Substrate assembly

Abstract

A substrate assembly is provided with: a substrate (10) having a first surface (10a) facing a first direction and a second surface (10b) facing a direction opposite the first direction on the side opposite the first surface, and to which an optical transceiver (30) having a first electrical interface (31a1) and a heat dissipation part (31a2) is fixed; the optical transceiver is fixed to the substrate in a state in which the first electrical interface and the heat dissipation portion face a direction opposite to the first direction and are arranged in a direction intersecting the first direction. And a first heat dissipation mechanism (50) that has a first portion (51a) that is adjacent to the heat dissipation section in the first direction and thermally connected to the heat dissipation section in a state in which the optical transceiver is fixed to the substrate, and that is fixed to the substrate, with a heat conduction member (47) interposed between the heat dissipation section and the first portion.

Description

Technical Field

[0001] This invention relates to a substrate assembly. Background Technology

[0002] Previously, as an optical transceiver for network switching devices, there is a small optical transceiver described in Patent Document 1 (for example, Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-27147 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In a network switch device that implements CPO (co-packaged optics), the switch ASIC (application-specific integrated circuit) and multiple optical transceivers are mounted on a substrate.

[0008] As communication volume increases, there is a tendency for not only the heat generated by the switch ASIC but also the heat generated by the optical transceiver in such network switching devices to increase.

[0009] Therefore, one of the objectives of this invention is, for example, to obtain a novel improved substrate assembly, as a substrate assembly including a substrate for mounting an optical transceiver, capable of more efficient heat dissipation from the optical transceiver.

[0010] Methods for solving problems

[0011] The substrate assembly of the present invention comprises: a substrate having a first surface facing a first direction and a second surface facing the opposite direction to the first direction on a side opposite to the first surface and for which an optical transceiver is fixed, the optical transceiver having a first electrical interface and a heat dissipation portion, the optical transceiver being fixed to the substrate in a state in which the first electrical interface and the heat dissipation portion face the opposite direction to the first direction and are arranged in a direction intersecting the first direction; and a first heat dissipation mechanism having a first portion adjacent to and thermally connected to the heat dissipation portion in the first direction when the optical transceiver is fixed to the substrate, and being fixed to the substrate, a heat-conducting member being sandwiched between the heat dissipation portion and the first portion.

[0012] In the substrate assembly, a receiving portion for accommodating the heat-conducting member may also be provided between the heat dissipation portion and the first portion.

[0013] In the substrate assembly, the heat-conducting member may also be clamped in contact with both the heat dissipation portion and the first portion.

[0014] In the substrate assembly, a receiving portion for accommodating the heat-conducting member may be provided between the heat dissipation portion and the first portion, and the height of the receiving portion is lower than the thickness of the heat-conducting member in its uncompressed state.

[0015] In the substrate assembly, the thermally conductive member may also comprise a synthetic resin material and be flexible.

[0016] In the substrate assembly, the optical transceiver may also have a body fixed to the substrate and having the first portion, with a plurality of optical fibers extending from the side of the body opposite to the heat dissipation portion.

[0017] In the substrate assembly, the first heat dissipation mechanism may also have a second portion adjacent to the first portion and arranged with the substrate in a direction intersecting the first direction.

[0018] In the substrate assembly, the first heat dissipation mechanism may also have a third portion adjacent to the first portion and penetrating the substrate along the first direction.

[0019] In the substrate assembly, the third portion may also be disposed on the substrate.

[0020] In the substrate assembly, the third portion may also be disposed separately from the substrate.

[0021] In the substrate assembly, the first heat dissipation mechanism may also have a heat transfer mechanism that delivers heat through a refrigerant.

[0022] In the substrate assembly, the first heat dissipation mechanism may also have a heat sink.

[0023] Alternatively, a semiconductor integrated circuit may be mounted on the first surface of the substrate assembly.

[0024] In the substrate assembly, or in the semiconductor integrated circuit, a second heat dissipation mechanism may be provided on the side opposite to the substrate when it is mounted on the substrate.

[0025] In the substrate assembly, the optical transceiver may also be fixed to the substrate with the heat sink positioned on the opposite side of the semiconductor integrated circuit relative to the first electrical interface.

[0026] In the substrate assembly, it may also be configured such that multiple optical transceivers can be fixed on the substrate as optical transceivers.

[0027] In the substrate assembly, the plurality of optical transceivers may also be arranged along the edges of the substrate.

[0028] In the substrate assembly, the plurality of optical transceivers may be arranged along the four sides of the substrate, and a semiconductor integrated circuit may be mounted on the first surface at a position farther away from each of the optical transceivers than the sides.

[0029] Alternatively, the substrate assembly may have a fixing mechanism for fixing the optical transceiver relative to the substrate.

[0030] In the substrate assembly, the fixing mechanism may also be shared by multiple optical transceivers that serve as optical transceivers.

[0031] In the substrate assembly, the fixing mechanism may also fix the optical transceiver relative to the substrate in a detachable manner.

[0032] In the substrate assembly, the fixing mechanism may also include: a first member fixed to the substrate; and a second member detachably fixed to the first member and pressing the optical transceiver toward the substrate.

[0033] In the substrate assembly, the optical transceiver may have a main body fixed to the substrate and having the first portion, with a plurality of optical fibers extending from the side of the main body opposite to the heat dissipation portion, and an opening for the optical fibers to pass through is provided in the second component.

[0034] Alternatively, the substrate assembly may include: a second electrical interface fixed to the substrate and electrically connected to the first electrical interface; and a positioning mechanism for positioning the first electrical interface and the second electrical interface.

[0035] Alternatively, the substrate assembly may include a socket mounted on the substrate and a second electrical interface electrically connected to the first electrical interface.

[0036] Alternatively, the substrate assembly may have a heat-conducting member between the first portion and the heat dissipation portion, and the heat-conducting member may be flexible.

[0037] Alternatively, the substrate assembly may be mounted on an integrated substrate capable of mounting multiple substrate assemblies as said substrate assembly.

[0038] Invention Effects

[0039] According to the present invention, for example, it is possible to obtain novel substrate assemblies with improvements, such as more efficient heat dissipation from optical transceivers. Attached Figure Description

[0040] Figure 1 This is an exemplary and schematic perspective view of the switching device according to the first embodiment.

