Silicon wafer separating device
By designing a silicon wafer separation device, the interaction force between the lifting and adsorption components is used to solve the problem of multiple blocks caused by the adhesion phenomenon of silicon wafers, the correct acquisition of single blocks is achieved, and the efficiency of production equipment is improved. .
Patent Information
- Application Number
- CN202420072521.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-11
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-01-11
AI Technical Summary
When stacking and placing silicon wafers, due to high flatness, they are prone to adhesion, which leads to the acquisition of multiple silicon wafers at one time, affecting the normal production of the equipment.
A silicon wafer separation device is designed, including a slide stage, a lifting assembly, a limiting assembly and an adsorption assembly. The second suction cup is driven to move through the driving member to reduce the contact area of the two silicon wafers, and the first suction cup and the second The opposite force of the suction cup causes the silicon wafer to be dislocated, and the partitioning components are repeatedly run until a single silicon wafer is obtained.
It effectively solves the problem of multiple blocks being taken by silicon wafer adhesion, ensures the correct acquisition of single blocks, and improves the normal operation efficiency of production equipment.
Smart Images
Figure CN222190669U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor production technology, in particular to a silicon wafer separation device. Background Art
[0002] Silicon wafer is a thin, flat, round silicon matrix material, which is commonly used in the preparation of integrated circuit manufacturing and other semiconductor devices. It is one of the most common substrate materials in the semiconductor industry.
[0003] In the related art, for the convenience of operation, multiple silicon wafers are often placed in a stack before testing. However, due to the influence of the front-end process of the silicon wafer, the flatness of the silicon wafer is relatively high, which makes the stacked silicon wafers stick together more frequently. When taking the silicon wafer on the top of the stack, it is easy to take multiple silicon wafers at a time due to the sticking phenomenon, affecting the normal production of the equipment. Utility Model Content
[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a silicon wafer separation device, which has the effect of separating silicon wafers that are adhered to each other and taking a single silicon wafer.
[0005] According to an embodiment of the utility model, a silicon wafer separation device comprises: a wafer stage, which is used to carry a silicon wafer group, wherein the silicon wafer group comprises a plurality of silicon wafers stacked vertically; a lifting assembly, which can drive the wafer stage to rise and fall; a limit assembly, which is used to limit the horizontal movement of the silicon wafer; an adsorption assembly, which comprises a first suction cup, which is movably arranged above the wafer stage, and the first suction cup can adsorb the silicon wafer;
[0006] The partition assembly includes a driving member and a second suction cup, wherein the second suction cup is located below the first suction cup, and the second suction cup is located above the wafer carrier, the second suction cup can absorb the silicon wafer, and the driving member can drive the second suction cup to move in a horizontal direction.
[0007] A silicon wafer separation device according to an embodiment of the utility model includes at least the following beneficial effects: when the suction cup needs to adsorb the silicon wafer, the wafer carrier is driven to rise by the lifting component, and the horizontal movement of the silicon wafer is limited by the limit component, so that the first suction cup can descend to adsorb the silicon wafer. Since adhesion is easy to occur between silicon wafers, if the first suction cup takes two silicon wafers at one time, the second suction cup is driven by the driving member to move to the bottom of the taken silicon wafer to adsorb the silicon wafer at the bottom of the taken silicon wafer. At this time, the adsorption forces of the first suction cup and the second suction cup are opposite forces, and the driving member is used to drive the second suction cup to move to the bottom of the taken silicon wafer. The movable part drives the silicon wafer adsorbed by the second suction cup to move relative to the silicon wafer adsorbed by the first suction cup, so that the two silicon wafers are staggered, thereby reducing the contact area of the two silicon wafers and reducing the adhesion force between the two silicon wafers; when the driving part continues to drive, the silicon wafer adsorbed by the second suction cup falls to the silicon wafer group under the restriction of the limiting component, so that the first suction cup can take a single silicon wafer; if the first suction cup takes multiple silicon wafers at one time, the separation process of the separation component is repeated until the first suction cup takes a single silicon wafer, thereby solving the problem of taking multiple silicon wafers at one time due to adhesion.
