Compartment type electrical integrated power distribution control cabinet

Abstract

The utility model discloses a compartment-type electrical integrated power distribution control cabinet, which comprises a cabinet body and bilateral cooling mechanisms, the bilateral cooling mechanisms are symmetrically arranged at the top of the cabinet body, cabinet doors are symmetrically arranged on the front surface of the cabinet body, handles are symmetrically arranged at the centers of the cabinet doors, and an observation plate is arranged at the upper end of the cabinet door at any end in a penetrating manner. According to the utility model, the double-side cooling mechanism is specially used for cooling and heat dissipation of mutual contact positions of the compartment type control cabinet, semiconductor cooling fins are used as a cold source, a water pump controls liquid to circularly flow in the cooling cavity and the cooling water return pipe, the temperature of the cooling water return pipe is reduced, and air in the cabinet body is in contact with the cooling water return pipe, so that the cabinet body is cooled; the problems that in the background technology, compartment type electrical integrated power distribution control cabinets are placed side by side, the temperature of the contact position is prone to rise, and heat dissipation is inconvenient are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of power distribution control cabinets, and particularly relates to a box-type electrical integrated power distribution control cabinet. Background Art

[0002] The box-type electrical integrated distribution control cabinet is a cabinet that assembles switchgear, measuring instruments, protective electrical appliances and auxiliary equipment in a closed or semi-closed metal cabinet or on a screen according to the electrical wiring requirements.

[0003] Generally, the heat dissipation of control cabinets is poor, and the electronic components inside the electrical control cabinet are easily burned. In addition, the box-type electrical integrated distribution control cabinets are usually placed side by side, so the contact position temperature of the box-type electrical integrated distribution control cabinet is easy to rise, and it is not convenient to dissipate heat. Therefore, a box-type electrical integrated distribution control cabinet is proposed. Utility Model Content

[0004] The purpose of the utility model is to overcome the problem in the prior art that the temperature of the contact position of box-type electrical integrated distribution control cabinets placed side by side is easily increased, which is inconvenient to dissipate heat, and to provide a box-type electrical integrated distribution control cabinet that uses a double-sided cooling mechanism to cool and dissipate heat specifically at the contact position of the box-type control cabinets.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a box-type electrical integrated distribution control cabinet, including a cabinet body and a double-sided cooling mechanism, the double-sided cooling mechanism is symmetrically arranged on the top of the cabinet body, the cabinet body is symmetrically installed with cabinet doors on the front side, handles are symmetrically arranged at the center of the cabinet doors, and an observation panel is penetrated through the upper end of the cabinet door at either end.

[0006] Preferably, the double-sided cooling mechanism includes a cooling return pipe, a partition plate 1, a partition plate 2, a cooling chamber, a semiconductor heat sink, a cooling chamber, a heat dissipation chamber and a water pump. The cooling chamber is symmetrically arranged on the top of the cabinet, the cooling return pipe is symmetrically arranged in the cooling chamber, the cooling return pipe is arranged in the cabinet, both ends of the cooling return pipe are connected to the bottom of the cooling chamber, the partition plate 1 is horizontally arranged in the middle of the inner wall of the cooling chamber, the partition plate 2 is symmetrically arranged below the partition plate and arranged on the bottom wall of the cooling chamber, and the cooling chamber is formed by the partition plate. 2. A sealed cavity composed of the side wall, bottom wall and partition 1 of the cooling bin; the heat dissipation bin is a sealed cavity composed of two groups of partition 2, partition 1 and the bottom wall of the cooling plate; the water pump is arranged under the upper wall of the cooling bin; the two ends of the water pump are respectively connected to the cooling cavities on both sides; the ends of the cooling return water pipe are respectively connected to the cooling cavities on both sides; the semiconductor heat sink is arranged through partition 2; the cooling surface of the semiconductor heat sink is located in the cooling cavity; the heating surface of the semiconductor heat sink is located in the heat dissipation cavity.

