Heat dissipation type PCB assembly

Abstract

The invention relates to the technical field of electronics, in particular to a heat dissipation type PCB assembly. An existing damping device is a spring or a rubber pad, and the damping mode can only buffer vibration in a single direction and cannot buffer vibration force in multiple directions. The invention relates to a heat dissipation type PCB (Printed Circuit Board) assembly, which comprises a fixed frame, the multiple cushioning air bags are fixedly connected to the two sides of the fixing frame correspondingly; the PCB is wrapped by the plurality of cushioning air bags; the flexible air bag is fixedly connected to the fixing frame; the communicating pipe is fixedly connected and communicated between all the cushioning air bags and the flexible air bag; and the heat dissipation assembly is arranged on the PCB and is used for carrying out heat dissipation on the PCB. The PCB is locally wrapped by the plurality of cushioning air bags, so that the cushioning air bags can buffer vibration force in multiple directions, the PCB is ensured to be in a stable state, and the probability of welding spot cracking on the PCB is reduced.

Description

Technical Field

[0001] The invention relates to the field of electronic technology, and in particular to a heat dissipation type PCB board assembly. Background Art

[0002] PCB board, or printed circuit board, is a basic component used in the electronics industry for mechanical support and electrical connection of various electronic components. It forms a conductive pattern on an insulating substrate by etching to achieve electrical connection between electronic components. PCB board can be single-layer, double-layer or multi-layer, depending on its complexity and purpose. After the PCB board is installed on the required machine, the machine itself or the environment in which the machine operates is often accompanied by vibration. If the PCB board is in a vibrating environment for a long time, it is very easy for the solder joints to be repeatedly subjected to stress, and then the solder joints will crack or break, which will affect the quality of the electrical connection. Therefore, it is necessary to install a vibration reduction device during the installation of the PCB board. Most of the existing vibration reduction devices are simple springs or rubber pads. This vibration reduction method can only reduce vibration in a single direction, and cannot offset vibration forces in multiple directions, resulting in the solder joints on the PCB board still being subjected to stress when vibrating in other directions, and thus cannot significantly reduce the probability of solder joints on the PCB board cracking or breaking. Summary of the invention

[0003] In order to overcome the shortcomings mentioned in the above background technology, the present invention provides a heat dissipation type PCB board assembly.

[0004] The technical implementation scheme of the present invention is: a heat dissipation type PCB board assembly, comprising: Fixed frame; There are a plurality of shock-absorbing airbags, which are respectively fixedly connected to two sides of the fixing frame; A PCB board is wrapped by a plurality of the shock absorbing air bags; A flexible airbag, fixedly connected to the fixing frame; A connecting pipe, fixedly connected and connected between all the shock absorbing airbags and the flexible airbags; The heat dissipation component is arranged on the PCB board and is used for dissipating heat from the PCB board.

[0005] Furthermore, the heat dissipation component includes: Heat dissipation silica gel, fixedly connected to the PCB board; A heat sink, fixedly connected to the heat dissipation silica gel, the heat sink being provided with a ring array of heat dissipation channels; A heat dissipation fan is fixedly connected to the heat dissipation plate, and an air outlet of the heat dissipation fan is communicated with the heat dissipation channels of the annular array.

[0006] Furthermore, the heat dissipation channel is a wavy channel, and the wave range of the heat dissipation channel gradually increases from the center to the side of the heat dissipation plate, so as to uniformly absorb the heat of the heat dissipation silica gel.

[0007] Furthermore, the aperture size of the heat dissipation channel is proportional to its own length, so as to uniformly absorb the heat of the heat dissipation silica gel.

[0008] Furthermore, it also includes: A detection component is arranged inside the heat dissipation silica gel and is used to detect the temperature of the PCB board. The detection component includes: There are several detection main pipes, all of which are fixedly connected to the inside of the heat dissipation silica gel; An external pipe is fixedly connected to the plurality of detection main pipes, and the plurality of detection main pipes are all in communication with the external pipe; An elastic push rod is fixedly connected to the fixing frame, and a fixing portion of the elastic push rod is connected to the external pipe through a pipeline; An adjusting component, disposed on the connecting pipe, for adjusting the flow rate of the connecting pipe; Auxiliary heat exchange components are arranged in the detection main pipes and are used to stir the gas in the detection main pipes.

