Silicon material inclined plane machining cutter

Abstract

A silicon material slope machining tool comprises tool bits, a tool apron and a tool handle, the tool apron is fixed to the tool handle, at least two tool bits are detachably fixed to the tool apron, each tool bit is provided with a fixing part and a machining part, the fixing part can be fixed to the tool apron, the machining part inclines by a certain angle relative to the fixing part, and the machining face of the machining part is a conical face. The carborundum bonding layer is arranged on the machining face, the tool bit is detachably fixed to the tool apron, the tool bit can be rapidly replaced after being abraded, the machining precision can be improved by replacing the tool bit, the tool bits with different angles can be installed on the same tool apron for machining, the cost of different tools is greatly reduced, and the machining efficiency is improved. And the tool can be modularly designed, so that the universality is wider.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor processing, and in particular relates to a silicon material bevel processing tool. Background Art

[0002] Semiconductor materials mainly include silicon, germanium, gallium arsenide, etc. These semiconductor materials are generally hard and difficult to process. The processing of some semiconductor materials also needs to avoid direct contact with metals to avoid affecting the conductive properties of the materials. Therefore, most semiconductor materials are processed by diamond grinding.

[0003] Semiconductor materials, especially silicon materials, are used in large quantities. The processing of silicon materials, such as silicon boats, often requires processing bevels. These bevels usually have a small inclination angle. Therefore, the wear on one side is very large when ordinary tools are used for processing. If a layered step-by-step processing method is adopted, although the difference in wear can be slightly reduced, it will greatly increase the processing time and reduce production efficiency. The tool wear is unstable, which can easily lead to poor surface roughness of the bevel and greatly reduce the processing accuracy. In addition, different tools need to be replaced when processing bevels at different angles. Since the inclination angles of different product designs are different, a large number of tools with different designs will also increase the processing cost. Therefore, there is room for improvement in the tools. Utility Model Content

[0004] In view of the above-mentioned prior art, the purpose of the utility model is to provide a more practical silicon material bevel processing tool.

[0005] The technical solution of the utility model is achieved as follows: a silicon material bevel processing tool comprises a cutter head, a cutter seat and a cutter handle, the cutter seat is fixed to the cutter handle, at least two cutter heads are detachably fixed to the cutter seat, the cutter head is provided with a fixing part and a processing part, the fixing part can be fixed to the cutter seat, the processing part is inclined at a certain angle relative to the fixing part, the processing surface of the processing part is formed into a conical surface, and a diamond abrasive bonding layer is provided on the processing surface.

[0006] The beneficial effects of this design are: the cutter head is fixed to the tool holder in a detachable manner, and the cutter head can be quickly replaced after being worn. By replacing the cutter head, the processing accuracy can be increased. Cutter heads of different angles can be installed on the same tool holder for processing, which greatly reduces the cost of different tools. The modular design of the tool makes it more versatile.

[0007] Furthermore, the tool head includes a finishing tool head and a roughing tool head. A certain machining allowance can be set during roughing tool head machining. In this way, the research and development direction of roughing tools is mainly how to overcome the unevenness of tool wear and the versatility of small angle change machining. Finishing is mainly to improve machining accuracy and ensure product quality. The two directions can greatly increase the improvement space of the tool head. Some improvements may affect the machining accuracy, but for roughing, it can be used as long as it is within the allowable range. For inclination angles close to 45 degrees, even two roughing operations can be performed. The angle deviation of the first roughing can be larger, and the machining allowance is also larger. The second roughing allowance is smaller, and the angles are basically the same. In this way, it is easier to ensure accuracy and tool life during finishing.

