Ultrahigh-precision microsphere integrated grinding and polishing method and system based on self-adaptive control

Abstract

The invention relates to the technical field of grinding and polishing parameter regulation and control, in particular to an ultrahigh-precision microsphere integrated grinding and polishing method and system based on self-adaptive control, and the method comprises the steps: constructing a grinding and polishing platform, obtaining grinding microspheres according to grinding and polishing parameters and by utilizing the grinding and polishing platform, carrying out the grinding process analysis of the grinding microspheres, obtaining grinding process factors, and obtaining the grinding process factors; judging whether the grinding process factor is smaller than a standard process factor, if not, obtaining a complete grinding parameter set, if yes, calculating a grinding damage factor, judging whether the grinding damage factor is smaller than a standard damage factor, if yes, obtaining a process grinding parameter set, and if not, obtaining a damage grinding parameter set; and a self-adaptive control model is constructed according to the complete grinding parameter set, the process grinding parameter set and the damage grinding parameter set. According to the invention, the precision and efficiency of integrated grinding and polishing of ultrahigh-precision microspheres can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing parameter control, and in particular to an ultra-high precision micro-sphere integrated polishing method and system based on adaptive control. Background Art

[0002] In the aviation field, ultra-high precision microspheres play an important role. For example, microspheres can be used in high-precision gyroscopes and accelerometers. In aerial photography and remote sensing technology, ultra-high precision microspheres can be used to manufacture optical components. In the process of applying ultra-high precision microspheres, it is extremely important to carry out integrated grinding and polishing of ultra-high precision microspheres.

[0003] At present, the integrated grinding and polishing method for ultra-high precision microspheres is mainly achieved by manually controlling the grinding and polishing process. This method will result in lower grinding and polishing accuracy. At the same time, excessive human intervention will lead to a decrease in grinding and polishing efficiency. Summary of the invention

[0004] The present invention provides an ultra-high precision micro-sphere integrated polishing method and system based on adaptive control, the main purpose of which is to improve the accuracy and efficiency of the ultra-high precision micro-sphere integrated polishing.

[0005] To achieve the above object, the present invention provides an ultra-high precision micro-sphere integrated polishing method based on adaptive control, comprising: Receiving a micro-ball polishing instruction, and setting polishing parameters based on the micro-ball polishing instruction; Obtain a set of microspheres to be polished, extract the microspheres to be polished in sequence from the set of microspheres to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a microsphere carrier; According to the grinding and polishing parameters, the microspheres to be polished are ground using the grinding and polishing platform to obtain ground microspheres, a grinding process analysis is performed on the ground microspheres to obtain a grinding process factor, and a current grinding time is recorded; Determine whether the grinding process factor is less than a preset standard process factor; If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter set; If the grinding process factor is less than the standard process factor, performing a grinding damage analysis on the grinding microspheres to obtain a grinding damage factor; Determine whether the grinding damage factor is less than the preset standard damage factor; If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain an adjustment parameter; Using the adjustment parameters and the grinding microballs to update the grinding parameters and the microballs to be polished respectively, and returning to the step of grinding the microballs to be polished using the grinding and polishing platform according to the grinding and polishing parameters; If the grinding damage factor is not less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a damage grinding parameter group; The complete grinding parameter group, process grinding parameter group and damage grinding parameter group are summarized to obtain a target grinding parameter group set, an adaptive control model is constructed according to the target grinding parameter group set, and ultra-high precision microsphere integrated grinding and polishing based on adaptive control is completed based on the adaptive control model.

[0006] Optionally, the construction of the polishing platform includes: Adding the grinding stone liquid into the microball carrier, and placing the microballs to be polished in the microball carrier, wherein the grinding stone liquid in the microball carrier covers the microballs to be polished; The electric spindle is connected to the polishing head to obtain a polishing rotating body, and the polishing rotating body is fixed on the surface of the microsphere to be polished to complete the construction of the polishing platform.

[0007] Optionally, the grinding process analysis of the grinding microspheres to obtain a grinding process factor comprises: The grinding microspheres are photographed microscopically to obtain a worn microsphere image group, wherein the worn microsphere image group includes four worn microsphere images, all of which are grayscale images, and different worn microsphere images in the worn microsphere image group come from different surfaces of the grinding microspheres; Extracting the worn microsphere images in the worn microsphere image group in sequence, identifying the image center of the worn microsphere image, and adding coordinates to the worn microsphere image based on the image center to obtain a coordinate microsphere image, wherein the coordinate center of the coordinate microsphere image is the image center, the horizontal axis is the horizontal direction of the coordinate microsphere image, and the vertical axis is the vertical direction of the coordinate microsphere image; The radial line precision value is set, and an extended radial line set is constructed in the coordinate microsphere image according to the radial line precision value and the image center, wherein the number of extended radial lines in the extended radial line set is the radial line precision value, and the extended radial lines pass through the image center; For each extension radius line in the extension radius line set, perform the following actions: Extracting a radial pixel point set from the extended radial line, wherein the radial pixel points in the radial pixel point set are arranged from far to near according to the distance from the center of the image; According to the radial pixel point set, determining whether there is an abrupt point in the extended radial line; If there is an abrupt point in the extended radial line, the extended radial line will be cut based on the abrupt point to obtain a cutting radial line group, wherein the cutting radial line group includes two sections of cutting radial lines; Extracting cutting lines in the cutting line group in sequence, and updating the extended lines by using the cutting lines, and returning to the step of extracting the line pixel point set in the extended lines; If the extended path line does not have any abrupt points, the extended path line is recorded as the target path line; Summarize the target diameters of the extended diameters to obtain a target diameter group, identify the maximum diameter in the target diameter group, and remove the maximum diameter from the target diameter group to obtain a fine line interval group; The maximum diameter line and fine line interval group corresponding to each extended diameter line are summarized respectively to obtain the maximum diameter line set and the fine line interval set; Based on the fine line interval set, the surface roughness analysis is performed on the worn microsphere image to obtain the grinding roughness factor, and according to the maximum diameter line set, the contour grinding analysis is performed on the worn microsphere image to obtain the grinding contour factor; The grinding roughness factor and grinding profile factor corresponding to each worn microsphere image are respectively summarized to obtain a grinding roughness factor set and a grinding profile factor set. Based on the grinding roughness factor set and the grinding profile factor set, the grinding process factor is calculated using a preset grinding process function, wherein the grinding process factor is expressed as: , , in, represents the grinding process factor, represents the grinding process function, represents the grinding roughness factor set, represents the grinding profile factor set, Indicates the number of grinding roughness factors in the grinding roughness factor set or the number of grinding profile factors in the grinding profile factor set, represents the first The grinding roughness factor, Indicates the first grinding profile factor.

[0008] Optionally, judging whether there is an abrupt point in the extended radial line according to the radial line pixel point set includes: Counting the radial interval between each radial pixel point in the radial pixel point set and the image center to obtain a radial interval set, and identifying a radial pixel value set corresponding to the radial pixel point set, wherein the radial intervals in the radial interval set correspond to the radial pixel values ​​in the radial pixel value set in a one-to-one correspondence; According to the radial pixel value set, radial interval set and the preset standard microsphere radius, the pixel distribution mean difference is calculated, wherein the pixel distribution mean difference is expressed as: , in, Indicates the average difference in pixel distribution, Indicates the number of radial pixel points in the radial pixel point concentration. Indicates the radial pixel value set Radius pixel value, Indicates the radial interval concentration Radius interval, represents the standard microsphere radius, represents the absolute value symbol, Indicates the radial pixel value set Radial pixel value; Determine whether the pixel distribution mean difference is greater than a preset standard distribution mean difference; If the pixel distribution mean difference is greater than the standard distribution mean difference, the maximum pixel point in the radial pixel point set is identified and recorded as an abrupt point; If the pixel distribution mean difference is not greater than the standard distribution mean difference, then there is no abrupt point in the extended radial line.

