Automatic silicon carbide tray conveying device for RTA

Abstract

The utility model discloses an automatic silicon carbide tray conveying device for RTA, which comprises a supporting platform provided with a plurality of first ejector pins which are vertically arranged and provided with supporting parts; the tray is provided with a first groove and a first through hole, the tray is arranged on the supporting platform, the first ejector pin penetrates through the first through hole, and the tray is supported by the supporting part; and the mechanical arm can place the silicon carbide substrate slice on the top of the second ejector pin and can lift the tray from the bottom of the tray, so that the silicon carbide substrate slice enters the first groove, and then the tray can be conveyed to an RTA process cavity. The automatic silicon carbide tray conveying device for the RTA can achieve automatic feeding and discharging of sheet materials and is high in efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon carbide (SIC) diode chip manufacturing, in particular to an automatic conveying device for a silicon carbide tray used for RTA. Background Art

[0002] RTA (rapid annealing) is a commonly used annealing process in integrated circuits. Silicon substrate RTA does not require a tray and can be directly transferred automatically by a robotic arm. Silicon carbide substrate RTA requires the use of a tray made of silicon carbide for heating. The reason is that the silicon carbide substrate sheet is a transparent material that does not absorb heat, and a tray made of silicon carbide is required for heat conduction. The tray made of silicon carbide has excellent thermal conductivity and can effectively disperse and conduct heat, which helps to control the temperature during the preparation process.

[0003] The existing trays are manually loaded and unloaded, which is inefficient. On the other hand, loading and unloading the trays can easily cause scratches, chip drops, bumps, etc., which damage the silicon carbide substrate. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an automatic conveying device for silicon carbide trays used for RTA, which can realize automatic loading and unloading of sheets with high efficiency.

[0005] According to the first aspect of the present invention, an automatic conveying device for silicon carbide trays for RTA includes:

[0006] A supporting platform is provided with a plurality of first ejector pins, wherein the first ejector pins are arranged vertically and are provided with a supporting portion;

[0007] A tray is provided with a first groove and a first through hole, the tray is arranged on the supporting platform, the first ejector pin passes through the first through hole, and the tray is supported by the supporting part;

[0008] The robot can place the silicon carbide substrate piece on the top of the first ejector pin, and can lift the tray from the bottom of the tray to allow the silicon carbide substrate piece to enter the first groove, and then can transport the tray to the RTA process chamber.

[0009] According to an embodiment of the utility model, an automatic conveying device for a silicon carbide tray for RTA has at least the following beneficial effects: the tray is placed on the first ejector pin of the supporting platform and is supported by the supporting portion provided on the first ejector pin, the silicon carbide substrate sheet delivered by the robot is directly placed on the first ejector pin, and then the robot moves to the bottom of the tray to lift the tray, the tray rises and then the silicon carbide substrate sheet enters the first groove of the tray, and finally the robot delivers the tray with the silicon carbide substrate sheet into the RTA process chamber, thereby realizing automatic loading and unloading of sheets, with high efficiency and without damaging the silicon carbide substrate sheet.

[0010] According to some embodiments of the utility model, a cover is further included, the support platform is further provided with a second ejector pin, the second ejector pin is parallel to the first ejector pin, and the second ejector pin is located outside the space surrounded by the plurality of the first ejector pins, the length of the second ejector pin is greater than the first ejector pin, the first ejector pin or the second ejector pin is provided with a support portion, the tray is further provided with a second through hole, the second ejector pin passes through the second through hole, the tray is supported by the support portion, and the cover is placed on top of the second ejector pin.

[0011] According to some embodiments of the present utility model, both the first ejector pin and the second ejector pin are provided with a supporting portion, and a height of the supporting portion of the first ejector pin is consistent with a height of the supporting portion of the second ejector pin.

[0012] According to some embodiments of the present invention, the tray is further provided with a second groove, the second groove is located outside the first groove, the depth of the first groove is greater than the depth of the second groove, and the tray can enter the second groove.

[0013] According to some embodiments of the present invention, the first through hole is located in the first groove, and the second through hole is located in the second groove.

[0014] According to some embodiments of the present invention, the ends of the first ejector pin and the second ejector pin are both pointed.

