Dehumidification device
By using a combination of semiconductor refrigeration sheet and external air-cooled heat dissipation device in the laser cabinet, the laser condensation problem in high temperature and high humidity environment is solved, efficient dehumidification and heat dissipation are achieved, and cost and space occupation are reduced.
Patent Information
- Application Number
- CN202420188285.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-01-25
AI Technical Summary
The existing laser dehumidification device has high cost and weak heat dissipation capabilities, which makes it difficult to solve the internal condensation problem of lasers in high temperature and high humidity environments.
The semiconductor refrigeration plate is combined with the external air-cooled heat dissipation device and the internal water-cooled heat dissipation device. The space occupation is reduced through the semi-built-in design, the heat dissipation and cooling capacity of the hot and cold surfaces is improved, and the dehumidification effect is enhanced.
It effectively reduces the dew point temperature inside the laser cabinet, avoids condensation problems, improves the dehumidification effect, and reduces the cost and space occupation of the device.
Smart Images
Figure CN222148065U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of dehumidification technology, and in particular to a dehumidification device. Background Art
[0002] When the laser is working, its internal optical components need to be controlled at a suitable operating temperature. Because the laser generates a lot of heat, it usually needs to be dissipated through a water cooling plate. When the laser works in a high temperature and high humidity environment, the moisture in the air may condense in the laser to form condensed water. The condensed water will have a great impact on the electronic and optical components in the laser, causing them to malfunction or even damage them.
[0003] Current dehumidification solutions for lasers mainly include: external air conditioners on the cabinet side walls, desiccant sheets placed inside the cabinet, fully built-in water-cooled and air-cooled composite heat dissipation TEC dehumidifiers, and semi-built-in pure air-cooled TEC dehumidifiers. However, the air conditioners used are bulky and costly; the dehumidification capacity of the desiccant sheets decreases as the desiccant sheets become saturated; in fully built-in air-cooled and water-cooled composite heat dissipation dehumidifiers, when using pure air cooling, all the heat generated by the TEC is concentrated inside the laser cabinet, increasing the internal temperature of the cabinet and hindering the reduction of the internal dew point temperature; in semi-built-in pure air cooling TEC dehumidifiers, the TEC hot surface has weak heat dissipation capacity, resulting in weak cooling capacity of the TEC cold surface, resulting in poor dehumidification effect.
[0004] Therefore, it is necessary to propose a dehumidification device that is low in cost, can reduce the dew point temperature inside the cabinet, improve or avoid the condensation problem inside the cabinet, and has good heat dissipation capacity. Utility Model Content
[0005] The embodiment of the present application provides a dehumidification device that is low in cost, improves or avoids the condensation problem inside the cabinet, and has good heat dissipation capability.
[0006] The dehumidification device provided in the present application includes an external dehumidification mechanism and an internal dehumidification mechanism; the internal dehumidification mechanism is arranged on the inner side wall of the laser cabinet for achieving water cooling and heat dissipation; the internal dehumidification mechanism includes a semiconductor cooling plate, and the semiconductor cooling plate includes a hot surface and a cold surface, and the cold surface is used to contact the heat source inside the cabinet and transfer heat from the heat source to the hot surface;
[0007] The external dehumidification mechanism is connected to the internal dehumidification mechanism, and the external dehumidification mechanism is located outside the laser cabinet. The external dehumidification mechanism is used to transfer the heat of the hot surface to the outside of the laser cabinet for air cooling and heat dissipation.
[0008] In some embodiments of the present application, the internal dehumidification mechanism further includes a water-cooled plate, a condenser, and a drainage assembly for achieving water-cooled heat dissipation, and the hot surface of the semiconductor refrigeration plate is in close contact with the water-cooled plate, and the cold surface is in close contact with the condenser;
[0009] The surface of the water-cooling plate extends along the side wall of the laser cabinet, the condenser is fixedly mounted on the side of the water-cooling plate away from the inner wall of the cabinet, and the semiconductor refrigeration sheet is arranged between the water-cooling plate and the condenser;
[0010] The condenser forms condensed water after heat exchange, and the drainage component is connected to the condenser, and the drainage component is used to drain the condensed water.