[0041] Figure 2 This is an exemplary and schematic top view of the switching device according to the first embodiment.

[0042] Figure 3 This is an illustrative and schematic side view of a part of the switching device of the first embodiment.

[0043] Figure 4 yes Figure 2 Sectional view IV-IV.

[0044] Figure 5 This is an illustrative and schematic top view of a part of the switching device of the first embodiment, and is a diagram showing the state before the optical transceiver is mounted, the state with the optical transceiver mounted, and the state with the optical transceiver assembled.

[0045] Figure 6 This is an illustrative and schematic cross-sectional view of a part of the switching device of the second embodiment.

[0046] Figure 7 yes Figure 6 This is an enlarged view of part VII, showing the state before assembly.

[0047] Figure 8 yes Figure 6 An enlarged view of part VII, showing the assembled state.

[0048] Figure 9 This is an illustrative and schematic cross-sectional view of a part of the switching device of the third embodiment.

[0049] Figure 10 This is an illustrative and schematic cross-sectional view of a part of the switching device of the fourth embodiment.

[0050] Figure 11 It is a variation of the implementation method and Figure 6 An enlarged sectional view at the same position as part VII, showing the assembled state.

[0051] Figure 12 It is related to the implementation method Figure 11 Different variations and Figure 6 An enlarged sectional view at the same position as part VII, showing the assembled state.

[0052] Figure 13 This is an exemplary and schematic perspective view of the switching device according to the fifth embodiment.

[0053] Figure 14 This is an illustrative and schematic top view of the switching device according to the fifth embodiment.

[0054] Figure 15 This is an illustrative and schematic side view of the switching device according to the fifth embodiment.

[0055] Figure 16 This is an illustrative and schematic cross-sectional view of a part of the switching device of the sixth embodiment. Detailed Implementation

[0056] Hereinafter, several exemplary embodiments of the present invention are disclosed. The structure of the embodiments shown below, as well as the effects and results (effects) resulting from such structures, are examples. The present invention can also be implemented using structures other than those disclosed in the following embodiments. Furthermore, according to the present invention, at least one of various effects (including derived effects) obtained through the structure can be obtained.

[0057] The various embodiments shown below have the same structure. Therefore, based on the structure of each embodiment, the same functions and effects can be obtained. Furthermore, the same reference numerals will be used to label these identical structures below, and repeated descriptions will sometimes be omitted.

[0058] In each diagram, arrow X represents the X direction, arrow Y represents the Y direction, and arrow Z represents the Z direction. The X, Y, and Z directions intersect and are orthogonal to each other.

[0059] [First Implementation Method]

[0060] Figure 1 This is a perspective view of the switch device 100A (100) according to the first embodiment. Figure 2 This is a top view of the switch device 100. Figure 3 Is Figure 1 A side view of a portion of the switching device 100 as seen along the Y direction in arrow III. Additionally, Figure 4 yes Figure 2 Sectional view IV-IV.

[0061] like Figure 1 As shown, the switch device 100 is mounted on the motherboard 200. It should be noted that in this embodiment, only one switch device 100 is mounted on the motherboard 200, but multiple switch devices 100 may also be mounted on the motherboard 200. The motherboard 200 is an example of an integrated substrate.

[0062] like Figure 1 , 2As shown, the switching device 100 includes a substrate 10, a switching ASIC 20, multiple optical transceivers 30, a heat sink 21 for the switching ASIC 20, a fixing mechanism 40 for fixing the optical transceivers 30 to the substrate 10, and a heat dissipation mechanism 50 for the optical transceivers 30. The substrate 10, the fixing mechanism 40, and the heat dissipation mechanism 50 in the switching device 100 are referred to as a substrate assembly. The substrate assembly can be mounted on a motherboard 200.

[0063] like Figure 2 As shown, the substrate 10 has a square (quadrilateral) shape. Additionally, as... Figure 4 As shown, substrate 10 extends orthogonally to the Z-direction and has a plate-like shape, having a surface 10a facing the Z-direction and a surface 10b facing the opposite direction to the Z-direction on the side opposite to surface 10a. Surfaces 10a and 10b extend orthogonally to the Z-direction. Substrate 10 is, for example, a printed wiring substrate. The Z-direction is an example of a first direction of substrate 10, and can also be referred to as the thickness direction of substrate 10. Surface 10a is an example of a first surface, and surface 10b is an example of a second surface.

[0064] Figures 1-4 The optical transceiver 30 shown receives optical signals transmitted in the optical fiber 32 and outputs electrical signals corresponding to those optical signals. The electrical signals output from the optical transceiver 30 are transmitted through a socket 43 (see reference 43). Figure 4 The optical transceiver 30 receives optical signals from the ASIC 20 via conductors on the substrate 10 and the substrate 10. The optical transceiver 30 has a photodiode array (not shown) as multiple light-receiving parts for receiving optical signals. Additionally, the optical transceiver 30 receives electrical signals from the ASIC 20 via conductors disposed on the substrate 10 and the socket 43, and outputs optical signals corresponding to those electrical signals. The optical signals output from the optical transceiver 30 are coupled to an optical fiber 32 and transmitted within that fiber. The optical transceiver 30 may have, for example, a VCSEL array (not shown, VCSEL: vertical cavity surface emitting laser) as multiple light-emitting parts for outputting optical signals.

[0065] like Figure 2 As shown, a plurality of optical transceivers 30 are arranged along each side 10c of the substrate 10. Furthermore, in this embodiment, as... Figure 4 As shown, the optical transceivers 30 are mounted in a manner that covers the side 10c. In other words, the optical transceivers 30 are arranged across the side 10c when viewed from opposite sides in the Z direction, and have portions located inside and outside the side 10c. This provides the advantage that interference between the optical fiber 32 extending from the optical transceiver 30 and other components such as the switch ASIC 20 and heat sink 21 mounted on the substrate 10 can be easily avoided, or that the substrate 10 can be made smaller.

