CLIP feeding tray carrier for IGBT module and CLIP mounting device

Abstract

The utility model discloses a CLIP feeding tray carrier used for an IGBT module, the IGBT module comprises a wiring board, an IGBT chip welded on the wiring board, a diode chip, and a CLIP electrically connected with the IGBT chip, the diode chip and the wiring board, the CLIP comprises a first CLIP electrically connected with an E pole of the IGBT chip and the wiring board, and a second CLIP electrically connected with a G pole of the IGBT chip and the wiring board, the third CLIP is electrically connected with the two parts of the wiring board, the CLIP feeding tray carrier comprises a tray body, the tray body is divided into a plurality of areas according to the type of the CLIP, and a plurality of positioning grooves which correspond to the CLIP and position the CLIP are formed in each area in a matrix mode. The utility model further discloses a CLIP mounting device. The CLIP feeding tray carrier is used for being matched with an automatic feeding machine to complete mounting of the CLIP in the IGBT module. Compared with the prior art, the surface mounting precision can be effectively improved and the cost can be reduced in a small-batch production stage.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to the feeding and mounting of CLIP in an IGBT module. Background Art

[0002] The IGBT module includes an IGBT chip and an FRD chip. The packaging usually involves welding the IGBT chip and the FRD chip onto a circuit substrate, and using bonding wires or bridge components such as CLIP to connect the chip and the circuit. The IGBT module usually uses CLIP mounting connections, and different types of CLIP mounting connections are used for different parts. In the small-batch production stage, the existing CLIP mounting is generally done manually, which has the problems of low mounting accuracy and large errors. If the tape-type used in mass production, that is, the overall stamping mounting connection, is used, different CLIP tapes need to be designed due to the different sizes and positions of the CLIPs used for packaging of different current chip particles, which results in high mold design costs and long development cycles.

[0003] Therefore, in order to solve the above problems, the utility model provides a novel CLIP feeding tray carrier and CLIP mounting device for IGBT modules. Utility Model Content

[0004] The purpose of the utility model is to provide a CLIP feeding tray carrier for an IGBT module and a CLIP mounting device for an IGBT module, which can effectively improve mounting accuracy and reduce costs in a small batch production stage.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a CLIP feeding tray carrier for an IGBT module, wherein the IGBT module includes a wiring board, an IGBT chip and a diode chip welded on the wiring board, and a CLIP electrically connecting the IGBT chip, the diode chip and the wiring board, wherein the CLIP includes a first CLIP electrically connecting an E pole of the IGBT chip and a wiring board, a second CLIP electrically connecting a G pole of the IGBT chip and a wiring board, and a third CLIP electrically connecting two parts of the wiring board, and the CLIP feeding tray carrier includes a tray body, wherein the tray body is divided into a plurality of areas according to the type of the CLIP, and a plurality of positioning grooves corresponding to the structure of the CLIP are arranged in a matrix in each area; the areas include a first area, a second area and a third area. The present invention relates to a three-region positioning groove, wherein the positioning grooves include a first positioning groove, a second positioning groove and a third positioning groove; the first region has a plurality of first positioning grooves arranged in a matrix, the second region has a plurality of second positioning grooves arranged in a matrix, and the third region has a plurality of third positioning grooves arranged in a matrix; the first positioning groove cooperates with the first CLIP in a concave-convex manner, so that the positioning groove carries the first CLIP and can position the first CLIP in the front, back, left, and right directions; the second positioning groove cooperates with the second CLIP in a concave-convex manner, so that the positioning groove carries the second CLIP and positions the second CLIP in the front, back, left, and right directions; the third positioning groove cooperates with the third CLIP in a concave-convex manner, so that the positioning groove carries the third CLIP and positions the third CLIP in the front, back, left, and right directions.

[0006] Preferably, the first CLIP includes at least two welding parts and a connecting bridge connecting adjacent welding parts, the connecting bridge is higher than the welding parts, and the first positioning groove includes a mounting positioning area corresponding to the height position of the shape of the welding part and a high bearing platform corresponding to the height position of the connecting bridge, so that when the first CLIP is placed in the first positioning groove, the welding part is correspondingly installed and carried on the mounting positioning area, and the connecting bridge is carried on the high bearing platform.