[0008] According to some embodiments of the present invention, the adsorption force of the first suction cup is greater than the adsorption force of the second suction cup.
[0009] According to some embodiments of the utility model, the silicon wafer separation device includes a vertically arranged fixed plate, the lifting assembly is arranged on the fixed plate, the lifting assembly includes a first slide rail, a slide plate, a drive motor and a screw rod, the first slide rail is vertically arranged on one side of the fixed plate, the slide plate is slidably matched with the first slide rail, the drive motor is arranged at the bottom of the first slide rail, the screw rod is vertically arranged, the bottom of the screw rod is fixedly connected to the output end of the drive motor, a screw hole is opened on the slide plate, the screw rod is threadedly matched with the screw hole, and one side of the wafer carrier is fixedly connected to the slide plate.
[0010] According to some embodiments of the utility model, a support plate is provided on one side of the slide plate, and the support plate is located below the wafer carrier. The limit assembly is carried on the support plate, and the limit assembly includes an elastic member and a plurality of limit rods, and the elastic member is carried on the support plate. The plurality of limit rods are distributed at intervals along the circumference of the silicon wafer, and the limit rods are vertically arranged. A plurality of waist-shaped holes are opened on the wafer carrier, and the plurality of waist-shaped holes correspond to the plurality of limit rods one by one, respectively. The waist-shaped holes are opened along the radial direction of the silicon wafer, and the bottom end of the limit rod is supported by the elastic member, and the top end passes through the waist-shaped hole and extends vertically upward, and the elastic member can simultaneously drive the plurality of limit rods to approach or move away from the silicon wafer group along the length direction of the waist-shaped hole.
[0011] According to some embodiments of the utility model, the tensioner includes a clamping cylinder and a plurality of transmission rods, the clamping cylinder is arranged on the support plate, the plurality of transmission rods respectively correspond to the plurality of limiting rods, one end of the transmission rod is connected to the clamping cylinder, and the other end is connected to the limiting rod, and the clamping cylinder can drive the plurality of transmission rods to expand or contract.
[0012] According to some embodiments of the present invention, the adsorption assembly further includes a lifting member, and the lifting member is used to drive the first suction cup to rise and fall.
[0013] According to some embodiments of the utility model, the lifting member includes a first cylinder, the first cylinder is fixedly connected to the fixing plate via a connecting frame, and the top of the first suction cup is connected to the first cylinder.
[0014] According to some embodiments of the utility model, the driving member includes a telescopic cylinder, a second cylinder and a connecting rod. The telescopic cylinder is fixedly arranged on the fixed plate, and the telescopic cylinder can drive the connecting rod to telescopically move along the radial direction of the silicon wafer. The second suction cup is arranged at one end of the connecting rod close to the wafer carrier, and the second cylinder can drive the connecting rod to rise and fall.
[0015] According to some embodiments of the utility model, a second slide rail is provided on one side of the fixed plate, the second slide rail is arranged along the telescopic direction of the telescopic cylinder, a slider is slidably fitted on the second slide rail, and the slider is connected to the piston rod of the telescopic cylinder.
[0016] According to some embodiments of the utility model, two auxiliary rods are arranged side by side at one end of the slider, and the auxiliary rods are arranged along the length direction of the connecting rod. The second cylinder is fixed on the slider, and the connecting rod is arranged on the top of the second cylinder so that the connecting rod can be raised and lowered and passed between the two auxiliary rods. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;
[0018] Figure 2 It is a structural schematic diagram of the lifting assembly in the embodiment of the present application;
[0019] Figure 3 It is a schematic diagram of the structure of the limit assembly in the embodiment of the present application;
[0020] Figure 4 yes Figure 2 A magnified view of part A;
[0021] Figure 5 It is a schematic diagram of the structure of the separation component in the embodiment of the present application.
