Paster jumper wire convenient for heat dissipation
By introducing a heat conducting plate and a heat dissipation needle into the patch jumper, combining the thermally conductive silicone layer and the insulating glue layer, the problems of poor heat dissipation and easy breakdown of the patch jumper are solved, achieving more efficient heat dissipation and stable connection.
Patent Information
- Application Number
- CN202420728228.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-04-10
AI Technical Summary
The patch jumper on the market dissipates heat through the shell, which is not effective and is easily broken down and burned out, affecting the connection of different spans on the PCB board, resulting in the current not being able to pass normally.
A patch jumper including a metal body, a heat conducting plate, a heat dissipation needle, a thermal silicone layer and an insulating adhesive layer was designed to transfer heat through the heat conducting plate and a heat dissipation needle, increase the heat dissipation area and prevent breakdown.
Improves heat dissipation efficiency, prevents jumpers from being broken down and burned out, ensures that the current passes normally, and meets the connection needs of different spans.
Smart Images
Figure CN222283779U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of jumper wires, in particular to a patch jumper wire which is convenient for heat dissipation. Background Art
[0002] The chip jumper is a component on the PCB board that requires overcurrent for various spans. It is a metal body formed by metal stamping, and the raised surface of the metal body is printed on the surface of the body by screen printing. It is resistant to moisture and high temperature, has a small temperature coefficient, can greatly save circuit space costs, and make the design more refined.
[0003] Through research and analysis, it is found that the chip jumpers on the market still have the following shortcomings to a certain extent.
[0004] For example, the chip jumper only dissipates heat through the outer shell, which has poor heat dissipation effect and is easily punctured and burned, affecting the connections of various spans on the PCB board, resulting in the inability of current to pass normally and unable to meet the needs of use. In order to solve the above technical problems, we have designed a chip jumper that is easy to dissipate heat. Utility Model Content
[0005] The utility model aims to provide a patch jumper that is easy to dissipate heat, has the advantages of being easy to dissipate heat and not easily punctured and burned, and solves the problem that the patch jumper only dissipates heat through the outer shell, the heat dissipation effect is poor, it is easy to be punctured and burned, and the connection of various different spans on the PCB board is affected, resulting in the problem that the current cannot pass normally.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a patch jumper that is easy to dissipate heat, comprising a metal body, a shell fixedly sleeved on the outer surface of the metal body, a heat-conducting plate in contact with the top of the metal body, a heat-dissipating pin penetrating the surface of the shell, one end of the heat-dissipating pin being fixedly connected to the surface of the heat-conducting plate, a heat-conducting silicone layer fixedly connected to the bottom of the metal body, and an insulating rubber layer fixedly connected to the bottom of the heat-conducting silicone layer.
[0007] Preferably, both ends of the metal body are fixedly connected with pins, and the metal body is mainly made of copper and iron.
[0008] Preferably, a through hole adapted to the heat dissipation pin is provided on the surface of the shell, and the through hole is circular in shape.
[0009] Preferably, the surface of the heat conducting plate is fixedly connected to the inner wall of the shell, the shape of the heat conducting plate is square, and the heat conducting plate is a ceramic heat conducting plate.
[0010] Preferably, the thermally conductive silicone layer and the insulating rubber layer are fixedly connected to the inner wall of the shell on one side close to the shell, and the number of the heat dissipation pins is several.
[0011] Preferably, the thermally conductive silicone layer is made of a thermally conductive silicone material, and the insulating rubber layer is made of a vulcanized rubber material.
[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0013] When an overcurrent flows through the jumper, the utility model generates heat, which is then transferred to the heat dissipation pins on the heat conduction plate through the heat transfer effect. The heat dissipation pins are in contact with the outside air to transfer and dissipate heat. At this time, air can flow between the gaps between a number of heat dissipation pins, thereby accelerating the heat dissipation efficiency. The heat dissipation efficiency is good and it is not easy to be punctured and burned. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;
[0015] Figure 2 It is a partially cutaway stereoscopic schematic diagram of the utility model;
[0016] Figure 3 For this utility model Figure 2 A is an enlarged schematic diagram;
[0017] Figure 4 It is a cross-sectional stereoscopic schematic diagram of the thermal conductive silicone layer and the insulating rubber layer of the utility model.
[0018] In the figure: 1. Metal body; 2. Shell; 3. Heat conducting plate; 4. Heat dissipation pin; 5. Thermal conductive silicone layer; 6. Insulating rubber layer; 7. Pin; 8. Through hole. DETAILED DESCRIPTION
[0019] See also Figure 1-Figure 4 A patch jumper that is easy to dissipate heat includes a metal body 1, a shell 2 is fixedly sleeved on the outer surface of the metal body 1, a heat conducting plate 3 is contacted and connected to the top of the metal body 1, a heat dissipation pin 4 is penetrated through the surface of the shell 2, one end of the heat dissipation pin 4 is fixedly connected to the surface of the heat conducting plate 3, a heat conducting silicone layer 5 is fixedly connected to the bottom of the metal body 1, and an insulating rubber layer 6 is fixedly connected to the bottom of the heat conducting silicone layer 5.
