Forming equipment for combustion head production

Abstract

The utility model discloses forming equipment for combustion head production, which relates to the field of combustion head production, and comprises a bottom plate, a lower die is mounted at the top of the bottom plate, cooling components are arranged on two sides of the lower die, each cooling component comprises an interchange box arranged on two sides of the lower die, and a liquid guide hopper is fixed in each interchange box. And the bottom of the liquid guide hopper is connected with a liquid guide pipe. Due to the fact that the cooling assembly is arranged, the density of cold water is larger than that of hot water at the temperature ranging from 4 DEG C to 100 DEG C, after raw materials in the lower die are continuously cooled through cooling liquid in the cooling cavity, the temperature of the cooling liquid can rise, and the cooling liquid with the higher temperature can be located above the cooling liquid with the lower temperature; at the moment, the cooling liquid with the high temperature flows into a liquid guide hopper in the exchange box through a liquid guide hole, a semiconductor chilling plate can be started at the moment, and the semiconductor chilling plate can conveniently cool the liquid.

Description

Technical Field

[0001] The utility model relates to the field of combustion head production, in particular to molding equipment for combustion head production. Background Art

[0002] The burner head is a component in the premixing structure of the flame atomizer. It is the nozzle for mixing gas and transporting ship-shaped samples during flame combustion. Most of them are single slit type. The former is used for nitrous oxide-acetylene flame, and the latter is used for air-acetylene flame. The burner head is generally cast during production. During the production process, the raw materials need to be poured into the molding equipment so that the raw materials can be molded in the molding equipment.

[0003] Existing molding equipment for burner head production has a cooling cavity in the lower mold, and coolant is injected into the cooling cavity so that the raw materials in the mold can be cooled by the coolant. However, after the coolant cools the raw materials in the mold for a period of time, the temperature of the coolant will increase. At this time, the coolant needs to be replaced to avoid the high temperature of the coolant making it difficult to cool the raw materials in the mold. However, frequent replacement of the coolant is troublesome and time-consuming. At the same time, since the coolant is difficult to recycle, it causes a waste of coolant and reduces the cooling effect on the raw materials. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a molding device for the production of burner heads to solve the technical problem that the temperature of the coolant will increase after cooling the raw materials for a period of time, thereby affecting the subsequent cooling effect on the raw materials.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a molding device for producing burner heads, comprising a base plate, a lower mold is installed on the top of the base plate, cooling components are provided on both sides of the lower mold, and the cooling components include exchange boxes arranged on both sides of the lower mold, a liquid guide hopper is fixed inside the exchange box, and a liquid guide pipe is connected to the bottom of the liquid guide hopper, a liquid guide plate is provided on one side of the interior of the exchange box, a baffle and a semiconductor refrigeration sheet are respectively installed on one side of the exchange box, a plurality of liquid guide holes are provided between the exchange box and the lower mold, a one-way valve is provided between the lower mold and the exchange box, and a buffer component is provided on the top of the exchange box.

[0006] By adopting the above technical solution, the semiconductor refrigeration plate can cool down the hot water inside the exchange box, and the cooled water can flow back to the cooling chamber through the one-way valve.

[0007] Furthermore, the buffer assembly includes a slide bar and a buffer spring arranged on the top of the exchange box, and the outer wall of the slide bar is sleeved with a slide seat.

[0008] By adopting the above technical solution, the slide seat can move on the slide rod, and the arrangement of the slide seat and the slide rod can guide the upper mold.

[0009] Furthermore, the bottom of the slide seat is connected to the top of the buffer spring, and the buffer spring is sleeved on the outer wall of the slide rod.

[0010] By adopting the above technical solution, when the slide seat moves downward, it will squeeze the buffer spring, so that the buffer spring is compressed, so as to buffer the impact force generated when the upper mold moves downward.

[0011] Furthermore, support columns are fixed on both sides of the top of the bottom plate, and a top plate is provided on the top of the support columns.

[0012] By adopting the above technical solution, the support column can support the top plate, thereby improving the stability of the top plate.

[0013] Furthermore, cylinders are installed on both sides of the top of the top plate, and an upper mold is installed on the output end of the cylinder through a piston rod.

[0014] By adopting the above technical solution, when the upper mold needs to be moved, the user can start the cylinder, and the operation of the cylinder can extend or contract the piston rod, thereby driving the upper mold to move.

[0015] Furthermore, both sides of the upper mold are connected to the slide seat, the upper mold is slidably connected to the slide rod through the slide seat, and the top end of the slide rod is connected to the bottom of the top plate.