[0015] According to some embodiments of the present invention, the depth of the first groove is greater than the thickness of the silicon carbide substrate sheet, and the silicon carbide substrate sheet can just enter the first groove.

[0016] According to some embodiments of the present invention, the depth of the second groove is equal to the thickness of the cover, and the cover can just enter the second groove.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is a schematic diagram of an automatic conveying device for silicon carbide trays used for RTA according to an embodiment of the utility model;

[0020] Figure 2 for Figure 1 An exploded view of a portion of the structure of an automatic conveying device for silicon carbide trays used for RTA is shown.

[0021] Reference numerals:

[0022] The supporting platform 100 , the first ejector pin 110 , the second ejector pin 120 , the supporting portion 130 , the tray 200 , the first groove 210 , the second groove 220 , the first through hole 230 , the second through hole 240 , the cover 300 , and the robot 400 . DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0027] RTA (rapid annealing) is a commonly used annealing process in integrated circuits. Silicon substrate RTA does not require a tray and can be directly transferred automatically by a robotic arm. Silicon carbide substrate RTA requires the use of a tray made of silicon carbide for heating. The reason is that the silicon carbide substrate sheet is a transparent material that does not absorb heat, and a tray made of silicon carbide is required for heat conduction. The tray made of silicon carbide has excellent thermal conductivity and can effectively disperse and conduct heat, which helps to control the temperature during the preparation process.

[0028] The existing trays are manually loaded and unloaded, which is inefficient. On the other hand, loading and unloading the trays can easily cause scratches, chip drops, bumps, etc., which damage the silicon carbide substrate.

[0029] In view of the technical problems existing in the prior art, the utility model proposes an automatic conveying device for silicon carbide trays for RTA, in which the tray is placed on a first ejector pin of a supporting platform and is supported by a supporting portion arranged on the first ejector pin. The silicon carbide substrate sheet delivered by a robot is directly placed on the first ejector pin, and then the robot moves to the bottom of the tray to lift the tray. The tray rises and then the silicon carbide substrate sheet enters the first groove of the tray. Finally, the robot delivers the tray with the silicon carbide substrate sheet into the RTA process chamber, thereby realizing automatic loading and unloading of sheets, with high efficiency and without damaging the silicon carbide substrate sheet.

[0030] Reference Figure 1 and Figure 2 It can be understood that the automatic conveying device for silicon carbide tray 200 for RTA provided by the embodiment of the utility model includes a support platform 100, a tray 200 and a manipulator 400. Specifically, the support platform 100 is provided with a plurality of first ejector pins 110, the first ejector pins 110 are arranged vertically, and the first ejector pins 110 are provided with a support portion 130. The utility model preferably provides three first ejector pins 110, and the figure surrounded by the three first ejector pins 110 is an equilateral triangle. The tray 200 is provided with a first groove 210 and a first through hole 230. The tray 200 is arranged on the support platform 100, the first ejector pin 110 passes through the first through hole 230, and the tray 200 is supported by the support portion 130. The manipulator 400 can place the silicon carbide substrate sheet on the top of the second ejector pin 120, and can lift the tray 200 from the bottom of the tray 200 so that the silicon carbide substrate sheet enters the first groove 210, and then can transport the tray 200 to the RTA process chamber.

[0031] It should be noted that, further, the automatic conveying device for silicon carbide tray 200 for RTA further includes a cover 300, the support platform 100 is further provided with a second ejector pin 120, the second ejector pin 120 is parallel to the first ejector pin 110, and the second ejector pin 120 is located outside the space surrounded by the plurality of first ejector pins 110, the length of the second ejector pin 120 is greater than the first ejector pin 110, the first ejector pin 110 or the second ejector pin 120 is provided with a support portion 130, the tray 200 is further provided with a second through hole 240, the second ejector pin 120 passes through the second through hole 240, the tray 200 is supported by the support portion 130, and the cover 300 is placed on the top of the second ejector pin 120. The utility model preferably provides three second ejector pins 120, the figure surrounded by the three second ejector pins 120 is an equilateral triangle, and the second ejector pin 120 is located outside the first ejector pin 110. The robot 400 can deliver the silicon carbide substrate sheet between the cover 300 and the tray 200 and place it on the top of the first ejector pin 110 , and then lift the tray 200 from the bottom until the silicon carbide substrate sheet enters the tray 200 and the cover 300 is placed on the top of the tray 200 .

