Temperature control system and semiconductor device

Abstract

The utility model relates to a temperature control system and semiconductor equipment, and relates to the field of temperature control systems. The temperature control system comprises a first micro-channel flat pipe assembly, a semiconductor chilling plate assembly, a liquid return pipe, a liquid supply pipe, a water supply pipe, a water outlet pipe and a compressor. The semiconductor chilling plate assembly is arranged, the cold channel section is used for cooling the first cooling liquid, the first micro-channel flat pipe assembly is further arranged, the first cooling liquid cooled through the cold channel section is used for cooling the second cooling liquid, then the load of the compressor is reduced, energy consumption is reduced, and the energy utilization efficiency is improved; meanwhile, compared with an original refrigerant system, the circulating first cooling liquid and the circulating second cooling liquid are both used for cooling the same load and controlling the temperature, the demand quantity of process cold water of the original system is reduced, resource waste is reduced, and the resource utilization efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of temperature control systems, and in particular to a temperature control system and semiconductor equipment. Background Art

[0002] In the process of semiconductor wafer manufacturing, the etching process is a very critical step. The etching machine physically bombards and chemically etches the wafer to achieve the desired pattern. However, this process generates a lot of heat, which needs to be discharged in time to avoid adverse effects on the wafer.

[0003] At present, in order to control the heat generated during the etching process, the commonly used method is to cool it through a compressor refrigerant system, and finally accurately heat the coolant through electric heating to meet the high standards of temperature accuracy required by the semiconductor production process.

[0004] The inventors have found that the prior art still has some problems in the temperature control equipment of the semiconductor etching chamber: the current load is only cooled by the compressor refrigerant system, which has a large demand for process cooling water and high power consumption, which may lead to waste of resources. Utility Model Content

[0005] The utility model aims to provide a temperature control system and semiconductor equipment, which can reduce the power consumption required for compressor cooling, avoid resource waste, and improve resource utilization efficiency.

[0006] The embodiment of the utility model is achieved as follows:

[0007] On the one hand, the utility model proposes a temperature control system for controlling the temperature of a load by means of a first coolant and a second coolant, respectively. The temperature control system comprises a first microchannel flat tube assembly, a semiconductor refrigeration plate assembly, a liquid return pipe, a liquid supply pipe, a water supply pipe, a water outlet pipe and a compressor; the first microchannel flat tube assembly comprises a first inlet and a first outlet that are connected and a second inlet and a second outlet that are connected; the semiconductor refrigeration plate assembly comprises a cold channel section for refrigeration and a hot channel section for heating; one end of the liquid return pipe is connected to the load, and the other end is connected to one end of the cold channel section, and the other end of the cold channel section is connected to the first inlet; the first coolant flows in the liquid supply pipe, one end of the liquid supply pipe is connected to the load, and the other end is connected to one end of the hot channel section, and the other end of the hot channel section is connected to the first outlet; the second coolant flows in the water supply pipe, one end of the water supply pipe is connected to the load, and the other end is connected to the second inlet; one end of the water outlet pipe is connected to the load; one end of the compressor is connected to the second outlet, and the other end is connected to the other end of the water outlet pipe.

[0008] Wherein, the first coolant circulates through the liquid return pipe, the cold channel section, the first inlet, the first outlet, the hot channel section, the liquid supply pipe and the load;

[0009] The second coolant circulates through the water supply pipe, the second inlet, the second outlet, the compressor, the water outlet pipe and the load.

[0010] Furthermore, a heating device is provided between the hot channel section and the liquid supply pipe.

[0011] Wherein, the heating device is used to heat the first coolant.

[0012] Furthermore, a coolant tank and a circulation pump are sequentially arranged between the second outlet and the hot channel section.

[0013] The coolant tank is capable of storing a certain volume of the first coolant; and the circulating pump is used for circulating and pumping the first coolant.

[0014] Furthermore, a first valve is provided between the liquid return pipe and the cold channel section; and / or

[0015] A second valve is arranged between the hot channel section and the liquid supply pipe.

[0016] The first valve and the second valve are used to open and close the pipeline, control the flow direction, and adjust and control the parameters of the conveying medium.

[0017] Furthermore, the temperature control system also includes a third valve, one end of the third valve is connected to the first valve, and the other end of the third valve is connected to the second valve.

[0018] The third valve is used to open and close the pipeline, control the flow direction, and adjust and control the parameters of the conveying medium. When the second coolant does not need the first coolant for heat exchange, the third valve can be opened, and the first coolant flows back to the supply pipe through the return pipe, the first valve, the third valve, and the second valve in sequence.