[0009] Furthermore, the adjustment component includes: A regulating valve, fixedly connected to the connecting pipe, for adjusting the flow aperture of the connecting pipe; A gear, fixedly connected to the rotating end of the regulating valve; The rack frame is fixedly connected to the telescopic end of the elastic push rod, and the rack frame is meshed with the gear.

[0010] Furthermore, the auxiliary heat exchange component includes: The guide plates are the same in number as the detection main pipes, and are rotatably connected to the inside of the adjacent detection main pipes, the guide plates are composed of a rotating shaft and a plurality of blades, and the blades of the guide plates are provided with linearly distributed guide grooves; The driving assembly is arranged on the heat dissipation plate and is used for driving a plurality of the guide plates to swing back and forth.

[0011] Furthermore, the guide grooves on adjacent blades of the guide plate are staggeredly distributed, so as to evenly push the gas in the detection main pipe.

[0012] Furthermore, the guide groove is a V-shaped groove, which is used to guide the gas in the detection main pipe to generate a vortex.

[0013] Furthermore, the driving assembly includes: A driving rod, slidably connected to the heat sink; Docking blocks, the number of which is the same as that of the guide plates, are fixedly connected to the driving rods, and the docking blocks are used to drive the adjacent driving rods to swing; The electric slide rail is fixedly connected to the heat sink, and the slider of the electric slide rail is fixedly connected to the driving rod.

[0014] The present invention has the following advantages: 1. The present invention wraps and fixes a part of the PCB board through a plurality of shock-absorbing airbags, so that the shock-absorbing airbags can offset vibration forces in multiple directions, ensure that the PCB board is in a stable state, and reduce the probability of cracking of solder joints on the PCB board due to vibration forces.

[0015] 2. By first gathering the gas at the center of the bottom of the PCB board and then distributing it outward along the heat dissipation channel, a large amount of gas first dissipates heat from the core electronic components in the middle of the PCB board, and then gradually dissipates it outward to dissipate heat from the remaining electronic components. Targeted heat dissipation is performed on the core electronic components of the PCB board to avoid damage caused by excessive local temperature of the PCB board.

[0016] 3. Through the wavy heat dissipation channel, the wave amplitude of the heat dissipation channel is gradually increased from the center to the side of the heat dissipation plate, and the length of the heat dissipation channel is proportional to its aperture size, so that the gas in the heat dissipation channel can evenly absorb the heat in the heat dissipation silica gel.

[0017] 4. By detecting the temperature of the PCB board, the damping effect of several shock-absorbing airbags on the PCB board is adaptively adjusted to avoid the mechanical strength reduction of the solder joints of the PCB board due to the increase in temperature, and the risk of cracking or falling off of the solder joints under vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the shock-absorbing airbag and the connecting tube of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the flexible airbag and the connecting tube of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the heat dissipation silica gel and the heat dissipation plate of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the heat dissipation plate and the heat dissipation fan of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the heat dissipation channel of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the detection main pipe and the external pipe of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the guide plate and the guide groove of the present invention; Fig. 9It is a three-dimensional structural schematic diagram of the regulating valve and gear of the present invention.

[0019] The meanings of the reference numerals in the figure are as follows: 1: fixing frame, 2: shock-absorbing airbag, 3: PCB board, 4: flexible airbag, 5: connecting pipe, 201: heat dissipation silica gel, 202: heat dissipation plate, 203: heat dissipation channel, 204: heat dissipation fan, 301: detection main pipe, 302: external pipe, 303: elastic push rod, 304: regulating valve, 305: gear, 306: rack rack, 401: guide plate, 402: guide groove, 403: driving rod, 404: docking block, 405: electric slide rail. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Currently, common vibration reduction measures mainly rely on simple springs or rubber pads. These methods can only effectively alleviate vibrations from specific directions, but are unable to cope with complex vibration forces in multi-dimensional space. As a result, although vibrations in one direction are suppressed, vibrations in other directions will still cause additional stress to the solder joints on the PCB board, thereby failing to significantly reduce the possibility of cracks or complete breakage of the solder joints.

