Full-chip digital power distribution module for passenger car

Abstract

A full-chip digital power distribution module for a passenger car comprises a shell, the shell is of a rectangular structure and is of a cast aluminum structure, current binding posts are arranged on the periphery of the shell, a left intelligent high-edge module is installed on the upper left portion in the shell, a power system is installed in the middle of the upper portion in the shell, and a power source is installed in the middle of the shell. A right intelligent high-side module is mounted at the right upper part in the shell; the power distribution module provided by the utility model has the advantages of high system integration level, compact structure, centralized display of vehicle states, centralized display of equipment information, centralized display of alarm information and integration of whole vehicle data, can realize informatization and digital transformation of buses, and integrates the CAN communication interface, the temperature detection system, the power supply system and the wake-up system, so that the power distribution module is convenient to use. The internal space of the passenger car can be saved to the greatest extent, meanwhile, the temperature detection system is additionally arranged to detect the short circuit and overcurrent conditions of an internal circuit, wire burning is avoided, and the probability that the passenger car is on fire is reduced.

Description

Technical Field

[0001] The utility model relates to the field of integrated power distribution modules for new energy pure electric vehicles, and in particular to a full-chip digital power distribution module for buses. Background Art

[0002] A new type of new energy pure electric bus is designed to adapt to the development trend of public transportation digitization, informatization and intelligence, effectively integrate vehicle data and centralized information display, break through the information islands between different devices, and guide drivers to focus on safe driving;

[0003] Large, medium and small full-chip digital power distribution modules use power chips to replace fuses that are prone to failure and fire, which can realize digital management of the current of the entire vehicle. Each line can be instantly protected when short circuit, overcurrent, or high temperature occurs, eliminating burnt wires and greatly reducing the probability of vehicle fire. Taking all the above reasons into consideration, it is necessary to design a new full-chip digital power distribution module device.

[0004] Based on this, in order to solve the problems of digital management of the entire bus and reduce the probability of vehicle fire, this design proposes a full-chip digital power distribution module for buses. Utility Model Content

[0005] The utility model aims to provide a full-chip digital power distribution module for buses.

[0006] A full-chip digital power distribution module for a bus, comprising: a shell, the shell structure is a rectangular structure, the shell is a cast aluminum structure, current terminals are arranged around the shell, wherein a left intelligent high-side module is installed in the upper left part of the shell, a power supply system is installed in the middle position of the upper part of the shell, a right intelligent high-side module is installed in the upper right part of the shell, an MCU microcontroller is installed at the bottom of the power supply system, an operating status indicator light is installed at the bottom of the MCU microcontroller, a fault indicator light is installed at the bottom of the operating status indicator light, and a temperature indicator light is installed at the bottom of the left intelligent high-side module. A monitoring system, wherein a pre-charging circuit is installed at the bottom of the temperature monitoring system, a wake-up management system is installed at the bottom of the pre-charging circuit, a switch input acquisition module is installed at the bottom of the wake-up management system, a CAN communication module is installed at the bottom of the switch input acquisition module, a power grounding terminal is provided at the bottom of the shell, the upper right side of the power grounding terminal is connected to the left end of the resistor R, the right end of the resistor R is connected to the casing, the lower right side of the power grounding terminal is connected to the left side of the capacitor C, the right side of the capacitor C is connected to the casing, the lower part of the casing is connected to the vehicle body grounding terminal, and the lower part of the casing is connected to the vehicle body grounding terminal.

[0007] Preferably, the left end of the left intelligent high-side module is connected to the P2, P3, P4, P5, P6, P7, P8, P9, and P10 potentials of the bus from top to bottom in sequence, the model of the left intelligent high-side module is MC06XS4200, the right end of the left intelligent high-side module is connected to the ADC analog-to-digital converter of the MCU microcontroller, the right end of the intelligent high-side module is connected to the SPI interface of the MCU microcontroller, the right end of the left intelligent high-side module is also connected to the lower part of the diode, and the upper part of the diode is connected to the P1 potential of the bus.