[0019] Further, the temperature control system further comprises a second microchannel flat tube assembly disposed between the water supply pipe and the second inlet;

[0020] The second microchannel flat tube assembly includes a third inlet and a third outlet that are connected and a fourth inlet and a fourth outlet that are connected;

[0021] The third inlet is connected to the water supply pipe, and the third outlet is connected to the second inlet;

[0022] The fourth inlet is connected to the compressor, and the fourth outlet is connected to the water outlet pipe.

[0023] The second coolant flowing out of the water supply pipe and the second coolant flowing out of the compressor after cooling can perform a convection heat exchange in the second microchannel flat tube assembly.

[0024] Furthermore, a liquid storage tank, a visual eyepiece and an expansion valve are sequentially arranged between the second microchannel flat tube assembly and the first microchannel flat tube assembly.

[0025] The liquid storage tank is used to store a certain volume of the second coolant, and the expansion valve is used to throttle, reduce the pressure and adjust the flow of the second coolant flowing out of the liquid storage tank.

[0026] Further, a first solenoid valve is provided between the water supply pipe and the second microchannel flat tube assembly; and / or

[0027] A second solenoid valve is provided between the compressor and the second microchannel flat tube assembly; and / or

[0028] A fourth valve is provided between the second microchannel flat tube assembly and the water outlet pipe.

[0029] Among them, the solenoid valve can be used to adjust the flow rate and temperature of the second coolant in the process, as well as control the flow rate and temperature of the compressor exhaust, to meet the high standards of temperature accuracy in the semiconductor production process.

[0030] Furthermore, one end of the semiconductor refrigeration plate assembly is a cold end surface, and the other end is a hot end surface;

[0031] The cold end surface and the hot end surface are connected with a third microchannel flat tube assembly;

[0032] The cold end surface and the third microchannel flat tube assembly form the cold channel section;

[0033] The hot end surface and the third microchannel flat tube assembly form the hot channel section.

[0034] When the first coolant flows through the cold end face through the cold channel section, the first coolant transfers the heat in the first coolant to the cold end face through the third microchannel flat tube assembly by means of convection heat transfer, and the first coolant is cooled. When the first coolant flows through the hot end face through the hot channel section, the first coolant transfers the heat of the hot end face to the first coolant through the third microchannel flat tube assembly by means of convection heat transfer, and the first coolant is heated.

[0035] Another aspect of the present invention provides a semiconductor device, comprising any one of the temperature control systems described above.

[0036] The beneficial effects of the embodiments of the utility model are:

[0037] The temperature control system of the utility model: 1. By setting a semiconductor refrigeration plate assembly, the first coolant is cooled by the cold channel section, and then by setting a first microchannel flat tube assembly, the first coolant cooled by the cold channel section cools the second coolant, thereby reducing the load of the compressor, reducing energy consumption, improving energy utilization efficiency, and achieving high efficiency and energy saving in the cooling process; 2. The first coolant is initially heated by the hot channel section of the semiconductor refrigeration plate assembly. The first coolant heated for the first time can reduce the start-up power of the heating device when it is heated for the second time and improve the temperature control accuracy of the second heating, which meets the high standard requirements of the semiconductor production process for temperature accuracy and reduces the energy consumption of the heating process; 3. Compared with the original refrigerant system, the circulating first coolant and the second coolant are both used to control the temperature of the same load, which reduces the demand for process cold water of the original system, reduces resource waste, and improves resource utilization efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 This is a schematic diagram of the structure of the temperature control system of the embodiment of the utility model;

[0040] Figure 2 It is a schematic structural diagram of a semiconductor refrigeration plate assembly according to an embodiment of the utility model.

[0041] Icons: 010-temperature control system; 110-liquid return pipe; 120-first valve; 130-semiconductor refrigeration chip assembly; 131-cold channel section; 132-hot channel section; 133-N-type conductor; 134-P-type conductor; 135-metal conductor; 136-insulating ceramic; 137-cold end face; 138-hot end face; 139-third microchannel flat tube assembly; 140-first microchannel flat tube assembly; 141-first inlet; 142-first outlet; 143-second inlet; 144-second outlet; 15 0-coolant tank; 160-circulating pump; 170-heating device; 180-second valve; 190-third valve; 200-liquid supply pipe; 210-water supply pipe; 220-first solenoid valve; 230-second microchannel flat tube assembly; 231-third inlet; 232-third outlet; 233-fourth inlet; 234-fourth outlet; 240-liquid storage tank; 250-visible eyepiece; 260-expansion valve; 270-compressor; 280-second solenoid valve; 290-fourth valve; 300-water outlet pipe. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0045] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0046] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0047] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] Please refer to Figure 1 The utility model proposes a temperature control system 010, which is used to control the temperature of a load through a first coolant and a second coolant respectively.

