Anti-overheating network switch

Abstract

The utility model relates to the technical field of heat dissipation of switches, in particular to an anti-overheating network switch which comprises a machine box, a cover plate and a circuit board welded with a chip, a heat dissipation mechanism is arranged above the chip of the circuit board, the heat dissipation mechanism comprises a hot end fin and a cold end fin which are attached to the chip of the circuit board, and the hot end fin and the cold end fin are in heat exchange connection; the hot end fins and the cold end fins are provided with airflow conveying modules, and the airflow conveying modules convey airflow outside the machine box to the heat dissipation mechanism and then discharge the airflow out of the machine box. According to the scheme, the heat dissipation mechanism is arranged on the circuit board chip, the hot end fins and the cold end fins are matched with each other, heat is conducted to the fins, meanwhile, the heat pipes are used for transmitting the heat to the surrounding, then the fan assemblies are arranged on the fins, external airflow is promoted to flow through the fan assemblies, and therefore the heat of the fins is taken away, and the heat dissipation efficiency is improved. Therefore, the temperature of the fins is reduced, and the network switch is prevented from being damaged due to overheating.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of switches, and in particular to an overheat-proof network switch. Background Art

[0002] A switch is a network device used for forwarding electrical (optical) signals. It can provide an exclusive electrical signal path for any two network nodes connected to the switch. The most common switch is the Ethernet switch. Since the switch needs to process the sending and receiving signals, it is usually equipped with a chip inside. During the operation, the chip will emit a certain amount of heat. Failure to cool it may cause the chip to be damaged. Therefore, most existing switches use aluminum fins for passive heat dissipation.

[0003] The cost of using aluminum fins for passive heat dissipation is low, but the disadvantages are also very obvious. Due to the poor airflow inside the switch, the aluminum fins can only dissipate a limited amount of heat from the chip, and the final stable state temperature will still be relatively high, and the heat dissipation effect is limited. Therefore, in order to solve the above problem, the present application provides an overheating-proof network switch.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0005] In order to solve the problem that the passive heat dissipation of existing switches is not effective, the present application provides an overheating-proof network switch.

[0006] The present application provides an overheat-proof network switch, comprising a machine box and a cover plate slidably embedded in the machine box, wherein a circuit board with a chip welded thereon is arranged inside the machine box, a heat dissipation mechanism is arranged above the circuit board chip, and the heat dissipation mechanism comprises a hot end fin and a cold end fin attached to the circuit board chip, and the two are connected by heat exchange;

[0007] The hot end fins and the cold end fins are both provided with air flow conveying modules, which convey the air flow outside the machine box to the heat dissipation mechanism and then discharge it to the outside of the machine box.

[0008] Preferably, the heat dissipation mechanism further comprises a heat pipe welded between the hot-end fin and the cold-end fin, the bottom of the hot-end fin is bonded to the circuit board chip via a heat conducting sheet, and the cold-end fin is suspended.

[0009] Preferably, the cold end fins are arranged above a position where the circuit board has less heat dissipation.

[0010] Preferably, the airflow conveying module comprises a fan assembly, a casing is arranged outside the fan assembly, an air inlet is opened at the input end of the casing located at the fan assembly, and an air outlet is arranged at the side of the fan assembly.

[0011] Preferably, the bottoms of the casings of the two fan assemblies are respectively fitted on the tops of the hot-end fins and the cold-end fins.

[0012] Preferably, a temperature monitoring module is provided on the circuit board, and the temperature monitoring module is communicatively connected with the fan assembly via a chip to control the fan speed.

[0013] Preferably, the cover plate is provided with an air inlet slot matching the air inlet end of the fan assembly, and the side wall of the machine box is provided with an air outlet slot matching the output end of the fan.

[0014] Preferably, a power supply is also provided on one side of the interior of the box.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] By setting a heat dissipation mechanism on the circuit board chip, using the hot-end fins and the cold-end fins to cooperate with each other, the heat is conducted to the fins, and the heat is transferred to the surroundings by using heat pipes. A fan assembly is then set on the fins, and the fan assembly is used to promote external airflow to take away the heat from the fins, thereby reducing the temperature of the fins and preventing the network switch from overheating and being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an isometric drawing in Example 1 of the present application;

[0018] Figure 2 It is an internal structure diagram in the first embodiment of the present application;

[0019] Figure 3 This is a structural diagram of the heat dissipation mechanism in Example 1 of the present application.

[0020] Explanation of the reference numerals: 1. machine box; 11. air outlet slot; 2. cover plate; 21. air inlet slot; 3. power supply; 4. circuit board; 6. air flow delivery module; 61. fan assembly; 62. air inlet end; 63. air outlet end; 7. heat dissipation mechanism; 71. hot end fin; 72. cold end fin; 73. heat pipe; 74. thermal conductive sheet. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1-Figure 3 This application is described in further detail.

[0022] Example

[0023] Reference Figure 1-Figure 3An overheat-proof network switch includes a machine box 1 and a cover plate 2 slidably embedded in the machine box 1. A circuit board 4 with a chip welded thereon is disposed inside the machine box 1. A power supply 3 is also disposed on one side of the machine box 1. A heat dissipation mechanism 7 is disposed above the chip of the circuit board 4. The heat dissipation mechanism 7 includes a hot end fin 71 and a cold end fin 72 that are attached to the chip of the circuit board 4.

