Lead frame row

Abstract

The utility model relates to the technical field of lead frames, in particular to a lead frame row, which comprises a plurality of lead frames, each lead frame comprises a plurality of pin leads, the plurality of lead frames are arranged side by side and sequentially connected to form a first frame group, and the remaining lead frames are arranged side by side and sequentially connected to form a second frame group. The number of the lead frames in the first frame group is equal to that of the lead frames in the second frame group, the first frame group and the second frame group are opposite in orientation, and the projection of the pin leads in the first frame group in the length direction of the first frame group coincides with the pin leads in the second frame group; according to the utility model, the first frame group and the second frame group are overlapped in the width direction of the plate, so that the arrangement of the first frame group and the second frame group is more reasonable, the utilization rate of the plate is higher, and the waste is less.

Description

Technical Field

[0001] The present application relates to the technical field of lead frames, and more particularly to a lead frame array. Background Art

[0002] Semiconductor packaging technology is already a very mature process. The lead frame is the chip carrier of the integrated circuit. It is a key structural component that uses bonding materials such as gold wire, aluminum wire, and copper wire to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It serves as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks. The lead frame row is a plate that is punched or etched by stamping or etching to obtain multiple lead frames arranged according to a certain rule, and then multiple lead frames can be obtained by trimming.

[0003] Our company currently has a lead frame array, such as Figure 1 As shown, it includes a plurality of lead frames 90, each of which has a plurality of pin leads 91 and a plurality of chip seat assemblies 92 at both ends. A plurality of the lead frames 90 are arranged side by side and connected in sequence to form a first frame group 90A, and the remaining plurality of lead frames 90 are arranged side by side and connected in sequence to form a second frame group 90B. The pin leads 91 on the first frame group 90A and the chip seat assemblies 92 on the second frame group 90B are connected by a connecting strip, and the above-mentioned lead frame row is obtained after a plate is stamped or etched. However, in the above-mentioned embodiment, the pin leads 91 on the first frame group 90A and the pin leads 91 on the second frame group 90B have the same orientation, and each of the pin leads 91 has a large number of blanks on both sides. During stamping or etching, these blanks need to be punched out or etched, resulting in serious waste of plate.

[0004] Therefore, there is a need to provide a lead frame row with a more reasonable arrangement of the first frame group and the second frame group, a higher board utilization rate and less waste. Summary of the invention

[0005] The main purpose of the present application is to provide a lead frame row, wherein the lead frame row includes a plurality of lead frames, each of the lead frames includes a plurality of pin leads, a plurality of the lead frames are arranged side by side and connected in sequence to form a first frame group, and the remaining lead frames are arranged side by side and connected in sequence to form a second frame group, and the number of the lead frames in the first frame group is equal to the number of the lead frames in the second frame group, and the first frame group and the second frame group are in opposite directions, and the projection of the pin leads in the first frame group in the length direction of the first frame group overlaps with the pin leads in the second frame group, thereby realizing effective utilization of space in the width direction of the plate. Compared with the prior art, the first frame group and the second frame group have the advantages of more reasonable arrangement, higher plate utilization and less waste.

[0006] Another object of the present application is to provide a lead frame row, wherein each of the lead frames includes a connecting portion and a chip seat combination, the connecting portion is located between the pin lead and the chip seat combination, and one side of the connecting portion is connected to each of the pin lead, and the other side of the connecting portion is connected to the chip seat combination, each of the pin lead has a plurality of first narrowing notches at one end facing away from the connecting portion, and each of the two ends of the connecting portion has a plurality of second narrowing notches, and the first narrowing notches and the second narrowing notches are provided to facilitate separation of the lead frames.

[0007] In order to achieve at least one of the above-mentioned invention objectives, the present application provides a lead frame row, wherein the lead frame row comprises:

[0008] A plurality of lead frames, each of which includes a plurality of pin leads, a plurality of the lead frames are arranged side by side and connected in sequence to form a first frame group, and the remaining lead frames are arranged side by side and connected in sequence to form a second frame group, and the number of the lead frames in the first frame group is equal to the number of the lead frames in the second frame group, and the first frame group and the second frame group are in opposite directions, and the projection of the pin leads in the first frame group in the length direction of the first frame group overlaps with the pin leads in the second frame group.