[0008] Preferably, the upper part of the power supply system is connected to the lower part of the diode, the upper part of the diode is connected to the P1 potential of the bus, the upper part of the power supply system is also connected to the right intelligent high-side module, the right end of the power supply system is connected to the +5V system voltage, and the power supply system is internally provided with a P1 voltage monitoring module, a VBAT voltage monitoring module, and a power supply circuit switching module.

[0009] Preferably, SPI interfaces are installed on the left and right ends of the upper part of the MCU microcontroller, a GPIO general input and output interface is installed on the lower left end, an ADC analog-to-digital converter is installed on the right side of the GPIO general input and output interface, and CAN interfaces are installed on the left and right sides of the lower part of the MCU microcontroller.

[0010] Preferably, the right end of the temperature monitoring system is connected to the ADC analog-to-digital converter of the MCU microcontroller, and the temperature of the P1 to P10 potentials is monitored in the temperature monitoring system. The temperature monitoring system also monitors the temperature inside the machine.

[0011] Preferably, the right end of the pre-charging circuit is connected to a GPIO general input and output interface, the interior of the pre-charging circuit is connected to the right smart high side, and the interior of the pre-charging circuit is connected to the P2, P6, P4, and P7 potentials of the left smart high side.

[0012] Preferably, the right end of the wake-up management system is connected to the wake-up contact.

[0013] Preferably, the right end of the switch quantity input acquisition module is connected to the GPIO interface of the MCU microcontroller.

[0014] Preferably, the right end of the CAN communication module is respectively connected to a transmitting TX end and a receiving RX end, and a filtering network is arranged inside the CAN communication module.

[0015] The beneficial effects of the above scheme are:

[0016] 1. The power distribution module of the utility model has high system integration, compact structure, centralized display of vehicle status, centralized display of equipment information, centralized display of alarm information, and integration of whole vehicle data, which can realize the information and digital transformation of public transportation. At the same time, the power distribution module integrates CAN communication interface, temperature detection system, power supply system and wake-up system, which can save the internal space of the bus to the greatest extent. At the same time, the addition of temperature detection system can detect short circuit and overcurrent of internal lines, avoid burning wires, and reduce the probability of vehicle fire. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a block diagram of the internal modules of the utility model. DETAILED DESCRIPTION

[0018] The present invention is further explained in detail below in conjunction with the accompanying drawings of the specification, but the protection scope of the present invention is not limited thereto.

[0019] according to Figure 1 As shown, a full-chip digital power distribution module for buses in the utility model comprises: a shell, the shell structure is a rectangular structure, the shell is a cast aluminum structure, current terminals are arranged around the shell, wherein a left intelligent high-side module is installed in the upper left part of the shell, a power supply system is installed in the middle position of the upper part of the shell, a right intelligent high-side module is installed in the upper right part of the shell, an MCU microcontroller is installed in the lower part of the power supply system, an operating status indicator light is installed in the lower part of the MCU microcontroller, a fault indicator light is installed in the lower part of the operating status indicator light, and the lower part of the left intelligent high-side module is installed in the lower part of the power supply system. A temperature monitoring system is installed, a pre-charging circuit is installed at the bottom of the temperature monitoring system, a wake-up management system is installed at the bottom of the pre-charging circuit, a switch input acquisition module is installed at the bottom of the wake-up management system, a CAN communication module is installed at the bottom of the switch input acquisition module, a power grounding terminal is provided at the bottom of the shell, the upper right side of the power grounding terminal is connected to the left end of the resistor R, the right end of the resistor R is connected to the casing, the lower right side of the power grounding terminal is connected to the left side of the capacitor C, the right side of the capacitor C is connected to the casing, the lower part of the casing is connected to the vehicle body grounding terminal, and the lower part of the casing is connected to the vehicle body grounding terminal.