[0022] A heat dissipation PCB assembly, such as Figure 1-Figure 3 As shown, it includes: a fixing frame 1; a plurality of shock-absorbing airbags 2, which are fixedly connected to both sides of the fixing frame 1; a PCB board 3, which is wrapped by the plurality of shock-absorbing airbags 2; a flexible airbag 4, which is fixedly connected to the fixing frame 1; a connecting pipe 5, which is fixedly connected and connected between all the shock-absorbing airbags 2 and the flexible airbags 4; and a heat dissipation component, which is arranged on the PCB board 3 and is used to dissipate heat from the PCB board 3.

[0023] In the above scheme, the shape of the fixing frame 1 can be freely changed according to the actual installation space, and is fixedly connected to the machine to be used by bolts. The bolts are shear-resistant bolts, which are used to improve the fixing stability of the fixing frame 1. The shock-absorbing airbag 2 is used to wrap a part of the PCB board 3, and the shock-absorbing airbag 2 is initially expanded to the limit state, so that the internal gas can enter the connecting tube 5 when the shock-absorbing airbag 2 is squeezed. The flexible airbag 4 is initially in an unexpanded or semi-expanded state, similar to a balloon, and is used for further expansion. At the same time, the expansion resistance buffers the external vibration force. The connecting tube 5 is a flexible tube, and all the shock-absorbing airbags 2 are connected to the connecting tube 5, and the connecting tube 5 is separately connected to the flexible airbag 4. The PCB board 3 is partially wrapped and fixed by a number of shock-absorbing airbags 2, so that the shock-absorbing airbag 2 can offset the vibration force in multiple directions, ensure that the PCB board 3 is in a stable state, and reduce the probability of cracking of the solder joints on the PCB board 3 due to the vibration force.

[0024] Specifically, Figure 4-Figure 6 As shown, the heat dissipation component includes: a heat dissipation silica gel 201, which is fixedly connected to the PCB board 3; a heat dissipation plate 202, which is fixedly connected to the heat dissipation silica gel 201, and the heat dissipation plate 202 is provided with a heat dissipation channel 203 in a circular array; a heat dissipation fan 204, which is fixedly connected to the heat dissipation plate 202, and the air outlet end of the heat dissipation fan 204 is connected to the heat dissipation channel 203 in the circular array; the heat dissipation channel 203 is a wavy channel, and the wave range of the heat dissipation channel 203 gradually increases from the center of the heat dissipation plate 202 to the side, which is used to uniformly absorb the heat of the heat dissipation silica gel 201; the aperture size of the heat dissipation channel 203 is proportional to its own length, which is used to uniformly absorb the heat of the heat dissipation silica gel 201.

[0025] In the above scheme, the heat dissipation silicone 201 is completely attached to the lower side of the PCB board 3. The heat dissipation silicone 201 can be a thermally conductive pad and a thermally conductive silicone sheet, which has certain flexibility and compressibility and can adapt to different installation conditions. Its shape is adjusted according to the actual shape of the PCB board 3. The heat dissipation plate 202 is made of copper plate or aluminum plate, which has good thermal conductivity and can be changed according to actual conditions. The heat dissipation fan 204 is an axial flow fan, which is low in cost and easy to install, and drives the wind flow from bottom to top. Since the shape of the PCB board 3 is mostly a rectangular plate, and the core electronic components are mostly located on the PCB board 3 In the middle, one end of the heat dissipation channel 203 of the annular array is located at the center of the heat dissipation plate 202 and is the inlet end, and the other end is located on the side of the heat dissipation plate 202 and is the outlet end. By allowing the gas to first converge at the center of the bottom of the PCB board 3 and then radiate outward along the heat dissipation channel, a large amount of gas is first dissipated from the core electronic components in the middle of the PCB board 3. At the same time, the length from the inlet end to the outlet end of the heat dissipation channel 203 is different, and the heat exchange area through which it flows is different. At this time, the longer the length of the heat dissipation channel 203, the larger its flow aperture, which is used to increase the gas content per unit length and improve the uniformity of heat dissipation of the PCB board 3.

