Label taking mechanism for chip heat dissipation stickers

Abstract

The label taking mechanism comprises a label head body, a vacuum adsorption hole and a chip avoiding groove, wherein the vacuum adsorption hole and the chip avoiding groove are formed in the bottom of the label head body; the label taking mechanism is further provided with a movable label head movably matched with the label head body, the movable label head is provided with an extending part arranged in the chip avoiding groove in an extending mode, and the extending part slides in the extending direction of the chip avoiding groove so as to adjust the size of the chip avoiding groove. According to the label taking mechanism, the size of the chip avoiding groove is adjusted through the extending part moving in the chip avoiding groove, the chip avoiding groove can be matched with chips of different lengths and sizes, and therefore the adaptability of the label taking mechanism is better improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a label taking mechanism for a chip heat dissipation sticker. Background Art

[0002] Semiconductor packaging technology is developing rapidly, and various chips are connected to circuits through packaging technology. In the field of COF (Chip On Flex or Chip On Film), the electrical connection between the internal circuit of the chip and the thin film circuit board is achieved through the connection between the chip and the thin film circuit board through COF packaging technology.

[0003] For the packaged chip, a good heat dissipation function is required to prevent the chip from generating too much heat during operation and thus damaging the COF product.

[0004] The existing heat dissipation technology generally achieves the purpose of heat dissipation by attaching a heat sink to the surface of the product through a heat sink machine. The label removal head is an important part of the heat sink machine. The bottom of the existing label removal head is generally a flat structure with several vacuum holes at the bottom. The function of the vacuum hole is to absorb the heat sink, and the heat sink is placed on the chip surface of the product through the machine label removal head, and then the heat sink and the product are tightly attached together through the roller rolling.

[0005] The applicability of the label removal head in the prior art is poor. One label removal head can only be adapted to one size of heat dissipation paste, which brings inconvenience in the actual production process. Utility Model Content

[0006] The purpose of the utility model is to provide a label taking mechanism for a chip heat sink to solve the deficiencies in the prior art. It adjusts the size of the chip avoidance groove by an extension portion movable in the chip avoidance groove, so that the chip avoidance groove can adapt to chips of different lengths, thereby better improving the adaptability of the label taking mechanism.

[0007] The utility model provides a label taking mechanism for a chip heat dissipation sticker, comprising: a label head body, a vacuum adsorption hole and a chip avoidance groove arranged at the bottom of the label head body;

[0008] The label taking mechanism also has a movable label head that is movably matched with the label head body. The movable label head has an extension part that is extended in the chip avoidance groove. The extension part slides along the extension direction of the chip avoidance groove to adjust the size of the chip avoidance groove.

[0009] Furthermore, the chip avoidance groove is extended along the length direction of the header body and has a lateral opening located on the side wall of the header body. A slide groove is formed on one side of the header body where the lateral opening is provided. The slide groove is connected to the chip avoidance groove, and the extension part slides in the slide groove.

[0010] Furthermore, the side of the header body provided with the lateral opening also has a limiting groove, the limiting groove is provided on the upper side of the slide groove and is connected with the slide groove, and the width dimension of the limiting groove is greater than the dimension of the slide groove;

[0011] The movable header comprises a sliding limit block, the extension part is fixed on the sliding limit block, and the sliding limit block slides in the sliding groove to limit the extension part from moving downward.

[0012] Furthermore, the extension portion is arranged at the center of the limit block in the width direction; the width direction of the limit block is consistent with the width direction of the header body. The limit groove and the slide groove form a T-shaped groove.

[0013] Furthermore, the movable header is provided with a movable adjustment rod, and the movable adjustment rod is extended outside the limiting groove.

[0014] Furthermore, a dovetail tenon is arranged in the limiting groove, and a dovetail groove matched with the dovetail tenon is arranged on the limiting block.

[0015] Furthermore, the label taking mechanism also has a locking mechanism, which includes a locking bolt, which is threadedly connected to the label head body, and one end of the locking bolt extends into the limit groove to abut against the limit block to achieve locking and fixing of the limit block;

[0016] Or one end of the locking bolt extends into the slide groove to abut against the extension portion to achieve locking and fixing of the extension portion.

