Vehicle-mounted circuit board and vehicle-mounted product
By setting holes and pads around the screw holes of the on-board circuit board, and applying solder paste, combined with ground wire coupling and through-slot design, the problem of on-board circuit board oxidation is solved, the electromagnetic compatibility performance and connection stability are improved, and the connection stability is reduced oxidation risk and wiring pressure.
Patent Information
- Application Number
- CN202420356715.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-26
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-02-26
AI Technical Summary
Existing automotive circuit boards are prone to oxidation after long-term contact of air, resulting in poor electromagnetic compatibility performance, especially the oxidation problem in exposed positions after using OSP process is difficult to solve.
A plurality of holes are provided in the area around the screw holes and a first pad is provided between adjacent holes, increasing the roughness of the solder ring and the adhesion ability of the nuts, and then applying solder paste to the area around the screw holes to prevent oxidation, while A through-groove splitting device is provided on the circuit board, the ground wire is coupled to the screw hole, and an opening is provided on the box to connect external components to reduce the risk of oxidation.
It effectively improves the electromagnetic compatibility performance of the circuit board, prevents oxidation, strengthens the connection force between the screw holes and the nuts, reduces wiring pressure and saves costs.
Smart Images

Figure CN222170076U_ABST
Abstract
Description
Technical Field
[0001] The present application is applied to the technical field of vehicle-mounted products, and in particular, relates to a vehicle-mounted circuit board and a vehicle-mounted product. Background Art
[0002] The existing PCB (circuit board) surface treatment of automotive products basically uses the immersion gold process or the immersion gold process plus the OSP process (organic coating method). Although the immersion gold process oxidizes relatively slowly and has good EMC (electromagnetic compatibility) performance, the immersion gold process consumes a lot of gold salts and has a high cost, which is about 5% higher than the OSP process. The OSP process uses a chemical method to generate a layer of organic film on the copper surface of the circuit board. Although the cost of processing the circuit board is lower than that of the immersion gold process, the OSP process will oxidize the exposed position due to long-term contact with air after welding, which cannot meet the EMC performance requirements well. Utility Model Content
[0003] The present application provides a vehicle-mounted circuit board to solve the problem that the exposed copper area of the vehicle-mounted circuit board is easily oxidized.
[0004] To solve the above technical problems, the first aspect of the present application provides a vehicle-mounted circuit board, including: a circuit board; a screw hole, the screw hole is arranged on one surface of the circuit board, a plurality of holes are arranged in the area around the screw hole, and a first soldering pad is arranged between adjacent holes; and solder paste, the solder paste covers the area around the screw hole.
[0005] The first soldering pad is arranged in a rectangular shape, and the first soldering pad protrudes around the screw hole.
[0006] The ground wire of the circuit board is coupled to the ground wire of the screw hole.
[0007] A through slot is provided on the circuit board, the screw hole is located on one side of the through slot, and other components on the circuit board are located on the other side of the through slot.
[0008] Among them, the vehicle-mounted circuit board also includes: a box body, the circuit board is arranged in the box body, and the screw holes are exposed in the box body; an opening is opened on the box body, and a connecting part corresponding to the opening is arranged on the circuit board, and the connecting part is used to connect external components.
[0009] The opening is arranged on one side end surface of the box body or around the box body.
[0010] Wherein, a copper layer is arranged on the connecting portion, second soldering pads are evenly arranged on the copper layer, and solder paste is arranged on the second soldering pad to prevent oxidation of the copper layer.
[0011] To solve the above problems, the present application also provides a vehicle-mounted product, including: a shell; a vehicle-mounted circuit board arranged in the shell, and the vehicle-mounted circuit board is any of the above-mentioned vehicle-mounted circuit boards.
[0012] Among them, the vehicle-mounted product also includes: a screw, a screw hole is connected to the shell through the screw, a nut is arranged on the screw, and the nut covers the area around the screw hole.
[0013] The ground wire of the screw hole is coupled to the ground wire of the housing, and the ground of the circuit board is coupled to the external components.