[0022] Explanation of the reference numerals in the accompanying drawings: 100, fixed plate; 200, wafer carrier; 300, silicon wafer group; 310, silicon wafer; 410, driving motor; 420, first slide rail; 430, slide plate; 440, screw rod; 500, support plate; 611, clamping cylinder; 612, transmission rod; 620, limiting rod; 630, waist-shaped hole; 700, adsorption assembly; 710, first suction cup; 721, first cylinder; 811, telescopic cylinder; 812, second cylinder; 813, connecting rod; 814, second slide rail; 815, slider; 816, auxiliary rod; 820, second suction cup; 830, air nozzle; 840, support. DETAILED DESCRIPTION
[0023] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0024] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0025] In the description of the utility model, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0026] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0027] The following is combined with Figure 1-5 This application is described in further detail.
[0028] The present invention provides a silicon wafer separation device, referring to Figure 1 , including a fixed plate 100 and a wafer stage 200 , the wafer stage 200 is carried on the fixed plate 100 , the wafer stage 200 is used to carry a silicon wafer group 300 , and the silicon wafer group 300 includes a plurality of stacked silicon wafers 310 .
[0029] It is understandable that in some embodiments of the present invention, reference Figure 1 and Figure 2 , a lifting assembly for driving the wafer stage 200 to rise and fall is provided on the fixed plate 100. Specifically, the lifting assembly includes a driving motor 410, a first slide rail 420, a slide plate 430 and a screw rod 440. The first slide rail 420 is vertically arranged on one side of the fixed plate 100, the slide plate 430 is slidably matched with the first slide rail 420, and the driving motor 410 is arranged at the bottom of the first slide rail 420; the screw rod 440 is vertically arranged, and the bottom of the screw rod 440 is fixedly connected to the output end of the driving motor 410. A screw hole is provided on the slide plate 430, and the screw rod 440 is threadedly matched with the screw hole. One side of the wafer stage 200 is fixedly connected to the slide plate 430, and the screw rod 440 is driven to rotate by the driving motor 410, and the screw rod 440 is threadedly matched with the screw hole to drive the slide plate 430 to slide relative to the first slide rail 420, thereby driving the wafer stage 200 to rise and fall, and driving the silicon wafer group 300 to rise and fall.
[0030] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3 A support plate 500 is disposed on one side of the slide plate 430 , and the support plate 500 is located below the wafer carrier 200 . A limit assembly is disposed on the support plate 500 , and the limit assembly is used to limit the horizontal movement of the silicon wafer 310 .
[0031] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3 The limiting assembly includes an elastic member and multiple limiting rods 620. The elastic member is carried on the support plate 500. The multiple limiting rods 620 are distributed at intervals along the circumference of the silicon wafer 310. The limiting rods 620 are vertically arranged. A plurality of waist-shaped holes 630 are opened on the wafer carrier 200. The multiple waist-shaped holes 630 correspond to the multiple limiting rods 620 one by one. The waist-shaped holes 630 are opened along the radial direction of the silicon wafer 310. The bottom end of the limiting rod 620 is supported by the elastic member, and the top end passes through the waist-shaped hole 630 and extends vertically upward. The elastic member can simultaneously drive the multiple limiting rods 620 to approach or move away from the silicon wafer group 300 along the length direction of the waist-shaped hole 630. Therefore, when the silicon wafer group 300 is placed on the wafer carrier 200, the multiple limiting rods 620 are driven by the elastic member to approach the silicon wafer group 300 along the length direction of the waist-shaped hole 630 to limit the horizontal movement of the silicon wafer 310. In some embodiments, there are three limiting rods 620 , and the three limiting rods 620 are distributed in a triangle relative to the silicon wafer 310 to limit the horizontal movement of the silicon wafer 310 .
[0032] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 3The tensioner includes a clamping cylinder 611 and a plurality of transmission rods 612. The clamping cylinder 611 is arranged on the support plate 500. The plurality of transmission rods 612 correspond to the plurality of limiting rods 620 one by one. One end of the transmission rod 612 is connected to the clamping cylinder 611, and the other end is connected to the limiting rod 620. When the plurality of limiting rods 620 need to move, the clamping cylinder 611 can drive the plurality of transmission rods 612 to expand or contract, so that the limiting rods 620 are away from or close to the silicon wafer group 300 along the length direction of the waist-shaped hole 630.