[0032] In addition, in some embodiments, the first ejector pin 110 and the second ejector pin 120 are both provided with a support portion 130, and the height of the support portion 130 of the first ejector pin 110 is consistent with the height of the support portion 130 of the second ejector pin 120, so that the first ejector pin 110 and the second ejector pin 120 can simultaneously support the tray 200. The tray 200 is also provided with a second groove 220, and the second groove 220 is located outside the first groove 210. The depth of the first groove 210 is greater than the depth of the second groove 220, and the tray 200 can enter the second groove 220, and the cover 300 can enter the second groove 220. The first through hole 230 is located in the first groove 210, and the second through hole 240 is located in the second groove 220.

[0033] It should be noted that the ends of the first ejector pin 110 and the second ejector pin 120 are both pointed. This arrangement can reduce the contact area between the first ejector pin 110 and the second ejector pin 120 and the cover 300 and the silicon carbide substrate, thereby reducing the risk of scratches.

[0034] It should be noted that the depth of the first groove 210 is greater than the thickness of the silicon carbide substrate sheet, and the silicon carbide substrate sheet can just enter the first groove 210. The depth of the second groove 220 is equal to the thickness of the cover 300, and the cover 300 can just enter the second groove 220. This arrangement prevents the cover 300 from directly contacting the silicon carbide substrate sheet, and the sizes of the first groove 210 and the second groove 220 are designed just right to prevent the cover 300 or the silicon carbide substrate sheet from shaking and colliding with the tray 200 during movement.

[0035] It should be noted that the robot 400 may also be other handling devices or conveying devices.

[0036] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. An automatic conveying device for silicon carbide trays for RTA, characterized in that: include: A supporting platform is provided with a plurality of first ejector pins, wherein the first ejector pins are arranged vertically and are provided with a supporting portion; A tray is provided with a first groove and a first through hole, the tray is arranged on the supporting platform, the first ejector pin passes through the first through hole, and the tray is supported by the supporting part; The robot can place the silicon carbide substrate piece on the top of the first ejector pin, and can lift the tray from the bottom of the tray to allow the silicon carbide substrate piece to enter the first groove, and then can transport the tray to the RTA process chamber.

2. The automatic conveying device for silicon carbide trays for RTA according to claim 1, characterized in that: The tray further includes a cover, the support platform is further provided with a second ejector pin, the second ejector pin is parallel to the first ejector pin, and the second ejector pin is located outside the space surrounded by the plurality of the first ejector pins, the length of the second ejector pin is greater than the first ejector pin, the first ejector pin or the second ejector pin is provided with a support portion, the tray is further provided with a second through hole, the second ejector pin passes through the second through hole, the tray is supported by the support portion, and the cover is placed on top of the second ejector pin.

3. The automatic conveying device for silicon carbide trays for RTA according to claim 2, characterized in that: The first ejector pin and the second ejector pin are both provided with a supporting portion, and a height of the supporting portion of the first ejector pin is consistent with a height of the supporting portion of the second ejector pin.

4. The automatic conveying device for silicon carbide trays for RTA according to claim 2, characterized in that: The tray is further provided with a second groove, the second groove is located outside the first groove, the depth of the first groove is greater than the depth of the second groove, and the tray can enter the second groove.

5. The automatic conveying device for silicon carbide trays for RTA according to claim 4, characterized in that: The first through hole is located in the first groove, and the second through hole is located in the second groove.

6. The automatic conveying device for silicon carbide trays for RTA according to claim 2, characterized in that: The ends of the first ejector pin and the second ejector pin are both pointed.

7. The automatic conveying device for silicon carbide trays for RTA according to claim 1, characterized in that: The depth of the first groove is greater than the thickness of the silicon carbide substrate sheet, and the silicon carbide substrate sheet can just enter the first groove.

8. The automatic conveying device for silicon carbide trays for RTA according to claim 4, characterized in that: The depth of the second groove is equal to the thickness of the cover, and the cover can just enter the second groove.

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