Heat difference power generation device and semiconductor tail gas treatment system

Abstract

The utility model relates to a heat difference power generation device and a semiconductor tail gas treatment system. The heat difference power generation device comprises a heat difference power generation unit, a first heat transfer unit, a first heat absorption unit, a second heat transfer unit and a second heat absorption unit, the heat difference power generation unit is connected with the power storage device; the inner end of the first heat transfer unit makes contact with the hot end of the heat difference power generation unit. The outer end and the inner end of the first heat absorption unit make contact with a heat source and the outer end of the first heat transfer unit correspondingly. The inner end of the second heat transfer unit is in contact with the cold end of the heat difference power generation unit; the outer end and the inner end of the second heat absorption unit make contact with the cold source and the outer end of the second heat transfer unit correspondingly. The semiconductor tail gas combustion treatment device has the advantages that the washing device, the liquid storage device and the cooling device are arranged to form water circulation to cool tail gas after combustion, the heat difference power generation device is arranged between the liquid storage device and the cooling device to generate power, and the problem that a large amount of heat energy generated in the semiconductor tail gas combustion treatment process cannot be fully utilized is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor tail gas treatment, in particular to a heat difference power generation device and a semiconductor tail gas treatment system. Background Art

[0002] The principle of semiconductor tail gas combustion treatment is mainly to use the combustion reaction to oxidize and decompose harmful substances in the tail gas into harmless substances. During the combustion process, it is necessary to control parameters such as combustion temperature and time to ensure the effect of tail gas treatment. Semiconductor tail gas combustion treatment usually adopts high-temperature combustion method, that is, the tail gas is introduced into the combustion chamber and reacts with oxygen at high temperature. In this process, harmful substances in the tail gas (such as organic matter, sulfide, nitride, etc.) are oxidized into harmless substances (such as carbon dioxide, water, sulfur dioxide, etc.), while releasing a large amount of heat energy.

[0003] In order to ensure the completeness and stability of the combustion reaction, it is usually necessary to control the combustion temperature within a certain range, and sufficient oxygen and time need to be provided to ensure that the harmful substances are completely oxidized.

[0004] A large amount of heat energy will be generated during the combustion process of semiconductor exhaust gas, so corresponding measures need to be taken to recover and utilize the heat to reduce energy consumption and costs.

[0005] At present, no effective solution has been proposed to address the problems in related technologies such as excessively high temperatures in the semiconductor exhaust combustion process, which may lead to danger and incomplete combustion, and a large amount of heat energy generated in the semiconductor exhaust combustion process that cannot be fully utilized. Utility Model Content

[0006] The purpose of the utility model is to provide a heat difference power generation device and a semiconductor exhaust treatment system in order to address the deficiencies in the prior art, so as to solve the problems existing in the related technology that excessively high temperature in the semiconductor exhaust combustion process may lead to danger and incomplete combustion, and a large amount of heat energy generated in the semiconductor exhaust combustion process cannot be fully utilized.

[0007] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0008] In a first aspect, a heat difference power generation device is provided, comprising:

[0009] A thermal difference power generation unit, the thermal difference power generation unit is connected to the power storage device and is used for performing temperature difference power generation according to the Seebeck effect;

[0010] a first heat transfer unit, wherein an inner end of the first heat transfer unit contacts a hot end of the heat difference power generation unit;

[0011] a first heat absorbing unit, wherein the outer end of the first heat absorbing unit contacts the heat source, and the inner end of the first heat absorbing unit contacts the outer end of the first heat transfer unit, and is used to transfer the heat source temperature to the heat difference power generation unit through the first heat transfer unit;

[0012] a second heat transfer unit, wherein an inner end of the second heat transfer unit contacts a cold end of the heat difference power generation unit;

[0013] The second heat absorbing unit, the outer end of the second heat absorbing unit is in contact with the cold source, and the inner end of the second heat absorbing unit is in contact with the outer end of the second heat transfer unit, and is used to transfer the cold source temperature to the heat difference power generation unit through the second heat transfer unit.