[0020] Specifically, the left end of the left intelligent high-side module is connected to the P2, P3, P4, P5, P6, P7, P8, P9, and P10 potentials of the bus from top to bottom, the model of the left intelligent high-side module is MC06XS4200, the right end of the left intelligent high-side module is connected to the ADC analog-to-digital converter of the MCU microcontroller, the right end of the intelligent high-side module is connected to the SPI interface of the MCU microcontroller, the right end of the left intelligent high-side module is also connected to the lower part of the diode, the upper part of the diode is connected to the P1 potential of the bus, the current flowing through the upper part of the diode is 200A, the intelligent high-side module is connected to P2 to flow 50A current, the intelligent high-side module is connected to P3, P4, P5, P6, and P7 to flow 30A current, the intelligent high-side module is connected to P7 and P8 to flow 50A current, and the intelligent high-side module is connected to P10 to flow 120A current.

[0021] Specifically, the upper part of the power system is connected to the lower part of the diode and the voltage at both ends is 24V. The power system is provided with a P1 voltage monitoring module, a VBAT voltage monitoring module, and a power circuit switching module. The upper part of the diode is connected to the P1 potential of the bus, and the right end of the power system is connected to the +5V system voltage. The upper part of the power system is also connected to the right intelligent high-side module. The connector pin CN of the right intelligent high-side connection represents the wiring harness end plug-in, and the corresponding wiring harness plug-in is as follows: .

[0022] Specifically, SPI interfaces are installed on the left and right ends of the upper part of the MCU microcontroller, a GPIO general input and output interface is installed on the lower left end, an ADC analog-to-digital converter is installed on the right side of the GPIO general input and output interface, and CAN interfaces are installed on the left and right sides of the lower part of the MCU microcontroller.

[0023] Specifically, the right end of the temperature monitoring system is connected to the ADC analog-to-digital converter of the MCU microcontroller, and the temperature of the P1 to P10 potentials is monitored in the temperature monitoring system. The temperature monitoring system also monitors the temperature inside the machine.

[0024] Specifically, the right end of the pre-charging circuit is connected to the GPIO general input and output interface, the interior of the pre-charging circuit is connected to the right smart high side, and the interior of the pre-charging circuit is connected to the P2, P6, P4, and P7 potentials of the left smart high side.

[0025] Specifically, the right end of the wake-up management system is connected to the wake-up contact, and the left end of the wake-up management system is connected to the wiring harness plug-in. Figure 1 The H on the left side of the wake-up management system represents a high level valid. Figure 1 The L on the left side of the wake-up management system represents a low level valid.

[0026] Specifically, the right end of the switch input acquisition module is connected to the GPIO interface of the MCU microcontroller, and the left side of the switch input acquisition is connected to the wiring harness plug-in. The left side H / L represents high or low level valid and is configurable.

[0027] Specifically, the right end of the CAN communication module is respectively connected to the transmitting TX end and the receiving RX end, a filtering network is arranged inside the CAN communication module, the left side of the CAN communication module is connected to the vehicle network, and a 120 ohm resistor is optionally added to the CAN communication shell.

[0028] Working principle: A full-chip digital power distribution module for buses, including: a shell, a power system inside the shell, an MCU microcontroller system, a temperature monitoring system, a pre-charging circuit, a wake-up management system, a switch quantity acquisition module, and a CAN communication module. When working, each interface is connected, and each module is controlled through the coordinated operation of the software. The power system monitors the voltage at P1 and also monitors the VBAT voltage circuit. At the same time, the power system also controls the switching of the power circuit. Since intelligent high-side modules are installed on the left and right sides of the module, the system module can be accurately controlled through the use of the intelligent high-side algorithm;

[0029] After the car is started and powered on, each module cooperates with each other. When abnormal temperature occurs, the temperature monitoring system will use the ADC analog-to-digital converter. At this time, the intelligent high-side module will analyze the data of the temperature monitoring system, and then collect it through the switch input, and transmit it to the MCU microcontroller through the GPIO interface. The MCU microcontroller will feedback the information on the car screen through CAN communication. At the same time, the intelligent high-side module can also control the wake-up management system, handle abnormal temperature conditions in the car, and control the cooling equipment to ensure that each system can work normally, ensure overheating inside the module, and reduce the probability of fire in the module. At the same time, the CAN communication interface integrated in the module can support remote monitoring of all data.