[0014] The beneficial effects of the present application are as follows: different from the prior art, the present application effectively increases the roughness of the solder ring in the area around the screw hole and increases the adhesion between the screw nut and the area around the screw hole by setting a plurality of holes in the area around the screw hole, and sets a first solder pad between adjacent holes, which effectively increases the friction when the area around the screw hole and the nut are connected. On this basis, solder paste is set in the area around the screw hole, which can effectively prevent oxidation of the exposed position of the circuit board after long-term contact with the air, thereby improving the electromagnetic compatibility performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of an embodiment of the vehicle-mounted circuit board of the present application;
[0016] Figure 2 It is a structural schematic diagram of a screw hole and a hole in an embodiment of a vehicle-mounted circuit board of the present application;
[0017] Figure 3 It is a structural schematic diagram of an embodiment of a screw hole and a first pad of a vehicle-mounted circuit board of the present application;
[0018] Figure 4 This is a schematic structural diagram of an embodiment of a circuit board and a through slot of the present application;
[0019] Figure 5 It is a structural schematic diagram of an embodiment of the connection between the box body and the circuit board of the present application. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0021] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0023] See also Figure 1 , Figure 1 It is a structural schematic diagram of an embodiment of a vehicle-mounted circuit board provided by the present application.
[0024] The present application provides a vehicle-mounted circuit board. Figure 1 As shown, the audio vehicle circuit board of this embodiment includes a circuit board 10, a screw hole 20, and solder paste (not shown). Among them, the screw hole 20 is set on the surface of one side of the circuit board 10, and a plurality of holes 30 are set in the area around the screw hole 20, and a first solder pad 40 is set between adjacent holes 30. The solder paste covers the area around the screw hole 20. Among them, multiple holes 30 are set in the area around the screw hole 20. The number of holes 30 can be 2, 3, 4 or more. The hole 30 can be a through hole, that is, it is set to pass through the circuit board 10; the hole 30 can also be set as a blind hole, that is, it does not pass through the circuit board 10. The depth of the hole 30 can be determined according to the subsequent requirement of setting solder paste in the area around the screw hole 20, and this application does not make specific restrictions here. The hole 30 can be a circular hole, an elliptical hole, a fan-shaped hole, a polygonal hole such as a triangular hole, a square hole, a diamond hole, or a hole of other irregular shapes. And the multiple holes 30 set in the area around the screw hole 20 can be evenly arranged, and the first solder pad 40 is also evenly arranged between adjacent holes 30. This arrangement is to facilitate the subsequent setting of solder paste in the area of the screw hole 20 so that the solder paste becomes uniform, thereby preventing tin leakage and the like. The positions of the hole 30 and the first solder pad 40 can also be set according to the need to fix the circuit board 10 later, and this application does not make specific restrictions here. Among them, when tinning around the screw hole 20, the solder paste can be set in the area around the screw hole 20 by solder paste printing or laser tinning, and other methods can also be used for tinning. When tinning the area around the screw hole 20, the shape of the solder paste can be tinned according to the shape of the hole, and this application does not make specific restrictions here.
[0025] In an optional embodiment, after the surface of the vehicle circuit board is treated with OSP process (organic coating method), Figure 2 and Figure 3As shown, a plurality of holes 30 are arranged in the area around the screw hole 20 on the circuit board 10, and a first soldering pad 40 is arranged between adjacent holes 30. During tin plating, due to the plurality of holes 30 in the area around the screw hole 20, the roughness of the soldering ring in the area around the screw hole 20 is effectively increased, and when the circuit board 10 is subsequently fixed by screws, the adhesion between the screw nut and the area around the screw hole 20 can be effectively increased. When the area around the screw hole 20 is tin-plated, the first soldering pad 40 can further increase the friction force when the screw nut and the area around the screw hole 20 are connected, and tin plating on the first soldering pad 40 can effectively reduce the oxidation rate of the first soldering pad 40 and the area around the screw hole 20, thereby preventing oxidation and the like from occurring after the circuit board 10 is subsequently fixed.