[0007] Preferably, a rotating motor is provided in the cooling chamber, and the rotating motor is provided under the upper wall of the heat dissipation chamber. A fan blade is fixedly connected under the rotating motor. A central exhaust hole is penetrated at the center of the bottom wall of the cooling chamber, and the central exhaust hole is provided directly below the fan blade. Side exhaust holes are symmetrically penetrated through the bottom wall of the cooling chamber, and the side exhaust holes are symmetrically provided on both sides of the central exhaust hole. The side exhaust holes and the central exhaust hole are both located between the second partition.

[0008] Preferably, an exhaust pipe is provided on the bottom wall of the cooling bin, the exhaust pipe is sleeved on the outside of the fan blade, the exhaust pipe is provided on the central exhaust hole, and the diameter of the exhaust pipe is larger than the diameter of the central exhaust hole.

[0009] Preferably, a filter structure is provided in the central exhaust hole and the side exhaust holes.

[0010] Preferably, layer plates are evenly distributed and sleeved on the cooling return water pipe.

[0011] Preferably, a collar is provided at the connection between the layer plate and the cooling return pipe. The collar is symmetrically arranged above and below the layer plate, and a circular groove structure is provided on the outer side surface of the collar.

[0012] The beneficial effects of the utility model are:

[0013] The utility model uses a double-sided cooling mechanism to cool and dissipate heat specifically at the contact positions of the box-type control cabinets, uses a semiconductor heat sink as a cold source, and a water pump controls the liquid to circulate in the cooling chamber and the cooling return pipe. The temperature of the cooling return pipe is reduced, and the air in the cabinet body contacts the cooling return pipe to achieve cooling of the cabinet body, thereby solving the problem in the background technology that the temperature of the contact positions of the box-type electrical integrated distribution control cabinets placed side by side is easily increased, making heat dissipation inconvenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a box-type electrical integrated power distribution control cabinet of the utility model.

[0015] Figure 2 yes Figure 1 A partial enlarged view of point A in the middle.

[0016] Figure 3 It is an internal structural diagram of a cooling chamber in a box-type electrical integrated power distribution control cabinet of the utility model.

[0017] Figure 4 It is a usage status diagram of the box-type electrical integrated power distribution control cabinet of the utility model.

[0018] In the figure: 1. cabinet body; 2. double-sided cooling mechanism; 3. cabinet door; 4. handle; 5. observation panel; 6. cooling return pipe; 7. partition 1; 8. partition 2; 9. cooling chamber; 10. semiconductor heat sink; 11. cooling chamber; 12. water pump; 13. rotating motor; 14. fan blade; 15. central exhaust hole; 16. side exhaust hole; 17. exhaust pipe; 18. shelf; 19. collar; 20. heat dissipation chamber. DETAILED DESCRIPTION

[0019] The following is combined with Figure 1-4 , clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, specific orientation structure and operation, and therefore should not be understood as a limitation on the present invention.

[0021] The present embodiment provides a box-type electrical integrated distribution control cabinet, including a cabinet body 1 and a double-sided cooling mechanism 2, the double-sided cooling mechanism 2 is symmetrically arranged on the top of the cabinet body 1, cabinet doors 3 are symmetrically installed on the front of the cabinet body 1, handles 4 are symmetrically arranged at the center of the cabinet doors 3, and an observation panel 5 is penetrated through the upper end of the cabinet door 3 at either end.