[0016] By adopting the above technical solution, when the upper mold moves, it will drive the slide seat to slide on the slide rod, thereby improving the stability of the upper mold when moving.

[0017] Furthermore, a cooling cavity is provided inside the lower mold, and the cooling cavity is communicated with the liquid guide hole.

[0018] By adopting the above technical solution, coolant can be stored inside the cooling chamber, and at the same time, water with a higher temperature inside the cooling chamber can flow into the exchange box through the liquid guide hole.

[0019] Furthermore, a sealing groove is provided at the top of the lower mold, and a sealing ring is provided at the bottom of the upper mold, and the sealing ring is adapted to the sealing groove.

[0020] By adopting the above technical solution, when the upper mold moves downward and closes with the lower mold, the upper mold will drive the sealing ring to move downward, so that the sealing ring is first inserted into the sealing groove.

[0021] Furthermore, a liquid through hole is provided at the bottom of the liquid guiding hopper, and the liquid through hole is connected to the liquid guiding tube.

[0022] By adopting the above technical solution, the liquid flowing into the liquid guiding bucket can flow into the liquid through hole, and then flow into the liquid guiding tube through the liquid through hole.

[0023] Furthermore, the liquid guiding tube is in a snake shape and is located above the liquid guiding plate.

[0024] By adopting the above technical solution, hot water can flow into the interior of the liquid guide tube and flow to the top of the liquid guide plate after flowing in the liquid guide tube.

[0025] In summary, the utility model mainly has the following beneficial effects:

[0026] The utility model is provided with a cooling component. Since the density of cold water is greater than that of hot water between 4 degrees Celsius and 100 degrees Celsius, and since the coolant in the cooling chamber continues to cool the raw materials in the lower mold, the temperature of the coolant will increase, and the coolant with a higher temperature will be located above the coolant with a lower temperature. At this time, the coolant with a higher temperature will flow into the liquid guide bucket in the exchange box through the liquid guide hole. At this time, the semiconductor refrigeration plate can be started, and the coolant will flow in the liquid guide tube, and the liquid guide tube is in a snake shape, which can extend the flow time of the liquid. After the liquid flows out through the liquid guide tube, it will flow to the liquid guide plate. After being guided by the liquid guide plate, the liquid will flow to the inner side of the exchange box close to the semiconductor refrigeration plate, which is convenient for the semiconductor refrigeration plate to cool the liquid. The cooled water can flow back to the cooling chamber through the one-way valve for recycling. In this way, it can be ensured that there is coolant in the cooling chamber to cool the raw materials in the mold, thereby improving the cooling effect on the raw materials and improving the recycling efficiency of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0028] Figure 2 It is a schematic diagram of the overall front section structure of the utility model;

[0029] Figure 3 It is a schematic diagram of the three-dimensional structure of the lower mold of the utility model;

[0030] Figure 4 It is a schematic diagram of the three-dimensional structure of the liquid guiding bucket of the utility model.

[0031] In the figure: 1. bottom plate; 2. support column; 3. top plate; 4. cylinder; 5. upper mold; 6. casting port; 7. buffer assembly; 701. slide rod; 702. slide seat; 703. buffer spring; 8. lower mold; 9. cooling assembly; 901. exchange box; 902. baffle; 903. semiconductor refrigeration plate; 904. liquid hole; 905. liquid guide bucket; 906. liquid guide tube; 907. liquid guide hole; 908. liquid guide plate; 909. one-way valve; 10. cooling chamber; 11. sealing groove; 12. sealing ring. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0033] The following describes an embodiment of the utility model based on its overall structure. Embodiment 1:

[0034] A molding device for producing a burner head, such as Figure 1-Figure 4 As shown, it includes a bottom plate 1, a lower mold 8 is installed on the top of the bottom plate 1, and cooling components 9 are provided on both sides of the lower mold 8. Support columns 2 are fixed on both sides of the top of the bottom plate 1, and a top plate 3 is provided on the top of the support columns 2. The support columns 2 can support the top plate 3, thereby improving the stability of the top plate 3. Cylinders 4 are installed on both sides of the top of the top plate 3, and an upper mold 5 is installed on the output end of the cylinder 4 through a piston rod. When the upper mold 5 needs to be moved, the user can start the cylinder 4. The cylinder 4 can extend or contract the piston rod when it works, thereby driving the upper mold 5 to move. A casting port 6 is provided on the top of the upper mold 5, so that the raw material can be cast into the mold through the casting port 6, so as to facilitate the molding of the raw material in the mold. A liquid inlet pipe is provided above the outer surface of the lower mold 8, and a liquid inlet valve is installed on the liquid inlet pipe, so that coolant can be added into the cooling chamber 10 through the liquid inlet pipe, and the sealing of the cooling chamber 10 can be improved after the liquid inlet valve is closed.