[0009] In one or more embodiments of the present application, each of the lead frames includes a connecting portion and a chip seat combination, the connecting portion is located between the pin lead and the chip seat combination, and one side of the connecting portion is connected to each of the pin lead, and the other side of the connecting portion is connected to the chip seat combination.

[0010] In one or more embodiments of the present application, the pin leads on the first frame group abut against and are connected to the connecting portion on the second frame group, and the pin leads on the second frame group abut against and are connected to the connecting portion on the first frame group.

[0011] In one or more embodiments of the present application, each of the pin leads has a plurality of first narrowing notches at one end facing away from the connecting portion.

[0012] In one or more embodiments of the present application, both ends of each of the connecting portions have a plurality of second narrowing notches.

[0013] In one or more embodiments of the present application, one end of each chip seat assembly close to the connecting portion is bent upward at a predetermined angle, and the connecting portion and the pin lead are arranged parallel to the end of the chip seat assembly away from the connecting portion and are spaced a predetermined distance apart in the height direction of the lead frame.

[0014] In one or more embodiments of the present application, the chip seat combination includes a first chip seat, a second chip seat, a third chip seat and a fourth chip seat, each of the lead frames includes four pin leads, and the four pin leads are respectively opposite to the first chip seat, the second chip seat, the third chip seat and the fourth chip seat.

[0015] In one or more embodiments of the present application, the first chip seat, the second chip seat, the third chip seat and the fourth chip seat are arranged in sequence, and the first chip seat, the third chip seat and the fourth chip seat each have a plurality of positioning holes.

[0016] In one or more embodiments of the present application, the second chip seat, the third chip seat and the fourth chip seat each have a plurality of protrusions.

[0017] In an embodiment of the present application, a lead frame row includes a plurality of lead frames, each lead frame includes a plurality of pin leads, a plurality of lead frames are arranged side by side and connected in sequence to form a first frame group, and the remaining lead frames are arranged side by side and connected in sequence to form a second frame group, and the number of lead frames in the first frame group is equal to the number of lead frames in the second frame group, and the first frame group and the second frame group are in opposite directions, and the projection of the pin leads in the first frame group in the length direction of the first frame group overlaps with the pin leads in the second frame group, thereby realizing effective utilization of space in the width direction of the plate. Compared with the prior art, the first frame group and the second frame group have the advantages of more reasonable arrangement, higher plate utilization and less waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] These and / or other aspects and advantages of the present application will become clearer and easier to understand from the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings, in which:

[0019] Figure 1 The figure shows a schematic structural diagram of an existing lead frame row;

[0020] Figure 2 The figure shows a schematic structural diagram of a lead frame row of the utility model at a certain angle;

[0021] Figure 3 The figure shows a schematic diagram of the structure of the lead frame;

[0022] Figure 4 The figure shows a schematic structural diagram of a lead frame row at another angle. DETAILED DESCRIPTION

[0023] The terms and words used in the following specification and claims are not limited to the literal meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present application is provided for illustrative purposes only and not for the purpose of limiting the present application as defined by the appended claims and their equivalents.

[0024] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0025] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0026] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0027] Application Overview

[0028] There is a lead frame array in which the pin leads on the first frame group and the pin leads on the second frame group have the same orientation, and both sides of each pin lead have a large number of blanks. During stamping or etching, these blanks need to be punched out or etched away, resulting in serious waste of board material.

[0029] Based on the above technical problems, the present application proposes a lead frame row, wherein the lead frame row has a simple structure, does not involve complicated manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the lead frame row provided by the present application is easy to produce and low-cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0030] Schematic lead frame row,

[0031] refer to Figures 2 to 4 According to a preferred embodiment of the present invention, a lead frame array is provided. Figure 2 As shown, the lead frame row includes a plurality of lead frames 10, each of the lead frames 10 includes a plurality of pin leads 101, a plurality of the lead frames 10 are arranged side by side and connected in sequence to form a first frame group 10A, and the remaining lead frames 10 are arranged side by side and connected in sequence to form a second frame group 10B, and the number of the lead frames 10 in the first frame group 10A is equal to the number of the lead frames 10 in the second frame group 10B, and the first frame group 10A and the second frame group 10B are in opposite directions, and the projection of the pin leads 101 in the first frame group 10A in the length direction of the first frame group 10A overlaps with the pin leads 101 in the second frame group 10B.

