Visual inspection device for semiconductor packaging quality

Abstract

The utility model relates to the technical field of industrial detection, and discloses a semiconductor packaging quality visual inspection device, which comprises a main body mechanism, a translation mechanism and an auxiliary mechanism, the translation mechanism is positioned on the upper side of the main body mechanism, the auxiliary mechanism is positioned on the outer side of the main body mechanism, and the main body mechanism comprises an equipment main body, a support frame and a placement assembly. The supporting frame is fixedly installed at the rear end of the equipment body, the placing assembly is movably installed in the equipment body and comprises a containing groove, a partition plate, a finished product box and a defective product box, the containing groove is fixedly formed in the equipment body, the partition plate is fixedly installed at the upper end of the containing groove, and the finished product box is movably installed in the containing groove; according to the utility model, by installing the main body mechanism, when people use the visual detection device for the semiconductor packaging quality, detected objects can be classified and placed in the finished product box and the defective product box.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial detection, in particular to a semiconductor packaging quality visual detection device. Background Art

[0002] Semiconductor is a material with electrical conductivity between that of insulator and conductor. Its electrical conductivity can be easily controlled and can be used as a component material for information processing. From the perspective of science and technology or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use changes in the electrical conductivity of semiconductors to process information.

[0003] Prior art CN214894886U A semiconductor packaging quality visual inspection device. The utility model discloses a semiconductor packaging quality visual inspection device, comprising a conveying mechanism, a carrying platform, a pick-and-place mechanism, a flipping mechanism and a visual camera. The pick-and-place mechanism is arranged above the discharge end of the conveying mechanism along the conveying direction, and a carrying platform is arranged below the discharge end of the conveying mechanism. The product to be tested is transferred from the conveying mechanism to the carrying platform through the pick-and-place mechanism. The flipping mechanism is arranged at a distance from the discharge end of the conveying mechanism in the conveying direction. A visual camera is arranged on the flipping mechanism. The visual camera is flipped up and down in a vertical plane through the flipping mechanism. The product to be tested on the conveying mechanism is transferred to the carrying platform through the pick-and-place mechanism. During the transfer process, the product to be tested is inspected on both sides by the visual camera.

[0004] In actual use, a semiconductor packaging quality visual inspection device of the prior art usually requires people to manually classify and place objects after inspection, which is inconvenient for classifying and placing objects to be inspected, and increases labor costs. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] The utility model aims to provide a semiconductor packaging quality visual inspection device to solve the problem in the above background technology that it is inconvenient to classify and place objects to be inspected.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor packaging quality visual inspection device, comprising a main mechanism, a translation mechanism and an auxiliary mechanism, wherein the translation mechanism is located on the upper side of the main mechanism, and the auxiliary mechanism is located on the outer side of the main mechanism, and the main mechanism comprises an equipment body, a support frame and a placement component, wherein the support frame is fixedly installed at the rear end of the equipment body, and the placement component is movably installed inside the equipment body;

[0009] The placement component includes a accommodating groove, a partition, a finished product box and a defective product box. The accommodating groove is fixedly arranged inside the equipment body, the partition is fixedly installed on the upper end of the accommodating groove, the finished product box is movably installed inside the accommodating groove, and the defective product box is movably installed inside the accommodating groove.

[0010] Preferably, the main mechanism also includes a fixed frame, a first visual camera, a second visual camera and a transmission device, the fixed frame is fixedly installed on the right end of the equipment body, the first visual camera is fixedly installed inside the equipment body, the second visual camera is fixedly installed inside the fixed frame, and the transmission device is fixedly installed on the upper end of the equipment body.

[0011] Preferably, the translation mechanism includes a baffle, a movable ring, a first motor, a threaded rod, an adjustment slider, an electric push rod, a second motor and an adsorption device, and the baffle is fixedly mounted on the front end of the support frame.

[0012] Preferably, the movable ring is fixedly mounted on the front end of the baffle, the first motor is fixedly mounted on the surface of the support frame, the threaded rod is movably mounted on the transmission end of the front end of the first motor, the adjusting slider is movably mounted on the outer end of the threaded rod, the electric push rod is fixedly mounted on the lower end of the adjusting slider, the second motor is fixedly mounted on the transmission end of the lower end of the electric push rod, and the adsorption device is fixedly mounted on the transmission end of the lower end of the second motor.

[0013] Preferably, the auxiliary mechanism includes a mobile base, universal wheels, a control panel and a touch screen, and the mobile base is fixedly mounted at the lower end of the device body.