[0008] Furthermore, the machining surface of the rough machining tool head includes a feed side and an exit side. Under the same machining radius, the vertical height of the feed side is higher than the vertical height of the exit side, so that the machining surface does not overlap with the conical surface and the height difference is within the range of thickness converted to height of a single tool head grinding process at one time. This design takes into account that there are multiple tool heads on a tool holder, and there is a certain gap between the tool heads. In this way, when maintaining a certain feed speed, there is a certain vacancy when transitioning from one tool head to another. The tool head at this vacant position does not process the silicon material at this position, but the tool holder continues to feed. When the next tool head contacts this position, there will be a large machining allowance. This position is also the feed side. Under such a machining mode, the wear on the feed side will be greater than that on the exit side, but when the wear reaches a certain level, it will reach Balance, that is, balance can be achieved when the displacement of the tool in the empty section is equal to the thickness difference of the corundum bonding layer on the feed side and the exit side. After balance is achieved, there will be basically no large impact when the tool head feeds. This is also related to the tool feed speed and rotation speed. Different tools have different rotation speeds and feed speeds, and the thickness difference is also different. In an ideal state, the machining surface of the tool head is a conical surface, but considering the interval between the tool heads, the machining surface cannot be designed as a conical surface, and it is difficult to adjust the thickness of the corundum bonding layer. Therefore, the machining surface is directly changed during actual machining. Under the same machining radius in geometric dimensions, the feed side is higher than the exit side. The specific number can be determined according to the tool head spacing, tool head rotation speed and feed speed. With such a design, there will be no great impact when using a new tool to maintain a certain feed speed.

[0009] Furthermore, the cutter head is provided with an inner end and an outer end of the cutter. The inner end of the cutter is closer to the central axis of rotation of the cutter head than the outer end of the cutter. The width of the outer end of the cutter head is greater than the width of the inner end of the cutter head. During the processing of the cutter head, the outer end of the cutter wears much more than the inner end of the cutter. The smaller the inclination angle, the greater the wear deviation of the outer end of the inner cutter. Increasing the width of the outer end of the cutter can make the outer end of the cutter head more wear-resistant, and can also increase the processing efficiency of the outer end of the cutter head, so that the wear of the inner end and the outer end of the cutter head is relatively balanced, avoiding the cutter head from failing due to excessive wear on one side, and relatively extending the service life of the tool.

[0010] Furthermore, the processing surface is projected onto a plane perpendicular to the central axis of rotation in a bow shape, with the inferior arc of the bow located at the outer end of the tool and the chord of the bow located at the inner end of the tool. In this way, the area of ​​the tool head processing surface is basically correlated with the amount of silicon material being processed, and there will be no situation where some areas are obviously worn too much. If the diamond abrasive bonding layer on the processing surface wears evenly, the processing accuracy that can be obtained will be higher. Especially for fine processing, the processing accuracy has a greater impact on product quality. Improving the processing accuracy is of great help to improving product quality. Many inclined surfaces are reference surfaces for processing other parts. If these surfaces deviate, the position of subsequent processing will deviate by a certain distance, which has a great impact on the accuracy of the entire product.

[0011] Furthermore, the processing surface is projected onto a plane perpendicular to the central axis of rotation into a half-arc shape. The complete arch needs to occupy a large space and too many cutter heads cannot be set. Half an arch can solve this shortcoming. For most inclined surface processing, it is easy to set four half-arc cutter heads for processing, and multiple cutter heads are also easier to remove chips.

[0012] Furthermore, the corundum bonding layer is provided with a plurality of chip grooves, which extend from the inner end of the cutter to the outer end of the cutter. The bow-shaped cutter head has a large area. The provision of the chip grooves can ensure that the waste chips generated by the feed side processing are discharged through the chip grooves, thereby minimizing the impact on subsequent processing and avoiding affecting the processing accuracy.

[0013] Furthermore, the installation direction of the cutter head is perpendicular to the radial and axial directions and opposite to the rotation direction, so that the force acting on the cutter head during the processing is opposite to the installation direction, and the installation of the cutter head is more stable, and stable installation can be achieved by setting a simple fixing structure.

[0014] Furthermore, the tool holder is provided with a rotating shaft so that the cutter head can be fixed to the tool holder by rotating a certain angle around the rotating shaft relative to the tool holder. For rough processing, the accuracy requirements of the cutter head are not high and a certain error range can be allowed. Therefore, even if the cutter head is installed with some looseness, it is acceptable. When processing inclined surfaces of different angles, if the angle difference is small, the angle of the cutter head can be directly adjusted for direct processing. This is more convenient and quick, and can reduce processing costs.