[0026] Working principle: the staff installs the device on the machine to be installed, that is, installs the fixing frame 1 at the required position by bolts. After the machine is put into use, the external environment will vibrate, which will cause the synchronous vibration of the fixing frame 1. At this time, the fixing frame 1 will drive the several shock-absorbing airbags 2 thereon to vibrate synchronously. At this time, the several shock-absorbing airbags 2 will generate a force with the PCB board 3, thereby compressing the gas in the shock-absorbing airbags 2. The compressed gas in the shock-absorbing airbags 2 will enter the connecting pipe 5. At this time, the gas in the connecting pipe 5 enters the flexible airbag 4 to expand the flexible airbag 4. When the flexible airbag 4 expands, it will generate expansion resistance, thereby offsetting the external vibration, so that the PCB board 3 is in a stable state. The PCB board 3 is partially wrapped and fixed by several shock-absorbing airbags 2, so that the shock-absorbing airbags 2 can offset the vibration force in multiple directions, ensure that the PCB is in a stable state, and avoid cracking of the solder joints on the PCB due to the influence of the vibration force.

[0027] Since the core electronic components on the PCB board 3 are mostly located in the middle or center, the heat generated by the core components during operation is much greater than the heat generated by the other electronic components. Therefore, when the machine starts to be used, the heat dissipation fan 204 in the device is synchronously turned on, so that the heat dissipation fan 204 draws external airflow, and the external airflow enters the plurality of heat dissipation channels 203 of the annular array along the center of the bottom of the heat dissipation plate 202, and then the gas flows along the plurality of heat dissipation channels 203 of the annular array and is discharged outwardly. At the same time, the heat generated by the electronic components on the PCB board 3 during operation will be absorbed by the heat dissipation silica gel 201, and then the gas flowing in the heat dissipation channel 203 will absorb the heat absorbed by the heat dissipation silica gel 201, and carry the heat out to achieve the discharge of the heat generated during the operation of the PCB. By firstly converging the gas at the center of the bottom of the PCB and then dissipating it outwardly along the heat dissipation channel 203, a large amount of gas first dissipates the heat at the center of the heat dissipation silica gel 201, and then gradually dissipates it outwardly to dissipate the heat to the other parts of the heat dissipation silica gel 201, thereby specifically dissipating the heat to the core electronic components of the PCB to avoid damage caused by excessive local temperature of the PCB.

[0028] In the process of gas flowing along the heat dissipation channel 203, since the heat dissipation channel 203 is wavy, the gas will constantly change its flow direction in the heat dissipation channel 203, so that the gas collides with the inner wall and rolls when switching directions along the heat dissipation channel 203, and the flow pattern of the gas is changed, so that the gas evenly absorbs the heat in the heat dissipation silica gel 201. At the same time, since the wave amplitude of the heat dissipation channel 203 gradually increases from the center of the heat dissipation plate 202 to the side, the heat exchange area of ​​the gas in the heat dissipation channel 203 to the heat dissipation silica gel 201 is increased, so that the heat dissipation silica gel 201 is heated and cooled. 01 is evenly discharged. At the same time, since the PCB is a rectangular plate, the distance from the center to the edge is different, resulting in different lengths of the heat dissipation channel 203, that is, different required heat exchange areas, that is, different heat exchange areas through which the gas per unit length in the heat dissipation channel 203 flows. Therefore, in this application, the longer the length of the heat dissipation channel 203, the larger the aperture of the heat dissipation channel 203, which is used to increase the flow rate of the gas per unit length of the heat dissipation channel 203 to adapt to the increase in the heat exchange area and ensure that the gas in the heat dissipation channel 203 evenly absorbs the heat in the heat dissipation silica gel 201.