[0007] Specifically, the first CLIP is also electrically connected to the positive electrode of the diode chip, and the first CLIP includes a first welding portion welded to the E pole of the IGBT chip, a second welding portion welded to the positive electrode of the diode chip, a third welding portion welded to the wiring board, a first connecting bridge connecting the first welding portion and the second welding portion, and a second connecting bridge connecting the second welding portion and the third welding portion; the bottom of the first positioning groove includes a first mounting positioning area corresponding to the height position of the shape of the first welding portion, a second mounting positioning area corresponding to the height position of the shape of the second welding portion, a third mounting positioning area corresponding to the height position of the shape of the third welding portion, a first high load-bearing platform corresponding to the height position of the first connecting bridge, and a second high load-bearing platform corresponding to the height position of the second connecting bridge.

[0008] Preferably, one or more types of first positioning grooves are formed in the first region, and each type of the first positioning grooves is used to position the first CLIP of a type of IGBT module; each type of the first positioning grooves has a first positioning groove corresponding to the structural type of the corresponding type of IGBT module.

[0009] Preferably, the second CLIP includes a fourth welding portion welded to the wiring board, a fifth welding portion welded to the G poles of two IGBT chips, and a T-shaped connecting bridge connecting the fourth welding portion and the two fifth welding portions, and the second positioning groove is T-shaped and forms positioning areas at the three ends for supporting and positioning the fourth welding portion and the two fifth welding portions.

[0010] Preferably, the third CLIP includes two sixth welding parts and a third connecting bridge connected between the two sixth welding parts, and the horizontal projection of the third CLIP is rectangular, and the third positioning groove is a rectangular groove; the third CLIP has one or more sizes, and one or more third positioning grooves corresponding to the sizes of the third CLIP are formed in the third area.

[0011] Preferably, the positioning grooves are arranged corresponding to the arrangement direction of the CLIPs in the IGBT module during mounting.

[0012] Preferably, the CLIP feeding tray carrier comprises a tray body and a tray carrier carrying the tray body, the tray body is an integrated structure of 3D printing, and the tray carrier has a groove for mounting the tray body. The 3D printing method further reduces costs and shortens the development cycle.

[0013] Specifically, the pallet carrier is further provided with a fixing piece fixed to the material feeding platform and a positioning convex piece aligned with the material feeding platform, and a concave-convex matching alignment component is further provided between the pallet carrier and the pallet body.

[0014] The utility model also discloses a CLIP mounting device for an IGBT module, comprising a CLIP feeding tray carrier, a feeding platform, a mounting platform and a conveying mechanism, wherein the CLIP feeding tray carrier is as described above; the feeding platform is used to carry the CLIP feeding tray carrier; the mounting platform is used to carry the IGBT module to be mounted; the conveying mechanism comprises a manipulator and a conveying part, wherein the conveying part moves the manipulator between the feeding platform and the mounting platform, and the manipulator is used to grab and release the CLIP.

[0015] Compared with the prior art, the utility model uses an IGBT module CLIP feeding tray carrier and cooperates with an automatic loading device for mounting. The CLIP feeding tray carrier is partitioned with different types of positioning grooves, and each partition has a number of positioning grooves for positioning the CLIP arranged in parallel, and the positioning grooves arranged in the partitions include positioning grooves that match all CLIP structures on the IGBT module. This can achieve faster replacement of chip particles with different currents that need to be replaced during small-batch production, thereby shortening the development cycle. At the same time, the mounting is carried out in conjunction with an automatic loading machine, making the mounting accuracy higher and the efficiency faster. Compared with the tape-type feeding mounting used in mass production, the mold cost is low and the development cycle is shorter. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of a CLIP placed on a CLIP feeding tray of the utility model.

[0017] Figure 2 It is a top view of the CLIP feeding tray of the utility model.

[0018] Figure 3 It is an exploded view of the CLIP feeding tray of the utility model.

[0019] Figure 4a yes Figure 1 Enlarged view of part a.

[0020] Figure 4b This is an installation exploded view of the first CLIP and the first positioning groove.

[0021] Figure 5a yes Figure 1 Enlarged view of part b.

[0022] Figure 5b This is an installation exploded view of the second CLIP and the second positioning groove.

[0023] Figure 6a yes Figure 1 Enlarged view of part c.

[0024] Figure 6b This is an installation exploded view of a model of the third CLIP and the third positioning groove.

[0025] Figure 7a yes Figure 1 Enlarged view of part d.

[0026] Figure 7b This is the installation exploded view of the first CLIP and the third positioning groove of another model.

[0027] Figure 8 This is the structural diagram of the IGBT module. DETAILED DESCRIPTION

[0028] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation modes and the accompanying drawings.

