Network equipment based on Internet of Things

Abstract

The utility model relates to network equipment based on the Internet of Things. The first heat dissipation tooth sheets are arranged on the inner wall of the heat dissipation shell in a protruding mode, the surface area of the inner wall of the heat dissipation shell can be effectively increased through the first heat dissipation tooth sheets, and heat generated by the electronic components can be rapidly transmitted to the surface of the heat dissipation shell. The second heat dissipation tooth pieces are arranged on the outer surface of the heat dissipation shell in a protruding mode, the surface area of the outer surface of the heat dissipation shell can be effectively increased through the second heat dissipation tooth pieces, the heat exchange efficiency between the heat dissipation shell and outside air is improved, and the normal working temperature of equipment is ensured. The first fixing plate is connected to the heat dissipation shell and covers the first installation opening, and the second fixing plate is connected to the heat dissipation shell and covers the second installation opening. And the first fixing plate and the second fixing plate are detachably connected with the heat dissipation shell, so that the electronic components in the first mounting space are convenient to mount and maintain. The installation assembly is installed on the surface, away from the first installation space, of the heat dissipation shell, the installation assembly can be installed with external equipment, and the overall network equipment can be rapidly installed or uninstalled.

Description

Technical Field

[0001] The utility model relates to the technical field of controllers, and in particular to a network device based on the Internet of Things. Background Art

[0002] When installing traditional network equipment, most of them need to be fixed in the shell by bolts to avoid affecting the aesthetics of the interior layout. It is cumbersome to disassemble and assemble after being fixed by bolts, and the heat dissipation effect is not strong after the controller adopts an integrated shell. Especially in the hot summer, network equipment is easy to be damaged after long-term use, which is very unfavorable to the use of network equipment. Utility Model Content

[0003] The embodiment of the present application aims to provide a network device based on the Internet of Things to improve the problems of cumbersome installation and poor heat dissipation of the network device.

[0004] In order to solve the technical problem, the embodiment of the present application adopts the following technical solution:

[0005] In the first aspect, the embodiment of the present application provides a network device based on the Internet of Things, including: a heat dissipation housing, a mounting assembly, a first fixing plate, a second fixing plate and a circuit board. The heat dissipation housing encloses a first installation space, the heat dissipation housing has a first mounting port and a second mounting port arranged oppositely, the first mounting port and the second mounting port are both connected to the first installation space, the heat dissipation housing is also provided with a first heat dissipation tooth plate and a second heat dissipation tooth plate, the first heat dissipation tooth plate is convexly arranged on the inner wall of the heat dissipation housing, and the second heat dissipation tooth plate is convexly arranged on the outer surface of the heat dissipation housing. The mounting assembly is installed on the surface of the heat dissipation housing away from the first installation space. A first fixing plate and a second fixing plate, the first fixing plate is connected to the heat dissipation housing and covers the first mounting port, the second fixing plate is connected to the heat dissipation housing and covers the second mounting port. The circuit board is arranged in the first installation space, one end of the circuit board is connected to the first fixing plate, and the other end is connected to the second fixing plate.

[0006] In some embodiments, the mounting assembly includes a connecting portion, a first limiting portion, and a second limiting portion, the first limiting portion and the second limiting portion are respectively arranged at two ends of the connecting portion, and the first limiting portion and the second limiting portion are arranged opposite to each other, a first clamping groove is arranged on the end surface of the first limiting portion facing the second limiting portion, and a clamping space is formed between the first limiting portion and the second limiting portion. The mounting assembly also includes an elastic member, which is arranged at the opening of the first clamping groove and extends to the clamping space.

[0007] In some embodiments, the heat dissipation housing includes a first main board and a second main board arranged opposite to each other along the first direction, and a first side panel and a second side panel arranged opposite to each other along the second direction, the first side panel and the second side panel are arranged between the first main board and the second main board, and the first main board, the second main board, the first side panel and the second side panel are sequentially connected to form a heat dissipation housing. The mounting assembly is arranged on the first side panel, and the network device also includes a first fixing portion, and the first fixing portion is arranged on the surface of the first main board away from the first mounting space. The first fixing portion includes a first extension portion, the first extension portion extends out of the first side panel, the first extension portion is provided with a first mounting hole and a second mounting hole, the first mounting hole and the second mounting hole are arranged on both sides of the first extension portion, and the first mounting hole and the second mounting hole are communicated with the clamping space.