[0017] Furthermore, a plurality of the vacuum adsorption holes are arranged along the length direction of the header body to form a vacuum adsorption hole group, and a plurality of the vacuum adsorption hole groups are arranged along the width direction of the header body to form a vacuum adsorption hole matrix;

[0018] The label taking mechanism also includes an airflow channel and a blocking unit arranged in the label head body;

[0019] The airflow channel includes a plurality of converging channels and a connecting channel connecting the plurality of converging channels, wherein the converging channel connects all the vacuum adsorption holes in a vacuum adsorption hole group;

[0020] The blocking unit comprises a blocking piece which is adjustable and movable in the connecting channel, and when the blocking piece moves to the corresponding converging channel, the converging channel and the connecting channel are blocked from conduction.

[0021] Furthermore, the communication channel penetrates the header body along the width direction of the header body, and two blocking pieces are provided. The two blocking pieces are respectively inserted from both ends of the communication channel, and the blocking pieces are adapted to the communication channel;

[0022] The blocking unit further includes a control member, which is fixedly connected to the blocking member and has a control handle extending outside the communication channel;

[0023] A connecting rod is provided between the operating member and the blocking member, and the connecting rod is threadedly mounted on the header body; the connecting rod can rotate along the circumferential direction of the connecting rod and drive the blocking member to move along the axial direction of the connecting rod during the rotation process.

[0024] Furthermore, the blocking unit also has a sleeve that is threadedly matched with the connecting rod, and the sleeve is installed and fixed on the header body. The header body is provided with a positioning hole that is compatible with the sleeve, and the positioning hole is coaxially arranged with the tube hole of the sleeve. The positioning hole is located at the edge of the inlet of the connecting channel and is coaxially arranged with the connecting channel.

[0025] Compared with the prior art, the utility model can adjust the size of the chip avoidance groove by moving the extension part in the chip avoidance groove, so that the chip avoidance groove can adapt to chips of different lengths, thereby better improving the adaptability of the label taking mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of a label taking mechanism for a chip heat dissipation sticker in an embodiment of the utility model;

[0027] Figure 2 It is a bottom view of the label taking mechanism for the chip heat dissipation sticker in the embodiment of the utility model;

[0028] Figure 3 yes Figure 2 Sectional view in the AA direction;

[0029] Figure 4 yes Figure 2 Cross-sectional view in the BB direction;

[0030] Figure 5 It is a left view of the label taking mechanism for chip heat dissipation sticker in the embodiment of the utility model;

[0031] Figure 6 yes Figure 5 Cross-sectional view in CC direction;

[0032] Figure 7 yes Figure 5 Cross-sectional view in the middle DD direction;

[0033] Figure 8 yes Figure 5 Cross-sectional view in the EE direction;

[0034] Fig. 9 It is a right view of the label taking mechanism for chip heat dissipation sticker in the embodiment of the utility model;

[0035] Fig.10 It is a structural schematic diagram of a blocking unit in a label taking mechanism for a chip heat dissipation sticker in an embodiment of the utility model;

[0036] Fig.11 This is a first structural schematic diagram of the label head body in the label taking mechanism for a chip heat dissipation sticker in an embodiment of the utility model;

[0037] Fig.12 This is a second structural schematic diagram of the label head body in the label taking mechanism for a chip heat dissipation sticker in an embodiment of the utility model;

[0038] Fig.13 It is a structural schematic diagram of a movable label head in a label taking mechanism for a chip heat dissipation sticker in an embodiment of the utility model;

[0039] Description of reference numerals: 1-header body, 10-positioning hole, 11-chip avoidance groove, 111-side opening, 12-slide groove, 13-limiting groove, 2-vacuum adsorption hole, 20-vacuum adsorption hole group, 200-vacuum adsorption hole matrix,

[0040] 3 - air flow channel, 31 - confluence channel, 311 - central confluence channel, 312 - edge confluence channel, 32 - connecting channel, 33 - air intake channel,

[0041] 4-blocking unit, 41-blocking piece, 42-control piece, 43-connecting rod, 44-sleeve, 441-limiting surface, 45-locking nut,

[0042] 5 - movable header, 51 - extension part, 52 - sliding limit block, 53 - movable adjustment rod. DETAILED DESCRIPTION

[0043] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] Embodiments of the present utility model: Figure 1 As shown in FIG. 4 , a label removal mechanism for a chip heat dissipation sticker is disclosed, comprising a header body 1, a vacuum adsorption hole 2 arranged at the bottom of the header body 1, and the vacuum adsorption hole 2 has an inlet arranged at the bottom surface of the header body 1. The vacuum adsorption hole 2 adsorbs the heat dissipation sticker on the bottom of the header body 1 to realize the transfer of the heat dissipation sticker.