[0026] In the above embodiment, after the surface of the vehicle circuit board is treated with the OSP process, a plurality of holes 30 are set in the area around the screw hole 20, so that the roughness of the solder ring in the area around the screw hole 20 is effectively increased, and the adhesion ability of the screw nut and the area around the screw hole 20 is increased. A first solder pad 40 is set between adjacent holes 30, so that the friction force when the area around the screw hole 20 is connected with the nut is effectively increased. On this basis, solder paste is set in the area around the screw hole 20, which can effectively prevent the circuit board 10 from oxidizing at the exposed position after long-term contact with the air, thereby improving the electromagnetic compatibility performance of the circuit board 10.
[0027] In an alternative embodiment, such as Figure 3 As shown, the first solder pad 40 is set to be rectangular, and the first solder pad 40 protrudes around the screw hole 20. Among them, the first solder pad 40 can also be a steel mesh laid in the area around the screw hole 20, or set to other shapes, such as triangles, ellipses, etc., or other irregular shapes, which are not specifically limited in this application. By setting the first solder pad 40 to be rectangular, the friction force of the area around the screw hole 20 is increased, and when the circuit board 10 is fixed, the nut of the screw is prevented from being oxidized when connected to the area around the screw hole 20, and when the area around the screw hole 20 is tinned, the adhesion of the solder paste to the area around the screw hole 20 can be improved, which facilitates the tinning of the circuit board 10. And the first soldering pad 40 is arranged to protrude around the screw hole 20, that is, when the area around the screw hole 20 is tinned, the first soldering pad 40 protrudes from the area around the screw hole 20, which can better tin the area around the screw hole 20, thereby preventing oxidation of the area around the screw hole 20 and the first soldering pad 40 after the circuit board 10 is OSP treated, thereby improving the electromagnetic compatibility performance of the circuit board 10.
[0028] In an optional embodiment, the ground wire (not shown) of the circuit board 10 is coupled with the ground wire (not shown) of the screw hole 20. This reduces the wiring pressure of the circuit board 10 and facilitates the layout of the circuit board 10 when it is installed in a vehicle-mounted product. Among them, the ground wire of the circuit board 10 and the ground wire of the screw hole 20 can be separately connected to other ground wires, which is not specifically limited in this application. Further, when the ground wire of the circuit board 10 is coupled with the ground wire of the screw hole 20, a through slot 50 is opened on the circuit board 10, the screw hole 20 is located on one side of the through slot 50, and other devices 60 on the circuit board 10 are located on the other side of the through slot 50. Since other devices 60 are provided on the circuit board 10, the through slot 50 is opened on the circuit board 10, so that the screw hole 20 on the circuit board 10 can be separated from the other devices 60 on the circuit board 10. Among them, other devices 60 on the circuit board 10 may be sensitive devices such as chips. Since the screw holes 20 may interfere with other devices 60 when the circuit board 10 is installed, a through groove 50 is opened on the circuit board 10 to separate the screw holes 20 from other devices 60 to avoid the screw holes 20 interfering with other devices 60 when the ground wire of the screw holes 20 is coupled with the ground wire of the circuit board 10.
[0029] In an optional embodiment, if Figure 5 As shown, the vehicle-mounted circuit board also includes: a box body 70, a circuit board 10 is arranged in the box body 70, and a screw hole 20 is exposed in the box body 70; an opening 701 is opened on the box body 70, and a connecting portion 80 corresponding to the opening 701 is arranged on the circuit board 10, and the connecting portion 80 is used to connect external components. Among them, the box body 70 is set according to the size and shape of the circuit board 10, and the opening 701 on the box body 70 is set according to the size of the connecting portion 80 on the circuit board 10, and can also be set according to the interface on the connecting portion 80 that needs to connect the signal line or power line, which is not specifically limited in this application. In order to install the circuit board 10 on the vehicle body, by setting the circuit board 10 in the box body 70, the circuit board 10 can be effectively protected, thereby preventing the circuit board 10 from being damaged during installation, and the screw hole 20 is exposed in the box body 70, which can facilitate the installation of the circuit board 10 on the vehicle body. Among them, since the circuit board 10 needs to transmit signals and the like with the vehicle body or external components on the vehicle body, an opening 701 is set on the box body 70, and a connecting portion 80 corresponding to the opening 701 of the box body 70 is set on the circuit board 10. The connecting portion 80 is connected to a signal line or a power line, etc. When the circuit board 10 is installed on the vehicle body, the signal line or the power line connected to the connecting portion 80 on the circuit board 10 is connected to the vehicle body or external components on the vehicle body through the opening 701 on the box body 70.