[0014] In some embodiments, there are a plurality of heat difference power generation units, which are arranged around and respectively contact the first heat transfer unit and the second heat transfer unit; and / or

[0015] There are a plurality of the first heat transfer units, and the plurality of the first heat transfer units are arranged around the heat difference power generation unit and are respectively in contact with the heat difference power generation unit and the first heat absorption unit; and / or

[0016] There are a plurality of the second heat transfer units, and the plurality of the second heat transfer units are arranged around the heat difference power generation unit and are in contact with the heat difference power generation unit and the second heat absorption unit respectively.

[0017] In some of the embodiments, it also includes:

[0018] A first heat fixing unit, wherein an outer end of the first heat fixing unit contacts a heat source, and an inner end of the first heat fixing unit contacts an outer end of the first heat absorbing unit.

[0019] In some of the embodiments, it also includes:

[0020] The second heat fixing unit, the outer end of the second heat fixing unit is in contact with the cold source, and the inner end of the second heat fixing unit is in contact with the outer end of the second heat absorbing unit.

[0021] In a second aspect, a semiconductor tail gas treatment system is provided, comprising:

[0022] A combustion device, wherein the combustion device is used to burn tail gas;

[0023] A water washing device, the water washing device is connected to the combustion device and is used to wash the exhaust gas after combustion;

[0024] A liquid storage device, the liquid storage device is connected to the combustion device and the water washing device respectively;

[0025] A cooling device, the cooling device is connected to the water washing device and the liquid storage device respectively, and is used to cool the liquid output by the liquid storage device;

[0026] The heat difference power generation device as described in the first aspect, wherein the heat difference power generation device is arranged between the liquid storage device and the cooling device;

[0027] An electricity storage device is connected to the heat difference power generation device and is used to store the electricity generated by the heat difference power generation device.

[0028] In some of the embodiments, it also includes:

[0029] A liquid transmission device is connected to the liquid storage device and the cooling device respectively, and is used to transport the liquid in the liquid storage device to the cooling device.

[0030] In some of the embodiments, the heat difference power generation device is also arranged in the combustion device.

[0031] In some of the embodiments, the heat difference power generation device is also arranged in the water washing device.

[0032] In some of the embodiments, the heat difference power generation device is also arranged between the combustion device and the water washing device.

[0033] In some of the embodiments, the heat difference power generation device is also arranged between the combustion device and the liquid storage device.

[0034] In some of the embodiments, it also includes:

[0035] A first circulation device, which is connected to the cooling device, the water washing device, and the liquid storage device, respectively, and is used to circulate the cooling water transported from the liquid storage device and the cooling device to the water washing device; and / or

[0036] The second circulation device is connected to the cooling device and the heat difference power generation device respectively, and is used for circulating the cooling liquid transported from the cooling device to the heat difference power generation device.

[0037] In some of the embodiments, it also includes:

[0038] A refrigeration device is arranged on the combustion device and connected to the power storage device, and is used for cooling the combustion device to reduce the temperature of the combustion device during combustion.

[0039] In some embodiments, the refrigeration device comprises:

[0040] A refrigeration unit, which is arranged at the combustion device and connected to the power storage device, and is used to cool the combustion device according to the Peltier effect to reduce the temperature of the combustion device during combustion;

[0041] a third heat absorbing unit, wherein the inner end of the third heat absorbing unit is in contact with the combustion device;

[0042] A third heat transfer unit, wherein the inner end of the third heat transfer unit contacts the outer end of the third heat absorption unit, and the outer end of the third heat transfer unit contacts the refrigeration unit, and is used to transfer the heat source temperature to the refrigeration unit.

[0043] In some of the embodiments, the refrigeration device is also arranged in the water washing device.

[0044] In some of the embodiments, the refrigeration device is also arranged between the combustion device and the water washing device.

[0045] In some of the embodiments, the refrigeration device is also disposed between the combustion device and the liquid storage device.

[0046] In some of the embodiments, the refrigeration device is also arranged between the water washing device and the liquid storage device.

