Multi-channel ultra-thin flexible array microsystem capable of being routed at will

Abstract

The invention discloses a multi-channel ultra-thin flexible array microsystem capable of being routed at will, which comprises a plurality of radio frequency subsystems, and the adjacent radio frequency subsystems are interconnected through a bendable flexible belt; the radio frequency subsystem comprises a high and low frequency multilayer composite substrate and a plurality of micro modules, and the micro modules are integrated on the front and back surfaces of the high and low frequency multilayer composite substrate in a ball grid array packaging mode; and the side surface of the high and low frequency multilayer composite substrate is interconnected with the flexible band, so that radio frequency signal and control signal transmission among different radio frequency subsystems is realized. According to the invention, interconnection of radio frequency signals and control signals of different radio frequency subsystems is realized by using the flexible belt, and the antenna has high deformability, can be suitable for complex carrier radio frequency front-end installation, and is high in applicability. The three-dimensional heterogeneous integration technology is utilized, micro modules with different functions are packaged and integrated into one composite substrate, and high-density, low-profile and light-weight integration of the system is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of radio frequency microsystems, and in particular to a multi-channel ultra-thin flexible array microsystem capable of arbitrary routing. Background Art

[0002] With the development of wafer-level packaging technologies such as three-dimensional heterogeneous integration, system-level packaging (SIP), and TSV, RF microsystems are moving towards system miniaturization, modularization, and integration, and have been widely used in wireless communications, navigation, radar, and other fields.

[0003] The RF microsystems reported in the existing relevant literature and materials mainly focus on the RF microsystems with planar structures based on three-dimensional heterogeneous integration and silicon-based RF microsystem technology. The T / R components, frequency conversion, beam synthesis, digital processing and other parts contained in this type of RF microsystem are all concentrated in the same plane and do not have the ability to adapt across planes, resulting in limited application scenarios. For example, in some application scenarios such as airborne and shipborne, the RF microsystem is required to have certain conformal capabilities, such as special installation areas such as wings and islands, so as to achieve higher space utilization and reduce the space and volume occupied by the entire system.

[0004] In addition, existing related RF microsystems do not have the ability to reconfigure RF-level routing, and are unable to flexibly and quickly reconfigure RF front-end resources and back-end processing resources, resulting in significant limitations on usage scenarios. In addition, when implementing large-scale RF microsystems, there are bottlenecks such as low control rate and limited bandwidth. Summary of the invention

[0005] In order to solve the above problems, the present invention proposes a multi-channel ultra-thin flexible array microsystem that can be arbitrarily routed, which can achieve conformal, low-profile, flexible and high-density integration of radio frequency-level routing.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A multi-channel ultra-thin flexible array microsystem with arbitrary routing includes a plurality of radio frequency subsystems, and adjacent radio frequency subsystems are interconnected by a bendable flexible belt; the radio frequency subsystem includes a high- and low-frequency multilayer composite substrate and a plurality of micromodules, and the micromodules are integrated on the front and back sides of the high- and low-frequency multilayer composite substrate by ball grid array packaging; the side surfaces of the high- and low-frequency multilayer composite substrate are interconnected with the flexible belt to realize the transmission of radio frequency signals and control signals between different radio frequency subsystems.

[0008] Furthermore, the flexible strip includes several strip lines for transmitting radio frequency signals and several optical fibers for transmitting control signals, the strip lines are connected to the radio frequency signal ports on the side of the high and low frequency multilayer composite substrate in the radio frequency subsystem, and the optical fibers are connected to the control signal ports on the side of the high and low frequency multilayer composite substrate in the radio frequency subsystem.

[0009] Furthermore, the micromodule includes a power management module, a sub-beam synthesis module, a radio frequency routing module, a drive module, a control micromodule and a transceiver micromodule, and the modules are interconnected through a high- and low-frequency multi-layer composite substrate.

[0010] Furthermore, the power management module, sub-beam synthesis module, radio frequency routing module, drive module and control micromodule are integrated on the back side of the high-low frequency multi-layer composite substrate by ball grid array packaging.

[0011] Furthermore, the transceiver micromodules are provided in plurality and are integrated on the front side of the high- and low-frequency multi-layer composite substrate by means of ball grid array packaging.

[0012] Furthermore, the RF routing module includes multiple RF ports, multiple power division networks and multiple switches, each RF port is connected to the corresponding power division network in the topological structure, and the power division networks are interconnected through switches; the RF routing module realizes RF signal routing and synthesis between any RF subsystems through the aforementioned topological relationship and the on-off relationship of different switches.

[0013] Furthermore, the RF routing module includes four RF ports, four power division networks and four switches, each RF port is topologically connected to the corresponding power division network, and the output end of each power division network is connected to the other two power division networks through two switches respectively; the RF routing module realizes RF signal routing and synthesis between any RF subsystems through the aforementioned topological relationship and the on-off relationship of different switches.

