PCB (printed circuit board) beneficial to heat dissipation

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a PCB facilitating heat dissipation, which comprises a board body, heat dissipation holes are arranged on the board body, copper columns are plugged in the positions of the heat dissipation holes, a heat dissipation fin board is welded on the copper columns, heat dissipation bumps are uniformly arranged on the heat dissipation fin board in a protruding manner, and heat dissipation arc grooves are arranged on the heat dissipation bumps. The copper columns are installed at the positions of the heat dissipation holes, the heat dissipation contact face of the plate body and the heat dissipation fin plate is not reduced, the heat conduction effect is good, the heat dissipation fin plate is structurally improved, the heat dissipation protruding blocks and the heat dissipation arc grooves are additionally arranged, the heat dissipation contact face of the heat dissipation fin plate and air is enlarged, cleaning is easy, and dirt is not blocked.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB circuit boards, in particular to a PCB circuit board that helps dissipate heat. Background Art

[0002] PCB circuit boards must be designed to dissipate heat, otherwise problems will arise when used at high temperatures. Generally, heat dissipation holes are opened to dissipate heat, and then heat sinks are welded at the positions of the heat dissipation holes. Due to the existence of the heat dissipation holes, the heat dissipation contact area is reduced, and the heat sink is a plate structure, so the heat dissipation surface is not large. Utility Model Content

[0003] The utility model aims to provide a PCB circuit board that helps to dissipate heat, so as to solve the problem in the background art that the heat dissipation contact surface is reduced due to the existence of the heat dissipation holes, and the heat sink is a plate structure with a small heat dissipation surface.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A PCB circuit board that helps heat dissipation includes a board body, a heat dissipation hole is provided on the board body, a copper column is installed in the position of the heat dissipation hole, a heat sink plate is welded and installed on the copper column, heat dissipation bumps are evenly raised on the heat sink plate, and heat dissipation arc grooves are provided on the heat dissipation bumps.

[0006] As a further description of the above technical solution:

[0007] Glue is applied on the edges of the heat sink plate and the plate body.

[0008] As a further description of the above technical solution:

[0009] The glue liquid is heat dissipation glue.

[0010] As a further description of the above technical solution:

[0011] The spacing between the heat dissipation bumps is greater than 5 mm.

[0012] As a further description of the above technical solution:

[0013] The heat dissipation bump is square in shape.

[0014] As a further description of the above technical solution:

[0015] The distance between the bottom of the heat dissipation arc groove and the plate body is less than 2 mm.

[0016] Compared with the prior art, the utility model provides a PCB circuit board that helps dissipate heat and has the following beneficial effects:

[0017] 1. In the utility model, the copper column is installed at the heat dissipation hole position, which does not reduce the heat dissipation contact surface between the plate body and the heat sink plate, and has a good heat conduction effect;

[0018] 2. In the utility model, the heat sink plate is structurally improved, heat dissipation bumps and heat dissipation arc grooves are added, the heat dissipation contact surface between the heat sink plate and the air is increased, and it is easy to clean without getting dirty. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the copper column structure of the utility model.

[0021] Legend:

[0022] 1. Board body; 2. Copper column; 3. Heat sink plate; 4. Heat dissipation bump; 5. Heat dissipation arc groove. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example:

[0025] See also Figure 1-Figure 2 The utility model provides a PCB circuit board that helps heat dissipation, including a board body 1, a heat dissipation hole is provided on the board body 1, a copper column 2 is installed inside the heat dissipation hole, a heat sink plate 3 is welded and installed on the copper column 2, a heat dissipation protrusion 4 is uniformly protruded on the heat sink plate 3, and a heat dissipation arc groove 5 is provided on the heat dissipation protrusion 4.

[0026] Specifically, glue is applied on the edge of the heat sink plate 3 and the plate body 1. The glue is heat dissipation glue, which increases the heat dissipation effect and is dust-proof and waterproof.

[0027] Specifically, the spacing between the heat dissipation bumps 4 is greater than 5 mm, and the ventilation effect is good.

[0028] Specifically, the heat dissipation protrusion 4 is square in shape, which is convenient for providing the heat dissipation arc groove 5 .

[0029] Specifically, the distance between the bottom of the heat dissipation arc groove 5 and the plate body 1 is less than 2 mm, which is close to the heat source and has a good heat dissipation effect.

[0030] Working principle:

[0031] First, a heat dissipation hole is opened, and copper liquid is poured at the position of the heat dissipation hole. Then, the copper liquid is cooled to form a copper column 2. The copper column 2 is polished, and then the heat sink plate 3 is welded and installed. Heat is introduced from the plate body 1 and the copper column 2 into the heat sink plate 3. Due to the presence of the heat dissipation bump 4 and the heat dissipation arc groove 5, the heat dissipation surface of the heat sink plate 3 is increased, and it is easy to clean without getting dirty.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board that helps dissipate heat, comprising a board body (1), characterized in that: The plate body (1) is provided with a heat dissipation hole, a copper column (2) is installed in the position of the heat dissipation hole, a heat sink plate (3) is welded and installed on the copper column (2), heat dissipation bumps (4) are evenly raised on the heat dissipation plate (3), and a heat dissipation arc groove (5) is provided on the heat dissipation bump (4).

2. A PCB circuit board with heat dissipation according to claim 1, characterized in that: Glue is applied on the edges of the heat sink plate (3) and the plate body (1).

3. A PCB circuit board with heat dissipation according to claim 2, characterized in that: The glue liquid is heat dissipation glue.

4. A PCB circuit board with heat dissipation according to claim 1, characterized in that: The spacing between the heat dissipation bumps (4) is greater than 5 mm.

5. The PCB circuit board with heat dissipation according to claim 1, characterized in that: The heat dissipation protrusion (4) is square in shape.

6. The PCB circuit board with heat dissipation according to claim 1, characterized in that: The distance between the bottom of the heat dissipation arc groove (5) and the plate body (1) is less than 2 mm.

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