[0049] The temperature control system 010 proposed by the present invention is applied to semiconductor equipment, wherein the semiconductor equipment can be a temperature control device of a semiconductor etching chamber, and the temperature control system 010 can be used to meet the high standard requirements of the etching process for temperature accuracy.

[0050] The temperature control system 010 proposed in this embodiment includes a first microchannel flat tube assembly 140, a semiconductor refrigeration plate assembly 130, a liquid return pipe 110, a liquid supply pipe 200, a water supply pipe 210, a water outlet pipe 300 and a compressor 270; the first microchannel flat tube assembly 140 includes a first inlet 141 and a first outlet 142 that are connected and a second inlet 143 and a second outlet 144 that are connected; the semiconductor refrigeration plate assembly 130 includes a cold channel section 131 for cooling and a hot channel section 132 for heating; one end of the liquid return pipe 110 is connected to the load, and the other end is connected to the One end of the cold channel section 131 and the other end of the cold channel section 131 are connected to the first inlet 141; the first coolant flows in the liquid supply pipe 200, one end of the liquid supply pipe 200 is connected to the load, and the other end is connected to one end of the hot channel section 132, and the other end of the hot channel section 132 is connected to the first outlet 142; the second coolant flows in the water supply pipe 210, one end of the water supply pipe 210 is connected to the load, and the other end is connected to the second inlet 143; one end of the water outlet pipe 300 is connected to the load; one end of the compressor 270 is connected to the second outlet 144, and the other end is connected to the other end of the water outlet pipe 300.

[0051] Specifically, the first coolant circulates through the return pipe 110, the cold channel section 131, the first inlet 141, the first outlet 142, the hot channel section 132, the liquid supply pipe 200 and the load. The second coolant circulates through the water supply pipe 210, the second inlet 143, the second outlet 144, the compressor 270, the water outlet pipe 300 and the load.

[0052] The second coolant and the first coolant cooled by the cold channel section 131 undergo convection heat transfer in the first microchannel flat tube assembly 140. The second coolant is cooled by the first coolant in the first microchannel flat tube assembly 140, thereby reducing the load of the compressor 270, reducing energy consumption, improving energy utilization efficiency, and achieving high efficiency and energy saving.

[0053] Among them, the first coolant is initially heated by utilizing the heat channel section 132 of the semiconductor refrigeration plate assembly 130, thereby reducing the start-up power of the secondary heating and improving the temperature control accuracy of the secondary heating, thus meeting the high standard requirements of the semiconductor production process for temperature accuracy.

[0054] It can be understood that the original load is cooled by the compressor refrigerant system, which has a large demand for process cooling water. Compared with the original refrigerant system, the present application uses both the circulating first coolant and the second coolant to cool and control the temperature of the same load, thereby reducing the demand for process cooling water of the original system, reducing resource waste, and improving resource utilization efficiency.

[0055] Please refer to Figure 1-Figure 2 , the components through which the first coolant circulates are described below. The first coolant circulates through the return pipe 110, the first valve 120, the cold channel section 131, the first inlet 141, the first outlet 142, the coolant tank 150, the circulation pump 160, the hot channel section 132, the heating device 170, the second valve 180, the liquid supply pipe 200, the load and the return pipe 110.

[0056] In this embodiment, please refer to Figure 2 The temperature control system 010 includes a semiconductor refrigeration plate assembly 130.

[0057] Specifically, the semiconductor cooling plate assembly 130 includes a plurality of N-type conductors 133 and P-type conductors 134 arranged at intervals and a power source; adjacent N-type conductors 133 and P-type conductors 134 are connected to a metal conductor 135; the positive electrode of the power source is connected to the P-type conductor 134 at the starting end through the metal conductor 135, and the negative electrode of the power source is connected to the N-type conductor 133 at the end through the metal conductor 135; both ends of the plurality of N-type conductors 133 and P-type conductors 134 arranged at intervals are also provided with insulating ceramics 136. One end of the plurality of N-type conductors 133 and P-type conductors 134 arranged at intervals is a cold end face 137, and the other end is a hot end face 138; the cold end face 137 and the hot end face 138 are both connected to a third microchannel flat tube assembly 139; the cold end face 137 and the third microchannel flat tube assembly 139 form a cold channel section 131; the hot end face 138 and the third microchannel flat tube assembly 139 form a hot channel section 132.