[0032] It should be noted that, compared with the prior art in which the pin leads 101 of the first frame group 10A and the second frame group 10B have the same orientation, resulting in the pin leads 101 on the first frame group 10A and the second frame group 10B occupying the width of the plate twice, the embodiment of the present application makes the first frame group 10A and the second frame group 10B face oppositely, and makes the pin leads 101 on the first frame group 10A and the second frame group 10B at least partially overlap in the width direction of the plate, thereby utilizing the wider blank area between the pin leads 101 on the first frame group 10A. The overlapping part of the pin leads 101 reduces the overall width of the plate. When the pin leads 101 of the first frame group 10A and the second frame group 10B completely overlap in the width direction of the plate, the utilization rate of the plate in the width direction is the highest at this time, and the first frame group 10A and the second frame group 10B are arranged more reasonably, the plate utilization rate is higher, the waste is less, and it is suitable for the arrangement scenario where the pin leads 101 are longer.

[0033] Further, in the embodiments of the present application, Figure 2 As shown, each of the lead frames 10 includes a connecting portion 102 and a chip seat assembly 103, wherein the connecting portion 102 is located between the pin lead 101 and the chip seat assembly 103, and one side of the connecting portion 102 is connected to each of the pin lead 101, and the other side of the connecting portion 102 is connected to the chip seat assembly 103.

[0034] Specifically, Figure 3 As shown, the chip seat assembly 103 includes a first chip seat 1031, a second chip seat 1032, a third chip seat 1033 and a fourth chip seat 1034, each of the lead frames 10 includes four pin leads 101, and the four pin leads 101 are respectively opposite to the first chip seat 1031, the second chip seat 1032, the third chip seat 1033 and the fourth chip seat 1034.

[0035] More specifically, if Figure 3 As shown, the end of the second chip holder 1032 away from the connecting portion 102 is surrounded by the first chip holder 1031 and the third chip holder 1033; the ends of the first chip holder 1031, the third chip holder 1033 and the fourth chip holder 1034 away from the connecting portion 102 are flush; the first chip holder 1031 and the third chip holder 1033 have a first bevel 10311 on the opposite side, and the first bevel 10311 is located at the first chip holder 1031 and one end of the third chip holder 1033 away from the connecting portion 102; the first chip holder 1031 and the third chip holder 1033 are both in a "7" shape as a whole, and the "7" of the first chip holder 1031 and the third chip holder 1033 are in opposite directions; the fourth chip holder 1034 is in a long strip shape; one end of the second chip holder 1032 away from the connecting portion 102 and a side of the third chip holder 1033 close to the second chip holder 1032 both have a second bevel angle 10321.

[0036] Furthermore, in order to maximize the use of space in the width direction of the plate, in the embodiment of the present application, Figure 3As shown, the projection of the pin lead 101 on the first frame group 10A in the length direction of the first frame group 10A completely overlaps with the pin lead 101 in the second frame group 10B. More specifically, each of the lead frames 10 includes a connecting portion 102 and a chip seat assembly 103, and the connecting portion 102 is located between the pin lead 101 and the chip seat assembly 103, and one side of the connecting portion 102 is connected to each of the pin leads 101, and the other side of the connecting portion 102 is connected to the chip seat assembly 103.

[0037] Furthermore, in order to facilitate the cutting of the pin leads 101 on the first frame group 10A and the connecting portion 102 on the second frame group 10B after stamping, Figure 2 and Figure 3 As shown, each of the pin leads 101 has a plurality of first narrowing notches 1011 at one end away from the connecting portion 102. In the embodiment of the present application, there are two first narrowing notches 1011 on each of the pin leads 101, and the two first narrowing notches 1011 are symmetrically arranged.