[0020] See also Figure 1 and Figure 2 Both ends of the metal body 1 are fixedly connected with pins 7. By setting the pins 7, the connection between the wire and the metal body 1 is convenient. The metal body 1 is mainly made of copper and iron.
[0021] See also Figure 2 and Figure 3The surface of the shell 2 is provided with a through hole 8 adapted to the heat dissipation pin 4. By providing the through hole 8, the heat dissipation pin 4 can conveniently pass through the shell 2 and connect with the heat conducting plate 3 for heat dissipation. The shape of the through hole 8 is circular.
[0022] See also Figure 2 The surface of the heat conducting plate 3 is fixedly connected to the inner wall of the shell 2. The shape of the heat conducting plate 3 is square. The heat conducting plate 3 is a ceramic heat conducting plate, which has the characteristics of high thermal conductivity, low thermal resistance, high mechanical strength, high chemical stability, etc. When used in a heat dissipation system, it can effectively improve the heat dissipation efficiency and protect the stable operation of electronic components. It has a small thermal expansion coefficient and good thermal shock resistance, and can maintain stable performance in a high temperature environment.
[0023] See also Figure 1 and Figure 4 The heat-conducting silicone layer 5 and the insulating rubber layer 6 are fixedly connected to the inner wall of the shell 2 on one side close to the shell 2. There are several heat-dissipating pins 4. The heat-dissipating pins 4 have good thermal conductivity and are designed to be an elongated needle-like structure to increase the heat dissipation area and effectively conduct heat away from the electronic device.
[0024] See also Figure 4 The thermally conductive silicone layer 5 is made of a thermally conductive silicone material, has good thermal conductivity and softness, can effectively transfer the heat generated by the heating element, and fill the gaps between the elements to ensure close contact between them, has good high temperature resistance and stability, and can maintain stable thermal conductivity during long-term operation of electronic equipment. The insulating rubber layer 6 is made of a vulcanized rubber material, has good insulation performance, high temperature resistance, chemical corrosion resistance, etc., isolates the contact between different circuits, and prevents circuit short circuit and damage.
[0025] When in use, when an overcurrent passes through the jumper, heat is generated, and then the heat is transferred to the heat dissipation pins 4 on the heat conducting plate 3 through heat transfer. The heat dissipation pins 4 are in contact with the outside air to transfer and dissipate heat. At this time, air can flow between the gaps between several heat dissipation pins 4, which accelerates the heat dissipation efficiency. The heat dissipation efficiency is good and it is not easy to be punctured and burned.
[0026] In summary, the chip jumper that is easy to dissipate heat, through the cooperation of the metal body 1, the shell 2, the heat conducting plate 3, the heat dissipation pin 4, the thermal conductive silicone layer 5 and the insulating rubber layer 6, solves the problem that the chip jumper only dissipates heat through the shell, the heat dissipation effect is poor, it is easy to be broken down and burned, and the connection of various different spans on the PCB board is affected, resulting in the current not being able to pass normally.
Claims
1. A patch jumper for facilitating heat dissipation, comprising a metal body (1), characterized in that: The outer surface of the metal body (1) is fixedly covered with a shell (2); the top of the metal body (1) is in contact with a heat conducting plate (3); a heat dissipation pin (4) is provided through the surface of the shell (2); one end of the heat dissipation pin (4) is fixedly connected to the surface of the heat conducting plate (3); the bottom of the metal body (1) is fixedly connected to a heat conducting silicone layer (5); and the bottom of the heat conducting silicone layer (5) is fixedly connected to an insulating rubber layer (6).
2. A chip jumper for heat dissipation according to claim 1, characterized in that: Both ends of the metal body (1) are fixedly connected with pins (7), and the metal body (1) is mainly made of copper and iron.
3. A chip jumper for heat dissipation according to claim 1, characterized in that: A through hole (8) adapted to the heat dissipation pin (4) is provided on the surface of the housing (2), and the through hole (8) is circular in shape.
4. A chip jumper for heat dissipation according to claim 1, characterized in that: The surface of the heat conducting plate (3) is fixedly connected to the inner wall of the outer shell (2); the shape of the heat conducting plate (3) is square; and the heat conducting plate (3) is a ceramic heat conducting plate.
5. A chip jumper for heat dissipation according to claim 1, characterized in that: The heat-conducting silicone layer (5) and the insulating rubber layer (6) are fixedly connected to the inner wall of the outer shell (2) on one side close to the outer shell (2), and the number of the heat dissipation pins (4) is a plurality.
6. A heat dissipation patch jumper according to claim 1, characterized in that: The thermally conductive silicone layer (5) is made of a thermally conductive silicone material, and the insulating rubber layer (6) is made of a vulcanized rubber material.