[0015] Furthermore, the tool holder is provided with a plurality of mounting positions so that the tool head can be mounted on the tool holder at different angles relative to the tool holder. For those with high machining accuracy requirements, using a plurality of mounting positions can greatly improve the accuracy and stability of the angle of each mounting position. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional schematic diagram of the processing position of a silicon material bevel processing tool of the utility model;

[0017] Figure 2This is a side schematic diagram of the processing position of a silicon material bevel processing tool of the utility model;

[0018] Figure 3 This is a schematic diagram of a T-shaped fixed part of a silicon material bevel processing tool of the utility model;

[0019] Figure 4 This is a schematic diagram of a T-slot tool holder for a silicon material bevel processing tool of the utility model;

[0020] Figure 5 This is a schematic diagram of a rough machining tool head with a widened outer end for a silicon material bevel machining tool according to the utility model;

[0021] Figure 6 This is a schematic diagram of the machining surface offset of the tool head of a silicon material bevel machining tool of the utility model

[0022] Figure 7 This is a schematic diagram of a tool seat of a silicon material bevel processing tool with a widened tool head at the outer end of the tool according to the utility model;

[0023] Figure 8 This is a schematic diagram of a side-mounted cutter head for a silicon material bevel processing tool according to the utility model;

[0024] Fig. 9 This is a schematic diagram of a side-mounted tool holder for a silicon material bevel processing tool according to the utility model;

[0025] Fig.10 This is a schematic diagram of an articulated cutter head for a silicon material bevel processing tool according to the utility model;

[0026] Fig.11 This is a schematic diagram of an articulated tool holder for a silicon material bevel processing tool of the utility model;

[0027] Fig.12 This is a schematic diagram of a bow-shaped tool head for a silicon material bevel processing tool of the utility model;

[0028] Fig.13 It is a schematic diagram of a semi-bowed tool head for a silicon material bevel processing tool of the utility model. DETAILED DESCRIPTION

[0029] As required, detailed embodiments of the present invention are disclosed herein, but it should be understood that the disclosed embodiments are only exemplary of the present invention, and the present invention may be implemented in different and alternative forms. The drawings are not necessarily drawn to scale, and certain features may be exaggerated or reduced to show the details of specific components. Therefore, the specific structural and functional details disclosed herein should not be understood as having a limiting meaning, but only as a representative basis to teach those skilled in the art to adopt the present invention differently. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0030] like Figure 1 and Figure 2 As shown, a silicon material bevel processing tool comprises a tool head 1, a tool seat 2 and a tool handle 3, the tool seat 2 is fixed to the tool handle 3, at least two tool heads 1 are detachably fixed to the tool seat 2, the tool head 1 is provided with a fixing portion 4 and a processing portion 5, the fixing portion 4 can be fixed to the tool seat 2, the processing portion 5 is inclined at a certain angle relative to the fixing portion 4, the processing portion 5 is provided with a processing surface 6 that is a conical surface, and a diamond abrasive bonding layer is provided on the processing surface 6, so that a conical tool surface 7 can be left on one side of the processed silicon material 12, and the other side is a bevel 8.

[0031] like Figure 1 and Figure 2 As shown, the tool handle 3 can select a tapered tool handle 3, so that it can be installed on most machine tools for use. The tool handle 3 and the tool holder 2 can be connected by threads, which is convenient for disassembly and installation. Of course, the tool handle 3 and the tool holder 2 can also be directly welded together to form an integrated structure. Due to the inconvenience of manufacturing, the tool holder 2 and the tool handle 3 are usually processed separately and then assembled together. If an integrated structure is adopted, a lot of cutting processing is required, which is time-consuming and labor-intensive. If the main structure is first cast and then machined, the cost is also relatively high, but the processing accuracy of the tool is improved. Therefore, the appropriate processing method can be selected according to specific needs.

[0032] like Figure 3 and Figure 4As shown, the structure of the tool holder 2 is also related to the number of fixed tool heads 1. In terms of processing accuracy and use, designing a tool holder 2 with four tool heads 1 can achieve higher processing accuracy and is more convenient for tool detection. A cross-shaped side arm 9 can be set on the tool holder 2, and the four tool heads 1 are arranged in a circle with a circumferential interval of 90 degrees and installed on the side arm 9. To ensure that the tool head 1 is stably fixed on the tool holder 2, the tool holder 2 can be designed with a T-slot 10 to match the T-shaped fixing portion 11 of the tool head 1. Since the tool holder 2 will generate an outward centrifugal force when it rotates, the tool head 1 will generate an inward reaction force when it contacts the processing material, that is, it will periodically generate a force in the opposite direction in the radial direction. Therefore, more screws are needed when the tool holder 2 fixes the tool head 1, and the tool holder 2 should also be provided with more threaded holes 13, or other methods should be used to limit the radial back-and-forth fluctuation force.