[0066] In addition, such as Figure 1 , 2 As shown, multiple optical transceivers 30 are fixed to the substrate 10 by fixing mechanisms 40 provided for each side 10c of the substrate 10. The fixing mechanisms 40 are provided for each of the four sides 10c, totaling four, and are shared by the multiple (eight in this embodiment) optical transceivers 30 arranged along each side 10c. By sharing the fixing mechanisms 40 for multiple optical transceivers 30, compared to the case where the optical transceivers 30 are fixed to the substrate 10 by individual fixing mechanisms, the following advantages can be obtained: the installation structure of the fixing mechanisms 40 on the substrate 10 can be simplified, or the number of components can be reduced, thereby reducing the manufacturing time and cost of the switching device 100.

[0067] like Figure 1 , 2 As shown, the switch ASIC 20 is mounted on the substrate 10 at positions away from each edge 10c (in this embodiment, for example, approximately the center of the substrate 10). Figure 4 As shown, the switch ASIC 20 is, for example, flip-chip mounted on surface 10a. The switch ASIC 20 controls the operation of each optical transceiver 30. The switch ASIC 20 is an example of a semiconductor integrated circuit.

[0068] like Figure 4 As shown, the heat sink 21 is positioned to contact the switch ASIC 20 on the side opposite to the substrate 10. The heat sink 21 contacts the top surface of the switch ASIC 20 and has a plurality of arrayed, pin-shaped fins 21a protruding in the Z direction from the base. Furthermore, the heat sink 21 is made of a material with high thermal conductivity, such as aluminum-based metals. With this structure, heat generated by the switch ASIC 20 is transferred along the Z direction within the heat sink 21, and through heat exchange between the fins 21a and the surrounding gas, it is transferred to, or released from, the surrounding gas. The heat sink 21 is an example of a second heat dissipation mechanism.

[0069] like Figure 3 , 4 As shown, in this embodiment, as an example, the fixing mechanism 40 includes an upper member 41, a middle member 42, and a socket 43. These structural elements of the fixing mechanism 40 are integrated by fasteners 46 such as screws. Furthermore, the middle member 42 and the socket 43 of the fixing mechanism 40 are shared by all optical transceivers 30 in a group of multiple optical transceivers 30 along the edge 10c of the substrate 10. Figure 4As shown, the fixing mechanism 40 fixes the optical transceiver 30 located near the edge 10c of the substrate 10 to the substrate 10 in a clamping state in the thickness direction of the substrate 10.

[0070] Furthermore, in order to allow for replacement of the optical transceiver 30 after assembly, the fixing mechanism 40 detachably fixes the optical transceiver 30 to the substrate 10. To achieve this, in this embodiment, the structural elements of the fixing mechanism 40 include structural elements that are fixed to the substrate 10 and structural elements that can be attached to and detached from the substrate 10. In this embodiment, the intermediate member 42 and the tube seat 43 are fixed to the substrate 10, and the upper member 41 is configured to be detachable from the intermediate member 42, i.e., the substrate 10. Specifically, as... Figure 4 As shown, the upper member 41 is mounted on the middle member 42 by a fastener 46 configured as a detachable screw. The middle member 42 and the tube seat 43 are examples of the first member, and the upper member 41 is an example of the second member.

[0071] Figure 5 This is a top view showing the state S1 before the optical transceiver 30 is mounted, the state S2 with the optical transceiver 30 mounted, and the state S3 with the optical transceiver 30 assembled. For example... Figure 5 As shown in state S3, in this embodiment, the upper component 41 is not shared by all of the multiple optical transceivers 30 along edge 10c, but only by two adjacent optical transceivers 30 along edge 10c. This provides advantages such as ease of disassembly for each optical transceiver 30 and the sharing of components, reducing the impact of deflection of the fixing mechanism 40, structural elements of the fixing mechanism 40, and manufacturing variations of the optical transceivers 30, thereby improving positioning accuracy. However, this structure is only one example; the upper component 41 could also be shared by all of the multiple optical transceivers 30 along edge 10c.

[0072] The optical transceiver 30 has a main body 31 and a plurality of optical fibers 32. It should be noted that, in the following description, unless otherwise specified, the state in which the optical transceiver 30 is fixed to the substrate 10 will be described.

[0073] like Figure 4 As shown, the main body 31 has a surface 31a facing the opposite direction to the Z direction. An electrical interface 31a1 and a heat dissipation surface 31a2 for arranging an array of multiple electrodes (not shown) are provided on surface 31a. In the fixed state, both the electrical interface 31a1 and the heat dissipation surface 31a2 face the opposite direction to the Z direction, and are positioned approximately along the surface 10a of the substrate 10 and intersecting with the edge 10c of the substrate 10 (in... Figure 4The optical transceivers 30 shown are arranged in the X direction. The heat-generating elements and heat dissipation surfaces 31a2 inside the optical transceivers 30 are arranged in the Z direction. The electrical interface 31a1 is an example of a first electrical interface, and the heat dissipation surface 31a2 is an example of a heat dissipation unit.

[0074] Multiple optical fibers 32 extend from the portion of the heat dissipation surface 31a that is separated from the surface 31a of the main body 31, specifically on the side opposite to the heat dissipation surface 31a2, from the portion that is aligned in the Z direction with the heat dissipation surface 31a2. In addition, multiple optical fibers 32 extend from the main body 31 in the Z direction near the main body 31.

[0075] A tube base 43, an intermediate member 42, and an upper member 41 are sequentially mounted on a substrate 10.

[0076] The upper member 41 presses the main body 31 of the optical transceiver 30 toward the substrate 10 and the socket 43 in the opposite direction to the Z direction. Additionally, as... Figure 4 , 5 As shown, the upper member 41 is provided with an opening 41a that serves as a notch penetrating the upper member 41 in the Z direction. A portion of the main body 31 is received in the opening 41a, and the optical fiber 32 extends through the opening 41a.

[0077] An opening 42a, which serves as a through hole extending along the Z direction, is provided in the intermediate member 42. The side of the opening 42a has the function of generally guiding the optical transceiver 30 body 31 in the X and Y directions when it is assembled.

[0078] The socket 43 is placed on the surface 10a of the substrate 10 and supports the main body 31 of the optical transceiver 30. An electrical interface 43a and an opening 43b are provided on the socket 43.