[0022] In one embodiment, specifically, the double-sided cooling mechanism 2 includes a cooling return pipe 6, a partition 1 7, a partition 2 8, a cooling bin 9, a semiconductor heat sink 10, a cooling cavity 11, a heat dissipation cavity 20 and a water pump 12. The cooling bin 9 is symmetrically arranged on the top of the cabinet 1, the cooling return pipe 6 is symmetrically arranged in the cooling bin 9, the cooling return pipe 6 is arranged in the cabinet 1, and both ends of the cooling return pipe 6 are connected to the bottom of the cooling bin 9. The partition 1 7 is horizontally arranged in the middle of the inner wall of the cooling bin 9, the partition 2 8 is symmetrically arranged under the partition 1 7 and arranged on the bottom wall of the cooling bin 9, and the cooling cavity 11 is symmetrically arranged in the cooling bin 9. It is a sealed cavity composed of partition 2 8, the side wall and bottom wall of the cooling chamber 9 and partition 1 7. The heat dissipation chamber is a sealed cavity composed of two groups of partition 2 8, partition 1 7 and the bottom wall of the cooling plate. The water pump 12 is arranged under the upper wall of the cooling chamber 9. The two ends of the water pump 12 are respectively connected to the cooling chamber 11 on both sides. The ends of the cooling return pipe 6 are respectively connected to the cooling chamber 11 on both sides. The semiconductor heat sink 10 is arranged through the partition 2 8. The cooling surface of the semiconductor heat sink 10 is located in the cooling chamber 11, and the heating surface of the semiconductor heat sink 10 is located in the heat dissipation chamber 20.

[0023] In one embodiment, specifically, a rotating motor 13 is provided in the cooling chamber 11, and the rotating motor 13 is provided under the upper wall of the heat dissipation chamber 20. A fan blade 14 is fixedly connected under the rotating motor 13. A central exhaust hole 15 is penetrated at the center of the bottom wall of the cooling chamber 9. The central exhaust hole 15 is located directly below the fan blade 14. Side exhaust holes 16 are symmetrically penetrated through the bottom wall of the cooling chamber 9. The side exhaust holes 16 are symmetrically arranged on both sides of the central exhaust hole 15. The side exhaust holes 16 and the central exhaust hole 15 are both located between the partition 2 8.

[0024] In one embodiment, specifically, an exhaust pipe 17 is provided on the bottom wall of the cooling chamber 9 , the exhaust pipe 17 is sleeved on the outside of the fan blade 14 , the exhaust pipe 17 is provided on the central exhaust hole 15 , and the diameter of the exhaust pipe 17 is larger than the diameter of the central exhaust hole 15 .

[0025] In one embodiment, specifically, filter structures are provided in the central exhaust hole 15 and the side exhaust holes 16 .

[0026] In one embodiment, specifically, the cooling return pipe 6 is evenly distributed with layer plates 18, and the connection between the layer plates 18 and the cooling return pipe 6 is sleeved with rings 19. The rings 19 are symmetrically arranged above and below the layer plates 18, and an annular groove structure is provided on the outer side of the rings 19.

[0027] The working process of the box-type electrical integrated distribution control cabinet in this embodiment is as follows: the double-sided cooling mechanism 2 is placed between adjacent control cabinets, and the two groups of cooling return pipes 6 of the double-sided cooling mechanism 2 are respectively inserted into the cabinet bodies 1 on both sides, and the water pump 12 controls the liquid to circulate in the cooling chamber 11 and the cooling return pipe 6. The liquid contacts the semiconductor heat sink 10, and the liquid temperature is reduced, thereby reducing the temperature of the cooling return pipe 6, and the air contacts the cooling return pipe 6, and the air temperature is reduced, thereby realizing the heat dissipation in the cabinet body 1, and the collar 19 and the layer plate 18 increase the contact area between the cooling return pipe 6 and the air, and increase the air temperature drop speed. At the same time, the rotating motor 13 drives the fan blades 14 to rotate, and controls the air discharge in the heat dissipation chamber 20. At the same time, the outside air enters the heat dissipation chamber 20 through the side exhaust hole 16, and the outside air contacts the hot end surface of the semiconductor heat sink 10 to reduce the temperature of the hot end surface of the semiconductor heat sink 10.

[0028] The above contents are merely examples and explanations of the structure of the utility model. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of the utility model.

