Novel chuck preparation device

Abstract

The utility model discloses a novel chuck manufacturing device which comprises a beryllium-mullite shielding cover. The ceramic insulating plate is fixedly connected to the lower end of the inner side wall of the beryllium-mullite shielding cover; the chuck leveling mounting plate is arranged on the outer edge of the upper end of the ceramic insulating plate; the Chuck disc is arranged on the inner edge of the upper end of the chuck leveling mounting plate; and the adsorption hole is formed in the middle of the Chuck plate in a penetrating manner. The problems that an existing chuck is only designed for wafer testing, does not carry out vacuum adsorption on a slide glass in a smaller shape, and cannot be independently controlled, so that a traditional probe station cannot test an independent bare chip or slide glass or the testing efficiency is low; and a traditional chuck is manufactured by a single red copper gold-plated disc or a stainless steel disc and the like, so that a test result is greatly interfered in a complex electromagnetic interference environment, and even serious consequences such as electrostatic breakdown and the like are possibly caused.

Description

Technical Field

[0001] The utility model relates to the technical field of chuck preparation, in particular to a novel chuck preparation device. Background Art

[0002] The probe station is one of the important testing equipment in the semiconductor industry. It is widely used in precision electrical measurements of complex and high-speed devices to ensure quality and reliability and reduce R&D time and device manufacturing process costs. The chuck is an important component of the probe station, and its quality and flatness directly affect the test effect and accuracy.

[0003] However, it still has the following disadvantages in actual use:

[0004] The existing chuck is designed only for wafer testing. The entire wafer is placed on the chuck, and negative pressure is provided by the different-sized, annular vacuum channels on the chuck to adsorb the wafer to be tested. However, after the wafer passes through the corresponding process flow, each unit of the wafer will be diced to form many smaller bare chips of different specifications and sizes. In addition, for products such as carriers (stacked, silicon-based, BGA packaged, single-chip), when these carriers are placed on the traditional chuck at the same time, the traditional vacuum chuck cannot vacuum adsorb the smaller carriers, nor can they be independently controlled, resulting in the traditional probe station being unable to test a single bare chip or carrier or having low test efficiency. In addition, the traditional chuck is made of a single copper gold-plated plate or stainless steel plate, which will have a greater interference on the test results in a complex electromagnetic interference environment, and may even cause serious consequences such as electrostatic breakdown. Utility Model Content

[0005] The purpose of the utility model is to provide a novel chuck preparation device to solve the problem raised in the above background technology that the existing chuck is only designed for wafer testing, the whole wafer is placed on the chuck, and negative pressure is provided by annular vacuum channels of different sizes on the chuck to adsorb the wafer to be tested thereon, but after the wafer passes through the corresponding process flow, each unit of the wafer will be diced to form many smaller bare chips of different specifications and sizes, and for products such as carriers (stacked, silicon-based, BGA packaged, single chip), when these carriers are placed on the traditional chuck at the same time, the traditional vacuum chuck cannot vacuum adsorb the smaller carriers, nor can they be independently controlled, resulting in the traditional probe station being unable to test a single bare chip or carrier or having low test efficiency; and the traditional chuck is made in a single copper gold-plated disk or stainless steel disk, which will have a greater interference on the test results in a complex electromagnetic interference environment, and may even cause serious consequences such as electrostatic breakdown.

[0006] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0007] The utility model is a novel chuck preparation device, comprising:

[0008] Beryllium molten metal shield;

[0009] A ceramic insulating plate, the ceramic insulating plate being fixedly connected to the lower end of the inner side wall of the beryllium molten metal shield;

[0010] A chuck leveling mounting plate, wherein the chuck leveling mounting plate is arranged on the upper outer edge of the ceramic insulating plate;

[0011] A chuck plate, the chuck plate being arranged on the inner edge of the upper end of the chuck leveling mounting plate;

[0012] The adsorption hole is opened through the middle of the Chuck plate.

[0013] Furthermore, a cavity is provided in the middle of the upper end of the beryllium molded shield, and the cavity is circular;

[0014] The chuck plate is located in the middle of the cavity.