[0011] In some embodiments of the present application, thermal insulation cotton is arranged between the water-cooling plate and the condenser, and the thermal insulation cotton is fixed on the surface of the water-cooling plate facing away from the side wall of the cabinet; along the plate surface direction of the water-cooling plate, the size of the thermal insulation cotton is not less than the size of the semiconductor refrigeration plate.
[0012] In some embodiments of the present application, the water-cooling plate includes a main body and a boss portion, the boss portion and the main body are integrally formed, and the main body and the boss portion are both plate-shaped;
[0013] The boss portion is formed with two lugs extending beyond the side wall of the main body portion, the two lugs being correspondingly arranged on both sides of the main body portion along the first direction, where the first direction is the length direction of the main body portion; the two lugs are both located on the same side of the main body portion along the second direction, where the second direction is the thickness direction of the main body portion;
[0014] The surface of the water cooling plate is extended along the side wall of the laser cabinet and includes:
[0015] The water cooling plate passes through the side wall of the laser cabinet, the main body is connected to the inside of the laser cabinet, the boss is located outside the laser cabinet, and the side wall of the lug is attached to and installed on the outer side wall surface of the laser cabinet.
[0016] In some embodiments of the present application, the water-cooling plate includes a flow channel, which is opened inside the main body, and the flow channel has a plurality of openings that pass through to the outer surface of the water-cooling plate; the outer surface of the water-cooling plate includes a wall surface parallel to the second direction on the outer peripheral surface of the water-cooling plate.
[0017] In some embodiments of the present application, the drainage assembly includes a water receiving funnel and a drain pipe. Along the third direction, the water receiving funnel is connected to the bottom of the condenser, one end of the drain pipe is connected to the water receiving funnel, and the other end of the drain pipe is connected to the outside of the laser cabinet to drain the condensed water to the outside of the laser cabinet.
[0018] In some embodiments of the present application, the internal dehumidification mechanism further includes a first fan, which is connected to the condenser; the first fan is used to control the hot air inside the laser cabinet to flow along the wind direction close to the condenser.
[0019] In some embodiments of the present application, the external dehumidification mechanism further includes a finned heat sink, and the finned heat sink is arranged away from the semiconductor refrigeration plate along the second direction;
[0020] The fin heat sink includes a plurality of heat dissipation fins, and the heat dissipation fins are connected to the water cooling plate;
[0021] A sealing member for maintaining a sealed state of the laser cabinet is provided between the heat dissipation fins and the laser cabinet.
[0022] In some embodiments of the present application, the heat dissipating fins are detachably connected to the water cooling plate.
[0023] In some embodiments of the present application, the external dehumidification mechanism further includes a second fan, which is used to control the hot air from the fin heat sink to flow in a wind direction away from the interior of the laser cabinet.
[0024] The dehumidification device of the embodiment of the present application realizes semi-built-in installation while reducing the space occupied by the dehumidification device because the internal dehumidification mechanism is arranged inside the laser cabinet and the external dehumidification mechanism is located outside the laser cabinet; the cold surface of the semiconductor refrigeration plate can transfer the heat from the heat source to the hot surface, and the external dehumidification mechanism promptly transfers the heat from the hot surface to the outside of the laser cabinet, thereby improving the heat dissipation capacity of the hot surface and the cooling capacity of the cold surface, enhancing the dehumidification effect, and improving or avoiding the condensation problem inside the laser cabinet. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0026] Figure 1 This is a connection diagram of the dehumidification device provided in an embodiment of the present application when it is installed on a laser cabinet;
[0027] Figure 2 This is a schematic diagram of the connection relationship between the thermal insulation cotton, the semiconductor refrigeration sheet, and the water cooling plate in the embodiment of the present application;
[0028] Figure 3 This is a schematic diagram of the connection relationship between the fin heat sink and the water cooling plate from one perspective of an embodiment of the present application;
[0029] Figure 4 This is a schematic diagram of the connection relationship between the fin heat sink and the water cooling plate from another perspective of an embodiment of the present application.