[0009] Optionally, the surface roughness analysis of the worn microsphere image is performed based on the fine line interval set to obtain a grinding roughness factor, including: Obtaining the number of fine line intervals in the fine line interval set, and counting the interval length of each fine line interval in the fine line interval set to obtain an interval length set, and calculating the total interval length of the interval length set; According to the interval length set, the number of fine line intervals and the total interval length, the grinding roughness factor is calculated using the following formula: , in, represents the grinding roughness factor, Indicates the number of fine line intervals, represents the number of interval lengths in the interval length set, Indicates Interval length, Indicates the total length of the interval.

[0010] Optionally, the performing of profile grinding analysis on the worn microsphere image according to the maximum diameter line set to obtain a grinding profile factor includes: Extract the maximum radial lines in the maximum radial line set in sequence, and identify the contour extension radial line corresponding to the maximum meridian; Calculate the grinding profile radius based on the profile extension line and the maximum line, wherein the grinding profile radius is the difference between the length of the profile extension line and the length of the maximum line; The grinding profile radii are summarized to obtain a grinding profile radius set, and a grinding profile factor is calculated according to the grinding profile radius set and the standard microsphere radius, wherein the grinding profile factor is expressed as: , in, represents the grinding profile factor, Indicates the number of grinding profile radii in the grinding profile radius set, Indicates the grinding profile radius concentration Grinding profile radius.

[0011] Optionally, performing grinding damage analysis on the grinding microspheres to obtain a grinding damage factor comprises: Performing ultrasonic testing on the grinding microspheres within a preset testing time to obtain an ultrasonic return number; Obtaining microspheres of the same type as the grinding microspheres, and performing ultrasonic testing on the microspheres of the same type based on the testing time to obtain a standard return number; Based on the ultrasonic return number and the standard return number, the grinding damage factor is calculated: , in, represents the grinding damage factor, Indicates the standard return number, Indicates the number of ultrasonic returns.

[0012] Optionally, the polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain the adjustment parameters, including: Setting the adjustment variation coefficient, wherein the adjustment variation coefficient includes: depth variation coefficient, rotation speed variation coefficient and speed variation coefficient; According to the adjustment variation coefficient, the grinding damage factor, the standard damage factor, the grinding process factor and the standard process factor, the adjustment parameters are calculated, wherein the adjustment parameters include: adjusting the grinding and polishing depth, adjusting the grinding and polishing speed and adjusting the feed speed, and the adjustment parameters are expressed as: , in, Indicates the adjustment of polishing depth. Indicates the polishing depth. represents the depth variation coefficient, represents the standard process factor, represents the standard damage factor, Indicates the adjustment of grinding and polishing speed. Indicates the grinding speed. represents the speed variation coefficient, Indicates adjusting the feed speed. Indicates the feed speed, Indicates the speed variation coefficient.

[0013] Optionally, constructing an adaptive control model according to a target grinding parameter set includes: Dividing the target grinding parameter set to obtain a plurality of damage parameter sets and a plurality of complete parameter sets, wherein each damage parameter set includes a damage grinding parameter set and a plurality of process grinding parameter sets, and each complete parameter set includes a complete grinding parameter set and a plurality of process grinding parameter sets; Extracting damage parameter sets in sequence from the plurality of damage parameter sets, and drawing a damage parameter curve of the damage parameter set, wherein the horizontal axis of the damage parameter curve is the polishing time, and the vertical axis is the polishing parameter; Using a preset damage mark to mark the damage parameter curve to obtain a damage mark curve, and summarizing the damage mark curves to obtain a damage mark curve set; Extracting complete parameter sets from multiple complete parameter sets in sequence, drawing complete parameter curves of the complete parameter sets, marking the complete parameter curves with preset complete marks to obtain complete marked curves, and summarizing the complete marked curves to obtain a complete marked curve set; The damage marking curve set and the complete marking curve set are used to train the pre-acquired deep learning model and obtain an adaptive control model.

[0014] To achieve the above object, the present invention also provides an ultra-high precision micro-ball integrated polishing system based on adaptive control, comprising: A polishing platform construction module is used to receive a micro-ball polishing instruction, set polishing parameters based on the micro-ball polishing instruction, obtain a set of micro-balls to be polished, sequentially extract the micro-balls to be polished from the set of micro-balls to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a micro-ball carrier; A damage factor analysis module is used to grind the microballs to be polished using a grinding and polishing platform according to the grinding and polishing parameters to obtain ground microballs, perform grinding process analysis on the ground microballs to obtain a grinding process factor, and record the current grinding time to determine whether the grinding process factor is less than a preset standard process factor. If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter group. If the grinding process factor is less than the standard process factor, a grinding damage analysis is performed on the ground microballs to obtain a grinding damage factor. a grinding parameter adjustment module, for judging whether the grinding damage factor is less than a preset standard damage factor; if the grinding damage factor is less than the standard damage factor, pairing the grinding and polishing parameters with the grinding time to obtain a process grinding parameter group; adjusting the grinding and polishing parameters according to the grinding damage factor and the grinding process factor to obtain adjustment parameters; updating the grinding parameters and the microballs to be polished respectively by using the adjustment parameters and the grinding microballs; and returning to the step of grinding the microballs to be polished by using the grinding and polishing platform according to the grinding and polishing parameters; The control model training module is used to pair the polishing parameters with the grinding time if the grinding damage factor is not less than the standard damage factor to obtain a damage grinding parameter group, summarize the complete grinding parameter group, the process grinding parameter group and the damage grinding parameter group to obtain a target grinding parameter group set, and construct an adaptive control model according to the target grinding parameter group set.

[0015] In order to solve the above problem, the present invention further provides an electronic device, the electronic device comprising: a memory storing at least one instruction; and The processor executes the instructions stored in the memory to implement the above-mentioned ultra-high precision micro-sphere integrated polishing method based on adaptive control.

[0016] In order to solve the above problems, the present invention also provides a computer-readable storage medium, in which at least one instruction is stored. The at least one instruction is executed by a processor in an electronic device to implement the above-mentioned ultra-high precision microsphere integrated polishing method based on adaptive control.

[0017] In order to solve the problems described in the background technology, the present invention first constructs a grinding and polishing platform, and uses the grinding and polishing platform to grind the microballs to be polished to obtain grinding microballs. This step completes the preliminary grinding of the microballs to be polished. Then, the grinding process of the grinding microballs is analyzed to obtain the grinding process factor. The acquisition of the grinding process factor enables the current grinding and polishing process to have a specific numerical representation. By performing a grinding damage analysis on the grinding microballs, a grinding damage factor is obtained, so that the internal damage of the grinding microballs is also numerically displayed. When the grinding microballs are not completely polished and the grinding microballs are not extremely damaged, the grinding and polishing parameters are adaptively adjusted to obtain the adjustment parameters. The entire grinding and polishing process is made more accurate. At the same time, the grinding damage factor and the grinding process factor can be used to control the stopping and continuing of the entire grinding, so that the micro-ball grinding has a higher efficiency. In addition, in multiple grinding processes, different types of grinding data can be obtained according to the grinding damage factor and the grinding process factor: a complete grinding parameter group, a process grinding parameter group, and a damage grinding parameter group. These data are used to train the deep learning model to obtain an adaptive control model. The adaptive control model can realize the automatic regulation of the grinding and polishing parameters in the grinding and polishing process without the need for artificial regulation of too many parameters in the grinding and polishing process, thereby improving the efficiency of micro-ball grinding and polishing. Therefore, the present invention can improve the accuracy and efficiency of integrated grinding and polishing of ultra-high precision micro-balls. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a process flow of an ultra-high precision micro-sphere integrated polishing method based on adaptive control provided by one embodiment of the present invention; Figure 2A functional module diagram of an ultra-high precision micro-sphere integrated grinding and polishing system based on adaptive control provided by one embodiment of the present invention; Figure 3 A schematic structural diagram of an electronic device for implementing the ultra-high precision micro-sphere integrated polishing method based on adaptive control provided in one embodiment of the present invention.