[0058] Specifically, the theoretical prototype of semiconductor refrigerators is the Peltier effect, that is, when current flows through the contact point formed by two different conductors, the electron energy level will jump.

[0059] Therefore, the working principle of the semiconductor cooling plate assembly 130 is: the energy required for the electron flow is provided by a DC power supply, the power is turned on, and the electrons start from the negative electrode. When the electrons flow from the low-energy P-type conductor 134 to the high-energy N-type conductor 133, the electrons will jump from the low energy level to the high energy level, which is manifested as the electrons need to absorb heat, thereby forming a cold end face 137 at this node. On the contrary, when the electrons flow from the high-energy N-type conductor 133 to the low-energy P-type conductor 134, the electrons will jump from the high energy level to the low energy level, which is manifested as the electrons need to release heat, thereby forming a hot end face 138 at this node. When the electrons pass through a module formed by an N-type conductor 133 and a P-type conductor 134 in turn, heat is sent from one side to the other side to cause a temperature difference, thereby forming a cold and hot end.

[0060] It can be understood that when the first coolant flows through the cold end face 137 through the cold channel section 131, the first coolant transfers the heat in the first coolant to the cold end face 137 through the third microchannel flat tube assembly 139 by means of convection heat transfer, and the first coolant is cooled. When the first coolant flows through the hot end face 138 through the hot channel section 132, the first coolant transfers the heat of the hot end face 138 to the first coolant through the third microchannel flat tube assembly 139 by means of convection heat transfer, and the first coolant is heated.

[0061] The temperature of the first coolant can achieve the desired initial heating effect or initial cooling effect by controlling the input power of the semiconductor cooling plate assembly 130. During heating, the temperature of the first coolant can be monitored and feedback controlled to achieve precise temperature control.

[0062] In this embodiment, the temperature control system 010 includes a heating device 170. The heating device 170 is arranged between the hot channel section 132 and the liquid supply pipe 200. The heating device 170 heats the first coolant by converting electrical energy into thermal energy.

[0063] The temperature can be precisely controlled by monitoring the temperature of the first coolant and performing feedback control or adjusting the power and heating time of the heating device 170 .

[0064] It is understandable that the first coolant is heated twice: after the first coolant is heated for the first time from the hot channel section 132, the heating device 170 performs a second precise heating on the first coolant; wherein, after the first coolant is heated for the first time, it is heated for the second time in the heating device 170. Such two heatings can reduce the start-up power of the heating device 170, save operating costs, reduce production costs, and improve economic benefits. Among them, the two heatings further improve the control accuracy of the temperature of the first coolant, meet the high standard requirements of the semiconductor production process for temperature accuracy, and thus ensure that the temperature of the etching process is controlled within a precise range, thereby improving product quality and manufacturing efficiency.

[0065] In this embodiment, the heating device 170 is an electric heater. In other embodiments, the heating device 170 can also be other devices capable of heating and temperature control.

[0066] In this embodiment, a coolant tank 150 and a circulating pump 160 are provided between the second outlet 144 and the hot channel section 132. The coolant tank 150 can store a certain volume of the first coolant; the circulating pump 160 is used to circulate the first coolant.

[0067] In this embodiment, a first valve 120 is provided between the liquid return pipe 110 and the cold channel section 131 ; and a second valve 180 is provided between the hot channel section 132 and the liquid supply pipe 200 .

[0068] It is worth mentioning that, in the present embodiment, the temperature control system 010 further includes a third valve 190 ; one end of the third valve 190 is connected to the first valve 120 , and the other end of the third valve 190 is connected to the second valve 180 .

[0069] When the second coolant does not need the first coolant for heat exchange, the third valve 190 can be opened, and the first coolant flows back to the liquid supply pipe 200 through the return pipe 110, the first valve 120, the third valve 190, and the second valve 180 in sequence.

[0070] In this embodiment, the first microchannel flat tube assembly 140 is a stacked microchannel flat tube; wherein the microchannel flat tube, also known as a "parallel flow aluminum flat tube", is a thin-walled porous flat tube-shaped high-efficiency heat exchanger material.