[0008] In some embodiments, a first guide rail is disposed on a surface of the first mainboard facing the first installation space, a first guide rail groove is formed on the circuit board, and the circuit board is slidably connected to the first guide rail through the first guide rail groove.

[0009] In some embodiments, along the first direction, a second guide rail groove is provided on a surface of the first limiting portion away from the first side plate.

[0010] In some embodiments, the second mainboard is provided with a first mounting groove, the circuit board is connected with an LED lamp, and the LED lamp is arranged in the first mounting groove and exposed on the outer surface of the second mainboard.

[0011] In some embodiments, the first fixing plate is provided with a first card interface, the circuit board is provided with a first card connection portion, the first card connection portion partially extends out of the circuit board, and the first card connection portion is carded with an inner wall of the first card interface. The first card connection portion is provided with a first receiving groove, the first receiving groove is communicated with the first card interface, and the network device further comprises a first terminal, and the first terminal is disposed in the first receiving groove.

[0012] In some embodiments, when viewed from the inner wall to the outer wall of the heat dissipation housing, the first heat dissipation fins and the second heat dissipation fins at least partially overlap.

[0013] In some embodiments, the second fixing plate is provided with a second card interface, the circuit board is provided with a second card connection portion, the second card connection portion partially extends out of the circuit board, and the second card connection portion is engaged with the inner wall of the second card interface. The second card connection portion is provided with a second receiving slot, the second receiving slot is in communication with the second card interface, and the network device further includes a communication interface, the communication interface is provided in the second receiving slot and extends out of the second card interface.

[0014] In some embodiments, the network device further comprises a second fixing portion, the second fixing portion is arranged on a surface of the first mainboard facing away from the first installation space, and the second fixing portion and the first fixing portion are arranged on both sides of the first mainboard opposite to each other. The second fixing portion comprises a second extension portion, the second extension portion extends out of the second side plate, the second extension portion is provided with a third installation hole and a fourth installation hole, and the third installation hole and the fourth installation hole are arranged on both sides of the second extension portion opposite to each other.

[0015] Different from the related art, the embodiment of the present application provides a network device, including a heat dissipation housing, a mounting assembly, a first fixing plate, a second fixing plate and a circuit board. The heat dissipation housing has good thermal conductivity and can quickly transfer the heat in the housing to the outside of the housing. The inner wall of the heat dissipation housing is provided with a first heat dissipation tooth plate, which can increase the inner surface area of ​​the heat dissipation housing, and the heat generated by the electronic components on the circuit board can fully contact the inner surface of the heat dissipation housing, which can improve the heat conduction efficiency. The outer surface of the heat dissipation housing is provided with a second heat dissipation tooth plate, which can effectively increase the surface area of ​​the outer surface of the heat dissipation housing, improve the heat exchange efficiency between the heat dissipation housing and the outside air, increase the contact between the air and the surface of the heat dissipation housing, and dissipate the heat to the outside of the heat dissipation housing, so as to ensure the normal working temperature of various electronic components on the circuit board and reduce the performance degradation or damage of electronic components due to overheating. The heat dissipation housing has a first mounting port and a second mounting port that are connected to the first mounting space, the first fixing plate is connected to the heat dissipation housing and covers the first mounting port, and the second fixing plate is connected to the heat dissipation housing and covers the second mounting port. The first fixing plate and the second fixing plate are detachably connected to the heat dissipation housing, and the circuit board is arranged in the first installation space, one end of the circuit board is connected to the first fixing plate, and the other end is connected to the second fixing plate. During installation, the circuit board can be first fixed to the first fixing plate, and then the circuit board can be placed in the heat dissipation housing. The first fixing plate can be directly connected to the heat dissipation housing and cover the first installation port. The second fixing plate can be directly fixed to the circuit board when installed in the second installation port, which can facilitate the installation and maintenance of electronic components in the first installation space. The installation component is installed on the surface of the heat dissipation housing away from the first installation space. The network device can be directly installed with the external device through the installation component, which simplifies the installation method of the network device with the external device, and the network device as a whole can be quickly installed or uninstalled without disassembling the heat dissipation housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of some network devices provided in the embodiments of the present application;

[0017] Figure 2 It is a schematic diagram of the structure of some network devices provided in the embodiments of the present application;