[0033] It is understandable that in some embodiments of the present invention, reference Figure 1 and Figure 2 The silicon wafer separation device further includes an adsorption assembly 700, which is used to adsorb the silicon wafer 310 on the top of the silicon wafer group 300, so as to achieve the effect of separating the silicon wafers 310 in the silicon wafer group 300. Specifically, the adsorption assembly 700 includes a first suction cup 710 and a lifting member, and the lifting member is used to drive the first suction cup 710 to rise and fall. The first suction cup 710 is located above the wafer carrier 200, and the first suction cup 710 can adsorb the silicon wafer 310.
[0034] It is understandable that in some embodiments of the present invention, reference Figure 1 and Figure 2 The lifting component includes a first cylinder 721, which is fixedly connected to the fixed plate 100 through a connecting frame, and the top of the first suction cup 710 is connected to the first cylinder 721. When the first suction cup 710 needs to adsorb the silicon wafer 310, the wafer carrier 200 is driven to rise by the lifting component. At the same time, the first suction cup 710 is lowered to the top of the silicon wafer group 300 through the first cylinder 721 to adsorb the silicon wafer 310 on the top of the silicon wafer group 300; at this time, the limiting rod 620 moves in the direction away from the silicon wafer group 300 under the drive of the clamping cylinder 611 to avoid the movement of the silicon wafer 310, thereby reducing the damage to the silicon wafer 310 caused by the friction between the limiting rod 620 and the silicon wafer 310; thereby, the first cylinder 721 drives the first suction cup 710 to rise, so as to realize the picking up of the silicon wafer 310.
[0035] It is understandable that in some embodiments of the present invention, reference Figure 1 and Figure 4, a separation component is provided on one side of the fixed plate 100, and the separation component is used to separate two adjacent adhered silicon wafers 310. Specifically, the separation component includes a driving member and a second suction cup 820, the second suction cup 820 is located below the first suction cup 710, the second suction cup 820 is located above the wafer carrier 200, the second suction cup 820 can adsorb the silicon wafer 310, and the driving member can drive the second suction cup 820 to move in the horizontal direction. If the first suction cup 710 takes two silicon wafers 310 at one time, the second suction cup 820 is driven by the driving member to move to the bottom of the taken silicon wafer 310 to adsorb the silicon wafer 310 at the bottom of the taken silicon wafer 310. At this time, the adsorption forces of the first suction cup 710 and the second suction cup 820 are opposite forces, and the silicon wafer 310 adsorbed by the second suction cup 820 is driven by the driving member to move relative to the silicon wafer 310 adsorbed by the first suction cup 710, so that the two silicon wafers 310 are staggered and distributed, so as to This reduces the contact area between the two silicon wafers 310 and the adhesion force between the two silicon wafers 310; when the driving member continues to drive, the silicon wafer 310 adsorbed by the second suction cup 820 falls to the silicon wafer group 300 under the restriction of the limiting component, so that the first suction cup 710 can take a single silicon wafer 310; if the first suction cup 710 takes multiple silicon wafers 310 at one time, repeat the separation process of the separation component until the first suction cup 710 takes a single silicon wafer 310.
[0036] It is understandable that in some embodiments of the present invention, reference Figure 4 and Figure 5 , the suction force of the first suction cup 710 is greater than that of the second suction cup 820. When the first suction cup 710 picks up multiple silicon wafers 310 at one time, the separation process of the separation component is repeated; until only a single silicon wafer 310 is left and is adsorbed by the first suction cup 710, so that the second suction cup 820 and the first suction cup 710 are respectively adsorbed on both sides of the silicon wafer 310. Since the suction force of the first suction cup 710 is greater than that of the second suction cup 820, the second suction cup 820 cannot drive the silicon wafer 310 to move. Therefore, after the separation component is repeatedly operated for multiple times, the first suction cup 710 can pick up a single silicon wafer 310.
