Heat dissipation base of notebook computer

Abstract

The utility model discloses a heat dissipation base of a notebook computer, and belongs to the technical field of heat dissipation devices of notebook computers. The heat dissipation base comprises a shell and a heat dissipation assembly, an air inlet is formed in the top face of the shell, an air outlet is formed in the bottom face of the shell, and the heat dissipation assembly is arranged between the air inlet and the air outlet. The heat dissipation assembly comprises a cover body and a fan, the cover body guides air to flow from the air inlet to the air outlet, and the fan is arranged in the cover body. According to the heat dissipation base, the cover body can reduce generation of turbulent flow, and noise is lowered; and the filler in the cover body plays a sound insulation role.

Description

Technical Field

[0001] The present application relates to the technical field of notebook computer cooling devices, and in particular to a notebook computer cooling base. Background Art

[0002] The patent document with announcement number CN212623950U discloses a portable low-noise air pressure difference notebook heat sink, in which a fan is installed in the base, and a rectifying wind guide cover is fixed to the outside of the fan. The outer size of the sound-absorbing material layer is consistent with the inner size of the base, and the sound-absorbing material layer and the base are attached to each other and leave an air intake channel for the fan.

[0003] The patent document with announcement number CN208314691U discloses a silent laptop computer radiator, in which a ventilation outlet is provided at a rack position corresponding to a low-speed fan below the radiator, and a sound-absorbing surface layer is provided on the inner surface of the ventilation outlet, and the structure of the sound-absorbing surface layer is a porous cotton-like structure.

[0004] In the prior art, the noise problem of the notebook computer cooling device is solved mainly by setting a sound insulation material on the periphery of the fan. The processing or installation process of the sound insulation material is difficult and costly. Summary of the invention

[0005] The present application provides a notebook computer heat dissipation base. The heat dissipation base according to the present application can overcome at least one or more problems existing in the prior art.

[0006] A notebook computer heat dissipation base is placed at the bottom of the notebook computer electronic device when in use to accelerate air circulation and heat dissipation. The heat dissipation base includes a shell and a heat dissipation component. The top surface of the shell is provided with an air inlet, and the bottom surface is provided with an air outlet, wherein the heat dissipation component is arranged between the air inlet and the air outlet; the heat dissipation component includes a cover body and a fan. The cover body guides air to flow from the air inlet to the air outlet, and the fan is arranged in the cover body.

[0007] In a possible implementation, a filler is provided in the groove on the cover body.

[0008] The heat dissipation base of the present application has a cover body that can reduce turbulence and reduce noise; the filler inside the cover body has a sound insulation effect.

[0009] In a possible implementation manner, the groove body is a continuous annular groove.

[0010] In one possible implementation, the cover body includes a collecting part and a volute part, and the collecting part is covered on the periphery of the air inlet; a volute part adapted to the fan is provided on one side of the collecting part, the volute part is provided along the periphery of the fan, a gap is provided on the side where air flows into the fan, and the fan is provided toward the air outlet.

[0011] In one possible implementation, the shell includes an upper shell and a lower shell, the air inlet is arranged on the upper shell, the air outlet is arranged on the lower shell, and the cover of the heat dissipation assembly is arranged between the upper shell and the lower shell.

[0012] In a possible implementation, the cover body is disposed around the outer periphery of the air inlet and the air outlet, and the upper and lower surfaces of the cover body respectively abut against the upper shell and the lower shell.

[0013] In another possible implementation, the cover body is arranged around the outer periphery of the air inlet, and its upper surface abuts against the upper shell. A bottom plate is arranged on the lower surface of the cover body, and an exhaust port is arranged on the bottom plate, and the exhaust port is arranged toward the air outlet.

[0014] In one possible implementation, the inner surface of the upper shell is provided with a baffle adapted to the cover body.

[0015] In a possible implementation, an inwardly concave groove is provided on one side of the bottom surface of the lower shell, and the air outlet is arranged on the bottom surface of the groove, and the bottom surface of the groove is arranged at an angle with the bottom surface of the shell body.