[0018] Figure 3is an exploded diagram of some network devices provided in the embodiments of the present application;

[0019] Figure 4 It is a schematic diagram of the structure of some heat dissipation housings provided in the embodiments of the present application;

[0020] Figure 5 It is a schematic diagram of the structure of some first fixing plates and heat dissipation housings provided in the embodiments of the present application;

[0021] Figure 6 It is a schematic diagram of the structure of some second fixing plates and heat dissipation housings provided in the embodiments of the present application;

[0022] Figure 7 It is a schematic diagram of the structure of some installation components provided in the embodiments of the present application;

[0023] Figure 8 It is a schematic diagram of the structure of some first fixing parts and second fixing parts provided in the embodiments of the present application.

[0024] Description of reference numerals:

[0025] 1000. Network equipment;

[0026] 10. heat dissipation housing; 11. first main board; 12. second main board; 121. first mounting groove; 13. first side plate; 131. first heat dissipation fin; 132. second heat dissipation fin; 14. second side plate; 15. first mounting space; 151. first mounting port; 152. second mounting port; 16. first guide rail;

[0027] 20. Mounting assembly; 21. Connecting portion; 22. First limiting portion; 221. First clamping slot; 222. Second guide rail slot; 23. Second limiting portion; 231. Second clamping slot; 24. Clamping space; 25. Elastic member;

[0028] 30. first fixing plate; 31. first through hole; 32. first card interface;

[0029] 40. second fixing plate; 41. second through hole; 42. second card interface;

[0030] 50, circuit board; 51, first clamping portion; 511, first receiving groove; 52, second clamping portion; 53, LED lamp;

[0031] 60. First screw;

[0032] 70. Second screw;

[0033] 80. First terminal;

[0034] 90. Communication interface;

[0035] 100, first fixing portion; 101, first extending portion; 1011, first mounting hole; 1012, second mounting hole;

[0036] 110, second fixing portion; 111, second extending portion; 1111, third mounting hole; 1112, fourth mounting hole. DETAILED DESCRIPTION

[0037] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0038] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "several" is more than one, unless otherwise clearly and specifically defined.

[0039] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0040] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. In addition, the technical features involved in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.

[0041] In the first aspect, the present application embodiment proposes a network device 1000 based on the Internet of Things, please refer to Figures 1 to 3 The network device 1000 includes a heat dissipation housing 10 , a mounting assembly 20 , a first fixing plate 30 , a second fixing plate 40 and a circuit board 50 .

[0042] For the heat dissipation housing 10, please refer to Figure 4The heat dissipation housing 10 is a shell structure used in the network device 1000 that can effectively dissipate heat. It is made of materials with good thermal conductivity, such as metal materials such as aluminum, nickel, aluminum alloy or copper. These materials help to quickly conduct the generated heat from the internal electronic components to the outer surface of the heat dissipation housing 10, preventing the electronic components from being degraded or damaged due to overheating. The outer surface of the heat dissipation housing 10 in the embodiment of the present application has a large heat dissipation area so as to dissipate heat to the surrounding environment more quickly. For example, along the first direction (X), the heat dissipation housing 10 includes a first main board 11 and a second main board 12 that are arranged oppositely, and a first side plate 13 and a second side plate 14 that are arranged oppositely along the second direction (Y). The first side plate 13 and the second side plate 14 are arranged between the first main board 11 and the second main board 12. The first main board 11, the second main board 12, the first side plate 13 and the second side plate 14 are sequentially connected and enclosed to form the heat dissipation housing 10. The first main board 11, the second main board 12, the first side plate 13 and the second side plate 14 are all made of materials with good thermal conductivity to improve the heat dissipation performance of the heat dissipation housing 10. In addition, the heat dissipation housing 10 also has a certain buffering effect, which can reduce direct impact on the circuit board and reduce the impact of dust, water vapor, etc. in the external environment on the electronic components.

[0043] For further information, please refer to Figure 4 The heat dissipation housing 10 encloses a first installation space 15, which is an area or space for installation and operation of a specific device, system or component to ensure that the specific device, system or component can operate normally. Figure 5 and Figure 6 Along the third direction (Z), the heat dissipation housing 10 has a first installation opening 151 and a second installation opening 152 that are arranged opposite to each other, and the first installation opening 151 and the second installation opening 152 are both connected to the first installation space 15. The first installation opening 151 and the second installation opening 152 facilitate the installation or maintenance of electronic components in the first installation space 15, thereby improving the flexibility of the network device 1000.

