Semiconductor etching cavity

Abstract

The utility model discloses a semiconductor etching cavity, and relates to the technical field of etching machines, the semiconductor etching cavity comprises a cavity, the lower end of the cavity is provided with four support columns, the lower ends of the four support columns are jointly provided with a recovery box, and the upper part of the left end and the upper part of the right end of the recovery box are provided with dredging components; the two dredging components are bilaterally symmetrical, a conveying component is connected to the middle of the right end of the recycling box in a penetrating mode, a hollow box is arranged in the recycling box, sieve plates are arranged at the left end and the right end of the hollow box, and an electric valve pipe is connected to the lower end of the hollow box in a penetrating mode. By arranging the dredging component, the sieve plate can be cleaned, so that the filter function of the sieve plate is recovered, liquid can conveniently and smoothly pass through the sieve plate, the circulation and use effects of a chemical solution are ensured, manual cleaning and cleaning by workers are not needed, waste of time and manpower resources is reduced, cleaned impurities can be conveyed by arranging the conveying component, and the cleaning efficiency is improved. And secondary pollution of impurities to the sieve plate is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of etching machines, in particular to a semiconductor etching chamber. Background Art

[0002] The etcher is a key equipment used in the manufacture of semiconductor devices. It is used to precisely remove unwanted parts from the surface of semiconductor materials by chemical corrosion or physical abrasion to form specific structures, through holes or patterns. These structures and patterns are crucial to the function and performance of semiconductor devices. The etcher usually consists of a control system, an etching chamber, an etching gas supply system, etc. Different etching methods and parameters can be selected according to needs. The etcher is widely used in integrated circuit manufacturing, photolithography, micro-nano processing and other fields, and is one of the indispensable key tools in semiconductor technology.

[0003] The prior art (publication number: CN 217489914 U) discloses a reaction chamber structure of an etcher, which relates to the technical field of etcher, and comprises a reaction chamber, wherein a movable sealing plate is detachably connected to the front of the reaction chamber, a quick response mechanism is arranged on the top and inner cavity of the reaction chamber, a filtering mechanism is arranged on the bottom of the reaction chamber, the quick response mechanism comprises a stepping motor and a mesh plate, and the stepping motor is fixedly mounted on the top of the reaction chamber.

[0004] Although the above patent can filter the chemical solution through the design of the filter screen plate, filter out the internal impurities in the inner cavity of the filter cartridge, avoid the problem of impurities affecting the normal use of the chemical solution, and improve the reliability of the device, it has the following disadvantages: after a certain period of use, the impurities will be blocked in the sieve holes on the filter screen plate. The blocked filter screen may prevent the liquid from passing smoothly, thereby affecting the circulation and use effect of the chemical solution, and workers are required to manually clean and clean it. Manual cleaning of the filter screen requires manual operation, which consumes time and human resources and needs further improvement. For this reason, we propose a semiconductor etching chamber. Utility Model Content

[0005] The main purpose of the utility model is to provide a semiconductor etching chamber, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A semiconductor etching chamber comprises a chamber, wherein four supporting columns are installed at the lower end of the chamber, a recovery box is commonly installed at the lower ends of the four supporting columns, dredging components are provided at the upper left end and the upper right end of the recovery box, and the two dredging components are left-right symmetrical components, a conveying component is inserted and connected at the middle of the right end of the recovery box, a hollow box is provided inside the recovery box, sieve plates are provided at the left and right ends of the hollow box, and an electric valve pipe is inserted and connected at the lower end of the hollow box.

[0008] Preferably, the dredging component includes an electric cylinder, which is installed on a recycling box, and the output end of the electric cylinder is movably inserted into the recycling box and fixedly connected to a movable plate, and a plurality of dredging needles are installed at one end of the movable plate close to the screen plate, and the dredging needles match the screen plate.

[0009] Preferably, the conveying component includes a cylinder, which is inserted and connected to the right end of the recovery box, and a motor is installed at the right end of the cylinder. A sewage pipe is inserted and connected to the lower right part of the outer cylindrical surface of the cylinder, and the output end of the motor extends into the cylinder and is transmission-connected to a rotating rod, and a spiral blade is fixedly sleeved on the outer surface of the rotating rod.

[0010] Preferably, the lower end of the electric valve tube extends into the cylinder.

[0011] Preferably, the inner movable sleeve of the movable plate is provided with two guide rods distributed front and back, and the guide rods are installed between the left inner wall and the right inner wall of the recovery box.