[0035] Specifically, the cooling component 9 includes an exchange box 901 disposed on both sides of the lower mold 8, a liquid guide bucket 905 is fixed inside the exchange box 901, and a liquid guide pipe 906 is connected to the bottom of the liquid guide bucket 905, and a liquid guide plate 908 is provided on one side of the inner part of the exchange box 901. The liquid guide pipe 906 is in a snake shape and is located above the liquid guide plate 908, so that hot water can flow into the liquid guide pipe 906 and flow to the top of the liquid guide plate 908 after flowing through the liquid guide pipe 906. A baffle 902 and a semiconductor refrigeration sheet 903 are respectively installed on one side of the exchange box 901. The semiconductor refrigeration sheet 903 can cool down the hot water inside the exchange box 901, and the cooled water can flow back to the cooling chamber 10 through the one-way valve 909. The semiconductor refrigeration sheet 903 is located inside the baffle 902. A vent is provided on the top of the baffle 902. The baffle 902 can protect the semiconductor refrigeration sheet 903. The vent is provided to facilitate ventilation and heat dissipation.

[0036] Specifically, a plurality of liquid guide holes 907 are provided between the exchange box 901 and the lower mold 8, and a one-way valve 909 is provided between the lower mold 8 and the exchange box 901. The setting of the one-way valve 909 allows the coolant to flow back into the cooling chamber 10, while the liquid in the cooling chamber 10 cannot flow back into the exchange box 901 through the one-way valve 909. A cooling chamber 10 is provided inside the lower mold 8, and the cooling chamber 10 is connected with the liquid guide hole 907. The cooling liquid can be stored in the cooling chamber 10, and at the same time, it is convenient for the water with higher temperature in the cooling chamber 10 to flow into the exchange box 901 through the liquid guide hole 907. A buffer component 7 is provided on the top of the exchange box 901. Embodiment 2:

[0037] On the basis of the above-mentioned embodiment 1, when the upper mold 5 moves downward to close the mold with the lower mold 8, the bottom of the upper mold 5 will collide with the top of the lower mold 8. In order to avoid damage to the mold due to excessive collision force, the following structure will be set to buffer the impact force generated when the upper mold 5 moves downward.

[0038] See also Figure 1-Figure 3The buffer assembly 7 includes a slide bar 701 and a buffer spring 703 arranged on the top of the exchange box 901. The outer wall of the slide bar 701 is sleeved with a slide seat 702. The slide seat 702 can move on the slide bar 701. At the same time, the arrangement of the slide seat 702 and the slide bar 701 can guide the upper mold 5. The bottom of the slide seat 702 is connected to the top of the buffer spring 703. The buffer spring 703 is sleeved on the outer wall of the slide bar 701. When the slide seat 702 moves downward, it will squeeze the buffer spring 703, so that the buffer spring 703 is compressed to buffer the impact force generated when the upper mold 5 moves downward. Both sides of the upper mold 5 are connected to the slide seat 702. The upper mold 5 is slidably connected to the slide bar 701 through the slide seat 702. The top of the slide bar 701 is connected to the bottom of the top plate 3. When the upper mold 5 moves, it will drive the slide seat 702 to slide on the slide bar 701, thereby improving the stability of the upper mold 5 when moving. Embodiment three:

[0039] On the basis of the above-mentioned first embodiment, after the upper mold 5 moves downward to close the mold with the lower mold 8, the following structure is provided to improve the sealing performance after closing the mold.

[0040] See also Figure 2-Figure 3 A sealing groove 11 is provided at the top of the lower mold 8, and a sealing ring 12 is provided at the bottom of the upper mold 5. The sealing ring 12 is adapted to the sealing groove 11. When the upper mold 5 moves downward and closes with the lower mold 8, the upper mold 5 will drive the sealing ring 12 to move downward, so that the sealing ring 12 is first inserted into the sealing groove 11.

