has completed the IV test to the front. The silver row rack 303 and copper busbar rack 304 are respectively close to the single silicon wafer, and are connected to the silicon wafer by EL silver busbar 305 and EL copper busbar 306 to form detection of internal defects such as hidden cracks, broken gates, cold solder joints, broken pieces, etc., and finally output the single silicon wafer. In addition, on IV detection mechanism 2 and EL detection mechanism 3, the alignment of the detection mechanism and the silicon wafer relies on UVW correction and alignment components, and the activities on X-axis, Y-axis and T-axis are realized through two groups of X-axis modules 208 and one group of Y-axis modules.

[0044] A temporary storage linear module 102 is arranged on the front conveying rail 1, and a temporary storage frame 103 is arranged at the driving end of the temporary storage linear module 102. The temporary storage frame 103 moves laterally on the side of the single-piece conveying rail 101. The temporary storage frame 103 moves laterally on the side of the front conveying rail 1. When the temporary storage linear module 102 on one side is fully loaded, the other side is placed, and the fully loaded side can be manually unloaded.

[0045] A splint positioning mechanism 104 is provided in the middle of the single-wafer conveying rail 101, and the splint positioning mechanism 104 includes a splint positioning motor 105, a splint positioning synchronous belt 106 and a splint positioning rotating wheel 107. A splint positioning wheel 108 is connected to the driving end of the splint positioning motor 105, and the splint positioning synchronous belt 106 is transmission-connected to the splint positioning wheel 108. A splint positioning support 109 is installed on the splint positioning synchronous belt 106, and the splint positioning rotating wheel 107 rotates at the upper end of the splint positioning support 109. The splint positioning motor 105 drives the movement of the splint positioning synchronous belt 106 by controlling the rotation of the splint positioning wheel 108, thereby making the splint positioning support 109 move closer to the middle of the single-wafer conveying rail 101 to correct the position of the single silicon wafer.

[0046] The front end of the single-piece conveying rail 101 is provided with an air-blowing cooling pipe 110 , and the rear end of the single-piece conveying rail 101 is provided with an ion-static removal air knife 111 . The air-blowing cooling pipe 110 performs cooling treatment, and the ion-static removal air knife 111 is responsible for removing static electricity.

[0047] The first four-station turntable 202 and the second four-station turntable 310 both include an electrical integrated slip ring 209, a turntable support frame 210 and a turntable 211. The electrical integrated slip ring 209 is fixed on the turntable support frame 210. The electrical integrated slip ring 209 drives the turntable 211 to rotate. The four stations of the turntable 211 are equipped with suction nozzles 212 to transfer the single silicon wafer from the front to the detection station. The electrical integrated slip ring 209 provides power to enable the turntable 211 to rotate. The patching process of the single silicon wafer can be carried out at the rear. The suction nozzles 212 on the four stations can effectively fix the position of the single silicon wafer, which is convenient for the alignment of the detection mechanism.

[0048] Both sides of the first four-station turntable 202 and both sides of the second four-station turntable 310 are installed with docking conveying rails 213, and the rear side of the docking conveying rails 213 is provided with a walking linear module 214, and the driving end of the walking linear module 214 is connected to a transfer adsorption plate 215. The docking conveying rails 213 are used to move the single silicon wafer in parallel, and the walking linear module 214 controls the single silicon wafer of the front and rear structures to be transferred to the turntable 211 for adsorption.

[0049] The first UVW base 203 is provided with a first upper linear module 216 and a first lower linear module 217, the first upper linear module 216 is connected to the gold wire row 204, and the first lower linear module 217 is connected to the silver row test frame 205. The second UVW base 302 is provided with a second upper linear module and a second lower linear module, the second upper linear module is connected to the silver row frame 303, and the second lower linear module is connected to the copper row frame 304. The first upper linear module 216, the first lower linear module 217, the second upper linear module and the second lower linear module are all controlled by a motor to drive a nut to control the up and down movement of the gold wire row 204, the silver row test frame 205, the silver row frame 303 and the copper row frame 304.

[0050] A first circuit board 218 and a tension spring 219 are provided on both sides of the gold wire row 204, both ends of the IV gold wire 206 are connected to the tension spring 219, a first wire 220 is connected between the first circuit board 218 and the tension spring 219, mounting grooves are provided at both ends of the silver row test frame 205, the IV silver row 207 is inserted into the mounting groove, a pressure plate 221 is pressed on the mounting groove, the outer end of the IV silver row 207 is connected to the second wire 222, the tension spring 219 ensures the tension of the IV gold wire 206, and the middle part of the IV silver plate is arc-shaped upwardly protruding, which is more convenient for contacting the auxiliary grid, and the electrical signal is connected at the first wire 220 and the second wire 222.