[0079] Electrical interface 43a has a conductor 43a1 that faces and contacts an electrical interface 31a1 disposed on the body 31 of the optical transceiver 30, and is electrically connected to a plurality of electrodes disposed on the electrical interface 31a1. The conductor 43a1 can be configured, for example, as a contact terminal having a resiliently retractable pin extending in the Z direction. The conductor 43a1 is electrically connected to a conductor (not shown) of the substrate 10. Each electrode of the electrical interface 31a1 of the optical transceiver 30 is electrically connected to a conductor of the switch ASIC 20 via the conductor 43a1 of the electrical interface 43a of the socket 43 and the conductor of the substrate 10. By having a socket 43 with an electrical interface 43a, for example compared to directly disposing of the electrical interface 43a on the substrate 10, the following advantages can be obtained: it is easier to construct a structure that ensures the required positioning accuracy of the multiple electrodes. Electrical interface 43a is an example of a second electrical interface.

[0080] The opening 43b exposes the heat dissipation surface 31a2 provided on the body 31 of the optical transceiver 30 in the opposite direction to the Z direction. The opening 43b is, for example, configured as a through hole or notch that passes through the tube seat 43 in the Z direction.

[0081] The heat dissipation mechanism 50 releases the heat generated by the optical transceiver 30. The heat dissipation mechanism 50 has a lower member 51 and a heat sink 52. It should be noted that at least the lower member 51 in the heat dissipation mechanism 50 can also function as part of the fixing mechanism 40. The heat dissipation mechanism 50 is an example of a first heat dissipation mechanism.

[0082] The lower component 51 is located on the side opposite to the middle component 42 relative to the tube base 43. The lower component 51 has a first portion 51a housed within the opening 43b and a second portion 51b arranged relative to the substrate 10 in a direction intersecting the Z direction. The lower component 51 is thermally connected to the heat dissipation surface 31a2 of the optical transceiver 30 and transfers the heat generated by the optical transceiver 30. The lower component 51 is made of a material with high thermal conductivity, such as aluminum-based metals. In addition, the lower component 51 is fixed to the substrate 10 or the fixing mechanism 40 by means of fasteners such as screws, adhesives, etc. The lower component 51 can also be referred to as a heat transfer component. It should be noted that, in this specification, thermal connection between two components means that the two components are in a state where they can conduct heat.

[0083] The first part 51a is adjacent to the heat dissipation surface 31a2 via a flexible heat-conducting member 47 and is thermally connected to the heat dissipation surface 31a2. By providing the heat-conducting member 47, the following advantages can be obtained: the heat conduction efficiency from the heat dissipation surface 31a2 to the first part 51a can be suppressed due to gaps between the heat dissipation surface 31a2 and the first part 51a caused by manufacturing irregularities, differences in the coefficients of thermal expansion between components, etc.; or excessive pressure can be suppressed between the heat dissipation surface 31a2 and the first part 51a.

[0084] The heat-conducting member 47, by incorporating a synthetic resin material, possesses elasticity, flexibility, and suppleness, enabling it to contact and adhere tightly to both the heat dissipation surface 31a2 and the first portion 51a. The heat-conducting member 47 is sandwiched between the heat dissipation surface 31a2 and the first portion 51a in an elastically compressed state. Specifically, the heat-conducting member 47 may be primarily made of synthetic resin materials such as acrylic resin or silicone resin, and may contain thermally conductive fillers such as boron nitride, aluminum nitride, or alumina. Alternatively, the heat-conducting member 47 may have, for example, a graphite film and a layer of synthetic resin material such as polyethylene terephthalate or polyimide sandwiching the film. Furthermore, the heat-conducting member 47 may also be made of a thermally conductive rubber material. This rubber material may be primarily made of materials such as silicone or acrylic, and may contain thermally conductive fillers such as boron nitride, aluminum nitride, alumina, or nanodiamond. However, the heat-conducting member 47 is not limited to these types and may also possess other structures exhibiting elasticity, flexibility, and suppleness.

[0085] The second portion 51b is integrally formed with the first portion 51a and is thermally connected to the first portion 51a. Furthermore, the second portion 51b is positioned relative to the substrate 10 in a direction intersecting the Z-direction (in... Figure 4 The lower member 51 shown is arranged in the X direction and extends from the first part 51a in the opposite direction of the Z direction, that is, the thickness direction of the substrate 10.

[0086] Furthermore, the lower member 51 contacts the heat sink 52 on the side opposite to the heat dissipation surface 31a2 relative to the substrate 10, and is thermally connected to the heat sink 52. The heat sink 52 has a plurality of arrayed, pin-shaped fins 52a protruding from the base in the opposite direction to the Z-direction. The heat sink 52 is made of a material with high thermal conductivity, such as aluminum-based metals. The heat sink 52 is fixed to the lower member 51 by means of fasteners such as screws, welding, or bonding. It should be noted that the lower member 51 and the heat sink 52 can also be integrated as a single component. The heat sink 52 can also be referred to as a heat transfer member or a heat dissipation member.

[0087] Through the lower component 51 and heat sink 52 of this structure, the heat generated by the optical transceiver 30 is transferred from the heat dissipation surface 31a2 in the lower component 51 and heat sink 52 in the opposite direction of the Z direction. This heat is then transferred to, or released from, the surrounding gas through heat exchange between the fins 52a and the gas surrounding the fins 52a. It should be noted that the switch device 100 can also be configured to include an electric fan, and the airflow generated by the operation of the electric fan acts on the heat sink 52.

[0088] In addition, from Figure 2 , 4As can be clearly seen from Figure 5, the heat dissipation surface 31a2 is located on the side opposite to the switch ASIC 20 relative to the electrical interface 31a1. With this configuration, for example, the following advantages can be obtained: the length of the conductor between the electrical interface 31a1 and the switch ASIC 20 can be further shortened, thereby making it easier to ensure the required transmission characteristics of the electrical signal, or interference between the first heat dissipation mechanism and the conductor can be avoided, thereby making it easier to obtain the required heat dissipation performance from the optical transceiver 30.