[0019] Description of reference numerals: 1. Electronic device; 10. Processor; 11. Memory; 12. Bus.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0022] The embodiment of the present application provides an ultra-high precision micro-sphere integrated polishing method based on adaptive control. The execution subject of the ultra-high precision micro-sphere integrated polishing method based on adaptive control includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided in the embodiment of the present application. In other words, the ultra-high precision micro-sphere integrated polishing method based on adaptive control can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc.

[0023] Reference Figure 1 FIG. 1 is a flow chart of an ultra-high precision micro-sphere integrated polishing method based on adaptive control provided by an embodiment of the present invention. In this embodiment, the ultra-high precision micro-sphere integrated polishing method based on adaptive control includes: S1. Receive micro-ball polishing instructions, and set polishing parameters based on the micro-ball polishing instructions.

[0024] It can be understood that the micro-ball polishing instruction refers to a manually initiated instruction for polishing the micro-balls, and the polishing parameters include: polishing depth, polishing speed and feed speed. The polishing depth refers to the depth of material removed each time the polishing tool contacts the micro-ball during the polishing process. The polishing parameter affects the efficiency and accuracy of the polishing. Too much polishing depth will cause excessive wear, while too little polishing depth will result in low polishing efficiency.

[0025] It can be understood that the polishing speed refers to the rotation speed of the polishing head during the polishing process. The polishing speed will affect the efficiency of the micro-ball polishing and the smoothness of the micro-ball surface. By increasing the polishing speed, the polishing efficiency can be improved, but it will increase heat and wear, and a lower polishing speed will lead to lower polishing efficiency, and the polishing speed will further affect the abrasive speed, where the abrasive speed refers to the rotation speed of the polishing medium relative to the micro-ball surface, which will affect the polishing accuracy and the smoothness of the micro-ball surface. The feed speed refers to the moving speed of the polishing tool relative to the micro-ball surface, which will affect the material removal rate during the polishing process. The speed of the feed speed will affect the surface damage degree of the micro-ball and the polishing efficiency.

[0026] It should be explained that the above-mentioned polishing parameters are all manually set parameters during the first polishing. They can be set according to past experience or according to relevant literature. Since the applicable polishing parameters are not necessarily the same for different microsphere materials, and even for the same microsphere material, the polishing parameters required in different polishing stages are also different, adaptive adjustment is required according to actual conditions.

[0027] S2, obtaining a set of microspheres to be polished, extracting the microspheres to be polished in sequence from the set of microspheres to be polished, and constructing a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a microsphere carrier.

[0028] It is clear that the microsphere set to be polished refers to a set of microsphere materials obtained artificially. In order to ensure that the adaptive control model constructed subsequently is sufficiently accurate, it is necessary to obtain multiple microspheres to be polished and perform polishing tests on them respectively. The polishing platform refers to an integrated device for polishing the microspheres to be polished, wherein the electric spindle refers to a motor that can rotate at high speed, which is used to drive the polishing head to polish the microspheres to be polished.

[0029] It can be understood that the grinding and polishing head refers to a device that applies pressure to the microballs to be polished, which is used to push the grinding stone liquid to grind the microballs to be polished. One end of the grinding and polishing head is connected to the electric spindle, and the other end is placed on the surface of the microballs to be polished. The grinding stone liquid refers to a liquid containing abrasive particles. During the grinding and polishing process, the abrasive particles in the grinding stone liquid will contact the surface of the microballs and remove excess material. At the same time, the grinding stone liquid also has the function of cooling and lubricating, which can reduce friction and heat during the grinding and polishing process and prevent the microballs from overheating and damage. The microball carrier refers to a carrier used to carry the microballs to be polished.

[0030] In detail, the construction of the polishing platform includes: Adding the grinding stone liquid into the microball carrier, and placing the microballs to be polished in the microball carrier, wherein the grinding stone liquid in the microball carrier covers the microballs to be polished; The electric spindle is connected to the polishing head to obtain a polishing rotating body, and the polishing rotating body is fixed on the surface of the microsphere to be polished to complete the construction of the polishing platform.

[0031] It should be explained that the polishing rotating body refers to the polishing head connected to the electric spindle. When the polishing head is connected to the electric spindle, the electric spindle will provide power to the polishing head, thereby allowing the polishing head to rotate.

[0032] S3. According to the polishing parameters, the microspheres to be polished are ground using the polishing platform to obtain ground microspheres, a grinding process analysis is performed on the ground microspheres to obtain a grinding process factor, and the current grinding time is recorded.

[0033] It can be understood that the grinding microballs refer to the microballs to be cast after grinding, the grinding process factor refers to the value used to indicate the current grinding completion degree of the grinding microballs, and the grinding time refers to the total time for grinding the grinding microballs.

[0034] In detail, the grinding process analysis of the grinding microspheres to obtain the grinding process factor includes: The grinding microspheres are photographed microscopically to obtain a worn microsphere image group, wherein the worn microsphere image group includes four worn microsphere images, all of which are grayscale images, and different worn microsphere images in the worn microsphere image group come from different surfaces of the grinding microspheres; Extracting the worn microsphere images in the worn microsphere image group in sequence, identifying the image center of the worn microsphere image, and adding coordinates to the worn microsphere image based on the image center to obtain a coordinate microsphere image, wherein the coordinate center of the coordinate microsphere image is the image center, the horizontal axis is the horizontal direction of the coordinate microsphere image, and the vertical axis is the vertical direction of the coordinate microsphere image; The radial line precision value is set, and an extended radial line set is constructed in the coordinate microsphere image according to the radial line precision value and the image center, wherein the number of extended radial lines in the extended radial line set is the radial line precision value, and the extended radial lines pass through the image center; For each extension radius line in the extension radius line set, perform the following actions: Extracting a radial pixel point set from the extended radial line, wherein the radial pixel points in the radial pixel point set are arranged from far to near according to the distance from the center of the image; According to the radial pixel point set, determining whether there is an abrupt point in the extended radial line; If there is an abrupt point in the extended radial line, the extended radial line will be cut based on the abrupt point to obtain a cutting radial line group, wherein the cutting radial line group includes two sections of cutting radial lines; Extracting cutting lines in the cutting line group in sequence, and updating the extended lines by using the cutting lines, and returning to the step of extracting the line pixel point set in the extended lines; If the extended path line does not have any abrupt points, the extended path line is recorded as the target path line; Summarize the target diameters of the extended diameters to obtain a target diameter group, identify the maximum diameter in the target diameter group, and remove the maximum diameter from the target diameter group to obtain a fine line interval group; The maximum diameter line and fine line interval group corresponding to each extended diameter line are summarized respectively to obtain the maximum diameter line set and the fine line interval set; Based on the fine line interval set, the surface roughness analysis is performed on the worn microsphere image to obtain the grinding roughness factor, and according to the maximum diameter line set, the contour grinding analysis is performed on the worn microsphere image to obtain the grinding contour factor; The grinding roughness factor and grinding profile factor corresponding to each worn microsphere image are respectively summarized to obtain a grinding roughness factor set and a grinding profile factor set. Based on the grinding roughness factor set and the grinding profile factor set, the grinding process factor is calculated using a preset grinding process function, wherein the grinding process factor is expressed as: , , in, represents the grinding process factor, represents the grinding process function, represents the grinding roughness factor set, represents the grinding profile factor set, Indicates the number of grinding roughness factors in the grinding roughness factor set or the number of grinding profile factors in the grinding profile factor set, represents the first The grinding roughness factor, Indicates the first grinding profile factor.