[0033] like Figure 3 and Figure 5 As shown, the tool head 1 includes a finishing tool head 14 and a roughing tool head 15. The design of the finishing tool head 14 mainly considers the processing accuracy, and the roughing tool head 15 mainly considers the processing efficiency. In many cases, the processing efficiency will decrease when the accuracy is considered. For example, the tool head 1 should be replaced frequently to avoid the wear of the tool head 1 and reduce the accuracy, and the tool feed speed should be reduced to obtain better processing quality. However, to obtain higher processing efficiency, it is necessary to increase the tool feed speed and increase the grinding area of ​​the tool head 1. Of course, a certain processing allowance should be reserved to avoid over-processing.

[0034] like Figure 5 , Figure 6 and Figure 7As shown, the machining surface 6 of the rough machining tool head 15 includes a feed side 16 and an exit side 17. Under the same machining radius, the vertical height of the feed side 16 is higher than the vertical height of the exit side 17, so that the machining surface 6 does not overlap with the conical surface and the height difference is within the range of the thickness converted to the height of a single tool head grinding process at one time. The rough machining feed speed is relatively fast. When the design of four tool heads 1 is adopted, the intervals between the tool heads 1 may also be relatively large. In this case, if the machining surface 6 of the tool head 1 is a conical surface, since the tool head 1 will not only rotate at a uniform speed, but also feed at a continuous and stable speed, the feed side 16 will have a large cutting amount when it initially contacts the processed silicon material. Since the silicon material is relatively brittle, such impact may cause local surface collapse and cause greater wear on the near-tool side of the tool head 1. If the feed speed is reduced, the machining efficiency will be reduced. In terms of balancing efficiency and processing quality, optimizing the tool becomes the first choice. Raising the height of the feed side 16 can avoid this impact, but the height is a very small value and is related to the tool feed speed, tool radius and rotation speed. If the tool feed speed is 600mm / min and the rotation speed is 6000n / min, the tool feeds 0.1mm per circle. If four cutter heads 1 are designed, and the circumferential spacing between the cutter heads 1 is 4 times the circumferential distance of the cutter heads 1, then the distance between the two cutter heads 1 is equivalent to a feed of 0.02mm. In this way, if the feed side 16 is ground to a thickness of 0.02mm, this cutting amount can be avoided. After grinding, it is equivalent to a smaller processing radius. Compared with other positions of the same processing radius, it is equivalent to increasing the vertical height. It can also be considered that the exit side 17 has become thicker or the position of the exit side 17 has been lowered. Figure 6 As shown, the solid line is the position of the initial processing surface 6, and the dotted line is the optimized curved surface structure. The dotted line is located below the solid line on the exit side 17. Of course, the height can also be increased on the entry side 16 so that the dotted line is located above the solid line. Although it is close to a conical surface, it has undergone slight changes relative to the conical surface. Although it is approximately considered to be a conical surface, it can be considered that the curved surface is a kind of curved surface that slowly transitions from a conical surface with a smaller radius to a larger conical surface between two conical surfaces with a radius difference of 0.02mm. It is more troublesome to calculate the height difference between the two conical surfaces. If only a near-sighted calculation is performed, it is relatively simple. If the inclination angle of the silicon material 12 is θ, then the feed value 0.02÷sinθ can get the reasonable height difference of the conical surface. In actual processing, it can also be directly programmed according to the cutting thickness of 0.02mm, without calculating the height difference. As for how to transition between the entry side 16 and the exit side, there are not many requirements. Of course, the smoother the transition, the smaller the impact on the processing. It can also be found that the larger the curved surface, the smoother the transition, and the smaller the impact. The rough machining cutter head 1 can use 100 mesh corundum, and the fine machining cutter head 14 can use 500 mesh corundum. Before machining, the fine machining cutter head 14 can use a trimming stone to trim the inclination angle of the fine machining cutter head 14, which can further improve the machining accuracy.