[0029] In a further embodiment, Figure 1 , Figure 7 and Fig. 9 As shown, it also includes: a detection component, which is arranged inside the heat dissipation silicone 201 and is used to detect the temperature of the PCB board 3. The detection component includes: a detection main pipe 301, which has several detection main pipes, all of which are fixedly connected to the inside of the heat dissipation silicone 201; an external pipe 302, which is fixedly connected to the detection main pipes 301, and the detection main pipes 301 are connected to the external pipe 302; an elastic push rod 303, which is fixedly connected to the fixing frame 1, and the fixed part of the elastic push rod 303 is connected to the external pipe 302 through a pipeline; an adjustment component, which is arranged on the connecting pipe 5 and is used to adjust the flow rate of the connecting pipe 5; an auxiliary heat exchange component, which is arranged in the detection main pipes 301 and is used to stir the gas in the detection main pipe 301.

[0030] In the above scheme, the detection main pipe 301 is located inside the heat dissipation silicone 201, that is, it is wrapped inside by the heat dissipation silicone 201. At the same time, the material of the detection main pipe 301 is also a heat-conducting material, such as copper or aluminum, which is convenient for conducting the heat of the heat dissipation silicone 201 to the gas in the detection main pipe 301. The gas in the detection main pipe 301 is a heat-expanding gas, which is used to make the gas in the detection main pipe 301 expand when heated and push the telescopic end of the elastic push rod 303 through the external pipe 302. The pipe between the fixed part of the elastic push rod 303 and the external pipe 302 is a flexible pipe, which prevents the vibration of the fixing frame 1 from being transmitted to the PCB board 3 through the elastic push rod 303 and the pipe.

[0031] Specifically, Fig. 9As shown, the regulating assembly includes: a regulating valve 304, fixedly connected to the connecting pipe 5, for adjusting the flow aperture of the connecting pipe 5; a gear 305, fixedly connected to the rotating end of the regulating valve 304; a rack rack 306, fixedly connected to the telescopic end of the elastic push rod 303, and the rack rack 306 is meshed with the gear 305.

[0032] In the above scheme, the regulating valve 304 is used to change the gas flow aperture of the connecting pipe 5, thereby increasing the vibration reduction effect of the shock-absorbing airbag 2 on the PCB board 3. At the same time, the outside of the gear 305 and the rack rack 306 are provided with a wear-resistant coating, such as chromium and nickel, which is used to reduce the friction loss caused by external vibration and extend the service life.

[0033] Specifically, Figure 4 , Figure 7 and Figure 8 As shown, the auxiliary heat exchange component includes: guide plates 401, the number of which is the same as that of the detection main pipe 301, which are rotatably connected to the inside of adjacent detection main pipes 301, and the guide plates 401 are composed of a rotating shaft and a plurality of blades, and the blades of the guide plates 401 are provided with linearly distributed guide grooves 402; a driving component, which is arranged on the heat dissipation plate 202, and is used to drive the plurality of guide plates 401 to swing back and forth; the guide grooves 402 on the adjacent blades of the guide plates 401 are staggered and are used to evenly push the gas in the detection main pipe 301; the guide grooves 402 are V-shaped grooves, which are used to guide the gas in the detection main pipe 301 to generate vortices.

[0034] In the above scheme, the number of fan blades on the guide plate 401 can be changed according to actual conditions, and the fan blades on the guide plate 401 are fitted with the inner wall of the detection main pipe 301, so that the fan blades on the guide plate 401 can push the gas in the detection main pipe 301 to move. The V-shaped groove opening of the guide groove 402 faces the adjacent rotating shaft, and the V-shaped angle of the guide groove 402 can be adjusted according to actual conditions. By stirring the gas in the detection main pipe 301, the turbulence degree of the gas in the detection main pipe 301 is increased, and the heat exchange efficiency between the heat dissipating silica gel 201 and the gas in the detection main pipe 301 is improved.

[0035] Specifically, Figure 4 , Figure 7 and Figure 8 As shown, the driving assembly includes: a driving rod 403, which is slidably connected to the heat sink 202; a docking block 404, which is the same in number as the guide plate 401 and is rotatably connected to the driving rod 403, the docking block 404 is slidably connected to the rotating shaft of the guide plate 401, and the docking block 404 is used to drive the adjacent driving rod 403 to swing; an electric slide rail 405, which is fixedly connected to the heat sink 202, and the slider of the electric slide rail 405 is fixedly connected to the driving rod 403.