[0035] It can be understood that the worn microsphere image group refers to a plurality of images obtained by photographing the surface of the grinding microspheres. In order to ensure that the image can show obvious contour information, the grinding microspheres should be in the middle of the worn microsphere image and should have an obvious white background in the image.

[0036] For example, in order to take an image of a ground microsphere, Xiao Zhang places the microsphere on the surface of a white glass plate and photographs the ground microsphere using a microscope to obtain four images of the worn microsphere, and the four images of the worn microsphere are taken from different angles of the microsphere.

[0037] It can be understood that the coordinate microsphere image refers to the worn microsphere image after the coordinates are added, and the radial line accuracy value refers to an artificially set constant. This accuracy value represents the accuracy of image processing for the worn microsphere image. When the radial line accuracy is higher, the subsequent grinding process factor calculation is more accurate, but it also reduces the efficiency of image processing. Among them, the range of the selected radial line accuracy value can be: 50-100. The extended radial line set refers to a set of multiple groups of straight lines passing through the center of the image.

[0038] It needs to be explained that since the worn microspheres are round, the distance from the edge of the microsphere contour to the center of the image in each worn microsphere image is close, and during the polishing process, the surface of the microsphere to be polished is treated uniformly. Based on the characteristics of the round shape and uniform polishing, multiple straight lines can be designed, and the changes in pixel values ​​on multiple straight lines can be analyzed to represent the pixel change trend of the entire image, so as to avoid the high complexity of processing the entire image and improve the grinding efficiency.

[0039] Furthermore, the radial pixel point set refers to a set of pixel points on an extended radial line, the abrupt point refers to a pixel point on the extended radial line whose pixel value change trend deviates greatly from the pixel value change trend of other pixel points, wherein the pixel value change trend is not only related to the size of the pixel value, but also to the position of the pixel point in the image, the maximum radial line refers to the target radial line with the largest length among the target radial lines, and the fine line interval group refers to the target radial line group after the maximum radial line is eliminated, which is used to represent the interval between adjacent fine lines on the surface of the ground microspheres.

[0040] It should be explained that when the extended diameter line passes through the fine lines on the surface of the grinding microsphere, the fine lines are represented as a sudden point on the extended diameter line, and the space between two connected sudden points is a fine line interval.

[0041] It can be understood that the grinding roughness factor refers to a numerical value used to represent the surface roughness of the grinding microspheres, the grinding profile factor refers to a numerical value used to represent the degree of completion of the grinding microsphere profile processing, and the grinding process function refers to a relationship formula used to represent the relationship between the grinding roughness factor set, the grinding profile factor set and the grinding process factor, which is created artificially.

[0042] Exemplarily, Xiao Zhang obtains a grinding roughness factor set and a grinding profile factor set, and sets a grinding process function: ,in, Represents a summation function, that is, the sum of all grinding roughness factors in the grinding roughness factor set, or the sum of all grinding profile factors in the grinding profile factor set.

[0043] In detail, judging whether there is an abrupt point in the extended radial line according to the radial line pixel point set includes: Counting the radial interval between each radial pixel point in the radial pixel point set and the image center to obtain a radial interval set, and identifying a radial pixel value set corresponding to the radial pixel point set, wherein the radial intervals in the radial interval set correspond to the radial pixel values ​​in the radial pixel value set in a one-to-one correspondence; According to the radial pixel value set, radial interval set and the preset standard microsphere radius, the pixel distribution mean difference is calculated, wherein the pixel distribution mean difference is expressed as: , in, Indicates the average difference in pixel distribution, Indicates the number of radial pixel points in the radial pixel point concentration. Indicates the radial pixel value set Radius pixel value, Indicates the radial interval concentration Radius interval, represents the standard microsphere radius, represents the absolute value symbol, Indicates the radial pixel value set Radial pixel value; Determine whether the pixel distribution mean difference is greater than a preset standard distribution mean difference; If the pixel distribution mean difference is greater than the standard distribution mean difference, the maximum pixel point in the radial pixel point set is identified and recorded as an abrupt point; If the pixel distribution mean difference is not greater than the standard distribution mean difference, then there is no abrupt point in the extended radial line.

[0044] It can be understood that the radial line interval is the distance between the radial line pixel point and the image center, the radial line pixel value refers to the pixel value of the radial line pixel point, the standard microsphere radius refers to the radius of the microsphere to be polished, which is determined by the specific polishing standard, the pixel distribution mean difference refers to the numerical value used to represent the deviation of the pixel value distribution on the extended radial line, and the standard distribution mean difference refers to an artificially set constant.

[0045] In detail, the surface roughness analysis of the worn microsphere image is performed based on the fine line interval set to obtain the grinding roughness factor, including: Obtaining the number of fine line intervals in the fine line interval set, and counting the interval length of each fine line interval in the fine line interval set to obtain an interval length set, and calculating the total interval length of the interval length set; According to the interval length set, the number of fine line intervals and the total interval length, the grinding roughness factor is calculated using the following formula: , in, represents the grinding roughness factor, Indicates the number of fine line intervals, represents the number of interval lengths in the interval length set, Indicates Interval length, Indicates the total length of the interval.

[0046] It can be understood that the number of fine line intervals refers to the number of fine line intervals in the fine line interval set, the interval length refers to the length of the fine line interval, and the total interval length refers to the sum of all interval lengths in the interval length set.

[0047] In detail, the profile grinding analysis is performed on the worn microsphere image according to the maximum diameter line set to obtain the grinding profile factor, including: Extract the maximum radial lines in the maximum radial line set in sequence, and identify the contour extension radial line corresponding to the maximum meridian; Calculate the grinding profile radius based on the profile extension line and the maximum line, wherein the grinding profile radius is the difference between the length of the profile extension line and the length of the maximum line; The grinding profile radii are summarized to obtain a grinding profile radius set, and a grinding profile factor is calculated according to the grinding profile radius set and the standard microsphere radius, wherein the grinding profile factor is expressed as: , in, represents the grinding profile factor, Indicates the number of grinding profile radii in the grinding profile radius set, Indicates the grinding profile radius concentration Grinding profile radius.

[0048] It can be understood that the contour extension line refers to the extension line where the maximum diameter line is located, and the grinding contour radius refers to the radius of the grinding microsphere displayed on the contour extension line. It is calculated as follows: R=AB, wherein R represents the grinding contour radius, and A and B represent the length of the contour extension line and the length of the maximum diameter line, respectively.

[0049] S4. Determine whether the grinding process factor is less than a preset standard process factor.

[0050] It is clear that the standard process factor refers to a constant of the artificially set grinding process factor, which provides a numerical standard for whether the grinding of the microspheres to be cast is completed.

[0051] S5. If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter set.

[0052] It can be understood that the grinding time refers to the current grinding time of the microspheres to be polished. It should be noted that the grinding time is only the time for grinding the microspheres to be polished, and does not include the time for imaging the microspheres and analyzing the grinding process. When the grinding process factor is not less than the standard process factor, it means that the current grinding of the microspheres to be polished has been completed and no further grinding is required. At this time, it is necessary to record the current grinding parameters and grinding time so that the adaptive control model can be constructed according to the target grinding parameter group later.

[0053] S6. If the grinding process factor is less than the standard process factor, a grinding damage analysis is performed on the grinding microspheres to obtain a grinding damage factor.

[0054] It should be explained that the grinding damage factor refers to a numerical value used to represent the degree of internal damage of the grinding microspheres. The grinding damage factor can be obtained by ultrasonic testing, wherein the equipment used for ultrasonic testing is, for example, a high-resolution ultrasonic microscope.