[0047] The utility model adopts the above technical solution, and compared with the prior art, has the following technical effects:

[0048] The utility model discloses a heat difference power generation device and a semiconductor exhaust gas treatment system, which form a water circulation by arranging a water washing device, a liquid storage device and a cooling device to cool the exhaust gas after combustion, and arranges a heat difference power generation device between the liquid storage device and the cooling device to generate electricity using the heat from the exhaust gas treatment, thereby solving the problem that a large amount of heat energy generated in the process of semiconductor exhaust gas combustion treatment is not fully utilized; by arranging a refrigeration device outside the combustion device and controlling the temperature of the combustion device and the pipeline, the exhaust gas can be burned more completely, thereby making the exhaust gas treatment cleaner, while ensuring the safety of the equipment, thereby solving the problem that excessive temperature in the process of semiconductor exhaust gas combustion treatment may cause danger and incomplete combustion. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 is a schematic diagram of a heat difference power generation device according to an embodiment of the utility model;

[0050] Figure 2 is a schematic diagram of a heat difference power generation system according to an embodiment of the utility model (I);

[0051] Figure 3 is a schematic diagram of a heat difference power generation system according to an embodiment of the utility model (II);

[0052] Figure 4 is a schematic diagram of a heat difference power generation system according to an embodiment of the utility model (III);

[0053] Figure 5 It is a flow chart according to an embodiment of the present utility model.

[0054] The accompanying drawings are numerals 100, combustion device;

[0055] 200. Water washing device;

[0056] 300. Liquid storage device;

[0057] 400. Cooling device;

[0058] 500, heat difference power generation device; 501, heat difference power generation unit; 502, first heat transfer unit; 503, first heat absorption unit; 504, second heat transfer unit; 505, second heat absorption unit; 506, first solid heat unit; 507, second solid heat unit;

[0059] 600. Electricity storage device;

[0060] 700. Liquid transfer device;

[0061] 800, first circulation device;

[0062] 900, second circulation device;

[0063] 1000, refrigeration device; 1001, refrigeration unit; 1002, third heat transfer unit; 1003, third heat absorption unit. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0065] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0066] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0067] Example 1

[0068] This embodiment relates to the heat difference power generation device of the utility model.

[0069] An illustrative embodiment of the present utility model is as follows: Figure 1 As shown, a heat difference power generation device 500 includes a heat difference power generation unit 501, a first heat transfer unit 502, a first heat absorption unit 503, a second heat transfer unit 504 and a second heat absorption unit 505. The heat difference power generation unit 501 is connected to the power storage device 600 and is used to perform temperature difference power generation according to the Seebeck effect; the inner end of the first heat transfer unit 502 is in contact with the hot end of the heat difference power generation unit 501; the outer end of the first heat absorption unit 503 is in contact with the heat source, and the inner end of the first heat absorption unit 503 is in contact with the outer end of the first heat transfer unit 502, and is used to transfer the heat source temperature to the heat difference power generation unit 501 through the first heat transfer unit 502; the inner end of the second heat transfer unit 504 is in contact with the cold end of the heat difference power generation unit 501; the outer end of the second heat absorption unit 505 is in contact with the cold source, and the inner end of the second heat absorption unit 505 is in contact with the outer end of the second heat transfer unit 504, and is used to transfer the cold source temperature to the heat difference power generation unit 501 through the second heat transfer unit 504.

[0070] In some of the embodiments, there are a plurality of heat difference power generation units 501 , and the plurality of heat difference power generation units 501 are arranged around and contact the first heat transfer unit 502 and the second heat transfer unit 504 , respectively.

[0071] In some of the embodiments, there are multiple first heat transfer units 502 , which are arranged around the thermal difference power generation unit 501 and are in contact with the thermal difference power generation unit 501 and the first heat absorption unit 503 , respectively.

[0072] In some of the embodiments, there are multiple second heat transfer units 504 , which are arranged around the thermal difference power generation unit 501 and are in contact with the thermal difference power generation unit 501 and the second heat absorption unit 505 , respectively.

[0073] In some of the embodiments, the thermal differential power generation unit 501 is composed of p-type and n-type semiconductor materials, which form a potential difference between the hot end and the cold end, thereby generating electric current.

[0074] In some of the embodiments, the thermal difference power generation unit 501 is made of thermoelectric semiconductor material.

[0075] In some of the embodiments, the cross-section of the first heat absorption unit 503 is circular.

[0076] In some embodiments, the first heat absorption unit 503 includes but is not limited to a heat absorption sheet.

[0077] In some of the embodiments, the connection method between the first heat transfer unit 502 and the first heat absorption unit 503 is but not limited to welding.

[0078] In some of the embodiments, the first heat transfer unit 502 includes but is not limited to a heat transfer rod.