[0030] In an optional embodiment, the opening 701 is arranged on one side end face of the box body 70 or arranged around the box body 70. Since the vehicle-mounted circuit board may be connected to multiple external components or the installation position on the vehicle body is different when it is installed. Therefore, the connection part 80 on the circuit board 10 can be set according to the position connected to the external component, for example, the connection part 80 on the circuit board 10 is set at the position closest to the external component to be connected, thereby reducing the pressure of subsequent wiring and saving costs. The connection part 80 on the circuit board 10 and the position of the opening 701 on the box body 70 can also be set according to the position of the box body 70 in the vehicle body, so as to facilitate the overall layout of the box body 70 in the vehicle body, and the present application is not specifically limited here. Further, according to the position of the connection part 80 on the circuit board 10, the opening 701 on the box body 70 corresponds to the position of the connection part 80 on the circuit board 10, which facilitates the wiring of the circuit board 10. Therefore, the opening 701 on the box body 70 is located on the end face of the box body 70, and can also be opened around the box body 70, and the present application is not specifically limited here.
[0031] In an optional embodiment, if Figure 5 As shown, a copper layer (not shown) is provided on the connecting portion 80, and a second soldering pad 90 is evenly provided on the copper layer, and a solder paste (not shown) is provided on the second soldering pad 90 to prevent oxidation of the copper layer. Among them, the second soldering pad 90 on the copper layer can also be provided as needed, and can cover part of the connecting portion 80, or can fully cover the connecting portion 80. This application does not make specific limitations here, and the shape of the second soldering pad 90 and the method of tinning on the second soldering pad 90 are the same as described above, and no further details are given here. After the surface of the vehicle-mounted circuit board is treated with the OSP process, since the copper layer is provided on the connecting portion 80, it is easy to oxidize after contacting with the air. By providing the second soldering pad 90 on the copper layer and providing the solder paste on the second soldering pad 90, it can effectively prevent the copper layer on the connecting portion 80 from being oxidized in the exposed position after long-term contact with the air, thereby improving the electromagnetic compatibility performance of the circuit board 10.
[0032] In the above manner, the present application effectively increases the roughness of the solder ring in the area around the screw hole 20 and increases the adhesion of the screw nut and the area around the screw hole 20 by setting a plurality of holes 30 in the area around the screw hole 20, and sets a first solder pad 40 between adjacent holes 30, and sets solder paste in the area around the screw hole 20, which can effectively prevent the circuit board 10 from being oxidized at the exposed position after being in contact with the air for a long time, thereby improving the electromagnetic compatibility performance of the circuit board 10. By setting the first solder pad 40 in a rectangular shape and protruding from the area around the screw hole 20, the friction force in the area around the screw hole 20 can be increased, and the nut of the screw can be prevented from being oxidized when connected to the area around the screw hole 20 when the circuit board 10 is fixed. By coupling the ground wire of the circuit board 10 with the ground wire of the screw hole 20 and setting a through slot 50 on the circuit board 10, the screw hole 20 on the circuit board 10 can be separated from other devices 60 on the circuit board 10, so as to avoid the situation where the screw hole 20 interferes with other devices 60 when the ground wire of the screw hole 20 is coupled with the ground wire of the circuit board 10. By setting the circuit board 10 in the box body 70 and opening the box body 70 corresponding to the connection part 80 of the circuit board 10, on the one hand, the box body 70 can effectively protect the circuit board 10, and on the other hand, the signal line or power line connected to the connection part 80 on the circuit board 10 is connected to the vehicle body or external components on the vehicle body through the opening 701 on the box body 70. By setting the opening 701 on one side of the box body 70 or around the box body 70, it is convenient to connect the circuit board 10 with external components, thereby reducing the pressure of subsequent wiring and saving costs. By evenly arranging the second soldering pad 90 on the copper layer of the connection part 80 and arranging solder paste on the second soldering pad 90, it is possible to effectively prevent the copper layer on the connection part 80 from being oxidized in the exposed position after being in contact with the air for a long time.