[0015] Furthermore, an electromagnetic shielding silicone strip is embedded between the connection gap between the Chuck plate and the cavity, and an upward annular protrusion is provided on the inner side of the electromagnetic shielding silicone strip.

[0016] Furthermore, a shielding isolation plate is provided between the chuck leveling mounting plate and the ceramic insulating plate, and an outer edge of the shielding isolation plate is fixedly connected to an inner side wall of the beryllium molded shield.

[0017] Furthermore, the number of the adsorption holes is thirteen, and the lower parts of the adsorption holes are connected to negative pressure air.

[0018] Furthermore, the upper end of the chuck leveling mounting plate is in contact with the lower end of the Chuck plate, the lower end of the chuck leveling mounting plate is in contact with the upper end of the shielding isolation plate, and the chuck leveling mounting plate is arranged as a slope from the outside to the inside.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] The utility model adopts an electromagnetic shielding structure design, has good electromagnetic shielding and anti-static properties, and adjusts the relative position between the ceramic insulating plate and the chuck leveling mounting plate to adjust the horizontal position of the chuck, so as to reduce errors in subsequent height detection and testing and improve accuracy. At the same time, it can independently control the thirteen-way vacuum adsorption chuck, greatly improving the test efficiency, test stability and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a cross-sectional schematic diagram of the utility model;

[0023] Figure 2 It is a top view schematic diagram of the utility model.

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0025] 1. Chuck plate; 2. Beryllium molten metal shielding cover; 3. Electromagnetic shielding silicone strip; 4. Chuck leveling mounting plate; 5. Shielding isolation plate; 6. Ceramic insulation plate; 7. Adsorption hole. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0028] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0029] Example

[0030] See also Figure 1-2 As shown, this embodiment is a novel chuck preparation device, comprising:

[0031] Beryllium molten metal shield 2;

[0032] The beryllium molded shield 2 serves as the main bearing structure, providing support for installation while forming a shielding enclosure for protection;

[0033] A cavity is provided in the middle of the upper end of the beryllium molded shield 2, and the cavity is circular;

[0034] The cavity is used to structurally receive the Chuck plate 1 and is circularly arranged to match the installation of the Chuck plate 1;

[0035] Chuck plate 1 is located in the middle of the cavity;

[0036] A ceramic insulating plate 6, the ceramic insulating plate 6 is fixedly connected to the lower end of the inner wall of the beryllium molded shield 2;

[0037] The ceramic insulating plate 6 can insulate the entire chuck and the device to avoid electrostatic interference, and structurally support and install the shielding isolation plate 5 at the upper part;

[0038] A chuck leveling mounting plate 4, wherein the chuck leveling mounting plate 4 is arranged on the outer edge of the upper end of the ceramic insulating plate 6;

[0039] By adjusting the relative position between the chuck leveling mounting plate 4 and the ceramic insulating plate 6, the Chuck plate 1 can be adjusted horizontally to reduce errors in subsequent height detection and testing, thereby improving the accuracy of the test;

[0040] A shielding isolation plate 5 is provided between the chuck leveling mounting plate 4 and the ceramic insulating plate 6, and the outer edge of the shielding isolation plate 5 is fixedly connected to the inner side wall of the beryllium molded shield 2;

[0041] The shielding isolation plate 5 is used to structurally support and install the chuck leveling installation plate 4. The electromagnetic shielding environment formed by the beryllium shielding cover 2 and the shielding isolation plate 5 can effectively filter the electromagnetic interference under the equipment.

[0042] The upper end of the chuck leveling mounting plate 4 is in contact with the lower end of the chuck plate 1, and the lower end of the chuck leveling mounting plate 4 is in contact with the upper end of the shielding isolation plate 5, and the chuck leveling mounting plate 4 is set as a slope from the outside to the inside;

[0043] The upper and lower ends of the chuck leveling mounting plate 4 are in contact with the upper end of the shielding isolation plate 5 and the lower end of the chuck plate 1, so as to support the structure of the chuck plate 1 and provide a broken slope surface from the outside to the inside. By adjusting the relative position with the ceramic insulating plate 6, the height difference of the slope surface can be used to adjust the level of the chuck plate 1;

[0044] A chuck plate 1 is arranged on the inner edge of the upper end of a chuck leveling mounting plate 4;