[0044] For further information, please refer to Figure 4, the heat dissipation housing 10 is also provided with a first heat dissipation fin 131 and a second heat dissipation fin 132. The first heat dissipation fin 131 is protruding from the inner wall of the heat dissipation housing 10, and the first heat dissipation fin 131 can effectively increase the surface area of ​​the inner wall of the heat dissipation housing 10, thereby improving the heat transfer between the heat dissipation housing 10 and the first installation space 15, so that more heat is transferred to the surface of the heat dissipation housing 10, and then dissipated to the surrounding environment faster. Among them, a plurality of first heat dissipation fins 131 can be provided on the inner wall of the heat dissipation housing 10. The second heat dissipation fin 132 is protruding from the outer surface of the heat dissipation housing 10, and the second heat dissipation fin 132 can effectively increase the surface area of ​​the outer surface of the heat dissipation housing 10, thereby improving the heat exchange efficiency between the heat dissipation housing 10 and the outside air, increasing the contact between the air and the surface of the heat dissipation housing 10, and dissipating the heat to the outside of the heat dissipation housing 10, ensuring the normal operating temperature of the equipment, and avoiding performance degradation or damage to electronic components due to overheating. Among them, a plurality of second heat dissipation fins 132 can be provided on the outer surface of the heat dissipation housing 10.

[0045] In some embodiments, please refer to Figure 4 , observed from the inner wall to the outer wall of the heat dissipation housing 10, the first heat dissipation fin 131 and the second heat dissipation fin 132 at least partially overlap, for example, the first heat dissipation fin 131 can be arranged on the inner wall of the first side plate 13, and the second heat dissipation fin 132 can be arranged on the outer surface of the first side plate 13. Similarly, the first heat dissipation fin 131 can be arranged on the inner wall of the second side plate 14, and the second heat dissipation fin 132 can be arranged on the outer surface of the second side plate 14. The first heat dissipation fin 131 and the second heat dissipation fin 132 at least partially overlap, which reduces the heat transfer path, helps to quickly transfer heat from the first heat dissipation fin 131 to the second heat dissipation fin 132, and improves the heat dissipation efficiency.

[0046] For the above-mentioned installation assembly 20, please refer to Figure 1 , Figure 5 and Figure 7 The mounting assembly 20 is mounted on the surface of the heat dissipation housing 10 away from the first mounting space 15. The mounting assembly 20 is used to be fixedly mounted with an external device, so that the network device 1000 is fixedly mounted with the external device as a whole. The mounting assembly 20 simplifies the installation method of the network device 1000 with the external device, and the network device 1000 can be quickly installed or uninstalled without disassembling the heat dissipation housing 10. For example, the mounting assembly 20 is set on the first side panel 13, or the mounting assembly 20 is set on the second side panel 14.

[0047] In some embodiments, please refer to Figure 7The installation component 20 includes a connecting portion 21, a first limiting portion 22 and a second limiting portion 23. The first limiting portion 22 and the second limiting portion 23 are respectively arranged at the two ends of the connecting portion 21, and the first limiting portion 22 and the second limiting portion 23 are arranged opposite to each other. A first card slot 221 is arranged on the end surface of the first limiting portion 22 facing the second limiting portion 23, and a second card slot 231 is arranged on the end surface of the second limiting portion 23 facing the first limiting portion 22. The first card slot 221 and the second card slot 231 are used to be clamped with an external device to prevent it from falling. A clamping space 24 is formed between the first limiting portion 22 and the second limiting portion 23, and the external device can be embedded in the clamping space 24, so that the installation component 20 is fastened to the external device. The installation component 20 also includes an elastic member 25, which is arranged at the opening of the first card slot 221 and extends to the clamping space 24. When the external device is connected to the first slot 221, the elastic member 25 can fasten the external device in the first slot 221 to prevent the external device from falling out of the first slot 221. The elastic member 25 can be a spring, a rubber pad, a spring washer, etc.