[0016] It should be noted that the above-mentioned various possible implementation methods can be combined under the premise that the solutions are not contradictory. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an exploded view of a notebook computer heat dissipation base provided in an embodiment of the present application.

[0018] Figure 2 This is an exploded view from another angle of a laptop computer heat dissipation base provided in an embodiment of the present application.

[0019] Figure 3 yes Figure 2 Exploded view of the heat sink assembly.

[0020] Figure 4 yes Figure 2 Top view of the heat sink assembly.

[0021] Figure 5 yes Figure 1 Schematic diagram of the structure of the middle and lower shells.

[0022] Description of reference numerals:

[0023] 10a. Upper shell; 11. Air inlet; 12. Enclosure; 10b. Lower shell; 13. Air outlet; 14. Electrical interface; 15. Sink; 20. Cover; 21. Sink; 22. Exhaust port; 23. Filler; 24. Collecting part; 25. Volute part; 30. Fan. DETAILED DESCRIPTION

[0024] The present application will be described below with reference to the accompanying drawings, which show several embodiments of the present application.

[0025] The embodiment of the present application provides a notebook computer heat dissipation base, please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 The structure of the heat dissipation base is shown from different angles. When in use, it is placed at the bottom of a laptop electronic device to accelerate air circulation and assist in heat dissipation. The heat dissipation base includes a shell and a heat dissipation component. The top surface of the shell is provided with an air inlet 11, and the bottom surface is provided with an air outlet 13, wherein the heat dissipation component is arranged between the air inlet 11 and the air outlet 13; the heat dissipation component includes a cover body 20 and a fan 30, and the fan 30 is arranged in the cover body 20. The cover body 20 is used to guide the flow direction of air, that is, from the air inlet 11 to the air outlet 13. At the same time, the cover body 20 can reduce the generation of turbulence and reduce noise.

[0026] Different from the prior art, a filler 23 is provided in the groove 21 on the cover 20 . The filler 23 is not limited to foam plastic or foam rubber or sound-absorbing cotton. The filler 23 has a sound insulation effect to reduce the noise generated by the fan 30 .

[0027] Foam plastic: polystyrene;

[0028] Foam rubber: It is made by mixing rubber particles or rubber latex with a foaming agent, and then forming a bubble structure through a foaming process;

[0029] Sound-absorbing cotton: a porous fiber material made of glass fiber, polyester fiber, rock wool, plant fiber and other raw materials.

[0030] Preferably, the groove body 21 is a continuous annular groove, which is convenient for filling the filler 23. In particular, the liquid rubber latex and the foaming agent are foamed in the groove body 21, which facilitates the flow of the liquid and improves the efficiency of automated production; the efficiency of manually filling the solid strip filler 23 can also be improved.

[0031] The housing includes an upper shell 10a and a lower shell 10b, the air inlet 11 is arranged on the upper shell 10a, and the air outlet 13 is arranged on the lower shell 10b;

[0032] In a possible implementation, the cover 20 is disposed around the outer periphery of the air inlet 11 and the air outlet 13, and its upper and lower surfaces respectively abut against the upper shell 10a and the lower shell 10b;

[0033] In another possible implementation, the cover body 20 is disposed around the outer periphery of the air inlet 11, and its upper surface contacts the upper shell 10a. A bottom plate is disposed on the lower surface of the cover body 20, and an exhaust port 22 is disposed on the bottom plate. The exhaust port 22 is disposed toward the air outlet 13. That is, in this solution, the lower surface of the cover body 20 does not contact the lower shell 10b.

[0034] In order to facilitate positioning during assembly, a baffle 12 adapted to the cover body 20 is provided on the inner surface of the upper shell 10a.

[0035] An electrical interface 14 for power supply is provided on the housing.