[0014] Furthermore, the flexible strip includes a plurality of strip lines for transmitting radio frequency signals and a plurality of optical fibers for transmitting control signals, the strip lines are connected to the radio frequency routing module in the radio frequency subsystem, and the optical fibers are connected to the control micromodule in the radio frequency subsystem.

[0015] Furthermore, the arrangement of the radio frequency subsystems includes a matrix arrangement, wherein any two radio frequency subsystems adjacent to each other left and right or up and down are interconnected via a flexible strip.

[0016] Furthermore, the radio frequency subsystems can form different installation angles through the flexible belt, and the installation angle range includes 0 to 90 degrees.

[0017] The present invention provides a multi-channel ultra-thin flexible array microsystem that can be arbitrarily routed, and its beneficial effects are:

[0018] (1) Flexible interconnection: The RF microsystem uses flexible tape to interconnect the RF signals and control signals of different RF subsystems. It has high deformation capability and can be used for installation on complex carrier RF front-ends, with strong applicability.

[0019] (2) Low profile and lightweight: The RF microsystem uses three-dimensional heterogeneous integration technology to package micromodules with different functions into a composite substrate, thereby achieving high-density, low-profile, and lightweight integration of the system.

[0020] (3) High-speed routing of arbitrary sub-arrays: The RF microsystem integrates RF-level routing functions, which can realize RF signal routing and synthesis between arbitrary RF subsystems, greatly improving the utilization efficiency of RF signals and reducing the subsequent digital processing pressure.

[0021] (4) Strong scalability: The scale of the RF subsystem in the RF microsystem can be flexibly adjusted, and an RF microsystem with any RF channel scale can be realized, and it has two-dimensional expansion capabilities. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a topological block diagram of a flexible radio frequency microsystem according to Embodiment 1 of the present invention;

[0023] Figure 2 This is a schematic diagram of a radio frequency subsystem in a flexible radio frequency microsystem according to Embodiment 1 of the present invention;

[0024] Figure 3 This is a block diagram of a radio frequency routing module in a flexible radio frequency microsystem according to embodiment 2 of the present invention;

[0025] Figure 4 This is a schematic diagram of a flexible radio frequency microsystem model according to Embodiment 2 of the present invention;

[0026] Figure 5 This is an exploded view of the flexible radio frequency microsystem according to Embodiment 2 of the present invention;

[0027] Figure 6 This is a schematic diagram of a flexible radio frequency microsystem model with a 15° installation angle in Example 2 of the present invention;

[0028] Figure 7 This is a schematic diagram of a flexible radio frequency microsystem model with a 30° installation angle in Example 2 of the present invention;

[0029] Figure 8 This is a schematic diagram of a flexible radio frequency microsystem model with a 90° installation angle in Example 2 of the present invention. DETAILED DESCRIPTION

[0030] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation methods of the present invention are now described. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention, that is, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0031] Example 1

[0032] Since the current RF microsystems are mainly researched around RF microsystems with planar structures based on three-dimensional heterogeneous heterogeneous integration and silicon-based RF microsystem technology, the T / R components, frequency conversion, beam synthesis, digital processing and other parts contained in this type of RF microsystem are all concentrated in the same plane and do not have cross-plane adaptation capabilities, resulting in limited application scenarios. For example, in the requirements of some application scenarios such as airborne and shipborne, RF microsystems are required to have certain conformal capabilities, such as special installation areas such as wings and islands, so as to achieve higher space utilization and reduce the space and volume occupied by the entire system. In addition, the existing related RF microsystems do not have RF-level routing reconstruction capabilities, and cannot flexibly and quickly reconstruct RF front-end resources and back-end processing resources, resulting in greater restrictions on usage scenarios, and there are bottlenecks such as low control rate and limited bandwidth when implementing large-scale RF microsystems.

[0033] Based on this, this embodiment provides a multi-channel ultra-thin flexible array microsystem that can be arbitrarily routed, such as Figure 1 As shown, it includes several RF subsystems 1, and adjacent RF subsystems 1 are interconnected through a bendable flexible belt 2; the RF subsystem 1 includes a high- and low-frequency multi-layer composite substrate 3 and several micromodules, and the micromodules are integrated on the front and back sides of the high- and low-frequency multi-layer composite substrate 3 through a ball grid array packaging method; the side surfaces of the high- and low-frequency multi-layer composite substrate 3 are interconnected with the flexible belt 2 to realize the transmission of RF signals and control signals between different RF subsystems 1.