[0012] Preferably, a U-shaped plate is installed on the lower left and lower right parts of the recovery box, a pump body is installed under the U-shaped plate, the suction end of the pump body is connected to a valve tube, and the upper end of the valve tube extends into the recovery box.

[0013] Preferably, a waste liquid pipe is inserted and connected to the upper end of the recovery box, the lower end of the waste liquid pipe extends into the hollow box, the upper end of the waste liquid pipe extends into the cavity, a receiving tray is provided in the cavity, and a movable door is provided at the front end of the cavity.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The sieve plate can be cleaned by setting a dredging component. When in use, if the sieve holes inside the sieve plate are blocked, the output end of the electric cylinder is controlled to extend, and the output end of the electric cylinder drives the dredging needle to be inserted into the sieve holes of the sieve plate through the moving plate, pushing the impurities out of the sieve holes, so that the sieve plate can resume the filtering function, facilitating the smooth passage of liquid, ensuring the circulation and use effect of the chemical solution, without the need for workers to manually clean and clean, reducing the waste of time and human resources;

[0016] 2. By setting up a conveying component, the cleaned impurities can be transported. When there are more impurities at the bottom of the recovery box, open the electric valve pipe to make the impurities fall into the cylinder. At the same time, turn on the power of the motor. The output end of the motor drives the spiral blade to rotate through the rotating rod. The spiral blade pushes the impurities to the right, so that the impurities are discharged from the sewage pipe, avoiding the accumulation of impurities in the hollow box, reducing the secondary contamination of the impurities to the screen plate, and no manual processing by workers is required. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;

[0018] Figure 2 Schematic diagram of the internal structure of this embodiment;

[0019] Figure 3 It is a structural schematic diagram of the dredging component in this embodiment;

[0020] Figure 4 Schematic diagram of the structure of the conveying component in this embodiment.

[0021] In the figure: 1. Cavity; 2. Movable door; 3. Recovery box; 4. Support column; 5. Clearing component; 6. Conveying component; 7. U-shaped plate; 8. Pump body; 9. Receiving plate; 10. Valve pipe; 11. Waste liquid pipe; 12. Hollow box; 13. Sieve plate; 14. Electric valve pipe; 15. Guide rod; 51. Electric cylinder; 52. Moving plate; 53. Clearing needle; 61. Cylinder; 62. Motor; 63. Drain pipe; 64. Rotating rod; 65. Spiral blade. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] like Figure 1-Figure 4 As shown, a semiconductor etching chamber comprises a chamber 1, four supporting columns 4 are installed at the lower end of the chamber 1, a recovery box 3 is installed together at the lower ends of the four supporting columns 4, dredging components 5 are provided at the upper left end and the upper right end of the recovery box 3, the two dredging components 5 are left-right symmetrical components, a conveying component 6 is inserted and connected to the middle of the right end of the recovery box 3, a hollow box 12 is provided inside the recovery box 3, sieve plates 13 are provided at the left and right ends of the hollow box 12, an electric valve tube 14 is inserted and connected to the lower end of the hollow box 12, and in order to facilitate impurities to fall into the cylinder 61, the lower end of the hollow box 12 is conical.

[0026] If the sieve holes inside the sieve plate 13 are blocked, in order to facilitate the smooth passage of liquid and ensure the circulation and use effect of the chemical solution, the sieve plate 13 can be cleaned by the dredging component 5, and the specific structure is: the dredging component 5 includes an electric cylinder 51, and the electric cylinder 51 is installed on the recycling box 3. The output end of the electric cylinder 51 is movably inserted into the recycling box 3 and is fixedly connected to a movable plate 52. A plurality of dredging needles 53 are installed at one end of the movable plate 52 close to the sieve plate 13. The dredging needles 53 match the sieve plate 13, and the diameter of the dredging needles 53 matches the aperture of the sieve plate 13. The internal movable sleeve of the movable plate 52 is provided with two guide rods 15 distributed front and back. The guide rods 15 are installed between the left inner wall and the right inner wall of the recycling box 3. The guide rods 15 are used to improve the stability of the movement of the movable plate 52.

[0027] In order to reduce the secondary contamination of the cleaned impurities to the screen plate 13, the cleaned impurities can be transported by the conveying component 6, and the specific structure is: the conveying component 6 includes a cylinder 61, and the cylinder 61 is inserted and connected to the right end of the recovery box 3, and a motor 62 is installed at the right end of the cylinder 61. A sewage pipe 63 is inserted and connected to the lower right part of the outer cylindrical surface of the cylinder 61, and the output end of the motor 62 extends into the cylinder 61 and is transmission-connected to a rotating rod 64. The outer surface of the rotating rod 64 is fixedly sleeved with a spiral leaf 65, and the lower end of the electric valve tube 14 extends into the cylinder 61.