[0048] For the first fixing plate 30 and the second fixing plate 40, please refer to Figure 3 Along the third direction, the first fixing plate 30 and the second fixing plate 40 are arranged on both sides of the heat dissipation housing 10, and then combined with Figure 5 , the first fixing plate 30 is connected to the heat dissipation housing 10 and covers the first installation opening 151. Specifically, a first through hole 31 is opened on the first fixing plate 30, and the network device 1000 further includes a first screw 60, which can be inserted into the first through hole 31 and threadedly connected to the heat dissipation housing 10. Similar to the structure of the first fixing plate 30, please refer to Figure 6 , the second fixing plate 40 is connected to the heat dissipation housing 10 and covers the second installation opening 152. The second fixing plate 40 is provided with a second through hole 41, and the network device 1000 further includes a second screw 70, which can be passed through the second through hole 41 and threadedly connected to the heat dissipation housing 10. The first fixing plate 30 and the second fixing plate 40 are detachably connected to the heat dissipation housing 10, so as to facilitate the installation and maintenance of the electronic components in the first installation space 15.

[0049] For the above-mentioned circuit board 50, please refer to Figure 3 The circuit board 50 is disposed in the first installation space 15 , and electronic components are mounted on the circuit board 50 , and the electronic components are accommodated in the first installation space 15 . One end of the circuit board 50 is connected to the first fixing plate 30 , and the other end is connected to the second fixing plate 40 .

[0050] For further information, please refer to Figure 5The first fixing plate 30 is provided with a first card interface 32, and the circuit board 50 is provided with a first clamping portion 51, which partially extends out of the circuit board 50 and is clamped with the inner wall of the first card interface 32. The first clamping portion 51 is provided with a first receiving groove 511, which is in communication with the first card interface 32. The network device 1000 further includes a first terminal 80, which is disposed in the first receiving groove 511. The first fixing plate 30 may be provided with a plurality of first card interfaces 32, and the circuit board 50 may be provided with a plurality of first clamping portions 51, and the plurality of first clamping portions 51 may be provided with a plurality of different external terminals for connecting with external devices.

[0051] For further information, please refer to Figure 6 The second fixing plate 40 is provided with a second card interface 42, and the circuit board 50 is provided with a second clamping portion 52, the second clamping portion 52 partially extends out of the circuit board 50, and the second clamping portion 52 is clamped with the inner wall of the second card interface 42. The second clamping portion 52 is provided with a second receiving groove (not shown in the figure), and the second receiving groove is communicated with the second card interface 42. The network device 1000 also includes a communication interface 90, which is arranged in the second receiving groove and extends out of the second card interface 42. Among them, the second fixing plate 40 can be provided with multiple second card interfaces 42, and the circuit board 50 can be provided with multiple second clamping portions 52. Multiple second clamping portions 52 can be provided with multiple different types of communication interfaces 90 to achieve communication connection with external devices.

[0052] In the embodiment of the present application, the network device 1000 includes a heat dissipation housing 10, a mounting assembly 20, a first fixing plate 30, a second fixing plate 40 and a circuit board 50. The heat dissipation housing 10 has good thermal conductivity and can quickly transfer the heat in the housing to the outside of the housing. The inner wall of the heat dissipation housing 10 is provided with a first heat dissipation tooth plate 131, which can effectively increase the inner surface area of ​​the heat dissipation housing 10, and the heat generated by the electronic components on the circuit board 50 can fully contact the inner surface of the heat dissipation housing, which can improve the efficiency of the heat conduction system. The outer surface of the heat dissipation housing 10 is provided with a second heat dissipation tooth plate 132, which can effectively increase the surface area of ​​the outer surface of the heat dissipation housing 10, improve the heat exchange efficiency between the heat dissipation housing 10 and the outside air, increase the contact between the air and the surface of the heat dissipation housing 10, dissipate the heat to the outside of the heat dissipation housing 10, ensure the normal working temperature of various electronic components on the circuit board 50, and reduce the performance degradation or damage of electronic components due to overheating. The heat dissipation housing 10 also has a first installation opening 151 and a second installation opening 152 communicated with the first installation space 15. The first fixing plate 30 is connected to the heat dissipation housing 10 and covers the first installation opening 151. The second fixing plate 40 is connected to the heat dissipation housing 10 and covers the second installation opening 152. The first fixing plate 30 and the second fixing plate 40 are detachably connected to the heat dissipation housing 10, and the circuit board 50 is arranged in the first installation space 15. One end of the circuit board 50 is connected to the first fixing plate 30, and the other end is connected to the second fixing plate 40. When installing, the circuit board 50 can be first fixed to the first fixing plate 30, and then the circuit board 50 is placed in the heat dissipation housing 10. The first fixing plate 30 can be directly connected to the heat dissipation housing 10 and covers the first installation opening 151. When the second fixing plate 40 is installed in the second installation opening 152, it can be directly fixed to the circuit board 50, which can facilitate the installation and maintenance of electronic components in the first installation space 15. The installation component 20 is installed on the surface of the heat dissipation shell 10 away from the first installation space 15. The network device 1000 can be directly installed with the external device through the installation component 20, which simplifies the installation method of the network device 1000 with the external device. The network device 1000 can be quickly installed or uninstalled as a whole without disassembling the heat dissipation shell 10.