[0089] in addition, Figure 5 The positioning mechanism 48a positioned the intermediate member 42 and the upper member 41 in a direction intersecting the Z direction. Positioning mechanism 48b positioned the tube socket 43 and the optical transceiver 30 in a direction intersecting the Z direction. Positioning mechanism 48c positioned the substrate 10 and the tube socket 43 in a direction intersecting the Z direction. Positioning mechanisms 48a-48c are, for example, composed of a pin and a member having a hole for inserting the pin. Positioning mechanisms 48a-48c are respectively located at two separate locations. The positioning mechanisms 48b at each location are configured such that the electrical interface 43a is disposed between the positioning mechanisms 48b at these two locations. This allows for easier and more precise positioning of the electrical interface 31a1 (see reference 31a1) of the optical transceiver 30. Figure 4 The electrodes of the tube socket 43 and the conductor 43a1 of the electrical interface 43a of the tube socket 43 are positioned.

[0090] As explained above, according to this embodiment, an improved novel substrate assembly can be obtained, which avoids interference with other components through the heat dissipation mechanism 50 and releases the heat generated by the optical transceiver 30 more efficiently. Furthermore, in this embodiment, the optical transceiver 30 is configured to face one side of the substrate 10, and the heat dissipation mechanism 50 is configured to face the other side of the substrate 10 or to be configured on the outside of the edge 10c of the substrate 10. This provides the following advantages: interference with the heat dissipation mechanism 50 can be avoided, and the mounting density of the optical transceiver 30 can be increased accordingly. Additionally, the optical fiber 32 can be led out from the optical transceiver 30 in a direction intersecting with the surface of the substrate 10, thereby suppressing the enlargement of the switching device 100 along the surface of the substrate 10. Furthermore, it provides the following advantages: the degree of freedom in the wiring direction of the optical fiber 32 can be increased, thereby making it easier to avoid interference with other components such as the ASIC 20. Furthermore, the following advantages can be obtained: interference with the optical transceiver 30 can be avoided, and the configuration and construction freedom of the heat dissipation mechanism 50 can be increased accordingly. Regarding the cooling method of the heat dissipation mechanism 50, whether it is water cooling or air cooling, it is easier to improve the heat dissipation efficiency of the heat dissipation mechanism 50 or to construct the heat dissipation mechanism 50 more compactly.

[0091] Furthermore, in this embodiment, a heat-conducting member 47 is sandwiched between the heat dissipation surface 31a2 (heat dissipation portion) of the optical transceiver 30 and the first portion 51a of the heat dissipation mechanism 50 (first heat dissipation mechanism). It is assumed that without the heat-conducting member 47, the thermal resistance between the heat dissipation surface 31a2 and the first portion 51a may increase, thus reducing the heat dissipation performance of the heat dissipation mechanism 50. Regarding this, according to this embodiment, the heat generated by the optical transceiver 30 can be transferred more efficiently to the first portion 51a, i.e., the heat dissipation mechanism 50, via the heat-conducting member 47, and released more efficiently from the heat dissipation mechanism 50.

[0092] Furthermore, as shown in this embodiment, in the case of a structure in which multiple optical transceivers 30 are arranged along the edge 10c of the substrate 10, the smaller the width along the edge 10c of the optical transceiver 30, the greater the number of optical transceivers 30 that can be installed. In the structure of this embodiment, for example, optical transceivers 30 with a width of 10 mm or less or 8 mm or less can be installed. In addition, in this case, optical transceivers 30 with a transmission capacity of, for example, 200 Gb / s or more, 400 Gb / s or more, or 800 Gb / s or more can be installed.

[0093] [Second Implementation]

[0094] Figure 6 It is part of the switching device 100B (100) of the second embodiment and Figure 4 A sectional view at the same location.

[0095] like Figure 6 As shown, in this embodiment, a through hole 10d is formed in the substrate 10, penetrating the substrate 10 in the Z direction, and a second portion 51b penetrates the through hole 10d in the Z direction. The second portion 51b is an example of a third portion that is separately provided from the substrate 10. It should be noted that, in this embodiment, a heat sink 52 may also be provided, which is adjacent to and thermally connected to the lower member 51 in the opposite direction of the Z direction relative to the lower member 51, similar to the first embodiment described above.

[0096] [Setting the compression rate of the heat-conducting plate in the containment section]

[0097] In addition, in this embodiment, such as Figure 6 As shown, a receiving portion 60 for a heat-conducting member 47 is provided between the heat dissipation surface 31a2 and the first portion 51a. The receiving portion 60 is configured as a recess that extends from the end face 51c of the first portion 51a in the Z direction in the opposite direction to the Z direction. The end face 51c extends orthogonally to the Z direction and contacts the heat dissipation surface 31a2 around the receiving portion 60. It should be noted that the end face 51c and the heat dissipation surface 31a2 may not be in contact around the entire circumference of the receiving portion 60.

[0098] Figure 7 and 8 is Figure 6 an enlarged view of part VII of Figure 7 It shows the state before the optical transceiver 30 is assembled to the substrate 10, or in other words, the state before the main body 31 of the optical transceiver 30, the heat conducting member 47, and the first part 51a of the heat dissipation mechanism 50 are assembled. Figure 8 It shows the state after the optical transceiver 30 is assembled to the substrate 10, or in other words, the state after the main body 31 of the optical transceiver 30, the heat conducting member 47, and the first part 51a of the heat dissipation mechanism 50 are assembled.

[0099] As Figure 7 shown, in the present embodiment, the accommodating portion 60 is a recessed portion that recesses from the end face 51c with a substantially constant depth (height H). In addition, the heat conducting member 47 has a substantially constant thickness T1 that is larger than the height H in a free state without external forces other than gravity and air pressure. The heat conducting member 47 is accommodated in the accommodating portion 60 in a state that extends substantially orthogonally to the Z direction. And, as Figure 8 shown, in the state after the main body 31, the heat conducting member 47, and the first part 51a are assembled, the heat conducting member 47 is elastically compressed in the Z direction between the main body 31 and the first part 51a, whereby the thickness of the heat conducting member 47 becomes T2 (=H<T1) that is smaller than T1. The thickness T1 is the thickness in a non-compressed state where the heat conducting member 47 is not compressed by two members, namely the main body 31 and the lower member 51. The thickness T1 is, for example, the thickness in a non-compressed state before the switch device 100 is assembled (before the heat conducting member 47 is assembled), or the thickness in a non-compressed state when the substrate assembly is disassembled after being assembled (after the heat conducting member 47 is assembled), that is, the assembled state is released. The disassembly in this case can be the disassembly immediately after assembly, or the disassembly after a relatively long time such as several years from the assembly.