[0045] A chip avoidance groove 11 is formed at the bottom of the header body 1. After the header mechanism absorbs the heat sink, when the heat sink is attached, the chip avoidance groove 11 is opposite to the chip position. The chip avoidance groove can make the heat sink fit more closely on the chip, so that the heat sink can be attached more flatly and avoid the generation of bubbles.

[0046] In this embodiment, the size of the chip avoidance groove 11 is adjustable. Specifically, the chip avoidance groove 11 is extended along the length direction of the header body 1 , and the chip avoidance groove 11 is arranged in the middle position of the width direction of the header body 1 .

[0047] The label taking mechanism also has a movable label head 5 movable on the label head body 1, and the movable label head 5 is movably matched with the label head body 1. Fig.13 As shown, the movable header 5 has an extension portion 51 extending from the chip avoidance groove 11, and the extension portion 51 forms the inner wall of the chip avoidance groove 11. The extension portion 51 slides along the extension direction of the chip avoidance groove 11 to adjust the size of the chip avoidance groove 11.

[0048] By adjusting the size of the chip avoidance groove 11 through the extension portion 51 movable in the chip avoidance groove 11 , the chip avoidance groove 11 can be adapted to chips of different lengths, thereby better improving the adaptability of the label taking mechanism.

[0049] like Fig.11 As shown, the chip avoidance groove 11 is extended along the length direction of the header body 1 and has a lateral opening 111 located on the side wall of the header body 1. A slide groove 12 is formed on one side of the header body 1 where the lateral opening 111 is provided. The slide groove 12 is connected to the chip avoidance groove 11, and the extension portion 51 slides in the slide groove 12.

[0050] The side of the header body 1 provided with the lateral opening 111 also has a limiting groove 13 , which is arranged on the upper side of the slide groove 12 and communicated with the slide groove 12 , and the width of the limiting groove is greater than that of the slide groove 12 .

[0051] The movable header 5 includes a sliding limit block 52 , the extension portion 51 is fixed on the sliding limit block 52 , the sliding limit block 52 is disposed in the limit slot 13 , and the sliding limit block 52 slides in the slide slot 12 to limit the extension portion 51 from moving downward.

[0052] like Fig.12 As shown, the extension portion 51 is disposed at the center of the limit block 52 in the width direction, and the width direction of the limit block 52 is consistent with the width direction of the header body 1. The limit groove 13 and the slide groove 12 form a T-shaped groove.

[0053] like Fig.13 As shown, the movable header 5 also has a movable adjustment rod 53 , which is extended outside the limiting groove 13 , and is fixed on the limiting block 52 , so that the limiting block 52 can be moved by the movable adjustment rod 53 .

[0054] Further, in order to achieve better sliding, a dovetail tenon can be provided in the limiting groove 13, and a dovetail groove adapted to the dovetail tenon can be provided on the limiting block 52. The sliding of the limiting block 52 in the limiting groove 13 is achieved by the cooperation of the dovetail tenon and the dovetail groove.

[0055] It can be understood that after the movable header 5 is adjusted into place, the position of the movable header 5 needs to be locked and fixed. Therefore, the label picking mechanism also has a locking mechanism, which includes a locking bolt, which is threadedly connected to the header body 1, and one end of the locking bolt extends into the limit groove 13 to abut against the limit block 52 to achieve locking and fixing of the limit block 52, or one end of the locking bolt extends into the slide groove 12 to abut against the extension portion 51 to achieve locking and fixing of the extension portion 51.