[0079] In some of the embodiments, the cross-section of the second heat absorption unit 505 is circular.

[0080] In some embodiments, the second heat absorption unit 505 includes but is not limited to a heat absorption sheet.

[0081] In some of the embodiments, the second heat transfer unit 504 and the second heat absorption unit 505 are connected in a manner including but not limited to welding.

[0082] In some of the embodiments, the second heat transfer unit 504 includes but is not limited to a heat transfer rod.

[0083] Furthermore, the heat difference power generation device 500 further includes a first heat fixing unit 506 , wherein the outer end of the first heat fixing unit 506 contacts the heat source, and the inner end of the first heat fixing unit 506 contacts the outer end of the first heat absorbing unit 503 .

[0084] In some embodiments, the cross-section of the first heat fixing unit 506 is circular.

[0085] In some embodiments, the first heat-fixing unit 506 is a first heat-fixing layer.

[0086] Furthermore, the heat difference power generation device 500 further includes a second solid heat unit 507. The outer end of the second solid heat unit 507 is in contact with the cold source, and the inner end of the second solid heat unit 507 is in contact with the liquid transmission device.

[0087] In some embodiments, the cross section of the second heat fixing unit 507 is circular.

[0088] In some embodiments, the second heat-fixing unit 507 is a second heat-fixing layer.

[0089] The working principle of the utility model is as follows:

[0090] The heat of the heat source reaches the hot end of the thermal difference power generation unit 501 through the first heat absorption unit 503 and the first heat transfer unit 502; the cold source is transferred to the cold end of the thermal difference power generation unit 501 through the second heat absorption unit 505 and the second heat transfer unit 504, and the thermal difference power generation unit 501 performs temperature difference power generation according to the Seebeck effect.

[0091] Example 2

[0092] This embodiment relates to the semiconductor tail gas treatment system of the utility model.

[0093] like Figure 2As shown, a semiconductor tail gas treatment system comprises a combustion device 100, a water washing device 200, a liquid storage device 300, a cooling device 400, a heat difference power generation device 500 as described in Example 1, and an electric storage device 600. Among them, the combustion device 100 is used to burn tail gas; the water washing device 200 is connected to the combustion device 100, and is used to wash the tail gas after combustion; the liquid storage device 300 is respectively connected to the combustion device 100 and the water washing device 200; the cooling device 400 is respectively connected to the water washing device 200 and the liquid storage device 300, and is used to cool the liquid output by the liquid storage device 300; the heat difference power generation device 500 is arranged between the liquid storage device 300 and the cooling device 400; the electric storage device 600 is connected to the heat difference power generation device 500, and is used to store the electricity generated by the heat difference power generation device 500.

[0094] In some of the embodiments, the combustion device 100 is a combustion chamber.

[0095] In some of the embodiments, the water washing device 200 is a water washing chamber.

[0096] In some of the embodiments, the liquid storage device 300 is a water reservoir.

[0097] In some of the embodiments, the cooling device 400 includes but is not limited to a dry air cooler and a hydrogen cooler.

[0098] Furthermore, the heat difference power generation device 500 is also provided on the combustion device 100. Specifically, the first heat absorption unit 503 is provided to cover the outer wall of the combustion device 100.

[0099] Furthermore, the heat difference power generation device 500 is also provided in the water washing device 200. Specifically, the first heat absorption unit 503 is provided to cover the outer wall of the water washing device 200.

[0100] Furthermore, the heat difference power generation device 500 is also disposed between the combustion device 100 and the water washing device 200. Specifically, the first heat absorption unit 503 is disposed to cover the outer wall of the liquid transmission device connecting the combustion device 100 and the water washing device 200.

[0101] Furthermore, the heat difference power generation device 500 is also disposed between the combustion device 100 and the liquid storage device 300. Specifically, the first heat absorption unit 503 is disposed to cover the outer wall of the liquid transmission device 700 connecting the combustion device 100 and the liquid storage device 300.

[0102] Furthermore, the semiconductor tail gas treatment system further includes a liquid transmission device 700 . The liquid transmission device 700 is communicated with the liquid storage device 300 and the cooling device 400 , respectively, and is used to transmit the liquid in the liquid storage device 300 to the cooling device 400 .