[0037] It can be understood that in some embodiments of the present invention, the driving member includes a telescopic cylinder 811, a second cylinder 812 and a connecting rod 813. The cylinder seat of the telescopic cylinder 811 is fixedly arranged on one side of the fixed plate 100, and the piston rod of the telescopic cylinder 811 is connected to the connecting rod 813, so that the telescopic cylinder 811 can drive the connecting rod 813 to telescopically move along the radial direction of the silicon wafer 310. The second suction cup 820 is arranged at one end of the connecting rod 813 close to the wafer stage 200. When the first suction cup 710 adsorbs the silicon wafer 310, since multiple silicon wafers 310 are prone to adhesion, the first suction cup 710 is easy to take multiple silicon wafers 310 at one time. At this time, the connecting rod 813 is driven by the telescopic cylinder 811 to move along the radial direction of the silicon wafer 310, so that the connecting rod 813 can drive the second suction cup 820 to move to the bottom of the silicon wafer 310 to be taken.
[0038] It is understandable that in some embodiments of the present invention, reference Figure 4 and Figure 5A second slide rail 814 is provided on one side of the fixed plate 100. The second slide rail 814 is provided along the telescopic direction of the telescopic cylinder 811. A slider 815 is provided on the second slide rail 814 for sliding movement. The slider 815 is connected to the piston rod of the telescopic cylinder 811. Two auxiliary rods 816 are provided side by side at one end of the slider 815. The auxiliary rods 816 are provided along the length direction of the connecting rod 813. One end of the auxiliary rod 816 is fixedly connected to the slider 815, and the other end is suspended. The second cylinder 812 is fixedly arranged on the slider 815, and the connecting rod 813 is arranged on the top of the second cylinder 812, so that the connecting rod 813 can be raised and lowered and passed between the two auxiliary rods 816, so that the slider 815 is driven by the telescopic cylinder 811 to slide relative to the second slide rail 814, so as to guide the end of the connecting rod 813 and the ends of the two auxiliary rods 816 to move to the bottom of the silicon wafer 310 to be taken; at this time, the second suction cup 820 is driven to rise by the second cylinder 812, so that the second suction cup 820 passes between the two auxiliary rods 816, thereby adsorbing the silicon wafer 310, and at this time, the adsorption force of the first suction cup 710 and the second suction cup 820 are opposite forces. The telescopic cylinder 811 is contracted to drive the connecting rod 813 to move in a direction away from the wafer stage 200, so that the silicon wafer 310 adsorbed by the second suction cup 820 moves relative to the silicon wafer 310 adsorbed by the first suction cup 710, so that the two silicon wafers 310 are staggered, thereby reducing the contact area of the two silicon wafers 310 and the adhesion force between the two silicon wafers 310; then, the connecting rod 813 is driven down by the lifting cylinder, so that the second suction cup 820 returns to the bottom of the two auxiliary rods 816, and the second suction cup 820 is moved back to the bottom of the two auxiliary rods 816. The silicon wafer 310 adsorbed by 20 is limited by the two auxiliary rods 816, so that the second suction cup 820 is separated from the silicon wafer 310, so that the silicon wafer 310 is carried on the two auxiliary rods 816; the two auxiliary rods 816 are driven to move in the direction away from the wafer carrier 200 by contraction of the telescopic cylinder 811, and the limiting rod 620 limits the silicon wafer 310, so that the auxiliary rod 816 is separated from the silicon wafer 310, and the silicon wafer 310 falls back into the silicon wafer group 300, so that the first suction cup 710 can take the single silicon wafer 310.
[0039] It is understandable that in some embodiments of the present invention, reference Figure 2 and Figure 4 The separation component also includes a plurality of air nozzles 830. A plurality of supports 840 are vertically arranged on the support plate 500. The plurality of supports 840 are distributed along the circumference of the silicon wafer 310. The plurality of air nozzles 830 correspond to the plurality of supports 840 one by one. The air nozzles 830 are used to spray air between two adjacent silicon wafers 310 to further assist the first suction cup 710 in increasing the gap between the two silicon wafers 310, thereby increasing the separation rate of the two silicon wafers 310, and further increasing the success rate and efficiency of the first suction cup 710 in adsorbing a single silicon wafer 310.