[0030] 1. Dehumidification device; 2. External dehumidification mechanism; 21. Fin heat sink; 211. Cooling fin; 22. Second fan; 3. Internal dehumidification mechanism; 31. Semiconductor refrigeration plate; 4. Water-cooled plate; 41. Main body; 411. Flow channel; 42. Boss; 421. Ear plate; 5. Condenser; 6. Drain assembly; 61. Water collecting funnel; 62. Drain pipe; 7. Insulation cotton; 8. First fan; 9. Laser cabinet; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION
[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.
[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.
[0033] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0034] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0035] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.
[0036] For details, please refer to Figures 1 to 4 The present invention provides a dehumidification device 1 for dehumidifying and dissipating heat inside a laser cabinet 9. The dehumidification device 1 is used to improve the problems of high dehumidification cost, weak cooling capacity, and poor dehumidification effect in related technologies. The dehumidification device 1 includes an external dehumidification mechanism 2 and an internal dehumidification mechanism 3.
[0037] The internal dehumidification mechanism 3 is provided on the inner side wall of the laser cabinet 9 for achieving water cooling and heat dissipation. The internal dehumidification mechanism 3 includes a semiconductor refrigeration plate (TEC) 31. The TEC 31 includes a hot surface and a cold surface (not shown). The cold surface is used to contact the heat source inside the cabinet and transfer heat from the heat source to the hot surface.
[0038] The external dehumidification mechanism 2 is connected to the internal dehumidification mechanism 3. The external dehumidification mechanism 2 is located outside the laser cabinet 9. The external dehumidification mechanism 2 is used to transfer the heat of the hot surface to the outside of the laser cabinet 9 for air cooling and heat dissipation.
[0039] Thus, the dehumidification device 1 of the embodiment of the present application, since the internal dehumidification mechanism 3 is arranged inside the laser cabinet 9 and the external dehumidification mechanism 2 is located outside the laser cabinet 9, realizes semi-built-in installation while reducing the occupied space of the dehumidification device 1; the cold surface of the semiconductor refrigeration plate 31 can transfer the heat of the heat source to the hot surface, and the external dehumidification mechanism 2 transfers the heat of the hot surface to the outside of the laser cabinet 9 in time, thereby improving the heat dissipation capacity of the hot surface and the cooling capacity of the cold surface, enhancing the dehumidification effect, and improving or avoiding the condensation problem inside the laser cabinet.
[0040] In some embodiments, in order to improve the heat dissipation capacity of the hot surface of the semiconductor refrigeration plate 31 and the cooling capacity of the cold surface thereof, both the hot surface and the cold surface of the semiconductor refrigeration plate 31 are coated with thermal grease.
[0041] In order to achieve the dehumidification effect of the internal dehumidification mechanism 3, in some embodiments, the internal dehumidification mechanism 3 also includes a water-cooled plate 4, a condenser 5 and a drainage component 6 for achieving water-cooled heat dissipation, and the hot surface of the semiconductor refrigeration plate 31 is close to the water-cooled plate 4, and the cold surface is close to the condenser 5.
[0042] The surface of the water-cooling plate 4 extends along the side wall of the laser cabinet 9, the condenser 5 is fixedly installed on the side of the water-cooling plate 4 facing away from the inner wall of the cabinet, and the semiconductor refrigeration plate 31 is arranged between the water-cooling plate 4 and the condenser 5; the condenser 5 forms condensed water after heat exchange, and the drainage component 6 is connected to the condenser 5, and the drainage component 6 is used to drain the condensed water.
[0043] See Figure 2 In some embodiments, in order to reduce or avoid heat transfer between the water-cooling plate 4 and the condenser 5 and reduce the possibility of heat transferred to the external dehumidification mechanism 2 being transferred back to the inside of the laser cabinet 9, a heat insulation cotton 7 is provided between the water-cooling plate 4 and the condenser 5.