[0103] Further, the heat difference power generation device 500 is disposed to cover the liquid transmission device 700. Specifically, the first heat absorption unit 503 is disposed to cover the outer wall of the liquid transmission device 700.

[0104] In some of the embodiments, the liquid transfer device 700 is a liquid infusion tube.

[0105] Furthermore, the semiconductor tail gas treatment system further includes a first circulation device 800. The first circulation device 800 is connected to the cooling device 400 and the water washing device 200 respectively, and is used to circulate the coolant transported from the cooling device 400 to the water washing device 200.

[0106] In some of the embodiments, the first circulation device 800 is a first water pump.

[0107] The working principle of the utility model is as follows:

[0108] The tail gas is transported to the combustion device 100, and the blower mixes air and nitrogen into the combustion device 100. The air is used to support combustion, and the nitrogen is used to take away heat, reduce the intensity of the combustion reaction, and control the temperature. It is generally used for purging.

[0109] The tail gas after the combustion reaction in the combustion device 100 enters the water washing device 200, is cooled by a water curtain, etc., and then discharged from the water washing device 200;

[0110] The liquid after cooling the exhaust gas enters the liquid storage device 300, and then enters the liquid transmission device 700 under the action of the first circulation device 800. The heat difference power generation device 500 located outside the liquid transmission device 700 uses the heat of the liquid transmission device 700 to generate electricity by temperature difference according to the Seebeck effect and transmits it to the power storage device 600 for power storage;

[0111] Under the action of the first circulation device 800, the liquid in the liquid transmission device 700 enters the cooling device 400, is cooled by the cooling device 400, and then enters the water washing device 200 to cool the exhaust gas after combustion, so as to achieve recycling and continuous power generation.

[0112] The advantage of the utility model is that a water circulation is formed by arranging a water washing device, a liquid storage device, a cooling device, and a first circulation device to cool the exhaust gas after combustion, and a heat difference power generation device is arranged on the outside of the liquid transmission device to utilize the heat generated in the exhaust gas treatment process to generate electricity, thereby solving the problem that a large amount of heat energy generated in the semiconductor exhaust gas combustion process is not fully utilized.

[0113] Example 3

[0114] This embodiment is a supplementary embodiment of Embodiment 2.

[0115] like Figure 2 As shown, the semiconductor tail gas treatment system further includes a second circulation device 900. The second circulation device 900 is respectively connected to the cooling device 400 and the heat difference power generation device 500, and is used to circulate the coolant transported from the cooling device 400 to the heat difference power generation device 500.

[0116] In some of the embodiments, the second circulation device 900 is a second water pump.

[0117] The working principle of this embodiment is as follows:

[0118] The cooling device 400 delivers cooling liquid to the thermal difference power generation device 500 to increase the temperature difference between the hot end and the cold end of the thermal difference power generation device 500 and improve the power generation efficiency. The second circulation device 900 allows the cooling liquid to be recycled.

[0119] The advantage of this embodiment is that the power generation efficiency of the heat difference power generation device is improved by conveying the coolant to the heat difference power generation device and circulating the coolant through the second circulation device.

[0120] Example 4

[0121] This embodiment is a supplementary embodiment of Embodiments 2 to 3.

[0122] like Figure 3 As shown, the semiconductor tail gas treatment system further includes a refrigeration device 1000. The refrigeration device 1000 is disposed on the combustion device 100 and connected to the power storage device 600, and is used to cool the combustion device 100 to reduce the temperature of the combustion device 100 during combustion.

[0123] like Figure 4 As shown, the refrigeration device 1000 includes a refrigeration unit 1001, a third heat transfer unit 1002 and a third heat absorption unit 1003. The refrigeration unit 1001 is disposed on the combustion device 100 and connected to the power storage device 600, and is used to cool the combustion device 100 according to the Peltier effect to reduce the temperature of the combustion device 100 during combustion; the outer end of the third heat transfer unit 1002 is in contact with the refrigeration unit 1001; the inner end of the third heat absorption unit 1003 is in contact with the heat source, and the outer end of the third heat absorption unit 1003 is in contact with the outer end of the third heat transfer unit 1002, and is used to transfer the heat source temperature to the refrigeration unit 1001 through the third heat transfer unit 1002.

[0124] In some of the embodiments, the cooling device 1000 is a Peltier cooling device.