[0029] refer to Figures 1 to 3 The utility model discloses a CLIP feeding tray 100 for an IGBT module.

[0030] refer to Figure 8 The IGBT module includes a wiring board 41, an IGBT chip 42 soldered on the wiring board 41, a diode chip 43, and a CLIP electrically connecting the IGBT chip 42, the diode chip 43 and the wiring board 41, the CLIP includes a first CLIP31 electrically connecting the E pole of the IGBT chip 42 and the wiring board 41, a second CLIP32 electrically connecting the G pole of the IGBT chip 42 and the wiring board 41, and a third CLIP33 electrically connecting two parts in the wiring board 41.

[0031] refer to Figures 1 to 3 The CLIP feeding tray 100 includes a tray body 10, which is divided into a plurality of regions according to the type of CLIP, and each region is provided with a plurality of positioning grooves corresponding to the structure of the CLIP arranged in a matrix. The positioning grooves are arranged in accordance with the arrangement direction of the CLIP in the IGBT module during mounting, so that during mounting, the robot does not need to rotate, but can be mounted directly by translation.

[0032] Continue to refer Figures 1 to 3 The regions include a first region 11, a second region 12 and a third region 13, and the positioning grooves include a first positioning groove 21, a second positioning groove 22 and a third positioning groove 23. The first region 11 is provided with a plurality of first positioning grooves 21, the second region 12 is provided with a plurality of second positioning grooves 22, and the third region 13 is provided with a plurality of third positioning grooves 23.

[0033] refer to Figure 4a and Figure 4bThe first positioning groove 21 and the first CLIP 31 are matched in a concave-convex manner, so that the positioning groove carries the first CLIP 31 and can position the first CLIP 31 frontward, backward, leftward and rightward.

[0034] Preferably, the first CLIP31 includes at least two welding parts and a connecting bridge connecting adjacent welding parts, the connecting bridge is higher than the welding parts, and the first positioning groove 21 includes a mounting positioning area corresponding to the height position of the welding part shape and a high bearing platform corresponding to the height position of the connecting bridge, so that when the first CLIP31 is placed in the first positioning groove 21, the welding part is correspondingly installed and carried on the mounting positioning area, and the connecting bridge is carried on the high bearing platform.

[0035] refer to Figure 8 The first CLIP 31 is also electrically connected to the positive electrode of the diode chip 43. Figure 4a and Figure 4b The first CLIP31 includes a first welding portion 311 welded to the E pole of the IGBT chip 42, a second welding portion 312 welded to the positive pole of the diode chip 43, a third welding portion 313 welded to the wiring board 41, a first connecting bridge 314 connecting the first welding portion 311 and the second welding portion 312, and a second connecting bridge 315 connecting the second welding portion 312 and the third welding portion 313.

[0036] refer to Figure 4a and Figure 4b The bottom of the first positioning groove 21 includes a first mounting positioning area 211 corresponding to the shape height position of the first welding part 311, a second mounting positioning area 212 corresponding to the shape height position of the second welding part 312, a third mounting positioning area 213 corresponding to the shape height position of the third welding part 313, a first high load-bearing platform 214 corresponding to the height position of the first connecting bridge 314, and a second high load-bearing platform 215 corresponding to the height position of the second connecting bridge.

[0037] One or more types of first positioning grooves 21 are formed in the first area 11, and each type of the first positioning grooves 21 is used to position the first CLIP 31 of a type of IGBT module. Each type of the first positioning grooves 21 has a first positioning groove 21 corresponding to the structure type of the corresponding type of IGBT module. Figures 1 to 3 In this embodiment, two types of first positioning grooves 21 are formed in the first region 11, corresponding to the first CLIPs 31 of two types of IGBT modules. The first CLIPs 31 of one type of IGBT module have two structures with different shapes or sizes, for example Figure 8The two types of first CLIPs 31 are mirror-symmetrical structures, and each type of first positioning grooves 21 has two structures with two shapes or sizes.

[0038] refer to Figure 5a and Figure 5b The second positioning groove 22 is matched with the second CLIP 32 in a concave-convex manner, so that the positioning groove carries the second CLIP 32 and positions the second CLIP 32 in the front, back, left and right directions.