[0055] In detail, the grinding damage analysis of the grinding microspheres to obtain the grinding damage factor includes: Performing ultrasonic testing on the grinding microspheres within a preset testing time to obtain an ultrasonic return number; Obtaining microspheres of the same type as the grinding microspheres, and performing ultrasonic testing on the microspheres of the same type based on the testing time to obtain a standard return number; Based on the ultrasonic return number and the standard return number, the grinding damage factor is calculated: , in, represents the grinding damage factor, Indicates the standard return number, Indicates the number of ultrasonic returns.

[0056] It can be understood that the process of performing ultrasonic detection is: using an ultrasonic detection device to emit ultrasonic waves to the grinding microspheres, waiting for a detection period, and then recording the returned sound waves received from the grinding microspheres.

[0057] It can be understood that the detection duration refers to the artificially set duration, which is used to specify the specific detection time of the ultrasonic detection. The ultrasonic return number refers to the signal strength of the ultrasonic signal reflected from the surface of the grinding microspheres after the detection time has passed since the moment when the ultrasonic wave is emitted to the grinding microspheres. The same type of microspheres refer to microspheres with the same polishing standards as the grinding microspheres. The same type of microspheres are microspheres that have completed polishing and meet the polishing standards. The standard return number refers to the signal strength of the ultrasonic signal reflected from the surface of the same type of microspheres after the waiting detection time has passed since the moment when the ultrasonic wave is emitted to the same type of microspheres.

[0058] It should be explained that when there are more damages inside the grinding microspheres, more ultrasonic waves will be reflected. Therefore, within a certain period of time, the more ultrasonic waves are received, the higher the degree of damage inside the grinding microspheres.

[0059] S7. Determine whether the grinding damage factor is less than a preset standard damage factor.

[0060] It can be understood that the standard damage factor refers to a constant of the artificially set grinding damage factor. The standard damage factor provides a numerical standard for whether the grinding of the microspheres to be polished currently causes damage. When the grinding damage factor is greater than the standard damage factor, there is no need to continue grinding and polishing the microspheres.

[0061] S8. If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain adjustment parameters.

[0062] It can be understood that the adjustment parameters refer to the polishing parameters after adjustment, wherein the adjustment parameters include: adjusting the polishing depth, adjusting the polishing speed and adjusting the feed speed.

[0063] It should be explained that when the grinding damage factor is smaller than the standard damage factor, and the grinding process factor is smaller than the standard process factor, it means that the current grinding microballs have not completed grinding and polishing and the grinding microballs have not suffered irreversible damage. It is necessary to adjust the grinding and polishing parameters according to the current grinding process and related data, and continue to polish the grinding microballs according to the adjusted grinding and polishing parameters.

[0064] In detail, the polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain the adjustment parameters, including: Setting the adjustment variation coefficient, wherein the adjustment variation coefficient includes: depth variation coefficient, rotation speed variation coefficient and speed variation coefficient; According to the adjustment variation coefficient, the grinding damage factor, the standard damage factor, the grinding process factor and the standard process factor, the adjustment parameters are calculated, wherein the adjustment parameters include: adjusting the grinding and polishing depth, adjusting the grinding and polishing speed and adjusting the feed speed, and the adjustment parameters are expressed as: , in, Indicates the adjustment of polishing depth. Indicates the polishing depth. represents the depth variation coefficient, represents the standard process factor, represents the standard damage factor, Indicates the adjustment of grinding and polishing speed. Indicates the grinding speed. represents the speed variation coefficient, Indicates adjusting the feed speed. Indicates the feed speed, Indicates the speed variation coefficient.

[0065] It can be understood that the adjustment variation coefficient refers to the rate constant for manually adjusting the grinding and polishing parameters, wherein the depth variation coefficient represents the degree of adjustment refinement when the grinding and polishing depth is manually adjusted, the speed variation coefficient represents the degree of adjustment refinement when the grinding and polishing speed is manually adjusted, and the speed variation coefficient represents the degree of adjustment refinement when the feed speed is manually adjusted. Since different grinding and polishing processes may not have the same emphasis on the adjustment parameters, it is necessary to set the parameter adjustment coefficient to adjust different parameters to different degrees. For example, the adjustment variation coefficient can be set to: 0.5, 0.6, 0.7.

[0066] For example, Xiao Zhang is an operator of a microball polishing process. Xiao Zhang needs to set the adjustment variation coefficient during a microball polishing process. After comprehensively considering the target accuracy, material properties and operating status of this microball polishing, Xiao Zhang believes that the control of the polishing depth is the most critical in this polishing process. Therefore, the depth variation coefficient is set to 0.7, so as to adjust the polishing depth more finely to ensure that the flatness of the microball surface meets the requirements. For the speed variation coefficient, Xiao Zhang considers the stability of the equipment and the polishing efficiency, and sets it to 0.6 to ensure the uniformity of the polishing process. For the feed speed variation coefficient, Xiao Zhang sets it to 0.5 according to the size of the microball and the polishing path to ensure the smooth progress of the polishing process and avoid the decline in polishing quality due to excessive feed speed. By setting these adjustment variation coefficients, Xiao Zhang can better control the polishing process, thereby improving the quality and efficiency of microball polishing.

[0067] S9, respectively updating the grinding parameters and the microballs to be polished by using the adjustment parameters and the grinding microballs, and returning to the step of grinding the microballs to be polished by using the grinding and polishing platform according to the grinding and polishing parameters.

[0068] It is clear that after the adjustment parameters are calculated, the polishing parameters need to be updated using the adjustment parameters and the microspheres to be polished continue to be ground.

[0069] S10. If the grinding damage factor is not less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a damage grinding parameter group.

[0070] It should be explained that when the grinding damage factor is not less than the standard damage factor, the current grinding microball can be deemed damaged and there is no need to continue grinding and polishing the grinding microball. In order to subsequently construct an adaptive control model, it is necessary to record the grinding and polishing parameters and time at this time, that is, to record the damaged grinding parameter group.

[0071] S11, summarizing the complete grinding parameter group, the process grinding parameter group and the damage grinding parameter group to obtain a target grinding parameter group set, constructing an adaptive control model according to the target grinding parameter group set, and completing the ultra-high precision microsphere integrated grinding and polishing based on the adaptive control model.

[0072] It can be understood that the adaptive control model refers to a model used to adjust the polishing parameters in the micro-ball polishing process in real time. The adaptive model is a set of parameter curves, which are the relationship curves between the polishing parameters and the polishing time. Through the control of the adaptive control model, the polishing parameters will automatically change with the increase of the polishing time, thereby realizing automated micro-ball polishing.

[0073] For example, Xiao Zhang needs to polish a certain microsphere material, so Xiao Zhang places the microsphere material on the polishing platform and sets the initial polishing parameters. The polishing platform will automatically adjust the polishing parameters during the polishing process of the microspheres according to the adaptive control model.

[0074] In detail, the adaptive control model is constructed according to the target grinding parameter set, including: Dividing the target grinding parameter set to obtain a plurality of damage parameter sets and a plurality of complete parameter sets, wherein each damage parameter set includes a damage grinding parameter set and a plurality of process grinding parameter sets, and each complete parameter set includes a complete grinding parameter set and a plurality of process grinding parameter sets; Extracting damage parameter sets in sequence from the plurality of damage parameter sets, and drawing a damage parameter curve of the damage parameter set, wherein the horizontal axis of the damage parameter curve is the polishing time, and the vertical axis is the polishing parameter; Using a preset damage mark to mark the damage parameter curve to obtain a damage mark curve, and summarizing the damage mark curves to obtain a damage mark curve set; Extracting complete parameter sets from multiple complete parameter sets in sequence, drawing complete parameter curves of the complete parameter sets, marking the complete parameter curves with preset complete marks to obtain complete marked curves, and summarizing the complete marked curves to obtain a complete marked curve set; The damage marking curve set and the complete marking curve set are used to train the pre-acquired deep learning model and obtain an adaptive control model.