[0056] It is understandable that a locking screw hole adapted to the locking bolt is correspondingly provided on the header body 1 , and the locking screw hole is communicated with the slide groove 12 or the locking screw hole is communicated with the limiting groove 13 .

[0057] The label taking mechanism also has an air flow channel 3 and a blocking unit 4 arranged in the label head body 1;

[0058] like Figure 2 As shown, the cross section of the header body 1 is rectangular as a whole, and has a length direction and a width direction. A plurality of vacuum adsorption holes 2 are arranged along the length direction of the header body to form a vacuum adsorption hole group 20, and a plurality of vacuum adsorption hole groups 20 are arranged along the width direction of the header body to form a vacuum adsorption hole matrix 200;

[0059] In the prior art, the heat sink is generally rectangular, so in a specific embodiment, the cross-sectional shape of the header body 1 is set to be consistent with the shape of the heat sink so that it can be more compatible with the heat sink, thereby achieving a better attachment effect. The vacuum adsorption hole group 20 includes all vacuum adsorption holes 2 arranged along the length direction of the header body 1, and several groups of vacuum adsorption hole groups 20 are arranged along the width direction of the header body 1. The overall width of the several groups of vacuum adsorption holes 20 arranged in the width direction is not greater than the size of the heat sink, thereby achieving a better adaptation to the heat sink. The vacuum adsorption holes 2 in the vacuum adsorption hole matrix 200 are arranged on the header body 1 at uniform intervals as a whole.

[0060] The air flow channel 3 includes a plurality of converging channels 31 and a connecting channel 32 connecting the plurality of converging channels 31, wherein the converging channels 31 connect all the vacuum adsorption holes 2 in a vacuum adsorption hole group 20;

[0061] A plurality of vacuum adsorption hole groups 20 are arranged on a header body 1, and a plurality of corresponding confluence channels 31 are also arranged, and each confluence channel 31 corresponds to a vacuum adsorption hole group 20, and finally all the confluence channels 31 converge into a connecting channel 32, and the connecting channel 32 is finally connected to the air pipe of the external air supply source. Such a structural arrangement can keep the negative pressure generated by each vacuum adsorption hole 2 as uniform as possible while facilitating the air supply, thereby better realizing the grabbing and transfer of the heat sink.

[0062] Although the above-mentioned structure facilitates the setting of the gas path and better realizes the grabbing of the heat sink, once the size of the heat sink does not match the arrangement of the vacuum adsorption holes 2, air leakage is likely to occur, thus affecting the use of the entire device. It also restricts the versatility and adaptability of the label-taking mechanism. That is, the setting of the above-mentioned structure requires the heat sink to completely cover the vacuum adsorption holes 2, so as to avoid air leakage in the uncovered vacuum adsorption holes 2.

[0063] Generally, a label picking mechanism can only be adapted to a heat sink of one size. Therefore, in order to improve adaptability, label picking mechanisms of multiple sizes are generally adapted on one machine, which causes inconvenience in the actual production process.

[0064] In order to solve the above technical problems, the labeling mechanism for the chip heat sink in this embodiment is also provided with a blocking unit 4, and the blocking unit 4 includes a blocking piece 41 that can be adjusted and moved in the connecting channel 32, and when the blocking piece 41 moves to the corresponding confluence channel 31, it cuts off the conduction between the confluence channel 31 and the connecting channel 32.

[0065] like Figure 3 As shown, in this embodiment, a plurality of vacuum adsorption holes are connected through a confluence channel 31, and then different confluence channels 31 are connected through a connecting channel 32. A movable blocking member 41 is arranged in the connecting channel 32. When the blocking member 41 moves to the confluence channel 31, the corresponding confluence channel 31 can be blocked. The setting of the blocking member 41 enables the header body 1 to adsorb heat dissipation stickers of various widths, thereby improving the adaptability of the header mechanism.

[0066] In a specific embodiment, Figure 3 and 6As shown in FIG. 8 , the connecting passage 32 penetrates the header body 1 along the width direction of the header body 1 , and two blocking members 41 are provided. The two blocking members 41 are respectively inserted from both ends of the connecting passage 32 , and the blocking members 41 are adapted to the connecting passage 32 .

