Particle beam microscope

Abstract

A particle beam microscope includes: an electron beam source for generating an electron beam; a beam tube (245) having an electrically conductive inner side surface, a first end and a second end, where the electron beam enters the first end of the beam tube (245) and exits the second end of the beam tube (245); a magnetic objective (240) for focusing the electron beam in an object plane, the magnetic objective (240) having a magnetic coil (243) and a pole shoe (241) having two pole ends, each pole end extending around an axis of symmetry of the magnetic objective (240); a potential supply system (262) configured to feed a potential to the electrically conductive inner side surface of the beam tube (245); wherein the beam tube (245) comprises an electrically insulating body having an inner wall and an outer wall, where an electrically conductive layer (211) is provided on the inner wall of the electrically insulating body, the electrically conductive layer forming an electrically conductive inner side surface of the beam tube (245), and where the electrically conductive layer (211) is formed from electroless nickel plating.

Description

Technical Field

[0001] The present disclosure relates to a particle beam microscope, in particular to an electron microscope. Background Art

[0002] An electron microscope of a generic type is disclosed in European patent EP 1 903 596 B1 filed by the present applicant. The electron microscope has in particular a beam tube through which an electron beam generated by an electron beam source passes after passing through a series of apertures in order to finally impinge on an object to be inspected or processed. In this case, the electron beam is deflected and / or focused by various coils.

[0003] Another general type of electron microscope is disclosed in German patent application DE 10 2020 108 514 A1 filed by the present applicant.

[0004] In the case of beam tube components for charged particle beams, gold (Au) or titanium (Ti) are usually used for the coating. It has now been found that titanium materials in particular are sometimes difficult to apply, since the components required for beam guidance usually have to be coated on the inside, i.e. on the surface of a hollow cylinder or a hollow truncated cone, for example. The method usually used for this purpose is sputtering, although this sometimes leads to uneven layer thicknesses or even layer perforations. However, a high and uniformly adjustable conductivity is essential for forming a potential surface determined within narrow tolerances and for dissipating charges. On the other hand, the useful layer thickness is also limited upwards due to the generation of undesirable eddy currents. At the same time, the coating is also intended to adhere durably to plastic surfaces, since many components of electron microscopes, such as coil supports, consist of plastic surfaces. Utility Model Content

[0005] Therefore, there is a need for a particle beam microscope in which the entire surface of a beam tube component has good electrical conductivity and is less likely to generate eddy currents.

[0006] Electrode coatings for gas lasers consisting of nickel plating are known (eg US Pat. No. 4,833,686 A). However, such layers are usually slightly ferromagnetic and are therefore not suitable for use in the environment of charged particle beams.

[0007] The inventors have now discovered that such coatings and components coated in this way can be applied or produced by chemical nickel plating. Chemical nickel plating (also known as electroless nickel plating) is understood here to mean a nickel-phosphorus alloy with a phosphorus content of about 3% by weight to about 40% by weight, which is applied chemically (i.e. by redox reactions) to the surface to be coated. Such coating methods are known per se, for example from US Pat. No. 1,207,218, which additionally, but not exclusively, relates to Al surfaces.

[0008] For particle beam guide components, the magnetic properties of the chemically plated nickel coating are particularly important, namely in particular its adjustability via the phosphorus content. In many cases, shielding of externally generated magnetic fields is not desired, so that the coating is preferably diamagnetic; this can be established by a phosphorus content of more than about 10.9% by weight. It is not permitted to heat treat the layer thereafter, since it could thereby become magnetic.

[0009] On the other hand, if a certain predetermined shielding is desired, a low-phosphorus coating of less than 10% is suitable, which has magnetic properties (soft magnetism), and specifically, the lower its phosphorus content, the greater its magnetism.

[0010] On the other hand, nickel-phosphorus alloys with high phosphorus contents of more than 15% by weight are known for high-temperature applications (see, for example, EP 3 865 604 A1). Such high phosphorus contents significantly impair the electrical conductivity: for example, the resistivity of an amorphous Ni-P material with a P content of 20% is already about 250 μΩ·cm (see document DE 30 30 270 A1). From the last cited document and US 3 832 168 A, ternary alloys are also known which contain, in addition to nickel and phosphorus, for example Co or Cu, but for purposes different from those of the present disclosure, namely to improve the appearance, or to deliberately increase the resistivity. In the present case, both properties are insignificant or even harmful. However, small proportions of the two elements adjacent to nickel in the periodic table, relative to the P content, outside the range of unavoidable impurities are also permissible.