[0040] The implementation principle of the present application is as follows: when the first suction cup 710 needs to absorb the silicon wafer 310, the lead screw 440 is driven to rotate by the driving motor 410, and the threaded engagement between the lead screw 440 and the screw hole drives the slide plate 430 to slide relative to the first slide rail 420, thereby driving the wafer carrier 200 to rise, thereby driving the silicon wafer group 300 to rise. At the same time, the first suction cup 710 is lowered to the top of the silicon wafer group 300 through the first cylinder 721 to absorb the silicon wafer 310 on the top of the silicon wafer group 300; at this time, the limit rod 620 is driven by the clamping cylinder 611 to move away from the silicon wafer group 300 to avoid the movement of the silicon wafer 310, thereby reducing the damage to the silicon wafer 310 caused by the friction between the limit rod 620 and the silicon wafer 310; thus, the first cylinder 721 drives the first suction cup 710 to rise, thereby realizing the removal of the silicon wafer 310.
[0041] If the first suction cup 710 picks up two silicon wafers 310 at one time, the sliding block 815 is driven to slide relative to the second sliding rail 814 by the telescopic cylinder 811, so as to guide the end of the connecting rod 813 and the ends of the two auxiliary rods 816 to move to the bottom of the silicon wafer 310 to be picked up; at this time, the second suction cup 820 is driven to rise by the second cylinder 812, so that the second suction cup 820 passes through the two auxiliary rods 816, thereby adsorbing the silicon wafer 310, and at this time, the adsorption forces of the first suction cup 710 and the second suction cup 820 are opposite. The telescopic cylinder 811 is contracted to drive the connecting rod 813 to move in a direction away from the wafer stage 200, so that the silicon wafer 310 adsorbed by the second suction cup 820 moves relative to the silicon wafer 310 adsorbed by the first suction cup 710, so that the two silicon wafers 310 are staggered, thereby reducing the contact area of the two silicon wafers 310 and the adhesion force between the two silicon wafers 310; then, the connecting rod 813 is driven down by the lifting cylinder, so that the second suction cup 820 returns to the bottom of the two auxiliary rods 816, and the second suction cup 820 is moved back to the bottom of the two auxiliary rods 816. The silicon wafer 310 adsorbed by 20 is limited by the two auxiliary rods 816, so that the second suction cup 820 is separated from the silicon wafer 310, so that the silicon wafer 310 is carried on the two auxiliary rods 816; the two auxiliary rods 816 are driven to move in the direction away from the wafer carrier 200 by contraction of the telescopic cylinder 811, and the limiting rod 620 limits the silicon wafer 310, so that the auxiliary rod 816 is separated from the silicon wafer 310, and the silicon wafer 310 falls back into the silicon wafer group 300, so that the first suction cup 710 can take the single silicon wafer 310.
[0042] If the first suction cup 710 picks up multiple silicon wafers 310 at one time, the separation process of the above-mentioned separation component is repeated; until a single silicon wafer 310 is left and is adsorbed by the first suction cup 710, so that the second suction cup 820 and the first suction cup 710 are respectively adsorbed on both sides of the silicon wafer 310. Since the adsorption force of the first suction cup 710 is greater than that of the second suction cup 820, the second suction cup 820 cannot drive the silicon wafer 310 to move. Therefore, after the separation component is repeatedly operated for multiple times, the first suction cup 710 can pick up a single silicon wafer 310, thereby solving the problem of picking up multiple silicon wafers 310 at one time due to adhesion.
[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A silicon wafer separation device, characterized in that: include: A wafer carrier (200) for carrying a silicon wafer group (300), wherein the silicon wafer group (300) comprises a plurality of silicon wafers (310) stacked vertically; A lifting component capable of driving the wafer carrier (200) to move up and down; A limiting component, used for limiting the horizontal movement of the silicon wafer (310); A suction component (700), comprising a first suction cup (710), wherein the first suction cup (710) is arranged above the wafer carrier (200) in a liftable manner, and the first suction cup (710) is capable of sucking the silicon wafer (310); The separation component includes a driving member and a second suction cup (820), wherein the second suction cup (820) is located below the first suction cup (710), and the second suction cup (820) is located above the wafer carrier (200). The second suction cup (820) can absorb the silicon wafer (310), and the driving member can drive the second suction cup (820) to move in a horizontal direction.