[0024] A hot exchange connection is provided between the two;

[0025] The heat dissipation mechanism 7 also includes a heat pipe 73 welded between the hot-end fin 71 and the cold-end fin 72. The bottom of the hot-end fin 71 is bonded to the chip of the circuit board 4 through the heat conductive sheet 74, and the cold-end fin 72 is suspended. The inner wall of the heat pipe 73 is a sintered wall with a porous structure. When one end of the heat pipe 73 contacts the heat source, the coolant in the heat pipe 73 absorbs heat and boils and evaporates into gas. When it diffuses to an area with a lower temperature, the coolant will cool, release heat and turn back into liquid, and then return to the hot zone through the capillary action of the sintered wall. In this reciprocating cycle, heat transfer can be achieved. The cold-end fin 72 is arranged above the position of the circuit board 4 with less heat dissipation. The hot-end fin 71 absorbs the chip heat through the heat conductive sheet 74 and transfers it to the fin body for heat dissipation. At the same time, part of the heat will be transferred to the cold-end fin 72 through the heat pipe 73, thereby completing the heat dispersion and improving the heat dissipation efficiency.

[0026] The hot end fins 71 and the cold end fins 72 are both provided with air flow conveying modules 6 , and the air flow conveying modules 6 convey the air flow outside the machine box 1 to the heat dissipation mechanism 7 and then discharge it to the outside of the machine box 1 .

[0027] The air flow conveying module 6 includes a fan assembly 61, and the fan assembly 61 includes a fan blade and a brushless motor arranged at the axial position thereof, and the fan blade is powered by the brushless motor. A housing is arranged on the outside of the fan assembly 61, and an air inlet end 62 is provided at the input end of the housing located at the fan assembly 61, and an air outlet end 63 is provided at the side of the fan assembly 61. An air inlet groove 21 matching the air inlet end 62 of the fan assembly 61 is provided on the cover plate 2, and an air outlet groove 11 matching the fan output end is provided on the side wall of the machine box 1. A gauze is provided at the position of the air inlet groove 21 to prevent large particles of impurities from entering the interior thereof, and a grille is provided at the position of the air outlet groove 11 for protecting the position. The bottom of the housing of the two fan assemblies 61 is respectively fitted on the top of the hot end fin 71 and the cold end fin 72. The casing is used to achieve further heat conduction. When the fan assembly 61 rotates, the external airflow enters the casing through its input end, and after contacting the casing, it takes away the heat on the hot end fins 71 and the cold end fins 72. Since the bottom of the casing is sealed, the airflow will be discharged from the output end to the outside of the machine box 1 under the action of centrifugal force, so as to cool the fins and then cool the chip. A temperature monitoring module is provided on the circuit board 4, and the temperature monitoring module is connected to the fan assembly 61 through communication with the chip to control the fan speed. After detecting that the chip temperature has increased, the temperature monitoring module transmits a signal to the chip. After processing the information, the chip controls the fan assembly 61 to increase the speed, thereby increasing the flow speed of the airflow to achieve a better cooling effect.

[0028] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An overheat-proof network switch, comprising a machine box (1) and a cover plate (2) slidably embedded in the machine box (1), wherein a circuit board (4) with a chip welded thereon is arranged inside the machine box (1), characterized in that: A heat dissipation mechanism (7) is provided above the chip of the circuit board (4), and the heat dissipation mechanism (7) comprises a hot end fin (71) and a cold end fin (72) which are bonded to the chip of the circuit board (4), and the two are connected by heat exchange; An airflow conveying module (6) is provided on both the hot end fin (71) and the cold end fin (72), and the airflow conveying module (6) conveys the airflow outside the machine box (1) to the heat dissipation mechanism (7) and then discharges it to the outside of the machine box (1); The circuit board (4) is provided with a temperature monitoring module, and the temperature monitoring module is communicatively connected with the fan assembly (61) via a chip to control the fan speed.

2. The overheat-proof network switch according to claim 1, characterized in that: The heat dissipation mechanism (7) further comprises a heat pipe (73) welded between the hot end fin (71) and the cold end fin (72); the bottom of the hot end fin (71) is bonded to the circuit board (4) chip via a heat conducting sheet (74); and the cold end fin (72) is suspended.

3. The overheat-proof network switch according to claim 2, characterized in that: The cold end fin (72) is arranged above a position of the circuit board (4) where the heat dissipation is relatively small.

4. The overheat-proof network switch according to claim 1, characterized in that: The air flow conveying module (6) comprises a fan assembly (61), a housing is arranged on the outer side of the fan assembly (61), and the housing is provided with an air inlet (62) at the input end of the fan assembly (61), and an air outlet (63) is arranged at the side of the fan assembly (61).

5. The overheat-proof network switch according to claim 4, characterized in that: The bottoms of the casings of the two fan assemblies (61) are respectively fitted on the tops of the hot end fins (71) and the cold end fins (72).

6. The overheat-proof network switch according to claim 1, characterized in that: The cover plate (2) is provided with an air inlet slot (21) matching the air inlet end (62) of the fan assembly (61), and the side wall of the machine box (1) is provided with an air outlet slot (11) matching the fan output end.

7. The overheat-proof network switch according to claim 1, characterized in that: A power supply (3) is also provided on one side of the interior of the housing (1).

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