[0038] Similarly, in order to facilitate cutting of the two adjacent lead frames 10, as shown in FIG. Figure 2 and Figure 3 As shown, both ends of each of the connecting portions 102 have a plurality of second narrowing notches 1021 . In the embodiment of the present application, the number of the second narrowing notches 1021 on each of the connecting portions 102 is two, and the two second narrowing notches 1021 are symmetrically arranged.

[0039] Further, in the embodiments of the present application, Figure 2 and Figure 4 As shown, one end of each chip seat assembly 103 close to the connecting portion 102 is bent upward at a predetermined angle, and the connecting portion 102 and the pin lead 101 are arranged parallel to the end of the chip seat assembly 103 away from the connecting portion 102 and are spaced a predetermined distance apart in the height direction of the lead frame 10.

[0040] Furthermore, to facilitate positioning during subsequent packaging, Figure 3As shown, the first chip base 1031, the second chip base 1032, the third chip base 1033 and the fourth chip base 1034 are arranged in sequence, and the first chip base 1031, the third chip base 1033 and the fourth chip base 1034 each have a plurality of positioning holes 10312. Specifically, the first chip base 1031 has two positioning holes 10312, one of which is a round hole and the other is a waist-shaped hole; the number of positioning holes 10312 on the third chip base 1033 and the fourth chip base 1034 is one.

[0041] In addition, if Figure 3 and Figure 4 As shown, the second chip seat 1032, the third chip seat 1033 and the fourth chip seat 1034 each have a plurality of bosses 10322. Specifically, the second chip seat 1032 and the third chip seat 1033 each have one boss 10322, and the fourth chip seat 1034 has two bosses 10322, and the two bosses 10322 are located on both sides of the positioning hole 10312.

[0042] In summary, the lead frame row according to the embodiment of the present application is explained, which provides the lead frame row with advantages such as more reasonable arrangement of the first frame group and the second frame group, higher plate utilization, less waste, etc.

[0043] It is worth mentioning that in the embodiment of the present application, the lead frame row has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the lead frame row provided by the present application is easy to produce and has low cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0044] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A lead frame row, Features: The lead frame array includes A plurality of lead frames, each of which includes a plurality of pin leads, a plurality of the lead frames are arranged side by side and connected in sequence to form a first frame group, and the remaining lead frames are arranged side by side and connected in sequence to form a second frame group, and the number of the lead frames in the first frame group is equal to the number of the lead frames in the second frame group, and the first frame group and the second frame group are in opposite directions, and the projection of the pin leads in the first frame group in the length direction of the first frame group overlaps with the pin leads in the second frame group.

2. The lead frame row according to claim 1, Features: Each of the lead frames comprises a connecting portion and a chip seat assembly, wherein the connecting portion is located between the pin lead and the chip seat assembly, and one side of the connecting portion is connected to each of the pin lead, and the other side of the connecting portion is connected to the chip seat assembly.

3. The lead frame row according to claim 2, Features: The pin leads on the first frame group abut against and are connected to the connecting portion on the second frame group, and the pin leads on the second frame group abut against and are connected to the connecting portion on the first frame group.

4. The lead frame row according to claim 3, Features: Each of the pin leads has a plurality of first narrowing notches at one end away from the connecting portion.

5. The lead frame array according to any one of claims 2 to 4, Features: Both ends of each of the connecting parts have a plurality of second narrowing notches.

6. The lead frame row according to claim 5, Features: One end of each chip seat assembly close to the connection portion is bent upward at a predetermined angle, and the connection portion and the pin lead are arranged in parallel with one end of the chip seat assembly away from the connection portion and are spaced a predetermined distance apart in the height direction of the lead frame.

7. The lead frame row according to claim 6, Features: The chip seat assembly includes a first chip seat, a second chip seat, a third chip seat and a fourth chip seat, each of the lead frames includes four pin leads, and the four pin leads are respectively opposite to the first chip seat, the second chip seat, the third chip seat and the fourth chip seat.

8. The lead frame row according to claim 7, Features: The first chip seat, the second chip seat, the third chip seat and the fourth chip seat are arranged in sequence, and the first chip seat, the third chip seat and the fourth chip seat are each provided with a plurality of positioning holes.

9. The lead frame row according to claim 8, Features: The second chip seat, the third chip seat and the fourth chip seat are each provided with a plurality of protruding columns.

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