[0036] In the above solution, the docking block 404 is a U-shaped block, so that the rotating shaft on the guide plate 401 is connected to the docking block 404, and the outside of the docking block 404 is electroplated with a wear-resistant coating, such as chromium or nickel coating, to extend the service life of the docking block 404.

[0037] Working principle: The PCB board 3 generates a lot of heat during operation, which causes the temperature of the PCB board 3 to rise. The high temperature will reduce the mechanical strength of the solder joints. Under vibration conditions, the solder joints are very likely to crack or fall off. At this time, the plurality of detection main pipes 301 detect the temperature of the PCB board 3 through the heat dissipation silicone 201. When the temperature of the PCB board 3 rises, the temperature inside the heat dissipation silicone 201 rises synchronously. At this time, the gas inside the plurality of detection main pipes 301 absorbs the heat of the heat dissipation silicone 201, and the temperature of the gas inside the detection main pipes 301 rises synchronously, causing the gas inside the plurality of detection main pipes 301 to expand due to the heat. The expansion of the gas inside the detection main pipe 301 pushes the gas inside the external pipe 302. The gas enters the fixed part of the elastic push rod 303 through the pipeline. At this time, the gas in the fixed part of the elastic push rod 303 pushes its telescopic end to slide outward, so that the telescopic end of the elastic push rod 303 drives the rack 306 to move synchronously. At this time, the rack 306 drives the gear 305 to rotate synchronously, so that the gear 305 drives the rotating end of the regulating valve 304 to rotate synchronously, so that the regulating valve 304 changes the flow aperture of the connecting pipe 5, thereby reducing the resistance of the plurality of shock-absorbing airbags 2 to enter the flexible airbag 4, further increasing the buffering effect of the plurality of shock-absorbing airbags 2 on the PCB board 3, ensuring that the internal stress of the solder joints on the PCB board 3 is in a balanced state, and reducing the probability of solder joints on the PCB board 3 breaking.

[0038] When the temperature of the PCB board 3 decreases, the temperature of the gas in the plurality of detection main pipes 301 decreases synchronously, causing the gas in the detection main pipes 301 to shrink to the initial volume, and the telescopic end of the elastic push rod 303 drives the rack rack 306 to reset, and the rack rack 306 drives the rotating end of the regulating valve 304 to reset through the gear 305, thereby restoring the flow aperture of the connecting pipe 5 and restoring the shock absorption degree of the plurality of shock-absorbing airbags 2.

[0039] When the device starts to operate, the electric slide rail 405 is synchronously turned on, so that the slider of the electric slide rail 405 drives the driving rod 403 to perform linear reciprocating motion, so that the driving rod 403 drives a plurality of docking blocks 404 in a linear array thereon to move synchronously, and the docking blocks 404 drive the adjacent guide plates 401 to reciprocate along the adjacent detection main pipe 301. At the same time, the docking blocks 404 slide relative to the rotating shafts of the guide plates 401, and the guide plates 401 stir the gas in the detection main pipe 301, thereby increasing the degree of turbulence of the gas in the detection main pipe 301, thereby increasing the gas in the detection main pipe 301 and the heat dissipation flow channel. The heat exchange efficiency of the gas in 203 is improved, so that the gas in the detection main pipe 301 is evenly heat-exchanged with the gas in the heat dissipation channel 203, thereby improving the heat dissipation efficiency of the heat dissipation silica gel 201 and avoiding damage caused by excessive temperature of the PCB board 3. At the same time, when the guide plate 401 rotates, the guide groove 402 thereon is synchronously driven to rotate synchronously. When the gas flows through the V-shaped guide groove 402, the opposite flow of the guide groove 402 forms a vortex, further increasing the motion state of the gas in the detection main pipe 301 and improving the heat exchange rate between the gas in the detection main pipe 301 and the gas in the heat dissipation channel 203.

[0040] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A heat dissipation PCB assembly, characterized in that it includes: Fixed frame (1); A plurality of shock-absorbing airbags (2) are fixedly connected to two sides of the fixing frame (1); A PCB board (3) is wrapped by a plurality of the shock absorbing airbags (2); A flexible airbag (4) fixedly connected to the fixing frame (1); A connecting pipe (5) fixedly connected to and connected between all the shock absorbing airbags (2) and the flexible airbags (4); A heat dissipation component is arranged on the PCB board (3) and is used to dissipate heat from the PCB board (3).