[0011] Furthermore, possible eddy currents in the coating are also undesirable for particle beam tube components. Therefore, the coating has a thickness of 3 μm to 100 μm, which can also counteract cracking. In terms of process engineering, the thickness of the coating is adjusted by the residence time of the component to be coated in the bath at a specific temperature. Since typical deposition rates are 10 μm to 20 μm per hour, it is advantageous from a practical point of view to use layer thicknesses of up to 50 μm.

[0012] The parts to be coated are usually designed to extend around the charged particle beam. If the parts to be coated are integral, it means that the parts to be coated have at least one hole for the charged particle beam to pass through during use. If a plurality of parts interact for this purpose, each of these parts can be free of holes. However, these parts are usually concave or have a concave surface portion facing the charged particle beam during use. Of particular importance are hollow cylinders and hollow truncated cones, whose inner surfaces face the charged particle beam.

[0013] For electron beam, the important beam guide components of particle beam device are deflection coils and focusing coils. In many cases, these coils are embedded in non-conductive plastic bodies. During use, the surface facing the particle beam provides adjustable potential because it is conductively coated and connected to a (DC) voltage source. According to the function of the coil, DC or AC current can be applied to the coil. According to the coating comprising NiP alloy of the present disclosure, due to its uniform layer thickness and good electrical conductivity, it is particularly suitable for this purpose, even if there is a relatively thin layer thickness that is not easy to form eddy current. In this case, the applied layer is particularly accurate in profile and is polishable in principle. In electron beam equipment, special attention is paid to backscattered electrons and reflected electrons, because these electrons can easily adhere to non-metallic and / or non-conductive surfaces and cause disturbing local charges there. For this reason, it is also generally advantageous that the inner surface (i.e. the inner surface facing the particle beam) is at least fully conductively coated, specifically overall coated and without holes, so that no residual local charges can be obtained.

[0014] In the present case, a beam tube of an electron microscope designed partly as a hollow cylinder and partly in the shape of a hollow truncated cone is coated on the inside with a chemically plated nickel alloy. It has been found that a beam tube coated in this way is durable and shows hardly any signs of wear or even failure even when used continuously for processing objects, i.e. in the presence of corrosive gas components in some cases.

[0015] Furthermore, bundled tube components coated in this way typically have an aspect ratio of length (in the bundle direction) to diameter (or, even in the case of rotationally asymmetrical components as an exception, for example to the largest dimension) of 0.3 to 30, typically greater than 0.9, in particular 1.5 to 5.0, in each case relative to the inner dimension.

[0016] The present disclosure provides a particle beam microscope, which includes: an electron beam source, which is used to generate an electron beam; a beam tube, which has a conductive inner surface, an upper end and a lower end, and is configured to allow the electron beam to enter the upper end of the beam tube and exit from the lower end of the beam tube; a magnetic objective lens, which is used to focus the electron beam in an object plane, wherein the magnetic objective lens has a magnetic coil and a pole shoe with two ends, each end extending around the particle optical axis of the magnetic objective lens; a voltage source, which is configured to feed an electric potential to the conductive inner surface of the beam tube; wherein the beam tube includes an electrically insulating body with an inner wall and an outer wall, and wherein a chemically plated nickel layer is provided on the inner wall of the electrically insulating body, and the chemically plated nickel layer forms the conductive inner surface of the beam tube.

[0017] In one embodiment, the conductive inner surface is a concave surface of the bundle tube or a concave portion of a surface of the bundle tube.

[0018] In one embodiment, the thickness of the chemically plated nickel layer is greater than 2.9 μm and less than 101 μm.

[0019] In one embodiment, the magnetic susceptibility χ of the chemically plated nickel layer is negative.

[0020] In one embodiment, the beam tube constitutes a hollow cylinder and / or a hollow truncated cone, and the electron beam passes through the interior of the hollow cylinder and / or the hollow truncated cone during use.

[0021] In one embodiment, the bundle tube is made of plastic.

[0022] In one embodiment, the bundle tube is made of PEEK.

[0023] In an embodiment, the particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to variably deflect the electron beam over time in at least one direction perpendicular to the general electron beam direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present disclosure is described below in conjunction with the accompanying drawings, in which:

[0025] Figure 1 shows a simplified schematic cross-section of an exemplary electron microscope,

[0026] Figure 2 Another exemplary electron microscope is shown, partly in perspective and partly in cross-section, and

[0027] Figure 3 A simplified schematic cross-section of a beam guiding tube of a focusing lens is shown, the tube being internally coated in accordance with the present disclosure.