[0071] It can be understood that in the first microchannel flat tube assembly 140: the cooled first coolant flows in the cavity connected to the first inlet 141 and the first outlet 142; the second coolant flows in the cavity connected to the second inlet 143 and the second outlet 144. After the cooled first coolant cools and exchanges heat with the second coolant by means of convection heat exchange in the first microchannel flat tube assembly 140, the first coolant flows back to the coolant tank 150, and the second coolant is preliminarily cooled and flows into the compressor 270 for cooling; thereby reducing the load of the compressor 270.

[0072] Please refer to Figure 1 , the components through which the second coolant circulates are introduced below.

[0073] In this embodiment, the circulation system includes a second microchannel flat tube assembly 230 , and the second microchannel flat tube assembly 230 is disposed between the water supply pipe 210 and the second inlet 143 .

[0074] Specifically, the second microchannel flat tube assembly 230 includes a connected third inlet 231 and a third outlet 232 and a connected fourth inlet 233 and a fourth outlet 234; the third inlet 231 is connected to the water supply pipe 210, and the third outlet 232 is connected to the second inlet 143; the fourth inlet 233 is connected to the compressor 270, and the fourth outlet 234 is connected to the water outlet pipe 300.

[0075] Of course, in this embodiment, the second microchannel flat tube assembly 230 and the third microchannel flat tube assembly 139 are consistent with the first microchannel flat tube assembly 140 and are both stacked microchannel flat tubes.

[0076] In this embodiment, a liquid storage tank 240, a visual eyepiece 250 and an expansion valve 260 are sequentially arranged between the second microchannel flat tube assembly 230 and the first microchannel flat tube assembly 140; a first solenoid valve 220 is arranged between the water supply pipe 210 and the second microchannel flat tube assembly 230; a second solenoid valve 280 is arranged between the compressor 270 and the second microchannel flat tube assembly 230; and a fourth valve 290 is arranged between the second microchannel flat tube assembly 230 and the water outlet pipe 300.

[0077] The solenoid valve can be used to adjust the flow rate and temperature of the second coolant in the process, and control the flow rate and temperature of the exhaust gas from the compressor 270, thereby meeting the high standards for temperature accuracy in the semiconductor production process.

[0078] Specifically, the circulation of the second coolant is: the second coolant circulates through the water supply pipe 210, the first solenoid valve 220, the third inlet 231, the third outlet 232, the liquid storage tank 240, the visual eyepiece 250, the expansion valve 260, the second inlet 143, the second outlet 144, the compressor 270, the second solenoid valve 280, the fourth inlet 233, the fourth outlet 234, the fourth valve 290, the water outlet pipe 300 and the water supply pipe 210.

[0079] The liquid storage tank 240 is used to store a certain volume of the second coolant, and the expansion valve 260 is used to throttle, reduce the pressure and adjust the flow of the second coolant flowing out of the liquid storage tank 240 .

[0080] Among them, the second coolant also has two convection heat exchanges: 1. The second coolant flowing out of the water supply pipe 210 enters the second microchannel flat tube assembly 230 through the third inlet 231. The second coolant flowing out of the water supply pipe 210 and the second coolant flowing out of the compressor 270 after cooling perform the first convection heat exchange in the second microchannel flat tube assembly 230. 2. The second coolant that has undergone the first convection heat exchange enters the first microchannel flat tube assembly 140 and performs the second convection heat exchange with the first coolant in the first microchannel flat tube assembly 140.

[0081] In summary, the temperature control system 010 of the utility model: 1. By setting the semiconductor refrigeration plate assembly 130, the first coolant is cooled by the cold channel section 131, and the first microchannel flat tube assembly 140 is set, so that the first coolant cooled by the cold channel section 131 cools the second coolant, thereby reducing the load of the compressor 270, reducing energy consumption, improving energy utilization efficiency, and achieving high efficiency and energy saving in the cooling process. 2. The first coolant is heated for the first time by the hot channel section 132 of the semiconductor refrigeration plate assembly 130. The first coolant heated for the first time can reduce the start-up power of the heating device 170 when it is heated for the second time, and the second heating can improve the temperature control accuracy, meet the high standard requirements of the semiconductor production process for temperature accuracy, and reduce the energy consumption of the heating process. 3. Compared with the original refrigerant system, the circulating first coolant and the second coolant are both used to cool and control the temperature of the same load, which reduces the demand for process cold water of the original system, reduces resource waste, and improves resource utilization efficiency.