[0034] In this embodiment, the arrangement of the RF subsystems 1 can be a matrix arrangement, wherein any two RF subsystems 1 adjacent to each other left and right or up and down are interconnected through the flexible belt 2. The RF subsystems 1 can form different installation angles through the flexible belt 2, and the installation angle range includes 0 to 90 degrees. In this embodiment, low-loss, large-bandwidth, and high-speed interconnection of different RF subsystems 1 can be achieved through the integrated interconnection of the flexible belt 2.

[0035] Preferably, the flexible strip 2 includes several strip lines 10 for transmitting radio frequency signals and several optical fibers 11 for transmitting control signals. The strip lines 10 are connected to the radio frequency signal ports on the sides of the high and low frequency multilayer composite substrate 3 in the radio frequency subsystem 1, and the optical fibers 11 are connected to the control signal ports on the sides of the high and low frequency multilayer composite substrate 3 in the radio frequency subsystem 1.

[0036] In this embodiment, the micromodule includes a power management module 4, a sub-beam synthesis module 5, a radio frequency routing module 6, a drive module 7, a control micromodule 8, and a transceiver micromodule 9, and each module is interconnected through a high-low frequency multi-layer composite substrate 3. The stripline 10 of the flexible belt 2 is connected to the radio frequency routing module 6 in the radio frequency subsystem 1, and the optical fiber 11 of the flexible belt 2 is connected to the control micromodule 8 in the radio frequency subsystem 1.

[0037] Preferably, if Figure 2 As shown, the power management module 4, the sub-beam synthesis module 5, the RF routing module 6, the drive module 7 and the control micromodule 8 are integrated on the back side of the high-low frequency multi-layer composite substrate 3 through a ball grid array packaging method; a plurality of transceiver micromodules 9 are provided and integrated on the front side of the high-low frequency multi-layer composite substrate 3 through a ball grid array packaging method.

[0038] Preferably, the RF routing module 6 includes multiple RF ports, multiple power division networks 12 and multiple switches 13, each RF port is connected to the corresponding power division network 12 in the topological structure, and the power division networks 12 are interconnected through the switch 13; the RF routing module 6 realizes the routing and synthesis of RF signals between any RF subsystems 1 through the aforementioned topological relationship and the on-off relationship of different switches 13. Since the routing and synthesis of RF signals between different RF subsystems 1 are realized at the RF level, the routing speed of broadband signals is greatly improved, while the pressure of subsequent digital processing of the system is reduced, and the overall efficiency is improved.

[0039] Example 2

[0040] This embodiment is based on embodiment 1:

[0041] This embodiment provides a multi-channel ultra-thin flexible array microsystem that can be arbitrarily routed, including a plurality of radio frequency subsystems 1, and adjacent radio frequency subsystems 1 are interconnected by bendable flexible bands 2. Figure 4 , Figure 5 The figure shows a flexible RF microsystem model composed of four RF subsystems 1 interconnected by bendable flexible strips 2. Preferably, the four RF subsystems 1 are arranged in a field shape, and two adjacent RF subsystems are interconnected by four flexible strips.

[0042] Preferably, Figure 4Each RF subsystem 1 is composed of a high- and low-frequency multi-layer composite substrate 3, a power management module 4, a sub-beam synthesis module 5, a RF routing module 6, a drive module 7, a control micromodule 8, and a transceiver micromodule 9; wherein the flexible belt 2 includes two strip lines 10 for transmitting RF signals and two optical fibers 11 for transmitting control signals; the strip lines 10 in the flexible belt 2 are connected to the RF routing module 6 in the RF subsystem 1; the optical fibers 11 in the flexible belt 2 are connected to the control micromodule 8 in the RF subsystem 1; and low-loss, large-bandwidth, and high-speed interconnection of different RF subsystems is achieved through the integrated interconnection of the flexible belt.

[0043] like Figure 5 As shown, in each RF subsystem 1 of the flexible RF microsystem, a certain number of micromodules with different functions are integrated by BGA ball planting on the front and back sides of the high and low frequency multilayer composite substrate 3; each RF subsystem 1 contains 16 transceiver micromodules 9, which are located on the front side of the high and low frequency multilayer composite substrate 3; the power management module 4, the sub-beam synthesis module 5, the RF routing module 6, the drive module 7, and the control micromodule 8 are located on the back side of the high and low frequency multilayer composite substrate 3; the flexible belt 2 is located on the side of the high and low frequency multilayer composite substrate 3 and is interconnected with it to realize the transmission of RF signals and control signals between different RF subsystems 1.

[0044] Preferably, if Figure 3 As shown, the RF routing module 6 in the flexible RF microsystem includes four RF ports, four power division networks 12 and four switches 13; each RF port is connected to the power division network 12 in the topological structure, and the output end of the power division network 12 is respectively connected to the other two power division networks 12 with two switches 13. Through the above topological relationship, the RF routing module 6 further realizes the RF signal routing and synthesis function between the four RF subsystems 1 by controlling the on and off of the switches 13 in the RF routing module 6. Since the routing and synthesis of RF signals between different RF subsystems 1 are realized at the RF level, the routing speed of broadband signals is greatly improved, while reducing the pressure of subsequent digital processing of the system and improving the overall efficiency.