[0039] refer to Figure 5a and Figure 5b The second CLIP32 includes a fourth welding portion 321 welded on the wiring board 41, a fifth welding portion 322 welded to the G poles of the two IGBT chips 42, and a T-shaped connecting bridge 323 connecting the fourth welding portion 321 and the two fifth welding portions 322. The second positioning groove 22 is T-shaped and has positioning areas 221 and 222 at the three ends for supporting and positioning the fourth welding portion 321 and the two fifth welding portions 322.

[0040] refer to Figures 6a to 7b The third positioning groove 23 is matched with the third CLIP 33 in a concave-convex manner, so that the positioning groove carries the third CLIP 33 and positions the third CLIP 33 in the front, back, left and right directions.

[0041] Continue to refer Figures 6a to 7b The third CLIP 33 includes two sixth welding portions 331 and a third connecting bridge 332 connected between the two sixth welding portions 331 , and the horizontal projection of the third CLIP 33 is rectangular, and the third positioning groove 23 is a rectangular groove.

[0042] Specifically, the third CLIP 33 has a variety of sizes, and a variety of third positioning grooves 23 corresponding to the sizes of the third CLIP 33 are formed in the third region 13. In this embodiment, the third CLIP 33 has two sizes, and the third positioning grooves 23 have two sizes, namely Figure 6a and Figure 6b The third CLIP33 and the third positioning groove 23, and Figure 7a and Figure 7b The third CLIP33 and the third positioning groove 23 in the.

[0043] refer to Figure 3 The CLIP feeding tray carrier 100 includes a tray body 10 and a tray carrier 20 carrying the tray body 10 . The tray body 10 is an integrated structure of 3D printing. The tray carrier 20 has a groove 201 for mounting the tray body 10 . The tray body 10 is accommodated in the groove 201 and is limited by the groove 201 .

[0044] Preferably, the tray carrier also has a fixing piece fixed to the material supply platform and a positioning protrusion 203 aligned with the material supply platform, so that the CLIP material supply tray carrier 100 can be more accurately aligned when it is installed on the material supply tray 100. The fixing piece is a plurality of fixing holes 204 opened at the bottom of the groove 201, and the tray carrier 20 can be fixed on the material supply platform through the fixing holes 204.

[0045] Preferably, there is an alignment component between the tray carrier 20 and the tray body 10. The alignment component includes a protrusion 202 convexly arranged on the groove 201 and an alignment groove 101 concavely arranged at a corresponding position of the tray body 10. During alignment, the protrusion 202 can extend into the alignment groove 101 and match the alignment groove 101 concavely and convexly.

[0046] The utility model also discloses a CLIP mounting device for IGBT modules, comprising a CLIP feeding tray 100, a feeding platform, a mounting platform and a conveying mechanism, wherein the CLIP feeding tray 100 is as described above; the feeding platform is used to carry the CLIP feeding tray 100; the mounting platform is used to carry the IGBT module to be mounted; the conveying mechanism has a manipulator and a conveying part, wherein the conveying part moves the manipulator between the feeding platform and the mounting platform, and the manipulator is used to grab and release the CLIP. The conveying mechanism can be an automatic loader.

[0047] During operation, the CLIP feeding tray carrier 100 needs to cooperate with the automatic loading device for mounting, wherein the tray carrier 20 is aligned and fixed on the feeding platform, and the manipulator positions the tray body 10 carrying the CLIP in the groove 201 of the tray carrier 20. The conveying unit moves the manipulator to the feeding platform, and uses the XY axis of the feeding platform to respectively locate the position of each CLIP on the tray body 10, and then controls the manipulator to pick up the CLIP at different positions and move to the mounting platform to release it, so that the CLIP is placed on the mounting platform at the corresponding position of the IGBT module to be mounted, thereby realizing the mounting of the IGBT module CLIP.

[0048] Among them, the front, back, left and right directions in the present invention refer to relative directions, rather than absolute up, down, left and right directions.