[0028] The same reference numerals denote the same components; however, functionally equivalent components in different arrangements are denoted differently. DETAILED DESCRIPTION

[0029] Figure 1 The processing system 100 in EMBODIMENT 1 comprises an electron microscope 1 , a gas supply arrangement 8 for supplying reactive gas to a location to be processed (in the object plane) of an object O mounted on an object holder 81 , and also an electrode arrangement 9 .

[0030] The electron microscope 1 includes an electron beam source 3, a first focusing / deflecting element 48, a backscattered electron detector 6, an energy selector 7, a secondary electron detector 5, and a focusing lens 4 along the electron beam direction. The second focusing / deflecting element 47 is arranged in the focusing lens. The focusing lens 4 is a combination of a magnetic lens and an electrostatic immersion lens. The magnetic lens includes an inner pole shoe 42, an outer pole shoe 41, and a coil 43 arranged therebetween, wherein the lower end of the inner pole shoe 42 forms a substantially axial gap 44 with the lower end of the outer pole shoe 41, and when a magnetic flux is induced by the pole shoes 41, 42 due to the flow of current in the coil 43, a magnetic field is generated in the gap, and the magnetic field substantially appears in the region of the axial gap 44. The magnetic field focuses the electron beam, which is accelerated from the electron beam source 3 toward the object O. The electrostatic immersion lens includes a beam tube 45, which extends through the interior of the magnetic lens 4 formed by the inner pole shoe 42 and the outer pole shoe 41. The electrostatic immersion lens also includes a terminal electrode 46 arranged at a distance from the lower end of the beam tube 45. The primary electrons can be decelerated to a primary energy of about 1 keV suitable for inspection of, for example, photomasks by applying a suitable electric field between the beam tube 45 and the terminal electrode 46 by means of a voltage source (schematically indicated, without reference numerals). In the illustrated embodiment, the beam tube may be at, for example, +8 keV, while the terminal electrode 46 is grounded.

[0031] The electron microscope 1 is subdivided into four different vacuum spaces 21, 22, 23, 24, which are partially separated from each other by pressure stages 25, 26, 27. The first vacuum space 21 contains the electron beam source 3. The first vacuum space 21 is connected to an ion getter pump 37 via a first connection 29. For example, during operation of the electron microscope, there are approximately 10 -9 Up to 10 -10 The first pressure level 25 is formed by an opening 25 symmetrically surrounding the electron beam path. The second vacuum space 22 is connected to a second vacuum pump 38, i.e. an ion getter pump, via a second connection 30. The second pressure level partially separates the second vacuum space 22 from the third vacuum space 23. For example, during operation of the electron microscope, the pressure in the second vacuum space 22 can be about 10 -7 The backscattered electron detector 6 and the energy selector 7 are arranged in the third vacuum space 23. The third vacuum space 23 is partially separated from the second vacuum space 22 and the fourth vacuum space 24 by pressure levels 26 and 27, respectively, and has a connection 31 connecting the third vacuum space to a third vacuum pump 39. For example, during operation, the pressure in the third vacuum space can be about 10 -5mbar range. The fourth vacuum space 24 is partially separated from the third vacuum space 23 by a third pressure level 27. In the illustrated example, the third pressure level 27 includes a secondary electron detector 5. In this case, the opening of the third pressure level 27 is formed by the opening of the secondary electron detector 5 through which the electron beam passes. In this case, the secondary electron detector 5 is held inside the electron microscope 1 in such a way that the pressure balance between the partially separated vacuum spaces 23 and 24 can only occur through the opening in the secondary electron detector. The fourth vacuum space 24 also has a gas-conducting connection 28 leading to the interior of the vacuum chamber 2. Here, the gas-conducting connection 28 is provided by a simple metal tube. With the help of a metal tube (which has a relatively large diameter so as to present as little resistance as possible to the gas transport to the interior of the vacuum chamber 2), the reaction gas supplied by the gas supply device is guided out of the fourth vacuum space 24 and into the vacuum chamber 2. In the illustrated exemplary embodiment, the beam tube 45 has a cylindrical lower region in the beam direction, which widens conically in the direction of the secondary electron detector 5 and then extends upwards in the form of a cylinder with a larger diameter and through the second vacuum space 22. The beam tube 45 thus surrounds the secondary electron detector 5, the energy selector 7 and the backscattered electron detector 6. The beam tube 45 is held at a distance below the secondary electron detector 5 by a vacuum-tight mounting 49, for example made of ceramic, and is vacuum-tightly connected to the lower pole piece 41 in such a way that the fourth vacuum space 24 substantially comprises the interior of the beam tube and the gap between the mounting 49 and the third vacuum space 23 which follows in the direction of the electron beam source 3. During operation, in the interior of the fourth vacuum space 24 in the region of the third pressure level 27 (i.e. in the vicinity of the third pressure level) there is, for example, a pressure of about 10 -4 The pressure in the mbar range is about 10 mbar, and for example, the pressure in the vacuum chamber 2 is about 10 mbar. -5 The vacuum chamber 2 has a connection 32 that connects the interior of the vacuum chamber 2 to a fourth vacuum pump 40. Thus, the first vacuum space, the second vacuum space, the third vacuum space, and the combination of the fourth vacuum space and the vacuum chamber can be evacuated individually in each case, so that the electron microscope can operate well, including when supplying gas into the vacuum chamber.