Claims

1. A full-chip digital power distribution module for buses, comprising: The shell has a rectangular structure and a cast aluminum structure. Current terminals are arranged around the shell. The shell is characterized in that a left intelligent high-side module is installed in the upper left part of the shell, a power supply system is installed in the middle position of the upper part of the shell, a right intelligent high-side module is installed in the upper right part of the shell, an MCU microcontroller is installed at the bottom of the power supply system, an operating status indicator light is installed at the bottom of the MCU microcontroller, a fault indicator light is installed at the bottom of the operating status indicator light, a temperature monitoring system is installed at the bottom of the left intelligent high-side module, a pre-charging circuit is installed at the bottom of the temperature monitoring system, a wake-up management system is installed at the bottom of the pre-charging circuit, a switch input acquisition module is installed at the bottom of the wake-up management system, and a CAN communication module is installed at the bottom of the switch input acquisition module. A power ground terminal is provided at the bottom of the shell, the upper right part of the power ground terminal is connected to the left end of the resistor R, the right end of the resistor R is connected to the casing, the lower right part of the power ground terminal is connected to the left side of the capacitor C, the right side of the capacitor C is connected to the casing, and the lower part of the casing is connected to the vehicle body ground terminal.

2. A full-chip digital power distribution module for buses as claimed in claim 1, characterized in that: The left end of the left intelligent high-side module is connected to the P2, P3, P4, P5, P6, P7, P8, P9, and P10 potentials of the bus from top to bottom. The model of the left intelligent high-side module is MC06XS4200. The right end of the left intelligent high-side module is connected to the ADC analog-to-digital converter of the MCU microcontroller. The right end of the intelligent high-side module is connected to the SPI interface of the MCU microcontroller. The right end of the left intelligent high-side module is also connected to the lower part of the diode, and the upper part of the diode is connected to the P1 potential of the bus.

3. A full-chip digital power distribution module for buses as claimed in claim 1, characterized in that: The upper part of the power supply system is connected to the lower part of the diode, and the upper part of the diode is connected to the P1 potential of the bus. The upper part of the power supply system is also connected to the right intelligent high-side module. The right end of the power supply system is connected to the +5V system voltage. The power supply system is internally provided with a P1 voltage monitoring module, a VBAT voltage monitoring module, and a power circuit switching module.

4. A full-chip digital power distribution module for buses as claimed in claim 1, characterized in that: The MCU microcontroller is provided with SPI interfaces on both left and right ends of the upper part, a GPIO general input and output interface is provided on the lower left end, an ADC analog-to-digital converter is provided on the right side of the GPIO general input and output interface, and a CAN interface is provided on both left and right sides of the lower part of the MCU microcontroller.

5. The full-chip digital power distribution module for buses according to claim 1, characterized in that: The right end of the temperature monitoring system is connected to the ADC analog-to-digital converter of the MCU microcontroller. The temperature monitoring system monitors the temperature of the P1 to P10 potentials. The temperature monitoring system also monitors the temperature inside the machine.

6. A full-chip digital power distribution module for buses as claimed in claim 1, characterized in that: The right end of the pre-charging circuit is connected to the GPIO general input and output interface, the interior of the pre-charging circuit is connected to the right smart high side, and the interior of the pre-charging circuit is connected to the P2, P6, P4, and P7 potentials of the left smart high side.

7. A full-chip digital power distribution module for buses as claimed in claim 1, characterized in that: The right end of the wake-up management system is connected to the wake-up contact.

8. The full-chip digital power distribution module for buses according to claim 1, characterized in that: The right end of the switch value input acquisition module is connected to the GPIO interface of the MCU microcontroller.

9. The full-chip digital power distribution module for buses according to claim 1, characterized in that: The right end of the CAN communication module is connected to the transmitting TX end and the receiving RX end respectively, and a filtering network is provided inside the CAN communication module.

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