[0100] In the case where the heat conducting member 47 is an elastic material such as an elastomer, the heat conducting member 47 is elastically compressed in the Z direction substantially uniformly at each position in the direction crossing the Z direction. Here, the compression ratio R [%] of the heat conducting member 47 accompanying the assembly can be defined as in the following formula (1).

[0101] R = (T1 - H) / T1 × 100…(1)

[0102] The thermal conductivity of the heat-conducting member 47 increases with the increase of the surface pressure acting on both sides (contact surfaces) in the thickness direction. When this surface pressure reaches or exceeds a threshold, the thermal conductivity becomes approximately saturated. Based on the inventors' in-depth research, from this perspective, it was determined that the compression ratio R is preferably 15% or more, more preferably 20% or more, and even more preferably 25% or more. Furthermore, the higher the compression ratio R, the higher the repulsive force generated by the heat-conducting member 47, and consequently, the higher the stress generated in the heat-conducting member 47, the main body 31, the lower member 51, and the connecting member that combines the optical transceiver 30 and the heat dissipation mechanism 50. From the viewpoint that this stress will not become excessive, it was determined that the compression ratio R is preferably 45% or less, more preferably 40% or less, and even more preferably 35% or less.

[0103] Furthermore, when the area of ​​the optical transceiver 30 exposed to the housing 60 is A1 and the area of ​​the heat-conducting member 47 in contact with the exposed surface is A2, the contact rate Rc[%] between the heat-conducting member 47 and the optical transceiver 30 can be defined as follows (2).

[0104] Rc=A2 / A1×100…(2)

[0105] The larger the contact area between the heat-conducting member 47 and the optical transceiver 30, the higher the thermal conductivity of the heat-conducting member 47. Based on the inventors' in-depth research, from this perspective, it was determined that the contact rate Rc is preferably 15% or more, more preferably 30% or more, and even more preferably 50% or more. It should be noted that the area A1 can also be set as the cross-sectional area of ​​the housing portion 60 in the direction orthogonal to the compression direction (Z direction) of the heat-conducting member 47.

[0106] In this embodiment, the heat generated by the optical transceiver 30 is also transferred and released from the heat dissipation surface 31a2 in the lower member 51 in the opposite direction to the Z direction. According to this embodiment, the same effect as the first embodiment described above can also be obtained.

[0107] Furthermore, according to this embodiment, the receiving portion 60, which is provided with the heat-conducting member 47, allows for the appropriate setting of the compression ratio R of the heat-conducting member 47 by setting the thickness T1 and T2 of the heat-conducting member 47 and the height H of the receiving portion 60. With this structure, for example, it is easy to set the heat conduction efficiency based on the heat-conducting member 47 to a value higher than desired. This facilitates more reliable heat release from the optical transceiver 30. Additionally, it is possible to suppress excessive stress in various parts of the switching device 100 caused by the compressive repulsive force accompanying the heat-conducting member 47. Therefore, deformation and damage to these parts can be suppressed.

[0108] [Third Implementation Method]

[0109] Figure 9 It is part of the switching device 100C (100) of the third embodiment and Figure 4 A sectional view at the same location.

[0110] like Figure 9 As shown, in this embodiment, an insert 10e is provided on the substrate 10, extending through the substrate 10 in the Z direction. The insert 10e is made of a material with high thermal conductivity, such as a copper-based metal. The insert 10e is arranged in the Z direction and in contact with the first portion 51a of the lower member 51, and is thermally connected to the first portion 51a. The insert 10e constitutes part of the heat dissipation mechanism 50, and is an example of being provided at the third portion of the substrate 10. The insert 10e can also be referred to as a heat transfer member or a heat dissipation member. It should be noted that in this embodiment, a heat sink 52 may also be provided adjacent to and thermally connected to the insert 10e in the opposite direction to the insert 10e in the Z direction.

[0111] In this embodiment, the heat generated by the optical transceiver 30 is also transferred and released from the heat dissipation surface 31a2 in the lower member 51 and the insert 10e in the opposite direction to the Z direction. According to this embodiment, the same effect as the first embodiment described above can also be obtained.

[0112] [Fourth Implementation Method]

[0113] Figure 10 It is part of the switching device 100D (100) of the fourth embodiment and Figure 4 A sectional view at the same location.

[0114] like Figure 10 As shown, in this embodiment, a through-hole 10f penetrating the substrate 10 along the Z-direction is provided on the substrate 10. The through-hole 10f is made of a material with high thermal conductivity, such as a copper-based metal. The through-hole 10f can be solid or hollow. In the case of a hollow through-hole, the through-hole 10f can also be a plating layer. The through-hole 10f is arranged in the Z-direction and contacts the first portion 51a of the lower member 51, and is thermally connected to the first portion 51a. The through-hole 10f forms part of the heat dissipation mechanism 50, and is an example of being provided at the third portion of the substrate 10. The through-hole 10f can also be referred to as a heat transfer member or a heat dissipation member. It should be noted that in this embodiment, a heat sink 52 may also be provided adjacent to and thermally connected to the through-hole 10f in the opposite direction to the through-hole 10f in the Z-direction.

[0115] In this embodiment, the heat generated by the optical transceiver 30 is also transferred and released from the heat dissipation surface 31a2 in the lower member 51 and through the through hole 10f in the opposite direction to the Z direction. According to this embodiment, the same effect as the first embodiment described above can also be obtained.