[0125] In some of the embodiments, the third heat transfer unit 1002 includes but is not limited to a heat transfer rod.

[0126] In some embodiments, the third heat absorption unit 1003 includes but is not limited to a heat absorption sheet.

[0127] Furthermore, the refrigeration device 1000 is also disposed on the water washing device 200. Specifically, the third heat absorption unit 1003 is disposed to cover the outer wall of the water washing device 200.

[0128] Furthermore, the refrigeration device 1000 is also disposed between the combustion device 100 and the water washing device 200. Specifically, the third heat absorption unit 1003 is disposed to cover the outer wall of the liquid transmission device 700 connecting the combustion device 100 and the water washing device 200.

[0129] Furthermore, the refrigeration device 1000 is also disposed between the combustion device 100 and the liquid storage device 300. Specifically, the third heat absorption unit 1003 is disposed to cover the outer wall of the liquid transmission device 700 connecting the combustion device 100 and the liquid storage device 300.

[0130] Furthermore, the refrigeration device 1000 is also disposed between the water washing device 200 and the liquid storage device 300. Specifically, the third heat absorption unit 1003 is disposed to cover the outer wall of the liquid transmission device 700 connecting the water washing device 200 and the liquid storage device 300.

[0131] The working principle of the utility model is as follows:

[0132] The refrigeration device 1000 is installed on the surface of the combustion device 100 and the surface of the liquid transfer device 700, and uses the Peltier effect to reduce the temperature inside the combustion device 100 and related structures and the liquid transfer device 700 during exhaust gas treatment to ensure the safety of the equipment (Peltier effect: when current passes through a loop formed by two different conductors, one conductor will absorb heat and the other conductor will release heat).

[0133] The advantage of this embodiment is that by arranging a refrigeration device outside the combustion device to control the temperature of the combustion device and the liquid transfer device, the exhaust gas can be burned more completely, thereby making the exhaust gas treatment cleaner and more environmentally friendly; at the same time, the safety of the equipment is guaranteed; by arranging a refrigeration device outside the thermal difference power generation device, the power generation efficiency of the thermal difference power generation device can be effectively improved.

[0134] Example 5

[0135] This embodiment is a specific embodiment of the present utility model.

[0136] like Figure 5 As shown, a heat difference power generation system, the tail gas is transported to the combustion device 100, and the blower mixes air and nitrogen into the combustion device 100;

[0137] The tail gas after the combustion reaction in the combustion device 100 enters the water washing device 200, is cooled by a water curtain, etc., and then discharged from the water washing device 200;

[0138] The liquid after cooling the exhaust gas enters the liquid storage device 300, and then enters the liquid transmission device 700 under the action of the first circulation device 800. The heat difference power generation device 500 located outside the liquid transmission device 700 uses the heat of the liquid transmission device 700 to generate electricity by temperature difference according to the Seebeck effect and transmits it to the power storage device 600 for power storage;

[0139] Under the action of the first circulation device 800, the liquid in the liquid transmission device 700 enters the cooling device 400, and after being cooled by the cooling device 400, enters the water washing device 200 for cooling the exhaust gas after combustion;

[0140] The refrigeration device 1000 installed on the surface of the combustion device 100, the surface of the liquid transmission device 700, and the surface of the heat difference power generation device 500 uses the Peltier effect to reduce the temperature of the combustion device 100, the liquid transmission device 700, and the heat difference power generation device 500 during the exhaust gas treatment;

[0141] The refrigeration device 1000 is connected to the power storage device 600 and operates using the electric energy stored in the power storage device 600.

[0142] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat difference power generation device for semiconductor tail gas treatment, characterized in that: include: A thermal difference power generation unit, the thermal difference power generation unit is connected to the power storage device and is used for performing temperature difference power generation according to the Seebeck effect; a first heat transfer unit, wherein an inner end of the first heat transfer unit contacts a hot end of the heat difference power generation unit; a first heat absorbing unit, wherein the outer end of the first heat absorbing unit contacts the heat source, and the inner end of the first heat absorbing unit contacts the outer end of the first heat transfer unit, and is used to transfer the heat source temperature to the heat difference power generation unit through the first heat transfer unit; a second heat transfer unit, wherein an inner end of the second heat transfer unit contacts a cold end of the heat difference power generation unit; The second heat absorbing unit, the outer end of the second heat absorbing unit is in contact with the cold source, and the inner end of the second heat absorbing unit is in contact with the outer end of the second heat transfer unit, and is used to transfer the cold source temperature to the heat difference power generation unit through the second heat transfer unit.