[0035] like Figure 5 , Figure 6 and Figure 7 As shown, further, the cutter head 1 includes an inner end 18 and an outer end 19. The inner end 18 is closer to the central axis of rotation of the cutter head 1 than the outer end 19. The width of the outer end 19 of the cutter head 1 is greater than the width of the inner end 18 of the cutter head 1. The outer end 19 of the cutter head 1 processes a larger area, so the wear is also greater. The ideal tool should be a disc-shaped tool, but the disc-shaped tool has an integral structure and is not easy to replace. The damage of the local diamond bonding layer requires overall replacement. The disc-shaped tool cannot overcome the problem that the outer end 19 of the cutter wears more than the inner end 18 of the cutter. The large defect of the side end 18, that is, most of the diamond grain bonding layer on the inner end 18 of the knife not only has little effect, but will affect the processing accuracy after a period of processing, because the diamond grain bonding layer on the outer end 19 of the knife becomes thinner, the thickness of the inner end 18 of the knife remains basically unchanged, and the inclination angle also changes. Therefore, the width of the outer end 19 of the knife is purposefully increased and the width of the inner end 18 of the knife is reduced, which can ensure that the inner end 18 and the outer end 19 of the knife are basically worn and thinned synchronously, which has a smaller impact on the processing accuracy and can reduce the frequency of tool replacement.

[0036] like Fig.12 As shown, the processing surface 6 is projected onto a plane perpendicular to the central axis of rotation into an arc shape, the inferior arc of the arc is located at the outer end 19 of the tool, and the chord of the arc is located at the inner end 18 of the tool. If the area of ​​the processing surface 6 of the tool head 1 is calculated based on the area of ​​the processing surface 6, then the conical surface projected into an arc shape is undoubtedly the most perfect, because after processing on the silicon material for a certain period of time, a shape projected into a half arc shape will also appear on the surface of the silicon material. In theory, the arc-shaped processing surface 6 can fit with the surface of the silicon material.

[0037] like Fig.13 As shown, the machining surface 6 is projected onto a plane perpendicular to the central axis of rotation to form a semi-arc shape. This design allows the machining surface 6 to completely match the conical surface machined on the silicon material at a certain position. In this way, the machining surface 6 can be ground more evenly at various positions, and is less likely to have large local wear. This allows the machining accuracy to be maintained for a long time, thereby improving the machining efficiency. The feed side 16 can be set at an end away from the fixed portion 4, which can reduce the impact of a certain thickness difference in the feed on the next cutter head 1 when the cutter head 1 is switched, and can gradually and slowly transition.

[0038] like Fig.13As shown, the diamond abrasive bonding layer is provided with a plurality of chip grooves 20, and the chip grooves 20 extend from the inner end 18 of the cutter to the outer end 19 of the cutter. Since the machining surface 6 of some designed cutter heads 1 is relatively large, a large amount of ground particles will be generated during the machining process. If they are not removed in time, the accumulation between the machining surface 6 and the silicon material will affect the machining accuracy. The chip grooves 20 can collect the cut waste chips within a certain range. The design of the chip grooves 20 is as close to the cutting direction of the cutter head 1 as possible, but they cannot be set in parallel. The chip removal effect of parallel setting is too poor, and the chip removal is not smooth if the angle is too large. Generally speaking, the tangent direction of the chip groove 20 is in the range of 5 to 40 degrees with the moving direction of the cutter head 1, preferably 25 degrees, so that the chip removal effect is better.

[0039] like Figure 8 and Fig. 9 As shown, the installation direction of the cutter head 1 is perpendicular to the radial and axial directions and opposite to the rotation direction. The cutter head 1 is installed sideways, so that the radial position of the cutter head 1 can be ensured. The installation direction of the cutter head 1 is opposite to the rotation direction, so that the cutter head 1 can be tighter during processing and is not prone to loosening during processing. A plurality of circumferentially extending dovetail grooves or T-slots 23 are provided on the side arms 9 of the tool holder 2, and the T-shaped fixing portion 24 of the cutter head 1 can be inserted into the dovetail groove or T-slot 23 and fixed by screws.