[0116] [A variation of the containment department]

[0117] Figure 11 , 12 This is a cross-sectional view showing a modified example of the housing section 60. For example... Figure 11 As illustrated, the receiving portion 60 may also be composed of a recess that is recessed in the Z direction from the heat dissipation surface 31a2 and a recess that is recessed in the opposite direction from the end face 51c in the Z direction. Additionally, as... Figure 12 As illustrated, the receiving portion 60 may also be composed solely of a recess that is recessed in the Z direction from the heat dissipation surface 31a2. Based on these modifications, it is also possible to obtain a receiving portion 60 similar to that of the second embodiment (…). Figure 8 The same effect applies to the case of ( ).

[0118] [Fifth Implementation]

[0119] Figure 13 This is a perspective view of the switch device 100E (100) according to the fifth embodiment. Figure 14 This is a top view of the switch unit 100E (100). Additionally, Figure 15 This is a side view of the switch device 100E (100).

[0120] like Figures 13-15 As shown, in this embodiment, the heat dissipation mechanism 50 has a heat pipe 53 for transferring heat via a refrigerant between the lower member 51 and the radiator 52. The heat pipe 53 transfers heat from the lower member 51 to the radiator 52 when heated to a gaseous state by the lower member 51, and returns to the lower member 51 when cooled to a liquid state by the radiator 52. The heat pipe 53 is an example of a heat transfer mechanism.

[0121] By incorporating heat pipe 53, the following advantages can be achieved, for example: heat can be released from areas where heat dissipation is easier, thereby enabling more efficient cooling of the optical transceiver 30.

[0122] It should be noted that the heat pipe 53 can also be thermally connected to the heat sink 52 of the switch ASIC 20. In this case, the following advantages can be obtained: the heat sink 52 can be shared in the switch ASIC 20 and the optical transceiver 30, which can reduce the number of components and thus reduce manufacturing time and cost, for example.

[0123] [Sixth Implementation Method]

[0124] Figure 16 It is part of the switching device 100F (100) of the sixth embodiment and Figure 4Cross-sectional view at the same position. In the present embodiment, the heat conductive member 47 is a grease having heat conductivity. This grease may also be mainly composed of, for example, silicone, ester, ether, polyalphaolefin, etc., and contain heat conductive fillers such as boron nitride, aluminum nitride, alumina, and nanodiamond. Thus, even when the heat conductive member 47 is a semi-solid liquid such as grease, the same effects as those of the above-described embodiment can be obtained.

[0125] It is known that when the heat conductive member 47 is grease, the thermal conductivity is higher in the compressed state than in the non-compressed state. Therefore, in the present embodiment, a protrusion 31a3 is provided on the main body 31 of the optical transceiver 30 to be inserted into the housing portion 60 as a recess, and in the assembly of the switch device 100, the protrusion 31a3 compresses the heat conductive member 47 within the housing portion 60. Further, in this case, in order to more reliably compress the heat conductive member 47 as grease within the housing portion 60, the gap between the outer peripheral surface of the protrusion 31a3 and the inner peripheral surface of the housing portion 60 is set to a size such that the compressed heat conductive member 47 does not leak out. In this structure, the surface at the front end of the protrusion 31a3 becomes the heat dissipation surface 31a2. The protrusion 31a3 may also be referred to as an inserted portion inserted into the housing portion 60 or a pressing portion that presses the heat conductive member 47.

[0126] When the volume of the housing portion 60 is V0, before assembling the switch device 100, the heat conductive member 47 having a volume V1 (<V0) in the non-compressed state is housed within the housing portion 60. Further, when assembling the switch device 100, the protrusion 31a3 is housed within the housing portion 60, and the volume V2 of the heat conductive member 47 sandwiched between the protrusion 31a3 and the housing portion 60 is smaller than the volume V1, that is, it is compressed.

[0127] In this case, the compression ratio R [%] of the heat conductive member 47 during assembly can be defined as in the following formula (3).

[0128] R = (V1 - V2) / V2 × 100…(3)

[0129] According to the in-depth research by the inventors and others, it has been found that from the viewpoint of further improving the thermal conductivity, the compression ratio R is preferably 5 [%] or more, more preferably 10 [%] or more, and even more preferably 15 [%] or more. Further, the higher the compression ratio R, the easier the heat conductive member 47 is to leak from the gap, and the higher the repulsive force generated by the heat conductive member 47. Along with this, the stress generated in the heat conductive member 47, the main body 31, the lower member 51, and further the coupling members that couple the optical transceiver 30 and the heat dissipation mechanism 50 becomes higher. From the viewpoint of suppressing leakage from the gap and preventing the stress from becoming too large, it has been found that the compression ratio R is preferably 40 [%] or less, more preferably 35 [%] or less, and even more preferably 30 [%] or less.

[0130] In this embodiment, the same effects as in other embodiments with the heat-conducting member 47 can be obtained. It should be noted that the structure of the switch device 100 when the heat-conducting member 47 is a lubricant is not limited to the above embodiment. For example, instead of the protrusion 31a3, a member different from the optical transceiver 30 can be provided that contacts (preferably adheres to) the surface of the lower member 51 side of the optical transceiver 30 in the assembled state, as the aforementioned insertion part or pressing part. Figure 16 In the structure described above, a configuration in which the protrusion 31a3 is separated from the optical transceiver 30 and designated as a separate component is equivalent to one example. It should be noted that the separate component can also be made of a material with a higher thermal conductivity than the main body 31 of the optical transceiver 30. In this configuration, the separated component can be considered part of the heat-conducting component.

[0131] The above embodiments of the present invention have been illustrated, but these embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other ways, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, the specifications of various structures, shapes, etc. (construction, type, orientation, model, size, length, width, thickness, height, quantity, configuration, position, material, etc.) can be appropriately modified for implementation.