[0067] In a specific embodiment, the cross section of the communication channel 32 is circular as a whole, and the blocking member 41 is correspondingly cylindrical. The blocking member 41 is moved from the edge of the width of the header body 1 to the middle to gradually adjust the available size of the vacuum adsorption hole 2.

[0068] In order to facilitate the movement and adjustment of the blocking member 41, Figure 3 and Fig.10 As shown, the blocking unit 4 further includes a manipulation member 42, which is fixedly connected to the blocking member 41 and has a manipulation handle extending outside the communication channel 32. Extending the manipulation member 42 outside the communication channel 32 can conveniently realize the movement and adjustment of the blocking member 41.

[0069] The blocking unit 4 also has a connecting rod 43 connected between the operating member 42 and the blocking member 41, and the connecting rod 43 is threadedly mounted on the header body 1; the connecting rod 43 can rotate along the circumferential direction of the connecting rod 43 and drive the blocking member 41 to move along the axial direction of the connecting rod 43 during the rotation process.

[0070] In this embodiment, the blocking member 41 is cylindrical, and the connecting rod 43 is coaxially arranged with the blocking member 41. The connecting rod 43 is arranged to be threadedly connected to the header body 1, and the position of the blocking member 41 can be adjusted by rotation, and the movement of the blocking member 41 can be better controlled, and the movement of the blocking member 41 can be finely controlled. In this embodiment, the connecting rod 43 is actually a screw connected between the operating member 42 and the blocking member 41.

[0071] It is understandable that the connecting rod 43 is provided with an external thread, and a threaded hole compatible with the external thread can be provided on the header body 1, and an internal thread is provided on the threaded hole. The threaded hole is coaxially arranged with the connecting channel 32 and is arranged at the edge of the connecting channel 32.

[0072] In this embodiment, if Fig. 9As shown in Figure 10, in order to better realize production and assembly, the blocking unit 4 also has a sleeve 44 threadedly matched with the connecting rod 43, and the sleeve 44 is installed and fixed on the header body 1. The header body 1 is provided with a positioning hole 10 adapted to the sleeve 44, and the sleeve 44 is provided with a pipe hole, and the inner wall of the pipe hole is provided with an internal thread. The positioning hole 10 is coaxially arranged with the pipe hole of the sleeve 44, and the positioning hole 10 is located at the edge of the inlet of the connecting channel 32 and is coaxially arranged with the connecting channel 32, and the sleeve 44 is positioned in the positioning hole 10.

[0073] like Fig.10 As shown, a limited surface 441 is provided on the outer wall of the sleeve 44. Fig.12 As shown, the positioning hole 10 is provided with an abutting surface 101 which abuts against the limiting surface 441 to limit the sleeve 44 from rotating circumferentially in the positioning hole 10 .

[0074] The cooperation between the limiting surface 441 and the abutting surface 101 prevents the operating member 42 from causing the sleeve 44 and the header body 1 to rotate relative to each other during the rotation adjustment process.

[0075] like Fig. 9 As shown in FIG. 10 , the blocking unit 4 further comprises a locking nut 45 sleeved on the outside of the connecting rod 43 . After the blocking member 41 is adjusted into place, the locking nut 45 is rotated to abut against the sleeve 44 to lock and fix the connecting rod 43 .

[0076] like Figure 6 As shown, the confluence channel 31 includes a central confluence channel 311 and edge confluence channels 312 symmetrically arranged on both sides of the central confluence channel 311, and the central confluence channel 311 is located at the center of the width direction of the header body 1;

[0077] The blocking member 41 can simultaneously cover all the edge converging channels 312 on the same side of the central converging channel 311. The length of the blocking member 41 can be sufficient to block all the edge converging channels 312 on the same side of the central converging channel 311.

[0078] The air flow channel 3 further has an air intake channel 33 communicating with the communication channel 32 , and the air intake channel 33 is used to be connected to a vacuum air intake pipe.

[0079] The above describes in detail the structure, features and effects of the utility model based on the embodiments shown in the drawings. The above is only a preferred embodiment of the utility model, but the utility model is not limited to the scope of implementation shown in the drawings. Any changes made in accordance with the concept of the utility model, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and the drawings, should be within the protection scope of the utility model.