[0014] Preferably, the universal wheel is movably mounted at the lower end of the mobile base, the control panel is fixedly mounted at the front end of the device body, the touch screen is fixedly mounted at the front end of the control panel, and the control panel is electrically connected to the first visual camera, the second visual camera, the transmission device, the first motor, the electric push rod, the second motor, the adsorption device and the touch screen.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The semiconductor packaging quality visual inspection device, by installing the main body mechanism, can enable people to classify the objects after inspection and place them inside the finished product box and the defective product box when using the semiconductor packaging quality visual inspection device;

[0017] 2. The semiconductor packaging quality visual inspection device can detect the bottom of the object to be inspected by installing a second visual camera, and can detect the object to be inspected by installing a second motor and an adsorption device so that the second motor drives the adsorption device to rotate, and detects the object to be inspected by the first visual camera;

[0018] 3. The semiconductor packaging quality visual inspection device can be installed with universal wheels so that people can move the device more quickly. The control panel and touch screen can be installed to make the device more intelligent and convenient for people to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the support frame of the utility model;

[0021] Figure 3 This is a three-dimensional structural diagram of the transmission device of the utility model;

[0022] Figure 4 It is a schematic diagram of the enlarged structure of the local details of the translation mechanism of the utility model.

[0023] In the figure: 1. Main mechanism; 101. Equipment body; 102. Support frame; 103. Placement component; 1031. Accommodating groove; 1032. Partition; 1033. Finished product box; 1034. Defective product box; 104. Fixed frame; 105. First visual camera; 106. Second visual camera; 107. Transmission device; 2. Translation mechanism; 201. Baffle; 202. Movable ring; 203. First motor; 204. Threaded rod; 205. Adjustment slider; 206. Electric push rod; 207. Second motor; 208. Adsorption device; 3. Auxiliary mechanism; 301. Mobile base; 302. Universal wheel; 303. Control panel; 304. Touch screen. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-Figure 4 The utility model provides a technical solution: a semiconductor packaging quality visual inspection device, comprising a main mechanism 1, a translation mechanism 2 and an auxiliary mechanism 3, wherein the translation mechanism 2 is located on the upper side of the main mechanism 1, and the auxiliary mechanism 3 is located on the outer side of the main mechanism 1, and the main mechanism 1 comprises an equipment body 101, a support frame 102 and a placement component 103, wherein the support frame 102 is fixedly installed at the rear end of the equipment body 101, and the placement component 103 is movably installed inside the equipment body 101;

[0026] The placement component 103 includes a accommodating groove 1031, a partition 1032, a finished product box 1033 and a defective product box 1034. The accommodating groove 1031 is fixedly arranged inside the equipment body 101, the partition 1032 is fixedly installed at the upper end of the accommodating groove 1031, the finished product box 1033 is movably installed inside the accommodating groove 1031, and the defective product box 1034 is movably installed inside the accommodating groove 1031.

[0027] The main mechanism 1 also includes a fixed frame 104, a first visual camera 105, a second visual camera 106 and a transmission device 107. The fixed frame 104 is fixedly installed at the right end of the device body 101, the first visual camera 105 is fixedly installed inside the device body 101, the second visual camera 106 is fixedly installed inside the fixed frame 104, and the transmission device 107 is fixedly installed at the upper end of the device body 101. The translation mechanism 2 includes a baffle 201, a movable ring 202, a first motor 203, a threaded rod 204, an adjustment slider 205, an electric push rod 206, a second motor 207 and an adsorption device 208. The baffle 201 is fixedly installed at the front end of the support frame 102, the movable ring 202 is fixedly installed at the front end of the baffle 201, the first motor 203 is fixedly installed on the surface of the support frame 102, the threaded rod 204 is movably installed at the transmission end of the front end of the first motor 203, the adjustment slider 205 is movably installed at the outer end of the threaded rod 204, and the electric push rod 206 is fixedly installed at the adjusting slider 205. At the lower end, the second motor 207 is fixedly mounted on the transmission end of the lower end of the electric push rod 206, and the adsorption device 208 is fixedly mounted on the transmission end of the lower end of the second motor 207. When the semiconductor packaging quality visual inspection device needs to be used, the device is first brought to the workplace, and the object to be inspected is placed on the upper end of the transmission device 107. The object is transmitted through the transmission device 107, and the first motor 203 drives the threaded rod 204 to rotate, so that the adjustment slider 205 is translated, and then the components below the adjustment slider 205 are moved. The electric push rod 206 pushes the second motor 207 and the adsorption device 208 to downwardly adsorb the object to be inspected, and move the object to the upper end of the second visual camera 106 to inspect the object to be inspected. The second motor 207 drives the adsorption device 208 to rotate, so that the object to be inspected rotates, and the first visual camera 105 inspects the object to be inspected. After the inspection, the object is placed in the finished product box 1033 or the defective box 1034 through the translation mechanism 2.