[0044] Among them, the thermal insulation cotton 7 is fixed on the surface of the water-cooling plate 4 facing away from the side wall of the cabinet; for example, the thermal insulation cotton 7 can be fixed on the surface of the water-cooling plate 4 facing away from the side wall of the cabinet by glue or other adhesives, or it can be connected by fasteners made with a lower thermal conductivity coefficient.
[0045] At the same time, in order to improve the thermal insulation effect of the thermal insulation cotton 7, the size of the thermal insulation cotton 7 along the board surface direction of the water-cooled plate 4 is not less than the size of the semiconductor refrigeration plate 31; as an embodiment, the size of the thermal insulation cotton 7 can be larger than the board surface size of the semiconductor refrigeration surface and smaller than the board surface size of the water-cooled plate 4, thereby achieving sufficient thermal insulation effect while occupying little space and saving material.
[0046] In addition, a limiter may be provided on the plate surface of the water-cooling plate 4 , and the limiter is used to limit the thermal insulation cotton 7 from sliding along the plate surface of the water-cooling plate 4 , thereby improving the fixing effect of the thermal insulation cotton 7 .
[0047] See Figure 3 and Figure 4 In some embodiments, the water-cooling plate 4 includes a main body 41 and a boss 42. The boss 42 is integrally formed with the main body 41. Both the main body 41 and the boss 42 are plate-shaped. The heat-insulating cotton 7 is installed on the side of the main body 41 away from the boss 42.
[0048] The boss portion 42 is formed with two lugs extending beyond the sidewall of the main body portion 41 . The two lugs are correspondingly arranged on both sides of the main body portion 41 along the first direction X. The two lugs are both located on the same side of the main body portion 41 along the second direction Y.
[0049] The first direction X is the length direction of the main body 41; the second direction Y is the thickness direction of the main body 41; spatially, it also includes a third direction Z, which is perpendicular to the first direction X and the second direction Y, respectively, wherein the third direction Z is the height direction of the laser cabinet 9.
[0050] The plate surface of the above-mentioned water-cooling plate 4 extends along the side wall of the laser cabinet 9, and may include: the water-cooling plate 4 passes through the side wall of the laser cabinet 9, and the main body 41 is connected to the inside of the laser cabinet 9, the boss portion 42 is located outside the laser cabinet 9, and the side wall of the lug is attached to and installed on the external side wall surface of the laser cabinet 9.
[0051] Therefore, during installation, an opening that is compatible with the main body 41 is opened on the side of the laser cabinet 9, the main body 41 of the water-cooled plate 4 is inserted from the opening, and fixed with corresponding fasteners, and then the other structures of the internal dehumidification mechanism 3 are installed correspondingly to the main body 41, and the external dehumidification mechanism 2 is installed correspondingly to the boss 42, so that the dehumidification device 1 can be conveniently and firmly fixed to the laser cabinet 9 in a semi-built-in manner.
[0052] In some embodiments, the water-cooled plate 4 includes a flow channel 411, which is opened inside the main body 41, and the flow channel 411 has multiple openings that pass through to the outer surface of the water-cooled plate 4; the outer surface of the water-cooled plate 4 includes a wall surface parallel to the second direction Y on the outer peripheral surface of the water-cooled plate 4; in one embodiment, the flow channel 411 has three openings that pass through to the outer surface of the water-cooled plate 4.
[0053] In some embodiments, the drainage assembly 6 includes a water receiving funnel 61 and a drain pipe 62. Along the third direction Z, the water receiving funnel 61 is connected to the bottom of the condenser 5, one end of the drain pipe 62 is connected to the water receiving funnel 61, and the other end of the drain pipe 62 is connected to the outside of the laser cabinet 9 to drain the condensed water to the outside of the laser cabinet 9.
[0054] Of course, the water receiving funnel 61 can also be selected as other water holding devices with the function of receiving water flow, such as a hollow box structure or a tubular structure, as long as it can collect and receive the condensed water in the condenser 5.