[0045] Preferably, Figure 6 to Figure 8 Demonstrated based on Figure 4 The flexible RF microsystem with different installation angles in the middle model. It can be seen that by introducing flexible belts to interconnect the RF signals and control signals of different RF subsystems 1, the entire system has high deformation capability and can be applied to the RF front-end installation of complex carriers, with strong applicability; at the same time, the microsystem realizes overall low-profile, high-density, lightweight flexible integrated integration, which greatly expands the application scenarios of existing RF microsystems.

[0046] The above is only a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the concept described herein through the above teachings or the technology or knowledge of the relevant field. The changes and modifications made by those skilled in the art shall not deviate from the spirit and scope of the present invention, and shall be within the scope of protection of the claims attached to the present invention.

Claims

1. A multi-channel ultra-thin flexible array microsystem with arbitrary routing, characterized in that: The invention comprises a plurality of radio frequency subsystems (1), wherein adjacent radio frequency subsystems (1) are interconnected via a bendable flexible belt (2); the radio frequency subsystem (1) comprises a high- and low-frequency multilayer composite substrate (3) and a plurality of micromodules, wherein the micromodules are integrated on the front and back sides of the high- and low-frequency multilayer composite substrate (3) via a ball grid array packaging method; the side surfaces of the high- and low-frequency multilayer composite substrate (3) are interconnected with the flexible belt (2), thereby realizing the transmission of radio frequency signals and control signals between different radio frequency subsystems (1).

2. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 1, characterized in that: The flexible strip (2) comprises a plurality of strip lines (10) for transmitting radio frequency signals and a plurality of optical fibers (11) for transmitting control signals, wherein the strip lines (10) are connected to radio frequency signal ports on the side of a high- and low-frequency multilayer composite substrate (3) in a radio frequency subsystem (1), and the optical fibers (11) are connected to control signal ports on the side of a high- and low-frequency multilayer composite substrate (3) in a radio frequency subsystem (1).

3. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 1, characterized in that: The micromodule comprises a power management module (4), a sub-beam synthesis module (5), a radio frequency routing module (6), a drive module (7), a control micromodule (8) and a transceiver micromodule (9), and the modules are interconnected via a high- and low-frequency multi-layer composite substrate (3).

4. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 3, characterized in that: The power management module (4), the sub-beam synthesis module (5), the radio frequency routing module (6), the drive module (7) and the control micromodule (8) are integrated on the back side of the high-low frequency multi-layer composite substrate (3) by means of ball grid array packaging.

5. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 3, characterized in that: The transceiver micromodules (9) are provided in plurality and are integrated on the front side of the high- and low-frequency multilayer composite substrate (3) by means of ball grid array packaging.

6. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 3, characterized in that: The radio frequency routing module (6) comprises a plurality of radio frequency ports, a plurality of power division networks (12) and a plurality of switches (13); each radio frequency port is connected to a corresponding power division network (12) in a topological structure, and the power division networks (12) are interconnected via switches (13); the radio frequency routing module (6) implements radio frequency signal routing and synthesis between any radio frequency subsystems (1) via the aforementioned topological relationship and the on-off relationship of different switches (13).

7. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 3, characterized in that: The radio frequency routing module (6) comprises four radio frequency ports, four power division networks (12) and four switches (13); each radio frequency port is connected to a corresponding power division network (12) in a topological structure, and the output end of each power division network (12) is connected to the other two power division networks through two switches (13) respectively; the radio frequency routing module (6) realizes the routing and synthesis of radio frequency signals between any radio frequency subsystems (1) through the aforementioned topological relationship and the on-off relationship of different switches (13).

8. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to claim 3, characterized in that: The flexible strip (2) comprises a plurality of strip lines (10) for transmitting radio frequency signals and a plurality of optical fibers (11) for transmitting control signals, wherein the strip lines (10) are connected to a radio frequency routing module (6) in a radio frequency subsystem (1), and the optical fibers (11) are connected to a control micromodule (8) in the radio frequency subsystem (1).

9. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to any one of claims 1 to 8, characterized in that: The arrangement of the radio frequency subsystems (1) includes a matrix arrangement, wherein any two radio frequency subsystems (1) adjacent to each other left and right or up and down are interconnected via a flexible band (2).

10. The multi-channel ultra-thin flexible array microsystem capable of arbitrary routing according to any one of claims 1 to 8, characterized in that: The radio frequency subsystems (1) can form different installation angles through the flexible belt (2), and the installation angle range includes 0 to 90 degrees.

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