[0032] Therefore, the detection area 51 of the secondary electron detector is arranged in the fourth vacuum space 24, while the backscattered electron detector 6 is arranged in the third vacuum space 23, in which a better vacuum is obtained. The energy selector 7 is arranged in front of the backscattered electron detector 6 in such a way that all electrons emitted by the object O or backscattered at the object must pass through the energy selector 7 in order to be able to reach the detection area of ​​the backscattered electron detector 6. In the illustrated embodiment, the energy selector 7 includes a first grid 71, a second grid 72 and a voltage source 73, which is used to generate a suitable electric field between the first grid and the second grid so as to be able to reflect the secondary electrons emitted from the surface of the object. The grids are arranged parallel to each other and surround the electron beam path of the primary electron beam generated by the electron beam source 3 in a ring shape. In the illustrated exemplary embodiment, the first grid 71 is connected to the voltage source 73, while the second grid 72 is coupled to the beam tube 45 and is therefore at the same potential as the beam tube. Insulating tubes can be introduced in the opening formed by the grids 71, 72 through which the electron beam passes, in order to protect the primary electron beam from the electric field applied between the two grids 71, 72. The electric field applied by means of the voltage source 73 is adapted to the primary electron energy and to the specific characteristics of the sample being inspected and processed in such a way that the backscattered electrons pass through the electric field and are detected at the backscattered electron detector, while the secondary electrons are reflected due to their lower kinetic energy and are therefore not detected. By adjusting the potential difference applied to the grids, the amplitude of the electric field and thus the amplitude of the detection signal can be improved.

[0033] The illustrated embodiment also includes an electrode arrangement 9, which includes a shielding electrode 91, which is arranged in a ring around the electron beam path and has a central opening 92 to allow the primary electron beam to pass undisturbed and the secondary electrons and backscattered electrons to pass substantially unhindered. By means of a suitable voltage source (schematically represented without reference numerals), a suitable voltage can be applied to the electrode 91 so as to effectively shield the primary electron beam from the electric field generated by the charging of the object O.

[0034] The bundle tube 45 is coated on the inside with an electroless nickel layer 11 having a thickness of more than 2.9 μm and less than 51 μm, in particular 3 μm to 50 μm, and a P content of more than 9 wt. % and less than 15 wt. %, in particular a P content of 10.0 wt. % to 14.0 wt. % (see also Figure 2 ). It is also conceivable to coat the electrode arrangement 9, for example with the shielding electrode 91, with a chemically plated nickel layer whose P content is relatively low, in particular a P content of between 3% by weight and 9% by weight, since this makes the possible magnetic shielding insignificant at this location. On the other hand, it is advantageous to choose a larger layer thickness there, i.e., for example in the range between 20 μm and 100 μm. This is possible since no significant interferences due to eddy currents occur at this location.

[0035] Since the bundle tube 45 is coated with an electroless nickel layer 11 on the inside in an overall conductive manner, the bundle tube does not need to be made of a material that is also conductive, such as a (non-magnetic) metal, but can be made of it. However, it is preferred that the tube is designed as a substantially rotationally symmetrical cutout in a plastic body, for example made of polyetheretherketone (PEEK). If necessary, the electroless nickel has excellent adhesion to such surfaces after activation by initial etching or primer in a manner known per se. In principle, activation can also be carried out regionally if the entire surface is not intended to be coated. The layer thickness is conveniently adjusted by the duration of the coating reaction, depending on the specific conditions, a layer thickness of about 10 μm per hour of reaction duration being typical. Finishing work is optional, but polishing can be carried out if the roughness achieved is too high for a specific application.