[0053] In some embodiments, please refer to Figure 4 , Figure 7 and Figure 8The network device 1000 further includes a first fixing portion 100, which is disposed on a surface of the first mainboard 11 away from the first installation space 15. The first fixing portion 100 includes a first extension portion 101, which extends out of the first side plate 13, and is provided with a first mounting hole 1011 and a second mounting hole 1012, which are disposed on both sides of the first extension portion 101, and the first mounting hole 1011 and the second mounting hole 1012 are communicated with the clamping space 24. The first mounting hole 1011 and the second mounting hole 1012 in the first fixing portion 100 can be mounted and fixed on a wall, an external device, etc. with screws, bolts, etc.

[0054] In some embodiments, please refer to Figure 4 and Figure 8 The network device 1000 further includes a second fixing portion 110, which is disposed on a surface of the first mainboard 11 away from the first installation space 15, and the second fixing portion 110 and the first fixing portion 100 are disposed on both sides of the first mainboard 11 opposite to each other. The second fixing portion 110 includes a second extension portion 111, which extends out of the second side plate 14, and the second extension portion 111 is provided with a third mounting hole 1111 and a fourth mounting hole 1112, which are disposed on both sides of the second extension portion 111 opposite to each other. The third mounting hole 1111 and the fourth mounting hole 1112 in the second fixing portion 110 can be mounted and fixed on a wall, an external device, etc. with screws, bolts, etc.

[0055] The first fixing portion 100 , the second fixing portion 110 and the installation assembly 20 can be flexibly fixed according to the location where the network device 1000 needs to be fixed, so as to meet different fixing requirements.

[0056] In some embodiments, please refer to Figure 4 A first guide rail 16 is provided on the surface of the first main board 11 facing the first installation space 15, and a first guide rail 16 groove (not shown in the figure) is opened on the circuit board 50. The circuit board 50 is slidably connected to the first guide rail 16 through the first guide rail 16 groove, so that the circuit board 50 can be easily placed or removed from the first installation space 15, which simplifies the installation procedure of the circuit board 50 and facilitates maintenance and replacement.

[0057] In some embodiments, the mounting assembly 20 is disposed on the first heat dissipation fin 131 and / or the second heat dissipation fin 132, and the mounting assembly 20 can conduct heat on the first heat dissipation fin 131 and / or the second heat dissipation fin 132 to increase the heat dissipation area and improve the heat dissipation efficiency. Figure 1 and Figure 7Along the first direction (X), the surface of the first limit portion 22 away from the first side plate 13 is provided with a second guide groove 222. The network device 1000 can slide to a specified position along the first direction (X) through the second guide groove 222 to achieve rapid installation and uninstallation with external devices.

[0058] In some embodiments, please refer to Figure 3 and Figure 4 The second mainboard 12 is provided with a first mounting slot 121, and the circuit board 50 is connected with an LED lamp 53, which is arranged in the first mounting slot 121 and exposed on the outer surface of the second mainboard 12. The LED lamp 53 can be used to display the working state of the network device 1000, such as the running state, the fault state, the communication state, etc. The current working state of the network device 1000 can be intuitively understood through the LED lamp 53 of different colors or flashing modes, so as to take corresponding measures in time.

[0059] It should be noted that the preferred embodiments of the utility model are given in the specification and drawings of the utility model, but the utility model can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional restrictions on the content of the utility model. The purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the utility model; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the utility model.