Claims

1. A box-type electrical integrated power distribution control cabinet, It is characterized in that The cabinet comprises a cabinet body (1) and a double-sided cooling mechanism (2), wherein the double-sided cooling mechanism (2) is symmetrically arranged on the top of the cabinet body (1), cabinet doors (3) are symmetrically installed on the front of the cabinet body (1), handles (4) are symmetrically arranged at the center of the cabinet doors (3), and an observation panel (5) is provided through the upper end of the cabinet door (3) at either end; The double-sided cooling mechanism (2) comprises a cooling water return pipe (6), a partition plate 1 (7), a partition plate 2 (8), a cooling chamber (9), a semiconductor heat sink (10), a cooling chamber (11), a heat dissipation chamber (20) and a water pump (12); the cooling chamber (9) is symmetrically arranged on the top of the cabinet (1); the cooling water return pipe (6) is symmetrically arranged in the cooling chamber (9); the cooling water return pipe (6) is arranged in the cabinet (1); both ends of the cooling water return pipe (6) are connected to the bottom of the cooling chamber (9); the partition plate 1 (7) is horizontally arranged in the middle of the inner wall of the cooling chamber (9); the partition plate 2 (8) is symmetrically arranged under the partition plate 1 (7) and arranged on the bottom wall of the cooling chamber (9); the cooling chamber (11) is A sealed cavity body composed of partition plate 2 (8), the side wall and bottom wall of a cooling chamber (9) and partition plate 1 (7); the heat dissipation cavity (20) is a sealed cavity body composed of two groups of partition plates 2 (8), partition plate 1 (7) and the bottom wall of the cooling plate; the water pump (12) is arranged below the upper wall of the cooling chamber (9); the two ends of the water pump (12) are respectively connected to the cooling chambers (11) on both sides; the ends of the cooling return water pipe (6) are respectively connected to the cooling chambers (11) on both sides; the semiconductor heat sink (10) is arranged to pass through partition plate 2 (8); the cooling surface of the semiconductor heat sink (10) is located in the cooling chamber (11); and the heating surface of the semiconductor heat sink (10) is located in the heat dissipation cavity (20).

2. According to claim 1, the box-type electrical integrated power distribution control cabinet, It is characterized in that A rotating motor (13) is arranged in the heat dissipation cavity (20), the rotating motor (13) is arranged below the upper wall of the heat dissipation cavity (20), a fan blade (14) is fixedly connected below the rotating motor (13), a central exhaust hole (15) is penetrated at the center of the bottom wall of the cooling chamber (9), the central exhaust hole (15) is arranged directly below the fan blade (14), side exhaust holes (16) are symmetrically penetrated through the bottom wall of the cooling chamber (9), the side exhaust holes (16) are symmetrically arranged on both sides of the central exhaust hole (15), and the side exhaust holes (16) and the central exhaust hole (15) are both located between the second partition (8).

3. According to claim 2, the box-type electrical integrated power distribution control cabinet, It is characterized in that An exhaust pipe (17) is provided on the bottom wall of the cooling chamber (9), the exhaust pipe (17) is sleeved on the outside of the fan blade (14), the exhaust pipe (17) is provided on the central exhaust hole (15), and the diameter of the exhaust pipe (17) is larger than the diameter of the central exhaust hole (15).

4. According to claim 3, the box-type electrical integrated power distribution control cabinet, It is characterized in that The central exhaust hole (15) and the side exhaust hole (16) are provided with filter structures.

5. According to claim 1, the box-type electrical integrated power distribution control cabinet, It is characterized in that The cooling water return pipe (6) is evenly sleeved with layer plates (18).

6. The box-type electrical integrated power distribution control cabinet according to claim 5, It is characterized in that A sleeve ring (19) is sleeved at the connection between the layer plate (18) and the cooling return water pipe (6). The sleeve ring (19) is symmetrically arranged above and below the layer plate (18). A circular ring groove structure is arranged on the outer side surface of the sleeve ring (19).

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