[0036] Although the above description relates to electron optical machining apparatus, simple electron or ion microscopes and two-column ion beam machining apparatus are also contemplated.

[0037] For example, Figure 2 A schematically simplified perspective illustration of a particle beam system 101 is shown, which comprises an electron beam microscope 103 having a particle optical axis 105 .

[0038] The electron beam microscope 103 is configured to generate a primary electron beam 119 emitted along a particle optical axis 105 of the electron beam microscope 103 and to direct the primary electron beam 119 onto an object arranged in an object plane 113 .

[0039] To generate the primary electron beam 119, the electron beam microscope 103 includes an electron source 121 (schematically illustrated by a cathode 123 and a suppression electrode 125) and an extraction electrode 126 spaced apart from the electron source. In addition, the electron beam microscope 103 includes an accelerating electrode 127, which transitions into a beam tube 129 and passes through a concentrator arrangement 131, which is schematically illustrated by a toroidal coil 133 and a yoke 135. After passing through the concentrator arrangement 131, the primary electron beam 119 passes through a pinhole aperture 137 and a central hole 139 in a secondary particle detector (e.g., a secondary electron detector) 141, and then the primary electron beam 119 enters an objective lens 143 of the electron beam microscope 103. The objective lens 143 includes a magnetic lens 145 and an electrostatic lens 147 for focusing the primary electron beam 119. The magnetic lens 145 includes a toroidal coil 149, an inner pole piece 151, and an outer pole piece 153. Electrostatic lens 147 is formed by lower end 155 of beam tube 129 , the inner lower end of outer pole piece 153 , and toroidal electrode 159 , which tapers conically toward object 113 .

[0040] The electron beam microscope 103 further comprises a deflector device (not shown) for deflecting the primary electron beam 119 in a direction orthogonal to the particle optical axis 105. Depending on the application, the deflector device can provide a magnetic field or an electric field; a magnetic field is advantageous for scanning methods, for which purpose a coil through which a current of alternating strength and / or direction flows is used. The frequency of the coil current suitable for this is, for example, in the range from 0.001 kHz to 100 kHz, in a special case 10 MHz; the signal waveform is, for example, sawtooth or step-shaped, but can also be configured, for example in the case of a "write" method, so that the write position jumps between irregularly distributed positions.

[0041] The particle beam system 101 also includes a controller 177, which controls the operation of the particle beam system 101. In particular, the controller 177 controls the operation of the electron beam microscope 103. The controller 177 receives a signal from the secondary particle detector 141, which represents the detected secondary particles generated by the interaction of the object 113 with the primary electron beam 119 and detected by the secondary particle detector 141. The controller 177 may also include an image processing device and may be connected to an image reproduction device (not shown). The beam tube 129 is provided with a chemical nickel coating 111 on the inside, specifically, in particular from its lower end 155 to the secondary particle detector 141 or even beyond the secondary particle detector. Preferably, the layer 111 is applied to the entire hollow cylindrical lower part and is arranged above it (relative to the primary beam), which part is in the shape of a hollow truncated cone. The thickness of the chemical nickel layer here is preferably the same as described above.

[0042] exist Figure 3In the case of the device shown in cross section and in some detail in FIG. 2 , the charged particle beam passes centrally through the hollow truncated cone portion of the beam tube 245, which passes through the deflection system 247 including two coil pairs 248, 249 and then through the cylindrical pole shoe insert 223. The coating 211 comprising a chemically plated nickel alloy can be provided only in the deflection system, only in the pole shoe insert or in both portions. In the present embodiment, the focusing system is formed by two inner and outer yokes, namely an inner yoke and an outer yoke, each of which is in the shape of a hollow truncated cone with an annular gap 233 between them at the object side end; i.e. where the particle beam exits. The coil 243 between them, through which a current constantly flows, generates an excitation magnetic field. The pole shoe insert passes axially through the inner yoke. On the inner side of the inner yoke, a deflection system 247 (shown only schematically) is formed by two coil pairs 248, 249 bent around the beam channel, arranged in such a way that they are embedded in the side surface of a hollow truncated cone of plastic (PEEK) (not shown for the sake of clarity). An electroless nickel coating 211 is advantageously implemented at least on the conical inner surface of this part of the beam tube. A drive system 262 and its controller 261 are likewise indicated only schematically. With the aid of the entire system 240, the particle beam is focused and can be directed, for example, line by line deflectably onto an object 204 held by an object carrier 205. An aperture 251 is arranged at the entrance of the particle beam, and a further aperture 238 is arranged at the exit, between which a potential controlled by the controller 261 can be applied by the drive system 262.