[0033] The present application also provides a vehicle-mounted product, which includes: a shell and a vehicle-mounted circuit board, the vehicle-mounted circuit board is arranged in the shell, and the vehicle-mounted circuit board is the vehicle-mounted circuit board of any of the above-mentioned embodiments.
[0034] In an optional embodiment, the vehicle-mounted product further includes: a screw, the screw hole 20 is connected to the housing by means of the screw, a nut is provided on the screw, and the nut covers the area around the screw hole 20. Therefore, when the circuit board 10 is mounted on the vehicle-mounted product, since solder paste is provided around the screw hole 20 on the vehicle-mounted circuit board, and the circuit board 10 with the screw hole 20 is mounted and fixed on the vehicle-mounted product by means of the screw through the via hole 30 and the first soldering pad 40 in the area around the screw hole 20, the adhesion ability of the nut of the screw and the area around the screw hole 20 is greatly enhanced, which can effectively reduce the oxidation of the nut and the area around the screw hole 20, and since solder paste is provided on the area around the screw hole 20, when connecting with the screw, the area around the screw hole 20 and the first soldering pad 40 are not oxidized, and when connecting the screw, the conductivity of the nut on the screw and the area around the screw hole 20 can be effectively improved.
[0035] In an optional embodiment, the ground wire of the screw hole 20 is coupled to the ground wire of the housing, and the ground wire of the circuit board 10 is coupled to the external components. When installing vehicle-mounted products, in order to prevent the sensitive components from interfering with other components 60 due to the screw hole 20 when the circuit board 10 is installed, the ground wire of the screw hole 20 can be processed to be coupled with the ground wire of the circuit board 10, and the ground wire of the circuit board 10 is coupled to the external components, thereby reducing the interference of the screw hole 20 with other components 60. In a specific embodiment, the ground wire of the screw hole 20 can be connected to the housing, and the ground wire of the circuit board 10 can be independently designed to be connected to the digital ground wire, thereby effectively avoiding mutual interference between them.
[0036] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A vehicle-mounted circuit board, characterized in that: The vehicle-mounted circuit board comprises: Circuit boards; A screw hole, wherein the screw hole is arranged on a surface of one side of the circuit board, a plurality of holes are arranged in an area around the screw hole, and a first soldering pad is arranged between adjacent holes; Solder paste covers the area around the screw hole.
2. The vehicle-mounted circuit board according to claim 1, characterized in that: The first soldering pad is configured to be rectangular, and the first soldering pad protrudes from the periphery of the screw hole.
3. The vehicle-mounted circuit board according to claim 1, characterized in that: The ground line of the circuit board is coupled to the ground line of the screw hole.
4. The vehicle-mounted circuit board according to claim 3, characterized in that: A through slot is provided on the circuit board, the screw hole is located on one side of the through slot, and other components on the circuit board are located on the other side of the through slot.
5. The vehicle-mounted circuit board according to claim 1, characterized in that: The vehicle-mounted circuit board also includes: A box body, wherein the circuit board is arranged in the box body, and the screw hole is exposed in the box body; The box body is provided with an opening, and the circuit board is provided with a connecting portion corresponding to the opening, and the connecting portion is used to connect with external components.
6. The vehicle-mounted circuit board according to claim 5, characterized in that: The opening is arranged on one side end surface of the box body or around the box body.
7. The vehicle-mounted circuit board according to claim 5, characterized in that: A copper layer is arranged on the connecting portion, second pads are evenly arranged on the copper layer, and solder paste is arranged on the second pads to prevent oxidation of the copper layer.
8. A vehicle-mounted product, characterized in that: The vehicle-mounted products include: The housing is provided with the vehicle-mounted circuit board on the housing, and the vehicle-mounted circuit board is the vehicle-mounted circuit board according to any one of claims 1 to 7.
9. The vehicle-mounted product according to claim 8, characterized in that: The vehicle-mounted products also include: A screw, wherein the screw hole is connected to the housing through the screw, and a nut is provided on the screw, and the nut covers the area around the screw hole.
10. The vehicle-mounted product according to claim 8, characterized in that: The ground line of the screw hole is coupled to the ground line of the housing, and the ground of the circuit board is coupled to external components.