2. The silicon wafer separation device according to claim 1, characterized in that: The adsorption force of the first suction cup (710) is greater than the adsorption force of the second suction cup (820).
3. The silicon wafer separation device according to claim 1, characterized in that: The silicon wafer separation device comprises a vertically arranged fixed plate (100), the lifting component is arranged on the fixed plate (100), the lifting component comprises a first slide rail (420), a slide plate (430), a drive motor (410) and a screw rod (440), the first slide rail (420) is vertically arranged on one side of the fixed plate (100), the slide plate (430) is slidably matched with the first slide rail (420), the drive motor (410) is arranged at the bottom of the first slide rail (420), the screw rod (440) is vertically arranged, the bottom of the screw rod (440) is fixedly connected to the output end of the drive motor (410), a screw hole is opened on the slide plate (430), the screw rod (440) is threadedly matched with the screw hole, and one side of the wafer carrier (200) is fixedly connected to the slide plate (430).
4. The silicon wafer separation device according to claim 3, characterized in that: A support plate (500) is provided on one side of the slide plate (430), the support plate (500) is located below the wafer carrier (200), the limit assembly is carried on the support plate (500), the limit assembly includes an elastic member and a plurality of limit rods (620), the elastic member is carried on the support plate (500), the plurality of limit rods (620) are distributed at intervals along the circumference of the silicon wafer (310), the limit rods (620) are vertically arranged, and the wafer carrier (200) is opened. A plurality of waist-shaped holes (630) are provided, and the plurality of waist-shaped holes (630) correspond one by one to the plurality of limiting rods (620), respectively. The waist-shaped holes (630) are opened along the radial direction of the silicon wafer (310), and the bottom end of the limiting rod (620) is supported by the elastic member, and the top end passes through the waist-shaped hole (630) and extends vertically upward. The elastic member can simultaneously drive the plurality of limiting rods (620) to approach or move away from the silicon wafer group (300) along the length direction of the waist-shaped hole (630).
5. The silicon wafer separation device according to claim 4, characterized in that: The tensioner comprises a clamping cylinder (611) and a plurality of transmission rods (612); the clamping cylinder (611) is arranged on the support plate (500); the plurality of transmission rods (612) correspond one by one to the plurality of limit rods (620); one end of the transmission rod (612) is connected to the clamping cylinder (611), and the other end is connected to the limit rod (620); the clamping cylinder (611) can drive the plurality of transmission rods (612) to expand or contract.
6. The silicon wafer separation device according to claim 3, characterized in that: The adsorption assembly (700) further comprises a lifting member, and the lifting member is used to drive the first suction cup (710) to move up and down.
7. The silicon wafer separation device according to claim 6, characterized in that: The lifting member comprises a first cylinder (721), the first cylinder (721) is fixedly connected to the fixing plate (100) via a connecting frame, and the top of the first suction cup (710) is connected to the first cylinder (721).
8. The silicon wafer separation device according to claim 3, characterized in that: The driving component includes a telescopic cylinder (811), a second cylinder (812) and a connecting rod (813); the telescopic cylinder (811) is fixedly arranged on the fixed plate (100); the telescopic cylinder (811) can drive the connecting rod (813) to telescopically move along the radial direction of the silicon wafer (310); the second suction cup (820) is arranged at one end of the connecting rod (813) close to the wafer carrier (200); and the second cylinder (812) can drive the connecting rod (813) to rise and fall.
9. The silicon wafer separation device according to claim 8, characterized in that: A second slide rail (814) is provided on one side of the fixed plate (100), and the second slide rail (814) is provided along the telescopic direction of the telescopic cylinder (811). A slider (815) is slidably matched on the second slide rail (814), and the slider (815) is connected to the piston rod of the telescopic cylinder (811).
10. The silicon wafer separation device according to claim 9, characterized in that: Two auxiliary rods (816) are arranged side by side at one end of the slider (815), and the auxiliary rods (816) are arranged along the length direction of the connecting rod (813). The second cylinder (812) is fixedly arranged on the slider (815), and the connecting rod (813) is arranged on the top of the second cylinder (812) so that the connecting rod (813) can be raised and lowered and passed between the two auxiliary rods (816).