[0045] The chuck plate 1 is used to open the following multiple adsorption holes 7 and receive the chuck to be tested;

[0046] An electromagnetic shielding silicone strip 3 is embedded between the connection gap between the Chuck plate 1 and the cavity, and an upward annular protrusion is provided on the inner side of the electromagnetic shielding silicone strip 3;

[0047] The electromagnetic shielding silicone strip 3 can prevent electromagnetic shielding and also prevent the product to be tested from falling into the equipment;

[0048] Adsorption hole 7, adsorption hole 7 is opened through the middle of Chuck plate 1;

[0049] The number of the adsorption holes 7 is thirteen, and the lower part of the adsorption holes 7 is connected to negative pressure air;

[0050] The adsorption holes 7 can be independently controlled, and the chuck to be tested can be adsorbed and positioned by connecting negative pressure air at the bottom;

[0051] Working principle:

[0052] In advance, the ceramic insulating plate 6 is fixedly installed on the inner lower part of the beryllium molten shield 2, and the shielding isolation plate 5 is installed above the ceramic insulating plate 6, and the chuck leveling mounting plate 4 is installed above the shielding isolation plate 5, and the chuck plate 1 is installed above the chuck leveling mounting plate 4, and the chuck plate 1 is located in the middle of the upper end cavity of the beryllium molten shield 2, and the electromagnetic shielding silicone strip 3 is embedded in the connecting gap between the two;

[0053] At this time, thirteen independent single pieces or wafer carrier products can be placed on the upper end of the Chuck plate 1 and arranged relative to the thirteen adsorption holes 7, and negative pressure air is introduced into the lower part of the adsorption holes 7 to adsorb and position the thirteen independent single pieces or wafer carrier products;

[0054] This step adopts an electromagnetic shielding structure design, which has good electromagnetic shielding and anti-static properties, and adjusts the relative position between the ceramic insulating plate 6 and the chuck leveling mounting plate 4 to adjust the horizontal position of the Chuck plate 1, so as to reduce errors in subsequent height detection and testing and improve accuracy. At the same time, it can independently control the thirteen-way vacuum adsorption chuck, greatly improving the test efficiency, test stability and safety.

[0055] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A novel chuck preparation device, characterized in that: include: Beryllium molten metal shield (2); A ceramic insulating plate (6), the ceramic insulating plate (6) being fixedly connected to the lower end of the inner wall of the beryllium molten metal shield (2); A chuck leveling mounting plate (4), wherein the chuck leveling mounting plate (4) is arranged on the outer edge of the upper end of the ceramic insulating plate (6); A chuck plate (1), wherein the chuck plate (1) is arranged on the inner edge of the upper end of the chuck leveling mounting plate (4); The adsorption hole (7) is opened through the middle of the Chuck plate (1).

2. A novel chuck preparation device according to claim 1, characterized in that: A cavity is provided in the middle of the upper end of the beryllium molten metal shield (2), and the cavity is circular; The Chuck plate (1) is located in the middle of the cavity.

3. A novel chuck preparation device according to claim 2, characterized in that: An electromagnetic shielding silicone strip (3) is embedded between the connection gap between the Chuck plate (1) and the cavity, and an upward annular protrusion is provided on the inner side of the electromagnetic shielding silicone strip (3).

4. A novel chuck preparation device according to claim 1, characterized in that: A shielding isolation plate (5) is provided between the chuck leveling mounting plate (4) and the ceramic insulating plate (6), and the outer edge of the shielding isolation plate (5) is fixedly connected to the inner side wall of the beryllium molten metal shielding cover (2).

5. A novel chuck preparation device according to claim 1, characterized in that: The number of the adsorption holes (7) is thirteen, and the lower parts of the adsorption holes (7) are connected to negative pressure air.

6. A novel chuck preparation device according to claim 4, characterized in that: The upper end of the chuck leveling mounting plate (4) is arranged in contact with the lower end of the chuck plate (1), the lower end of the chuck leveling mounting plate (4) is arranged in contact with the upper end of the shielding isolation plate (5), and the chuck leveling mounting plate (4) is arranged in a slope from the outside to the inside.

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