Claims

1. A network device based on the Internet of Things, characterized in that: include: A heat dissipation shell encloses a first installation space, the heat dissipation shell has a first installation opening and a second installation opening that are arranged opposite to each other, the first installation opening and the second installation opening are both communicated with the first installation space, the heat dissipation shell is further provided with a first heat dissipation tooth plate and a second heat dissipation tooth plate, the first heat dissipation tooth plate is convexly arranged on the inner wall of the heat dissipation shell, and the second heat dissipation tooth plate is convexly arranged on the outer surface of the heat dissipation shell; A mounting assembly mounted on a surface of the heat dissipation housing facing away from the first mounting space; a first fixing plate and a second fixing plate, wherein the first fixing plate is connected to the heat dissipation housing and covers the first mounting opening, and the second fixing plate is connected to the heat dissipation housing and covers the second mounting opening; A circuit board is arranged in the first installation space, one end of the circuit board is connected to the first fixing plate, and the other end of the circuit board is connected to the second fixing plate.

2. The network device according to claim 1, characterized in that: The mounting assembly comprises a connecting portion, a first limiting portion and a second limiting portion, wherein the first limiting portion and the second limiting portion are respectively arranged at two ends of the connecting portion, and the first limiting portion and the second limiting portion are arranged opposite to each other, a first clamping groove is arranged on an end surface of the first limiting portion facing the second limiting portion, and a clamping space is formed between the first limiting portion and the second limiting portion; The mounting assembly further includes an elastic member, which is disposed at an opening of the first slot and extends to the clamping space.

3. The network device according to claim 2, characterized in that: The heat dissipation housing comprises a first main board and a second main board arranged opposite to each other in the first direction, and a first side plate and a second side plate arranged opposite to each other in the second direction, wherein the first side plate and the second side plate are arranged between the first main board and the second main board, and the first main board, the second main board, the first side plate and the second side plate are sequentially connected to form the heat dissipation housing; The mounting assembly is arranged on the first side plate, and the network device further comprises a first fixing portion, and the first fixing portion is arranged on a surface of the first mainboard away from the first mounting space; The first fixing portion includes a first extension portion, the first extension portion extends out of the first side plate, the first extension portion is provided with a first mounting hole and a second mounting hole, the first mounting hole and the second mounting hole are arranged on both sides of the first extension portion, and the first mounting hole and the second mounting hole are communicated with the clamping space.

4. The network device according to claim 3, characterized in that: A first guide rail is disposed on a surface of the first mainboard facing the first installation space, a first guide rail groove is formed on the circuit board, and the circuit board is slidably connected to the first guide rail through the first guide rail groove.

5. The network device according to claim 3, characterized in that: Along the first direction, a second guide rail groove is provided on a surface of the first limiting portion away from the first side plate.

6. The network device according to claim 3, characterized in that: The second mainboard is provided with a first mounting groove, the circuit board is connected with an LED lamp, and the LED lamp is arranged in the first mounting groove and exposed on the outer surface of the second mainboard.

7. The network device according to claim 1, characterized in that: The first fixing plate is provided with a first card interface, the circuit board is provided with a first card connection portion, the first card connection portion partially extends out of the circuit board, and the first card connection portion is carded with an inner wall of the first card interface; The first card connection portion is provided with a first receiving slot, the first receiving slot is communicated with the first card interface, and the network device further comprises a first terminal, the first terminal is arranged in the first receiving slot.

8. The network device according to claim 1, characterized in that: When viewed from the inner wall to the outer wall of the heat dissipation housing, the first heat dissipation fins and the second heat dissipation fins at least partially overlap.

9. The network device according to claim 1, characterized in that: The second fixing plate is provided with a second card interface, the circuit board is provided with a second card connection portion, the second card connection portion partially extends out of the circuit board, and the second card connection portion is carded with an inner wall of the second card interface; The second card connection portion is provided with a second receiving slot, the second receiving slot is communicated with the second card interface, and the network device further comprises a communication interface, the communication interface is arranged in the second receiving slot and extends out of the second card interface.

10. The network device according to claim 3, characterized in that: The network device further includes a second fixing portion, the second fixing portion being arranged on a surface of the first mainboard facing away from the first installation space, and the second fixing portion being arranged on two sides of the first mainboard opposite to the first fixing portion; The second fixing portion includes a second extending portion, the second extending portion extends out of the second side plate, the second extending portion is provided with a third mounting hole and a fourth mounting hole, and the third mounting hole and the fourth mounting hole are arranged on two sides of the second extending portion opposite to each other.

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