2. The heat difference power generation device according to claim 1, characterized in that: There are a plurality of heat difference power generation units, which are arranged around and respectively contact the first heat transfer unit and the second heat transfer unit; and / or There are a plurality of the first heat transfer units, and the plurality of the first heat transfer units are arranged around the heat difference power generation unit and are respectively in contact with the heat difference power generation unit and the first heat absorption unit; and / or There are a plurality of the second heat transfer units, and the plurality of the second heat transfer units are arranged around the heat difference power generation unit and are in contact with the heat difference power generation unit and the second heat absorption unit respectively.

3. The heat difference power generation device according to claim 1 or 2, characterized in that: Also includes: a first heat fixing unit, wherein an outer end of the first heat fixing unit contacts a heat source, and an inner end of the first heat fixing unit contacts an outer end of the first heat absorbing unit; and / or The second heat-fixing unit, the outer end of the second heat-fixing unit is in contact with the cold source, and the inner end of the second heat-fixing unit is in contact with the liquid transmission device.

4. A semiconductor tail gas treatment system, characterized in that: include: A combustion device, wherein the combustion device is used to burn tail gas; A water washing device, the water washing device is connected to the combustion device and is used to wash the exhaust gas after combustion; A liquid storage device, the liquid storage device is connected to the combustion device and the water washing device respectively; A cooling device, the cooling device is connected to the water washing device and the liquid storage device respectively, and is used to cool the liquid output by the liquid storage device; The heat difference power generation device according to any one of claims 1 to 3, wherein the heat difference power generation device is arranged between the liquid storage device and the cooling device; An electricity storage device is connected to the heat difference power generation device and is used to store the electricity generated by the heat difference power generation device.

5. The semiconductor tail gas treatment system according to claim 4, characterized in that: Also includes: A liquid transmission device is connected to the liquid storage device and the cooling device respectively, and is used to transport the liquid in the liquid storage device to the cooling device.

6. The semiconductor tail gas treatment system according to claim 4 or 5, characterized in that: Also includes: a first circulation device, the first circulation device being connected to the cooling device, the water washing device, and the liquid storage device, respectively, and being used for circulating cooling water transported from the liquid storage device and the cooling device to the water washing device; and / or The second circulation device is connected to the cooling device and the heat difference power generation device respectively, and is used for circulating the cooling liquid transported from the cooling device to the heat difference power generation device.

7. The semiconductor tail gas treatment system according to any one of claims 4 to 6, characterized in that: The heat difference power generation device is also arranged on the combustion device; and / or The heat difference power generation device is also arranged in the water washing device; and / or The heat difference power generation device is also arranged between the combustion device and the water washing device; and / or The heat difference power generation device is also arranged between the combustion device and the liquid storage device.

8. The semiconductor tail gas treatment system according to any one of claims 5 to 7, characterized in that: Also includes: A refrigeration device is arranged on the combustion device and connected to the power storage device, and is used for cooling the combustion device to reduce the temperature of the combustion device during combustion.

9. The semiconductor tail gas treatment system according to claim 8, characterized in that: The refrigeration device comprises: A refrigeration unit, which is arranged at the combustion device and connected to the power storage device, and is used to cool the combustion device according to the Peltier effect to reduce the temperature of the combustion device during combustion; a third heat transfer unit, wherein an outer end of the third heat transfer unit is in contact with the refrigeration unit; A third heat absorbing unit, wherein the inner end of the third heat absorbing unit contacts the heat source, and the outer end of the third heat absorbing unit contacts the outer end of the third heat transfer unit, and is used to transfer the heat source temperature to the refrigeration unit through the third heat transfer unit.

10. The semiconductor tail gas treatment system according to any one of claims 8 to 9, characterized in that: The refrigeration device is also arranged on the water washing device; and / or The refrigeration device is also arranged between the combustion device and the water washing device; and / or The refrigeration device is also arranged between the combustion device and the liquid storage device; and / or The refrigeration device is also arranged between the water washing device and the liquid storage device.

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