[0055] In order to further improve the contact between the condenser 5 and the semiconductor refrigeration plate 31 and the heat source, thereby improving the condensation effect of the condenser 5 and enhancing the cooling capacity of the cold surface of the semiconductor refrigeration plate 31, in some embodiments, the internal dehumidification mechanism 3 also includes a first fan 8, which is connected to the condenser 5; the first fan 8 is used to control the hot air inside the laser cabinet 9 to flow along the wind direction close to the condenser 5.
[0056] See Figure 3 and Figure 4 In some embodiments, the external dehumidification mechanism 2 includes a fin heat sink 21, which is arranged along the second direction Y away from the semiconductor refrigeration plate 31. That is, when the water-cooling plate 4 is fixedly installed on the laser cabinet 9, the fin heat sink 21 is installed on the surface of the water-cooling plate 4 away from the laser cabinet 9.
[0057] The finned heat sink 21 includes a plurality of fins 211, which are connected to the water-cooling plate 4. In one embodiment, the fins 211 and the water-cooling plate 4 can be fixedly connected, for example, by riveting or welding. In another embodiment, the fins 211 and the water-cooling plate 4 are configured as separate structures, and the fins 211 and the water-cooling plate 4 are detachably connected and fixed using screws or bolts.
[0058] In some embodiments, a seal is provided between the heat sink 211 and the laser cabinet 9 for maintaining the sealed state of the laser cabinet 9. The seal is a rubber pad or a rubber ring filled between the fin heat sink 21 and the laser cabinet 9 to maintain the sealed state of the laser cabinet 9.
[0059] In some embodiments, the external dehumidification mechanism 2 also includes a second fan 22, which is fixedly mounted on the fin heat sink 21. By controlling the air outlet direction of the second fan 22, the hot air from the fin heat sink 21 is controlled to flow along the wind direction away from the inside of the laser cabinet 9, thereby accelerating the dissipation of heat from the laser cabinet 9.
[0060] The working process of the dehumidification device 1 provided in the embodiment of the present application mainly includes: before the laser is passed through water, the semiconductor refrigeration plate 31 is powered on, and the first fan 8 and the second fan 22 are both turned on and rotated. Since the first fan 8 can drive the internal heat source of the laser to contact the cold surface of the semiconductor refrigeration plate 31 more fully, the semiconductor refrigeration plate 31 is air-cooled and dissipated, so that the dew point temperature in the cabinet is conveniently reduced to below the water supply temperature; after the laser is passed through water, the conductor refrigeration plate is powered on, the second fan 22 stops rotating, and the first fan 8 rotates, and the conductor refrigeration plate is water-cooled and dissipated, which can further reduce the dew point temperature inside the cabinet to minimize or even avoid the condensation problem inside the cabinet; the dehumidification device 1 in the present application can realize air cooling, water cooling and a combination of air cooling and water cooling, and uses a semi-built-in installation method, which reduces the space occupied by the dehumidification device 1 and improves the heat dissipation and dehumidification effects; in addition, the dehumidification device 1 provided in the present application has a simple structure and reduces the dehumidification cost.
[0061] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0062] The above is a detailed introduction to an electronic device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A dehumidification device, characterized in that: include: An external dehumidification mechanism (2) and an internal dehumidification mechanism (3); The internal dehumidification mechanism (3) is arranged on the inner side wall of the laser cabinet (9) and is used to achieve water cooling and heat dissipation; the internal dehumidification mechanism (3) comprises a semiconductor cooling sheet (31), the semiconductor cooling sheet (31) comprises a hot surface and a cold surface, the cold surface is used to contact the heat source inside the cabinet and transfer the heat of the heat source to the hot surface; The external dehumidification mechanism (2) is connected to the internal dehumidification mechanism (3), and the external dehumidification mechanism (2) is located outside the laser cabinet (9). The external dehumidification mechanism (2) is used to transfer the heat of the hot surface to the outside of the laser cabinet (9) for air cooling and heat dissipation.