[0132] Explanation of reference numerals in the attached figures:

[0133] 10… Substrate (Substrate Assembly)

[0134] 10a… (First page)

[0135] 10b… (Second side)

[0136] 10c…side

[0137] 10d…through hole

[0138] 10e…Inlay (Third Part)

[0139] 10f… Through hole (third part)

[0140] 20… Switch ASIC (Semiconductor Integrated Circuit)

[0141] 21…Radiator (Second heat dissipation mechanism)

[0142] 21a…fin

[0143] 30… Optical transceiver

[0144] 31…Main Body

[0145] 31a…

[0146] 31a1… Electrical Interface (First Electrical Interface)

[0147] 31a2… Heat dissipation surface (heat dissipation section)

[0148] 31a3…Protrusion (Inserted part, Pressing part)

[0149] 32… fiber optic

[0150] 40… Fixing mechanism (substrate assembly)

[0151] 41… Upper component (second component)

[0152] 41a…opening

[0153] 42…Intermediate component (first component)

[0154] 42a…opening

[0155] 43… Pipe seat (first component)

[0156] 43a… Electrical interface (second electrical interface)

[0157] 43a1… conductor

[0158] 43b…open

[0159] 46…fasteners

[0160] 47… Thermal conductive components

[0161] 48a~48c… Positioning mechanism

[0162] 50… Heat dissipation mechanism (first heat dissipation mechanism, substrate assembly)

[0163] 51…lower side component

[0164] 51a…First part

[0165] 51b…Second part

[0166] 51c…end face

[0167] 52… Radiator

[0168] 52a…fin

[0169] 53…Heat pipe (heat transfer mechanism)

[0170] 60…Containment Department

[0171] 100, 100A~100F… switch devices

[0172] 200… Motherboard

[0173] Areas A1, A2...

[0174] H…height

[0175] S1~S3…State

[0176] Thicknesses T1, T2...

[0177] X…direction

[0178] Y...direction

[0179] Z… direction (first direction).

Claims

1. A substrate assembly, wherein, The substrate assembly includes: A substrate having a first surface facing a first direction and a second surface facing the opposite direction of the first direction on a side opposite to the first surface, and for which an optical transceiver is fixed, the optical transceiver having a first electrical interface and a heat dissipation portion, the optical transceiver being fixed to the substrate with the first electrical interface and the heat dissipation portion facing the opposite direction of the first direction and arranged in a direction intersecting the first direction. as well as A first heat dissipation mechanism has a first portion that is adjacent to and thermally connected to the heat dissipation portion in the first direction when the optical transceiver is fixed to the substrate, and is fixed to the substrate. A heat-conducting component is sandwiched between the heat dissipation part and the first part.

2. The substrate assembly according to claim 1, wherein, A receiving portion for accommodating the heat-conducting component is provided between the heat dissipation portion and the first portion.

3. The substrate assembly according to claim 1, wherein, The heat-conducting component is clamped in contact with both the heat dissipation part and the first part.

4. The substrate assembly according to claim 2, wherein, The height of the receiving portion is lower than the thickness of the heat-conducting member in its uncompressed state.

5. The substrate assembly according to any one of claims 1 to 4, wherein, The thermally conductive component comprises a synthetic resin material and is flexible.

6. The substrate assembly according to claim 1, wherein, The optical transceiver has a main body that is fixed to the substrate and has the first portion. Multiple optical fibers extend from the side of the main body opposite to the heat dissipation section.

7. The substrate assembly according to claim 1 or 6, wherein, The first heat dissipation mechanism has a second portion that is adjacent to the first portion and arranged with the substrate in a direction that intersects with the first direction.

8. The substrate assembly according to claim 1 or 6, wherein, The first heat dissipation mechanism has a third portion adjacent to the first portion and penetrating the substrate along the first direction.

9. The substrate assembly according to claim 8, wherein, The third part is disposed on the substrate.

10. The substrate assembly according to claim 8, wherein, The third part is disposed separately from the substrate.

11. The substrate assembly according to claim 1, wherein, The first heat dissipation mechanism has a heat transfer mechanism that transfers heat through a refrigerant.

12. The substrate assembly according to claim 1, wherein, The first heat dissipation mechanism has a heat sink.

13. The substrate assembly according to claim 1, wherein, A semiconductor integrated circuit is mounted on the first surface.

14. The substrate assembly according to claim 13, wherein, In the semiconductor integrated circuit, a second heat dissipation mechanism is provided on the side opposite to the substrate when it is mounted on the substrate.

15. The substrate assembly according to claim 13 or 14, wherein, The optical transceiver is fixed to the substrate with the heat sink positioned on the opposite side of the semiconductor integrated circuit relative to the first electrical interface.

16. The substrate assembly according to claim 1, wherein, The substrate assembly is configured to fix a plurality of optical transceivers on the substrate as optical transceivers.

17. The substrate assembly according to claim 16, wherein, The plurality of optical transceivers are arranged along the edge of the substrate.

18. The substrate assembly according to claim 17, wherein, The plurality of optical transceivers are arranged along the four sides of the substrate. A semiconductor integrated circuit is mounted on the first surface at a position farther away from each of the edges than the optical transceiver.

19. The substrate assembly according to claim 1, wherein, The substrate assembly includes a fixing mechanism for fixing the optical transceiver relative to the substrate.

20. The substrate assembly according to claim 19, wherein, The fixing mechanism is shared by multiple optical transceivers that serve as optical transceivers.

21. The substrate assembly according to claim 19 or 20, wherein, The fixing mechanism secures the optical transceiver to the substrate in a detachable manner.

22. The substrate assembly according to claim 21, wherein, The fixing mechanism has: a first component fixed to the substrate; and a second component detachably fixed to the first component and pressing the optical transceiver toward the substrate.

23. The substrate assembly according to claim 22, wherein, The optical transceiver has a main body that is fixed to the substrate and has the first portion. Multiple optical fibers extend from the side of the main body opposite to the heat dissipation section. The second component has an opening for the optical fiber to pass through.

24. The substrate assembly according to claim 1, wherein, The substrate assembly includes: A second electrical interface, which is fixed to the substrate and electrically connected to the first electrical interface; and A positioning mechanism for locating the first electrical interface and the second electrical interface.

25. The substrate assembly according to claim 1, wherein, The substrate assembly includes a socket mounted on the substrate and has a second electrical interface electrically connected to the first electrical interface.

26. The substrate assembly according to claim 1, wherein, A heat-conducting member is provided between the first part and the heat dissipation part, and the heat-conducting member is flexible.

27. The substrate assembly according to claim 1, wherein, The substrate assembly is mounted on an integrated substrate capable of mounting multiple substrate assemblies as said substrate assembly.

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