Claims

1. A label taking mechanism for a chip heat dissipation sticker, characterized in that: include: The header body and the vacuum adsorption hole and the chip avoidance groove arranged at the bottom of the header body; The label taking mechanism also has a movable label head that is movably matched with the label head body. The movable label head has an extension part that is extended in the chip avoidance groove. The extension part slides along the extension direction of the chip avoidance groove to adjust the size of the chip avoidance groove.

2. The label taking mechanism for chip heat dissipation sticker according to claim 1, characterized in that: The chip avoidance groove is extended along the length direction of the header body and has a lateral opening located on the side wall of the header body. A slide groove is formed on one side of the header body where the lateral opening is provided. The slide groove is connected to the chip avoidance groove, and the extension part slides in the slide groove.

3. The label taking mechanism for chip heat dissipation sticker according to claim 2, characterized in that: The side of the header body provided with the lateral opening also has a limiting groove, the limiting groove is arranged on the upper side of the slide groove and communicated with the slide groove, and the width dimension of the limiting groove is greater than the dimension of the slide groove; The movable header comprises a sliding limit block, the extension part is fixed on the sliding limit block, and the sliding limit block slides in the sliding groove to limit the extension part from moving downward.

4. The label taking mechanism for chip heat dissipation sticker according to claim 3, characterized in that: The extension portion is arranged at the center position of the limiting block in the width direction; the width direction of the limiting block is consistent with the width direction of the header body; the limiting groove and the sliding groove form a T-shaped groove.

5. The label taking mechanism for chip heat dissipation sticker according to claim 3, characterized in that: The movable header is also provided with a movable adjustment rod, and the movable adjustment rod is extended outside the limiting groove.

6. The label taking mechanism for chip heat dissipation sticker according to claim 3, characterized in that: A dovetail tenon is arranged in the limiting groove, and a dovetail groove matched with the dovetail tenon is arranged on the limiting block.

7. The label taking mechanism for chip heat dissipation sticker according to claim 3, characterized in that: The label taking mechanism also has a locking mechanism, which includes a locking bolt, which is threadedly connected to the label head body, and one end of the locking bolt extends into the limit groove to abut against the limit block to achieve locking and fixing of the limit block; Or one end of the locking bolt extends into the slide groove to abut against the extension portion to achieve locking and fixing of the extension portion.

8. The label taking mechanism for chip heat dissipation sticker according to claim 1, characterized in that: A plurality of the vacuum adsorption holes are arranged along the length direction of the header body to form a vacuum adsorption hole group, and a plurality of the vacuum adsorption hole groups are arranged along the width direction of the header body to form a vacuum adsorption hole matrix; The label taking mechanism also includes an airflow channel and a blocking unit arranged in the label head body; The airflow channel includes a plurality of converging channels and a connecting channel connecting the plurality of converging channels, wherein the converging channel connects all the vacuum adsorption holes in a vacuum adsorption hole group; The blocking unit comprises a blocking piece which is adjustable and movable in the connecting channel, and when the blocking piece moves to the corresponding converging channel, the converging channel and the connecting channel are blocked from conduction.

9. The label taking mechanism for chip heat dissipation sticker according to claim 8, characterized in that: The communication channel penetrates the header body along the width direction of the header body, and two blocking pieces are provided. The two blocking pieces are respectively inserted from two ends of the communication channel, and the blocking pieces are adapted to the communication channel; The blocking unit further includes a control member, which is fixedly connected to the blocking member and has a control handle extending outside the communication channel; A connecting rod is provided between the operating member and the blocking member, and the connecting rod is threadedly mounted on the header body; the connecting rod can rotate along the circumferential direction of the connecting rod and drive the blocking member to move along the axial direction of the connecting rod during the rotation process.

10. The label taking mechanism for chip heat dissipation sticker according to claim 9, characterized in that: The blocking unit also has a sleeve threadedly matched with the connecting rod, the sleeve is installed and fixed on the header body, and the header body is provided with a positioning hole adapted to the sleeve, the positioning hole is coaxially arranged with the tube hole of the sleeve, and the positioning hole is located at the edge of the inlet of the connecting channel and is coaxially arranged with the connecting channel.

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