2. A heat dissipation PCB assembly according to claim 1, characterized in that: The heat dissipation component includes: Heat dissipation silica gel (201), fixedly connected to the PCB board (3); A heat dissipation plate (202) fixedly connected to the heat dissipation silica gel (201), the heat dissipation plate (202) being provided with a circular array of heat dissipation channels (203); A heat dissipation fan (204) is fixedly connected to the heat dissipation plate (202), and an air outlet end of the heat dissipation fan (204) is in communication with the heat dissipation channels (203) of the annular array.

3. A heat dissipation PCB assembly according to claim 2, characterized in that: The heat dissipation channel (203) is a wave-shaped channel, and the wave range of the heat dissipation channel (203) gradually increases from the center to the side of the heat dissipation plate (202), so as to evenly absorb the heat of the heat dissipation silica gel (201).

4. A heat dissipation PCB assembly according to claim 3, characterized in that: The aperture size of the heat dissipation channel (203) is proportional to its own length, and is used to uniformly absorb the heat of the heat dissipation silica gel (201).

5. A heat dissipation PCB assembly according to claim 4, characterized in that: Also included are: A detection component is arranged inside the heat dissipating silica gel (201) and is used to detect the temperature of the PCB board (3), wherein the detection component comprises: There are a plurality of detection main pipes (301), all of which are fixedly connected to the inside of the heat dissipating silica gel (201); An external pipe (302) is fixedly connected to the plurality of detection main pipes (301), and the plurality of detection main pipes (301) are all in communication with the external pipe (302); An elastic push rod (303) is fixedly connected to the fixing frame (1), and a fixing portion of the elastic push rod (303) is connected to the external pipe (302) via a pipe; an adjusting component, arranged on the connecting pipe (5) and used for adjusting the flow rate of the connecting pipe (5); An auxiliary heat exchange component is arranged in a plurality of the detection main pipes (301) and is used to stir the gas in the detection main pipes (301).

6. A heat dissipation PCB assembly according to claim 5, characterized in that: The adjustment component includes: A regulating valve (304) fixedly connected to the connecting pipe (5) and used for adjusting the flow aperture of the connecting pipe (5); A gear (305) fixedly connected to the rotating end of the regulating valve (304); The rack frame (306) is fixedly connected to the telescopic end of the elastic push rod (303), and the rack frame (306) is meshed with the gear (305).

7. A heat dissipation PCB assembly according to claim 6, characterized in that: The auxiliary heat exchange component comprises: The guide plates (401) are the same in number as the detection main pipes (301), and are respectively rotatably connected to the inside of adjacent detection main pipes (301). The guide plates (401) are composed of a rotating shaft and a plurality of blades. The blades of the guide plates (401) are provided with guide grooves (402) distributed in a straight line. A driving assembly is arranged on the heat dissipation plate (202) and is used to drive the plurality of guide plates (401) to swing back and forth.

8. A heat dissipation PCB assembly according to claim 7, characterized in that: The guide grooves (402) on adjacent blades of the guide plate (401) are staggered and distributed, and are used to evenly push the gas in the detection main pipe (301).

9. A heat dissipation PCB assembly according to claim 8, characterized in that: The guide groove (402) is a V-shaped groove, used to guide the gas in the detection main pipe (301) to generate a vortex.

10. A heat dissipation PCB assembly according to claim 9, characterized in that: The drive assembly comprises: A driving rod (403) slidably connected to the heat dissipation plate (202); Docking blocks (404), the number of which is the same as that of the guide plates (401), are rotatably connected to the driving rods (403), the docking blocks (404) are slidably connected to the rotating shafts of the guide plates (401), and the docking blocks (404) are used to drive the adjacent driving rods (403) to swing; The electric slide rail (405) is fixedly connected to the heat dissipation plate (202), and the slider of the electric slide rail (405) is fixedly connected to the driving rod (403).

Images