[0028] In order to facilitate the recovery of the filtered solution, a U-shaped plate 7 is installed on the lower left and lower right parts of the recovery box 3, a pump body 8 is installed under the U-shaped plate 7, the suction end of the pump body 8 is connected to a valve tube 10, and the upper end of the valve tube 10 extends into the recovery box 3.

[0029] The upper end of the recovery box 3 is connected with a waste liquid pipe 11, the lower end of the waste liquid pipe 11 extends into the hollow box 12, and the upper end of the waste liquid pipe 11 extends into the cavity 1. A receiving tray 9 is provided in the cavity 1, and the receiving tray 9 is used to place semiconductors. A movable door 2 is provided at the front end of the cavity 1.

[0030] The utility model proposes a semiconductor etching chamber. The used chemical solution enters the hollow box 12 through the waste liquid pipe 11. The sieve plate 13 filters the chemical solution and then flows to the bottom of the recovery box 3. The valve pipe 10 and the pump body 8 are opened to transport the filtered solution. If the sieve holes inside the sieve plate 13 are blocked, the output ends of the two electric cylinders 51 are controlled to extend. The output ends of the two electric cylinders 51 drive two groups of dredging needles 53 to be inserted into the sieve holes of the two sieve plates 13 through two moving plates 52 respectively, and the impurities are pushed out of the sieve holes, so that the sieve plates 13 resume the filtering function. When there are more impurities at the bottom of the recovery box 3, the electric valve pipe 14 is opened to make the impurities fall into the cylinder 61. At the same time, the power supply of the motor 62 is turned on. The output end of the motor 62 drives the spiral blade 65 to rotate through the rotating rod 64. The spiral blade 65 pushes the impurities to move to the right, so that the impurities are discharged from the sewage pipe 63 to avoid the accumulation of impurities in the hollow box 12.

[0031] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor etching chamber, comprising a chamber (1), Features: Four support columns (4) are installed at the lower end of the cavity (1), and a recovery box (3) is installed at the lower ends of the four support columns (4). The upper left and right ends of the recovery box (3) are both provided with dredging components (5), and the two dredging components (5) are left-right symmetrical components. A conveying component (6) is inserted and connected to the middle of the right end of the recovery box (3). A hollow box (12) is arranged inside the recovery box (3), and a sieve plate (13) is arranged at the left and right ends of the hollow box (12). An electric valve pipe (14) is inserted and connected to the lower end of the hollow box (12).

2. A semiconductor etching chamber according to claim 1, Features: The dredging component (5) comprises an electric cylinder (51), the electric cylinder (51) is mounted on the recovery box (3), the output end of the electric cylinder (51) is movably inserted into the recovery box (3) and is fixedly connected to a movable plate (52), and a plurality of dredging needles (53) are mounted on one end of the movable plate (52) close to the sieve plate (13), and the dredging needles (53) match the sieve plate (13).

3. A semiconductor etching chamber according to claim 1, Features: The conveying component (6) comprises a cylinder (61), the cylinder (61) is inserted and connected to the right end of the recovery box (3), a motor (62) is installed at the right end of the cylinder (61), a sewage pipe (63) is inserted and connected to the lower right part of the outer cylindrical surface of the cylinder (61), the output end of the motor (62) extends into the cylinder (61) and is transmission-connected to a rotating rod (64), and a spiral blade (65) is fixedly sleeved on the outer surface of the rotating rod (64).

4. A semiconductor etching chamber according to claim 3, Features: The lower end of the electric valve tube (14) extends into the cylinder (61).

5. A semiconductor etching chamber according to claim 2, Features: The movable sleeve inside the movable plate (52) is provided with two guide rods (15) distributed front and back, and the guide rods (15) are installed between the left inner wall and the right inner wall of the recovery box (3).

6. A semiconductor etching chamber according to claim 1, Features: A U-shaped plate (7) is installed on the left and right lower ends of the recovery box (3), a pump body (8) is installed under the U-shaped plate (7), a valve tube (10) is connected to the liquid suction end of the pump body (8), and the upper end of the valve tube (10) extends into the recovery box (3).

7. The semiconductor etching chamber according to claim 1, Features: The upper end of the recovery box (3) is connected with a waste liquid pipe (11), the lower end of the waste liquid pipe (11) extends into the hollow box (12), the upper end of the waste liquid pipe (11) extends into the cavity (1), a receiving tray (9) is provided in the cavity (1), and a movable door (2) is provided at the front end of the cavity (1).

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