[0075] It should be explained that the division of the target grinding parameter set refers to dividing all target grinding parameter sets in the target grinding parameter set, wherein the division is performed artificially, and the number of damage parameter sets in the multiple damage parameter set sets and the number of complete parameter sets in the multiple complete parameter set sets obtained after the division are both set artificially.

[0076] It can be understood that the damage parameter group set refers to a damage grinding parameter group and a collection of multiple process grinding parameter groups recorded in the process of obtaining the damage grinding parameter group, the complete parameter group set refers to a complete grinding parameter group and a collection of multiple process grinding parameter groups recorded in the process of obtaining the complete grinding parameter group, and the damage parameter curve refers to a curve representing the relationship between the polishing parameters and the polishing time in the damage parameter group set, and the damage parameter curve includes: a damage polishing depth curve, a damage polishing speed curve and a damage feed speed curve, wherein, when the polishing parameter is the polishing depth, the damage parameter curve is a curve representing the relationship between the polishing depth and the polishing time, that is, at this time The damage parameter curve is the damage polishing depth curve. When the polishing parameter is the polishing speed, the damage parameter curve is a curve representing the relationship between the polishing speed and the polishing time, that is, the damage parameter at this time is the damage polishing speed curve. When the polishing parameter is the feed speed, the damage parameter curve is a curve representing the relationship between the feed speed and the polishing time, that is, the damage parameter curve at this time is the damage feed speed curve. The damage mark and complete mark refer to numbers or symbols set manually to identify the damage parameter curve and the complete parameter curve, respectively. The deep learning model refers to a machine learning model that can process time series data or curve data, such as: RNN, CNN, TCN, etc.

[0077] In order to solve the problems described in the background technology, the present invention first constructs a grinding and polishing platform, and uses the grinding and polishing platform to grind the microballs to be polished to obtain grinding microballs. This step completes the preliminary grinding of the microballs to be polished. Then, the grinding process of the grinding microballs is analyzed to obtain the grinding process factor. The acquisition of the grinding process factor enables the current grinding and polishing process to have a specific numerical representation. By performing a grinding damage analysis on the grinding microballs, a grinding damage factor is obtained, so that the internal damage of the grinding microballs is also numerically displayed. When the grinding microballs are not completely polished and the grinding microballs are not extremely damaged, the grinding and polishing parameters are adaptively adjusted to obtain the adjustment parameters. The entire grinding and polishing process is made more accurate. At the same time, the grinding damage factor and the grinding process factor can be used to control the stopping and continuing of the entire grinding, so that the micro-ball grinding has a higher efficiency. In addition, in multiple grinding processes, different types of grinding data can be obtained according to the grinding damage factor and the grinding process factor: a complete grinding parameter group, a process grinding parameter group, and a damage grinding parameter group. These data are used to train the deep learning model to obtain an adaptive control model. The adaptive control model can realize the automatic regulation of the grinding and polishing parameters in the grinding and polishing process without the need for artificial regulation of too many parameters in the grinding and polishing process, thereby improving the efficiency of micro-ball grinding and polishing. Therefore, the present invention can improve the accuracy and efficiency of integrated grinding and polishing of ultra-high precision micro-balls.

[0078] like Figure 2 , which is a functional module diagram of an ultra-high precision micro-sphere integrated grinding and polishing system based on adaptive control provided by one embodiment of the present invention.

[0079] The ultra-high precision microsphere integrated grinding and polishing system 100 based on adaptive control of the present invention can be installed in an electronic device. According to the functions to be implemented, the ultra-high precision microsphere integrated grinding and polishing system 100 based on adaptive control can include a grinding and polishing platform construction module 101, a damage factor analysis module 102, a grinding parameter adjustment module 103 and a control model training module 104. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0080] The polishing platform construction module 101 is used to receive a micro-ball polishing instruction, set polishing parameters based on the micro-ball polishing instruction, obtain a set of micro-balls to be polished, sequentially extract the micro-balls to be polished from the set of micro-balls to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a micro-ball carrier; The damage factor analysis module 102 is used to grind the micro-balls to be polished using the grinding and polishing platform according to the grinding and polishing parameters to obtain ground micro-balls, perform grinding process analysis on the ground micro-balls to obtain grinding process factors, and record the current grinding time to determine whether the grinding process factor is less than a preset standard process factor. If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter group. If the grinding process factor is less than the standard process factor, grinding damage analysis is performed on the ground micro-balls to obtain grinding damage factors. The grinding parameter adjustment module 103 is used to determine whether the grinding damage factor is less than a preset standard damage factor. If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain adjustment parameters, and the grinding parameters and the microballs to be polished are updated respectively using the adjustment parameters and the grinding microballs, and the step of grinding the microballs to be polished using the grinding and polishing platform according to the grinding and polishing parameters is returned; The control model training module 104 is used to pair the polishing parameters with the grinding time if the grinding damage factor is not less than the standard damage factor to obtain a damage grinding parameter group, summarize the complete grinding parameter group, the process grinding parameter group and the damage grinding parameter group to obtain a target grinding parameter group set, and construct an adaptive control model according to the target grinding parameter group set.

[0081] In detail, the modules in the ultra-high precision micro-ball integrated polishing system 100 based on adaptive control in the embodiment of the present invention are used in the same manner as described above. Figure 1 The same technical means are used as the ultra-high precision microsphere integrated polishing method based on adaptive control described in, and can produce the same technical effects, so I will not go into details here.

[0082] like Figure 3 , is a schematic diagram of the structure of an electronic device for implementing an ultra-high precision micro-sphere integrated polishing method based on adaptive control provided by an embodiment of the present invention.

[0083] The electronic device 1 may include a processor 10, a memory 11 and a bus 12, and may also include a computer program stored in the memory 11 and executable on the processor 10, such as an ultra-high precision microsphere integrated polishing method program based on adaptive control.

[0084] Among them, the memory 11 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (for example: SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the electronic device 1, such as a mobile hard disk of the electronic device 1. In other embodiments, the memory 11 can also be an external storage device of the electronic device 1, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device 1. Further, the memory 11 also includes an internal storage unit of the electronic device 1 and an external storage device. The memory 11 can not only be used to store application software and various types of data installed in the electronic device 1, such as the code of the program of the ultra-high precision microsphere integrated polishing method based on adaptive control, but also can be used to temporarily store data that has been output or is to be output.

[0085] In some embodiments, the processor 10 may be composed of an integrated circuit, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips. The processor 10 is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect various components of the entire electronic device, and executes or executes programs or modules stored in the memory 11 (such as an ultra-high precision microsphere integrated polishing method program based on adaptive control, etc.), and calls data stored in the memory 11 to execute various functions of the electronic device 1 and process data.

[0086] The bus 12 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus 12 may be divided into an address bus, a data bus, a control bus, etc. The bus 12 is configured to realize connection and communication between the memory 11 and at least one processor 10, etc.

[0087] Figure 3 Only an electronic device with components is shown, and those skilled in the art will understand that Figure 3The structure shown does not constitute a limitation on the electronic device 1, and may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0088] For example, although not shown, the electronic device 1 may also include a power source (such as a battery) for supplying power to various components. Preferably, the power source may be logically connected to the at least one processor 10 through a power management system, so that the power management system can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators. The electronic device 1 may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be repeated here.

[0089] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device 1 and other electronic devices.