[0036] See also Figure 3 and Figure 4 , Figure 3 and Figure 4 The structure of the heat dissipation assembly is shown from different angles. In order to further reduce the noise generated by air turbulence, the cover body 20 includes a collector 24 and a volute 25. The collector 24 is arranged on the periphery of the air inlet 11. Figure 2 The air inlet 11 of the heat dissipation base shown is composed of multiple holes in a rectangular array. In this scheme, the collecting part 24 is also rectangular; a volute part 25 adapted to the fan 30 is provided on one side of the collecting part 24, and the volute part 25 is arranged around the outer periphery of the fan 30. A gap is provided on the side where air flows into the fan 30. The fan 30 is arranged toward the air outlet 13, and the volute part 25 guides the airflow to reduce turbulence and reduce noise; and prevents the gas from flowing back to the collecting part 24 again; the connection between the collecting part 24 and the volute part 25 has a smooth transition.

[0037] See also Figure 5 , Figure 5 A structure of a lower shell 10b is shown, and an inwardly concave sink 15 is provided on one side of the bottom surface of the lower shell 10b, and an air outlet 13 is provided on the bottom surface of the sink 15;

[0038] Preferably, the bottom surface of the sink 15 and the bottom surface of the lower shell 10b are arranged at an angle α, so that when the lower shell 10b is placed on a plane, the air outlet 13 can also exhaust air.

[0039] Although the exemplary embodiments of the present application have been described, it should be understood by those skilled in the art that various changes and modifications can be made to the exemplary embodiments of the present application without departing from the spirit and scope of the present application in essence. Therefore, all changes and modifications are included in the protection scope of the present application as defined by the claims. The present application is defined by the attached claims, and the equivalents of these claims are also included.

Claims

1. A notebook computer heat dissipation base, placed at the bottom of a notebook computer electronic device for use, comprising a housing and a heat dissipation component, wherein the top surface of the housing is provided with an air inlet (11), and the bottom surface is provided with an air outlet (13), characterized in that: The heat dissipation component is arranged between the air inlet (11) and the air outlet (13); the heat dissipation component comprises a cover body (20) and a fan (30); the cover body (20) guides air to flow from the air inlet (11) to the air outlet (13); the fan (30) is arranged in the cover body (20); and a filler (23) is arranged in the groove body (21) on the cover body (20).

2. The notebook computer heat dissipation base according to claim 1, characterized in that: The groove body (21) is a continuous annular groove.

3. The notebook computer heat dissipation base according to claim 1, characterized in that: The cover body (20) comprises a flow collecting portion (24) and a volute portion (25); the flow collecting portion (24) is arranged on the periphery of the air inlet (11); a volute portion (25) adapted to the fan (30) is provided on one side of the flow collecting portion (24); the volute portion (25) is arranged along the periphery of the fan (30), and a gap is provided on the air inflow side of the fan (30); the fan (30) is arranged toward the air outlet (13).

4. The notebook computer heat dissipation base according to claim 1, characterized in that: The housing comprises an upper shell (10a) and a lower shell (10b), the air inlet (11) is arranged on the upper shell (10a), the air outlet (13) is arranged on the lower shell (10b), and the cover (20) of the heat dissipation assembly is arranged between the upper shell (10a) and the lower shell (10b).

5. The notebook computer heat dissipation base according to claim 4, characterized in that: The cover body (20) is arranged around the outer periphery of the air inlet (11) and the air outlet (13), and its upper and lower surfaces respectively abut against the upper shell (10a) and the lower shell (10b).

6. The notebook computer heat dissipation base according to claim 4, characterized in that: The cover body (20) is arranged around the outer periphery of the air inlet (11), and its upper surface abuts against the upper shell (10a). A bottom plate is provided on the lower surface of the cover body (20), and an exhaust port (22) is provided on the bottom plate. The exhaust port (22) is arranged toward the air outlet (13).

7. The notebook computer heat dissipation base according to claim 4, characterized in that: The inner surface of the upper shell (10a) is provided with a baffle (12) adapted to the cover body (20).

8. The notebook computer heat dissipation base according to claim 4, characterized in that: An inwardly concave groove (15) is provided on one side of the bottom surface of the lower shell (10b), the air outlet (13) is arranged on the bottom surface of the groove (15), and the bottom surface of the groove (15) is arranged at an angle with the bottom surface of the shell.

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