[0040] like Fig.10 , Fig.11 and Fig.12 As shown, the tool holder 2 is provided with a rotating shaft so that the cutter head 1 can be fixed to the tool holder 2 by rotating a certain angle around the rotating shaft relative to the tool holder 2. Since the processed inclined surfaces have different angles, the cost of developing specific tools for processing with smaller batches is relatively high. Therefore, a rotating shaft 26 can be provided on the side wall 27 of the tool holder 2, and the cutter head 1 is provided with a rotating hole 25 to be installed on the rotating shaft 26. Positioning screws are provided on both sides of the rotating shaft 26. A spherical concave surface 28 is provided at the corresponding position of the cutter head 1 to match the positioning screws. The angle of the cutter head 1 relative to the tool holder 2 can be changed by limiting the positioning screws.

[0041] like Figure 8 and Fig. 9 As shown, the tool holder 2 is provided with a plurality of mounting positions so that the tool head 1 can be installed on the tool holder 2 at different angles relative to the tool holder 2. The tool holder 2 can be provided with a plurality of side arms 9. Mounting positions are provided on both sides of the side arms 9, i.e., a left mounting position 21 and a right mounting position 22. The mounting positions on both sides, i.e., the left mounting position 21 and the right mounting position 22, form a certain angle so that the tool head 1 can be installed together at different relative angles relative to the tool holder 2.

Claims

1. A silicon material bevel machining tool, characterized in that: The present invention comprises a cutter head (1), a cutter seat (2) and a cutter handle (3), wherein the cutter seat (2) is fixed to the cutter handle (3), and at least two cutter heads (1) are fixed to the cutter seat (2) in a detachable manner. The cutter head (1) is provided with a fixing portion (4) and a processing portion (5), wherein the fixing portion (4) can be fixed to the cutter seat (2), and the processing portion (5) is inclined at a certain angle relative to the fixing portion (4), and a processing surface (6) provided on the processing portion (5) is a conical surface, and a diamond bonding layer is provided on the processing surface (6).

2. The silicon material bevel machining tool according to claim 1, characterized in that: The tool head (1) comprises a finishing tool head (14) and a roughing tool head (15).

3. The silicon material bevel machining tool according to claim 2, characterized in that: The machining surface (6) of the rough machining tool head (15) comprises a feed side (16) and an exit side (17); under the same machining radius, the vertical height of the feed side (16) is higher than the vertical height of the exit side (17), so that the machining surface (6) does not overlap with the conical surface and the height difference is within the range of the thickness converted to height of a single grinding process of the tool head (1).

4. The silicon material bevel machining tool according to claim 2 or 3, characterized in that: The cutter head (1) comprises an inner cutter end (18) and an outer cutter end (19); the inner cutter end (18) is closer to a rotation center axis of the cutter head (1) than the outer cutter end (19); and the width of the outer cutter end (19) of the cutter head (1) is greater than the width of the inner cutter end (18) of the cutter head (1).

5. The silicon material bevel machining tool according to claim 4, characterized in that: The processing surface (6) is projected onto a plane perpendicular to the central axis of rotation to form an arc shape, the minor arc of the arc is located at the outer end (19) of the knife, and the chord of the arc is located at the inner end (18) of the knife.

6. The silicon material bevel machining tool according to claim 4, characterized in that: The processing surface (6) is projected onto a plane perpendicular to the central axis of rotation into a half-arc shape.

7. The silicon material bevel machining tool according to claim 5 or 6, characterized in that: The diamond grit bonding layer is provided with a plurality of chip removal grooves (20), and the chip removal grooves (20) extend from the inner end (18) of the knife to the outer end (19) of the knife.

8. The silicon material bevel machining tool according to claim 7, characterized in that: The installation direction of the cutter head (1) is perpendicular to the radial direction and the axial direction and opposite to the rotation direction.

9. The silicon material bevel machining tool according to claim 7, characterized in that: The knife seat (2) is provided with a rotation axis so that the knife head (1) can be rotated at a certain angle around the rotation axis relative to the knife seat (2) and fixed to the knife seat (2).

10. The silicon material bevel machining tool according to claim 7, characterized in that: The knife seat (2) is provided with a plurality of mounting positions so that the knife head (1) can be mounted on the knife seat (2) at different angles relative to the knife seat (2).

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