[0090] Optionally, the electronic device 1 may further include a user interface, which may be a display, an input unit (such as a keyboard), or a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode) touch device. The display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device 1 and to display a visual user interface.

[0091] The program of the ultra-high precision micro-sphere integrated polishing method based on adaptive control stored in the memory 11 of the electronic device 1 is a combination of multiple instructions. When running in the processor 10, it can achieve: Receiving a micro-ball polishing instruction, and setting polishing parameters based on the micro-ball polishing instruction; Obtain a set of microspheres to be polished, extract the microspheres to be polished in sequence from the set of microspheres to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a microsphere carrier; According to the grinding and polishing parameters, the microspheres to be polished are ground using the grinding and polishing platform to obtain ground microspheres, a grinding process analysis is performed on the ground microspheres to obtain a grinding process factor, and a current grinding time is recorded; Determine whether the grinding process factor is less than a preset standard process factor; If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter set; If the grinding process factor is less than the standard process factor, performing a grinding damage analysis on the grinding microspheres to obtain a grinding damage factor; Determine whether the grinding damage factor is less than the preset standard damage factor; If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain an adjustment parameter; Using the adjustment parameters and the grinding microballs to update the grinding parameters and the microballs to be polished respectively, and returning to the step of grinding the microballs to be polished using the grinding and polishing platform according to the grinding and polishing parameters; If the grinding damage factor is not less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a damage grinding parameter group; The complete grinding parameter group, process grinding parameter group and damage grinding parameter group are summarized to obtain a target grinding parameter group set, an adaptive control model is constructed according to the target grinding parameter group set, and ultra-high precision microsphere integrated grinding and polishing based on adaptive control is completed based on the adaptive control model.

[0092] Specifically, the specific implementation method of the processor 10 for the above instructions can refer to Figures 1 to 3 The description of the relevant steps in the corresponding embodiments will not be repeated here.

[0093] Furthermore, if the module / unit integrated in the electronic device 1 is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium can include: any entity or system that can carry the computer program code, a recording medium, a USB flash drive, a mobile hard disk, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0094] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor of an electronic device, the computer program can implement: Receiving a micro-ball polishing instruction, and setting polishing parameters based on the micro-ball polishing instruction; Obtain a set of microspheres to be polished, extract the microspheres to be polished in sequence from the set of microspheres to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a microsphere carrier; According to the grinding and polishing parameters, the microspheres to be polished are ground using the grinding and polishing platform to obtain ground microspheres, a grinding process analysis is performed on the ground microspheres to obtain a grinding process factor, and a current grinding time is recorded; Determine whether the grinding process factor is less than a preset standard process factor; If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter set; If the grinding process factor is less than the standard process factor, performing a grinding damage analysis on the grinding microspheres to obtain a grinding damage factor; Determine whether the grinding damage factor is less than the preset standard damage factor; If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain an adjustment parameter; Using the adjustment parameters and the grinding microballs to update the grinding parameters and the microballs to be polished respectively, and returning to the step of grinding the microballs to be polished using the grinding and polishing platform according to the grinding and polishing parameters; If the grinding damage factor is not less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a damage grinding parameter group; The complete grinding parameter group, process grinding parameter group and damage grinding parameter group are summarized to obtain a target grinding parameter group set, an adaptive control model is constructed according to the target grinding parameter group set, and ultra-high precision microsphere integrated grinding and polishing based on adaptive control is completed based on the adaptive control model.

[0095] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only illustrative, and actual implementation may have other division methods.

[0096] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0097] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0098] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. An ultra-high precision micro-sphere integrated polishing method based on adaptive control, characterized in that: The method comprises: Receiving a micro-ball polishing instruction, and setting polishing parameters based on the micro-ball polishing instruction; Obtain a set of microspheres to be polished, extract the microspheres to be polished in sequence from the set of microspheres to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a microsphere carrier; According to the grinding and polishing parameters, the microspheres to be polished are ground using the grinding and polishing platform to obtain ground microspheres, a grinding process analysis is performed on the ground microspheres to obtain a grinding process factor, and a current grinding time is recorded; Determine whether the grinding process factor is less than a preset standard process factor; If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter set; If the grinding process factor is less than the standard process factor, performing a grinding damage analysis on the grinding microspheres to obtain a grinding damage factor; Determine whether the grinding damage factor is less than the preset standard damage factor; If the grinding damage factor is less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a process grinding parameter group, and the grinding and polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain an adjustment parameter; Using the adjustment parameters and the grinding microballs to update the grinding parameters and the microballs to be polished respectively, and returning to the step of grinding the microballs to be polished using the grinding and polishing platform according to the grinding and polishing parameters; If the grinding damage factor is not less than the standard damage factor, the grinding and polishing parameters are paired with the grinding time to obtain a damage grinding parameter group; The complete grinding parameter group, process grinding parameter group and damage grinding parameter group are summarized to obtain a target grinding parameter group set, an adaptive control model is constructed according to the target grinding parameter group set, and ultra-high precision microsphere integrated grinding and polishing based on adaptive control is completed based on the adaptive control model.

2. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 1, characterized in that: The construction of the polishing platform comprises: Adding the grinding stone liquid into the microball carrier, and placing the microballs to be polished in the microball carrier, wherein the grinding stone liquid in the microball carrier covers the microballs to be polished; The electric spindle is connected to the polishing head to obtain a polishing rotating body, and the polishing rotating body is fixed on the surface of the microsphere to be polished to complete the construction of the polishing platform.

3. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 2, characterized in that: The grinding process analysis of the grinding microspheres to obtain the grinding process factor includes: The grinding microspheres are photographed microscopically to obtain a worn microsphere image group, wherein the worn microsphere image group includes four worn microsphere images, all of which are grayscale images, and different worn microsphere images in the worn microsphere image group come from different surfaces of the grinding microspheres; Extracting the worn microsphere images in the worn microsphere image group in sequence, identifying the image center of the worn microsphere image, and adding coordinates to the worn microsphere image based on the image center to obtain a coordinate microsphere image, wherein the coordinate center of the coordinate microsphere image is the image center, the horizontal axis is the horizontal direction of the coordinate microsphere image, and the vertical axis is the vertical direction of the coordinate microsphere image; The radial line precision value is set, and an extended radial line set is constructed in the coordinate microsphere image according to the radial line precision value and the image center, wherein the number of extended radial lines in the extended radial line set is the radial line precision value, and the extended radial lines pass through the image center; For each extension radius line in the extension radius line set, perform the following actions: Extracting a radial pixel point set from the extended radial line, wherein the radial pixel points in the radial pixel point set are arranged from far to near according to the distance from the center of the image; According to the radial pixel point set, determining whether there is an abrupt point in the extended radial line; If there is an abrupt point in the extended radial line, the extended radial line will be cut based on the abrupt point to obtain a cutting radial line group, wherein the cutting radial line group includes two sections of cutting radial lines; Extracting cutting lines in the cutting line group in sequence, and updating the extended lines by using the cutting lines, and returning to the step of extracting the line pixel point set in the extended lines; If the extended path line does not have any abrupt points, the extended path line is recorded as the target path line; Summarize the target diameters of the extended diameters to obtain a target diameter group, identify the maximum diameter in the target diameter group, and remove the maximum diameter from the target diameter group to obtain a fine line interval group; The maximum diameter line and fine line interval group corresponding to each extended diameter line are summarized respectively to obtain the maximum diameter line set and the fine line interval set; Based on the fine line interval set, the surface roughness analysis is performed on the worn microsphere image to obtain the grinding roughness factor, and according to the maximum diameter line set, the contour grinding analysis is performed on the worn microsphere image to obtain the grinding contour factor; The grinding roughness factor and grinding profile factor corresponding to each worn microsphere image are respectively summarized to obtain a grinding roughness factor set and a grinding profile factor set. Based on the grinding roughness factor set and the grinding profile factor set, the grinding process factor is calculated using a preset grinding process function, wherein the grinding process factor is expressed as: ， ， in, represents the grinding process factor, represents the grinding process function, represents the grinding roughness factor set, represents the grinding profile factor set, Indicates the number of grinding roughness factors in the grinding roughness factor set or the number of grinding profile factors in the grinding profile factor set, represents the first The grinding roughness factor, Indicates the first grinding profile factor.

4. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 3, characterized in that: The step of judging whether there is an abrupt point in the extended radial line according to the radial line pixel point set includes: Counting the radial interval between each radial pixel point in the radial pixel point set and the image center to obtain a radial interval set, and identifying a radial pixel value set corresponding to the radial pixel point set, wherein the radial intervals in the radial interval set correspond to the radial pixel values ​​in the radial pixel value set in a one-to-one correspondence; According to the radial pixel value set, radial interval set and the preset standard microsphere radius, the pixel distribution mean difference is calculated, wherein the pixel distribution mean difference is expressed as: ， in, Indicates the average difference in pixel distribution, Indicates the number of radial pixel points in the radial pixel point concentration. Indicates the radial pixel value set Radius pixel value, Indicates the radial interval concentration Radius interval, represents the standard microsphere radius, represents the absolute value symbol, Indicates the radial pixel value set Radial pixel value; Determine whether the pixel distribution mean difference is greater than a preset standard distribution mean difference; If the pixel distribution mean difference is greater than the standard distribution mean difference, the maximum pixel point in the radial pixel point set is identified and recorded as an abrupt point; If the pixel distribution mean difference is not greater than the standard distribution mean difference, then there is no abrupt point in the extended radial line.

5. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 4, characterized in that: The surface roughness analysis of the worn microsphere image is performed based on the fine line interval set to obtain the grinding roughness factor, including: Obtaining the number of fine line intervals in the fine line interval set, and counting the interval length of each fine line interval in the fine line interval set to obtain an interval length set, and calculating the total interval length of the interval length set; According to the interval length set, the number of fine line intervals and the total interval length, the grinding roughness factor is calculated using the following formula: ， in, represents the grinding roughness factor, Indicates the number of fine line intervals, represents the number of interval lengths in the interval length set, Indicates interval length, Indicates the total length of the interval.

6. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 5, characterized in that: The grinding profile factor is obtained by performing a profile grinding analysis on the worn microsphere image according to the maximum diameter line set, including: Extract the maximum radial lines in the maximum radial line set in sequence, and identify the contour extension radial line corresponding to the maximum meridian; Calculate the grinding profile radius based on the profile extension line and the maximum line, wherein the grinding profile radius is the difference between the length of the profile extension line and the length of the maximum line; The grinding profile radii are summarized to obtain a grinding profile radius set, and a grinding profile factor is calculated according to the grinding profile radius set and the standard microsphere radius, wherein the grinding profile factor is expressed as: ， in, represents the grinding profile factor, Indicates the number of grinding profile radii in the grinding profile radius set, Indicates the first Grinding profile radius.

7. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 6, characterized in that: The grinding damage analysis of the grinding microspheres to obtain the grinding damage factor comprises: Performing ultrasonic testing on the grinding microspheres within a preset testing time to obtain an ultrasonic return number; Obtaining microspheres of the same type as the grinding microspheres, and performing ultrasonic testing on the microspheres of the same type based on the testing time to obtain a standard return number; Based on the ultrasonic return number and the standard return number, the grinding damage factor is calculated: ， in, represents the grinding damage factor, Indicates the standard return number, Indicates the number of ultrasonic returns.

8. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 7, characterized in that: The polishing parameters are adjusted according to the grinding damage factor and the grinding process factor to obtain the adjustment parameters, including: Setting the adjustment variation coefficient, wherein the adjustment variation coefficient includes: depth variation coefficient, rotation speed variation coefficient and speed variation coefficient; According to the adjustment variation coefficient, the grinding damage factor, the standard damage factor, the grinding process factor and the standard process factor, the adjustment parameters are calculated, wherein the adjustment parameters include: adjusting the grinding and polishing depth, adjusting the grinding and polishing speed and adjusting the feed speed, and the adjustment parameters are expressed as: ， in, Indicates the adjustment of polishing depth. Indicates the polishing depth. represents the depth variation coefficient, represents the standard process factor, represents the standard damage factor, Indicates the adjustment of grinding and polishing speed. Indicates the grinding speed. represents the speed variation coefficient, Indicates adjusting the feed speed. Indicates the feed speed, Indicates the speed variation coefficient.

9. The ultra-high precision micro-sphere integrated polishing method based on adaptive control as claimed in claim 8, characterized in that: The method of constructing an adaptive control model according to the target grinding parameter set includes: Dividing the target grinding parameter set to obtain a plurality of damage parameter sets and a plurality of complete parameter sets, wherein each damage parameter set includes a damage grinding parameter set and a plurality of process grinding parameter sets, and each complete parameter set includes a complete grinding parameter set and a plurality of process grinding parameter sets; Extracting damage parameter sets in sequence from the plurality of damage parameter sets, and drawing a damage parameter curve of the damage parameter set, wherein the horizontal axis of the damage parameter curve is the polishing time, and the vertical axis is the polishing parameter; Using a preset damage mark to mark the damage parameter curve to obtain a damage mark curve, and summarizing the damage mark curves to obtain a damage mark curve set; Extracting complete parameter sets from multiple complete parameter sets in sequence, drawing complete parameter curves of the complete parameter sets, marking the complete parameter curves with preset complete marks to obtain complete marked curves, and summarizing the complete marked curves to obtain a complete marked curve set; The damage marking curve set and the complete marking curve set are used to train the pre-acquired deep learning model and obtain an adaptive control model.

10. An ultra-high precision micro-ball integrated polishing system based on adaptive control, characterized in that: The system comprises: A polishing platform construction module is used to receive a micro-ball polishing instruction, set polishing parameters based on the micro-ball polishing instruction, obtain a set of micro-balls to be polished, sequentially extract the micro-balls to be polished from the set of micro-balls to be polished, and construct a polishing platform, wherein the polishing platform includes: an electric spindle, a polishing head, a grinding stone liquid, and a micro-ball carrier; A damage factor analysis module is used to grind the microballs to be polished using a grinding and polishing platform according to the grinding and polishing parameters to obtain ground microballs, perform grinding process analysis on the ground microballs to obtain a grinding process factor, and record the current grinding time to determine whether the grinding process factor is less than a preset standard process factor. If the grinding process factor is not less than the standard process factor, the grinding and polishing parameters are paired with the grinding time to obtain a complete grinding parameter group. If the grinding process factor is less than the standard process factor, a grinding damage analysis is performed on the ground microballs to obtain a grinding damage factor. a grinding parameter adjustment module, for judging whether the grinding damage factor is less than a preset standard damage factor; if the grinding damage factor is less than the standard damage factor, pairing the grinding and polishing parameters with the grinding time to obtain a process grinding parameter group; adjusting the grinding and polishing parameters according to the grinding damage factor and the grinding process factor to obtain adjustment parameters; updating the grinding parameters and the microballs to be polished respectively by using the adjustment parameters and the grinding microballs; and returning to the step of grinding the microballs to be polished by using the grinding and polishing platform according to the grinding and polishing parameters; The control model training module is used to pair the polishing parameters with the grinding time if the grinding damage factor is not less than the standard damage factor to obtain a damage grinding parameter group, summarize the complete grinding parameter group, the process grinding parameter group and the damage grinding parameter group to obtain a target grinding parameter group set, and construct an adaptive control model according to the target grinding parameter group set.

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