[0028] The auxiliary mechanism 3 includes a mobile base 301, a universal wheel 302, a control panel 303 and a touch screen 304. The mobile base 301 is fixedly installed at the lower end of the device body 101, the universal wheel 302 is movably installed at the lower end of the mobile base 301, the control panel 303 is fixedly installed at the front end of the device body 101, the touch screen 304 is fixedly installed at the front end of the control panel 303, the control panel 303 is electrically connected to the first visual camera 105, the second visual camera 106, the transmission device 107, the first motor 203, the electric push rod 206, the second motor 207, the adsorption device 208 and the touch screen 304, and the universal wheel 302 is movably installed at the lower end of the mobile base 301, so that people can move the device more quickly, and people can control the device through the control panel 303 and the touch screen 304.

[0029] Working principle: When the semiconductor packaging quality visual inspection device is needed, the device is first brought to the work site, and the object to be inspected is placed on the upper end of the transmission device 107. The object is transmitted through the transmission device 107, and the first motor 203 drives the threaded rod 204 to rotate, so that the adjustment slider 205 is translated, and then the components below the adjustment slider 205 are moved. The electric push rod 206 pushes the second motor 207 and the adsorption device 208 downward to adsorb the object to be inspected, and moves the object to the upper end of the second visual camera 106 to inspect the object to be inspected. The second motor 207 drives the adsorption device 208 to rotate, so that the object to be inspected rotates, and the first visual camera 105 inspects the object to be inspected. After the inspection, the object is placed in the finished product box 1033 or the defective box 1034 through the translation mechanism 2. The universal wheel 302 is movably installed at the lower end of the mobile base 301, so that people can move the device more quickly, and people can control the device through the control panel 303 and the touch screen 304.

[0030] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A semiconductor packaging quality visual inspection device, comprising a main mechanism (1), a translation mechanism (2) and an auxiliary mechanism (3), characterized in that: The translation mechanism (2) is located on the upper side of the main mechanism (1), and the auxiliary mechanism (3) is located on the outer side of the main mechanism (1). The main mechanism (1) comprises a device body (101), a support frame (102), and a placement component (103). The support frame (102) is fixedly mounted on the rear end of the device body (101), and the placement component (103) is movably mounted inside the device body (101); The placement component (103) comprises a receiving groove (1031), a partition (1032), a finished product box (1033) and a defective product box (1034); the receiving groove (1031) is fixedly arranged inside the device body (101); the partition (1032) is fixedly installed at the upper end of the receiving groove (1031); the finished product box (1033) is movably installed inside the receiving groove (1031); and the defective product box (1034) is movably installed inside the receiving groove (1031).

2. A semiconductor packaging quality visual inspection device according to claim 1, characterized in that: The main body mechanism (1) further comprises a fixing frame (104), a first visual camera (105), a second visual camera (106) and a transmission device (107); the fixing frame (104) is fixedly mounted on the right end of the device body (101); the first visual camera (105) is fixedly mounted inside the device body (101); the second visual camera (106) is fixedly mounted inside the fixing frame (104); and the transmission device (107) is fixedly mounted on the upper end of the device body (101).

3. A semiconductor packaging quality visual inspection device according to claim 2, characterized in that: The translation mechanism (2) comprises a baffle (201), a movable ring (202), a first motor (203), a threaded rod (204), an adjustment slider (205), an electric push rod (206), a second motor (207) and an adsorption device (208); the baffle (201) is fixedly mounted on the front end of the support frame (102).

4. A semiconductor packaging quality visual inspection device according to claim 3, characterized in that: The movable ring (202) is fixedly mounted on the front end of the baffle (201); the first motor (203) is fixedly mounted on the surface of the support frame (102); the threaded rod (204) is movably mounted on the transmission end of the front end of the first motor (203); the adjusting slider (205) is movably mounted on the outer end of the threaded rod (204); the electric push rod (206) is fixedly mounted on the lower end of the adjusting slider (205); the second motor (207) is fixedly mounted on the transmission end of the lower end of the electric push rod (206); and the adsorption device (208) is fixedly mounted on the transmission end of the lower end of the second motor (207).

5. A semiconductor packaging quality visual inspection device according to claim 4, characterized in that: The auxiliary mechanism (3) comprises a movable base (301), universal wheels (302), a control panel (303) and a touch screen (304); the movable base (301) is fixedly mounted on the lower end of the device body (101).

6. A semiconductor packaging quality visual inspection device according to claim 5, characterized in that: The universal wheel (302) is movably mounted on the lower end of the mobile base (301); the control panel (303) is fixedly mounted on the front end of the device body (101); the touch screen (304) is fixedly mounted on the front end of the control panel (303); and the control panel (303) is electrically connected to the first visual camera (105), the second visual camera (106), the transmission device (107), the first motor (203), the electric push rod (206), the second motor (207), the adsorption device (208) and the touch screen (304).

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