[0082] Furthermore, by setting the heating device 170, after the first coolant is initially heated from the hot channel section 132, the heating device 170 performs a second precise heating on the first coolant; wherein, after the first coolant is initially heated, it is heated for the second time in the heating device 170, and the two heatings set in this way can reduce the start-up power of the heating device 170, save operating costs, reduce production costs, and improve economic benefits. Among them, the two heatings further improve the control accuracy of the temperature of the first coolant, meet the high standard requirements of the semiconductor production process for temperature accuracy, and then ensure that the temperature of the etching process is controlled within a precise range, thereby improving product quality and manufacturing efficiency.

[0083] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A temperature control system, characterized in that: Used to control the temperature of a load by using a first coolant and a second coolant respectively, the temperature control system (010) comprising: A first microchannel flat tube assembly (140), the first microchannel flat tube assembly (140) comprising a first inlet (141) and a first outlet (142) that are in communication with each other, and a second inlet (143) and a second outlet (144) that are in communication with each other; A semiconductor refrigeration chip assembly (130), the semiconductor refrigeration chip assembly (130) comprising a cold channel section (131) for refrigeration and a hot channel section (132) for heating; a liquid return pipe (110), one end of the liquid return pipe (110) being connected to the load, and the other end of the liquid return pipe (110) being connected to one end of the cold channel section (131), and the other end of the cold channel section (131) being connected to the first inlet (141); a liquid supply pipe (200), wherein the first coolant flows in the liquid supply pipe (200), one end of the liquid supply pipe (200) is connected to the load, and the other end of the liquid supply pipe (200) is connected to one end of the hot channel section (132), and the other end of the hot channel section (132) is connected to the first outlet (142); a water supply pipe (210), wherein the second coolant flows in the water supply pipe (210), one end of the water supply pipe (210) is connected to the load, and the other end of the water supply pipe (210) is connected to the second inlet (143); a water outlet pipe (300), one end of the water outlet pipe (300) being connected to the load; A compressor (270), one end of the compressor (270) is connected to the second outlet (144), and the other end of the compressor (270) is connected to the other end of the water outlet pipe (300).

2. The temperature control system according to claim 1, characterized in that: A heating device (170) is provided between the hot channel section (132) and the liquid supply pipe (200).

3. The temperature control system according to claim 1, characterized in that: A coolant tank (150) and a circulation pump (160) are arranged in sequence between the second outlet (144) and the hot channel section (132).

4. The temperature control system according to claim 1, characterized in that: A first valve (120) is provided between the liquid return pipe (110) and the cold channel section (131); and / or A second valve (180) is provided between the hot channel section (132) and the liquid supply pipe (200).

5. The temperature control system according to claim 4, characterized in that: The temperature control system (010) further comprises a third valve (190), one end of the third valve (190) being connected to the first valve (120), and the other end of the third valve (190) being connected to the second valve (180).

6. The temperature control system according to claim 1, characterized in that: The temperature control system (010) further comprises a second microchannel flat tube assembly (230) disposed between the water supply pipe (210) and the second inlet (143); The second microchannel flat tube assembly (230) comprises a third inlet (231) and a third outlet (232) that are connected, and a fourth inlet (233) and a fourth outlet (234) that are connected; The third inlet (231) is connected to the water supply pipe (210), and the third outlet (232) is connected to the second inlet (143); The fourth inlet (233) is connected to the compressor (270), and the fourth outlet (234) is connected to the water outlet pipe (300).

7. The temperature control system according to claim 6, characterized in that: A liquid storage tank (240), a visual eyepiece (250) and an expansion valve (260) are sequentially arranged between the second microchannel flat tube assembly (230) and the first microchannel flat tube assembly (140).

8. The temperature control system according to claim 6, characterized in that: A first solenoid valve (220) is provided between the water supply pipe (210) and the second microchannel flat tube assembly (230); and / or A second solenoid valve (280) is provided between the compressor (270) and the second microchannel flat tube assembly (230); and / or A fourth valve (290) is provided between the second microchannel flat tube assembly (230) and the water outlet pipe (300).

9. The temperature control system according to claim 1, characterized in that: One end of the semiconductor refrigeration plate assembly (130) is a cold end surface (137), and the other end is a hot end surface (138); The cold end surface (137) and the hot end surface (138) are both connected to a third microchannel flat tube assembly (139); The cold end surface (137) and the third microchannel flat tube assembly (139) form the cold channel section (131); The hot end surface (138) and the third microchannel flat tube assembly (139) form the hot channel section (132).

10. A semiconductor device, characterized in that: A temperature control system comprising any one of claims 1 to 9.

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