[0041] The working principle of the utility model is as follows: first, the user can install the device and connect the power supply, then open the liquid inlet valve, add the coolant into the cooling chamber 10 through the liquid inlet pipe, and close the liquid inlet valve after adding, then start the cylinder 4, the cylinder 4 can make the piston rod extend, and then drive the upper mold 5 to move downward, and the upper mold 5 drives the slide 702 to slide on the slide rod 701, and when the slide 702 moves downward, it squeezes the buffer spring 703, so that the buffer spring 703 is compressed, so as to buffer the impact force generated when the upper mold 5 moves downward, and after the upper mold 5 and the lower mold 8 are molded together, the sealing ring 12 at the bottom of the upper mold 5 moves into the sealing groove 11, so as to improve the sealing performance of the upper mold 5 and the lower mold 8 after the mold is molded together;

[0042] Then the raw material is poured into the mold through the casting port 6 so that the raw material can be formed inside the mold. At the same time, the coolant inside the cooling chamber 10 can cool the raw material. Since the density of cold water is greater than that of hot water between 4 degrees Celsius and 100 degrees Celsius, and the coolant inside the cooling chamber 10 continues to cool the raw material inside the lower mold 8, the temperature of the coolant will increase, and the coolant with a higher temperature will be located above the coolant with a lower temperature. At this time, the coolant with a higher temperature will flow into the liquid guide hopper 905 in the exchange box 901 through the liquid guide hole 907. At this time The semiconductor refrigeration plate 903 can be started, and the coolant will flow into the liquid conduit 906 through the liquid hole, so that the liquid flows in the liquid conduit 906. The liquid conduit 906 is snake-shaped, which can prolong the flow time of the liquid. After the liquid flows out through the liquid conduit 906, it will flow onto the liquid guide plate 908. After being guided by the liquid guide plate 908, the liquid will flow to the inner side of the exchange box 901 close to the semiconductor refrigeration plate 903, which is convenient for the semiconductor refrigeration plate 903 to cool down the liquid. The cooled water can flow back to the inside of the cooling chamber 10 through the one-way valve 909 for recycling.

[0043] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. A forming device for producing a burner head, comprising a base plate (1), characterized in that: A lower mold (8) is installed on the top of the bottom plate (1), cooling components (9) are provided on both sides of the lower mold (8), and the cooling components (9) include exchange boxes (901) arranged on both sides of the lower mold (8), a liquid guide bucket (905) is fixed inside the exchange box (901), and a liquid guide tube (906) is connected to the bottom of the liquid guide bucket (905), a liquid guide plate (908) is provided on one side of the inner part of the exchange box (901), a baffle (902) and a semiconductor cooling plate (903) are respectively installed on one side of the exchange box (901), a plurality of liquid guide holes (907) are provided between the exchange box (901) and the lower mold (8), a one-way valve (909) is provided between the lower mold (8) and the exchange box (901), and a buffer component (7) is provided on the top of the exchange box (901).

2. A molding device for producing a burner head according to claim 1, characterized in that: The buffer assembly (7) comprises a slide bar (701) and a buffer spring (703) arranged on the top of the exchange box (901); the outer wall of the slide bar (701) is sleeved with a slide seat (702).

3. A forming device for producing a burner head according to claim 2, characterized in that: The bottom of the sliding seat (702) is connected to the top of the buffer spring (703), and the buffer spring (703) is sleeved on the outer wall of the sliding rod (701).

4. A forming device for producing a burner head according to claim 1, characterized in that: Support columns (2) are fixed on both sides of the top of the bottom plate (1), and a top plate (3) is provided at the top of the support column (2).

5. A forming device for producing a burner head according to claim 4, characterized in that: Cylinders (4) are installed on both sides of the top of the top plate (3), and an upper mold (5) is installed on the output end of the cylinder (4) via a piston rod.

6. A forming device for producing a burner head according to claim 5, characterized in that: Both sides of the upper mold (5) are connected to the slide seat (702), and the upper mold (5) is slidably connected to the slide rod (701) through the slide seat (702), and the top end of the slide rod (701) is connected to the bottom of the top plate (3).

7. A burner head production molding device according to claim 1, characterized in that: A cooling cavity (10) is provided inside the lower mold (8), and the cooling cavity (10) is connected to the liquid guide hole (907).

8. A forming device for producing a burner head according to claim 5, characterized in that: A sealing groove (11) is provided at the top of the lower mold (8), and a sealing ring (12) is provided at the bottom of the upper mold (5), wherein the sealing ring (12) is adapted to fit the sealing groove (11).

9. A forming device for producing a burner head according to claim 1, characterized in that: A liquid through hole (904) is provided at the bottom of the liquid guiding hopper (905), and the liquid through hole (904) is connected to the liquid guiding tube (906).

10. A forming device for producing a burner head according to claim 1, characterized in that: The liquid guiding tube (906) is in the shape of a snake and is located above the liquid guiding plate (908).

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