[0051] Both ends of the EL silver busbar 305 are fixed on the silver busbar frame 303, one side of the EL silver busbar 305 is connected to a third wire 307, both ends of the EL copper busbar 306 are fixed on the copper busbar frame 304, one side of the EL copper busbar 306 is connected to a fourth wire 308, and a number of copper needles 309 are distributed on the EL copper busbar 306. The copper needles 309 contact the lower end of the 0BB silicon wafer under the action of the EL copper busbar 306, and the EL silver busbar 305 is connected at the upper end of the 0BB silicon wafer to realize EL detection of the 0BB silicon wafer.

[0052] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. An all-in-one machine for performing IV detection on 0BB silicon wafers, characterized in that: It includes a front conveying rail, an IV detection mechanism and an EL detection mechanism, wherein the IV detection mechanism is located between the front conveying rail and the EL detection mechanism; A single-piece conveyor rail is provided on the front conveyor rail; The IV detection mechanism includes a first working platform, a first four-station turntable and a first UVW base, wherein the first four-station turntable is located in the middle of the first working platform, the first UVW base is located at both sides of the front end of the first working platform, and the first UVW base is movably connected with a gold wire row and a silver row test frame along the vertical direction, the gold wire row is installed with IV gold wire, and the silver row test frame is installed with IV silver row; The EL detection mechanism includes a second working platform, a second four-station turntable and a second UVW base, wherein the second four-station turntable is located in the middle of the second working platform, the second UVW base is located at both sides of the front end of the second working platform, and the second UVW base is movably connected with a silver rack and a copper rack along the vertical direction, the silver rack is installed with an EL silver bar, and the copper rack is installed with an EL copper bar; The first UVW base and the second UVW base are both equipped with UVW deflection correction and alignment components, and the UVW deflection correction and alignment components include two groups of X-axis modules and one group of Y-axis modules.

2. The all-in-one machine for performing IV detection on OBB silicon wafers according to claim 1, characterized in that: A temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the single-piece conveying rail.

3. The integrated machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: A splint positioning mechanism is arranged in the middle of the single-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning rotating wheel. The driving end of the splint positioning motor is connected with the splint positioning wheel, and the splint positioning synchronous belt is transmission-connected with the splint positioning wheel. A splint positioning support is installed on the splint positioning synchronous belt, and the splint positioning rotating wheel rotates on the upper end of the splint positioning support.

4. The integrated machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: The front end of the single-piece conveying rail is provided with an air blowing and cooling pipe, and the rear end of the single-piece conveying rail is provided with an ion static removal air knife.

5. The integrated machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: The first four-station turntable and the second four-station turntable both include an electrical integrated slip ring, a turntable support frame and a turntable. The electrical integrated slip ring is fixed on the turntable support frame. The electrical integrated slip ring drives the turntable to rotate. Suction nozzles are installed on the four stations of the turntable.

6. The all-in-one machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: Both sides of the first four-station turntable and both sides of the second four-station turntable are installed with docking conveying rails, and the rear side of the docking conveying rails is provided with a walking linear module, and the driving end of the walking linear module is connected to a transfer adsorption plate.

7. The all-in-one machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: The first UVW base is provided with a first upper linear module and a first lower linear module, the first upper linear module is connected to the gold wire row, the first lower linear module is connected to the silver row test frame, and the second UVW base is provided with a second upper linear module and a second lower linear module, the second upper linear module is connected to the silver row frame, and the second lower linear module is connected to the copper row frame.

8. The integrated machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: A first circuit board and a tension spring are arranged on both sides of the gold wire row, both ends of the IV gold wire are connected to the tension spring, a first wire is connected between the first circuit board and the tension spring, mounting grooves are arranged at both ends of the silver row test frame, the IV silver row is inserted into the mounting groove, a pressure plate is pressed on the mounting groove, and the outer end of the IV silver row is connected to a second wire.

9. The all-in-one machine for performing IV detection on OBB silicon wafer according to claim 1, characterized in that: The two ends of the EL silver bar are fixed on the silver bar frame, one side of the EL silver bar is connected to a third wire, the two ends of the EL copper bar are fixed on the copper bar frame, one side of the EL copper bar is connected to a fourth wire, and a plurality of copper needles are distributed on the EL copper bar.