[0049] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A CLIP feeding tray carrier for an IGBT module, the IGBT module comprising a wiring board, an IGBT chip and a diode chip soldered on the wiring board, and a CLIP electrically connecting the IGBT chip, the diode chip and the wiring board, the CLIP comprising a first CLIP electrically connecting the E pole of the IGBT chip and the wiring board, a second CLIP electrically connecting the G pole of the IGBT chip and the wiring board, and a third CLIP electrically connecting two parts of the wiring board, characterized in that: The CLIP feeding tray carrier comprises a tray body, wherein the tray body is divided into a plurality of regions according to the type of the CLIP, and each region is provided with a plurality of positioning grooves corresponding to the structure of the CLIP arranged in a matrix; The regions include a first region, a second region and a third region, and the positioning grooves include a first positioning groove, a second positioning groove and a third positioning groove; A plurality of first positioning grooves are arranged in a matrix on the first area, a plurality of second positioning grooves are arranged in a matrix on the second area, and a plurality of third positioning grooves are arranged in a matrix on the third area; the first positioning grooves are matched with the first CLIP in a concave-convex manner, so that the positioning grooves carry the first CLIP and can position the first CLIP in the front, back, left, and right directions; The second positioning groove cooperates with the second CLIP in a concave-convex manner, so that the positioning groove carries the second CLIP and positions the second CLIP in the front-back and left-right directions; The third positioning groove cooperates with the third CLIP in a concave-convex manner, so that the positioning groove carries the third CLIP and positions the third CLIP in the front-back, left-right directions.

2. The CLIP feeding tray carrier according to claim 1, characterized in that: The first CLIP includes at least two welding parts and a connecting bridge connected between adjacent welding parts, the connecting bridge is higher than the welding parts, and the first positioning groove includes a mounting positioning area corresponding to the height position of the welding part shape and a high bearing platform corresponding to the height position of the connecting bridge, so that when the first CLIP is placed in the first positioning groove, the welding part is correspondingly installed and carried on the mounting positioning area, and the connecting bridge is carried on the high bearing platform.

3. The CLIP feeding tray carrier according to claim 2, characterized in that: The first CLIP is also electrically connected to the positive electrode of the diode chip. The first CLIP includes a first welding portion welded to the E pole of the IGBT chip, a second welding portion welded to the positive electrode of the diode chip, a third welding portion welded to the wiring board, a first connecting bridge connecting the first welding portion and the second welding portion, and a second connecting bridge connecting the second welding portion and the third welding portion; the bottom of the first positioning groove includes a first mounting positioning area corresponding to the height position of the shape of the first welding portion, a second mounting positioning area corresponding to the height position of the shape of the second welding portion, a third mounting positioning area corresponding to the height position of the shape of the third welding portion, a first high load-bearing platform corresponding to the height position of the first connecting bridge, and a second high load-bearing platform corresponding to the height position of the second connecting bridge.

4. The CLIP feeding tray carrier according to claim 1, characterized in that: One or more types of first positioning grooves are formed in the first region, and each type of the first positioning grooves is used to position a first CLIP of an IGBT module of a certain model; each type of the first positioning grooves has a first positioning groove corresponding to the structural type of the IGBT module of the corresponding model.

5. The CLIP feeding tray carrier according to claim 1, characterized in that: The second CLIP includes a fourth welding portion welded on the wiring board, a fifth welding portion welded to the G poles of two IGBT chips, and a T-shaped connecting bridge connecting the fourth welding portion and the two fifth welding portions. The second positioning groove is T-shaped and forms positioning areas at the three ends to support and position the fourth welding portion and the two fifth welding portions.

6. The CLIP feeding tray carrier according to claim 1, characterized in that: The third CLIP includes two sixth welding parts and a third connecting bridge connected between the two sixth welding parts, and the horizontal projection of the third CLIP is rectangular, and the third positioning groove is a rectangular groove; the third CLIP has one or more sizes, and one or more third positioning grooves corresponding to the size of the third CLIP are formed in the third area.

7. The CLIP feeding tray carrier according to claim 1, characterized in that: The positioning grooves are arranged in accordance with the arrangement direction of the CLIPs in the IGBT module during mounting.

8. The CLIP feeding tray carrier according to claim 1, characterized in that: The CLIP feeding tray carrier includes a tray body and a tray carrier that carries the tray body. The tray body is an integrated structure of 3D printing, and the tray carrier has a groove for mounting the tray body.

9. The CLIP feeding tray carrier according to claim 8, characterized in that: The pallet carrier is also provided with a fixing piece fixed to the material feeding platform and a positioning convex piece aligned with the material feeding platform, and a concave-convex matching alignment component is also provided between the pallet carrier and the pallet body.

10. A CLIP mounting device for an IGBT module, characterized in that: include: A CLIP feed tray carrier, which is a CLIP feed tray carrier as claimed in any one of claims 1 to 9; A feeding platform, used for carrying the CLIP feeding tray carrier; Mounting platform, used to carry the IGBT modules to be mounted; The conveying mechanism comprises a manipulator and a conveying part, wherein the conveying part moves the manipulator between the feeding platform and the mounting platform, and the manipulator is used to grab and release the CLIP.

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