2. The dehumidification device according to claim 1, characterized in that: The internal dehumidification mechanism (3) also includes a water cooling plate (4) for achieving water cooling and heat dissipation, a condenser (5) and a drainage assembly (6); the hot surface of the semiconductor refrigeration sheet (31) is in close contact with the water cooling plate (4), and the cold surface is in close contact with the condenser (5); The plate surface of the water cooling plate (4) is extended along the side wall of the laser cabinet (9), the condenser (5) is fixedly installed on the side of the water cooling plate (4) away from the inner wall of the cabinet, and the semiconductor cooling plate (31) is arranged between the water cooling plate (4) and the condenser (5); The condenser (5) forms condensed water after heat exchange, and the drainage component (6) is connected to the condenser (5), and the drainage component (6) is used to drain the condensed water.
3. The dehumidification device according to claim 2, characterized in that: A heat insulating cotton (7) is arranged between the water cooling plate (4) and the condenser (5), and the heat insulating cotton (7) is fixed on the surface of the water cooling plate (4) facing away from the side wall of the cabinet; along the plate surface direction of the water cooling plate (4), the size of the heat insulating cotton (7) is not less than the size of the semiconductor refrigeration plate (31).
4. The dehumidification device according to claim 2, characterized in that: The water-cooling plate (4) comprises a main body (41) and a boss portion (42), the boss portion (42) and the main body (41) are integrally formed, and the main body (41) and the boss portion (42) are both plate-shaped; The boss portion (42) is formed with two lugs extending beyond the side wall of the main body portion (41), and the two lugs are arranged correspondingly on both sides of the main body portion (41) along a first direction (X), wherein the first direction (X) is the length direction of the main body portion (41); the two lugs are both located on the same side of the main body portion (41) along a second direction (Y), wherein the second direction (Y) is the thickness direction of the main body portion (41); The plate surface of the water cooling plate (4) is extended along the side wall of the laser cabinet (9), and comprises: The water cooling plate (4) passes through the side wall of the laser cabinet (9), the main body (41) is connected to the inside of the laser cabinet (9), the boss (42) is located outside the laser cabinet (9), and the side wall of the lug is attached to and installed on the outer side wall surface of the laser cabinet (9).
5. The dehumidification device according to claim 4, characterized in that: The water-cooling plate (4) comprises a flow channel (411), wherein the flow channel (411) is opened inside the main body (41), and the flow channel (411) has a plurality of openings penetrating to the outer surface of the water-cooling plate (4); the outer surface of the water-cooling plate (4) comprises a wall surface parallel to the second direction (Y) in the outer peripheral surface of the water-cooling plate (4).
6. The dehumidification device according to any one of claims 2 to 5, characterized in that: The drainage component (6) comprises a water receiving funnel (61) and a drainage pipe (62). Along a third direction (Z), the water receiving funnel (61) is connected to the bottom of the condenser (5), one end of the drainage pipe (62) is connected to the water receiving funnel (61), and the other end of the drainage pipe (62) is connected to the outside of the laser cabinet (9) so as to guide the condensed water to the outside of the laser cabinet (9).
7. The dehumidification device according to any one of claims 2 to 5, characterized in that: The internal dehumidification mechanism (3) further comprises a first fan (8), wherein the first fan (8) is connected to the condenser (5); the first fan (8) is used to control the hot air inside the laser cabinet (9) to flow along a wind direction close to the condenser (5).
8. The dehumidification device according to claim 4, characterized in that: The external dehumidification mechanism (2) further comprises a fin heat sink (21), wherein the fin heat sink (21) is arranged away from the semiconductor refrigeration sheet (31) along the second direction (Y); The fin heat sink (21) comprises a plurality of heat dissipation fins (211), and the heat dissipation fins (211) are connected to the water cooling plate (4); A sealing member for maintaining the sealed state of the laser cabinet (9) is provided between the heat dissipation fin (211) and the laser cabinet (9).
9. The dehumidification device according to claim 8, characterized in that: The heat dissipation fins (211) are detachably connected to the water cooling plate (4).
10. The dehumidification device according to any one of claims 8 to 9, characterized in that: The external dehumidification mechanism (2) further comprises a second fan (22), wherein the second fan (22) is used to control the hot air of the fin heat sink (21) to flow along a wind direction away from the inside of the laser cabinet (9).