[0043] The coating of the particle beam guide tube components according to the present disclosure has multiple advantages, namely, magnetic permeability to the magnetic field (or essentially no shielding), small layer thickness to avoid eddy currents, no pores, uniform coatability with accurate contours and controlled thickness, high adhesion to plastic bodies (such as plastic bodies made of PEEK), and durability.

[0044] In some embodiments, the present invention relates to a particle beam guiding tube component that is coated with a static magnetic field. In some embodiments, the particle beam guiding tube component ...

Claims

1. A particle beam microscope, It is characterized in that The particle beam microscope comprises: An electron beam source for generating an electron beam; a beam tube having a conductive inner surface, an upper end and a lower end, and configured so that the electron beam enters the upper end of the beam tube and exits the lower end of the beam tube; a magnetic objective lens for focusing the electron beam in an object plane, wherein the magnetic objective lens has a magnetic coil and a pole piece having two ends, each end extending around a particle optical axis of the magnetic objective lens; a voltage source configured to feed an electric potential to the conductive inner surface of the beam tube; The bundle tube comprises an electrically insulating body having an inner wall and an outer wall, and A chemical nickel plating layer is arranged on the inner wall of the electrical insulating body, and the chemical nickel plating layer forms the conductive inner surface of the bundle tube.

2. The particle beam microscope according to claim 1, It is characterized in that The conductive inner surface is a concave surface of the beam tube or a concave portion of a surface of the beam tube.

3. The particle beam microscope according to claim 1, It is characterized in that The layer thickness of the chemically plated nickel layer is greater than 2.9 μm and less than 101 μm.

4. The particle beam microscope according to claim 2, It is characterized in that The layer thickness of the chemically plated nickel layer is greater than 2.9 μm and less than 101 μm.

5. The particle beam microscope as claimed in any one of the preceding claims, It is characterized in that The magnetic susceptibility χ of the chemically plated nickel layer is negative.

6. The particle beam microscope according to any one of claims 1 to 4, It is characterized in that The beam tube constitutes a hollow cylinder and / or a hollow truncated cone, and the electron beam passes through the interior of the hollow cylinder and / or the hollow truncated cone during use.

7. The particle beam microscope according to claim 5, It is characterized in that The beam tube constitutes a hollow cylinder and / or a hollow truncated cone, and the electron beam passes through the interior of the hollow cylinder and / or the hollow truncated cone during use.

8. The particle beam microscope according to any one of claims 1 to 4, It is characterized in that The bundle tube is made of plastic.

9. The particle beam microscope according to claim 5, It is characterized in that The bundle tube is made of plastic.

10. The particle beam microscope according to claim 6, It is characterized in that The bundle tube is made of plastic.

11. The particle beam microscope according to claim 7, It is characterized in that The bundle tube is made of plastic.

12. The particle beam microscope according to claim 8, It is characterized in that The bundle tube is made of PEEK.

13. The particle beam microscope according to claim 9, It is characterized in that The bundle tube is made of PEEK.

14. The particle beam microscope according to claim 10, It is characterized in that The bundle tube is made of PEEK.

15. The particle beam microscope according to claim 11, It is characterized in that The bundle tube is made of PEEK.

16. The particle beam microscope according to any one of claims 1 to 4, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

17. The particle beam microscope according to claim 5, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

18. The particle beam microscope according to claim 6, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

19. The particle beam microscope according to claim 7, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

20. The particle beam microscope according to claim 8, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

21. The particle beam microscope according to claim 9, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

22. The particle beam microscope according to claim 10, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

23. The particle beam microscope according to claim 11, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

24. The particle beam microscope according to claim 12, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

25. The particle beam microscope according to claim 13, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

26. The particle beam microscope according to claim 14, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

27. The particle beam microscope according to claim 15, It is characterized in that The particle beam microscope comprises at least one coil or coil arrangement extending around the beam tube and for subjecting the electron beam to an alternating magnetic field to deflect the electron beam variably over time in at least one direction perpendicular to a general electron beam direction.

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